CN217740489U - Turning device and silicon wafer inserting equipment - Google Patents

Abstract

The embodiment of the utility model provides a steering device and silicon wafer inserting equipment, which relate to the technical field of photovoltaic manufacturing, wherein the steering device comprises an adsorption part, a conveyor belt and a driving part; the adsorption piece is used for adsorbing the silicon wafer and comprises a first surface, the first surface is of an arc-shaped structure, and the first surface is the surface of the adsorption piece close to the silicon wafer; the conveying belt is sleeved on the adsorption piece, and a friction increasing structure is arranged on the surface of the conveying belt, which is in contact with the silicon wafer; the driving piece is connected with the conveying belt and used for driving the conveying belt to rotate so as to drive the silicon wafer to move and turn. The friction increasing structure is used for increasing the friction force between the silicon wafer and the belt so as to improve the stability of the silicon wafer in the conveying process, and therefore the abnormal conditions of silicon wafer subfissure, damage and the like caused by the conditions of turning, falling and the like which possibly occur in the conveying process of the silicon wafer are avoided.

Description

Turning device and silicon wafer inserting equipment

Technical Field

The utility model relates to a photovoltaic manufacturing technology field, concretely relates to turn to device and silicon chip inserted sheet equipment.

Background

Photovoltaic power generation has been increasingly emphasized and vigorously developed as one of green energy and main energy for human sustainable development. The silicon wafer is a main production material for photovoltaic power generation, the multi-wire cutting technology of the silicon wafer is an advanced silicon wafer processing technology at present, and a steel wire moving at a high speed drives cutting edge materials attached to the steel wire to rub a silicon rod so as to achieve a cutting effect, so that a lot of cutting liquid, silicon powder and other particles are attached to the silicon wafer after cutting is completed and can be removed only by cleaning. Before cleaning, the silicon wafer is usually needed to be degummed, sliced and the like, the sliced silicon wafer is vertical, and after passing through the steering device, the vertical silicon wafer is changed into a horizontal state so as to be conveyed to a basket for cleaning.

In the process of implementing the present application, the inventors found that at least the following problems exist in the related art: when the existing steering device is used for driving a silicon wafer, the stability is poor, and the silicon wafer can be steered and dropped in the conveying process, so that the silicon wafer is cracked and damaged abnormally.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a turn to device and inserted sheet equipment to solve current device that turns to when the transmission silicon chip, stability is relatively poor, the silicon chip probably appears turning to in the data send process, the circumstances such as drop lead to the silicon chip to be hidden to split, unusual such as damaged.

In order to solve the technical problem, the utility model discloses a realize like this:

in a first aspect, an embodiment of the present invention provides a steering apparatus for silicon wafer inserting device, including: the device comprises an adsorption piece, a conveyor belt and a driving piece;

the adsorption piece is used for adsorbing a silicon wafer and comprises a first surface, the first surface is of an arc-shaped structure, and the first surface is the surface of the adsorption piece close to the silicon wafer;

the conveying belt is sleeved on the adsorption piece, and a friction increasing structure is arranged on the surface of the conveying belt, which is in contact with the silicon wafer;

the driving piece is connected with the conveying belt and used for driving the conveying belt to rotate so as to drive the silicon wafer to move and turn.

Further, the friction enhancing structure includes a plurality of protrusions.

Furthermore, the plurality of protrusions are uniformly arranged on the surface of the conveyor belt, which is in contact with the silicon wafer, so as to be arranged in an array.

Furthermore, a plurality of grooves are formed in the surface, in contact with the silicon wafer, of the conveyor belt, and the grooves are used for guiding out water on the conveyor belt.

Furthermore, along the width direction of conveyer belt, it is a plurality of the recess evenly sets up, and two adjacent lines set up one between the arch the recess.

Further, the steering device further includes: the water removing mechanism comprises an air blowing pipe and a compressed air assembly;

the surface of the air blowing pipe facing the conveyor belt is provided with a plurality of air blowing holes,

and the compressed air assembly is connected with two ends of the air blowing pipe and used for blowing air into the air blowing pipe and discharging the air from the air blowing holes so as to remove residual water stains on the conveying belt.

