CN217786881U

CN217786881U - Wafer blue film test disc and wafer test machine

Info

Publication number: CN217786881U
Application number: CN202221731124.3U
Authority: CN
Inventors: 段雄斌; 张利利; 庞华贵; 何选民
Original assignee: Shenzhen Biaopu Semiconductor Co ltd
Current assignee: Shenzhen Biaopu Semiconductor Co ltd
Priority date: 2022-07-05
Filing date: 2022-07-05
Publication date: 2022-11-11
Anticipated expiration: 2032-07-05

Abstract

The utility model belongs to the technical field of the wafer test, especially, relate to a blue membrane test disc of wafer and wafer test machine, the blue membrane test disc of this wafer includes base plate, backup pad, primary and secondary ring and hoop: the substrate is provided with a hollow hole; the supporting plate is arranged on the substrate and covers the hollow hole; the primary and secondary rings are arranged on the base plate and surround the supporting plate; the iron ring is arranged on the substrate and surrounds the primary ring and the secondary ring. The wafer blue film test disc can be compatible with the test fixing modes of the iron ring and the primary and secondary rings, namely can be compatible with different wafer blue film fixing modes; in addition, in the production process, if different fixing modes need to be replaced, the wafer blue film test disc does not need to be replaced, and the fixing part corresponding to the fixing mode is selected, so that the production transferring speed is greatly improved.

Description

Wafer blue film test disc and wafer test machine

Technical Field

This application belongs to wafer test technical field, especially relates to a blue membrane test disc of wafer and wafer test machine.

Background

Blue membrane of wafer is widely applied to the chip package field, the wafer is laminated the surface of blue membrane of wafer usually and is stored, and in the preparation of actual chip package, need test the wafer of laminating on the blue membrane surface of wafer, fix the blue membrane of wafer on the test disc in chip test equipment usually at present, then, the testing arrangement who recycles in the chip test equipment tests the wafer, but the fixed mode of the blue membrane of current test disc and wafer is single, can not satisfy the various fixed mode of the blue membrane of wafer, thereby lead to having the inconvenient problem of trade production in the testing process.

SUMMERY OF THE UTILITY MODEL

An object of this application is to provide a blue membrane test disc of wafer and wafer test machine, and it is single with the fixed mode of the blue membrane of wafer to aim at solving the test disc among the prior art, can not satisfy the blue manifold fixed mode of membrane of wafer to lead to having the inconvenient technical problem of trade production in the test procedure.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: a die blue film test tray, comprising:

the substrate is provided with a hollow hole;

the supporting plate is arranged on the substrate and covers the hollow hole;

the primary and secondary rings are arranged on the base plate and surround the supporting plate; and

and the iron ring is arranged on the substrate and surrounds the primary ring and the secondary ring.

Optionally, the iron ring is magnetically attached to the substrate.

Optionally, the base plate is provided with a plurality of magnets, and the magnets are distributed at intervals along the circumferential direction of the iron ring and are connected with the iron ring in a magnetic adsorption manner.

Optionally, the base plate is provided with a plurality of reference columns, the reference columns are distributed along the circumference of the iron ring, and the peripheral wall of location with the peripheral wall butt of iron ring.

Optionally, the base plate is provided with an annular protrusion, the annular protrusion is arranged around the support plate, and the annular protrusion is located between the support plate and the primary and secondary rings.

Optionally, a vacuum groove for adsorbing the wafer blue film is formed in an end face, opposite to the substrate, of the annular protrusion.

Optionally, the vacuum groove is an annular groove extending circumferentially along the annular protrusion.

Optionally, the end surface of the annular protrusion, which faces away from the substrate, is further provided with a plurality of vacuum holes, the vacuum holes are uniformly distributed along the circumferential direction of the annular groove, and each vacuum hole is communicated with the vacuum groove.

Optionally, the outer circumferential wall of the annular protrusion is provided with a notch.

