CN217733347U - Crystal pulling production equipment - Google Patents

Abstract

The application discloses crystal pulling production equipment relates to crystal pulling production technical field, and this crystal pulling production equipment has the beneficial effect that the crystal pulling quality is good, and production efficiency is high. The crystal pulling production equipment comprises a single crystal furnace and a feeding assembly, wherein the feeding assembly is positioned outside the single crystal furnace and used for adding silicon materials into the single crystal furnace, the feeding assembly is provided with an air inlet pipe, the air inlet pipe is used for introducing clean gas, and the clean gas enters the single crystal furnace through the feeding assembly.

Description

Crystal pulling production equipment

Technical Field

The disclosure relates to the technical field of crystal pulling production, in particular to crystal pulling production equipment.

Background

Generally, an apparatus for producing a single crystal silicon rod includes a single crystal furnace, a transfer device and a feed bin, the transfer device transporting a silicon material in the feed bin toward the single crystal furnace.

In order to ensure a long-term continuous pulling, it is necessary to continuously feed silicon material into the single crystal furnace. On one hand, the dust enters a crystal pulling crucible of a single crystal furnace along with the flowing of gas and falls on the surface of liquid silicon to cause wire breakage and influence the crystal pulling quality. On the other hand, the dust adheres to the silicon material conveying passage, and the cleanliness in the passage is poor, which tends to adversely affect the quality of the ingot.

In addition, when molten silicon is produced, silicon vapor is generated, and the quality of the pulled crystal is also affected after the silicon vapor enters the single crystal furnace.

SUMMERY OF THE UTILITY MODEL

The application aims to provide a crystal pulling production device which has the beneficial effects of good crystal pulling quality and high production efficiency.

The application provides a crystal pulling production facility, crystal pulling production facility include single crystal growing furnace and reinforced subassembly, and reinforced subassembly is located the single crystal growing furnace outside for add silicon material in to the single crystal growing furnace, be provided with the intake pipe on the reinforced subassembly, the intake pipe is used for letting in clean gas, clean gas gets into the single crystal growing furnace through reinforced subassembly.

Under the condition of adopting the technical scheme, the cleaning gas can be continuously introduced into the single crystal furnace by utilizing the gas inlet pipe in the process of feeding the feeding assembly into the single crystal furnace, or before crystal pulling production, or in the whole crystal pulling production process, and can be taken away along with the discharge of the cleaning gas from the gas outlet of the single crystal furnace, so that the dust and the silicon steam falling on the surface of the liquid silicon material in the single crystal furnace are reduced, the dust attached to the inner wall of the equipment is reduced, the adverse effect of the dust and the silicon steam on the crystal pulling quality is reduced, and the success rate of crystal pulling is improved.

In one possible implementation, the charging assembly comprises a liquid charging device, wherein the liquid charging device is used for adding liquid silicon materials into the single crystal furnace; the intake pipe is including setting up second intake pipe and/or third intake pipe on liquid feeding device. Under the condition of adopting the technical scheme, the dust generated when solid silicon materials are added and the silicon steam generated when the solid silicon materials are melted can be carried away by utilizing the cleaning gas introduced by the second air inlet pipe and/or the third air inlet pipe.

In one possible embodiment, the liquid charging device comprises a containing cavity, a container and a heater, wherein the container is used for containing solid silicon materials and/or liquid silicon materials, the container is provided with a discharge hole communicated with the single crystal furnace, the container and the heater are positioned in the containing cavity, and the heater is used for heating and melting the silicon materials in the container. Under the condition of adopting the technical scheme, when the container is filled with the solid silicon material, the heater can melt the solid silicon material into liquid, and when the container is filled with the liquid silicon material, the heater can heat the liquid silicon material to keep the liquid silicon material in the liquid state. The accommodating cavity can play a role in heat preservation and sealing, and can also play a role in avoiding scalding due to mistaken touch of the heater and the container.

In one example, the second air inlet pipe is communicated with and arranged at the top of the accommodating cavity, and an air outlet of the second air inlet pipe corresponds to the feeding hole of the container. The cleaning gas introduced by the second gas inlet pipe enters the feed inlet, so that dust and silicon vapor in the liquid feeding device are carried away.

