CN217740394U

CN217740394U - Button structure and have its earphone

Info

Publication number: CN217740394U
Application number: CN202221488041.6U
Authority: CN
Inventors: 杨坤; 杨桧; 付丰鸿
Original assignee: Tai Shen Technology Shenzhen Co ltd
Current assignee: Tai Shen Technology Shenzhen Co ltd
Priority date: 2022-06-14
Filing date: 2022-06-14
Publication date: 2022-11-04
Anticipated expiration: 2032-06-14

Abstract

The application provides a key structure. The key structure comprises a shell, a pressing area is formed on the shell; the supporting part is arranged in the shell, the front plate surface of the supporting part is used for arranging a circuit component, and a supporting plane which is opposite to the pressing area and is parallel to the side surface of the supporting part is formed on the supporting part; a pressing assembly which is abutted against the inner side wall of the pressing area is arranged on the supporting plane, the pressing assembly comprises an elastic piece, a pressure sensor and a flexible circuit board which are arranged in a stacked mode, and the flexible circuit board is electrically connected with the pressure sensor and the circuit component respectively; the vertical distance between the supporting plane and the side wall of the supporting part is smaller than the thickness of the pressing component. The key structure provided by the application has the advantage that the occupied space in the electronic equipment is smaller. The application also correspondingly provides the earphone with the key structure.

Description

Button structure and have its earphone

Technical Field

The application belongs to the technical field of electronic equipment, more specifically relates to a button structure and have its earphone.

Background

Nowadays, the trend of electronic equipment volume miniaturization is more obvious, for example smart mobile phone, smart watch and wireless earphone, and, this kind of equipment also has the trend towards waterproof dustproof direction development, therefore, in this kind of electronic equipment, its button also gradually adopts pressure sensor's form, pressure change through pressure sensor comes control signal output, so, its button structure only needs to set up corresponding region of pressing on the shell, need not the entity button and can realize function control, thereby avoid setting up the gap production on the entity button leads to the electronic equipment shell, dustproof waterproof performance has then been influenced, the assembly degree of difficulty has also been increaseed under the miniaturized condition.

However, in the related electronic device adopting the pressure sensor key structure, in order to facilitate the assembly of the pressure sensor, a support with a larger volume is often required, so that the internal space of the electronic device is still occupied during the assembly, and the miniaturization of the electronic device is affected, and this defect is particularly obvious on a TWS (True Wireless Stereo) earphone.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide a key structure and an earphone with the same, so as to solve the technical problem that a case structure in the prior art occupies a large space inside a shell of an electronic device.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: there is provided a key structure including:

a housing on which a pressing area is formed;

the supporting part is arranged in the shell, the front plate surface of the supporting part is used for arranging a circuit component, and a supporting plane which is opposite to the pressing area and is parallel to the side surface of the supporting part is formed on the supporting part; a pressing assembly which is abutted against the inner side wall of the pressing area is arranged on the supporting plane, the pressing assembly comprises an elastic piece, a pressure sensor and a flexible circuit board which are arranged in a stacked mode, and the flexible circuit board is electrically connected with the pressure sensor and the circuit component respectively; the vertical distance between the supporting plane and the side wall of the supporting part is smaller than the thickness of the pressing component.

Optionally, the elastic member is any one of a silicone member, an elastic sheet or a spring.

Optionally, the elastic modulus at the pressing area on the housing is greater than the elastic modulus of the elastic member.

Optionally, the supporting portion includes a PCB, a front surface of the PCB is used for arranging circuit components, and the supporting plane is disposed on the PCB.

Optionally, the supporting portion includes a supporting frame and a PCB stacked on the supporting frame, and a front surface of the PCB is used for arranging circuit components; the support plane is arranged on the support frame or the PCB, or the support plane is arranged between the support frame and the PCB.

Optionally, a groove is disposed on one side of the support portion, and a groove bottom of the groove is the support plane.

Optionally, a support platform is disposed on the support portion, and the support plane is formed on the support platform.

Optionally, a projection of the elastic member on the supporting plane in a direction perpendicular to the pressing area is located in the supporting plane.

Optionally, the pressure sensor is stacked between the flexible circuit board and the elastic member; the key structure also comprises a reinforcing piece, wherein the reinforcing piece is attached to the surface of one side of the flexible circuit board, which is far away from the pressure sensor; in the assembled state, the reinforcement abuts against an inner side surface of the pressing region.

Correspondingly, the application also provides an earphone, which comprises the key structure, wherein the shell is a component of the shell of the earphone.

