CN217775943U

CN217775943U - Laser processing jig and laser processing equipment

Info

Publication number: CN217775943U
Application number: CN202221474325.XU
Authority: CN
Inventors: 潘明铮; 王习文; 彭大硌; 张董洁; 王昌焱; 徐新峰; 房用桥; 李士杰; 朱玉涛; 罗奕长; 高云峰
Original assignee: Han s Laser Technology Industry Group Co Ltd
Current assignee: Han s Laser Technology Industry Group Co Ltd
Priority date: 2022-06-13
Filing date: 2022-06-13
Publication date: 2022-11-11
Anticipated expiration: 2032-06-13

Abstract

The application discloses laser beam machining tool and laser beam machining equipment. Laser beam machining tool includes: the dust collection device comprises a base, a dust collection cavity is arranged in the base, a plurality of dust collection holes are formed in the surface of the base, and the dust collection holes are communicated with the dust collection cavity; the jig base plate is arranged on the base and positioned in the area provided with the dust suction holes, the jig base plate is used for placing a product to be processed, a first processing hole is formed in the jig base plate, and the first processing hole corresponds to the processing area of the product to be processed; the jig cover plate is detachably connected to the jig bottom plate and used for pressing a product to be processed, a second processing hole corresponding to the first processing hole is formed in the jig cover plate, and the laser penetrates through the second processing hole to process the product to be processed. The application provides a centre gripping that can be stable treats the processing product, and enables to treat laser beam machining tool and the laser beam machining equipment that the work piece obtained better protection.

Description

Laser processing jig and laser processing equipment

Technical Field

The application relates to the technical field of clamps, especially, relate to a laser beam machining tool and laser beam machining equipment.

Background

When the product is processed by laser, for example, when the PCBA (Printed Circuit Board) Board is cut by laser to divide the Board, the product needs to be fixed by a jig first, so as to prevent the product from moving in the processing process and affecting the processing precision. In the existing jig, the product is generally positioned by abutting the side edge of the product. The positioning effect of the positioning mode is not ideal, the product can only be basically ensured not to move in the horizontal direction, but the product can not be ensured not to move in the vertical direction, and the positioning mode enables the upper surface of the product to be exposed outside, so that the parts which do not need to be processed on the product can not be effectively protected.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the application provides a stable centre gripping of ability treats the processing product, and enables to treat laser beam machining tool and laser beam machining equipment that the work piece obtained better protection.

To achieve the purpose, the following technical scheme is adopted in the application:

a laser processing jig includes:

the dust collection device comprises a base, a dust collection cavity and a dust collection device, wherein the base is internally provided with the dust collection cavity, the surface of the base is provided with a plurality of dust collection holes, and the dust collection holes are communicated with the dust collection cavity;

the jig base plate is arranged on the base and is positioned in the area, provided with the dust suction holes, of the base, the jig base plate is used for placing a product to be processed, a first processing hole is formed in the jig base plate, and the first processing hole corresponds to the processing area of the product to be processed;

the jig cover plate is detachably connected to the jig bottom plate and used for compressing a product to be processed, a second processing hole corresponding to the first processing hole is formed in the jig cover plate, and laser penetrates through the second processing hole to process the product to be processed.

As an alternative of the above-mentioned laser processing jig, the laser processing jig further includes:

the sealing plate is arranged on the base and used for sealing the area which is provided with the dust suction hole and is not covered by the jig bottom plate on the base.

As an alternative of the laser processing jig, the laser processing jig further comprises a first positioning element, a second positioning element and a third positioning element, and the first positioning element, the second positioning element and the third positioning element are all arranged on the base; the first positioning piece and the second positioning piece are respectively positioned at two ends of the jig bottom plate along the first direction, and the third positioning piece is positioned at one end of the jig bottom plate along the second direction; the first direction is perpendicular to the second direction.

As an alternative of the laser processing jig, an elastic propping structure is arranged on the first positioning piece or the second positioning piece, and the elastic propping structure can prop a product to be processed to the opposite side tightly.

As an alternative of the above laser processing jig, the elastic jacking structure includes:

the ball head column is arranged on the first positioning piece or the second positioning piece, arranged along a first direction and capable of sliding along the first direction;

and the elastic piece is used for propping the ball head column to the opposite side.

