CN217790024U - Integrated circuit testing die for SMT packaged product - Google Patents

Integrated circuit testing die for SMT packaged product Download PDF

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Publication number
CN217790024U
CN217790024U CN202221383322.5U CN202221383322U CN217790024U CN 217790024 U CN217790024 U CN 217790024U CN 202221383322 U CN202221383322 U CN 202221383322U CN 217790024 U CN217790024 U CN 217790024U
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China
Prior art keywords
integrated circuit
base
smt
electric cabinet
workbench
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Application number
CN202221383322.5U
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Chinese (zh)
Inventor
胡来军
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Shenzhen Delong Supply Chain Co ltd
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Shenzhen Delong Supply Chain Co ltd
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Priority to CN202221383322.5U priority Critical patent/CN217790024U/en
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Abstract

The utility model belongs to the technical field of circuit testing, in particular to an integrated circuit testing die for SMT packaging products, which comprises a base, a processing table and a static-removing ion wind rod; the detector comprises a base, an electric cabinet, a workbench, a bent frame, a mounting frame and a detector, wherein the electric cabinet is arranged in the middle of the top of the base, the workbench is arranged on the top of the electric cabinet, the bent frame is arranged on one side of the top of the workbench, the mounting frame is arranged at the bottom of the bent frame, and the detector is arranged at the bottom of the mounting frame; the machining table is arranged in the middle of the top of the base, vertical plates are arranged on two sides of the top of the machining table, a locking cylinder is arranged on one side opposite to each vertical plate, and a locking clamping plate is arranged at one end of each locking cylinder; its is rational in infrastructure, and at the in-process that uses, it leads to integrated circuit board to be fixed by sweat stain and dust damage to avoid the manual work to integrated circuit board, has convenient fixed advantage, has the surface function of destaticizing simultaneously, and the security is higher.

Description

Integrated circuit testing die for SMT packaged products
Technical Field
The utility model relates to a circuit test technical field specifically is an integrated circuit test mould for SMT encapsulates product.
Background
SMT is an abbreviation for surface mounting technology, the most popular technique and process in the electronic assembly industry. Electronic circuit surface assembly techniques, known as surface mount or surface mount techniques. The surface-mounted component without pins or short leads is mounted on the surface of a printed circuit board or other substrates and is welded and assembled by methods such as reflow soldering or dip soldering.
Although the technical scheme disclosed by the application number of cn202122174999.X, entitled as an integrated circuit testing mold for SMT packaged products, achieves the function of convenient adjustment, the technical scheme still has some disadvantages, such as no surface static electricity removal function, and therefore a novel integrated circuit testing mold for SMT packaged products is provided to solve the problems.
SUMMERY OF THE UTILITY MODEL
This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the invention.
The utility model discloses a problem that exists among the integrated circuit test mould for SMT encapsulation product now has been provided.
Therefore, the utility model aims at providing an integrated circuit test mould for SMT encapsulates product, at the in-process that uses, avoids the manual work to fix integrated circuit board and leads to integrated circuit board to be damaged by sweat stain and dust, has convenient fixed advantage, has the surface function of destaticing simultaneously, and the security is higher.
For solving the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:
an integrated circuit testing die for SMT packaged products comprises a base, a processing table and a static-removing ion air bar;
wherein the content of the first and second substances,
an electric cabinet is arranged in the middle of the top of the base, a workbench is arranged on the top of the electric cabinet, a bent frame is arranged on one side of the top of the workbench, a mounting frame is arranged at the bottom of the bent frame, and a detector is arranged at the bottom of the mounting frame;
the machining table is arranged in the middle of the top of the base, vertical plates are arranged on two sides of the top of the machining table, a locking cylinder is arranged on one side opposite to each vertical plate, and a locking clamping plate is arranged at one end of each locking cylinder;
the static-removing ion wind rod is arranged on one side of the bent frame, and a wind port is formed in one side of the static-removing ion wind rod.
As the utility model discloses an integrated circuit test mould's an preferred scheme for SMT encapsulation product, wherein: the bottom four corners of base are provided with the universal wheel, and are provided with the stopper on the universal wheel.
As the utility model discloses an integrated circuit test mould's an preferred scheme for SMT encapsulation product, wherein: the locking splint is L-shaped, and a rubber gasket is arranged on the surface of the locking splint.
As the utility model discloses an integrated circuit test mould's an preferred scheme for SMT encapsulation product, wherein: the processing table is positioned right below the detector.
As the utility model discloses an integrated circuit test mould's an preferred scheme for SMT encapsulation product, wherein: an operation panel is arranged on the front surface of the electric cabinet.
As the utility model discloses an integrated circuit test mould's an preferred scheme for SMT encapsulation product, wherein: the electric cabinet is connected with an external power supply through a wire.
Compared with the prior art, the beneficial effects of the utility model are that: the processing table is arranged at the top of the workbench, and the vertical plate, the locking cylinder and the locking clamping plate are arranged at the top of the processing table, so that the workpiece is automatically locked, the integrated circuit board is prevented from being damaged by sweat stains and dust due to manual fixing of the integrated circuit board, and the integrated circuit board has the advantage of convenience in fixing; in addition, one side of the curved frame is provided with the static-removing ion wind rod, so that static removal on the surface of the workpiece is realized, and the improvement of the product quality is facilitated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor. Wherein:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic side view of the present invention;
fig. 3 is a schematic view of the structure of the processing table of the present invention.
In the figure: 100 bases, 110 universal wheels, 120 electric cabinets, 130 workbenches, 140 curved frames, 150 mounting frames, 160 detectors, 200 processing tables, 210 vertical plates, 220 locking cylinders, 230 locking clamping plates, 240 rubber gaskets, 300 static removing ion air bars and 310 air openings.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, other embodiments may be utilized and other implementations may be devised without departing from the spirit and scope of the present invention.
Next, the present invention will be described in detail with reference to the schematic drawings, and in the detailed description of the embodiments of the present invention, for convenience of explanation, the sectional view showing the device structure will not be enlarged partially according to the general scale, and the schematic drawings are only examples, and should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
The utility model provides a following technical scheme: an integrated circuit testing die for SMT packaged products, which avoids the damage of the integrated circuit board caused by sweat stain and dust due to manual fixing of the integrated circuit board in the using process, has the advantage of convenient fixing, and has the functions of surface static elimination and higher safety;
fig. 1 to 3 are schematic structural views illustrating an embodiment of an integrated circuit testing mold for SMT packaged products according to the present invention, the main body of which includes a base 100, a processing table 200 and a static ion removing air bar 300;
please refer to fig. 1 to 3 again: the middle of the top of the base 100 is in threaded connection with an electric cabinet 120, the top of the electric cabinet 120 is in threaded connection with a workbench 130, one side of the top of the workbench 130 is welded with a curved frame 140, the bottom of the curved frame 140 is welded with a mounting frame 150, the bottom of the mounting frame 150 is in threaded connection with a detector 160, four corners of the bottom of the base 100 are in threaded connection with universal wheels 110, the universal wheels 110 are in threaded connection with a limiter, further, the base 100 is used for bearing the electric cabinet 120 and the workbench 130, the workbench 130 is used for bearing the processing table 200 and the curved frame 140, the curved frame 140 is used for bearing the detector 160 and the static-removing ion wind bar 300, and the detector 160 is used for workpiece detection;
please refer to fig. 1 to 3 again: the machining table 200 is screwed in the middle of the top of the base 100, the vertical plates 210 are welded on two sides of the top of the machining table 200, the locking air cylinder 220 is screwed on one opposite side of each vertical plate 210, the locking clamping plate 230 is screwed on one end of each locking air cylinder 220, the locking clamping plate 230 is arranged in an L shape, the rubber gasket 240 is bonded on the surface of the locking clamping plate 230, and further, the vertical plates 210, the locking air cylinders 220 and the locking clamping plates 230 are used for fixing workpieces;
please refer to fig. 1 to 3 again: the static-removing ion wind rod 300 is screwed on one side of the curved frame 140, the wind port 310 is inserted into one side of the static-removing ion wind rod 300, and the static-removing ion wind rod 300 and the wind port 310 are used for removing static electricity on the surface of a workpiece, so that the product quality is improved.
The working principle is as follows: in the using process of the utility model, the processing table 200 is arranged at the top of the workbench 130, and the vertical plate 210, the locking cylinder 220 and the locking clamping plate 230 are arranged at the top of the processing table 200, so that the automatic locking of the workpiece is realized, the integrated circuit board is prevented from being damaged by sweat stains and dust due to manual fixing of the integrated circuit board, and the fixing device has the advantage of convenient fixing; in addition, the static electricity removing ion wind rod 300 is arranged on one side of the curved frame 140, so that the static electricity removing on the surface of the workpiece is realized, and the product quality is improved.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims (6)

