CN217741685U - Electronic device with a detachable cover - Google Patents
Electronic device with a detachable cover Download PDFInfo
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- CN217741685U CN217741685U CN202221790561.2U CN202221790561U CN217741685U CN 217741685 U CN217741685 U CN 217741685U CN 202221790561 U CN202221790561 U CN 202221790561U CN 217741685 U CN217741685 U CN 217741685U
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- circuit board
- electronic device
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- wall portion
- cover plate
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Abstract
Disclosed is an electronic device including: an electronic device housing including a first circuit board receiving portion and a second circuit board receiving portion formed on a first side of the electronic device housing; a first circuit board mounted to the first circuit board receiving part; a second circuit board mounted to the second circuit board receiving part; and an electronics cover plate mounted to the first side of the electronics housing for at least partially enclosing the first circuit board and the second circuit board between the electronics housing and the electronics cover plate.
Description
Technical Field
The present invention relates to electronic devices, and more particularly, to audio power amplifiers.
Background
Audio power amplifiers are important components in sound systems for receiving audio signals from an audio signal source and amplifying the received audio signals to drive speakers. Currently used audio power amplifiers include various types, some of which have various other audio signal processing functions in addition to an audio signal amplifying function, and some of which have only an audio signal amplifying function and do not have an audio signal processing function.
In some high-end applications, it is desirable to employ both audio power amplifiers to provide more audio channels, drive more speakers, and provide better sound. However, there is a lack of design that can combine two audio power amplifiers together well.
In addition, the audio power amplifier usually generates a large amount of heat, and a special heat dissipation structure needs to be arranged to dissipate the heat of the audio power amplifier. This also increases the difficulty of combining the two audio power amplifiers together.
Therefore, there is a need for a new audio power amplifier design that combines two audio power amplifiers together well.
SUMMERY OF THE UTILITY MODEL
The present invention aims to overcome at least some of the above problems in the prior art.
According to an aspect of the present invention, there is provided an electronic apparatus, including:
an electronic device housing including a first circuit board receiving portion and a second circuit board receiving portion formed on a first side of the electronic device housing;
a first circuit board mounted to the first circuit board receiving part;
a second circuit board mounted to the second circuit board receiving part; and
an electronics cover plate mounted to the first side of the electronics housing for at least partially enclosing the first circuit board and the second circuit board between the electronics housing and the electronics cover plate.
In accordance with one or more embodiments of the present invention, the electronic device housing has a housing base,
wherein the first circuit board receiving portion includes a first peripheral wall portion extending from the housing base portion, the first peripheral wall portion and the housing base portion collectively defining a first chamber, a free end portion of the first peripheral wall portion having a shape and size corresponding to a shape and size of a peripheral portion of the first circuit board such that the free end portion of the first peripheral wall portion engages the peripheral portion of the first circuit board,
wherein the second circuit board receiving portion includes a second peripheral wall portion extending from the housing base, the second peripheral wall portion and the housing base collectively defining a second chamber, a free end of the second peripheral wall portion having a shape and size corresponding to a shape and size of a peripheral portion of the second circuit board such that the free end of the second peripheral wall portion engages the peripheral portion of the second circuit board.
According to one or more embodiments of the invention, the first and second peripheral wall portions have a common wall portion, the first and second chambers being separated by the common wall portion,
wherein a peripheral portion of the first circuit board and a peripheral portion of the second circuit board are adjacent to each other at the common wall portion.
According to one or more embodiments of the present invention, the first circuit board comprises electronic components extending at least partially into the first chamber, and the second circuit board comprises electronic components extending at least partially into the second chamber.
In accordance with one or more embodiments of the present invention, the electronic device cover includes a first cover portion and a second cover portion,
wherein the first cover plate portion includes a first cover plate center portion and a first cover plate peripheral portion having a shape and a size corresponding to those of the peripheral portion of the first circuit board so as to sandwich the peripheral portion of the first circuit board between the first cover plate peripheral portion and the free end portion of the first peripheral wall portion,
wherein the second cover plate portion includes a second cover plate central portion and a second cover plate peripheral portion having a shape and a size corresponding to those of the peripheral portion of the second circuit plate for sandwiching the peripheral portion of the second circuit plate between the second cover plate peripheral portion and a free end portion of the second peripheral wall portion.
According to one or more embodiments of the present invention, the electronic device is an audio power amplifier, and the first circuit board and the second circuit board are both audio power amplifying circuit boards.
