CN217752535U - Injection mold cavity capable of accelerating cooling - Google Patents
Injection mold cavity capable of accelerating cooling Download PDFInfo
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- CN217752535U CN217752535U CN202221724212.0U CN202221724212U CN217752535U CN 217752535 U CN217752535 U CN 217752535U CN 202221724212 U CN202221724212 U CN 202221724212U CN 217752535 U CN217752535 U CN 217752535U
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Abstract
The application discloses can accelerate refrigerated die cavity of moulding plastics, relate to injection mold technical field, including the outer die body of moulding plastics, the both sides of the outer die body roof of moulding plastics are all fixed to be inlayed and are had the injection mould cavity, the intermediate position department of the outer die body roof of moulding plastics is fixed with the install bin, the inner chamber diapire rigidity of install bin has multiunit driving motor, the diapire that the install bin was run through to multiunit driving motor bottom output and be fixed with the auger, the diapire rigidity of the outer die body of moulding plastics has the water tank, the water tank inner chamber is fixed with the water and shifts the subassembly, the diapire of water tank is fixed to be inlayed and is had the heat conduction diaphragm. This application starts water transfer subassembly and makes the cooling water of water tank and the external mold cavity of moulding plastics can the circulation flow, and the cold volume that starts the production of semiconductor refrigeration piece transmits the cooling water through the heat conduction diaphragm to thereby start driving motor drives the auger and rotates and mix the cooling water, and then conveniently cools down the cooling water, makes moisture evenly distributed, thereby guarantees the cooling effect.
Description
Technical Field
The application relates to the technical field of injection molds, in particular to an injection mold cavity capable of accelerating cooling.
Background
The mold is a common device for processing industrial products, wherein the injection mold is mainly used for processing and manufacturing injection products, and when the injection mold is used, raw materials in a molten state are injected into an injection mold cavity of the injection mold, and the injection product can be obtained by demolding after cooling.
At present, an injection mold cavity is filled with cooling water inside the mold in order to improve the cooling efficiency, but the cooling effect is reduced due to the temperature rise after the injection mold cavity is used for a long time because the volume of the cooling water is effective.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem that the cooling effect is reduced after the cooling water is used for a long time, the application provides an injection mold cavity capable of accelerating cooling.
The application provides a can be with higher speed refrigerated mould cavity of moulding plastics adopts following technical scheme:
the utility model provides a can accelerate refrigerated die cavity of moulding plastics, is including the outer die body of moulding plastics, the both sides of the outer die body roof of moulding plastics are all fixed to be inlayed and are had the injection mould cavity, the intermediate position department of the outer die body roof of moulding plastics is fixed with the install bin, the inner chamber diapire rigidity of install bin has multiunit driving motor, multiunit the diapire that the install bin was run through to driving motor bottom output and is fixed with the auger, the diapire rigidity of the outer die body of moulding plastics has the water tank, the water tank inner chamber is fixed with the water and shifts the subassembly, the diapire of water tank is fixed to be inlayed and is had the heat conduction diaphragm, the diapire rigidity of water tank has the semiconductor refrigeration piece.
Through adopting above-mentioned technical scheme, start water transfer assembly and make the water tank and the cooling water of moulding plastics external mold cavity can the circulation flow, start the cold volume that the semiconductor refrigeration piece produced and transmit the cooling water through the heat conduction diaphragm to thereby start driving motor and drive the auger and rotate and stir the cooling water, and then conveniently cool down the cooling water, make moisture evenly distributed, thereby guarantee the cooling effect.
Optionally, the water transfer subassembly includes immersible pump and wet return, the immersible pump is fixed in one side of water tank inner chamber bottom, the immersible pump output is fixed with the water injection pipe that extends to the outer internal cavity of mould plastics bottom, the wet return is fixed to be inlayed and is kept away from the upper end position of immersible pump one side lateral wall at the water tank, the wet return upper end extends to the upper end position of the outer internal cavity of mould plastics.
By adopting the technical scheme, the submersible pump is started, and the water tank and the cooling water in the inner cavity of the injection molding outer die body are circulated and flowed by utilizing the water injection pipe and the water return pipe, so that the moisture is uniformly distributed, and the cooling effect is ensured.
Optionally, fans are fixed on two sides of the bottom wall of the water tank.
Through adopting above-mentioned technical scheme, start two sets of fans and produce the air current, and then take away the heat that the semiconductor refrigeration piece heated the face department with higher speed, guarantee the normal work of semiconductor refrigeration piece.