1. An integrated circuit testing die for SMT packaged products, comprising: comprises a base (100), a processing table (200) and a static-removing ion wind rod (300);
wherein the content of the first and second substances,
an electric cabinet (120) is arranged in the middle of the top of the base (100), a workbench (130) is arranged on the top of the electric cabinet (120), a bent frame (140) is arranged on one side of the top of the workbench (130), a mounting frame (150) is arranged at the bottom of the bent frame (140), and a detector (160) is arranged at the bottom of the mounting frame (150);
the processing table (200) is arranged in the middle of the top of the base (100), vertical plates (210) are arranged on two sides of the top of the processing table (200), a locking cylinder (220) is arranged on one side opposite to each vertical plate (210), and a locking clamping plate (230) is arranged at one end of each locking cylinder (220);
the static-removing ion wind rod (300) is arranged on one side of the curved frame (140), and a wind port (310) is arranged on one side of the static-removing ion wind rod (300).
2. An integrated circuit test die for an SMT package product according to claim 1, wherein: the universal wheel (110) is arranged at four corners of the bottom of the base (100), and the universal wheel (110) is provided with a limiter.
3. An integrated circuit test die for SMT packaged products according to claim 1, wherein: the locking clamping plate (230) is arranged in an L shape, and a rubber gasket (240) is arranged on the surface of the locking clamping plate (230).
4. An integrated circuit test die for SMT packaged products according to claim 1, wherein: the processing table (200) is located directly below the detector (160).
5. An integrated circuit test die for SMT packaged products according to claim 1, wherein: an operation panel is arranged on the front surface of the electric cabinet (120).
6. An integrated circuit test die for an SMT package product according to claim 1, wherein: the electric control box (120) is connected with an external power supply through a lead.
CN202221383322.5U 2022-06-01 2022-06-01 Integrated circuit testing die for SMT packaged product Active CN217790024U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221383322.5U CN217790024U (en) 2022-06-01 2022-06-01 Integrated circuit testing die for SMT packaged product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221383322.5U CN217790024U (en) 2022-06-01 2022-06-01 Integrated circuit testing die for SMT packaged product

Publications (1)

Publication Number Publication Date
CN217790024U true CN217790024U (en) 2022-11-11

Family

ID=83920151

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221383322.5U Active CN217790024U (en) 2022-06-01 2022-06-01 Integrated circuit testing die for SMT packaged product

Country Status (1)

Country Link
CN (1) CN217790024U (en)

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