In one example, the liquid charging device further comprises an insulating member located in the receiving chamber, the insulating member having an inner cavity, the container and the heater both being located in the inner cavity; the heat preservation component is provided with an avoiding hole which corresponds to the feed inlet of the container. Under the condition of adopting the technical scheme, the silicon material enters the container from the avoiding hole. The heat preservation component can play a role in heat preservation, and is beneficial to enabling the solid silicon material in the container to be rapidly and sufficiently heated and melted into the liquid silicon material by the heater or keeping the liquid silicon material in the container in a liquid state.

In one example, the third air inlet pipe is communicated with and arranged at the side part of the accommodating cavity, the heat preservation member is provided with a vent hole, the inner end of the vent hole is communicated with the feed inlet of the container, and the outer end of the vent hole corresponds to the air outlet of the third air inlet pipe. Under the condition of adopting this technical scheme, the clean gas that the third inlet tube lets in enters into the feed inlet of container through the air vent, can erode the inner wall of container, takes away silicon steam, dust in the container, improves the cleanliness in the container.

In one possible implementation, the crystal pulling production plant further comprises a cooling device which is arranged at the side or the bottom of the accommodating chamber. Under the condition of adopting this technical scheme, cooling device can carry out cooling to the lateral wall of container in holding the chamber, can be through adjustment cooling device's cooling capacity to make the container be in suitable temperature range, avoid leading to the softened condition to appear in the container because of heating temperature is too high, guarantee simultaneously that the silicon material temperature in the container is higher than self melting point, can melt rapidly.

In one possible implementation, the feeding assembly comprises a solid feeding device, the solid feeding device is used for feeding solid silicon materials into the single crystal furnace, and the air inlet pipe comprises a first air inlet pipe positioned on the solid feeding device. Under the condition of adopting the technical scheme, the cleaning gas introduced through the first gas inlet pipe firstly enters the solid feeding device, so that the solid silicon material in the solid feeding device can be blown, the dust attached to the solid silicon material can be taken away, the dust generated in the process that the solid silicon material is added into the single crystal furnace, and the silicon vapor generated in the process that the solid silicon material is melted in the single crystal furnace can be taken away by the cleaning gas introduced through the first gas inlet pipe, and the cleaning gas is discharged out of the single crystal furnace together with the cleaning gas.

In one possible embodiment, the solid feeding device comprises a feeding bin and a conveying device, and two ends of the conveying device are respectively communicated with the feeding bin and the single crystal furnace and used for conveying the solid silicon material from the feeding bin to the single crystal furnace; the first air inlet pipe is communicated with the side part of the feeding bin, and clean air enters the single crystal furnace through the conveying device. Under the condition of adopting the technical scheme, in the process that the solid silicon material is placed in the conveying device and enters the single crystal furnace from the conveying device, the generated dust can be carried by the cleaning gas and discharged out of the single crystal furnace, so that the dust can be reduced from falling on the surface of the liquid silicon material in the single crystal furnace, and the adverse effect on the crystal pulling quality is reduced; silicon vapor generated when the solid silicon material is melted into a liquid state in the single crystal furnace can also be carried away by the cleaning gas.

In one possible implementation mode, the feeding assembly comprises a solid feeding device and a liquid feeding device, the solid feeding device conveys a solid silicon material into the liquid feeding device, and the liquid feeding device conveys the solid silicon material into the single crystal furnace after melting the solid silicon material into a liquid silicon material; the intake pipe includes at least one of first intake pipe, second intake pipe and third intake pipe, and first intake pipe is located solid feeding device, and second intake pipe and third intake pipe are located liquid feeding device. Under the condition of adopting the technical scheme, the cleaning gas introduced into any one of the three gas inlet pipes can carry away dust generated during the conveying of the solid silicon material and silicon steam generated during the melting of the solid silicon material.

In one possible embodiment, the liquid charging device further comprises an isolation valve, the liquid charging device having an inlet, the isolation valve being mounted at the inlet, the solid charging device extending into the liquid charging device through the inlet when the isolation valve is open; when the solid feeding device exits the liquid feeding device, the isolation valve is closed. Under the condition of adopting the technical scheme, the solid silicon material can be discharged from the liquid feeding device after being conveyed, and the adverse effect of high temperature in the liquid feeding device on the solid feeding device is reduced.

