CN211531607U - Heat pipe and speaker device - Google Patents

Abstract

The utility model provides a heat pipe, its include the heat pipe upper strata, with the heat pipe upper strata sets up relatively and encloses into accommodating space's heat pipe lower floor and accept in flow path layer in the accommodating space, flow path layer is including a plurality of pipe walls of mutual spaced, each the pipe wall presss from both sides respectively and locates the heat pipe upper strata with between the heat pipe lower floor, just the heat pipe upper strata with the heat pipe lower floor respectively with the pipe wall laminating is fixed and adjacent two the pipe wall with the heat pipe upper strata reaches the heat pipe lower floor encloses to close and forms the runner that supplies the heat exchange working medium to flow, the heat pipe upper strata with the heat pipe lower floor is the steel sheet. The utility model also provides an application the speaker device of heat pipe compares with the correlation technique, the utility model discloses heat pipe and speaker device's manufacturing process is simple, and makes of high quality and efficient.

Description

Heat pipe and speaker device

[ technical field ] A method for producing a semiconductor device

The utility model relates to an acoustoelectric field especially relates to a heat pipe and speaker device.

[ background of the invention ]

With the continuous improvement of the processor performance of electronic products, the size of the heat flux density is increased rapidly, and the heat dissipation performance of the electronic products is required to be higher. Many new technologies have emerged to increase heat transfer area and overall heat transfer coefficient. Among the technologies, a heat pipe heat exchanger (heat pipe for short) has high heat exchange efficiency, and is widely applied to heat transfer of electronic products. The flow channel of the heat pipe is important for fluid distribution, the flow state of the fluid can be improved to a certain extent, the nonuniformity of thermal resistance can be improved, and the heat dissipation performance of electronic products with continuously increased heat flux density is greatly improved.

The loudspeaker is the only component of the electronic product that is in airflow communication with the space outside the cabinet. The heat inside the casing can be diffused to the outside atmosphere through the air, and the condensation end of the heat pipe heat exchanger is designed at the condensation end, so that the temperature difference between the outside air and the processor can be utilized to push the heat exchange to be carried out towards the direction which is favorable for improving the performance of the heat pipe heat exchanger.

However, compared with the conventional heat pipe of an electronic product, the heat pipe with the built-in speaker component has smaller volume and smaller heat exchange area. It is further necessary to provide flow channels for proper distribution of fluid within. However, the complex flow channel has a smaller processing range, a longer period and a higher price compared with the loudspeaker.

Therefore, there is a need to provide a new heat pipe and speaker device to solve the above technical problems.

[ Utility model ] content

An object of the utility model is to provide a manufacturing process is simple, and makes high quality and efficient heat pipe and speaker device.

In order to achieve the above object, the utility model provides a heat pipe, its include the heat pipe upper strata, with the heat pipe upper strata sets up relatively and encloses into accommodating space's heat pipe lower floor and accept in flow path layer in the accommodating space, flow path layer is including a plurality of pipe walls of mutual interval, each the pipe wall presss from both sides respectively and locates the heat pipe upper strata with between the heat pipe lower floor, just the heat pipe upper strata with the heat pipe lower floor respectively with the pipe wall laminating is fixed and adjacent two the pipe wall with the heat pipe upper strata reaches the heat pipe lower floor encloses to close and forms the runner that supplies the heat transfer working medium to flow, the heat pipe upper strata with the heat pipe lower floor is the steel sheet.

Preferably, the flow channel layer is an etched steel sheet array.

Preferably, the flow channel layer is a graphite sticker array.

Preferably, the flow channel layer is an injection molded tube wall array.

Preferably, the two opposite sides of the flow channel layer are respectively fixed with the upper heat pipe layer and the lower heat pipe layer by brazing.

Preferably, two opposite sides of the flow channel layer are respectively bonded and fixed with the upper heat pipe layer and the lower heat pipe layer.

Preferably, the plurality of flow channels are uniformly arranged.