Further, the steering device further includes: vacuumizing the part;

the adsorption piece further comprises a second surface, the second surface is a surface of the adsorption piece, which is far away from the silicon wafer, and forms a cavity with the first surface, and the second surface is a plane, a bending surface or an arc surface;

a plurality of adsorption holes are formed in the first surface, a plurality of connecting holes are formed in the second surface, and the adsorption holes and the connecting holes are communicated with the cavity;

the vacuumizing piece is connected with each connecting hole so that the silicon wafer is adsorbed on the conveying belt.

Further, the number of the conveyor belts is at least one;

the plurality of adsorption holes are arranged in the area where the conveyor belt is not sleeved on the first surface.

Further, the steering device further comprises a conveying adjusting mechanism;

the driving piece is connected with the conveying adjusting mechanism and used for driving the conveying adjusting mechanism to drive the conveying belt to rotate and adjust the tensioning degree of the conveying belt.

The embodiment of the utility model provides a turn to device has following advantage:

in the embodiment of the utility model, the steering device can be applied to silicon chip insert equipment, and comprises an adsorption piece, a conveyor belt and a driving piece; the adsorption piece is used for adsorbing the silicon wafer and comprises a first surface, the first surface is of an arc-shaped structure, the first surface is the surface of the adsorption piece close to the silicon wafer, the conveying belt is sleeved on the adsorption piece, and the driving piece is connected with the conveying belt and used for driving the conveying belt to rotate so as to drive the silicon wafer to move and turn, so that the silicon wafer can be converted from a vertical state to a horizontal state to be conveyed to the basket for cleaning; the surface of the conveying belt, which is in contact with the silicon wafer, is provided with the friction increasing structure so as to increase the friction force between the silicon wafer and the conveying belt, so that the stability of the silicon wafer in the conveying process is improved, and the silicon wafer is prevented from being hidden and damaged due to the conditions of turning, dropping and the like which may occur in the conveying process.

The embodiment of the utility model provides a second aspect, the embodiment provides a silicon chip inserted sheet equipment, turn to the device including the aforesaid.

The advantages of the silicon chip inserting device are the same as those of the turning device, and the description is omitted here.

Drawings

Fig. 1 is a schematic view of a steering device according to an embodiment of the present invention at a first viewing angle;

fig. 2 is a schematic view of a steering device according to an embodiment of the present invention at a second viewing angle;

fig. 3 is a schematic view of a steering device according to an embodiment of the present invention at a third viewing angle;

fig. 4 is a schematic view of a steering device at a fourth viewing angle according to an embodiment of the present invention;

fig. 5 is a schematic view illustrating a process of turning a silicon wafer in a turning device according to an embodiment of the present invention;

fig. 6 is a schematic diagram of an air blowing pipe in a steering device according to an embodiment of the present invention.

Reference numerals:

1: an adsorbing member; 11: a first surface; 111: an adsorption hole; 12: a second surface; 121: connecting holes; 13: a first side surface; 2: a conveyor belt; 21: a protrusion; 22: a groove; 23: meshing teeth; 3: an air blowing pipe; 31: a gas blowing hole; 4: a drive shaft; 5: a driven shaft; 6: an adjustment shaft; 7: a drive gear; 8: a driven gear; 9: adjusting the gear; 10: a silicon wafer; 100: a water absorption plate; 200: and (5) conveying the belt.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In the embodiment of the present invention, the turning device can be applied to a silicon wafer inserting apparatus, and referring to fig. 1 to 5, the turning device includes an adsorption member 1, a conveyor belt 2, and a driving member; the adsorption piece 1 is used for adsorbing a silicon wafer 10, the adsorption piece 1 comprises a first surface 11, the first surface 11 is of an arc structure, and the first surface 11 is the surface of the adsorption piece 1 close to the silicon wafer 10; the conveying belt 2 is sleeved on the adsorption piece 1, and a friction increasing structure is arranged on the surface of the conveying belt 2, which is in contact with the silicon wafer 10; the driving part is connected with the conveyor belt 2 and used for driving the conveyor belt 2 to rotate so as to drive the silicon wafer 10 to move and turn. The friction increasing structure of the embodiment is used for increasing the friction force between the silicon wafer 10 and the conveyor belt 2, so that the stability of the silicon wafer 10 in the conveying process is improved, and the silicon wafer 10 is prevented from being hidden and damaged due to the conditions of turning, dropping and the like possibly occurring in the conveying process of the silicon wafer 10.

