CN217739854U - Quick heat abstractor of computer - Google Patents

Abstract

The utility model discloses a quick heat abstractor of computer, add notes a section of thick bamboo and seal the nozzle stub including contact heating panel, a holding section of thick bamboo, inflation sealing post, liquid nitrogen, a holding section of thick bamboo is the pipe form, and upper and lower opening, a holding section of thick bamboo fixed mounting is at the upper surface position of contact heating panel, inflation sealing post fixed mounting is located the inside of a holding section of thick bamboo at the upper surface position of contact heating panel, a liquid nitrogen filling section of thick bamboo is fixed to be set up directly over the inflation sealing post, the liquid nitrogen adds the below surface position fixed intercommunication of annotating a section of thick bamboo and has sealed nozzle stub, seal the nozzle stub with be provided with contact plug flow structure between the inflation sealing post. The utility model relates to a quick heat abstractor of computer is applicable to the quick cooling of treater when computer overclocking, adds notes a section of thick bamboo and contact heating panel separation design through the liquid nitrogen that sets up for the liquid nitrogen that computer processor avoided the liquid nitrogen to add when the low-load in the notes a section of thick bamboo is supercooled to the treater, thereby avoids bringing the damage to the treater.

Description

Quick heat abstractor of computer

Technical Field

The utility model relates to a computer heat dissipation technical field specifically is a quick heat abstractor of computer.

Background

The processor in the computer is a core heating element of the computer, in the ultimate user field of the computer, in order to pursue the ultimate performance of the processor of the computer, the processor can be manually used in an overclocking manner, the power consumption and the heat productivity of the processor are greatly increased under the working condition of large-amplitude overclocking, and the conventional fan heat dissipation can not meet the requirement, so that the processor is often cooled by liquid nitrogen, the temperature of the liquid nitrogen is extremely low, the processor is difficult to control when being cooled, if the processor is still in a low-load state, the processor can be excessively cooled to cause damage, and the on-time and quantitative addition is difficult to be carried out according to the heating condition of the processor by manually adding the liquid nitrogen.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a quick heat abstractor of computer to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a quick heat abstractor of computer, includes the contact heating panel, holds a section of thick bamboo, inflation sealing post, liquid nitrogen and annotates a section of thick bamboo and closed nozzle stub, it is the pipe form to hold a section of thick bamboo, and upper and lower opening, hold an upper surface position of section of thick bamboo fixed mounting at the contact heating panel, inflation sealing post fixed mounting is located the inside that holds a section of thick bamboo at the upper surface position of contact heating panel, the fixed setting of a liquid nitrogen filling section of thick bamboo is directly over the inflation sealing post, the liquid nitrogen adds the below surface position fixed intercommunication of annotating a section of thick bamboo and has closed nozzle stub, closed nozzle stub with be provided with contact shutoff structure between the inflation sealing post, contact shutoff structure with inflation sealing post cooperation has shutoff and through-flow function.

The contact plugging structure includes a blocking flange, a through-flow aperture and a closing baffle disc.

The closed short pipe is in a cylindrical short pipe shape and is provided with an upper opening and a lower opening, the blocking flange is fixedly installed in the closed short pipe and is close to the position of the lower surface, and a through flow hole is formed in the blocking flange.

The upper end of the expansion sealing column penetrates through the through flow hole, and a certain gap is formed between the outer wall surface of the expansion sealing column and the inner wall surface of the through flow hole.

The sealing baffle disc is fixedly arranged on the surface of the upper end of the expansion sealing column, a certain gap is arranged between the surface of the side wall of the sealing baffle disc and the surface of the inner wall of the sealing short pipe, the diameter of the sealing baffle disc is larger than that of the flow through hole, and the sealing baffle disc is in contact with the blocking flange in a conventional state.

The side wall surface position of the contact heat dissipation plate is fixedly provided with an installation clamping plate, and the surface of the installation clamping plate is provided with a fixing nail groove.

