CN217797676U

CN217797676U - Wafer cleaning machine

Info

Publication number: CN217797676U
Application number: CN202221868695.1U
Authority: CN
Inventors: 陆金发; 殷秋鹤; 刘兆山; 郭云静
Original assignee: Jiaxing Liankangwoyuan Technology Co ltd
Current assignee: Jiaxing Liankangwoyuan Technology Co ltd
Priority date: 2022-07-19
Filing date: 2022-07-19
Publication date: 2022-11-15
Anticipated expiration: 2032-07-19

Abstract

The utility model provides a wafer cleaning machine, which comprises a frame, it has the open-ended casing to install upper portion in the frame, the breach of stepping down that is linked together with the opening is seted up to the casing lateral part, cylinder I is still installed to the casing lateral part, cylinder I's tailpiece of the piston rod portion installs the arc closure plate that can seal the breach of stepping down and live, the arc closure plate still with casing sliding connection, the support is still installed to the casing lateral part, be equipped with spray tube I on the support, spray tube II and blow-dry pipe, the power shaft is installed to vertical rotation in the frame, power shaft lower extreme and driving motor I link to each other, the power shaft upper end links to each other through connecting seat and switching rod middle part, the switching rod tip all with auxiliary rod one end sliding connection, the auxiliary rod other end links to each other with driving motor II, the platform is placed to the last wafer that is used for placing the wafer of installing of driving motor II, the wafer still has the locating component that is used for the wafer location on placing the platform, cylinder II is still installed to the connecting seat lateral part, the piston rod tip and auxiliary rod one end link to each other.

Description

Wafer cleaning machine

Technical Field

The utility model belongs to the technical field of machinery, a wafer cleaning machine is related to.

Background

The wafers are left with contaminants during storage, transfer and unloading, and throughout the manufacturing process of semiconductor devices, and thus cleaning equipment is required to remove contaminants from the surfaces of the wafers.

Through search, as disclosed in the chinese patent document, a semiconductor wafer cleaning machine [ application No.: 202122604202.5; publication No.: CN 216297286U ]. The semiconductor wafer cleaning apparatus is characterized in that it comprises: a housing; a support device housed within the housing and configured to support a semiconductor wafer; and a liquid supply device partially housed within the housing and comprising: the liquid storage mechanism stores and outputs cleaning solution; a nozzle connected to a reservoir mechanism through a conduit and configured to spray the cleaning solution toward a surface of the semiconductor wafer; and a flow rate monitoring mechanism including a flow rate monitoring unit connected to at least one of the pipe and the nozzle, and an output unit connected to the flow rate monitoring unit to output a flow rate monitoring result.

The wafer cleaning machine disclosed in the patent has a too simple structure, only has one supporting device, and is not required to be additionally waited for cleaning, so that a wafer cleaning machine is necessary to be designed.

Disclosure of Invention

The utility model aims at providing a wafer cleaning machine to there is above-mentioned problem in current technique.

The purpose of the utility model can be realized by the following technical proposal: the utility model provides a wafer cleaning machine, which comprises a frame and is characterized in that, it has the open-ended casing to install upper portion in the frame, the casing lateral part is seted up the breach of stepping down that is linked together with the opening, the casing lateral part is still installed cylinder one, and the vertical upwards setting of piston rod of cylinder one, the arc closure piece that can seal the breach of stepping down is installed to the piston rod tip of cylinder one, the arc closure piece still with casing sliding connection, the support is still installed to the casing lateral part, be equipped with spray pipe one on the support, spray pipe two and blow-dry pipe, the power shaft is installed in the vertical rotation in the frame, power shaft lower extreme and driving motor one link to each other, and the vertical upwards setting of output shaft of driving motor one, the power shaft upper end links to each other through connecting seat and switching rod middle part, the switching rod tip all links to each other with auxiliary rod one end sliding connection, the auxiliary rod other end and driving motor two links to each other, the wafer placing platform that is used for placing is installed on the driving motor two, and arbitrary wafer placing platform homoenergetic moves to the casing, the wafer placing still has the locating component that is used for the wafer location on the wafer placing platform, cylinder lateral part still installs cylinder two, and the connecting seat, and the piston rod level setting of cylinder two, and the piston rod one end of cylinder links to each other, the auxiliary rod one end links to each other.

By adopting the structure, the power shaft is driven to rotate by the motor, the power shaft drives the switching rod to rotate, and the two ends of the switching rod are respectively provided with the wafer placing tables, so that the wafer can be cleaned in the shell by one wafer placing table, and the wafer can be taken and placed outside the shell by the other wafer placing table, therefore, the extra waiting time for cleaning the wafer can be greatly reduced, and the cleaning efficiency is high; can drive the relative switching pole of auxiliary rod through cylinder two and stretch out and draw back to make the wafer place the platform and rotate not interfere with the casing mutually, and can make the wafer place the platform again and can remove to the casing in, at the clearance in-process, can drive the wafer through motor two and place the platform and rotate, thereby under the cooperation of spray pipe one, spray pipe two and blow-dry pipe, the realization is to the washing of wafer.