In a possible implementation mode, the crystal pulling production equipment further comprises a vacuum generating device, and the single crystal furnace and the cooling air outlet pipe are connected with the vacuum generating device.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a schematic view of a crystal pulling apparatus according to an embodiment of the present application;

fig. 2 is a partial perspective cross-sectional view of a liquid feeding device provided in an embodiment of the present application.

Reference numerals are as follows:

11-a feeding bin, 12-a container and 121-a discharging port;

2-liquid feeding device, 21-container, 211-feeding inlet, 212-outflow section, 22-containing cavity, 23-heat-insulating member,

231-vent, 24-guide tube, 25-isolation valve;

3-single crystal furnace, 4-vacuum generating device,

5-conveying device, 51-feeding position, 52-blanking position and 53-conveying pipe;

61-a first air inlet pipe, 62-a second air inlet pipe, 63-a third air inlet pipe;

71-cooling air inlet pipe, 72-cooling air outlet pipe.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description of the present application, "above" and "below" are based on the direction of gravity.

As is known, when obtaining single crystal silicon rods by crystal pulling, a crystal pulling production apparatus is used, which comprises a single crystal furnace 3 and a charging assembly located outside the single crystal furnace 3 for adding silicon material into the single crystal furnace 3. The single crystal furnace 3 is provided with an exhaust port which is connected with a vacuum generating device 4 and is used for keeping the inside of the single crystal furnace 3 in a negative pressure sealing state in the crystal pulling production process.

However, during the crystal pulling process, the feeding assembly continuously or intermittently feeds silicon material (which may be liquid or solid) into the single crystal furnace 3 because the feeding assembly is in communication with the single crystal furnace 3 and is in a negative pressure sealed state. If the solid silicon material is added, a large amount of dust is generated in the adding process, and after the solid silicon material is melted into the liquid silicon material, the dust is attached to the surface of the liquid silicon material or doped in the liquid silicon material, so that the dust has adverse effects on crystal pulling quality, is also attached to the inner wall of equipment, particularly to the inner wall of a silicon material conveying channel, and is easy to cause channel blockage due to the accumulation of the upper time; moreover, silicon vapor is generated in the process of melting the solid silicon material into the liquid silicon material in the single crystal furnace 3, and the silicon vapor is attached to the surface of the liquid silicon material or doped in the liquid silicon material, thereby having adverse effects on the crystal pulling quality. If the liquid silicon material is added, a large amount of silicon vapor is generated in the adding process, and the silicon vapor is attached to the surface of the liquid silicon material or doped in the liquid silicon material, so that the crystal pulling quality is adversely affected. Therefore, it is desirable to clean out the dust and silicon vapors in a timely manner to reduce the adverse effects of the dust and silicon vapors on the crystal pulling quality.

In order to solve the technical problem, the application provides a crystal pulling production device, and as shown in fig. 1, the crystal pulling production device comprises a single crystal furnace 3 and a feeding assembly, wherein the feeding assembly is located outside the single crystal furnace 3 and used for adding silicon materials into the single crystal furnace 3, the feeding assembly is provided with an air inlet pipe, the air inlet pipe is used for introducing clean gas, and the clean gas enters the single crystal furnace 3 through the feeding assembly.

Under the condition of adopting the technical scheme, the cleaning gas can be continuously introduced into the single crystal furnace 3 by utilizing the gas inlet pipe in the process of feeding the feeding component into the single crystal furnace 3, or before crystal pulling production, or in the whole crystal pulling production process, and along with the discharge of the cleaning gas from the gas outlet of the single crystal furnace 3, the cleaning gas can carry away the dust and the silicon steam, thereby reducing the dust and the silicon steam falling on the surface of the liquid silicon material in the single crystal furnace 3, reducing the dust attached to the inner wall of the equipment, reducing the adverse effect of the dust and the silicon steam on the crystal pulling quality, and improving the success rate of crystal pulling.