The application provides a button structure has following beneficial effect at least:

the supporting structure is provided with the supporting plane parallel to the side face of the supporting part, so that the front face of the supporting part can be used for arranging circuit components, the utilization rate of the supporting part can be improved, the using number of the supports in the shell is reduced, and the assembly space required in the shell is favorably reduced; perpendicular distance between the side of supporting plane and supporting part slightly is less than the thickness of pressing the subassembly, so, after pressing the subassembly on the supporting plane, under the assembled state, under the prerequisite that the subassembly supports subsides with the inside wall that presses down the region better guaranteeing to press, can reduce the clearance between supporting part and the casing inside wall, further improve the inside space utilization of casing, make casing inner structure compacter, thereby be favorable to further realizing the miniaturization of button structure.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

FIG. 1 is a partial cross-sectional view of a key structure according to some embodiments of the present application;

FIG. 2 is an exploded view of a pressing assembly in some embodiments of the present application;

FIG. 3 is a perspective view of a pressing assembly according to some embodiments of the present application;

fig. 4 is a perspective view of a key assembly mounted on a support portion according to some embodiments of the present application;

FIG. 5 is a perspective view of a support portion according to some embodiments of the present application;

FIG. 6 is a perspective view of a support portion of other embodiments of the present application;

FIG. 7 is a perspective view of a support portion in accordance with still other embodiments of the present application;

FIG. 8 is a perspective view of a support portion in accordance with still other embodiments of the present application.

Wherein, in the figures, the respective reference numerals:

100. a housing; 110. a pressing area;

200. a support portion; 210. a groove; 220. a support platform; 200a, a support frame; 200b, a PCB;

300. a pressing assembly; 310. an elastic member; 320. a pressure sensor; 330. a flexible circuit board; 340. a reinforcement;

a. a support plane.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 to 8 together, a key structure provided in an embodiment of the present application will be described. The key structure comprises:

a housing 100 having a pressing region 110 formed on the housing 100;

a support part 200 arranged in the casing 100 for arranging circuit components, wherein a support plane a facing the pressing area 110 and parallel to the side surface of the support part 200 is formed on the support part 200; the supporting plane a is provided with a pressing assembly 300 which is abutted against the inner side wall of the pressing area 110, the pressing assembly 300 comprises an elastic member 310, a pressure sensor 320 and a flexible circuit board 330 which are arranged in a laminating and bonding mode, and the flexible circuit board 330 is electrically connected with the pressure sensor 320 and a circuit component.

It is further understood that the vertical distance between the supporting plane a and the sidewall of the supporting portion 200 is smaller than the thickness of the pressing assembly 300. Specifically, the vertical distance between the supporting plane a and the sidewall of the supporting portion 200 is only slightly smaller than the thickness of the pressing assembly 300, and the vertical distance between the supporting plane a and the sidewall of the supporting portion 200 only needs to satisfy that the pressure sensor 320 can clearly sense the pressure change on the pressing area 110.

It is understood that the shape of the housing 100 depends on its application scenario. For example, in a design scenario of the TWS headset, the housing 100 may be a hollow cylinder, such as a cylinder or a cylinder with an irregular cross section. Inside the casing 100, various circuit components and batteries, such as a controller, a sensor, a noise reduction module, a wireless connection module, and the like, are provided.

In the following embodiments, the case 100 is exemplified as a hollow cylindrical shape.

Specifically, referring to fig. 1, a pressing area 110 is formed on the housing 100, and the pressing area 110 is used for being pressed by a finger of a user, so that the pressure applied on the pressing area 110 is transmitted to the pressing element 300 inside the housing 100, and the pressure sensor 320 in the pressing element 300 is pressed to generate an electrical signal, thereby implementing function control of the control module installed inside the housing 100.

Further, referring to fig. 1, it can be understood that the outer surface of the casing 100 located in the pressing area 110 may be a plane or a curved surface with a slight curvature, and preferably, the outer surface of the pressing area 110 is a plane, so that after the user presses the pressing area 110, the pressure can be directly transmitted to the pressing component 300 inside the casing 100, thereby improving the pressing accuracy of the user. Meanwhile, it should be understood that the inner sidewall of the pressing area 110 is also a plane, so that the stability of the pressing assembly 300 when the pressing assembly 300 abuts against the inner sidewall of the pressing area 110 can be improved, the assembly of the pressing assembly 300, the supporting portion 200 and the housing 100 can be facilitated, and the assembly accuracy can be improved.