According to one or more embodiments of the present invention, the electronic device case further includes a heat radiating fin formed on a second side opposite to the first side of the electronic device case.
According to one or more embodiments of the present invention, the electronic device housing comprises one or more bosses formed on the first side of the electronic device housing, the one or more bosses being thermally coupled with heat-generating elements on the first and/or second circuit boards.
According to the utility model discloses a one or more embodiments, the electronic device casing is integrated into one piece's metalwork, the electronic device apron is integrative stamping forming's sheet metal.
According to one or more embodiments of the present invention, the electronic device includes a first connection port connected with the first circuit board and a second connection port connected with the second circuit board.
Drawings
Fig. 1 shows an assembly diagram of an electronic device according to one or more embodiments of the invention;
FIG. 2 shows an exploded view of the electronic device of FIG. 1;
FIG. 3A illustrates a bottom view of an electronic device housing of an electronic device;
FIG. 3B shows the electronic device housing and the first and second circuit boards 150 and assembled to the electronic device housing;
FIG. 3C shows the electronics housing, the first circuit board 150 and the second circuit board assembled to the electronics housing, and the electronics cover;
FIG. 4A isbase:Sub>A sectional view taken along line A-A in FIG. 3C, FIG. 4B isbase:Sub>A sectional view taken along line B-B in FIG. 3C, and FIG. 4C isbase:Sub>A sectional view taken along line C-C in FIG. 3C;
fig. 5A is an enlarged view of a dotted line portion 5A in fig. 4A; fig. 5B is an enlarged view of a dotted line portion 5B in fig. 4A; fig. 5C is an enlarged view of a dotted line portion 5C in fig. 4A.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The utility model provides an electronic device, its electronic device casing include first circuit board receiving part and second circuit board receiving part, and first circuit board receiving part and second circuit board receiving part are used for accepting first circuit board and second circuit board respectively. Compare with the current scheme that needs two solitary electron device to hold two circuit boards, the utility model discloses following technical advantage has: the number of the die tools is small, the number of required tests is small, the assembly process is saved, and the production cost is reduced.
In some embodiments according to the invention, the first circuit board receiving portion and the second circuit board receiving portion comprise a first peripheral wall portion and a second peripheral wall portion, respectively, extending from the housing base. In other embodiments according to the present invention, an electronic device cover includes a first cover portion and a second cover portion, each of the first cover portion and the second cover portion including a first cover peripheral portion and a second cover peripheral portion. The free end portions of the first and second peripheral wall portions have shapes and sizes corresponding to or conforming to peripheral portions of the first and second circuit boards, respectively, and the first and second cover plate peripheral portions have shapes and sizes corresponding to or conforming to peripheral portions of the first and second circuit boards, respectively. Therefore, the electronic device case and the electronic device cover can firmly clamp the first circuit board and the second circuit board therebetween.
In some embodiments according to the invention, the first circuit board is substantially enclosed within a space defined by the first cover plate portion, the housing base portion, and the first peripheral wall portion by clamping the first circuit board between the first cover plate peripheral portion and the first peripheral wall portion. The second circuit board is substantially enclosed within a space defined by the second cover plate portion, the housing base portion, and the second peripheral wall portion by sandwiching the second circuit board between the second cover plate peripheral portion and the second peripheral wall portion. With this configuration, the first circuit board and the second circuit board are ensured to be protected from the EMC interference of the external environment, while preventing the electromagnetic interference between the two circuit boards.
In some embodiments according to the invention, the electronic device is an audio power amplifier and the first circuit board and the second circuit board are two separate audio power amplifying circuit boards. Through the mutual cooperation between the two audio power amplification circuit boards, better audio power amplification performance can be provided. And simultaneously, the utility model discloses a required mould frock of electron device is small in quantity, has saved the equipment process, has reduced manufacturing cost.
Fig. 1 shows an assembly view of an electronic device 100 according to one or more embodiments of the present invention, and fig. 2 shows an exploded view of the electronic device 100. The electronic device 100 includes an electronic device housing 110, a first circuit board 150, a second circuit board 160, and an electronic device cover plate 170. The electronic device cover 170 is mounted to the electronic device case 110, and the first and second circuit boards 150 and 160 are fixed between the electronic device case 110 and the electronic device cover 170. A heat dissipating fin 114 is formed on the other side or the outer side of the electronic device case 110 for dissipating heat from the first circuit board 150 and the second circuit board 160 in the electronic device 100. In the embodiment shown, the electronic device 100 is an audio power amplifier. In other embodiments according to the present invention, the electronic device 100 may be any suitable other electronic device.