Here, silicon vapor refers to gaseous silicon and other gaseous silicon-containing compounds. The dust described herein is a mixed dust including silicon dust and other impurity dust.

In one possible implementation, referring to fig. 1, the charging assembly includes a liquid charging device 2, the liquid charging device 2 being used to add a liquid silicon charge into a single crystal furnace 3; the air inlet pipe comprises a second air inlet pipe 62 and/or a third air inlet pipe 63 which are arranged on the liquid feeding device 2. The solid silicon material can be added into the liquid feeding device 2, and after the liquid feeding device 2 melts the solid silicon material into the liquid silicon material, the liquid silicon material is added into the single crystal furnace 3; or, the liquid feeding device 2 only plays a role of transferring, namely, the melted liquid silicon material is added into the single crystal furnace 3 by the liquid feeding device 2. Under the condition of adopting the technical scheme, if the liquid feeding device 2 needs to melt the solid silicon material into the liquid silicon material, the dust generated when the solid silicon material is added and the silicon steam generated when the solid silicon material is melted into the liquid silicon material can be carried away by utilizing the clean gas introduced by the second gas inlet pipe 62 and/or the third gas inlet pipe 63; if the liquid feeding device 2 only serves to transfer the liquid silicon material, the cleaning gas can carry away the silicon vapor carried by the liquid silicon material. Moreover, if the second air inlet pipe 62 and the third air inlet pipe 63 are simultaneously filled with the cleaning gas, the flow of the cleaning gas can be increased, more silicon vapor and dust can be carried away, the dust falling in the single crystal furnace 3 and the silicon vapor can be reduced, and the dust attached to the inner wall of the liquid feeding device 2 can be reduced.

In one possible embodiment, the liquid charging device 2 comprises a containing chamber 22, a container 21 and a heater, the container 21 is used for containing solid silicon material and/or liquid silicon material, the container 21 is provided with a discharge hole communicated with the single crystal furnace 3, the container 21 and the heater are both positioned in the containing chamber 22, and the heater is used for heating and melting the silicon material in the container 21. Under the condition of adopting the technical scheme, when the container 21 is filled with the solid silicon material, the heater can melt the solid silicon material into liquid, and when the container 21 is filled with the liquid silicon material, the heater can heat the liquid silicon material to keep the liquid silicon material in the liquid state. The accommodating cavity 22 can play a role in heat preservation and sealing, and can also play a role in avoiding scalding caused by mistakenly touching the heater and the container 21.

In one example, vessel 21 may be tubular and includes a melt section and an outflow section, feed inlet 211 is located in the melt section, the melt section is located in receiving chamber 22, the outflow section extends into single crystal furnace 3, and the liquid silicon material flows from the melt section to the outflow section and then from the outflow section into single crystal furnace 3. Thus, the connection structure between the liquid feeding device 2 and the single crystal furnace 3 can be simplified, and the liquid silicon material can be conveniently fed into the single crystal furnace 3 from the liquid feeding device 2. In particular, vessel 21 may be slightly inclined with the melt section above the outflow section to facilitate the flow of liquid silicon material toward single crystal furnace 3.

In one example, the second air inlet pipe 62 is disposed at the top of the accommodating chamber 22 in a communicating manner, and an air outlet of the second air inlet pipe 62 corresponds to the feeding hole 211 of the container 21. This facilitates the clean gas introduced from the second gas inlet pipe 62 to enter the feed port 211 to carry away the dust and silicon vapor in the liquid feeding device 2.

In one example, the liquid charging device 2 further comprises a thermal insulation member 23 located in the accommodating chamber 22, the thermal insulation member 23 having an inner chamber, the container 21 and the heater being located in the inner chamber; the heat insulating member 23 has relief holes corresponding to the feed ports 211 of the container 21. Under the condition of adopting the technical scheme, the silicon material enters the container 21 from the avoidance hole. The heat-insulating member 23 can perform a heat-insulating function, so as to facilitate the solid silicon material in the container 21 to be quickly and sufficiently heated by the heater to be melted into the liquid silicon material, or to facilitate the liquid silicon material in the container 21 to be kept in a liquid state.

