CN217770530U

CN217770530U - A encapsulating processing apparatus for PCB board

Info

Publication number: CN217770530U
Application number: CN202221524796.7U
Authority: CN
Inventors: 王孝军; 唐君莲; 汪佳佳; 朱惟峰
Original assignee: Suzhou Pengxie Intelligent Control Technology Co ltd
Current assignee: Suzhou Pengxie Intelligent Control Technology Co ltd
Priority date: 2022-06-17
Filing date: 2022-06-17
Publication date: 2022-11-08
Anticipated expiration: 2032-06-17

Abstract

The utility model discloses a glue filling processing device for a PCB, which relates to the technical field of PCB glue filling processing, and comprises a bearing box and an observation window arranged in an opening of the front end face of the bearing box, wherein a shunting cavity is arranged in the inner wall of the box body of the bearing box, air inlet pipes are transversely arranged at the bottoms of two sides of the bearing box, air outlet pipes are arranged at the upper parts of the periphery of the inner wall of the bearing box, a plurality of air guide pipes are arranged on the inner bottom surface of the bearing box in an equidistant communication manner, and an air supply assembly is arranged at the top end of each communication pipe; the utility model discloses a reposition of redundant personnel chamber and the cooperation of going out tuber pipe and air supply subassembly, be convenient for carry out quick colloid solidification cooling operation to the PCB board after the encapsulating, can carry out the independent control to the inclination that goes out the tuber pipe according to local encapsulating position on the PCB board simultaneously, can avoid the wind body of bottom directly to blow simultaneously and penetrate on the bottom surface of PCB board, the wind body that is convenient for make the lower part get into can be to the even diffusion in four corners, has effectively improved the fast curing effect to PCB board encapsulating position.

Description

A encapsulating processing apparatus for PCB board

Technical Field

The utility model relates to a PCB board encapsulating technical field especially relates to an encapsulating processing apparatus for PCB board.

Background

The PCB needs to carry out encapsulation and glue filling operation on the placement position of an electronic element during processing, the PCB has a plurality of encapsulation methods, such as coating three-proofing paint on the surface layer of the circuit board, low-pressure injection molding, glue filling and other encapsulation methods, after the glue filling operation on the electronic element position on the PCB is finished, the glue on the PCB passing through the glue filling position needs to be solidified, the glue on the glue filling position is generally solidified and cooled by adopting a mode of blowing cold air to arrange the top surface of the PCB, but the glue head on the bottom surface of the PCB cannot be directly blown and jetted by air due to glue filling overflow, the solidification efficiency is slow, the consumed time of the PCB after glue filling and solidification is influenced, and therefore the problems need to be improved and processed.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a glue pouring processing device for a PCB.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a glue filling processing device for a PCB comprises a bearing box and an observation window arranged in an opening of the front end face of the bearing box, wherein a shunting cavity is formed in the inner wall of the bearing box, air inlet pipes communicated with the shunting cavity are transversely arranged at the bottoms of two sides of the bearing box, air outlet pipes communicated with the upper part of the shunting cavity are arranged at the upper parts of the periphery of the inner wall of the bearing box, a plurality of air guide pipes communicated with the lower part of the shunting cavity are arranged on the inner bottom surface of the bearing box in an equidistance communication mode, and air supply assemblies used for solidifying glue solution at the bottom of the PCB are arranged at the top ends of the air guide pipes;

the inner bottom four corners of the bearing box are vertically provided with support columns, and the top ends of the support columns are horizontally provided with bearing plates for supporting the PCB.

Preferably, the air outlet pipe is of a flat rectangular pipe body structure, the middle of the pipe body of the air outlet pipe, which is located in the bearing box, is a hose type pipe body section, and the outer end of the air outlet pipe is inclined downwards.

Preferably, the air supply subassembly runs through the montant of locating fixed otter board middle part including the intercommunication locate the M type pipe on air duct top with locating the interior fixed otter board of M type pipe both ends export and vertical activity, equal horizontal activity is equipped with the closing plate in the export at M type pipe both ends, the bottom of montant and the top surface rigid coupling of closing plate, the horizontal rigid coupling of top surface of montant has the holding down plate.