One or more technical schemes in the wafer blue film test disc that this application provided have one of following technological effect at least: according to the wafer blue film test disc, because the iron ring and the primary-secondary ring are arranged on the substrate at the same time, in the actual test process, if the wafer blue film needs to adopt the fixing mode of the iron ring, the iron ring on the substrate can be directly used for fixing; if the blue film of the wafer needs to adopt the fixing mode of the primary ring and the secondary ring, the primary ring and the secondary ring are adopted for fixing, so that the blue film test disc of the wafer in the embodiment of the application can be compatible with the test fixing mode of the iron ring and the primary ring and can be compatible with different blue film fixing modes of the wafer; in addition, in the production process, if different fixing modes need to be replaced, the wafer blue film test disc does not need to be replaced, and the fixing part corresponding to the fixing mode is selected, so that the production transferring speed is greatly improved.

The application adopts another technical scheme that: a wafer tester comprises the wafer blue film test disc.

According to the wafer testing machine, the iron ring and the primary-secondary ring are arranged on the substrate at the same time, so that the wafer testing machine disclosed by the embodiment of the application can be compatible with the test fixing modes of the iron ring and the primary-secondary ring, namely, different wafer blue film fixing modes can be compatible; in addition, in the production process, if different fixing modes need to be replaced, the wafer blue film test disc does not need to be replaced, and the fixing part corresponding to the fixing mode is selected, so that the production transferring speed is greatly improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a wafer blue film test tray according to an embodiment of the present application.

Fig. 2 is an exploded view of the wafer blue film test tray shown in fig. 1.

Wherein, in the figures, the respective reference numerals:

10-substrate 11-hollowed-out hole 12-magnet

13-positioning column 14-annular bulge 15-vacuum groove

16-vacuum hole 17-gap 20-support plate

21-positioning plane 30-primary-secondary ring 40-iron ring

50-joint.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in fig. 1-2, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functionality throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings only for the convenience of description and simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and thus, are not to be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.

As shown in fig. 1-2, in one embodiment of the present application, a wafer blue film test tray is provided, in which the wafer blue film is mainly used for fixing a wafer blue film, so that a test apparatus can accurately align a wafer on the wafer blue film for testing, for example, electrical testing or optical testing.

The wafer blue film test disc comprises a substrate 10, a support plate 20, a snap ring 30 and an iron ring 40, and it can be understood that the substrate 10 is used as an installation base body, is fixedly installed on a rack of a wafer test mechanism, and is fixed in the test process; the substrate 10 is provided with a hollow hole 11, the support plate 20 is arranged on the substrate 10, and the hollow hole 11 is sealed; wherein, backup pad 20 adopts transparent material preparation to form to convenient test light shines and jets out and is received by light collection device through backup pad 20 and light trap behind the wafer, thereby realizes the optical characteristic test of wafer. The primary and secondary rings 30 are mounted on the base plate 10 and arranged around the support plate 20; it can be understood that the snap ring 30 includes a sub ring and a mother ring sleeved outside the sub ring, so that the periphery of the die blue film is clamped between the sub ring and the mother ring, and then the sub ring 30 is mounted on the substrate 10, thereby achieving the fixation of the die blue film; the iron ring 40 is mounted on the base plate 10 and disposed around the primary and secondary rings 30.

The working process of the wafer blue film test disk according to the embodiment of the present application is described below, when the wafer blue film needs to adopt the fixing mode of the iron ring 40, the periphery of the wafer blue film is clamped between the iron ring 40 and the substrate 10, and the middle part of the wafer blue film is supported by the support plate 20, so that the test surface of the wafer is ensured to be in a flat state, and the test precision is improved; when blue membrane of wafer needs to adopt the fixed mode of primary and secondary ring 30, with the blue peripheral centre gripping of membrane of wafer between the primary and secondary ring in primary and secondary ring 30, then, install primary and secondary ring 30 on base plate 10 again, like the same reason, the blue middle part of membrane of wafer is supported by backup pad 20 to guarantee that the test surface of wafer is in the leveling condition, improve the measuring accuracy.

Based on the above structural design, in the wafer blue film test disc of the embodiment of the present application, since the substrate 10 is provided with the iron ring 40 and the snap ring 30 at the same time, in the actual test process, if the wafer blue film needs to adopt the fixing mode of the iron ring 40, the iron ring 40 on the substrate 10 can be directly used for fixing; if the blue film of the wafer needs to adopt the fixing mode of the primary-secondary ring 30, the primary-secondary ring 30 is adopted for fixing, so that the blue film test disc of the wafer in the embodiment of the application can be compatible with the test fixing modes of the iron ring 40 and the primary-secondary ring 30, namely, different blue film fixing modes of the wafer can be compatible; in addition, in the production process, if different fixing modes need to be replaced, the wafer blue film test disc does not need to be replaced, and the fixing part corresponding to the fixing mode is selected, so that the production transferring speed is greatly improved.