The upper surface position of the contact heating panel is located inside the containing cylinder and is fixedly provided with a heat conduction fin, the outer surface position of the liquid nitrogen filling cylinder is fixedly provided with a support fixing frame, and the lower end of the support fixing frame is fixedly arranged on the upper surface position of the mounting clamping plate.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model relates to a quick heat abstractor of computer is applicable to the treater quick cooling when computer overclocking, through the design that the liquid nitrogen adds a notes section of thick bamboo and contact heating panel separation that sets up, makes the computer processor avoid the liquid nitrogen in the liquid nitrogen adds a notes section of thick bamboo to the treater overcooling when the low-load, thereby avoids bringing the damage to the treater;

and under the limit overfrequency operating mode, when the treater height generates heat, the expansion seal post is heated the expansion and extends, make to seal and keep off and separate out certain clearance between dish and the separation flange, the liquid nitrogen in the liquid nitrogen adds the notes section of thick bamboo and passes through the clearance downward flow, get into and hold the section of thick bamboo and dispel the heat to the treater, after low temperature, the contraction of expansion seal post, automatically will seal and keep off the separation clearance between dish and the separation flange and seal, it is downflow to stop the liquid nitrogen in the liquid nitrogen adds the notes section of thick bamboo, make the flow of liquid nitrogen more controllable when utilizing the liquid nitrogen to carry out the overfrequency heat dissipation to the treater, reduce the liquid nitrogen loss, avoid the treater to be supercooled simultaneously.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the overall structure of the present invention;

FIG. 3 is a schematic front view of the present invention;

fig. 4 is a schematic cross-sectional view of the present invention.

In the figure: 1. a contact heat dissipation plate; 2. a receiving cylinder; 3. expanding the sealed column; 4. a liquid nitrogen filling cylinder; 5. sealing the short pipe; 501. a barrier flange; 502. a flow-through orifice; 503. closing the baffle disc; 101. mounting a clamping plate; 102. a staple slot is fixed; 201. heat-conducting fins; 401. and supporting the fixing frame.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a quick heat abstractor of computer, including contact heating panel 1, hold a section of thick bamboo 2, inflation sealing column 3, liquid nitrogen adds notes a section of thick bamboo 4 and seals nozzle stub 5, it is the pipe form to hold a section of thick bamboo 2, and upper and lower opening, it installs at the upper surface position of contact heating panel 1 to hold a section of thick bamboo 2 fixed mounting, inflation sealing column 3 fixed mounting is at the upper surface position of contact heating panel 1, be located the inside that holds a section of thick bamboo 2, liquid nitrogen adds notes a section of thick bamboo 4 fixed setting directly over inflation sealing column 3, liquid nitrogen adds the fixed intercommunication in lower part surface position of annotating a section of thick bamboo 4 and has sealed nozzle stub 5, be provided with contact choked flow structure between sealed nozzle stub 5 and the inflation sealing column 3, contact choked flow structure has choked flow and through-flow function with inflation sealing column 3 cooperation, contact heating panel 1, hold a section of thick bamboo 2, inflation sealing column 3 and heat conduction fin isotructure all adopt the same kind of good heat conductivity material to make, for example aluminium or copper etc.

The contact plugging structure comprises a plugging flange 501, a through flow hole 502 and a closing baffle disc 503; the closed short pipe 5 is in a cylindrical short pipe shape and is provided with an upper opening and a lower opening, the blocking flange 501 is fixedly arranged inside the closed short pipe 5 and is close to the lower surface, and a through flow hole 502 is formed inside the blocking flange 501; the upper end of the expansion sealing column 3 is inserted through the through-flow hole 502, and a certain gap is provided between the outer wall surface of the expansion sealing column 3 and the inner wall surface of the through-flow hole 502; the sealing baffle disk 503 is fixedly arranged at the upper end surface of the expansion sealing column 3, a certain gap is arranged between the side wall surface of the sealing baffle disk 503 and the inner wall surface of the sealing short pipe 5, the diameter of the sealing baffle disk 503 is larger than that of the through flow hole 502, and the sealing baffle disk 503 and the blocking flange 501 are contacted with each other under the normal state.

A mounting clamping plate 101 is fixedly mounted on the surface of the side wall of the contact heat dissipation plate 1, and a fixing nail groove 102 is formed in the surface of the mounting clamping plate 101; the upper surface position of contact heating panel 1 is located the inside fixed mounting who holds a section of thick bamboo 2 and has heat conduction fin 201, and the outer surface position fixed mounting that a section of thick bamboo 4 was annotated to liquid nitrogen has support mount 401, and the lower extreme fixed mounting that supports mount 401 has the upper surface position of installation cardboard 101, and a section of thick bamboo 4 is annotated with liquid nitrogen all adopts thermal-insulated material to make with support mount 401, supports and can fix through the screw between mount 401 and the installation cardboard 101.