As an alternative of the above laser processing jig, at least one of the jig base plate and the jig cover plate is provided with a magnet, so that the jig cover plate and the jig base plate are detachably connected through the magnet.

As an alternative of the laser processing jig, the jig bottom plate is provided with a cover plate positioning pin for positioning the jig cover plate and a product positioning pin for positioning a product to be processed.

the jig base plate is arranged on the base, the jig base plate and the jig cover plate are arranged on the jig base plate, and a hollow area is arranged at the position, below the jig base plate, on the jig base plate.

As an alternative of the laser processing jig, the base comprises a bottom plate, a side plate and a top plate; the side plates are multiple and are arranged around the bottom plate to form the dust suction cavity, the top plate is covered above the side plates, and the dust suction holes are formed in the top plate.

A laser processing device comprises the laser processing jig.

The embodiment of the application has the advantages that: the jig cover plate used for pressing the product to be processed is arranged on the jig base plate, so that the product to be processed can be firmly pressed on the jig base plate and cannot move, and the processing precision is improved. The jig cover plate is provided with a second processing hole for laser to pass through, the processing area of the product is processed, and the part outside the processing area of the product can be protected by the jig cover plate and cannot be damaged. The tool bottom plate is provided with first processing hole, and first processing hole corresponds with the processing region of treating the processing product, can guarantee like this that the regional below fretwork of product processing prevents that laser from being reflected back by the tool bottom plate and burning out the product. The base surface is equipped with a plurality of dust absorption holes, is equipped with the dust absorption chamber in the base, and the dust absorption hole can be siphoned away dust and waste residue that produce in the course of working with the dust absorption chamber intercommunication.

Drawings

Fig. 1 is a schematic structural diagram of a laser processing jig according to an embodiment of the present application;

fig. 2 is an exploded view of a laser processing fixture according to an embodiment of the present disclosure;

FIG. 3 is an exploded view of the base of an embodiment of the present application;

FIG. 4 is a schematic structural view of a first positioning member according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a jig base plate according to an embodiment of the present application;

fig. 6 is a schematic structural diagram of a jig cover plate according to an embodiment of the present application;

fig. 7 is a schematic view of a back structure of a cover plate of a jig according to an embodiment of the present application.

In the figure:

100. a laser processing jig;

110. a base; 111. a dust suction chamber; 112. a dust extraction port; 113. a dust collection hole; 114. a base plate; 1141. a support column; 115. a side plate; 116. a top plate;

120. a jig base plate; 121. a first machining hole; 122. an avoidance groove; 123. a magnet; 124. a cover plate positioning pin; 125. positioning pins of the product;

130. a jig cover plate; 131. a second machining hole;

140. closing plates;

151. a first positioning member; 1511. an elastic jacking structure; 1512. a ball stud; 1513. a strip-shaped hole; 152. a second positioning member; 153. a third positioning member;

160. a jig backing plate; 161. screw holes.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures.

In the description of the present application, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly and include, for example, fixedly connected, detachably connected, or integral to one another; may be directly connected or indirectly connected through an intermediate. The meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. The terms "first" and "second" are used merely for descriptive purposes and are not intended to have a special meaning.

The embodiment of the application provides a laser processing tool. Referring to fig. 1 and 2, the laser processing jig 100 includes a base 110, a jig base plate 120, and a jig cover plate 130. As shown in fig. 3, a dust suction chamber 111 is disposed in the base 110, and the dust suction chamber 111 is connected to an external vacuum device through a dust suction port 112 to vacuum the dust suction chamber 111. Referring to fig. 2 and 3, the surface of the base 110 is provided with a plurality of dust suction holes 113, the dust suction holes 113 are communicated with the dust suction chamber 111, and the dust suction holes 113 are used for sucking dust and waste residues generated in the laser processing process into the dust suction chamber 111.

The jig base plate 120 is installed on the base 110 and located in the area where the dust suction holes 113 are formed in the base 110, and the jig base plate 120 is used for placing a product to be processed. The laser processing jig 100 in the embodiment of the present application is used for laser cutting of a product, and may be used for other laser processing. Since the laser penetrates through the product during the laser cutting, in the embodiment of the present application, referring to fig. 5, a first processing hole 121 is disposed on the jig base plate 120, and the first processing hole 121 is disposed corresponding to a processing area of the product to be processed. Therefore, the lower part of the product processing area is hollowed out, and the laser is prevented from being reflected by the jig base plate 120 to burn out the product. The first processing hole 121 is a hollow hole, so that dust and waste residues generated by processing leak from the first processing hole 121 and are sucked away from the dust suction hole 113 by the base 110.