In this application embodiment, hoop 40 encircles outside primary and secondary ring 30 for hoop 40's size is greater than primary and secondary ring 30's size, and the size of the blue membrane of the fixed corresponding wafer of hoop 40 or primary and secondary ring 30 through selecting then also can be inequality, thereby makes this blue membrane of wafer test disk on the basis that can compatible different fixed mode, can also satisfy the fixed demand of the blue membrane of the wafer of not unidimensional, and application scope is wide, and the commonality is high, and it is fast to change production efficiency.

In this embodiment, the snap ring 30 may be directly placed on the substrate 10, or may be mounted on the substrate 10 by other methods such as fastening, inserting, and fastening, and the details thereof may be selected according to actual needs, which is not limited herein.

In another embodiment of the present application, the iron ring 40 of the blue film test disk is provided to be magnetically attracted to the substrate 10. Specifically, the periphery of the blue film of the wafer is magnetically clamped between the iron ring 40 and the substrate 10, so that the blue film of the wafer is good in fixing reliability and cannot shake, and the test precision is improved; in addition, the connected mode that hoop 40 and base plate 10 adopted magnetism to inhale, hoop 40 is directly got from base plate 10 and is put the change that can realize the blue membrane of wafer, is favorable to improving production efficiency, simultaneously, gets through hoop 40 through long-time getting and put the back, the damage can not appear to this blue membrane of wafer test disc's life and service reliability have been prolonged greatly.

In another embodiment of the present application, as shown in fig. 2, the substrate 10 of the wafer blue film test tray is provided with a plurality of magnets 12, and the magnets 12 are distributed at intervals along the circumferential direction of the iron ring 40 and are magnetically attracted to the iron ring 40. Specifically, when the test device is used, the periphery of the wafer blue film is clamped between the iron ring 40 and the magnets 12, and meanwhile, the magnets 12 are distributed at intervals along the circumferential direction of the iron ring 40, so that the periphery of the wafer blue film is subjected to the clamping force of the iron ring 40 and the magnets 12, the middle part of the wafer blue film can be flatly laid on the support plate 20, the test surface of a wafer is ensured to be in a flat state, and the test precision is improved; the iron ring 40 and the substrate 10 are attracted by the magnet 12, so that the structure is simple, the manufacturing and processing are convenient and fast, and the cost is low.

In another embodiment, the magnet 12 may be fixed to the substrate 10 by a detachable connection such as a fastener or a snap fit, or may be fixed to the substrate 10 by a non-detachable connection such as a solder or an adhesive.

In this embodiment, the number of the magnets 12 may be two, three, or more than four, and the magnets 12 are uniformly spaced along the circumferential direction of the iron ring 40, so as to ensure that the middle part of the wafer blue film can be flatly laid on the supporting plate 20, thereby improving the testing accuracy; for cost manufacturing, the number of the magnets 12 is four, and four magnets 12 are uniformly distributed around the iron ring 40.

In another embodiment of the present application, as shown in fig. 1 and 2, the substrate 10 of the wafer blue film test tray is provided with a plurality of positioning posts 13, the positioning posts 13 are distributed along the circumferential direction of the iron ring 40, and the outer circumferential wall of the positioning posts abuts against the outer circumferential wall of the iron ring 40. In practical application, the iron ring 40 is placed on the substrate 10, and the outer peripheral wall of the positioning column 13 is abutted to the outer peripheral wall of the iron ring 40, so that the iron ring 40 is positioned on the substrate 10, the operation is simple, and the improvement of the testing efficiency is facilitated.

In an embodiment, the outer peripheral wall of the iron ring 40 is formed with the positioning planes 21, wherein the number of the positioning planes 21 is two, three or more than four, the positioning planes 21 are arranged along the circumferential direction of the iron ring 40, and the positioning planes 21 are provided with a plurality of positioning columns 13 abutted thereto, so that in the actual manufacturing process, the positioning columns 13 corresponding to the positioning planes 21 can be linearly installed along the extending direction of the positioning planes 21, so that the installation and positioning of the positioning columns 13 are simpler and more convenient, and the processing and manufacturing are convenient. In the embodiment, the number of the positioning columns 13 is four, the number of the positioning planes 21 is four, and two positioning columns 13 abut against two adjacent positioning planes 21 respectively, so that the accurate positioning of the iron ring 40 on the substrate 10 in two perpendicular directions is realized.