Optionally, support vertical plates are fixed at two sides of the bottom wall of the injection molding outer mold body.
Through adopting above-mentioned technical scheme, utilize two sets of support risers can the stable support outer die body of moulding plastics, and then can stabilize the position that the outer die body of moulding plastics was placed.
Optionally, a plurality of sets of heat conducting fins are uniformly fixed on the outer walls of the two sets of injection mold cavities.
By adopting the technical scheme, the surface area of the injection mold cavity is conveniently increased under the action of the multiple groups of heat conduction fins, so that the contact area of the injection mold cavity and cooling water is increased, and the cooling efficiency is improved.
Optionally, a water injection hole is formed in the top of the side wall of one side of the injection molding outer mold body, and a pluggable water injection soft plug is arranged in the water injection hole formed in the injection molding outer mold body.
By adopting the technical scheme, cooling water is conveniently supplemented by using the design of the pluggable water injection soft plug and the water injection hole.
Optionally, handles are fixed at the middle positions of the two side walls of the injection molding outer mold body.
Through adopting above-mentioned technical scheme, utilize the handle can conveniently remove the position of moulding plastics the outer die body.
In summary, the present application includes at least one of the following benefits:
1. the submersible pump is started, the water tank and cooling water in the inner cavity of the injection molding outer die body circularly flow by utilizing the water injection pipe and the water return pipe, cold energy generated by the semiconductor refrigerating sheet is started to be transmitted into the cooling water through the heat conduction transverse plate, and the driving motor is started to drive the auger to rotate so as to stir the cooling water, so that the cooling water is conveniently cooled, the water is uniformly distributed, and the cooling effect is ensured;
2. the two groups of fans are started to generate air flow, so that the air flow rate of the bottom heating surface of the semiconductor refrigerating sheet is accelerated, the heat of the heating surface of the semiconductor refrigerating sheet is further accelerated to be taken away, and the normal work of the semiconductor refrigerating sheet is guaranteed.
Drawings
FIG. 1 is a front view of the internal structure of the present application;
FIG. 2 is a schematic view of the three-dimensional structure of the injection mold cavity, the supporting vertical plate, the mounting box and the injection mold outer body.
In the figure: 1. a water return pipe; 2. a heat-conducting fin; 3. an injection mold cavity; 4. a support vertical plate; 5. a fan; 6. a heat conducting transverse plate; 7. a semiconductor refrigeration sheet; 8. a packing auger; 9. a water tank; 10. a water injection pipe; 11. a submersible pump; 12. water injection soft plugs; 13. a drive motor; 14. installing a box; 15. and (5) injection molding of the outer mold body.
Detailed Description
The present application is described in further detail below with reference to figures 1-2.
Referring to fig. 1 and 2 of the drawings, the present application provides an embodiment: the utility model provides a can accelerate refrigerated mould cavity of moulding plastics, including the outer die body 15 of moulding plastics, the both sides position of the 15 diapire of the outer die body 15 of moulding plastics all is fixed with supporting riser 4, the top position of the 15 lateral wall of the outer die body of moulding plastics has seted up the water injection hole, the water injection hole that the outer die body 15 of moulding plastics was seted up is provided with pluggable water injection cork 12, water injection cork 12 is the rubber cork, the both sides of the 15 roof of the outer die body of moulding plastics are all fixed and are inlayed injection mould cavity 3, the outer wall of two sets of injection mould cavity 3 is evenly fixed with multiunit heat conduction fin 2, the top position of injection mould cavity 3 sets up to the opening form, 3 top positions of injection mould cavity and the top position of the outer die body 15 of moulding plastics are in same horizontal plane, the intermediate position department of the 15 roof of the outer die body of moulding plastics is fixed with install bin 14, the inner chamber diapire position of install bin 14 is fixed with multiunit driving motor 13, multiunit driving motor 13 bottom output runs through the diapire of install bin 14 and is fixed with auger 8, the bottom position of auger 8 is connected with the rotation of the 15 inner chamber of moulding plastics through the bearing.