In practice, after the silicon wafer inserting apparatus separates the stacked silicon wafers 10 in the wafer inserting tank, as shown in fig. 5, the separated silicon wafers 10 are adsorbed on the water suction plate 100, and the silicon wafers 10 are in a vertical state, and then, the silicon wafers are turned into a horizontal state by the turning device, and are transferred onto the transfer belt 200, and are transferred to the basket placing region by the transfer belt 200, so that the silicon wafers 10 are inserted into the basket for cleaning. It should be noted that the stacked silicon wafers 10 are in a vertical state in the wafer inserting water tank, and the silicon wafers are generally in a vertical state after being sliced, but since slicing is generally realized by spraying through a spray head, the silicon wafers 10 after being sliced may be in a vertical state, and may be in a state close to the vertical state (as shown in fig. 5), and the vertical state is taken as an example to be described below.

Specifically, as shown in fig. 1, the turning device includes an absorption member 1, and the absorption member 1 is obliquely fixed on a substrate of the silicon wafer inserting apparatus and is located above the water absorption plate 100. The adsorption member 1 comprises a first surface 11, as shown in fig. 5, the first surface 11 is a surface of the adsorption member 1 close to the silicon wafer 10, and can also be understood as an upper surface of the adsorption member 1, wherein the first surface 11 of the adsorption member 1 is in an arc structure, specifically, along an arc shape bending towards the second surface 12. The second surface 12 is inclined relative to the horizontal plane, and the inclined angle may be 35 degrees, 40 degrees or other angles, and the specific inclined angle is set according to actual conditions.

Specifically, as shown in fig. 1, the conveyor belt 2 is sleeved on the adsorbing member, and the driving member is connected to the conveyor belt 2. As shown in fig. 5, when the silicon wafer 10 on the suction plate 100 is transferred upwards, the silicon wafer 10 first reaches the bottom of the turning device, at this time, the suction member 1 can make the silicon wafer 10 be sucked onto the conveyor belt 2, and when the driving member drives the conveyor belt 2 to rotate, the conveyor belt 2 drives the silicon wafer 10 to move and turn, and in practice, the silicon wafer 10 is transferred upwards along an arc-shaped structure, and gradually changes from a vertical turning state to a horizontal state to be transferred onto the conveyor belt 200.

Specifically, as shown in fig. 1 to 5, a friction increasing structure is disposed on a surface of the conveyor belt 2 contacting the silicon wafer 10, and the friction force between the silicon wafer 10 and the conveyor belt 2 can be increased by the friction increasing structure, so that when the conveyor belt 2 rotates, the stability of the silicon wafer 10 during the conveying process can be improved, and the silicon wafer 10 is prevented from being cracked and damaged due to possible situations such as turning and dropping during the conveying process. Wherein the surface of the conveyor belt 2 contacting the silicon wafer 10 can be referred to as the front surface of the conveyor belt 2, and the surface of the conveyor belt 2 opposite to the front surface can be referred to as the back surface of the conveyor belt 2, and in practice, the back surface of the conveyor belt 2 contacts the surface of the adsorption member 1.

In the embodiment of the present invention, as shown in fig. 1 to 5, the friction increasing structure includes a plurality of protrusions 21.

