CN217821454U

CN217821454U - High-performance mainboard for chip set

Info

Publication number: CN217821454U
Application number: CN202221463281.0U
Authority: CN
Inventors: 李保强
Original assignee: Shenzhen Jawest Electronic Science & Technology Co ltd
Current assignee: Shenzhen Jawest Electronic Science & Technology Co ltd
Priority date: 2022-06-13
Filing date: 2022-06-13
Publication date: 2022-11-15
Anticipated expiration: 2032-06-13

Abstract

The utility model discloses a high performance mainboard is used to chipset, which comprises a mainboard, the top of mainboard is equipped with protection machanism, protection machanism includes first framework, first framework rigid coupling is in the top of mainboard, the inner wall clearance fit of first framework has the second framework, the top rigid coupling of second framework has the screen panel. The high-performance mainboard for the chipset is characterized in that a second frame body in a protection mechanism is clamped with a clamping groove in a first frame body through a clamping block, the second frame body and a mesh enclosure are fixed in the first frame body, and the second frame body and the mesh enclosure can protect electric elements at the mainboard to protect the electric elements at the mainboard from being damaged.

Description

High-performance mainboard for chipset

Technical Field

The utility model relates to a mainboard technical field specifically is a chip group uses high performance mainboard.

Background

A main board, also called a main board (main board), a system board (system board), or a motherboard (mother board), is one of the most important components of a computer, and the main board is a generally rectangular circuit board on which main circuit systems constituting the computer are mounted, and generally includes elements such as a BIOS chip, an I/O control chip, a keyboard and a panel control switch interface, an indicator light socket, an expansion socket, a main board, and a dc power supply for plug-in connectors for plug-in cards.

For example, the patent numbers are: CN212846642U, a high performance mainboard is used to chip group, the utility model belongs to the technical field of the mainboard, especially, relate to a high performance mainboard is used to chip group, through setting up the mainboard body, the locating piece, the activity groove, fixed establishment, the spacing groove, stop gear, first through-hole, the cooperation of third through-hole and fourth through-hole is used, current mainboard has been solved and has been installed, install through the screw mostly when being not convenient for install the mainboard, and partial mainboard can be installed and be difficult to the problem that use tool installed in narrow and small space, although it can be convenient for install, but the mainboard is installed the back, electric elements on the mainboard does not have the protection problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high performance mainboard is used to the chipset to after proposing the mainboard and installing, the electric elements on the mainboard does not have the problem of protection in solving above-mentioned background art.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a high performance mainboard is used to chipset, includes the mainboard, the top of mainboard is equipped with protection machanism, protection machanism includes first framework, first framework rigid coupling in the top of mainboard, the inner wall clearance fit of first framework has the second framework, the top rigid coupling of second framework has the screen panel.

Preferably, through holes are fixedly connected to four corners of the top of the mainboard, and the inner walls of the through holes are communicated with the bottom of the mainboard.

Preferably, rubber pads are fixedly connected to four corners of the top and the bottom of the main board, and the plurality of rubber pads correspond to the plurality of through holes in pairs respectively.

Preferably, clamping grooves are machined at two ends of the inner wall of the first frame body.

Preferably, the two ends of the second frame body are respectively provided with a clamping block, and the two clamping blocks are respectively clamped with the inner walls of the two clamping grooves.

Compared with the prior art, the beneficial effects of the utility model are that: this high performance mainboard is used to chipset carries out the joint through the draw-in groove in fixture block and the first frame through the second framework among the protection machanism, fixes second framework and screen panel in the inside of first framework, can protect the electric elements of mainboard department with second framework and screen panel, and the electric elements of protection mainboard department do not receive the damage.

Drawings

FIG. 1 is a schematic view of the connection relationship of the present invention;

FIG. 2 is a schematic cross-sectional view of a high performance motherboard for the chipset;

FIG. 3 is a schematic structural view of the main board, the slot and the latch shown in FIG. 2;

fig. 4 is a schematic structural diagram of the through hole, the rubber ring and the annular fixture block in fig. 2.