It is understood that, referring to fig. 1, the supporting portion 200 is disposed inside the casing 100 as a supporting carrier for various circuit components inside the casing 100. Specifically, since the support portion 200 is plate-shaped, and the length and width thereof are much greater than the thickness thereof, and the front plate surface of the support portion 200 serves as the installation position of the circuit component, the support portion 200 is generally installed at the maximum diameter inside the casing 100 when being assembled inside the casing 100, so that the area of the region on the support portion 200 where the electronic component is installed can be effectively increased, and various electronic components can be accommodated as much as possible.

It will be appreciated that, with reference to fig. 1, in the assembled state, the pressing assembly 300 needs to abut against the inner side wall of the pressing region 110 so that the pressure sensor 320 can sensitively sense the pressure change. In order to enable the pressure sensor 320 to sensitively sense the pressure change on the pressing area 110, the elastic member 310 is disposed in the pressing assembly 300, the elastic member 310 is disposed on the side of the pressure sensor 320 far away from the inner side wall of the pressing area 110, and in an assembled state, the elastic force of the elastic member 310 pushes the pressure sensor 320 to move toward a direction close to the pressing area 110, so that the pressing assembly 300 can closely abut against the pressing area 110, the generation of a gap between the pressing assembly 300 and the pressing area 110 is reduced, and the sensing accuracy of the pressure sensor 320 is improved.

Generally, the thicknesses of the pressure sensor 320, the flexible circuit board 330 and the elastic member 310 are small, that is, the thickness of the pressing assembly 300 is small, so that the longitudinal space (longitudinal direction, i.e., a direction perpendicular to the pressing region 110) required by the pressing assembly 300 is small when assembling. Therefore, if the width direction of the supporting portion 200 is parallel to the direction perpendicular to the pressing area 110, compared to the case where the width direction of the supporting portion 200 is perpendicular to the direction perpendicular to the pressing area 110, the number of brackets required for assembly and the number of fasteners required for assembly are much smaller than those of the fasteners required for assembly in the assembly process of the pressing assembly 300, so that the assembly difficulty can be simplified, and the assembly efficiency and the assembly yield can be improved.

In view of the above, in the present application, the front plate surface of the supporting portion 200 is provided with a supporting plane a for providing the pressing member 300. Thus, the pressing member 300 is directly disposed on the supporting portion 200, so that a very limited assembly space inside the casing 100 can be saved, thereby facilitating an improvement of space utilization, making the internal structure of the casing 100 more compact, and realizing a miniaturization of the key structure.

Further, a support plane a is disposed at a side close to the support portion 200, and meanwhile, the support plane a is parallel to the side wall of the support portion 200; also, it should be noted that the vertical distance between the supporting plane a and the sidewall of the supporting portion 200 is slightly smaller than the thickness of the pressing assembly 300. Specifically, the minimum interval between the side of the supporting portion 200 and the pressing area 110 only needs to be slightly larger than the preset compression stroke of the elastic member 310 in the pressing assembly 300. Since the longitudinal space required for assembling the pressing assembly 300 is relatively small, the minimum distance between the side edge of the supporting portion 200 and the pressing region 110 only needs to be slightly larger than the preset compression stroke of the elastic member 310 in the pressing assembly 300 during assembling, and the area of the supporting portion 200 for disposing electronic components can be increased in the same assembling space, so as to improve the space utilization rate.

Further, referring to fig. 5 to 8, the supporting plane a may be a groove bottom plane of the groove 210 disposed on the side of the supporting portion 200, or may be formed on the supporting platform 220 protruded on the front or back of the supporting portion 200, and particularly, but not limited thereto, it is only necessary to form the supporting plane a thereon for accommodating the pressing assembly 300. Furthermore, the supporting plane a and the supporting portion 200 are integrally formed, so that the number of the fasteners during assembly can be reduced, the number of parts to be processed is reduced, the assembly process is simplified, the assembly precision is improved, and the assembly cost is reduced.

In summary, the key structure of the present application, with such an arrangement, the assembly space required by the pressing component 300 thereon is smaller, and in the same space inside the casing 100, the supporting portion 200 can be arranged as large as possible, so as to assemble more electronic components and improve the utilization rate of the space.

It will be appreciated that in the assembled state, the resilient member 310 is in a compressed state. Therefore, the elastic member 310 can maintain effective elastic force, so as to push the pressing element 300 to cling to the inner side wall of the pressing area 110, thereby reducing the generation of a gap between the pressing area 110 and the pressing element 300, improving the sensing accuracy of the pressure sensor 320, and finally improving the performance reliability of the key structure.