Preferably, the sealing plate is a hollow carbon fiber plate body.

Preferably, the air bag sleeve is movably sleeved on the vertical rod between the fixed screen plate and the lower pressing plate, and the top of the air bag sleeve is movably abutted with the bottom of the lower pressing plate.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses in, through the cooperation of reposition of redundant personnel chamber and play tuber pipe and air supply subassembly, be convenient for carry out quick colloid solidification cooling operation to the PCB board after the encapsulating, can carry out the independent control to the inclination that goes out the tuber pipe according to local encapsulating position on the PCB board simultaneously, can avoid the wind body of bottom directly to blow simultaneously and penetrate on the bottom surface of PCB board, the wind body that is convenient for make the lower part get into can be to the even diffusion in four corners, has effectively improved the fast curing effect to PCB board encapsulating position.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation to the invention. In the drawings:

fig. 1 is a schematic view of a front view structure provided by the present invention;

fig. 2 is a sectional view of a front view structure proposed by the present invention;

FIG. 3 is a cross-sectional view of the M-shaped tube structure provided by the present invention;

fig. 4 is a schematic view of the connection of the sealing plate, the airbag cover and the lower pressing plate provided by the present invention.

Sequence numbers in the figure: 1. a support box; 2. an observation window; 3. a shunting cavity; 4. an air outlet pipe; 5. a support pillar; 6. a support plate; 7. an air duct; 8. an M-shaped pipe; 9. fixing the screen plate; 10. a vertical rod; 11. a sealing plate; 12. an air bag cover; 13. and (5) pressing the plate downwards.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Example (b): referring to fig. 1-4, a glue-pouring processing device for PCB board in the present invention comprises a support box 1 and an observation window 2 installed in an opening of a front end face of the support box 1, a shunting cavity 3 is opened in an inner wall of the support box 1, air inlet pipes communicated with the shunting cavity 3 are transversely arranged at bottoms of two sides of the support box 1, air outlet pipes 4 communicated with an upper portion of the shunting cavity 3 are arranged at upper portions of peripheries of an inner wall of the support box 1, the air outlet pipes 4 are of a flat rectangular pipe structure, a middle portion of each air outlet pipe 4 located in the support box 1 is a hose type pipe section, an outer end of each air outlet pipe 4 is arranged in a downward inclined manner, so as to facilitate adjustment of an air blowing angle of an inner end of each air outlet pipe 4, and improve curing efficiency of a local glue-pouring position of a PCB board; a plurality of air guide pipes 7 communicated with the lower part of the shunting cavity 3 are arranged on the inner bottom surface of the bearing box 1 in an equidistance communication manner, and air supply assemblies used for curing glue solution at the bottom of the PCB are arranged at the top ends of the air guide pipes 7; four corners of the inner bottom surface of the bearing box 1 are vertically provided with supporting columns 5, the top ends of the supporting columns 5 are horizontally provided with bearing plates 6 for supporting the PCB, and the PCB can be supported after glue pouring; through the cooperation of reposition of redundant personnel chamber 3 and air-out pipe 4 and air supply subassembly, be convenient for carry out quick colloid solidification cooling operation to the PCB board after the encapsulating, can carry out the independent control to the inclination that goes out air-out pipe 4 according to local encapsulating position on the PCB board simultaneously, the wind body that can avoid the bottom simultaneously directly blows and penetrates on the bottom surface of PCB board, be convenient for make the wind body that the lower part got into enough to the even diffusion in four corners, effectively improved the fast curing effect to PCB board encapsulating position.

