CN220717779U - Graphite die for electronic sintering - Google Patents

Graphite die for electronic sintering Download PDF

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Publication number
CN220717779U
CN220717779U CN202322139574.4U CN202322139574U CN220717779U CN 220717779 U CN220717779 U CN 220717779U CN 202322139574 U CN202322139574 U CN 202322139574U CN 220717779 U CN220717779 U CN 220717779U
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China
Prior art keywords
electronic
sintering
air cooling
air
graphite
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CN202322139574.4U
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Chinese (zh)
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王华杰
展培翔
赵立刚
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Qingdao Shengkaiweijian Graphite Products Co ltd
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Qingdao Shengkaiweijian Graphite Products Co ltd
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Abstract

The utility model relates to the technical field of graphite molds and discloses a graphite mold for electronic sintering, wherein an upper template is arranged below a plate seat of an upper die holder, a lower template is arranged above a plate seat of a lower die holder, two groups of water cooling channels are formed in a plate frame of the upper die holder by taking the center as a boundary, the number of each group of water cooling channels is multiple, a plurality of air cooling channels are arranged in the plate frame of the lower die holder in an arrangement mode, and the air cooling channels are arranged at equal intervals. When the graphite die is used for sintering the electronic element, the upper die plate is cooled by the water cooling channel in the upper die base, and the lower die plate is cooled by the air cooling channel in the lower die base, so that the electronic sintering element in the butt joint cavity of the upper die plate and the lower die plate can be cooled in a double manner, the cooling efficiency of the electronic sintering element is improved, and the cooling duration is saved.