Specifically, as shown in fig. 1 to 5, in the present embodiment, a plurality of protrusions 21 may be disposed on the surface of the conveyor belt 2 contacting the silicon wafer 10, so that the surface roughness of the surface of the conveyor belt 2 contacting the silicon wafer 10 is increased, the friction between the silicon wafer 10 and the conveyor belt 2 is increased, and meanwhile, the silicon wafer 10 is prevented from being damaged. As shown in fig. 2 to fig. 5, each protrusion 21 is shaped like a hemisphere (which may be called a small bump), the shape of the protrusion 21 of this embodiment is not limited thereto, and the protrusion may also be shaped like a pattern, a V-shape, or an S-shape, and the specific shape of the protrusion 21 of this embodiment may not be limited, and may be set according to actual requirements. The following description will be made with the protrusion 21 being in the shape of a hemisphere.

Specifically, as shown in fig. 2 and 3, the plurality of protrusions 21 are uniformly disposed on the surface of the conveyor belt 2 contacting the silicon wafer 10, so that the plurality of protrusions 21 are arranged in an array. In practice, the array includes rows and columns, in this embodiment, a plurality of protrusions 21 may be uniformly disposed on the entire front surface of the conveyor belt 2, and the distance between two adjacent rows of protrusions 21 and the distance between two adjacent columns may be set according to parameters such as the width of the conveyor belt 2, which is not limited in this embodiment, and in fig. 2 and 3, 8 columns are disposed on one conveyor belt 2 in the width direction of the conveyor belt 2. It should be noted that, in this embodiment, the plurality of protrusions 21 may be uniformly disposed only in the area where the conveyor belt 2 contacts the silicon wafer 10, and may be specifically set according to actual situations.

It should be noted that the plurality of small bumps in each column may be replaced by a strip-shaped protrusion, and the strip-shaped protrusion may have other curved shapes such as a straight line and an S-shape.

In the embodiment of the present invention, as shown in fig. 2 and fig. 3, a plurality of grooves 22 are further disposed on the surface of the conveyor belt 2 contacting the silicon wafer 10, and the grooves 22 are used for guiding out water on the conveyor belt 2.

In practice, after the silicon wafer 10 is separated, some water is still present on the surface thereof, and in order to guide the water on the surface of the silicon wafer 10 out to further increase the friction between the silicon wafer 10 and the conveyor belt 2, the present embodiment is further provided with a plurality of grooves 22 on the front surface of the conveyor belt 2. The grooves 22 are recessed with respect to the front surface of the conveyor belt 2, and water on the silicon wafer 10 is collected in the grooves 22 and flows down along the grooves 22 according to the principle of "water goes down".

In the embodiment of the present invention, as shown in fig. 2 and 3, along the width direction of the conveyor belt 2, a plurality of grooves 22 are uniformly arranged, and two adjacent rows of the grooves 22 are arranged between the protrusions 21.

Specifically, as shown in fig. 2 and 3, one groove 22 is provided between two adjacent rows of projections 21 in the left-right direction, and the width of the groove 22 is equal to or less than the distance between two adjacent rows of projections 21. With this arrangement, water on the surface of the silicon wafer 10 can be collected into the grooves 22 as much as possible and can flow down the grooves 22. Of course, a row of protrusions 21 may be disposed between two adjacent rows of grooves 22, and the specific disposition positions of the plurality of grooves 22 may be set according to the structure of the protrusions 21, in short, the protrusions 21 and the grooves 22 in a row may be disposed in a staggered manner.

In the embodiment of the present invention, as shown in fig. 1, the steering device further includes: a water removal mechanism; the water removing mechanism is used for removing residual water stains on the conveyor belt 2 so as to increase the friction force between the silicon wafer 10 and the conveyor belt 2.

In fact, after the grooves 22 guide out the water on the surface of the silicon wafer 10, the surface of the silicon wafer 10 may still have residual water stains, and therefore, the present embodiment is further provided with a water removing mechanism to remove the residual water stains on the surface of the silicon wafer 10, so as to further increase the friction force between the silicon wafer 10 and the conveyor belt 2.

