CN212312685U

CN212312685U - A rapid cooling injection molding device

Info

Publication number: CN212312685U
Application number: CN202020508126.0U
Authority: CN
Inventors: 肖青梅
Original assignee: Nanjing Baihong Technology Co ltd
Current assignee: Nanjing Baihong Technology Co ltd
Priority date: 2020-04-09
Filing date: 2020-04-09
Publication date: 2021-01-08
Anticipated expiration: 2030-04-09

Abstract

The utility model discloses a quick cooled injection moulding device, which comprises a frame, the vertical device of moulding plastics, cooling device and controller, the vertical device of moulding plastics sets up the top at the frame, cooling device sets up on the frame of vertical injection moulding device below, be provided with elevating gear in cooling device's below, elevating gear's the vertical top that upwards alternates supercooling device and extend to cooling device of execution axle, be provided with at elevating gear's execution axle end and hold the groove, hold the injection mold after the compound die, injection mold includes mould and bed die, be provided with the sleeve pipe above the hole of moulding plastics of last mould, the controller sets up in one of them one side of frame. The utility model discloses can effectual improvement to the cooling efficiency and the effect of the product of injection mold shaping intracavity, solve the problem that the cooling efficiency that injection mold exists is low among the prior art, product production cycle is long.

Description

Quick cooling type injection molding device

Technical Field

The utility model relates to a quick cooling type device of moulding plastics belongs to the injection mold field.

Background

In the production of automobile fans, injection molds are mostly adopted for production; the injection mold is various molds and tools for obtaining required products by injection blow molding, extrusion, die casting or forging forming, smelting, stamping and other methods in industrial production. The injection mold can generate a large amount of heat in the injection molding process of a molded product, and the general injection mold needs to carry out cooling treatment on the mold after injection molding so as to rapidly and uniformly cool and mold materials in a mold cavity. In the cooling mode commonly used at present, the point cooling mode is often adopted, namely the mould is cooled through a plurality of cooling points on the mould, the cooling efficiency of the cooling mode is low, and the production cycle of the product is long.

Disclosure of Invention

For solving the not enough of prior art, the utility model provides a quick cooling type injection moulding device, effectual improvement has improved production efficiency to the cooling efficiency and the effect of the product of injection mold shaping intracavity.

The utility model discloses the technical scheme who adopts does:

a quick cooling type injection molding device comprises a frame, a vertical injection molding device, a cooling device and a controller, wherein the vertical injection molding device is arranged above the frame, the cooling device is arranged on the frame below the vertical injection molding device, a lifting device is arranged below the cooling device, an execution shaft of the lifting device vertically and upwards penetrates through the supercooling device and extends to the upper side of the cooling device, a containing groove is formed in the tail end of the execution shaft of the lifting device, an injection mold after mold closing is contained in the containing groove, the injection mold comprises an upper mold and a lower mold, and a sleeve is arranged above an injection molding hole of the upper mold; cooling device includes that the top is the cooling box of open state and sets up the circulating pump on the frame of cooling box both sides, be provided with a plurality of semiconductor refrigeration piece on the top of cooling box and lateral wall, the entry of circulating pump and the lateral wall bottom intercommunication of cooling box, the export of circulating pump is provided with the shower of terminal level extension to liquid level top in the cooling box, terminal slope at the shower is provided with the shower nozzle towards cooling box central line downwards, the controller sets up one of them side at the frame, through the vertical device of moulding plastics of operation control on the controller, the circulating pump, semiconductor refrigeration piece and elevating gear action.

Preferably, a branch pipe extending horizontally to the position below the liquid level of the cooling box body is further arranged on the spray pipe of one of the circulating pumps.

Further preferably, a fan is arranged above the shower pipe in the cooling box body and obliquely downwards.

Preferably, a photoelectric generator is arranged on one side of the interior of the cooling box, a photoelectric receiver corresponding to the photoelectric generator is arranged on one side of the sleeve, and the photoelectric receiver is used for receiving a signal sent by the photoelectric generator, transmitting the signal to the controller and controlling the lifting device to act through the controller.

Further preferred is provided with a plurality of support column in the top and the cell body that hold the groove, and is provided with a plurality of through-hole on the cell body that holds the groove.

Further preferably, the semiconductor refrigeration piece comprises a refrigeration surface and a heat dissipation surface, the refrigeration surface is attached to the side wall and the bottom of the cooling box body, and the heat dissipation surface is provided with a plurality of heat dissipation fins.

Further preferably, a temperature sensor for monitoring the liquid temperature is further arranged in the cooling box body, the temperature sensor transmits the monitored liquid temperature to the controller for displaying, and the controller controls the starting and stopping of the semiconductor refrigerating sheet.