In the figure: 1. mainboard, 2, through-hole, 3, rubber pad, 4, draw-in groove, 5, fixture block, 6, protection machanism, 601, first framework, 602, second framework, 603, screen panel, 7, prevent mechanism of colliding with, 701, rubber circle, 702, annular clamping groove, 703, annular fixture block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a high-performance mainboard for a chipset comprises a mainboard 1, wherein a protection mechanism 6 is arranged at the top of the mainboard 1, the protection mechanism 6 comprises a first frame body 601, the first frame body 601 is fixedly connected at the top of the mainboard 1, a second frame body 602 is arranged on the inner wall of the first frame body 601 in a clearance fit manner, the second frame body 602 can move into the inner wall of the first frame body 601 or move out of the inner wall of the first frame body 601, a mesh enclosure 603 is fixedly connected at the top of the second frame body 602, the mesh enclosure 603 is used for protecting an electric element at the position of the mainboard 1 and ensuring heat generated when the electric element works to dissipate heat, through holes 2 are fixedly connected at four corners of the top of the mainboard 1, the inner walls of the through holes 2 are communicated with the bottom of the mainboard 1, rubber pads 3 are fixedly connected at the top and the four corners of the bottom of the mainboard 1, the rubber pads 2 are used for preventing the through holes 2 from being in butt joint with bolts, when the bolts are attached to the mainboard 1, damage to the mainboard 1 is caused, two of the rubber pads 3 correspond to the through holes 2, the clamping grooves 4 are formed in two ends of the inner wall of the first frame body 601, the clamping blocks 5 are formed in two ends of the second frame body 602, the two clamping blocks 5 are respectively in clamping connection with the inner walls of the two clamping grooves 4, the clamping grooves 4 and the clamping blocks 5 are in clamping connection, the second frame body 602 can be fixed on the inner wall of the first frame body 601, the second frame body 602 and the mesh cover 603 are fixed inside the first frame body 601 through the clamping blocks 5 in clamping connection with the clamping grooves 4 in the first frame body 601 through the second frame body 602, the second frame body 602 and the mesh cover 603 can protect the electrical elements at the mainboard 1, and the electrical elements at the mainboard 1 are protected from being damaged.

Mainboard 1's outer wall is equipped with prevents colliding with mechanism 7, prevent colliding with mechanism 7 and include rubber circle 701, the inner wall of rubber circle 701 laminates with mainboard 1's outer wall mutually, the inner wall processing of rubber circle 701 has annular clamping groove 702, annular clamping groove 702's inner wall joint has annular fixture block 703, annular fixture block 703 cup joints in mainboard 1's outer wall, fix the outer wall at mainboard 1 through rubber circle 701, rubber circle 701 can be when mainboard 1 carries or installs, when mainboard 1's four sides collide with, protect mainboard 1's four sides, avoid mainboard 1's four sides to damage.

When using this high performance mainboard for chipset, second framework 602 carries out the joint through fixture block 5 and draw-in groove 4 in the first framework 601, fix second framework 602 and screen panel 603 in the inside of first framework 601, can protect the electric elements of mainboard 1 department with second framework 602 and screen panel 603, the electric elements of protection mainboard 1 department do not receive the damage, and accessible rubber circle 701 is fixed at the outer wall of mainboard 1, rubber circle 701 can be when mainboard 1 carries or installs, when the four sides of mainboard 1 collide with, protect the four sides of mainboard 1, avoid the four sides of mainboard 1 to damage.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high performance mainboard is used to chipset, includes mainboard (1), its characterized in that: the top of mainboard (1) is equipped with protection machanism (6), protection machanism (6) include first framework (601), first framework (601) rigid coupling is in the top of mainboard (1), the inner wall clearance fit of first framework (601) has second framework (602), the top rigid coupling of second framework (602) has screen panel (603).

2. The high-performance motherboard for chipset according to claim 1, wherein: the top four corners of mainboard (1) all the rigid coupling have through-hole (2), and is a plurality of the inner wall of through-hole (2) all communicates with the bottom of mainboard (1).

3. The high-performance motherboard for chip set according to claim 1, wherein: rubber pads (3) are fixedly connected to four corners of the top and the bottom of the main board (1), and the plurality of rubber pads (3) correspond to the plurality of through holes (2) in pairs respectively.

4. The high-performance motherboard for chip set according to claim 1, wherein: clamping grooves (4) are machined at two ends of the inner wall of the first frame body (601).

5. The high-performance motherboard for chipset according to claim 1, wherein: fixture blocks (5) are processed at two ends of the second frame body (602), and the two fixture blocks (5) are respectively clamped with the inner walls of the two clamping grooves (4).