Please refer to fig. 1 in the drawings of the specification, a water tank 9 is fixed at the bottom wall of an injection molding outer mold body 15, the water tank 9 is arranged at the middle position of the injection molding outer mold body 15, a water transfer component is fixed at the inner cavity of the water tank 9, the water transfer component comprises a submersible pump 11 and a water return pipe 1, the submersible pump 11 is fixed at one side of the bottom of the inner cavity of the water tank 9, an output end of the submersible pump 11 is fixed with a water injection pipe 10 extending to the bottom of the inner cavity of the injection molding outer mold body 15, the water return pipe 1 is fixedly embedded at the upper end position of the side wall of the water tank 9 far away from the submersible pump 11, the upper end of the water return pipe 1 extends to the upper end position of the inner cavity of the injection molding outer mold body 15, a heat conduction transverse plate 6 is fixedly embedded at the bottom wall of the water tank 9, the upper end of the heat conduction transverse plate 6 extends into the inner cavity of the water tank 9, a semiconductor refrigeration plate 7 is fixed at the bottom wall of the water tank 9, the upper surface of the semiconductor refrigeration plate 7 is arranged as a refrigeration surface, the semiconductor refrigeration plate 7 is arranged as a heating surface, both arranged at the middle position of the water conduction transverse plate 6 and the semiconductor refrigeration plate 7 is arranged at the middle position of the water tank 9, and the cross section size of the semiconductor refrigeration plate 7 is larger than that of the transverse plate 6.
The injection molding outer die body 15 is placed at a proper position through the two groups of supporting vertical plates 4, then the water injection soft plug 12 is pulled out, a proper amount of cooling water is injected into the inner cavity of the injection molding outer die body 15, then the water injection soft plug 12 is plugged again, a proper amount of high-temperature melting injection molding raw material is injected into the inner cavity of the injection molding die cavity 3, heat in the injection molding raw material is conveniently conducted into cooling water in the inner cavity of the injection molding outer die body 15 under the action of heat conducting materials of the injection molding die cavity 3 and the heat conducting fins 2, and the high-temperature melting injection molding raw material is rapidly cooled by utilizing the cold energy of the cooling water.
Start 11 automatic cooling water of absorbing the water tank 9 inner chambers of immersible pump and pour into the inner chamber of the outer die body 15 of moulding plastics through water injection pipe 10 in, the cooling water on 15 inner chamber upper portions of the outer die body of moulding plastics is automatic to enter into the water tank 9 through 1 circulation of wet return, start semiconductor refrigeration piece 7 this moment, the cold volume that utilizes its refrigeration face to produce is in the cooling water of the inner chamber of water tank 9 through 6 transmission of heat conduction diaphragm, thereby it stirs to the cooling water to start driving motor 13 and drive 8 rotations of auger, and then conveniently cool down the cooling water, make moisture evenly distributed, thereby guarantee the cooling effect.
Referring to fig. 1 in the drawings of the specification, fans 5 are fixed on two sides of the bottom wall of a water tank 9, the bottom position of each fan 5 is above the bottom position of a supporting vertical plate 4, and a gap exists between each fan 5 and the corresponding supporting vertical plate 4. When starting semiconductor refrigeration piece 7 and refrigerating, start two sets of fans 5 and produce the air current to accelerate the air velocity of 7 bottom surfaces of semiconductor refrigeration piece and heating face departments, and then accelerate and take away the heat of 7 heating face departments of semiconductor refrigeration piece, guarantee the normal work of semiconductor refrigeration piece 7.
Referring to fig. 1 in the drawings of the specification, handles are fixed at the middle positions of two side walls of the injection mold outer mold body 15, and nylon ropes are uniformly wound on the outer walls of the handles to play a role in skid resistance and heat insulation. The worker can drive the injection mold cavity capable of accelerating cooling to move by respectively holding the two groups of handles with two hands.
The working principle is as follows: when the injection mold cavity capable of accelerating cooling is used, the injection mold cavity capable of accelerating cooling is placed at a proper position through the two groups of supporting vertical plates 4, then the water injection soft plug 12 is pulled out, a proper amount of cooling water is injected into the inner cavity of the injection outer mold body 15, then the water injection soft plug 12 is plugged again, a proper amount of high-temperature melting injection molding raw material is injected into the inner cavity of the injection mold cavity 3, heat in the injection molding raw material is conveniently conducted into cooling water in the inner cavity of the injection outer mold body 15 under the action of heat conducting materials of the injection mold cavity 3 and the heat conducting fins 2, and the cooling capacity of the cooling water is utilized to rapidly cool the high-temperature melting injection molding raw material.
When using, start 11 automatic cooling water of intaking water tank 9 inner chambers of immersible pump and pour into the inner chamber of the outer die body 15 of moulding plastics through water injection pipe 10 in, the cooling water on the outer die body 15 inner chamber upper portion of moulding plastics is automatic to enter into water tank 9 through return water pipe 1 circulation, start semiconductor refrigeration piece 7 this moment, the cold volume that utilizes its refrigeration face to produce transmits the cooling water of water tank 9 inner chamber through heat conduction diaphragm 6, thereby start driving motor 13 and drive 8 rotations of auger and mix the cooling water, and then conveniently cool down the cooling water, make moisture evenly distributed, thereby guarantee the cooling effect.