3A-3C are views from the same perspective, where FIG. 3A shows a bottom view of the electronic device housing 110 of the electronic device 100; FIG. 3B shows the electronic device housing 110 and the first and second circuit boards 150, 160 assembled to the electronic device housing 110; fig. 3C shows the electronic device housing 110, the first and second circuit boards 150 and 160 assembled to the electronic device housing 110, and the electronic device cover plate 170. As shown, the electronic device case 110 includes a case base 112, a first peripheral wall portion 120a and a second peripheral wall portion 120b extending from the case base 112 in a direction perpendicular to the case base 112. The first peripheral wall portion 120a and the second peripheral wall portion 120b have a common wall portion 122. In other words, the first peripheral wall portion 120a and the second peripheral wall portion 120b are joined or merged together at the common wall portion 122.
The housing base 112 and the first peripheral wall portion 120a collectively define a first chamber 130. The first cavity 130 and the first peripheral wall portion 120a collectively receive the first circuit board 150, and may be collectively referred to as a first circuit board receiving portion. The housing base 112 and the second peripheral wall portion 120b collectively define a second chamber 140. The second chamber 140 and the second peripheral wall portion 120b collectively receive the second circuit board 160, and may be collectively referred to as a second circuit board receiving portion. The electronic device 100 further comprises one or more first connection ports 152 connected to the first circuit board 150 and one or more second connection ports 162 connected to the second circuit board 160.
As shown in fig. 3A, the first perimeter wall portion 120a substantially surrounds the first chamber 130 except in the area of the first connection port 152. The shape and size of (the free end of) the first peripheral wall portion 120a is set to correspond to or conform to or approximate to the shape and size of the peripheral portion 154 of the first circuit board 150, so that the peripheral portion 154 of the first circuit board 150 engages with (the free end of) the first peripheral wall portion 120a when the first circuit board 150 is mounted to the electronic device housing 110, as shown in fig. 3B. The second peripheral wall portion 120b substantially surrounds the second chamber 140 except for the region where the second connection port 162 is located. The shape and size of (the free end portion of) the second peripheral wall portion 120B are set to correspond to or conform to or approximate to the shape and size of the peripheral portion 164 of the second circuit board 160, so that the peripheral portion 164 of the second circuit board 160 is engaged with (the free end portion of) the second peripheral wall portion 120B when the second circuit board 160 is mounted to the electronic device casing 110, as shown in fig. 3B.
As shown in fig. 3C, the electronic device cover plate 170 includes a first cover plate portion 180 and a second cover plate portion 190, the first cover plate portion 180 and the second cover plate portion 190 corresponding to the first circuit board receiving portion and the second circuit board receiving portion of the housing base 112, respectively. The first cover plate portion 180 includes a first cover plate center portion 182 and a first cover plate peripheral portion 184. The first cover plate center portion 182 is retracted relative to the first cover plate peripheral portion 184, thereby forming a first cover plate cavity. The shape and size of the first cover plate peripheral portion 184 are set to correspond to or conform to or approximate to the shape and size of (the free end portion of) the first peripheral wall portion 120a and the peripheral portion 154 of the first circuit board 150, thereby sandwiching the peripheral portion 154 of the first circuit board 150 between the first cover plate peripheral portion 184 and the first peripheral wall portion 120a. The main portion of the first circuit board 150 is now located in the first cavity 130 of the electronic device housing 110 and the first cover cavity of the first cover portion 180. The second cover plate portion 190 includes a second cover plate center portion 192 and a second cover plate peripheral portion 194. The second cover plate central portion 192 is retracted relative to the second cover plate peripheral portion 194 forming a second cover plate cavity. The second cover plate peripheral portion 194 is shaped and sized to correspond to or conform to or approximate the shape and size of (the free end portion of) the second peripheral wall portion 120b and the peripheral portion 164 of the second circuit board 160, thereby sandwiching the peripheral portion 164 of the second circuit board 160 between the second cover plate peripheral portion 194 and the second peripheral wall portion 120b. The main portion of the second circuit board 160 is now located in the second cavity 140 of the electronic device housing 110 and the second cover cavity of the second cover portion 190. The first cover plate peripheral portion 184 and the second cover plate peripheral portion 194 also have a common peripheral portion 188 corresponding to the common wall portion 122 of the first peripheral wall portion 120a and the second peripheral wall portion 120b. That is, the first cover plate perimeter portion 184 and the second cover plate perimeter portion 194 join or merge together at the common perimeter portion 188.