Still install the aircraft bonnet in the frame, have the division board in the aircraft bonnet, division board divides into purge chamber and control chamber with the aircraft bonnet inside.

By adopting the structure, the shell is positioned in the cleaning chamber, and the operation chamber is used for taking and placing the wafer, so that the whole operation can be separated from the external environment.

The hood is made of transparent materials.

The operating room is provided with a taking and placing opening, the taking and placing opening is hinged with an cover plate, and a handle is installed on the cover plate.

By adopting the structure, the operation can be conveniently carried out in the operating room through the cover plate.

The auxiliary rod comprises a first horizontal rod, a second horizontal rod and a vertical rod, the vertical rod is fixedly connected between the first horizontal rod and the second horizontal rod, the first horizontal rod and the second horizontal rod are located on different sides of the vertical rod, a guide portion matched with the switching rod is arranged on the first horizontal rod, and an installation portion used for installing the second driving motor is arranged on the second horizontal rod.

And the frame is also provided with a plurality of horse wheels.

By adopting the structure, the whole wafer cleaning machine can be conveniently moved or positioned through the horseback wheel.

Compared with the prior art, the wafer cleaning machine has the advantages that:

the utility model discloses in drive the power shaft through the motor and rotate, the power shaft drives the switch lever and rotates, and the switch lever both ends all have the wafer and place the platform, can realize one and place the platform at the wafer and realize rinsing the operation to the wafer in the casing, and another wafer is placed the platform and is realized getting the operation of putting the wafer outside the casing to the wafer that can significantly reduce washs extra required latency, and the cleaning efficiency is high.

Drawings

Fig. 1 is a schematic plan view of the present invention;

FIG. 2 is a schematic plan view of the present invention with portions broken away;

fig. 3 is a schematic plan view of the housing of the present invention;

FIG. 4 is a schematic plan view of the auxiliary rod of the present invention;

in the figure, 1, a frame; 2. a fortune horse wheel; 3. a handle; 4. a cover plate; 5. a hood; 5a, an operation chamber; 5b, a cleaning chamber; 6. a partition plate; 7. a support; 8. a housing; 8a, an abdication gap; 9. a second driving motor; 10. a first cylinder; 11. an arc-shaped sealing sheet; 12. a second air cylinder; 13. a first driving motor; 14. a connecting seat; 15. a switch lever; 16. an auxiliary lever; 16a, a first horizontal rod; 16b, a vertical rod; 16c, a second horizontal rod; 17. a wafer placing table; 18. drying the tube; 19. a second liquid spraying pipe; 20. a first liquid spraying pipe; 21. a power shaft.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

As shown in fig. 1-4, the wafer cleaning machine comprises a frame 1, wherein a housing 8 with an opening at the upper part is mounted on the frame 1, a abdicating notch 8a communicated with the opening is formed at the side part of the housing 8, a first cylinder 10 is further mounted at the side part of the housing 8, a piston rod of the first cylinder 10 is vertically and upwardly arranged, an arc-shaped sealing sheet 11 capable of sealing the abdicating notch 8a is mounted at the end part of the piston rod of the first cylinder 10, the arc-shaped sealing sheet 11 is further connected with the housing 8 in a sliding manner, by adopting the structure, a wafer placing table 17 can conveniently enter the housing 8 through the abdicating notch 8a, and after entering, the arc-shaped sealing sheet 11 is driven by the first cylinder 10 to move so as to seal the abdicating notch 8 a; the side part of the shell 8 is also provided with a bracket 7, and the bracket 7 is provided with a first liquid spraying pipe 20, a second liquid spraying pipe 19 and a blow-drying pipe 18, wherein the first liquid spraying pipe 20, the second liquid spraying pipe 19 and the blow-drying pipe 18 are in the prior art in the embodiment; a power shaft 21 is vertically and rotatably arranged on the rack 1, the lower end of the power shaft 21 is connected with a first driving motor 13, an output shaft of the first driving motor 13 is vertically and upwardly arranged, the upper end of the power shaft 21 is connected with the middle of a switching rod 15 through a connecting seat 14, the end part of the switching rod 15 is in sliding connection with one end of an auxiliary rod 16, the other end of the auxiliary rod 16 is connected with a second driving motor 9, a wafer placing table 17 for placing a wafer is arranged on the second driving motor 9, any wafer placing table 17 can be moved into a shell 8, and a positioning assembly for positioning the wafer is arranged on the wafer placing table 17; a second air cylinder 12 is further mounted on the side of the connecting seat 14, a piston rod of the second air cylinder 12 is horizontally arranged, and the end of the piston rod of the second air cylinder 12 is connected with one end of an auxiliary rod 16.