Referring to fig. 1 and 2, the jig cover plate 130 is detachably connected to the jig base plate 120, and the jig cover plate 130 is used for pressing the product to be processed. The jig cover plate 130 is arranged to compress the product, so that the product to be processed can be firmly compressed on the jig base plate 120, the product cannot move randomly, and the processing precision is improved. As shown in fig. 6, the jig cover plate 130 is provided with a second processing hole 131, and the second processing hole 131 corresponds to the first processing hole 121 on the jig base plate 120. Since the second processing hole 131 corresponds to the first processing hole 121 and the first processing hole 121 is disposed corresponding to a processing area of a product to be processed, the second processing hole 131 also corresponds to the processing area of the product. The laser passes through the second processing hole 131 to process the product to be processed. The jig cover plate 130 is provided with a second processing hole 131 for protecting the product.

As shown in fig. 5 and 7, the jig base plate 120 and the jig cover plate 130 are both provided with an avoiding groove 122, and the avoiding groove 122 is used for avoiding a protruding portion or a protruding component on a product. The avoidance groove 122 may be an avoidance hole as long as an avoidance function is provided.

Referring to fig. 1 and 2, the laser processing jig 100 further includes a sealing plate 140. The sealing plate 140 is disposed on the base 110, and the sealing plate 140 is used to seal the area of the base 110, which is not covered by the jig base plate 120 and is provided with the dust suction hole 113. That is, the area of the base 110 where the dust suction holes 113 are formed is larger than the area that the jig base 120 can cover, which is convenient for adjusting the size of the jig base 120 according to the size of the product. The sealing plate 140 is used for covering the area of the jig base plate 120 outside the coverage area of the base 110, and when the product size is larger and the used jig base plate 120 is larger, the sealing plate 140 is smaller; when the product size is smaller and the used jig base plate 120 is smaller, the sealing plate 140 is larger than the sealing plate 140. The above design makes the laser processing jig 100 of the embodiment of the present application adaptable to products of different sizes.

With reference to fig. 1 and fig. 2, the laser processing jig 100 further includes a first positioning element 151, a second positioning element 152 and a third positioning element 153, and the first positioning element 151, the second positioning element 152 and the third positioning element 153 are all disposed on the base 110 for positioning a product. As shown in fig. 1, the first positioning element 151 and the second positioning element 152 are respectively disposed at two ends of the jig base plate 120 along the first direction, and the third positioning element 153 is disposed at one end of the two ends of the jig base plate 120 along the second direction. The first direction is perpendicular to the second direction. For convenience of description, the first direction, the second direction, and the third direction are defined in the embodiments of the present application. The first direction, the second direction and the third direction are perpendicular to each other, and as shown in fig. 1, the first direction, the second direction and the third direction may correspond to an X direction, a Y direction and a Z direction of the spatial coordinate system, respectively. The first direction, the second direction, and the third direction may also be understood as a left-right direction, a front-back direction, and an up-down direction of the laser processing jig 100. Above setting up make first setting element 151 and second setting element 152 respectively with the both ends butt of product along first direction, third setting element 153 and the one end butt of product along the second direction to fix a position the product, rethread tool apron 130 compresses tightly the product. The jig base plate 120 is provided with a third positioning element 153 at one end along the second direction, and no positioning element is provided at the other end along the second direction, so that when a product is clamped, the product can be inserted from the end without the positioning element.

In an embodiment, referring to fig. 1 and fig. 4, an elastic propping structure 1511 is disposed on the first positioning element 151 or the second positioning element 152, and a propping direction of the elastic propping structure 1511 is along a first direction, so that the elastic propping structure 1511 can prop a product to be processed toward an opposite side. As shown in fig. 4, in the embodiment of the present application, the elastic pushing structure 1511 is disposed on the first positioning element 151, and in other embodiments, the elastic pushing structure 1511 may also be disposed on the second positioning element 152.