The utility model also provides a loudspeaker device, which comprises a heat pipe, a loudspeaker box and a heat source device which is separated from the loudspeaker box,

the heat pipe comprises a condensation end, a conduction part extending from the condensation end, an evaporation end extending from the conduction part to a position far away from the condensation end, and a heat exchange working medium, the flow channel is sequentially arranged at the condensation end, the conduction part and the evaporation end and forms a closed ring shape, and the heat exchange working medium is filled in the heat pipe and circularly flows in the flow channel;

the loudspeaker box comprises a shell with a first accommodating space, a sound generating unit accommodated in the first accommodating space and a sound guide channel formed in the shell; the sound-producing monomer comprises a vibrating diaphragm for vibrating and producing sound, the vibrating diaphragm divides the first accommodating space into a front sound cavity and a rear cavity, and the sound guide channel communicates the front sound cavity with the outside and forms a front cavity together with the front sound cavity; the condensation end is embedded in the shell, and two opposite sides of the condensation end are respectively connected with the outside and the front sound cavity;

the heat source device is connected with the evaporation end.

Preferably, the condensation end and the shell are integrally formed by injection molding.

Preferably, the heat source device is any one of a processor and a battery.

The manufacturing process is simple, and the heat pipe and the loudspeaker device which have good manufacturing quality and high efficiency are manufactured.

Compared with the prior art, the utility model discloses a heat pipe and speaker device is through setting up the heat pipe respectively to the heat pipe upper strata that the steel sheet constitutes, the runner layer that a plurality of mutual spaced pipe walls constitute and the heat pipe lower floor three layer construction that the steel sheet constitutes. The upper layer and the lower layer of the heat pipe are respectively attached and fixed with the pipe wall, so that the two adjacent pipe walls, the upper layer and the lower layer of the heat pipe are enclosed to form a flow channel for the heat exchange working medium to flow. The utility model discloses heat pipe and speaker device's manufacturing process is simple, and under the small condition of speaker device, the heat pipe that makes to have complex structure sets up in speaker device, and makes of high quality and efficient.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:

FIG. 1 is a schematic perspective view of a heat pipe according to the present invention;

FIG. 2 is a schematic view of a partial three-dimensional structure of the heat pipe of the present invention;

FIG. 3 is an enlarged view of portion A of FIG. 1;

fig. 4 is a schematic perspective view of the speaker device of the present invention;

fig. 5 is a schematic view of a partial three-dimensional structure of the speaker device of the present invention;

fig. 6 is a schematic diagram of the speaker device of the present invention applied to a mobile terminal.

[ detailed description ] embodiments

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a heat pipe 100. The heat pipe 100 includes an upper heat pipe layer 101, a lower heat pipe layer 102, and a flow channel layer 103.

The heat pipe upper layer 101 and the heat pipe lower layer 102 enclose an accommodating space 10.

The heat pipe lower layer 102 is disposed opposite to the heat pipe upper layer 101.

The upper heat pipe layer 101 and the lower heat pipe layer 102 are both steel sheets. In the present embodiment, the heat pipe upper layer 101 and the heat pipe lower layer 102 are both made of stamped steel sheets.

The flow channel layer 103 is accommodated in the accommodating space 10. The flow channel layer 103 includes a plurality of tube walls 31 spaced apart from each other. Each pipe wall 31 is sandwiched between the heat pipe upper layer 101 and the heat pipe lower layer 102. The heat pipe upper layer 101 and the heat pipe lower layer 102 are respectively attached and fixed, and two adjacent pipe walls 31, the heat pipe upper layer 101 and the heat pipe lower layer 102 enclose to form a flow channel 30 for a heat exchange working medium (not shown) to flow. In the present embodiment, the flow passage 30 has a tubular shape. The plurality of flow passages 30 are uniformly arranged.

The flow channel layer 103 may be constructed in various ways. The following four examples are illustrated separately:

(embodiment one)

The flow channel layer 103 is an etched steel sheet array. The opposite sides of the flow channel layer 103 are respectively bonded and fixed to the heat pipe upper layer 101 and the heat pipe lower layer 102.

The structure of the flow channel layer 103, the heat pipe upper layer 101, and the heat pipe lower layer 102 will be described in detail below by manufacturing the heat pipe 100. The heat pipe 100 is manufactured by the following steps:

step 1, respectively punching two steel sheets according to design specifications to form the upper heat pipe layer 101 and the lower heat pipe layer 102. The runner layer 103 is made by etching a plurality of runners 30 from a single piece of steel according to design specifications.