In the embodiment of the present invention, as shown in fig. 1, the water removing mechanism includes an air blowing pipe 3 and a compressed air assembly; a plurality of air blowing holes 31 are formed in the surface, facing the conveyor belt 2, of the air blowing pipe 3, and the compressed air assembly is connected with the two ends of the air blowing pipe 3 and used for blowing air into the air blowing pipe 3 and discharging the air from the air blowing holes 31 to remove residual water stains on the conveyor belt 2.

Specifically, as shown in fig. 1, the blowing pipe 3 can be fixed on the adsorption member 1 through a bracket, and can also be fixed on a base of the silicon wafer inserting device through a bracket, which can be set in an actual situation, and if the blowing pipe is set on the adsorption member 1, the blowing pipe cannot influence the rotation of the conveyor belt 2. Wherein, gas blow pipe 3 is a hollow pipeline, and the compressed air subassembly can include air compressor, compressed air saving tank and connecting pipe, and air compressor can be connected with the compressed air saving tank through the connecting pipe, and the compressed air saving tank can be connected with the both ends of gas blow pipe 3 respectively through the connecting pipe. As shown in fig. 5, a plurality of air blowing holes 31 are provided on the surface of the air blowing pipe 3 facing the conveyor belt 2, so that when the steering device is in an operating state, the air compressor produces compressed air, so that the compressed air can blow into the air blowing pipe 3, and the air in the air blowing pipe 3 is discharged from the air blowing holes 31 to blow to the front surface of the conveyor belt 2, so as to remove the residual water stain on the front surface of the conveyor belt 2.

It should be noted that fig. 1 shows one blowpipe 3, in practice, a plurality of blowpipes 3 may be provided, and the specific number of blowpipes 3 in this embodiment may not be limited, and may be specifically set according to actual requirements.

In an embodiment of the present invention, the steering device further includes: vacuumizing the part; the adsorption piece 1 further comprises a second surface 12, the second surface 12 is a surface of the adsorption piece 1 departing from the silicon wafer 10 and forms a cavity with the first surface 11 in a surrounding mode, and the second surface 12 is a plane, a bending surface or an arc-shaped surface; a plurality of adsorption holes 111 are formed in the first surface 11, a plurality of connection holes 121 are formed in the second surface 12, and the adsorption holes 111 and the connection holes 121 are communicated with the cavity; the vacuum-pumping member is connected to each of the connection holes 121 so that the silicon wafer 10 is adsorbed on the conveyor belt 2.

Specifically, the suction member 1 further includes a second surface 12 opposite to the first surface 11, as shown in fig. 5, the second surface 12 is a surface of the suction member 1 away from the silicon wafer 10, and referring to fig. 1 and 2, the first surface 11 is an upper surface of the suction member 1, and the second surface 12 is a lower surface of the suction member 1. The second surface 12 may be a plane, a bending surface, or an arc surface, and forms a cavity with the first surface 11.

In practice, as shown in fig. 1, the absorbent member 1 further comprises a first side 13 and a second side, which are opposite to each other, and the first side 13 and the second side are connected together by the first surface 11 and the second surface 12, and the first surface 11, the second surface, the first side 13 and the second side enclose a box structure to form a cavity, wherein the second surface is a plane.

Specifically, as shown in fig. 1 and 2, the first surface 11 of the suction member 1 is provided with a plurality of suction holes 111, and as shown in fig. 3, the second surface 12 of the suction member 1 is provided with a plurality of connection holes 121. Since the first surface and the second surface enclose a cavity, the plurality of adsorption holes 111 and the plurality of connection holes 121 are communicated with the cavity.

In practice, the vacuumizing member may be connected to each of the connection holes 121 through an air pipe, so that when the turning device is in an operating state, the vacuumizing member may exhaust air in the cavity through the air pipe to make the plurality of adsorption holes 111 in a negative pressure state, and after the silicon wafer 10 is transferred to the conveyor belt 2, the adsorption holes 111 may adsorb the silicon wafer 10 to make the silicon wafer 10 stably adsorbed on the front surface of the conveyor belt 2. The vacuumizing part can be fixed on a base of the silicon wafer inserting device, and can be a high-pressure air suction pump, a vacuum pump or other devices capable of being vacuumized.