In one embodiment, referring to fig. 4, the elastic tightening structure 1511 may include a stud 1512 and an elastic member (not shown). The ball stud 1512 is provided on the first positioning member 151 or the second positioning member 152. When the elastic pushing structure 1511 is disposed on the first positioning element 151, the ball stud 1512 is disposed on the first positioning element 151, and when the elastic pushing structure 1511 is disposed on the second positioning element 152, the ball stud 1512 is disposed on the second positioning element 152. As shown in fig. 4, the ball stud 1512 is disposed in a first direction and is slidable in the first direction. The elastic member is used to push the ball stud 1512 to the opposite side, so that the ball stud 1512 is tightly pressed against the product to position the product. The elastic member may be a spring.

The head of the stud 1512 is curved or spherical to make the contact surface of the stud 1512 and the product smoother, thereby avoiding damage to the product. Meanwhile, referring to fig. 1, since the product is inserted from one end of the jig base plate 120 in the second direction, it is more advantageous to smoothly insert the product by arranging the head of the ball stud 1512 to be arc-shaped or ball-shaped. When a product is inserted, because the elastic member has elasticity, when the product contacts the ball stud 1512, the product extrudes the ball stud 1512 outwards, and the ball stud 1512 fixes the product tightly under the action of the elastic member, so that the product is tightly propped against the positioning member on the opposite side to position the product.

In one embodiment, referring to fig. 1, the jig cover plate 130 may be detachably connected to the jig base plate 120, so that the jig cover plate 130 is easily detached from and installed on the jig base plate 120. Further, the jig cover plate 130 may be detachably connected to the jig base plate 120 through a magnetic structure. Referring to fig. 5, a magnet 123 is disposed on at least one of the jig base plate 120 and the jig cover plate 130, so that the jig cover plate 130 and the jig base plate 120 are detachably connected through the magnet 123. In the embodiment of the present application, the magnets 123 are disposed on the jig base plate 120 and the jig cover plate 130, and the magnets 123 on the jig base plate 120 and the jig cover plate 130 are disposed correspondingly, so that the magnets 123 on the jig base plate 120 and the jig cover plate 130 attract each other, and the attraction force is stronger.

Referring to fig. 5, the jig base plate 120 may further include a cover plate positioning pin 124 for positioning the jig cover plate 130, and a product positioning pin 125 for positioning a product to be processed. The product and the jig cover plate 130 are positioned on the jig base plate 120 by the product positioning pins 125 and the cover plate positioning pins 124, respectively. It is understood that the jig cover 130 is provided with positioning holes for engaging with the cover positioning pins 124, and the product is provided with positioning holes for engaging with the product positioning pins 125.

Referring to fig. 1 and fig. 2, in an embodiment, the laser processing jig 100 further includes a jig pad 160. The jig base plate 160 is disposed on the base 110, and the jig base plate 120 and the jig cover plate 130 are disposed on the jig base plate 160. In the third direction, the base 110, the jig base plate 160, the jig base plate 120, and the jig cover plate 130 are sequentially disposed from bottom to top. As shown in fig. 2, a hollowed-out area a is disposed below the jig base plate 120 on the jig base plate 160, and the jig base plate 120 and the jig cover plate 130 are disposed above the hollowed-out area a, so that the processing dust and the waste residue are leaked from the hollowed-out area a and are absorbed. Referring to fig. 1 and 2, the jig base plate 120, the first positioning element 151, the second positioning element 152, and the third positioning element 153 are all fixed on the jig base plate 160 by screws, and the jig cover plate 130 is magnetically attached to the jig base plate 120. The jig base plate 160 is provided to facilitate the installation of the jig base plate 120, the jig cover plate 130, the first positioning member 151, the second positioning member 152 and the third positioning member 153, and to enable dust and waste residues generated during the processing process to be sucked away from the hollow area a of the jig base plate 160.