In one example, the liquid feeding device 2 may have a guide tube 24, the guide tube 24 passing through the relief hole, and the silicon material passing through the guide tube 24 into the container 21. The guide pipe 24 can play a role in protecting the heat-insulating member 23, and the heat-insulating member 23 is prevented from being polluted and worn by silicon materials when passing through the avoidance hole, so that the service life of the heat-insulating member 23 can be prolonged.

In one example, the third air inlet pipe 63 is communicated with and disposed at the side of the accommodating chamber 22, the heat insulating member 23 has a vent hole 231, the inner end of the vent hole 231 is communicated with the inlet 211 of the container 21, and the outer end corresponds to the air outlet of the third air inlet pipe 63. Under the condition of adopting this technical scheme, the clean gas that third inlet tube 63 lets in enters into the feed inlet 211 of container 21 through air vent 231, can wash the inner wall of container 21, carries away silicon steam, dust in the container 21, improves the cleanliness in the container 21.

In one possible implementation, the crystal pulling production apparatus further comprises a cooling device disposed at a side or bottom of the receiving chamber 22. Under the condition of adopting this technical scheme, because container 21 is close to the heater, container 21 temperature itself is higher than the silicon material temperature in it, the condition that container 21 itself high temperature and softening appears easily, consequently, cooling device can cool off the lateral wall of container 21 in holding chamber 22, can be through adjusting cooling device's cooling capacity to make container 21 be in suitable temperature range, avoid leading to container 21 to appear the condition of softening because of the high temperature that heats, guarantee simultaneously that the silicon material temperature in container 21 is higher than self melting point, can melt rapidly.

In a possible embodiment, as shown in fig. 1 and 2, the cooling device comprises a cooling inlet pipe 71 and a cooling outlet pipe 72, the cooling inlet pipe 71 and the cooling outlet pipe 72 both extend into the accommodating cavity 22, the cooling inlet pipe 71 is used for introducing cooling gas, and the cooling outlet pipe 72 is used for discharging cooling gas. Under the condition of adopting this technical scheme, can regulate and control cooling gas's flow for cooling gas gets into and holds the lateral wall to container 21 in the chamber 22 and carries out cooling, so that container 21 is in suitable temperature range, avoids leading to the softened condition to appear in container 21 because of heating temperature is too high, and the influence of minimizing simultaneously silicon material temperature in to container 21, in order to ensure that silicon material temperature is higher than self melting point in the container 21, can melt rapidly. Wherein, cooling intake pipe 71 and cooling outlet pipe 72 all can stretch into the container 21 below, and the quick process cooling outlet pipe 72 of being convenient for cooling gas is discharged, can reduce the flow of cooling gas in liquid feeding device 2 to reduce or avoid cooling gas to get into in the container 21. In one example, the cooling air inlet pipe 71 and the cooling air outlet pipe 72 may both extend from the bottom of the accommodating chamber 22, and their respective air outlets correspond to the bottom wall of the container 21.

For example, in this apparatus, the solid silicon mass has a melting temperature of 1410 ℃ and the vessel 21 can be subjected to a maximum temperature of 1700 ℃, and the silicon mass can be heated to a temperature of 1500 ℃ to 1600 ℃ to ensure rapid melting of the solid silicon mass. Then, the temperature of the lower sidewall of the container 21 may be controlled to be between 1500 ℃ and 1700 ℃, or 1600 ℃ and 1700 ℃ by using the cooling gas.

Further, when the liquid feeding device 2 includes the insulating member 23, the cooling air inlet pipe 71 and the cooling air outlet pipe 72 may both extend into the inner cavity of the insulating member 23.

In one possible implementation, the feeding assembly comprises a solid feeding device for adding solid silicon material into the single crystal furnace 3, and the gas inlet pipe comprises a first gas inlet pipe 61 positioned on the solid feeding device. Under the condition of adopting this technical scheme, the clean gas that first intake pipe 61 let in firstly enters into solid feeding device, can blow solid silicon material wherein, takes away the attached dust on the solid silicon material, and the dust that produces in the solid silicon material is added and is got into single crystal growing furnace 3 in-process to and the silicon steam that the solid silicon material melts in single crystal growing furnace 3 and produces, also can be taken away by the clean gas that first intake pipe 61 let in, along with clean gas is discharged outside single crystal growing furnace 3 together.