And 2, attaching and fixing the upper heat pipe layer 101, the flow channel layer 103 and the lower heat pipe layer 102 to form a whole according to design specifications. In this embodiment, the heat pipe 100 is formed by fixing the heat pipe upper layer 101, the flow channel layer 103, and the heat pipe lower layer 102 by glue.

As can be seen from the above, the heat pipe 100 has a simple manufacturing process, good manufacturing quality and high efficiency.

(second embodiment)

The flow channel layer 103 is an etched steel sheet array. Opposite sides of the flow channel layer 103 are respectively fixed to the heat pipe upper layer 101 and the heat pipe lower layer 102 by brazing.

The structure of the flow channel layer 103, the heat pipe upper layer 101, and the heat pipe lower layer 102 will be described in detail below by manufacturing the heat pipe 100. The heat pipe 100 is manufactured by the following steps:

step 1, respectively punching two steel sheets into the upper heat pipe layer 101 and the lower heat pipe layer 102 according to design specifications, and etching a plurality of flow channels 30 from one steel sheet according to the design specifications to form the flow channel layer 103.

Step 2, the brazing solder is uniformly plated on the surface of the accommodating space 10 of the upper heat pipe layer 101, the surface of the accommodating space 10 of the flow channel layer 103 and the surface of the accommodating space 10 of the lower heat pipe layer 102, and the upper heat pipe layer 101, the flow channel layer 103 and the lower heat pipe layer 102 which are plated with the brazing solder are brazed and fixed to form the heat pipe 100.

As can be seen from the above, the heat pipe 100 has a simple manufacturing process, good manufacturing quality and high efficiency.

(third embodiment)

The flow channel layer 103 is a graphite sticker. The opposite sides of the flow channel layer 103 are respectively bonded and fixed to the heat pipe upper layer 101 and the heat pipe lower layer 102.

The structure of the flow channel layer 103, the heat pipe upper layer 101, and the heat pipe lower layer 102 will be described in detail below by manufacturing the heat pipe 100. The heat pipe 100 is manufactured by the following steps:

step 1, respectively punching two steel sheets into the upper heat pipe layer 101 and the lower heat pipe layer 102 according to design specifications, and manufacturing a graphite sticker into the runner layer 103 according to the shape of the plurality of runners 30 according to the design specifications.

And 2, attaching and fixing the upper heat pipe layer 101, the flow channel layer 103 and the lower heat pipe layer 102 according to design specifications to form the heat pipe 100.

As can be seen from the above, the heat pipe 100 has a simple manufacturing process, good manufacturing quality and high efficiency.

(example four)

The flow channel layer 103 is an injection molded pipe wall array. The opposite sides of the flow channel layer 103 are respectively bonded and fixed to the heat pipe upper layer 101 and the heat pipe lower layer 102. The structure of the flow channel layer 103, the heat pipe upper layer 101, and the heat pipe lower layer 102 will be described in detail below by manufacturing the heat pipe 100. The heat pipe 100 is manufactured by the following steps:

step 1, respectively punching two steel sheets according to design specifications to form the upper heat pipe layer 101 and the lower heat pipe layer 102, and injection molding a plurality of flow channels 30 according to the design specifications to form the flow channel layer 103.

And 2, attaching and fixing the upper heat pipe layer 101, the flow channel layer 103 and the lower heat pipe layer 102 according to design specifications to form the heat pipe 100. The heat pipe 100 is formed by fixing the heat pipe upper layer 101, the flow channel layer 103, and the heat pipe lower layer 102 by glue.

As can be seen from the above, the heat pipe 100 has a simple manufacturing process, good manufacturing quality and high efficiency.

The structure of the heat pipe 100 will be described below according to its function, and in particular,

the heat pipe 100 includes a condensation end 1, a conduction part 2 extending from the condensation end 1, an evaporation end 3 extending from the conduction part 2 to a position far away from the condensation end 1, and a heat exchange working medium (not shown), the flow channel 30 is sequentially disposed at the condensation end 1, the conduction part 2, and the evaporation end 3 and forms a closed ring shape, and the heat exchange working medium is filled in the heat pipe 100 and circularly flows in the flow channel 30.

Referring to fig. 4-5, the present invention provides a speaker device 200. The speaker apparatus 200 includes the heat pipe 100, a speaker box 300, and a heat source device 400 spaced apart from the speaker box 300.

