CN217768410U - Built-in IC magic color LED - Google Patents

Abstract

The utility model discloses a built-in IC colorful light-emitting diode, belonging to the technical field of light-emitting diodes; the LED lamp comprises a support carrier, wherein a lamp shade is arranged above the support carrier, a copper foil substrate is arranged below the lamp shade, an IC chip is arranged on the upper surface of the copper foil substrate, and a light-emitting diode chip is arranged on one side of the IC chip; the utility model discloses a set up and just tear the subassembly open, realized the quick dismantlement to the lamp shade, inconvenient dismantlement between LED lamp shade and the support has been avoided, in case the impaired inconvenient condition that overhauls fast of inside chip takes place, the staff of being convenient for overhauls the inside chip circuit of emitting diode, through setting up radiator unit, the quick heat dissipation to emitting diode has been realized, the heat of having avoided producing in the emitting diode working process is difficult to the effluvium, the condition that influences the emitting diode sustainability takes place, accelerate emitting diode's heat dissipation, guarantee emitting diode's sustainability.

Description

Built-in IC magic color LED

Technical Field

The utility model belongs to the technical field of emitting diode, concretely relates to built-in IC illusion-colour emitting diode.

Background

A light emitting diode, referred to as LED for short, is a commonly used light emitting device, emits light by energy released by recombination of electrons and holes, and is widely used in the field of illumination. The light emitting diode can efficiently convert electric energy into light energy, and has wide application in modern society, such as illumination, flat panel display, medical devices and the like.

The prior art has the following problems: in the chip type light emitting diode with the built-in IC disclosed by the prior art, the light emitting diode lampshade and the support are inconvenient to detach when in use, once the internal chip is damaged and inconvenient to overhaul, a large amount of heat generated in the working process of the light emitting diode is difficult to dissipate, the service lives of the chip and a conductive path in the diode can be shortened for a long time, and the sustainability of the light emitting diode is influenced.

SUMMERY OF THE UTILITY MODEL

To solve the problems set forth in the background art described above. The utility model provides a built-in IC illusion-colour emitting diode has the characteristics of easy access, assurance emitting diode sustainability.

In order to achieve the above object, the utility model provides a following technical scheme: a lampshade is arranged above the support carrier, a copper foil substrate is arranged below the lampshade, an IC chip is arranged on the upper surface of the copper foil substrate, a light-emitting diode chip is arranged on one side of the IC chip, easy-to-detach components are arranged on the support carrier and the two sides of the lampshade, and a heat dissipation component is arranged at the bottom of the support carrier.

Preferably, the assembly convenient to disassemble comprises a limiting spring, a top block, a pressing plate and a rotating shaft, wherein the limiting spring is arranged on two sides of the support carrier, the top block is arranged at the upper end of the limiting spring, the pressing plate is arranged at the upper end of the top block, and the rotating shaft is arranged between the pressing plate and the support carrier.

Preferably, the bottom of one end of the pressing plate close to the lampshade is provided with a limiting block, and a limiting groove is formed between the lampshade and the limiting block.

Preferably, the heat dissipation assembly comprises an absorber plate, a heat conduction column and a heat dissipation plate, wherein the absorber plate is arranged at the bottom of the copper foil substrate, the heat conduction column is arranged at the bottom of the absorber plate, and the heat dissipation plate is arranged at the lower end of the heat conduction column.

Preferably, the bottom of the heat dissipation plate is uniformly provided with a plurality of heat dissipation grooves.

Preferably, the bottom of the lampshade is provided with a sealing groove, and one side of the copper foil substrate, which is close to the sealing groove, is provided with a sealing ring.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model realizes the quick disassembly of the lampshade by arranging the easy-to-disassemble component, avoids the inconvenient disassembly between the LED lampshade and the bracket, and is convenient for the staff to overhaul the circuit of the LED inner chip once the inner chip is damaged and inconvenient to overhaul;

2. the utility model discloses a set up radiator unit, realized being difficult to the effluvium to emitting diode's quick heat dissipation, the heat of having avoided producing in the emitting diode working process influences the condition emergence of emitting diode sustainability for emitting diode's heat dissipation, extension emitting diode's life guarantees emitting diode's sustainability.

Drawings

Fig. 1 is a schematic view of the appearance structure of the present invention;

fig. 2 is a schematic side view of the cross-sectional structure of the present invention;

FIG. 3 is a schematic view of the easy-to-disassemble assembly of the present invention;

fig. 4 is a schematic structural view of the heat dissipation assembly of the present invention.