As shown in fig. 2, the first positioning element 151, the second positioning element 152 and the third positioning element 153 are all provided with a strip-shaped hole 1513, so that the positions of the first positioning element 151, the second positioning element 152 and the third positioning element 153 on the jig base plate 160 can be adjusted. The fixing of the positioning member can be completed by passing the screw through the strip-shaped hole 1513 and locking the screw to the jig backing plate 160. The strip-shaped holes 1513 of the first positioning member 151 and the second positioning member 152 extend along the first direction, so that the positions of the first positioning member 151 and the second positioning member 152 on the jig base plate 160 can be adjusted along the first direction. The strip-shaped hole 1513 of the third positioning member 153 extends along the second direction, so that the position of the third positioning member 153 on the jig base plate 160 can be adjusted along the third direction. Meanwhile, the jig backing plate 160 is provided with a plurality of screw holes 161, so that the strip-shaped hole 1513 on the positioning piece can be matched with different screw holes 161, and the mounting position of the positioning piece can be further adjusted. The positioning member is adjustable, so that the laser processing jig 100 of the embodiment of the present application can adapt to products with different sizes.

Referring to fig. 3, in an embodiment, the base 110 may include a bottom plate 114, side plates 115, and a top plate 116. The side plates 115 are multiple, and the side plates 115 are arranged around the bottom plate 114 to form the dust collection cavity 111. In the embodiment of the present application, the base 110 is rectangular, and the side plates 115 are four. The top plate 116 is covered above the side plate 115, and the dust suction hole 113 is formed in the top plate 116. The dust suction hole 113 penetrates the upper and lower end surfaces of the top plate 116, so that the dust suction hole 113 communicates with the dust suction chamber 111. When the laser processing jig 100 works, negative pressure is formed in the dust suction cavity 111, so that dust and waste residues generated in the laser processing process are sucked away.

With continued reference to FIG. 3, the bottom plate 114 may be provided with support posts 1141, and the support posts 1141 can be abutted against the top plate 116 to prevent the top plate 116 from sagging and deforming. The support posts 1141 may be provided in a number of strips supported at various locations on the bottom of the top plate 116.

The embodiment of the application also provides laser processing equipment. The laser processing apparatus includes the above-mentioned laser processing jig 100. The laser processing equipment in the embodiment of the application can be a laser cutting machine, and of course, other laser processing equipment can also be used. The laser processing apparatus of the embodiment of the present application includes the laser processing fixture 100, and thus has at least the beneficial effects of the laser processing fixture 100, and the details are not repeated herein.

It should be understood that the above-mentioned examples are only examples for clearly illustrating the present application, and are not intended to limit the embodiments of the present application. Numerous obvious variations, adaptations and substitutions will occur to those skilled in the art without departing from the scope of the present application. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A laser processing jig is characterized by comprising:

the jig base plate is arranged on the base and is positioned in the area, provided with the dust suction holes, of the base, and used for placing a product to be processed;

2. The laser processing jig of claim 1, further comprising:

and the sealing plate is arranged on the base and used for sealing the area which is provided with the dust absorption hole on the base and is not covered by the jig bottom plate.

3. The laser processing jig according to claim 1, further comprising a first positioning member, a second positioning member, and a third positioning member, wherein the first positioning member, the second positioning member, and the third positioning member are all disposed on the base; the first positioning piece and the second positioning piece are respectively positioned at two ends of the jig bottom plate along the first direction, and the third positioning piece is positioned at one end of the jig bottom plate along the second direction; the first direction is perpendicular to the second direction.

4. The laser processing jig of claim 3, wherein the first positioning member or the second positioning member is provided with an elastic pushing structure, and the elastic pushing structure can push a product to be processed to the opposite side.

5. The laser processing jig of claim 4, wherein the elastic jacking structure comprises:

and the elastic piece is used for pushing the ball head column to the opposite side top.

6. The laser processing jig according to claim 1, wherein a magnet is provided on at least one of the jig base plate and the jig cover plate, so that the jig cover plate and the jig base plate are detachably connected through the magnet.

7. The laser processing jig according to claim 1, wherein the jig base plate is provided with a cover plate positioning pin for positioning the jig cover plate and a product positioning pin for positioning a product to be processed.

8. The laser processing jig according to claim 1, further comprising:

9. The laser processing jig of any one of claims 1 to 8, wherein the base includes a bottom plate, side plates, and a top plate; the side plates are multiple and are arranged around the bottom plate to form the dust suction cavity, the top plate is covered above the side plates, and the dust suction holes are formed in the top plate.

10. A laser processing apparatus comprising the laser processing jig according to any one of claims 1 to 9.