In another embodiment of the present application, as shown in fig. 1 and 2 in combination, the substrate 10 of the wafer blue film test tray is provided with an annular protrusion 14, the annular protrusion 14 is disposed around the support plate 20, and the annular protrusion 14 is located between the support plate 20 and the snap ring 30. Specifically, the annular protrusion 14 can separate the support plate 20 from the primary-secondary ring 30, the inner peripheral wall of the annular protrusion 14 can limit the support plate 20, the support plate 20 cannot move, test errors caused by movement of the support plate 20 are reduced, and test accuracy is improved; during actual installation, the light transmission hole can be shielded by placing the support plate 20 in the annular bulge 14, so that the installation operation of the support plate 20 is realized, and the accuracy of the installation position is good; simultaneously, the periphery wall of annular arch 14 can also play the effect to son and mother's ring 30 location for son and mother's ring 30 can not remove, improves the measuring accuracy, simultaneously, overlaps son and mother's ring 30 cover and can realize the equipment outside annular arch 14, and its equipment easy operation is efficient.

In another embodiment of the present application, as shown in fig. 1 and fig. 2, a vacuum groove 15 for adsorbing a wafer blue film is opened on an end surface of the annular protrusion 14 of the wafer blue film test tray, which faces away from the substrate 10. When specifically using, after the blue membrane of wafer is fixed to be accomplished, the blue membrane vacuum adsorption of wafer is on vacuum tank 15 to make the blue membrane of wafer can more lay backup pad 20 smoothly on, further, improve the planarization of wafer test surface, improve the measuring accuracy.

In another embodiment of the present application, shown in conjunction with fig. 1 and 2, the vacuum groove 15 of the wafer blue film test disk is provided as an annular groove extending circumferentially along the annular protrusion 14. When concrete application, the periphery vacuum adsorption of the blue membrane of wafer is on the ring channel, at this moment, the middle part of the blue membrane of wafer, backup pad 20 and the protruding 14 internal perisporium of annular can enclose and establish and form an enclosure space, and along with the ring channel is evacuation constantly, can be with the air suction in this enclosure space, make the middle part of the blue membrane of wafer can adsorb on backup pad 20, and can guarantee after the vacuum adsorption firm level and smooth and can not produce the bubble between the middle part of backup pad 20 and the blue membrane of wafer, guarantee that the test removes the in-process wafer and stabilize and can not take place the displacement, improve the measuring accuracy.

In another embodiment of the present application, as shown in fig. 1 and fig. 2, a plurality of vacuum holes 16 are further formed on an end surface of the annular protrusion 14 of the wafer blue film test tray, which faces away from the substrate 10, the vacuum holes 16 are uniformly distributed along a circumferential direction of the annular groove, and each vacuum hole 16 is communicated with the vacuum groove 15. In concrete application, the setting of a plurality of vacuum holes 16 for vacuum degree distribution uniformity is good in the ring channel, and vacuum adsorption power distributes evenly on the periphery of the blue membrane of wafer like this, makes the firm planarization between the middle part of backup pad 20 and the blue membrane of wafer after the vacuum adsorption better, and the probability that the bubble appears is littleer, and the test removes in-process wafer stability, and the probability of taking place the displacement is littleer, and the measuring accuracy is higher.

In this embodiment, a plurality of channels are formed in the substrate 10, the vacuum holes 16 are respectively communicated with the air outlets of the channels in a one-to-one correspondence manner, the air inlet of each channel is provided with a joint 50 and is connected with a vacuum generator through the joint 50, and the channels, the vacuum holes 16 and the annular groove are vacuumized through the vacuum generator, so that vacuum adsorption of the wafer blue film is realized.

In one embodiment, the vacuum holes 16 are elongated holes and extend along the radial direction of the annular groove, one end of the elongated holes close to the center of the annular groove is connected with the annular groove, and the other end of the vacuum holes 16 is communicated with the channel; wherein, the number of the vacuum holes 16 is two, three or more than four; it is preferable that the number of the vacuum holes 16 is three in consideration of manufacturing cost and structural strength of the substrate 10.