In the figure: 1. a scaffold carrier; 2. a lamp shade; 3. a copper foil substrate; 4. an IC chip; 5. a light emitting diode chip; 6. the assembly is convenient to disassemble; 61. a limiting spring; 62. a top block; 63. pressing a plate; 64. a rotating shaft; 65. a limiting block; 66. a limiting groove; 7. a heat dissipating component; 71. a heat absorbing plate; 72. a heat-conducting column; 73. a heat dissipation plate; 74. and a heat dissipation groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Example 1

Referring to fig. 1-4, the present invention provides the following technical solutions: a built-in IC magic color light emitting diode comprises a support carrier 1, a lampshade 2 is arranged above the support carrier 1, a copper foil substrate 3 is arranged below the lampshade 2, an IC chip 4 is arranged on the upper surface of the copper foil substrate 3, a light emitting diode chip 5 is arranged on one side of the IC chip 4, a detachable component 6 is arranged on two sides of the support carrier 1 and the lampshade 2, and a heat dissipation component 7 is arranged at the bottom of the support carrier 1.

Specifically, the easy-to-detach assembly 6 comprises a limiting spring 61, an ejector block 62, a pressing plate 63 and a rotating shaft 64, wherein the limiting spring 61 is arranged on two sides of the support carrier 1, the ejector block 62 is arranged at the upper end of the limiting spring 61, the pressing plate 63 is arranged at the upper end of the ejector block 62, and the rotating shaft 64 is arranged between the pressing plate 63 and the support carrier 1.

Through adopting the above technical scheme, be close to the one end of kicking block 62 through pressing down clamp plate 63, clamp plate 63 one end is pressed down the downstream, clamp plate 63 downstream drives kicking block 62 downstream compression limiting spring 61, drive pivot 64 when clamp plate 63 one end downstream rotates, pivot 64 rotates the one end perk that drives clamp plate 63 and is close to lamp shade 2, make clamp plate 63 break away from lamp shade 2, and then can take out lamp shade 2 from support carrier 1, so that examine and repair the chip on the copper foil substrate 3.

Specifically, the bottom of the end of the pressing plate 63 close to the lampshade 2 is provided with a limiting block 65, and a limiting groove 66 is arranged between the lampshade 2 and the limiting block 65.

By adopting the technical scheme, the limiting block 65 close to the bottom of one end of the lampshade 2 and the limiting groove 66 between the lampshade 2 and the limiting block 65 are arranged through the pressing plate 63, so that the limiting effect of the pressing plate 63 on the lampshade 2 is improved.

This embodiment is used: in the LED work, when emitting diode broke down, through pressing the one end that clamp plate 63 is close to kicking block 62, clamp plate 63 moves down and drives kicking block 62 and move down and compress spacing spring 61, drive pivot 64 when clamp plate 63 one end moves down and rotate, pivot 64 rotates the one end perk that drives clamp plate 63 and is close to lamp shade 2, clamp plate 63 rotates and drives stopper 65 and break away from spacing groove 66, and then can take out lamp shade 2 from support carrier 1, so that overhaul the chip on the copper foil base plate 3.

Example 2

The present embodiment is different from embodiment 1 in that: specifically, the heat dissipation assembly 7 includes an absorber plate 71, a heat conduction column 72 and a heat dissipation plate 73, wherein the absorber plate 71 is disposed at the bottom of the copper foil substrate 3, the heat conduction column 72 is disposed at the bottom of the absorber plate 71, and the heat dissipation plate 73 is disposed at the lower end of the heat conduction column 72.

Through adopting above-mentioned technical scheme, the absorber plate 71 through copper foil base plate 3 bottom utilizes its heat conductivity of heat conduction silica gel, absorb the heat that chip and circuit work produced on the copper foil base plate 3 fast, and with the heat through heat conduction post 72 with heat transfer for the heat dissipation board 73 heat dissipation, heat dissipation board 73 utilizes heat conduction silica gel's heat conductivity to give the air with the heat transfer of absorption, make the heat that chip and circuit work produced can dispel fast, the life of extension chip and conductive path, guarantee emitting diode's sustainability.

Specifically, a plurality of heat dissipation grooves 74 are uniformly formed in the bottom of the heat dissipation plate 73.

By adopting the technical scheme, the contact area of the heat dissipation plate 73 and air is increased through the plurality of heat dissipation grooves 74 at the bottom of the heat dissipation plate 73, and the heat dissipation speed is accelerated.

Specifically, a sealing groove is formed in the bottom of the lampshade 2, and a sealing ring is arranged on one side, close to the sealing groove, of the copper foil substrate 3.