When starting semiconductor refrigeration piece 7 and refrigerating, start two sets of fans 5 and produce the air current to accelerate the air flow rate of 7 bottom surfaces heating face departments of semiconductor refrigeration piece, and then take away the heat of 7 heating face departments of semiconductor refrigeration piece with higher speed, guarantee the normal work of semiconductor refrigeration piece 7, when needs remove this injection mold die cavity that can accelerate the cooling, the staff only need utilize two sets of handles to hold respectively and can drive this injection mold die cavity that can accelerate the cooling and remove.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (7)
1. An injection mold cavity capable of accelerated cooling, comprising an injection mold outer body (15), characterized in that: the both sides of outer mould body (15) roof of moulding plastics all are fixed with to inlay and are had injection mould cavity (3), the intermediate position department of outer mould body (15) roof of moulding plastics is fixed with install bin (14), the inner chamber diapire rigidity of install bin (14) has multiunit driving motor (13), multiunit driving motor (13) bottom output runs through the diapire of install bin (14) and is fixed with auger (8), the diapire rigidity of outer mould body (15) of moulding plastics has water tank (9), water tank (9) inner chamber is fixed with water transfer assembly, the diapire of water tank (9) is fixed to be inlayed and is had heat conduction diaphragm (6), the diapire rigidity of water tank (9) has semiconductor refrigeration piece (7).
2. An accelerated cooling injection mold cavity as recited in claim 1, wherein: the water shifts the subassembly and includes immersible pump (11) and wet return (1), one side in water tank (9) inner chamber bottom is fixed in immersible pump (11), immersible pump (11) output is fixed with water injection pipe (10) that extend to mould plastics outer die body (15) inner chamber bottom, wet return (1) is fixed to be inlayed and is kept away from the upper end position of immersible pump (11) one side lateral wall in water tank (9), wet return (1) upper end extends to the upper end position of moulding plastics outer die body (15) inner chamber.
3. An accelerated cooling injection mold cavity as defined in claim 1, wherein: and fans (5) are fixed on two sides of the bottom wall of the water tank (9).
4. An accelerated cooling injection mold cavity as recited in claim 1, wherein: and supporting vertical plates (4) are fixed at two sides of the bottom wall of the injection molding outer mold body (15).
5. An accelerated cooling injection mold cavity as recited in claim 1, wherein: and a plurality of groups of heat conduction fins (2) are uniformly fixed on the outer walls of the two groups of injection mold cavities (3).
6. An accelerated cooling injection mold cavity as recited in claim 1, wherein: the top position of the side wall of one side of the injection molding outer die body (15) is provided with a water injection hole, and the water injection hole arranged on the injection molding outer die body (15) is internally provided with a pluggable water injection soft plug (12).
7. An accelerated cooling injection mold cavity as recited in claim 1, wherein: handles are fixed at the middle positions of two side walls of the injection molding outer mold body (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221724212.0U CN217752535U (en) | 2022-07-06 | 2022-07-06 | Injection mold cavity capable of accelerating cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221724212.0U CN217752535U (en) | 2022-07-06 | 2022-07-06 | Injection mold cavity capable of accelerating cooling |
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| Publication Number | Publication Date |
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| CN217752535U true CN217752535U (en) | 2022-11-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202221724212.0U Active CN217752535U (en) | 2022-07-06 | 2022-07-06 | Injection mold cavity capable of accelerating cooling |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116564618A (en) * | 2023-07-10 | 2023-08-08 | 海门南洋电工器材有限公司 | Combined cooling device for wire and cable processing |
-
2022
- 2022-07-06 CN CN202221724212.0U patent/CN217752535U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116564618A (en) * | 2023-07-10 | 2023-08-08 | 海门南洋电工器材有限公司 | Combined cooling device for wire and cable processing |
| CN116564618B (en) * | 2023-07-10 | 2023-09-15 | 海门南洋电工器材有限公司 | Combined cooling device for wire and cable processing |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An injection mold cavity that can accelerate cooling Effective date of registration: 20230330 Granted publication date: 20221108 Pledgee: Mudu sub branch of Bank of Suzhou Co.,Ltd. Pledgor: SUZHOU CUIPING PLASTIC Co.,Ltd. Registration number: Y2023980037080 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |