CN217741864U - Monitoring sound box with integrated structure of digital processing module and power amplifier module - Google Patents
Monitoring sound box with integrated structure of digital processing module and power amplifier module Download PDFInfo
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- CN217741864U CN217741864U CN202221818009.XU CN202221818009U CN217741864U CN 217741864 U CN217741864 U CN 217741864U CN 202221818009 U CN202221818009 U CN 202221818009U CN 217741864 U CN217741864 U CN 217741864U
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- power amplifier
- processing module
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- digital processing
- heat dissipation
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Abstract
The utility model discloses a monitoring sound box with a digital processing module and a power amplifier module integrated structure, which comprises a box shell, at least one group of loudspeakers and a PCB control panel, wherein the box shell is provided with two connecting holes; the PCB control panel is provided with a power amplifier module and a digital processing module, and the monitoring sound box is further provided with a heat dissipation system. The liquid in the heat dissipation system is a volatile heat dissipation medium. When the power amplifier processing module works, the heat emitted by the power amplifier processing module can be absorbed by the heat conducting part and conducts the absorbed heat to the heat dissipation medium of the liquid, the heat dissipation medium of the liquid is heated and volatilized into a gaseous medium, and the gaseous medium enters the two groups of spiral tubes connected in series together through the Y-shaped flexible pipeline. The fan on the air cooling group exhausts the air and dissipates the heat, the gaseous medium in the two groups of spiral pipes is cooled to form a liquid medium, the liquid medium flows back to the heat conducting part along the Y-shaped flexible pipeline, the purpose of dissipating the heat is achieved, and the purpose that the digital processing module and the power amplifier module are assembled on a PCB control board and cannot be damaged is achieved.
Description
Technical Field
The utility model relates to an audio amplifier, specific saying so relates to a digital processing module and power amplifier module structure of monitoring audio amplifier as an organic whole.
Background
A speaker refers to a device that can convert an audio signal into sound. The popular way is that a power amplifier is arranged in a main box body or a bass box body of the sound box, and the sound is emitted back by the sound box after the audio signal is amplified, so that the sound is increased. The loudspeaker box is a terminal of the whole sound system and is used for converting audio electric energy into corresponding sound energy and radiating the sound energy into a space. It is an extremely important component of an audio system and is responsible for the task of converting electrical signals into acoustic signals for direct listening by the human ear.
The monitoring sound box is a professional sound equipment and is characterized in that sound in three frequency ranges of high, middle and low can be restored in a balanced manner, no decoration and rendering are carried out on the playback of the sound, and audio signals are restored faithfully. The loudspeaker box is not well viewed in the civil field, on one hand, most people like listening to more pleasant sound after being exaggeratedly decorated by the loudspeaker box, and on the other hand, the loudspeaker box is expensive. The first aspect is actually a misunderstanding of the listening box that can hear the decorated effect as if the music producer had processed the sound to be pleasing.
Traditional monitoring sound box digital processing module and power amplifier module install respectively on the circuit board of difference, form split type mounting structure, and this kind of package mainly is because the heat that power amplifier module gived off is great, causes the harm to digital processing module's electronic component easily.
In view of the above, it is desirable to improve the heat dissipation efficiency so that the digital processing module and the power amplifier module of the sound box can be assembled on a circuit board to form an integrated structure.
SUMMERY OF THE UTILITY MODEL
Not enough to among the prior art, the to-be-solved technical problem of the utility model lies in providing a digital processing module and power amplifier module structure of becoming a body monitoring audio amplifier, and the purpose of designing this monitoring audio amplifier is with digital processing module and power amplifier module assembly structure of becoming a body.
In order to solve the technical problem, the utility model discloses a following scheme realizes: the utility model discloses a monitoring sound box with a digital processing module and a power amplifier module integrated structure, which comprises a box shell, at least one group of loudspeakers arranged in the box shell and a PCB control panel for driving the loudspeakers to operate, wherein the top plate of the box shell is provided with two connecting holes;
the PCB control board is provided with a power amplifier module and a digital processing module, and the monitoring sound box is also provided with a heat dissipation system;
this cooling system includes:
the heat absorption component is arranged on the power amplification module, volatile liquid heat dissipation media are arranged in the heat absorption component, and the liquid heat dissipation media in the heat absorption component volatilize through heat conduction to form gaseous media;
the two groups of spiral pipes are arranged on the two connecting holes and connected in series, and are connected to the heat absorption assembly through a Y-shaped flexible pipeline and communicated with the cavity where the heat dissipation medium is located;
and the air cooling unit is covered on the two groups of spiral pipes and fixes the two groups of spiral pipes, and is provided with an air duct passing through the two groups of spiral pipes and a fan which is arranged at the top of the air cooling unit and exhausts air upwards.
Furthermore, the heat absorption component comprises a heat conduction part with a containing cavity, a quick connector arranged at the upper end of the heat conduction part, and a valve connector arranged at the lower end of the heat conduction part.
Furthermore, the cavity of the heat conducting part is filled with liquid heat dissipation medium in a non-full state.
Furthermore, the liquid heat dissipation medium is one of ethanol and acetone.
Furthermore, the connecting holes are provided with double-head quick connectors, the upper ends of the two double-head quick connectors are respectively and quickly connected with the two pipe orifices of the two groups of spiral pipes, and the lower ends of the two double-head quick connectors are respectively connected with the two pipelines of the Y-shaped flexible pipeline.
Furthermore, the remaining pipe of the Y-shaped flexible pipe is connected with the quick connector.
Further, the heat conducting portion is an aluminum heat conducting member.
Further, the air cooling unit includes:
the cover body is fixed on the top plate and covers the two groups of spiral pipes, and the cover body is provided with a side air inlet and a top air outlet;
the fan mounting rack is covered at the upper end of the cover body and surrounds the top air outlet hole, and an air outlet hole is formed in the top surface of the fan mounting rack;
and the fan is fixed on the fan mounting frame.
Furthermore, the spiral pipe is an aluminum spiral pipe.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a monitor audio amplifier assembles digital processing module and power amplifier module on a PCB control panel to install on power amplifier processing module and be used for radiating heat-conducting part. The heat conducting part is provided with a containing cavity for storing liquid, and the liquid is a volatile heat dissipation medium. When the power amplifier processing module works, the heat emitted by the power amplifier processing module can be absorbed by the heat conducting part and conducts the absorbed heat to the heat dissipation medium of the liquid, the heat dissipation medium of the liquid is heated and volatilized into a gaseous medium, and the gaseous medium enters the two groups of spiral tubes connected in series together through the Y-shaped flexible pipeline. The fan on the air cooling group exhausts air and dissipates heat, the gaseous medium in the two groups of spiral pipes is cooled to form a liquid medium, the liquid medium flows back to the heat conducting part along the Y-shaped flexible pipeline, the heat dissipation purpose is achieved, and the purpose that the digital processing module and the power amplifier module are assembled on a PCB control panel and cannot be damaged is achieved.
Drawings
Fig. 1 is a diagram of the exterior structure of the sound box of the present invention.
Fig. 2 is a structural diagram of the heat dissipation system of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making more clear and definite definitions of the protection scope of the present invention. It is to be understood that the embodiments described herein are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
referring to fig. 1-2, the utility model discloses a monitoring sound box with an integrated structure of a digital processing module and a power amplifier module, which comprises a box shell 1, at least one set of speakers installed in the box shell 1 and a PCB control board 52 for driving the speakers to operate, wherein two connecting holes 2 are arranged on a top plate 11 of the box shell 1;
the PCB control board 52 is provided with a power amplifier module and a digital processing module 51, and the monitoring sound box is also provided with a heat dissipation system 5;
this cooling system 5 includes:
the heat absorption component is arranged on the power amplification module, the heat absorption component is internally provided with a volatile liquid heat dissipation medium 511, and the liquid heat dissipation medium 511 in the heat absorption component is volatilized through heat conduction to form a gaseous medium;
two groups of spiral pipes 56 which are arranged on the two connecting holes 2 and connected in series, wherein the two groups of spiral pipes 56 are connected to the heat absorption assembly through a Y-shaped flexible pipeline 59 and are communicated with the chamber where the heat dissipation medium is located;
and the air cooling unit is covered on the two groups of spiral pipes 56 and fixes the two groups of spiral pipes 56, and the air cooling unit is provided with an air duct passing through the two groups of spiral pipes 56 and a fan 53 which is arranged at the top of the air cooling unit and exhausts air upwards.
A preferred technical solution of this embodiment: the heat absorbing assembly includes a heat conductive portion 512 having a cavity, a quick connector 510 mounted on an upper end of the heat conductive portion 512, and a valve connector 513 mounted on a lower end of the heat conductive portion 512.
A preferred technical solution of this embodiment: the cavity of the heat conducting part 512 is filled with a liquid heat dissipating medium 511 in a non-full state.
A preferred technical solution of this embodiment: the liquid heat dissipation medium 511 is one of ethanol and acetone.
A preferred technical solution of this embodiment: the connecting hole 2 is provided with a double-head quick connector, the upper ends of the two double-head quick connectors are respectively and quickly connected with the two pipe orifices of the two groups of spiral pipes 56, and the lower ends of the two double-head quick connectors are respectively connected with the two pipelines of the Y-shaped flexible pipeline 59.
A preferred technical solution of this embodiment: the remaining one of the Y-shaped flexible tubing 59 is connected to the quick connector 510.
A preferred technical solution of this embodiment: the heat conducting portion 512 is an aluminum heat conducting member.
A preferred technical solution of this embodiment: the air cooling unit comprises:
the cover body 57 is fixed on the top plate 11 and covers the two groups of spiral pipes 56, and the cover body 57 is provided with a side air inlet 58 and a top air outlet 514;
the fan mounting rack 55 is covered at the upper end of the cover body 57 and surrounds the top air outlet hole 514, and an air outlet hole 54 is formed in the top surface of the fan mounting rack 55;
and a fan 53 fixed to the fan mount 55.
A preferred technical solution of this embodiment: the spiral tube 56 is an aluminum spiral tube.
Example 2:
since liquid can become gaseous at any temperature by evaporation, likewise, gas can become liquid at any temperature below the boiling point. Therefore, the heat dissipation medium 511 of the present invention is one of ethanol and acetone. The ethanol is alcohol with a boiling point of 78.3, the acetone with a boiling point of 56.12, and the liquid with a low boiling point is volatile by heating. Although some lower boiling point liquids are available in the market, the liquid with the too low boiling point is gasified quickly, and the requirement on the bearing capacity of the closed cavity is high, so that the purpose of heat dissipation can be better realized by selecting ethanol or acetone.
The utility model discloses a monitor audio amplifier assembles digital processing module 51 and power amplifier module on a PCB control panel 52 to install on power amplifier processing module and be used for radiating heat-conducting part 512. The heat conduction portion 512 has a cavity for storing liquid, and the liquid is a volatile heat dissipation medium 511.
When the power amplifier processing module works, the heat emitted by the power amplifier processing module is absorbed by the heat conducting part 512 and conducts the absorbed heat to the liquid heat-dissipating medium 511, the liquid heat-dissipating medium 511 is heated and volatilized into a gaseous medium, and the gaseous medium enters the two groups of spiral pipes 56 which are connected in series through the Y-shaped flexible pipeline 59. The fan 53 on the air cooling unit exhausts air for heat dissipation, cools the gaseous medium in the two groups of spiral pipes 56 to form a liquid medium, and the liquid medium flows back to the heat conducting part 512 along the Y-shaped flexible pipeline 59, so that the purpose of heat dissipation is achieved, and the purpose that the digital processing module 51 and the power amplifier module are assembled on a PCB control board and cannot be damaged is also achieved.
Example 3:
as shown in fig. 1, a woofer 3 and a tweeter 4 are mounted inside a front side plate of a cabinet 1 of the cabinet. Case shell 1 is closed shell, and two connecting hole 2 departments all are equipped with seal structure, and the double-end quick-operation joint passes through to form sealing connection between seal cover and the connecting hole 2.
Example 4:
in order to mute the operation of the fan 53, a bearing is fitted to a drive shaft connected to the fan 53.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.