Description

Graphite die for electronic sintering
Technical Field
The utility model relates to the technical field of graphite molds, in particular to a graphite mold for electronic sintering.
Background
The mould is a basic technological equipment which is very widely used in industrial production, in modern industrial production, product parts are widely processed by stamping, forging forming, die casting forming, extrusion forming, plastic injection or other forming processing methods, and the mould is matched with a forming mould, so that blanks are formed and processed into parts meeting the product requirements, and in recent years, with the rapid development of the mould industry, graphite materials, new processes and increasingly-increased mould factories are continuously impacted on the mould market, and the graphite mould gradually becomes a preferred material for mould manufacture by virtue of good physical and chemical properties.
When the existing electronic component is sintered by utilizing a graphite die, the temperature of the existing electronic component is higher and cooling treatment is needed, however, the existing graphite die lacks a cooling device, and the existing graphite die is low in efficiency in the cooling process and long in cooling time, so that the sintering efficiency and quality of the electronic component are affected. To this end, a person skilled in the art provides a graphite mold for electronic sintering to solve the problems set forth in the background art described above.
Disclosure of Invention
The utility model mainly aims to provide a graphite die for electronic sintering, which can effectively solve the problem that the cooling efficiency of the graphite die for electronic element sintering in the prior art is low.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: the utility model provides a graphite mould for electronic sintering, includes upper die base and level setting in the die holder of upper die base bottom, the board seat below of upper die base is provided with the cope match-plate pattern, the board seat top of die holder is provided with the lower bolster, two sets of water cooling passageway have been seted up to the grillage inside of upper die base with the center as the boundary, and the quantity of every water cooling passageway of group is a plurality of, a plurality of forced air cooling passageway have been seted up to the grillage inside of die holder, and a plurality of forced air cooling passageway are equidistant range setting.
As still further aspects of the utility model: two pairs of involution inserting rods are arranged below the jig of the upper template in a pairwise symmetrical mode, and two pairs of involution inserting grooves corresponding to the two pairs of involution inserting rods are formed in the upper surface of the jig of the lower template in a pairwise symmetrical mode.
As still further aspects of the utility model: the inlet end of the water cooling channel is communicated with a liquid inlet valve port, and the outlet end of the water cooling channel is communicated with a liquid outlet valve port.
As still further aspects of the utility model: the water cooling channel is of an S-shaped pipe structure.
As still further aspects of the utility model: the inlet end of the air cooling channel is communicated with an air inlet valve port, and the outlet end of the air cooling channel is communicated with an air outlet valve port.
As still further aspects of the utility model: the inside of the air duct of the air cooling channel is provided with a plurality of groups of spoilers in a staggered arrangement, and one side of the inner wall of the air duct of the air cooling channel, which is staggered with the spoilers, is provided with a plurality of groups of diffusion grooves.
Compared with the prior art, the utility model has the following beneficial effects:
the novel use is when utilizing graphite mould to carry out sintering work to electronic component, through utilizing the water-cooling of water-cooling passageway in the upper die base to the cope match-plate pattern, and utilize the forced air cooling of forced air cooling passageway in the die holder to the lower bolster, it can carry out dual cooling work to cope match-plate pattern, lower bolster to the electronic sintering component of intracavity portion, improve its cooling efficiency, save cooling duration, on the other hand utilizes the water-cooling of water-cooling passageway to the cope match-plate pattern to the water-cooling of cope match-plate pattern, its cooling performance is superior to the forced air cooling of forced air cooling passageway to the lower bolster and cools down, the drawing of patterns work that opens and shuts of cope match-plate pattern more is favorable to the cope match-plate pattern, avoid electronic sintering component to open and shut along with the cope match-plate pattern, the synchronous bonding moves up.
Drawings
FIG. 1 is a schematic diagram of a graphite mold for electronic sintering according to the present utility model;
FIG. 2 is a schematic development view of a graphite mold for electronic sintering according to the present utility model;
FIG. 3 is a schematic diagram of a water cooling channel in a graphite mold for electronic sintering according to the present utility model;
fig. 4 is a schematic structural diagram of an air cooling channel in a graphite mold for electronic sintering according to the present utility model.
In the figure: 1. an upper die holder; 2. an upper template; 3. a lower die holder; 4. a lower template; 5. a involution inserted link; 6. a involution slot; 7. a liquid inlet valve port; 8. a liquid outlet valve port; 9. a water cooling channel; 10. an intake valve port; 11. an air outlet valve port; 12. an air cooling channel; 13. a spoiler; 14. and (5) diffusion slotting.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1-4, a graphite mold for electronic sintering includes an upper mold base 1 and a lower mold base 3 horizontally disposed at the bottom of the upper mold base 1, an upper mold plate 2 is disposed below a plate base of the upper mold base 1, a lower mold plate 4 is disposed above a plate base of the lower mold base 3, two pairs of alignment insert rods 5 are disposed below a fixture of the upper mold plate 2 in a two-to-two symmetrical manner, two pairs of alignment slots 6 corresponding to the two pairs of alignment insert rods 5 are disposed on an upper surface of the fixture of the lower mold plate 4 in a two-to-two symmetrical manner, and when sintering an electronic component by using the graphite mold, alignment accuracy of the upper mold plate 2 and the lower mold plate 4 can be improved by using guide insertion correspondence of the alignment insert rods 5 and the alignment slots 6, so as to ensure high quality of element sintering.
Two groups of water cooling channels 9 are formed in the plate frame of the upper die holder 1 by taking the center as a boundary, the number of each group of water cooling channels 9 is multiple, the inlet ends of the water cooling channels 9 are communicated with liquid inlet valve ports 7, the outlet ends of the water cooling channels 9 are communicated with liquid outlet valve ports 8, the water cooling channels 9 are of an S-shaped pipe structure, after the electronic elements are sintered by using a graphite die, cooling water can be conveyed to the water cooling channels 9 through the liquid inlet valve ports 7 by using external water cooling equipment, the S-shaped pipe structure of the water cooling channels 9 is utilized, the cooling water can circulate and commutate in the water cooling channels 9, the cooling time is prolonged, the electronic sintering elements in the upper die plate 2 are subjected to water cooling operation, the cooling efficiency is improved, and then the cooled cooling water can flow back into the water cooling equipment through the liquid outlet valve ports 8.
The plate frame of the lower die holder 3 is internally provided with a plurality of air cooling channels 12 in an arrangement mode, the air cooling channels 12 are arranged at equal intervals, the inlet ends of the air cooling channels 12 are communicated with air inlet valve ports 10, the outlet ends of the air cooling channels 12 are communicated with air outlet valve ports 11, the air channel of the air cooling channels 12 is internally provided with a plurality of groups of flow blocking plates 13 in a staggered mode, one side, staggered with the flow blocking plates 13, of the inner wall of the air channel of the air cooling channel 12 is provided with a plurality of groups of diffusion grooves 14, after the electronic components are sintered by using a graphite die, cold air can be blown into the air cooling channels 12 through the air inlet valve ports 10 by using external air cooling equipment, the flow blocking time of the flow blocking plates 13 in the air cooling channels 12 is prolonged, the air cooling area of the air cooling channels 12 is increased by using the diffusion grooves 14, then the air cooling of the cold air in the air cooling channels 12 is utilized, the electronic sintered components in the lower die plate 4 are subjected to air cooling work, and then the cooled cold air can be discharged out of the outside through the air outlet valve ports 11.
The working principle of the utility model is as follows: when the graphite mold is used for sintering the electronic element, the electronic element is packaged in the matching cavity by matching the upper mold plate 2 with the lower mold plate 4, the sintering molding operation is carried out on the electronic element, after the electronic element is sintered by the graphite mold, the external water cooling equipment is used for pressing and sending cooling water to the water cooling channel 9 through the liquid inlet valve port 7, the S-shaped pipe structure of the water cooling channel 9 is used for circularly reversing and circulating the cooling water in the water cooling channel 9, the cooling time is prolonged, the electronic sintering element in the upper mold plate 2 is subjected to the water cooling operation, and the external air cooling equipment is synchronously used for blowing cold air into the air cooling channel 12 through the air inlet valve port 10, the flow blocking of the flow blocking plate 13 in the air cooling channel 12 is utilized to prolong the retention time of cold air, the diffusion grooving 14 is utilized to increase the air cooling area of the air cooling channel 12, then the air cooling of the cold air in the air cooling channel 12 is utilized to perform air cooling work on the electronic sintering element in the lower template 4, and then the double cooling work of water cooling and air cooling is utilized to improve the cooling efficiency and save the cooling time on one hand, and on the other hand, the water cooling of the upper template 2 by the water cooling channel 9 is better than the air cooling of the lower template 4 by the air cooling channel 12 in cooling performance, so that the opening and closing demolding work of the upper template 2 is more facilitated.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (6)