In the embodiment of the present invention, the number of the conveyor belts 2 is at least one; the plurality of suction holes 111 are disposed in a region of the first surface 11 where the conveyor belt 2 is not sleeved.

Specifically, as shown in fig. 1, the number of the conveyor belts 2 may be two, and the two conveyor belts 2 are symmetrical with respect to the center plane of the suction member 1 in the width direction thereof (the left-right direction shown in fig. 1). In the non-operating state of the diverting means, i.e. with the conveyor belt 2 stationary, a portion of the conveyor belt 2 abuts against the first surface 11 of the suction member 1. In this case, the plurality of adsorption holes 111 are uniformly formed in the middle region of the first surface 11 of the adsorption member 1 (the region where the two conveyor belts 1 are not attached to the first surface 11), and as can be seen from fig. 1, the plurality of adsorption holes 111 are located between the two conveyor belts 2, and it can also be understood that the two conveyor belts 2 are located on both sides of the middle region of the adsorption member 1. Thus, the silicon wafer 10 can be attached to the conveyor 2 in each region, and the stability of the silicon wafer 10 can be further improved.

As shown in fig. 3, the second surface 12 of the suction member 1 shows 4 connection holes 121, and the specific number of the connection holes 121 is not limited to 4, and may also be 3, 5, etc., and may be determined according to the actual number.

It should be noted that, besides the two conveyor belts 2 shown in fig. 1, the number of the conveyor belts 2 may also be 1, and the conveyor belts 2 may be sleeved on the middle region of the adsorbing member 1, in this case, the plurality of adsorbing holes 111 are disposed on the region of the first surface of the adsorbing member 1 except the middle region, and the plurality of connecting holes are disposed on the region of the second surface 12 of the adsorbing member 1 except the middle region.

In an embodiment of the present invention, the steering device further includes: a delivery adjustment mechanism; the driving piece is connected with the conveying adjusting mechanism and used for driving the conveying adjusting mechanism to drive the conveying belt 2 to rotate and adjusting the tensioning degree of the conveying belt 2.

As shown in fig. 2, the transmission adjusting mechanism may include a driving shaft 4, a driven shaft 5, a driving gear 7 and a driven gear 8, wherein the driving shaft 4 and the driven shaft 5 are respectively and fixedly disposed through the adsorbing member 1, and as can be seen from fig. 2, the driving shaft 4 is close to the rear end of the adsorbing member 1, and the driven shaft 5 is close to the front end of the adsorbing member 1. Both the driving shaft 4 and the driven shaft 5 are fixed to the suction attachment 1, i.e. no relative displacement occurs. In the left and right directions, two ends of the driving shaft 4 respectively extend out of a first side surface 13 (right side surface) and a second side surface (left side surface) of the adsorption piece 1, two ends of the driving shaft 4 are respectively sleeved with a driving gear 7, and the driving gear 7 can rotate relative to the driving shaft 4; the two ends of the driven shaft 5 respectively extend out of the first side surface 13 and the second side surface of the adsorption part 1, the two ends of the driven shaft 5 are respectively sleeved with a driven gear 8, and the driven gear 8 can rotate relative to the driven shaft 5.

As shown in fig. 1 to 3, the following description will be made with reference to a center plane of the suction member 1 in the width direction thereof, and with reference to the conveyor belt 2 on the right side of the center plane: one part of the right-side conveyor belt 2 is sleeved on the adsorption piece 1, the other part of the right-side conveyor belt 2 extends out of the right side face of the adsorption piece 1, and the back face of the extending part of the right-side conveyor belt 2 is meshed and connected with the right-side driving gear 7 and the right-side driven gear 8. Similarly, a part of the left conveyor belt 2 is respectively sleeved on the adsorption element 1, the other part of the left conveyor belt 2 extends out of the left side surface of the adsorption element 1, and the back surface of the extended part of the left conveyor belt 2 is meshed and connected with the left driving gear 7 and the left driven gear 8.