Fig. 4A isbase:Sub>A sectional view taken along the linebase:Sub>A-base:Sub>A in fig. 3C, fig. 4B isbase:Sub>A sectional view taken along the line B-B in fig. 3C, and fig. 4C isbase:Sub>A sectional view taken along the line C-C in fig. 3C. Fig. 5A is an enlarged view of a dotted line portion 5A in fig. 4A; fig. 5B is an enlarged view of a dotted line portion 5B in fig. 4A; fig. 5C is an enlarged view of a dotted line portion 5C in fig. 4A. As shown, in the assembled position of the electronic device 100, the first cover plate peripheral portion 184, the peripheral portion 154 of the first circuit board 150, and the first peripheral wall portion 120a are aligned with each other, and the second cover plate peripheral portion 194, the peripheral portion 164 of the second circuit board 160, and the second peripheral wall portion 120b are aligned with each other. Fasteners 186 (bolts in the illustrated embodiment) secure the electronics cover plate 170 to the electronics housing 110. Specifically, the fasteners 186 fix the first cover plate peripheral portion 184 to the first peripheral wall portion 120a to firmly clamp the peripheral portion 154 of the first circuit board 150 between the first cover plate peripheral portion 184 and the first peripheral wall portion 120a. The fasteners 186 also fix the second cover plate peripheral portion 194 to the second peripheral wall portion 120b to sandwich the peripheral portion 164 of the second circuit board 160 between the second cover plate peripheral portion 194 and the second peripheral wall portion 120b. Therefore, the electronic device cover plate 170 and the electronic device housing 110 according to the present invention can firmly fix and position the two circuit boards 150 and 160.
In one or more embodiments according to the present invention, the electronic device housing is an integrally formed metal member, and the heat dissipating fins 114 are formed on an outer side (the other side opposite to the side on which the first circuit board 150, the second circuit board 160, and the electronic device cover 170 are mounted). The electronic device cover plate is an integrally punched and formed metal plate. Accordingly, heat generated during operation of the first circuit board 150 and the second circuit board 160 of the electronic device 100 can be dissipated through the electronic device case 110 and the electronic device cover plate 170. In some embodiments according to the present invention, the electronic device housing 110 includes one or more bosses 118 formed on the housing base 112. The bosses 118 extend into the first and/or second cavities 130, 140 to engage or otherwise be proximate to the heat generating components 158, 168 on the first and/or second circuit boards 150, 160. Accordingly, heat generated by the heat generating components 158, 168 on the first and/or second circuit boards 150, 160 can be quickly dissipated through the one or more bosses 118, the housing base 112, and the heat dissipating fins 114. According to the utility model discloses an electron device has good heat-sinking capability.
As shown in the drawings, in the electronic device 100 according to the present invention, by sandwiching the first circuit board 150 between the first cover peripheral portion 184 and the first peripheral wall portion 120a, the first circuit board 150 is substantially enclosed in the space defined by the first cover portion 180, the case base 112, and the first peripheral wall portion 120a. By sandwiching the second circuit board 160 between the second cover plate peripheral portion 194 and the second peripheral wall portion 120b, the second circuit board 160 is substantially enclosed within a space defined by the second cover plate portion 190, the housing base 112, and the second peripheral wall portion 120b. With this structure, the first circuit board 150 and the second circuit board 160 are secured from EMC interference of the external environment, while electromagnetic interference between the first circuit board 150 and the second circuit board 160 is prevented. According to the utility model discloses an electronic device 100 has good EMC performance.
As shown in fig. 4A, 5A, and 5C, the electronics housing 110 also includes a peripheral wall 126 that is outside of the electronics cover plate 170 and adjacent to the electronics cover plate 170. The peripheral wall 126 extends beyond the first cover perimeter portion 184 and the second cover perimeter portion 194 of the electronics cover 170, preferably flush with the first cover center portion 182 and the second cover center portion 192. The peripheral wall 126 can further improve the EMC performance of the electronic device 100 and provide protection to the first circuit board 150, the second circuit board 160, and the electronic device cover plate 170.