Further, in some embodiments of the present application, the elastic member 310 is any one of a silicone member, an elastic sheet, or a spring. Specifically, a suitable type of the elastic member 310 can be selected according to the actual situation, and preferably, the elastic member 310 is a silica gel member, so that the assembly mode of the silica gel member is simple, the displacement is not easy to occur during assembly, and the assembly precision is controllable.

In some embodiments of the present application, the elastic modulus at the pressing area 110 on the housing 100 is greater than the elastic modulus of the elastic member 310.

It is understood that, when the user presses the pressing area 110, the deformation of the pressing area 110 on the housing 100 is much smaller than that of the elastic member 310. Therefore, on one hand, the phenomenon that the deformation of the pressing area 110 is too large due to too large pressing force, so that the deformation of the pressing area 110 is larger than that of the elastic piece 310, and the elastic piece 310 cannot absorb the pressure well, so that the pressure sensor 320 is damaged due to the transmission of the larger pressure, and the service life of the pressure sensor 320 is prolonged; on the other hand, the elastic member 310 has a small elastic modulus, so that it can provide sufficient elastic force to make the pressing member 300 continuously abut against the pressing area 110, thereby improving the sensing accuracy of the pressure sensor 320.

In some embodiments of the present application, please refer to fig. 5 to 8, the supporting portion 200 includes a PCB 200b or a supporting frame 200a, a front surface of the PCB 200b is used for disposing circuit components; or, the supporting portion 200 includes a supporting frame 200a and a PCB 200b stacked on the supporting frame 200a, and similarly, the front surface of the PCB 200b is used for arranging circuit components.

It is understood that, in some embodiments, the supporting part 200 is a PCB board 200b disposed inside the housing 100. Specifically, the support plane a may be disposed in the following manner: a groove 210 is formed in one side of the PCB 200b, the depth direction of the groove 210 is the width direction of the PCB 200b, the width direction of the groove 210 is the thickness direction of the PCB 200b, and the length direction of the groove 210 is the length direction of the PCB 200b, so that the bottom plane of the groove 210 is the support plane a; or, a supporting platform 220 is disposed on the PCB 200b, the supporting platform 220 is disposed on the front surface and/or the back surface of the PCB 200b near one side thereof, and a plane of the supporting platform 220 facing the pressing area 110 is a supporting plane a; or, a groove 210 is formed in one side of the PCB 200b, and meanwhile, a supporting platform 220 is also disposed on the PCB 200b, and a plane of one side of the supporting platform 220, which faces the pressing area 110, is communicated with a plane of a bottom of the groove 210.

Or, in some embodiments, referring to fig. 8, the supporting portion 200 is a PCB 200b and a supporting frame 200a disposed inside the housing 100, the PCB 200b is stacked on the supporting frame 200a, and the supporting frame 200a is fixedly disposed inside the housing 100. In this way, the stability of the support portion 200 in supporting the pressing member 300 can be increased. In this arrangement, the grooves 210 are disposed on the same side of the PCB 200b and the supporting frame 200a, similarly, the depth direction of the grooves 210 is the width direction of the PCB 200b, the width direction of the grooves 210 is the thickness direction of the PCB 200b, and the length direction of the grooves 210 is the length direction of the PCB 200b, meanwhile, the supporting frame 200a is disposed with the supporting platform 220, the plane of the supporting platform 220 is communicated with the groove bottom of the grooves 210 on the supporting frame 200a and the groove bottom of the grooves 210 on the PCB 200b, and at this time, the supporting plane a is a plane formed by the communication of the groove bottom plane of the grooves 210 on the supporting frame 200a, the plane of the supporting platform 220, and the groove bottom plane of the grooves 210 on the PCB 200b.

Through such arrangement, during assembly, because the PCB board 200b is fixedly arranged inside the housing 100, the number of the supporting frames 200a required by the pressing assembly 300 can be saved, the assembly space required by the pressing assembly 300 is further saved, the space inside the housing 100 is more compact, and the space utilization rate inside the housing 100 is improved; meanwhile, because the PCB 200b is provided with circuit components and various electrical signal interfaces, when the PCB 200b is designed, the pressure electrical signal interfaces on the PCB can be made to be close to the supporting plane a as much as possible through improved design, so that the setting length of the flexible circuit board 330 in the pressing assembly 300 can be reduced, the bending times of the flexible circuit board 330 can also be reduced, and the collision interference between the bent part on the flexible circuit board 330 and other electronic components in the shell 100 during assembly can be avoided, thereby being beneficial to reducing the assembly difficulty.