The utility model relates to a quick heat abstractor of computer, when using, the last surface contact laminating of contact heating panel 1 and treater, paint the silicone grease in order to improve heat conduction effect between the two, and fix contact heating panel 1 through installation cardboard 101, with liquid nitrogen filling feed liquor nitrogen filling section of thick bamboo 4, because under the conventional condition, it seals to seal fender 503 and separation flange 501 contact, therefore the liquid nitrogen can not the downflow, when the treater generates heat, the inflation sealing post 3 is heated the thermal expansion and is extended through the heat conduction, make and seal fender 503 and separation flange 501 direct separation out certain clearance, the liquid nitrogen in the liquid nitrogen filling section of thick bamboo 4 flows downwards through above-mentioned clearance, through the surperficial water conservancy diversion of inflation sealing post 3, flow in and hold section of thick bamboo 2 the part and carry out rapid cooling, and inflation sealing post 3 is owing to have the liquid nitrogen to flow through on the surface, consequently can be cooled down the shrink rapidly, make and seal fender 503 and separation flange 501 jam once more and seal, stop the liquid nitrogen and flow constantly, make the above-mentioned flow of liquid nitrogen circulation, make the utilization be convenient for more the accuse when cooling the treater.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a quick heat abstractor of computer, includes contact heating panel (1), holds a section of thick bamboo (2), inflation sealing post (3), liquid nitrogen filling section of thick bamboo (4) and seals nozzle stub (5), its characterized in that: hold a section of thick bamboo (2) and be the pipe form, and upper and lower opening, hold an upper surface position of section of thick bamboo (2) fixed mounting at contact heating panel (1), inflation sealing post (3) fixed mounting is located the inside of holding a section of thick bamboo (2) at the upper surface position of contact heating panel (1), liquid nitrogen adds notes a section of thick bamboo (4) fixed setting directly over inflation sealing post (3), the fixed intercommunication of below surface position that a section of thick bamboo (4) was added to the liquid nitrogen has closed nozzle stub (5), closed nozzle stub (5) with be provided with contact choked flow structure between inflation sealing post (3), contact choked flow structure with inflation sealing post (3) cooperation has choked flow and through-flow function.

2. The quick heat dissipation device for computers of claim 1, wherein: the contact plugging structure comprises a blocking flange (501), a through flow hole (502) and a closing baffle disc (503).

3. The quick heat dissipation device for computers of claim 2, wherein: seal nozzle stub (5) and be cylindrical nozzle stub form, and upper and lower opening, separation flange (501) fixed mounting is close to the lower surface position in the inside of sealing nozzle stub (5), the inside of separation flange (501) is provided with through-flow hole (502).

4. The quick heat dissipation device for computers of claim 3, wherein: the upper end of the expansion sealing column (3) penetrates through the through flow hole (502), and a certain gap is formed between the outer wall surface of the expansion sealing column (3) and the inner wall surface of the through flow hole (502).

5. The quick heat dissipation device for computers of claim 4, wherein: the sealing baffle disc (503) is fixedly installed at the upper end surface of the expansion sealing column (3), a certain gap is arranged between the side wall surface of the sealing baffle disc (503) and the inner wall surface of the sealing short pipe (5), the diameter of the sealing baffle disc (503) is larger than that of the through flow hole (502), and the sealing baffle disc (503) and the blocking flange (501) are in mutual contact in a conventional state.

6. The quick heat dissipation device of claim 1, wherein: the side wall surface position of the contact heat dissipation plate (1) is fixedly provided with an installation clamping plate (101), and the surface of the installation clamping plate (101) is provided with a fixing nail groove (102).

7. The quick heat dissipation device of claim 1, wherein: the upper surface position of contact heating panel (1) is located the inside fixed mounting who holds a section of thick bamboo (2) and has heat conduction fin (201), the outer surface position fixed mounting who fills a section of thick bamboo (4) with liquid nitrogen has support mount (401), the lower extreme fixed mounting who supports mount (401) is at the upper surface position of installation cardboard (101).

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