Claims (9)
1. The monitoring sound box with the integrated structure of the digital processing module and the power amplifier module comprises a box shell (1), at least one group of loudspeakers arranged in the box shell (1) and a PCB control panel (52) for driving the loudspeakers to operate, and is characterized in that two connecting holes (2) are formed in a top plate (11) of the box shell (1);
a power amplifier module and a digital processing module (51) are arranged on the PCB control board (52), and a heat dissipation system (5) is further installed on the monitoring sound box;
the heat dissipation system (5) comprises:
the heat absorption component is arranged on the power amplification module, volatile liquid heat dissipation medium (511) is arranged in the heat absorption component, and the liquid heat dissipation medium (511) in the heat absorption component volatilizes through heat conduction to form gaseous medium;
the two groups of spiral pipes (56) are arranged on the two connecting holes (2) and connected in series, and the two groups of spiral pipes (56) are connected to the heat absorption assembly through a Y-shaped flexible pipeline (59) and are communicated with the cavity where the heat dissipation medium is located;
and the air cooling unit is covered on the two groups of spiral pipes (56) and fixes the two groups of spiral pipes (56), and the air cooling unit is provided with an air channel passing through the two groups of spiral pipes (56) and a fan (53) which is arranged at the top of the air cooling unit and exhausts air upwards.
2. The monitoring speaker with integrated digital processing module and power amplifier module as claimed in claim 1, wherein the heat absorbing assembly comprises a heat conducting portion (512) having a cavity, a quick connector (510) mounted on an upper end of the heat conducting portion (512), and a valve connector (513) mounted on a lower end of the heat conducting portion (512).
3. The monitoring speaker with integrated digital processing module and power amplifier module as claimed in claim 2, wherein the cavity of the heat conducting part (512) is filled with liquid heat dissipating medium (511) in non-full state.
4. The monitoring sound box with the integrated structure of the digital processing module and the power amplifier module according to claim 3, wherein the liquid heat dissipation medium (511) is one of ethanol and acetone.
5. The monitoring sound box with the integrated structure of the digital processing module and the power amplifier module according to claim 2, wherein the connecting hole (2) is provided with two-head quick connectors, the upper ends of the two-head quick connectors are respectively and quickly connected with the two pipe orifices of the two sets of spiral pipes (56), and the lower ends of the two-head quick connectors are respectively and quickly connected with the two pipes of the Y-shaped flexible pipeline (59).
6. The monitoring speaker with integrated structure of digital processing module and power amplifier module as claimed in claim 5, wherein the remaining one of said Y-shaped flexible pipes (59) is connected to said quick connector (510).
7. The monitoring speaker with integrated digital processing module and power amplifier module as claimed in claim 2, wherein the heat conducting portion (512) is an aluminum heat conducting member.
8. The monitoring speaker with integrated digital processing module and power amplifier module as claimed in claim 1, wherein the air cooling set comprises:
the cover body (57) is fixed on the top plate (11) and covers the two groups of spiral pipes (56), and the cover body (57) is provided with a side air inlet (58) and a top air outlet (514);
the fan mounting rack (55) is connected to the upper end of the cover body (57) in a covering mode and surrounds the top air outlet hole (514), and an air outlet hole (54) is formed in the top face of the fan mounting rack (55);
and a fan (53) fixed to the fan mounting bracket (55).
9. The monitoring speaker with integrated digital processing module and power amplifier module as claimed in claim 1, wherein the spiral tube (56) is an aluminum spiral tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221818009.XU CN217741864U (en) | 2022-07-14 | 2022-07-14 | Monitoring sound box with integrated structure of digital processing module and power amplifier module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221818009.XU CN217741864U (en) | 2022-07-14 | 2022-07-14 | Monitoring sound box with integrated structure of digital processing module and power amplifier module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217741864U true CN217741864U (en) | 2022-11-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221818009.XU Active CN217741864U (en) | 2022-07-14 | 2022-07-14 | Monitoring sound box with integrated structure of digital processing module and power amplifier module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217741864U (en) |
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2022
- 2022-07-14 CN CN202221818009.XU patent/CN217741864U/en active Active
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