The loudspeaker enclosure 300 has a front volume 310 for sound production. The condensation end 1 is connected to the front chamber 310. The heat source device 400 is connected to the evaporation end 3.

The evaporation end 3 conducts the heat of the heat source device 400 to the condensation end 1 through the conduction part 2, the condensation end 1 is connected with the front cavity 310, and active airflow exchange is formed when the front cavity 310 of the speaker box 300 occurs, so that the heat of the condensation end 1 is rapidly dissipated through the airflow exchange.

Specifically, the speaker box 300 includes a housing 301 having a first receiving space, a sound generating unit 302 received in the first receiving space 305, and a sound guiding channel 303 formed in the housing 301. The sound generating unit 302 includes a diaphragm 3021 for generating sound by vibration, the diaphragm 3021 divides the first accommodation space 305 into a front sound cavity 304 and a rear cavity (not shown), and the sound guiding channel 303 communicates the front sound cavity 304 with the outside and forms the front cavity 310 together with the front sound cavity 304.

The condensation end 1 is embedded in the housing 301, and two opposite sides of the condensation end 1 are respectively connected with the outside and the front cavity 310.

In this embodiment, the condensation end 1 and the housing 301 are integrally formed by injection molding. This arrangement allows one side of the condensation terminal 1 to be in direct contact with the air in the front chamber 310 and the other side to be in direct contact with the outside air of the speaker box 300 or the case of the mobile terminal, and one side heat conduction and heat radiation are combined to dissipate heat and the other side heat radiation is dissipated heat. The evaporation end 3 is connected with the heat source device 400, heat of the heat source device 400 is transferred to the heat exchange working medium inside the heat pipe 100 and conducted to the condensation end 1, and the heat exchange working medium is evaporated and condensed inside the heat pipe 100 to transfer and transfer heat, so that the purpose of heat dissipation is achieved.

The condensation end 1 conducts heat to the front sound cavity 304 (which may be a sound guiding channel 303), and the diaphragm 3021 vibrates to push air in the front sound cavity 304 to circulate with the outside through the sound guiding channel 303. Specifically, the volume of the front acoustic cavity 304 changes when the diaphragm 121 vibrates: when the volume of the front sound cavity 304 becomes smaller, the diaphragm 3021 discharges part of the air in the front sound cavity 304 to the outside through the sound guide channel 303; when the volume of the front sound cavity 304 becomes larger, the diaphragm 3021 sucks the external space into the front sound cavity 304 through the sound guide channel 303; the above process convects the air in the front acoustic chamber 304 with the air in the outside. The vibration of the diaphragm 3021 causes the heat in the front acoustic cavity 304 to be dissipated out of the housing 301 along with the circulation of air, so that the heat dissipation of the heat source device 400 is realized, and the heat dissipation effect of the speaker apparatus 200 is good.

In the present embodiment, the heat source device 400 is any one of a processor and a battery, but is not limited thereto.

It should be noted that the vibration of the diaphragm 3021 may be in a sound mode or a non-sound mode, and the heat conducted into the front sound cavity 304 may be dissipated to the outside along with the air circulation. So that the speaker box 300 can exclusively perform the work of dissipating heat.

Specifically, a pulse signal of a lower frequency is input to the speaker box 300, and a low frequency sound generated in the speaker box 300 is not heard by human ears. In this embodiment, the input lower frequency is below 1000 Hz. In a specific application, the speaker box 300 can play the pulse signal alone when not performing a music playing task; the speaker box 300 may also superimpose the pulse signal into the music signal while performing the music play task. Because the signal is an ultra-low frequency pulse signal, the signal can not be heard by human ears and the normal listening effect is not influenced.

Referring to fig. 6, when the speaker device 200 is applied to a mobile terminal 500, the mobile terminal 500 includes a housing 502 having a second receiving space 501 and the speaker device 200, and the speaker device 200 is mounted in the second receiving space 501. The housing 502 is provided with a sound outlet channel 503 penetrating therethrough, and the sound outlet channel 503 is in air communication with the front sound cavity 304 through the sound guide channel 303 so as to radiate heat of the heat source device 400 conducted to the front sound cavity 304 through the heat pipe 100 to the outside of the housing 502.