Through adopting above-mentioned technical scheme, the sealing washer that is close to sealing groove one side through the seal groove of 2 bottoms of lamp shades and copper foil base plate 3 prevents that external dust and water from getting into in the lamp shade 2.

This embodiment is used: when chip and circuit work produced heat on copper foil base plate 3, the absorber plate 71 through copper foil base plate 3 bottom utilizes the heat conductivity of its heat conduction silica gel, absorb the heat that chip and circuit work produced on copper foil base plate 3 fast, and with the heat through heat conduction post 72 with heat transfer for heat dissipation plate 73 heat dissipation, heat dissipation plate 73 utilizes the heat conductivity of heat conduction silica gel to give the air with the heat transfer of absorption, make the heat that chip and circuit work produced can dispel fast, prolong the life of chip and electrically conductive route, guarantee emitting diode's sustainability.

The structure and the use principle of the IC chip 4 and the led chip 5 in the present invention are disclosed in the chip-type led with an IC built therein disclosed in the chinese patent application No. 201821151748.1.

The utility model discloses a theory of operation and use flow: the utility model discloses built-in IC emitting diode during operation, through built-in IC chip 4, make emitting diode work in have the effect of IC constant current, can realize RGB illusion-colour effect through the external pulse signal control of external pulse controller, when chip and circuit work produced heat on copper foil substrate 3, absorber plate 71 through copper foil substrate 3 bottom utilizes the heat conductivity of its heat conduction silica gel, absorb the heat that chip and circuit work produced on the copper foil substrate 3 fast, and pass through heat conduction post 72 with the heat transfer for heat dissipation plate 73 heat dissipation, heat dissipation plate 73 utilizes the heat conductivity of heat conduction silica gel to transmit the heat that absorbs for the air, make the heat that chip and circuit work produced can diffuse out fast, prolong the life of chip and conducting path, guarantee emitting diode's sustainability, in emitting diode work, when emitting diode breaks down, through pressing the clamp plate 63 one end that is close to kicking block 62, clamp plate 63 moves down and drives kicking block 62 and compresses spacing spring 61 downwards, drive pivot 64 when the one end downward that clamp plate 63 moved, pivot 64 rotates, the one end that pivot 64 rotated and takes place dynamic pressure plate 63 and is close to lamp shade 2, clamp plate 63 rotates 65, and then can break away from spacing support 66, the support in order to take out the copper foil substrate from 2, it is convenient for the maintenance piece to take out to carry out to lamp shade 2 in order to the copper foil 3.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. An IC-embedded multicolor light emitting diode comprises a bracket carrier (1), and is characterized in that: the support is characterized in that a lampshade (2) is arranged above the support carrier (1), a copper foil substrate (3) is arranged below the lampshade (2), an IC chip (4) is arranged on the upper surface of the copper foil substrate (3), a light-emitting diode chip (5) is arranged on one side of the IC chip (4), assemblies (6) which are convenient to disassemble are arranged on the two sides of the support carrier (1) and the lampshade (2), and a heat dissipation assembly (7) is arranged at the bottom of the support carrier (1).

2. The LED of claim 1, wherein: just, tear subassembly (6) open and include spacing spring (61), kicking block (62), clamp plate (63) and pivot (64), wherein, the both sides of support carrier (1) are provided with spacing spring (61), the upper end of spacing spring (61) is provided with kicking block (62), the upper end of kicking block (62) is provided with clamp plate (63), be provided with pivot (64) between clamp plate (63) and support carrier (1).

3. The IC-embedded multicolor light emitting diode of claim 2, wherein: the lamp shade is characterized in that a limiting block (65) is arranged at the bottom of one end, close to the lamp shade (2), of the pressing plate (63), and a limiting groove (66) is formed between the lamp shade (2) and the limiting block (65).

4. The IC-embedded multicolor light emitting diode of claim 1, wherein: the heat dissipation assembly (7) comprises a heat absorption plate (71), heat conduction columns (72) and a heat dissipation plate (73), wherein the heat absorption plate (71) is arranged at the bottom of the copper foil substrate (3), the heat conduction columns (72) are arranged at the bottom of the heat absorption plate (71), and the heat dissipation plate (73) is arranged at the lower ends of the heat conduction columns (72).

5. The LED of claim 4, wherein: the bottom of the heat dissipation plate (73) is uniformly provided with a plurality of heat dissipation grooves (74).

6. The IC-embedded multicolor light emitting diode of claim 1, wherein: the bottom of the lampshade (2) is provided with a sealing groove, and one side of the copper foil substrate (3) close to the sealing groove is provided with a sealing ring.

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