According to the utility model discloses an electron device can firmly install two circuit boards simultaneously, and these two circuit boards all have good heat dispersion and EMC performance simultaneously. Compared with the prior art which requires two separate electronic devices to accommodate two such circuit boards, the present invention has the following technical advantages: the number of the die tools is small, the number of required tests is small, the assembly process is saved, and the production cost is reduced. In embodiments where the electronic device is an audio power amplifier, the first circuit board and the second circuit board are two separate audio power amplifying circuit boards that can cooperate to provide better audio power amplification performance. For example, in some embodiments, a first audio power amplifier circuit board (e.g., amplifier) performs audio processing and amplification on an audio signal from an audio source, and a second audio power amplifier circuit board (e.g., boost) receives the audio processed and amplified audio signal from the first audio power amplifier circuit board and further amplifies the audio signal. This configuration can provide more audio channels, drive more speakers, and provide better sound effects, suitable for use in some high-end sound systems.
In the embodiment shown in the figures, the first and second peripheral wall portions 120a, 120b have a common wall portion 122, and the first and second cover plate peripheral portions 184, 194 also have a common peripheral portion 188. The common wall portion 122 is widened with respect to the first and second peripheral wall portions 120a and 120b, and the common peripheral portion 188 is widened with respect to the first and second cover plate peripheral portions 184 and 194, so that the peripheral portion 154 of the first circuit board 150 and the peripheral portion 164 of the second circuit board 160 can be simultaneously received. However, the present invention is not limited thereto, and in other embodiments of the present invention, the first peripheral wall portion 120a and the second peripheral wall portion 120b may not include the common wall portion 122, i.e., they are separated, and/or the first cover plate peripheral portion 184 and the second cover plate peripheral portion 194 may not include the common peripheral portion 188, i.e., they are separated.
In the embodiment shown, the electronics housing 110 and electronics cover 170 are shaped to receive the first circuit board 150 and the second circuit board 160. In other embodiments according to the present invention, the electronic device housing and the electronic device cover plate may have other suitable shapes to receive two circuit boards of other shapes. In some other embodiments according to the invention, the electronic device may accommodate more than two (e.g., three) circuit boards. Accordingly, the electronic device housing may have more than two (e.g., three) circuit board receiving portions, and the electronic device cover may have more than two (e.g., three) cover portions.
The utility model discloses can realize following mode:
item 1: an electronic device, comprising:
an electronic device housing including a first circuit board receiving portion and a second circuit board receiving portion formed on a first side of the electronic device housing;
a first circuit board mounted to the first circuit board receiving part;
a second circuit board mounted to the second circuit board receiving part; and
an electronics cover plate mounted to the first side of the electronics housing for at least partially enclosing the first circuit board and the second circuit board between the electronics housing and the electronics cover plate.
Item 2: the electronic device of item 1, the electronic device housing having a housing base,
wherein the first circuit board receiving portion includes a first peripheral wall portion extending from the housing base portion, the first peripheral wall portion and the housing base portion collectively defining a first chamber, a free end portion of the first peripheral wall portion having a shape and size corresponding to a shape and size of a peripheral portion of the first circuit board such that the free end portion of the first peripheral wall portion engages the peripheral portion of the first circuit board,
wherein the second circuit board receiving portion includes a second peripheral wall portion extending from the housing base, the second peripheral wall portion and the housing base collectively defining a second chamber, a free end of the second peripheral wall portion having a shape and size corresponding to a shape and size of a peripheral portion of the second circuit board such that the free end of the second peripheral wall portion engages the peripheral portion of the second circuit board.
Item 3: the electronic device of any of items 1-2, the first and second peripheral wall portions having a common wall portion, the first and second chambers separated by the common wall portion,
wherein a peripheral portion of the first circuit board and a peripheral portion of the second circuit board are adjacent to each other at the common wall portion.
Item 4: the electronic device of any of items 1-3, the first circuit board comprising electronic components extending at least partially into the first chamber, the second circuit board comprising electronic components extending at least partially into the second chamber.
Item 5: the electronic device of any of items 1-4, the electronic device cover panel comprising a first cover panel portion and a second cover panel portion,
wherein the first cover plate portion includes a first cover plate center portion and a first cover plate peripheral portion having a shape and a size corresponding to those of the peripheral portion of the first circuit board so as to sandwich the peripheral portion of the first circuit board between the first cover plate peripheral portion and the free end portion of the first peripheral wall portion,
wherein the second cover plate portion includes a second cover plate central portion and a second cover plate peripheral portion having a shape and a size corresponding to those of the peripheral portion of the second circuit plate for sandwiching the peripheral portion of the second circuit plate between the second cover plate peripheral portion and a free end portion of the second peripheral wall portion.
Item 6: the electronic device of any of items 1-5, wherein the electronic device is an audio power amplifier, and the first circuit board and the second circuit board are each audio power amplifying circuit boards.