It is above-mentioned to synthesize the utility model discloses a heat pipe 100 will be made two steel sheets punching press respectively heat pipe upper strata 101 with heat pipe lower floor 102, and make through different processes flow channel layer 103 to according to the manufacturing approach on flow channel layer, correspond the fixed mode formation one of selecting the difference in above-mentioned step 2 heat pipe 100's whole, and be fixed in it through the mode of moulding plastics in speaker device 200, heat pipe 100's above-mentioned step is in under the small condition of speaker device 200, the messenger has complex structure heat pipe 100 set up in speaker device 200, and make of high quality and efficient.

Compared with the prior art, the utility model discloses a heat pipe and speaker device is through setting up the heat pipe respectively to the heat pipe upper strata that the steel sheet constitutes, the runner layer that a plurality of mutual spaced pipe walls constitute and the heat pipe lower floor three layer construction that the steel sheet constitutes. The upper layer and the lower layer of the heat pipe are respectively attached and fixed with the pipe wall, so that the two adjacent pipe walls, the upper layer and the lower layer of the heat pipe are enclosed to form a flow channel for the heat exchange working medium to flow. The utility model discloses heat pipe and speaker device's manufacturing process is simple, and under the small condition of speaker device, the heat pipe that makes to have complex structure sets up in speaker device, and makes of high quality and efficient.

The above embodiments of the present invention are only described, and it should be noted that, for those skilled in the art, modifications can be made without departing from the inventive concept, but these all fall into the protection scope of the present invention.

Claims (10)

1. A heat pipe is characterized by comprising a heat pipe upper layer, a heat pipe lower layer and a flow channel layer, wherein the heat pipe lower layer is arranged opposite to the heat pipe upper layer and surrounds a containing space, the flow channel layer is contained in the containing space and comprises a plurality of pipe walls which are mutually spaced, the pipe walls are respectively clamped between the heat pipe upper layer and the heat pipe lower layer, the heat pipe upper layer and the heat pipe lower layer are respectively attached and fixed to the pipe walls, two adjacent pipe walls are enclosed by the heat pipe upper layer and the heat pipe lower layer to form a flow channel for heat exchange working medium to flow, and the heat pipe upper layer and the heat pipe lower layer are both steel sheets.

2. A heat pipe as claimed in claim 1 wherein said flow field layer is an array of etched steel sheets.

3. A heat pipe as claimed in claim 1 wherein said flow channel layer is an array of graphite decals.

4. A heat pipe as claimed in claim 1 wherein said flow field layer is an injection molded array of pipe walls.

5. A heat pipe as claimed in claim 1 wherein opposite sides of said flow channel layer are brazed to said upper heat pipe layer and said lower heat pipe layer, respectively.

6. A heat pipe as claimed in claim 1 wherein opposite sides of said flow channel layer are adhesively secured to said upper heat pipe layer and said lower heat pipe layer, respectively.

7. A heat pipe as claimed in claim 1 wherein said plurality of flow passages are uniformly arranged.

8. A loudspeaker device comprising a heat pipe according to any one of claims 1 to 6, a loudspeaker enclosure and heat source means spaced from the loudspeaker enclosure,

the heat pipe comprises a condensation end, a conduction part extending from the condensation end, an evaporation end extending from the conduction part to a position far away from the condensation end, and a heat exchange working medium, the flow channel is sequentially arranged at the condensation end, the conduction part and the evaporation end and forms a closed ring shape, and the heat exchange working medium is filled in the heat pipe and circularly flows in the flow channel;

the loudspeaker box comprises a shell with a first accommodating space, a sound generating unit accommodated in the first accommodating space and a sound guide channel formed in the shell; the sound-producing monomer comprises a vibrating diaphragm for vibrating and producing sound, the vibrating diaphragm divides the first accommodating space into a front sound cavity and a rear cavity, and the sound guide channel communicates the front sound cavity with the outside and forms a front cavity together with the front sound cavity; the condensation end is embedded in the shell, and two opposite sides of the condensation end are respectively connected with the outside and the front sound cavity;

the heat source device is connected with the evaporation end.

9. The speaker device of claim 8, wherein the condenser end is injection molded integrally with the housing.

10. The speaker device according to claim 8, wherein the heat source means is any one of a processor and a battery.

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