As shown in fig. 1, 4, and 5, the transmission adjusting mechanism further includes an adjusting shaft 6, the driven shaft 5 and the adjusting shaft 6 are both located below the driving shaft 4 in the vertical direction, and the adjusting shaft 6 is located on a side of the driving shaft 4 away from the driven shaft 5 in the front-rear direction shown in the drawings, that is, the driving shaft 4 is located between the adjusting shaft 6 and the driven shaft 5. The conveyor belt 2 is also sleeved on the adjusting shaft 6 and is meshed and connected with the adjusting shaft 6. As shown in fig. 4 and 5, the conveyor belt 2 is bent into three regions, an arc region contacting the first surface of the suction member 1, a transition region opposite to the arc region, and a water removal region connecting the arc region and the transition region, in fig. 1, the water removal region is located at the rear side of the suction member 1, the arc region is located at the upper side of the suction member 1, and the transition region is located at the lower side of the suction member 1.

In practice, since water on the surface of the silicon wafer 10 flows down along the grooves 22, and thus a part of the water flows into the water removal region, when the conveyor belt 2 is in a stationary state, the present embodiment arranges the gas blowing pipes 3 on the side of the water removal region (the rear side in fig. 1) away from the adsorbing member 1 and above the adjusting shafts 6. In the air blowing process of the air blowing pipe 3, air is blown from the air blowing holes along the tangential direction of the adjusting shaft 6 and the conveyor belt 2 so as to quickly remove residual water stains on the water removing area of the silicon wafer 10. It should be noted that, when the steering device is in the working state, the conveyor belt 2 is in the rotating state, and the water removing area is changed, that is, as long as the conveyor belt 2 rotates to the water removing area, the residual water stain on the area can be removed by the water removing mechanism.

In practice, the adjusting shaft 6 is detachably connected to the base of the silicon wafer inserting device, and the tightness degree of the conveying belt 2 can be adjusted by adjusting the front and back positions of the adjusting shaft 6. As shown in fig. 4, in order to mesh the rear surface of the conveyor belt 2 with the driving gear 7 and the driven gear 8, the rear surface of the conveyor belt 2 is uniformly provided with a plurality of meshing teeth 23; the adjusting shaft 6 is fixedly sleeved with an adjusting gear 9, and the adjusting gear 9 is also meshed with the meshing teeth 23 on the back surface of the conveyor belt 2.

In practice, the driving member may be a motor, an output shaft of the motor is connected to the driving gear 7, and the rotation of the motor drives the driving gear 7 to rotate, as shown in fig. 5, so as to drive the conveyor belt 2 to rotate, and further drive the silicon wafers 10 on the conveyor belt 2 to move and turn to turn so as to be converted into a horizontal state.

The embodiment of the utility model provides a turn to device has following advantage:

in the embodiment of the utility model, the steering device can be applied to silicon chip insert equipment, and comprises an adsorption piece, a conveyor belt and a driving piece; the adsorption piece is used for adsorbing the silicon wafer and comprises a first surface, the first surface is of an arc-shaped structure, the first surface is the surface of the adsorption piece close to the silicon wafer, the conveying belt is sleeved on the adsorption piece, and the driving piece is connected with the conveying belt and used for driving the conveying belt to rotate so as to drive the silicon wafer to move and turn, so that the silicon wafer can be converted from a vertical state to a horizontal state to be conveyed to the basket for cleaning; the surface of the conveying belt, which is in contact with the silicon wafer, is provided with the friction increasing structure so as to increase the friction force between the silicon wafer and the conveying belt, so that the stability of the silicon wafer in the conveying process is improved, and the silicon wafer is prevented from being hidden and damaged due to the conditions of turning, dropping and the like which may occur in the conveying process.