In the utility model, the air supply component comprises an M-shaped pipe 8 which is communicated with the top end of the air duct 7, a fixed screen plate 9 which is arranged in the outlets at the two ends of the M-shaped pipe 8 and a vertical rod 10 which is vertically movably arranged in the middle of the fixed screen plate 9 in a penetrating way, a sealing plate 11 is horizontally movably arranged in the outlets at the two ends of the M-shaped pipe 8, and the sealing plate 11 is a hollow carbon fiber plate body; the bottom of montant 10 and the top surface rigid coupling of closing plate 11, the horizontal rigid coupling of top surface of montant 10 has holding down plate 13, the gasbag cover 12 has been cup jointed in the activity on montant 10 between fixed otter board 9 and the holding down plate 13, the top of gasbag cover 12 and the end activity butt of holding down plate 13, when cold wind passes through from M type intraductal, can promote closing plate 11 to descend, after closing plate 11 descends out M type 8 outsidely, the wind can blow off from M type 8 insides of pipe, drive montant 10 decline when closing plate 11 descends after that, it compresses gasbag cover 12 to drive holding down plate 13 through the montant 10 that descends, when M type 8 insides do not admit air, through the recovery of gasbag cover 12, be convenient for make montant 10 drive closing plate 11 rise again, and then play the effect of automatic shutoff to the export of M type pipe 8.

The working principle is as follows: the utility model discloses during the use, at first with air-supply line and outside air supply equipment intercommunication setting, then the PCB board after the encapsulating is placed at the top of bearing board 6, then control outside air supply equipment through the air-supply line to the inside confession cold wind that shunts chamber 3, then the cold wind in the chamber of shunting 3 blows the PCB board top surface after placing through going out tuber pipe 4, then the inside cold wind of lower part shunting chamber 3 blows earlier on the interior bottom surface of bearing box 1 through the cooperation of air duct 7 and M type pipe 8, then cold wind spreads all around in bearing box 1 bottom surface, and then avoid directly blowing from the bottom surface of the PCB board of the exhaust tuber pipe in M type pipe 8.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a encapsulating processing apparatus for PCB board, includes bearing box (1) and installs observation window (2) in the terminal surface opening before bearing box (1), its characterized in that: a shunting cavity (3) is formed in the inner wall of the box body of the bearing box (1), air inlet pipes communicated with the shunting cavity (3) are transversely arranged at the bottoms of two sides of the bearing box (1), air outlet pipes (4) communicated with the upper part of the shunting cavity (3) are arranged at the upper parts of the periphery of the inner wall of the bearing box (1), a plurality of air guide pipes (7) communicated with the lower part of the shunting cavity (3) are equidistantly communicated on the inner bottom surface of the bearing box (1), and air supply assemblies used for curing glue solution at the bottom of a PCB are arranged at the top ends of the air guide pipes (7);

the PCB supporting device is characterized in that supporting columns (5) are vertically arranged at four corners of the inner bottom surface of the supporting box (1), and supporting plates (6) used for supporting a PCB are horizontally arranged at the top ends of the supporting columns (5).

2. The glue-pouring processing device for the PCB board as claimed in claim 1, wherein: go out tuber pipe (4) and be the rectangular pipe body structure of platykurtic, just the body middle part that is located bearing box (1) of going out tuber pipe (4) is hose formula pipe body section, the outer end downward sloping setting of going out tuber pipe (4).

3. The glue-pouring processing device for the PCB board as claimed in claim 1, wherein: air supply assembly runs through montant (10) of locating fixed otter board (9) middle part including M type pipe (8) that the intercommunication was located air duct (7) top and locating M type pipe (8) both ends export with vertical activity, equal horizontal activity is equipped with closing plate (11) in the export at M type pipe (8) both ends, the bottom of montant (10) and the top surface rigid coupling of closing plate (11), the horizontal rigid coupling of top surface of montant (10) has holding down plate (13).

4. The glue-pouring processing device for the PCB board according to claim 3, characterized in that: the sealing plate (11) is a hollow carbon fiber plate body.

5. The glue-pouring processing device for the PCB board as claimed in claim 3, wherein: the air bag sleeve (12) is movably sleeved on the vertical rod (10) between the fixed screen plate (9) and the lower pressing plate (13), and the top of the air bag sleeve (12) is movably abutted to the bottom of the lower pressing plate (13).