The beneficial effects of the utility model reside in that:

the cooling liquid is cooled by the semiconductor refrigeration sheet, the injection mold after mold filling is lowered into the cooling box body through the lifting device, the cooling liquid cools the lower portion of the injection mold, the spray head and the cooling liquid cool the upper portion of the injection mold, the flowing of the cooling liquid is accelerated by the branch pipes and the spray head, the containing grooves which are provided with a plurality of through holes are formed in the groove body, and a plurality of support columns are arranged in the top portion and the groove body, so that a water flowing space is formed between the injection mold and the containing grooves, and the cooling effect is improved; the fan carries out wind-force cooling to injection mold at the in-process that injection mold descends, and in the in-process of injection mold lifting, the coolant liquid that can accelerate on the injection mold falls to the cooling box in.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural diagram of a semiconductor chilling plate;

FIG. 3 is a schematic view of the structure of the holding tank;

the main reference numerals in the figures have the following meanings:

1. the device comprises a frame, 2, a vertical injection molding device, 3, a cooling device, 4, a lifting device, 5, a containing groove, 6, an injection mold, 7, a sleeve, 8, a controller, 9, a photoelectric generator, 10, a photoelectric receiver, 31, a cooling box body, 32, a circulating pump, 33, a semiconductor refrigerating sheet, 34, a spray pipe, 35, a spray head, 36, a branch pipe, 37, a fan, 38, a temperature sensor, 331, a refrigerating surface, 332, a radiating surface, 333, a radiating fin, 51, a supporting column, 52 and a through hole.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings and examples.

As shown in fig. 1-3: the embodiment is a rapid cooling type injection molding device, which comprises a frame 1, a vertical injection molding device 2, a cooling device 3 and a controller 8, wherein the vertical injection molding device 2 is arranged above the frame 1, the cooling device 3 is arranged on the frame 1 below the vertical injection molding device 2, a lifting device 4 is arranged below the cooling device 3, an execution shaft of the lifting device 4 vertically penetrates through the supercooling device 3 upwards and extends to the upper part of the cooling device 3, a containing groove 5 is arranged at the tail end of the execution shaft of the lifting device 4, an injection mold 6 after mold closing is contained in the containing groove 5, the injection mold 6 comprises an upper mold and a lower mold, and a sleeve 7 which corresponds to an injection port of the vertical injection molding device 2 and is used for the injection port to insert is arranged above an injection hole of the upper mold; the cooling device 3 comprises a cooling box body 31 with an open top and a circulating pump 32 arranged on frames 1 on two sides of the cooling box body 31, a plurality of semiconductor refrigerating pieces 33 are arranged on the top and the side wall of the cooling box body 31, the inlet of the circulating pump 32 is communicated with the bottom of the side wall of the cooling box body 31, a spray pipe 34 with the tail end horizontally extending to the upper part of the liquid level in the cooling box body 31 is arranged at the outlet of the circulating pump 32, a spray head 35 facing the central line of the cooling box body 31 is obliquely and downwards arranged at the tail end of the spray pipe 34, a controller 8 is arranged on one side of the frame 1, and the vertical injection molding device 2 is controlled through operation on the controller 8, the circulating pump 32, the semiconductor refrigerating pieces 33 and.

Referring to fig. 1, a branch pipe 36 extending horizontally to a position below the liquid level of the cooling tank 31 is provided on the shower pipe 34 of one of the circulation pumps 32.

Referring to fig. 1, a fan 37 is also provided obliquely downward above the shower pipe 34 in the cooling box 31.

Referring to fig. 1, a photoelectric generator 9 is arranged on one side inside the cooling box 31, the photoelectric generator 9 is positioned above the liquid level of the cooling liquid, a photoelectric receiver 10 corresponding to the photoelectric generator 9 is arranged on one side of the sleeve 7, and the photoelectric receiver 10 is used for receiving a signal sent by the photoelectric generator 9, transmitting the signal to the controller 8 and controlling the action of the lifting device 4 through the controller 8.

Referring to fig. 3, a plurality of support columns 51 are provided in the top and the body of the holding tank 5, and a plurality of through holes 52 are provided in the body of the holding tank 5.

Referring to fig. 2, the semiconductor cooling plate 33 includes a cooling surface 331 and a heat dissipating surface 332, the cooling surface 331 is attached to the side wall and the bottom of the cooling box 31, and a plurality of heat dissipating fins 333 are disposed on the heat dissipating surface 332.

Referring to fig. 1, a temperature sensor 38 for monitoring the temperature of the liquid is further disposed in the cooling tank 31, and the temperature sensor 38 transmits the monitored temperature of the liquid to the controller 8 for display and controls the start and stop of the semiconductor chilling plates 33 through the controller 8.