Further, referring to fig. 4, along a direction perpendicular to the pressing area 110, a projection of the elastic element 310 on the supporting plane a is located in the supporting plane a. With such an arrangement, when the supporting plane a is formed on the bottom plane of the groove 210, a gap can still remain between the elastic element 310 and each side wall of the groove 210 after the assembly is completed, so as to reduce the difficulty of assembling and disassembling the elastic element 310.

In some embodiments of the present application, referring to fig. 1 to 4, the pressure sensor 320 is stacked between the flexible circuit board 330 and the elastic element 310; the key structure further comprises a reinforcing member 340, wherein the reinforcing member 340 is attached to the surface of the flexible circuit board 330 on the side away from the pressure sensor 320; in the assembled state, the reinforcement 340 abuts against the inner side surface of the pressing area 110. The arrangement is convenient for assembling the key structure.

Specifically, the assembly process of the key assembly is generally: firstly, the elastic member 310 is adhered to the supporting plane a of the supporting portion 200, an interface at one end of the flexible circuit board 330 is connected with an interface related to an electronic component on the supporting portion 200 in a welding manner, then the other end of the flexible circuit board 330 is adhered to the pressure sensor 320, the interface is connected with a signal interface of the pressure sensor 320 in a welding manner, and then the pressure sensor 320 and the flexible circuit board 330 which are adhered together are stacked on the elastic member 310, so that the assembly of the key assembly is completed. In the process, since the pressure sensor 320 has a small volume and the flexible circuit board 330 has a small volume and a soft texture, the pressure sensor 320 and the flexible circuit board 330 are difficult to position during the process of bonding the two, and displacement deviation is easy to occur during stacking and bonding, so that the pressure sensor 320 cannot correctly face the pressing area 110 after the two are stacked and connected with the elastic member 310, and the pressure sensor 320 cannot accurately sense pressure change. Therefore, the reinforcing member 340 is provided, during assembly, the reinforcing member 340 can be clamped by a customized jig, then the flexible circuit board 330 and the pressure sensor 320 are sequentially stacked on the reinforcing member 340, and then the reinforcing member 340, the flexible circuit board 330, the pressure sensor 320 and the elastic member 310 which are bonded together are stacked and bonded. Therefore, the assembly difficulty of the key assembly can be greatly reduced, the assembly precision is improved, and the assembly efficiency is improved.

In addition, correspondingly, the present application also provides an earphone, which includes the above-mentioned key structure, and the housing 100 in the key structure is a component of the earphone housing. So, the required fitting space of button structure is little, can effectively reduce the occupation to earphone shell inner space to be favorable to the miniaturization of earphone.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A key structure, comprising:

a housing on which a pressing area is formed;

2. The key structure of claim 1, wherein: the elastic piece is any one of a silica gel piece, an elastic sheet or a spring.

3. The key structure of claim 1, wherein: the elastic modulus at the pressing area on the housing is larger than that of the elastic member.

4. The key structure of claim 1, wherein: the supporting part comprises a PCB, the front surface of the PCB is used for arranging circuit components, and the supporting plane is arranged on the PCB.

5. The key structure of claim 1, wherein: the supporting part comprises a supporting frame and a PCB (printed circuit board) stacked on the supporting frame, and the front surface of the PCB is used for arranging circuit components; the support plane is arranged on the support frame or the PCB, or the support plane is arranged between the support frame and the PCB.

6. A key structure according to claim 4 or 5, characterized in that: a groove is formed in one side of the supporting portion, and the bottom of the groove is the supporting plane.

7. A key structure according to claim 4 or 5, characterized in that: a support platform is arranged on the support part, and the support plane is formed on the support platform.

8. The key structure of claim 6, wherein: the projection of the elastic element on the supporting plane in a direction perpendicular to the pressing area is located in the supporting plane.

9. The key structure of claim 1, wherein: the pressure sensor is stacked between the flexible circuit board and the elastic piece; the key structure also comprises a reinforcing piece, and the reinforcing piece is attached to the surface of one side of the flexible circuit board, which is far away from the pressure sensor; in the assembled state, the reinforcement abuts against an inner side surface of the pressing region.

10. An earphone comprising a key structure as claimed in any one of claims 1 to 9, wherein the housing is an integral part of the casing of the earphone.