1. The utility model provides a graphite mould for electronic sintering, includes upper die base (1) and level setting in die holder (3) of upper die base (1) bottom, its characterized in that, the board seat below of upper die base (1) is provided with cope match-plate pattern (2), the board seat top of die holder (3) is provided with lower bolster (4), two sets of water cooling passageway (9) have been seted up to the grillage inside of upper die base (1) with the center as the boundary, and the quantity of every water cooling passageway (9) of group is a plurality of, a plurality of forced air cooling passageway (12) have been seted up in the grillage inside arrangement of die holder (3), and a plurality of forced air cooling passageway (12) are equidistant the range setting.
2. The graphite mold for electronic sintering according to claim 1, wherein two pairs of involution inserting rods (5) are symmetrically arranged below the jig of the upper mold plate (2), and two pairs of involution inserting grooves (6) corresponding to the two pairs of involution inserting rods (5) are symmetrically arranged on the upper surface of the jig of the lower mold plate (4).
3. The graphite mold for electronic sintering according to claim 1, wherein the inlet end of the water cooling channel (9) is communicated with a liquid inlet valve port (7), and the outlet end of the water cooling channel (9) is communicated with a liquid outlet valve port (8).
4. Graphite mould for electronic sintering according to claim 1, characterized in that the water cooling channels (9) are S-shaped tube structures.
5. The graphite mold for electronic sintering according to claim 1, wherein an inlet end of the air cooling channel (12) is communicated with an air inlet valve port (10), and an outlet end of the air cooling channel (12) is communicated with an air outlet valve port (11).
6. The graphite mold for electronic sintering according to claim 1, wherein a plurality of groups of spoilers (13) are arranged in a staggered manner in the air duct of the air cooling channel (12), and a plurality of groups of diffusion grooves (14) are formed in one side of the air duct inner wall of the air cooling channel (12) with the spoilers (13) staggered.
CN202322139574.4U 2023-08-10 2023-08-10 Graphite die for electronic sintering Active CN220717779U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322139574.4U CN220717779U (en) 2023-08-10 2023-08-10 Graphite die for electronic sintering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322139574.4U CN220717779U (en) 2023-08-10 2023-08-10 Graphite die for electronic sintering

Publications (1)

Publication Number Publication Date
CN220717779U true CN220717779U (en) 2024-04-05

Family

ID=90485674

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322139574.4U Active CN220717779U (en) 2023-08-10 2023-08-10 Graphite die for electronic sintering

Country Status (1)

Country Link
CN (1) CN220717779U (en)

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