By adopting the structure, the motor drives the power shaft 21 to rotate, the power shaft 21 drives the switching rod 15 to rotate, and the wafer placing tables 17 are arranged at the two ends of the switching rod 15, so that the wafer can be cleaned in the shell 8 by one wafer placing table 17, and the wafer can be taken and placed outside the shell 8 by the other wafer placing table 17, thereby greatly reducing the extra waiting time for cleaning the wafer and having high cleaning efficiency; the auxiliary rod 16 can be driven to stretch relative to the switching rod 15 through the second air cylinder 12, so that the wafer placing table 17 does not interfere with the shell 8 when rotating, the wafer placing table 17 can move into the shell 8, and the wafer placing table 17 can be driven to rotate through the second motor in the cleaning process, so that the wafers are cleaned under the matching of the first liquid spraying pipe 20, the second liquid spraying pipe 19 and the drying pipe 18.

A hood 5 is further mounted on the frame 1, and a partition plate 6 is provided in the hood 5, and the partition plate 6 divides the interior of the hood 5 into a wash chamber 5b and an operation chamber 5a.

With this structure, the housing 8 is located in the cleaning chamber 5b, and the operation chamber 5a is used for taking and placing the wafer, so that the whole operation can be isolated from the external environment.

The hood 5 is made of transparent material.

The operation chamber 5a is provided with a taking and placing opening, the taking and placing opening is hinged with a cover plate 4, and the cover plate 4 is provided with a handle 3.

With this structure, the operation in the operation room 5a can be facilitated by the cover plate 4.

The auxiliary lever 16 comprises a first horizontal lever 16a, a second horizontal lever 16c and a vertical lever 16b, the vertical lever 16b is fixedly connected between the first horizontal lever 16a and the second horizontal lever 16c, the first horizontal lever 16a and the second horizontal lever 16c are positioned on different sides of the vertical lever 16b, the first horizontal lever 16a is provided with a guide part matched with the switching lever 15, and the second horizontal lever 16c is provided with a mounting part used for mounting the second driving motor 9.

The frame 1 is also provided with a plurality of horse wheels 2, and in the embodiment, the number of the horse wheels 2 is four.

By adopting the structure, the whole wafer cleaning machine can be conveniently moved or positioned through the rocking wheel 2.

The above components are all standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experiments.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Claims

1. The wafer cleaning machine comprises a rack (1), and is characterized in that a shell (8) with an opening at the upper part is installed on the rack (1), a abdicating notch (8 a) communicated with the opening is formed in the side part of the shell (8), a first cylinder (10) is further installed on the side part of the shell (8), a piston rod of the first cylinder (10) is vertically and upwards arranged, an arc-shaped sealing sheet (11) capable of sealing the abdicating notch (8 a) is installed at the end part of the piston rod of the first cylinder (10), the arc-shaped sealing sheet (11) is further connected with the shell (8) in a sliding manner, a support (7) is further installed on the side part of the shell (8), a first liquid spraying pipe (20), a second liquid spraying pipe (19) and a blow-drying pipe (18) are arranged on the support (7), a power shaft (21) is installed on the rack (1) in a vertical rotating manner, the lower end part of the power shaft (21) is connected with the first driving motor (13), an output shaft of the first driving motor (13) is vertically and upwards arranged, the upper end part of the power shaft (21) is connected with a switching rod (14) and a second auxiliary rod (16) which is connected with a wafer moving platform (9) and is used for placing the wafer moving platform (17), the wafer placing table (17) is further provided with a positioning assembly for positioning a wafer, a second air cylinder (12) is further mounted on the side portion of the connecting seat (14), a piston rod of the second air cylinder (12) is horizontally arranged, and the end portion of the piston rod of the second air cylinder (12) is connected with one end of the auxiliary rod (16).

2. Wafer cleaning machine according to claim 1, characterized in that a hood (5) is also mounted on the frame (1), a partition plate (6) is provided in the hood (5), and the interior of the hood (5) is divided into a cleaning chamber (5 b) and an operating chamber (5 a) by the partition plate (6).

3. Wafer cleaning machine according to claim 2, characterized in that said hood (5) is made of transparent material.

4. The wafer cleaning machine as claimed in claim 2, wherein the operation chamber (5 a) is provided with a pick-and-place opening, a cover plate (4) is hinged to the pick-and-place opening, and a handle (3) is mounted on the cover plate (4).

5. The wafer cleaning machine according to claim 1, wherein the auxiliary bar (16) comprises a first horizontal bar (16 a), a second horizontal bar (16 c) and a vertical bar (16 b), the vertical bar (16 b) is fixedly connected between the first horizontal bar (16 a) and the second horizontal bar (16 c), the first horizontal bar (16 a) and the second horizontal bar (16 c) are arranged on different sides of the vertical bar (16 b), the first horizontal bar (16 a) is provided with a guide part matched with the switching bar (15), and the second horizontal bar (16 c) is provided with a mounting part for mounting the second driving motor (9).

6. A wafer cleaning machine according to claim 1, characterized in that a plurality of fomes wheels (2) are further mounted on the frame (1).