In another embodiment of the present application, as shown in fig. 1 and 2, the peripheral wall of the annular protrusion 14 of the wafer blue film test disk is provided with a notch 17. When specifically using, the hand of operating personnel can stretch into this breach 17 and take off primary and secondary ring 30 for the operation of taking out of primary and secondary ring 30 is simple convenient and fast more.

In the present embodiment, the number of the notches 17 may be two, three, or more than four, the notches 17 are evenly distributed along the circumferential direction of the annular protrusion 14, and exemplarily, the number of the notches 17 is four.

The blue membrane test disc of wafer of embodiment of the application, including the location and the absorption method that base plate 10 can compatible hoop 40 and primary and secondary ring 30, be equipped with magnet 12 and reference column 13 on the base plate 10, magnet 12 and reference column 13 are used for hoop 40 to lean on limit location and absorbent effect, backup pad 20 is the part that is used for supporting the blue membrane of wafer in hoop 40 or primary and secondary ring 30, guarantee to be tested the wafer face and level, backup pad 20's periphery is equipped with vacuum tank 15 and is used for adsorbing the blue membrane of wafer that is fixed in on primary and secondary ring 30 or hoop 40, guarantee after the vacuum adsorption that firm the leveling does not have the bubble between backup pad 20 and the blue membrane of wafer, guarantee that the test removes the stable displacement that does not take place of in-process chip.

In another embodiment of the present application, a wafer testing machine is provided, which includes the above wafer blue film test tray.

According to the wafer testing machine provided by the embodiment of the application, as the iron ring 40 and the primary-secondary ring 30 are arranged on the substrate 10 at the same time, the wafer testing machine provided by the embodiment of the application can be compatible with the test fixing modes of the iron ring 40 and the primary-secondary ring 30, namely, different wafer blue film fixing modes; in addition, in the production process, if different fixing modes need to be replaced, the wafer blue film test disc does not need to be replaced, and the fixing part corresponding to the fixing mode is selected, so that the production transferring speed is greatly improved.

The blue membrane test disc of wafer of this application embodiment, the fixed method of multiple wafer of can compatible also can make the compatible test method of more types of wafer test machine better, reduces manufacturing enterprise's equipment quantity and production place.

Since the wafer testing machine of the embodiment of the present application adopts all the technical solutions of all the embodiments described above, all the beneficial effects brought by the technical solutions of the embodiments described above are also achieved, and are not described in detail herein.

The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.

Claims

1. A die blue film test tray, comprising:

the substrate is provided with a hollow hole;

the supporting plate is arranged on the substrate and covers the hollow hole;

2. The wafer blue film test tray of claim 1, wherein: the iron ring is connected with the substrate in a magnetic adsorption manner.

3. The wafer blue film test tray of claim 2, wherein: the base plate is provided with a plurality of magnets, the magnets are distributed along the circumferential direction of the iron ring at intervals and are connected with the iron ring in a magnetic adsorption mode.

4. The wafer blue film test tray of claim 1, wherein: the base plate is provided with a plurality of reference columns, the reference column is followed the circumference of hoop distributes, the periphery wall of location with the periphery wall butt of hoop.

5. A wafer blue film test tray according to any one of claims 1 to 4, wherein: the base plate is provided with annular protrusion, annular protrusion encircles the backup pad setting, annular protrusion is located the backup pad with between the primary and secondary ring.

6. The wafer blue film test tray of claim 5, wherein: the end face, back to the substrate, of the annular protrusion is provided with a vacuum groove for adsorbing a wafer blue film.

7. The wafer blue film test tray of claim 6, wherein: the vacuum groove is an annular groove extending along the circumferential direction of the annular protrusion.

8. The wafer blue film test tray of claim 7, wherein: the annular protrusion is back to the end face of the substrate, a plurality of vacuum holes are further formed in the end face of the annular protrusion, the vacuum holes are evenly distributed along the circumferential direction of the annular groove, and the vacuum holes are communicated with the vacuum groove.

9. The wafer blue film test tray of claim 5, wherein: the peripheral wall of the annular bulge is provided with a notch.

10. A wafer tester is characterized in that: comprising a wafer blue test disc according to any of claims 1 to 9.