CN217803252U

CN217803252U - SMD carrier band forming die that blows

Info

Publication number: CN217803252U
Application number: CN202122286676.XU
Authority: CN
Inventors: 王云青
Original assignee: Suzhou Haoyan Electronic Technology Co ltd
Current assignee: Suzhou Haoyan Electronic Technology Co ltd
Priority date: 2021-09-22
Filing date: 2021-09-22
Publication date: 2022-11-15
Anticipated expiration: 2031-09-22

Abstract

The utility model discloses a SMD carrier band forming die that blows relates to carrier band preparation technical field. The utility model discloses an go up mould and bed die, it is located the bed die top to go up the mould, goes up to be provided with the carrier band between mould and the bed die, and the bed die right side is provided with heating device, and it is a plurality of to go up the mould upper surface and be provided with the gas blow pipe, and the surface is provided with protruding a plurality of below going up the mould, is provided with the venthole around the arch, and the bed die upper surface is provided with the pit a plurality ofly, and the pit bottom is provided with the air vent, and the bed die is provided with exhaust hole a plurality of. The utility model designs the air blowing pipe and the air outlet on the upper die and designs the air vent and the air exhaust hole on the lower die to form an air blowing channel from top to bottom, which provides uniform acting force for the forming of the carrier tape and prevents the carrier tape from being damaged; through being provided with the cooling tube in that the bed die is inside, but after the carrier band shaping, rapid cooling realized the rapid prototyping of carrier band, increased work efficiency.

Description

SMD carrier band forming die that blows

Technical Field

The utility model belongs to the technical field of the carrier band preparation, particularly, in particular to SMD carrier band forming die that blows.

Background

The electronic component bearing belt is a belt product, called carrier belt for short, and is mainly applied to the field of electronic component packaging. The carrier tape is a tape body which is composed of a row of circular positioning holes which are distributed at equal intervals and have the same size and a row of accommodating holes which have a certain shape and have a certain width, the positioning holes play a role in guiding and positioning, and the accommodating holes are used for loading electronic components. The conventional carrier tape molding method is to mold pockets in a certain size and shape after heating a supplied tape-shaped sheet. The conventional pocket forming method includes a blowing type and a snow pressure type, and the blowing type pocket forming method is a method of placing a heated strip-shaped thin sheet on a mold with a carved shape and performing high-pressure blowing forming.

Patent specification with application number CN201720510158.2 discloses a carrier tape forming die, which comprises: a forming mold, a blowing mold and an auxiliary mold; the blowing mold is arranged above the forming mold, the carrier tape subjected to heat treatment is arranged between the blowing mold and the forming mold, and the auxiliary mold is arranged between the blowing mold and the carrier tape. An air blowing channel is arranged in the air blowing mould, one end of the air blowing channel is communicated with an air supply device, and the other end of the air blowing channel is communicated with the auxiliary mould; the lower end face of the auxiliary die is provided with a protrusion, the protrusion is in an inverted trapezoid shape, the upper end face of the forming die is provided with a groove, and the shape of the groove is matched with the shape of the protrusion. And a plurality of exhaust holes are formed in the periphery of the inner groove of the forming die. Still exist some not enoughly in the device, if the passageway setting of blowing is unreasonable, lead to the carrier band inhomogeneous in the atress of forming process, the material damage easily appears, does not have cooling tube, unable rapid cooling, influences work efficiency.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

To the problem in the correlation technique, the utility model provides a SMD carrier band forming die that blows to overcome the above-mentioned technical problem that current correlation technique exists.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme:

the utility model relates to a SMD carrier band forming die that blows, including last mould and bed die, it is located to go up the mould the bed die top, go up the mould with be provided with the carrier band between the bed die, the bed die right side sets up in heating device, it is a plurality of to go up the mould upper surface and be provided with the gas blow pipe, the surface is provided with protruding a plurality of below going up the mould, be provided with the venthole around the arch, the bed die upper surface is provided with the pit a plurality of, the pit bottom is provided with the air vent, the bed die is provided with exhaust hole a plurality of.

Further, heating device top is provided with the heating chamber, heating chamber inside upper surface and lower surface all are provided with the hot plate, the carrier band is located between the hot plate.