The embodiment of the utility model provides a silicon chip inserted sheet equipment, turn to the device including the aforesaid.

Specifically, the silicon wafer inserting device comprises a steering device, and the specific structure and the working principle of the steering device are described in detail above, and are not described herein again.

The advantages of the inserting piece equipment are the same as those of the turning device, and are not described again here.

It should be noted that, in this specification, each embodiment is described in a progressive manner, and each embodiment focuses on differences from other embodiments, and portions that are the same as and similar to each other in each embodiment may be referred to.

While alternative embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the true scope of the embodiments of the invention.

Finally, it should also be noted that, in this document, relational terms such as first and second, and the like may be used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or terminal apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or terminal apparatus. Without further limitation, an element defined by the phrases "comprising one of \8230;" does not exclude the presence of additional like elements in an article or terminal device comprising the element. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/", and generally means that the former and latter related objects are in an "or" relationship.

It is right above to the technical scheme that the utility model provides a detailed introduction has been carried out, and it is right to have used specific individual example here the utility model discloses a principle and embodiment have been expounded, simultaneously, to the general technical staff in this field, according to the utility model discloses a principle and implementation all have the change part on concrete implementation and application scope, to sum up, this description content should not be understood as the restriction of the utility model.

Claims (10)

1. The utility model provides a turn to device, is applied to silicon chip inserted sheet equipment, its characterized in that includes: the device comprises an adsorption piece, a conveyor belt and a driving piece;

the adsorption piece is used for adsorbing a silicon wafer and comprises a first surface, the first surface is of an arc-shaped structure, and the first surface is the surface of the adsorption piece close to the silicon wafer;

the conveying belt is sleeved on the adsorption piece, and a friction increasing structure is arranged on the surface of the conveying belt, which is in contact with the silicon wafer;

the driving part is connected with the conveying belt and used for driving the conveying belt to rotate so as to drive the silicon wafers to move and turn.

2. The steering device of claim 1, wherein the friction enhancing structure comprises a plurality of protrusions.

3. The turning device according to claim 2, wherein a plurality of the protrusions are uniformly arranged on the surface of the conveyor belt contacting the silicon wafer in an array.

4. The turning device according to claim 3, wherein the surface of the conveyor belt contacting the silicon wafer is further provided with a plurality of grooves for guiding out water on the conveyor belt.

5. The turning device according to claim 4, wherein a plurality of the grooves are uniformly arranged in the width direction of the conveyor belt, and one groove is arranged between two adjacent rows of the projections.

6. The steering device according to claim 1, characterized by further comprising: the water removal mechanism comprises an air blowing pipe and a compressed air assembly;

a plurality of air blowing holes are formed in the surface, facing the conveyor belt, of the air blowing pipe;

the compressed air assembly is connected with two ends of the air blowing pipe and used for blowing air into the air blowing pipe and discharging the air from the air blowing holes so as to remove residual water stains on the conveying belt.

7. The steering device according to claim 1, characterized by further comprising: vacuumizing the part;

the adsorption piece also comprises a second surface, the second surface is the surface of the adsorption piece departing from the silicon wafer and forms a cavity with the first surface, and the second surface is a plane, a bending surface or an arc surface;

a plurality of adsorption holes are formed in the first surface, a plurality of connecting holes are formed in the second surface, and the adsorption holes and the connecting holes are communicated with the cavity;

the vacuumizing piece is connected with each connecting hole so that the silicon wafer is adsorbed on the conveying belt.

8. The steering device according to claim 7, wherein the number of the conveyor belts is at least one;

the plurality of adsorption holes are arranged in the area where the conveyor belt is not sleeved on the first surface.

9. The steering device according to claim 1, characterized in that the steering device further comprises: a delivery adjustment mechanism;

the driving piece is connected with the conveying adjusting mechanism and used for driving the conveying adjusting mechanism to drive the conveying belt to rotate and adjust the tensioning degree of the conveying belt.

10. A silicon wafer inserting apparatus comprising the turning device according to any one of claims 1 to 9.

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