The utility model discloses when the actual application, place injection mold 6 after the compound die in holding groove 5, then start elevating gear 4, take elevating gear 4's execution axle to stretch out the back completely, 2 injection molding mouths of vertical injection molding device insert in sleeve 7, then fill the mould to injection mold 6 through vertical injection molding device 2 of controller 8 control, after filling the mould process, start elevating gear 4 and drive injection mold 6 and descend, in the in-process that injection mold descends, when photoelectric receiver 10 on sleeve 7 and photoelectric generator 9 are located same water flat line, photoelectric receiver 10 receives the signal that photoelectric generator 9 sent and transmits this signal to controller 8 and through controller 8 control elevating gear 4 stop motion, the coolant liquid level below that whole injection mold 6 was located in cooling box 31 at this moment cools off under the effect of coolant liquid; in-process that descends at injection mold 6, the fan 37 of setting in the top of shower 34 and through circulating pump 32 endless coolant liquid through shower nozzle 35 blowout act on injection mold 6 and tentatively cool down injection mold 6, after injection mold 6 is located coolant liquid level below completely, the coolant liquid that returns through branch pipe 36 circulation has improved the liquid mobility in the cooling box 31 and then has improved cooling efficiency, and be provided with the groove 5 that holds that is provided with a plurality of support column 51 in a plurality of through-holes 52 and top and the cell body on the cell body, make injection mold 6 and hold and form the space of swimming between the groove 5, the area of contact of coolant liquid with injection mold 6 has been enlarged, the cooling effect is improved.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims

1. The utility model provides a quick cooling type injection molding device which characterized in that: the automatic mold cooling device comprises a frame (1), a vertical injection molding device (2), a cooling device (3) and a controller (8), wherein the vertical injection molding device (2) is arranged above the frame (1), the cooling device (3) is arranged on the frame (1) below the vertical injection molding device (2), a lifting device (4) is arranged below the cooling device (3), an execution shaft of the lifting device (4) vertically penetrates through the supercooling device (3) and extends to the upper side of the cooling device (3), a containing groove (5) is arranged at the tail end of the execution shaft of the lifting device (4), an injection mold (6) after mold closing is contained in the containing groove (5), the injection mold (6) comprises an upper mold and a lower mold, and a sleeve (7) is arranged above an injection hole of the upper mold; the cooling device (3) comprises a cooling box body (31) with an opening top and a circulating pump (32) arranged on frames (1) at two sides of the cooling box body (31), a plurality of semiconductor refrigerating sheets (33) are arranged on the top and the side wall of the cooling box body (31), the inlet of the circulating pump (32) is communicated with the bottom of the side wall of the cooling box body (31), the outlet of the circulating pump (32) is provided with a spray pipe (34) the tail end of which horizontally extends to the upper part of the liquid level in the cooling box body (31), a spray head (35) facing the central line of the cooling box body (31) is obliquely and downwards arranged at the tail end of the spray pipe (34), the controller (8) is arranged at one side of the frame (1), the controller (8) is operated to control the vertical injection molding device (2), the circulation pump (32), the semiconductor cooling plate (33), and the lifting device (4) to operate.

2. A rapid cooling injection molding apparatus as claimed in claim 1, wherein a branch pipe (36) extending horizontally to below the liquid level of the cooling tank (31) is further provided to the shower pipe (34) of one of the circulation pumps (32).

3. A rapid cooling injection molding apparatus as claimed in claim 1, wherein a fan (37) is further provided obliquely downward above the shower pipe (34) in the cooling tank (31).

4. A rapid cooling type injection molding apparatus according to claim 1, wherein a photoelectric generator (9) is disposed at one side of the cooling box (31), a photoelectric receiver (10) corresponding to the photoelectric generator (9) is disposed at one side of the sleeve (7), and the photoelectric receiver (10) is used for receiving a signal sent by the photoelectric generator (9), transmitting the signal to the controller (8) and controlling the operation of the lifting device (4) through the controller (8).

5. A rapid cooling type injection molding device according to claim 1, wherein a plurality of support columns (51) are provided in the top and the tank body of the holding tank (5), and a plurality of through holes (52) are provided in the tank body of the holding tank (5).

6. A rapid cooling type injection molding apparatus according to claim 1, wherein the semiconductor cooling plate (33) comprises a cooling surface (331) and a heat dissipating surface (332), the cooling surface (331) is attached to the side wall and the bottom of the cooling box (31), and a plurality of heat dissipating fins (333) are disposed on the heat dissipating surface (332).

7. A rapid cooling type injection molding device according to claim 6, wherein a temperature sensor (38) for monitoring the liquid temperature is further disposed in the cooling tank body (31), the temperature sensor (38) transmits the monitored liquid temperature to the controller (8) for displaying and controls the start and stop of the semiconductor cooling fins (33) through the controller (8).