Furthermore, the air blowing pipe is communicated with the air outlet hole, and the vent hole is communicated with the exhaust hole.

Further, the protrusion and the recess are matched.

Furthermore, a cooling pipe is arranged on one side of the lower die, the cooling pipe is wound around the concave pit, and the cooling pipe penetrates through the lower die.

Further, the front and the rear parts of the upper die and the lower die are provided with fixing plates, and fixing holes are formed in the fixing plates.

The utility model discloses following beneficial effect has:

1. the utility model discloses design trachea and venthole on going up the mould, design air vent and exhaust hole on the bed die, form the from the top down passageway of blowing, for the carrier band shaping provides even effort, prevent that the carrier band from damaging.

2. Through being provided with the cooling tube in that the bed die is inside, but after the carrier band shaping, rapid cooling realizes the rapid prototyping of carrier band, has increased work efficiency.

Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive work.

Fig. 1 is an overall schematic view of the present invention;

FIG. 2 is an exploded view of the upper and lower templates of the present invention;

FIG. 3 is an enlarged view of a detail of the lower mold of the present invention;

FIG. 4 is an enlarged view of the upper mold detail of the present invention;

fig. 5 is a schematic view of the cooling pipe of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. an upper die; 2. a lower die; 3. an air blowing pipe; 4. a protrusion; 5. an air outlet; 6. a pit; 7. a vent hole; 8. an exhaust hole; 9. a cooling tube; 10. a fixing plate; 11. a fixing hole; 12. carrying a belt; 13. a heating device; 14. a heating chamber; 15. heating the plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by a person skilled in the art without any inventive work based on the embodiments of the present invention belong to the protection scope of the present invention.

In the description of the present invention, it should be understood that the terms "open hole", "upper", "lower", "top", "middle", "inner", etc. indicate an orientation or positional relationship merely for convenience of description of the invention and to simplify the description, and do not indicate or imply that the indicated component or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.

Please refer to fig. 1-4, the utility model relates to a SMD carrier band forming die that blows, including last mould 1 and bed die 2, it is located to go up mould 1 bed die 2 top, go up mould 1 with be provided with carrier band 12 between the bed die 2, 2 right sides of bed die are provided with heating device 13, it is provided with gas blow pipe 3 a plurality of to go up 1 upper surface of mould, the surface is provided with protruding 4 a plurality of below going up mould 1, be provided with venthole 5 around protruding 4, 2 upper surfaces of bed die are provided with pit 6 a plurality of, pit 6 bottoms are provided with air vent 7, bed die 2 is provided with exhaust hole 8 a plurality of.

In one embodiment, for the above heating device 13, a heating cavity 14 is arranged above the heating device 13, heating plates 15 are arranged on the upper surface and the lower surface inside the heating cavity 14, the carrier tape 12 is located between the heating plates 15, so that the carrier tape 12 is made of a non-metal material and needs to be heated, the carrier tape 12 passes through the heating cavity 14, and the heating plate 15 inside the heating cavity 14 is used for heating the carrier tape 12, so that when the upper mold 1 and the lower mold 2 are combined, the extrusion blow molding of the carrier tape 12 is easier.

In one embodiment, for the above-mentioned blowing pipes 3, the blowing pipes 3 are communicated with the air outlet holes 5, and the air vent holes 7 are communicated with the air outlet holes 8, so that the blowing pipes 3 are used for connecting an air pump, the air pump transmits air to the air outlet holes 5 through the blowing pipes 3, and exhausts the carrier tape 12, the carrier tape 12 is tightly attached to the surface of the pit 6, then the air blown out from the upper mold 1 is transmitted to the air outlet holes 8 through the air vent holes 7 and exhausted, and the air blown out from the upper mold 1 can blow and shape the carrier tape 12, thereby realizing the circulation of air. In addition, when the air outlet hole 5 and the vent hole 7 are used in a specific mode, the air outlet hole and the vent hole are both circular.

In one embodiment, for the protrusion 4, the protrusion 4 and the recess 6 are matched, so that after the upper mold 1 and the lower mold 2 are combined, the protrusion 4 and the recess 6 can be perfectly matched, the air outlet 5 is communicated with the air vent 7, the carrier tape 12 is extruded, and air passages are circulated.

In an embodiment, for the lower mold 2, a cooling pipe 9 is arranged on one side of the lower mold 2, the cooling pipe 9 is wound around the concave pit 6, the cooling pipe 9 penetrates through the lower mold 2, so that the upper mold 1 and the lower mold 2 extrude the carrier tape 12, heat of the carrier tape 12 is transmitted to the surface of the lower mold 2, cooling liquid is introduced into the cooling pipe 9, heat can be dissipated around the concave pit 6, rapid forming of the carrier tape 12 is facilitated, and forming efficiency is increased. In addition, in specific applications, after the carrier tape 12 is blow molded, a cooling liquid is introduced to avoid affecting the blow molding effect of the carrier tape 12, and the cooling liquid may be water.

In an embodiment, for the upper mold 1, fixing plates 10 are disposed at front and rear portions of the upper mold 1 and the lower mold 2, and fixing holes 11 are formed in the fixing plates 10, so that the fixing plates 10 can fix the upper mold 1 and the lower mold 2 by penetrating bolts into the fixing holes 11, and thus, when the upper mold 1 and the lower mold 2 work, no deviation occurs, and normal processing of the carrier tape 12 is ensured.

In conclusion, with the aid of the above technical scheme of the utility model, through in passing heating chamber 14 of heating device 13 with carrier band 12, hot plate 15 heats carrier band 12, then will put in the middle of mould 1 and lower mould 2, put in the pit 6 of lower mould 2 with the arch 4 of last mould 1, cooperate, then connect gas blow pipe 3 and air pump, the air pump blows gas blow pipe 3, arch 4 in going up mould 1 exerts the effort of looks down and gas with carrier band 12 laminating inside pit 6 to carrier band 12, form the hole at carrier band 12, in this process, gas process venthole 5, inside getting into pit 6, it discharges from exhaust hole 8 to get into air vent 7, after blow molding, let in the coolant liquid in cooling tube 9, cool off lower mould 2, be favorable to the quick cooling of carrier band 12, and increase work efficiency.

Through above-mentioned technical scheme, 1, design gas blow pipe 3 and venthole 5 on through last mould 1, design air vent 7 and exhaust hole 8 on lower mould 2, form the air blow passageway from the top down, provide even effort for the shaping of carrier band 12, prevent that carrier band 12 from damaging. 2. Through being provided with cooling tube 9 inside lower mould 2, after carrying 12 shaping, but rapid cooling realizes carrying 12's rapid prototyping, has increased work efficiency.

In the description of the present specification, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the invention disclosed above are intended only to help illustrate the invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise forms disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides a SMD carrier band forming die that blows, includes mould (1) and bed die (2), its characterized in that: go up mould (1) and be located bed die (2) top, go up mould (1) with be provided with between bed die (2) and carry band (12), bed die (2) right side is provided with heating device (13), it is a plurality of to go up mould (1) upper surface and be provided with gas blow pipe (3), it is a plurality of that the surface is provided with protruding (4) below mould (1) to go up, be provided with venthole (5) around protruding (4), bed die (2) upper surface is provided with pit (6) a plurality of, pit (6) bottom is provided with air vent (7), bed die (2) are provided with exhaust hole (8) a plurality of.

2. The SMD carrier tape blow molding die as claimed in claim 1, wherein a heating cavity (14) is provided above said heating means (13), heating plates (15) are provided on both the inner upper and lower surfaces of said heating cavity (14), and said carrier tape (12) is located between said heating plates (15).

3. The SMD carrier tape blow molding die as claimed in claim 1, wherein said blow pipes (3) are in communication with said air outlets (5), and said vent holes (7) are in communication with said air vents (8).

4. -the SMD carrier tape blow molding die of claim 2, wherein said bumps (4) and said dimples (6) are matched.

5. -SMD carrier tape blow moulding die according to claim 3, characterised in that said lower die (2) is provided on one side with cooling tubes (9), said cooling tubes (9) being coiled around said recesses (6), said cooling tubes (9) extending through said lower die (2).

6. The SMD carrier tape blowing forming die of claim 4, wherein fixing plates (10) are respectively arranged at the front and the rear of the upper die (1) and the lower die (2), and fixing holes (11) are formed in the fixing plates (10).