Item 7: the electronic device of any of items 1-6, the electronic device case further comprising heat dissipating fins formed on a second side of the electronic device case opposite the first side.
Item 8: the electronic device of any of items 1-7, the electronic device case comprising one or more bosses formed on the first side of the electronic device case, the one or more bosses thermally coupled with heat-generating elements on the first and/or second circuit boards.
Item 9: the electronic device according to any of items 1 to 8, wherein the electronic device case is an integrally formed metal member, and the electronic device cover is an integrally stamped and formed metal plate.
Item 10: the electronic device according to any of items 1-9, wherein the electronic device comprises a first connection port connected to the first circuit board and a second connection port connected to the second circuit board.
The above description is made for the purpose of illustrating the principles of the present invention and is not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also within the scope of the invention.
Claims (10)
1. An electronic device, comprising:
an electronic device housing including a first circuit board receiving portion and a second circuit board receiving portion formed on a first side of the electronic device housing;
a first circuit board mounted to the first circuit board receiving part;
a second circuit board mounted to the second circuit board receiving part; and
an electronics cover mounted to the first side of the electronics housing for at least partially enclosing the first circuit board and the second circuit board between the electronics housing and the electronics cover.
2. The electronic device of claim 1, wherein said electronic device housing has a housing base,
wherein the first circuit board receiving portion includes a first peripheral wall portion extending from the housing base portion, the first peripheral wall portion and the housing base portion collectively defining a first chamber, a free end portion of the first peripheral wall portion having a shape and size corresponding to a shape and size of a peripheral portion of the first circuit board such that the free end portion of the first peripheral wall portion engages the peripheral portion of the first circuit board,
wherein the second circuit board receiving portion includes a second peripheral wall portion extending from the housing base, the second peripheral wall portion and the housing base collectively defining a second chamber, a free end of the second peripheral wall portion having a shape and size corresponding to a shape and size of a peripheral portion of the second circuit board such that the free end of the second peripheral wall portion engages the peripheral portion of the second circuit board.
3. The electronic device of claim 2, wherein said first peripheral wall portion and said second peripheral wall portion have a common wall portion, said first chamber and said second chamber being separated by said common wall portion,
wherein a peripheral portion of the first circuit board and a peripheral portion of the second circuit board are adjacent to each other at the common wall portion.
4. An electronic device according to claim 2, wherein the first circuit board includes electronic components extending at least partially into the first chamber and the second circuit board includes electronic components extending at least partially into the second chamber.
5. The electronic device of claim 2, wherein the electronic device cover includes a first cover portion and a second cover portion,
wherein the first cover plate portion includes a first cover plate center portion and a first cover plate peripheral portion having a shape and a size corresponding to those of the peripheral portion of the first circuit board so as to sandwich the peripheral portion of the first circuit board between the first cover plate peripheral portion and the free end portion of the first peripheral wall portion,
wherein the second cover plate portion includes a second cover plate center portion and a second cover plate peripheral portion having a shape and a size corresponding to those of the peripheral portion of the second circuit board for sandwiching the peripheral portion of the second circuit board between the second cover plate peripheral portion and the free end portion of the second peripheral wall portion.
6. The electronic device of any of claims 1-5, wherein the electronic device is an audio power amplifier, and wherein the first circuit board and the second circuit board are each audio power amplifying circuit boards.
7. The electronic device of any of claims 1-5, wherein the electronic device housing further comprises heat dissipating fins formed on a second side of the electronic device housing opposite the first side.
8. The electronic device of any of claims 1-5, wherein the electronic device housing comprises one or more bosses formed on the first side of the electronic device housing, the one or more bosses thermally coupled to heat-generating components on the first and/or second circuit boards.
9. The electronic device according to any of claims 1-5, wherein the electronic device housing is a one-piece metal piece and the electronic device cover is a one-piece stamped and formed metal plate.
10. The electronic device according to any of claims 1-5, wherein the electronic device comprises a first connection port connected to the first circuit board and a second connection port connected to the second circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221790561.2U CN217741685U (en) | 2022-07-12 | 2022-07-12 | Electronic device with a detachable cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221790561.2U CN217741685U (en) | 2022-07-12 | 2022-07-12 | Electronic device with a detachable cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217741685U true CN217741685U (en) | 2022-11-04 |
Family
ID=83844280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221790561.2U Active CN217741685U (en) | 2022-07-12 | 2022-07-12 | Electronic device with a detachable cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217741685U (en) |
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2022
- 2022-07-12 CN CN202221790561.2U patent/CN217741685U/en active Active
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