In a possible embodiment, referring to fig. 1, the solid feeding device comprises a feeding bin 11 and a conveying device 5, and two ends of the conveying device 5 are respectively communicated with the feeding bin 11 and the single crystal furnace 3 for conveying the solid silicon material from the feeding bin 11 to the single crystal furnace 3; the first gas inlet pipe 61 is communicated with the side part of the feeding bin 11, and clean gas enters the single crystal furnace 3 through the conveying device 5. Under the condition of adopting the technical scheme, the solid silicon material in the feeding bin 11 is transferred on the conveying device 5 and conveyed into the single crystal furnace 3 through the conveying device 5. The cleaning gas introduced from the first gas inlet pipe 61 firstly enters the feeding bin 11, then enters the conveying device 5 from the feeding bin 11, and enters the single crystal furnace 3 through the silicon material conveying channel of the conveying device 5. In the process that the solid silicon material is placed in the conveying device 5 and enters the single crystal furnace 3 from the conveying device 5, the generated dust can be carried by the cleaning gas and discharged out of the single crystal furnace 3, so that the dust falling on the surface of the liquid silicon material in the single crystal furnace 3 can be reduced, and the adverse effect on the crystal pulling quality is reduced; silicon vapor generated when the solid silicon material is melted into a liquid state in the single crystal furnace 3 can also be carried away by the cleaning gas.

In one example, the conveying device 5 has a charging position 51 and a discharging position 52, the charging position 51 being located in the charging hopper 11, and the discharging position 52 corresponding to the single crystal furnace 3. The solid feeding device further comprises a container 12, the container 12 is disposed on the feeding bin 11, and the container 12 has a discharge opening 121, and the discharge opening 121 is spaced above the feeding position 51 in the gravity direction. The solid silicon material is freely dropped from the discharge port 121 to the charging position 51, and then is carried by the conveyor 5 to enter the single crystal furnace 3 from the discharging position 52.

In one example, the gas outlet of the first gas inlet pipe 61 can correspond to the charging position 51, and further, the height position of the gas outlet can be located between the charging position 51 and the discharging position 121, so as to maximally carry dust generated during the solid silicon material falling from the discharging position 121 of the material container 12 to the charging position 51 into the silicon material conveying channel of the conveying device 5, so as to discharge the dust out of the crystal pulling production equipment as much as possible.

In one possible implementation, referring to fig. 1, the feeding assembly comprises a solid feeding device and a liquid feeding device 2, the solid feeding device conveys a solid silicon material into the liquid feeding device 2, and the liquid feeding device 2 melts the solid silicon material into a liquid silicon material and conveys the liquid silicon material into the single crystal furnace 3; the air inlet pipe comprises at least one of a first air inlet pipe 61, a second air inlet pipe 62 and a third air inlet pipe 63, the first air inlet pipe 61 is positioned on the solid feeding device, and the second air inlet pipe 62 and the third air inlet pipe 63 are positioned on the liquid feeding device 2. Under the condition of adopting the technical scheme, the cleaning gas introduced into any one of the three gas inlet pipes can carry away dust generated during the conveying of the solid silicon material and silicon steam generated during the melting of the solid silicon material. When two or three air inlet pipes are arranged, the flow of the clean gas is large, more silicon steam and dust can be carried away, the dust is prevented from being attached to the inner walls of the liquid silicon material and the equipment, and the cleanliness in the crystal pulling production equipment is improved.

In one embodiment, referring to fig. 1, the solid feeding device comprises a feeding bin 11 and a conveying device 5, and two ends of the conveying device 5 are respectively communicated with the feeding bin 11 and the liquid feeding device 2 for conveying the solid silicon material into the liquid feeding device 2. With this technical solution, the solid silicon material is placed on the conveying device 5 in the feeding bin 11, and the conveying device 5 is used to convey the solid silicon material to the liquid feeding device 2. In the process of crystal pulling production, the solid silicon material can be conveyed to the liquid feeding device 2 in advance, heated and melted by the liquid feeding device 2 to obtain the liquid silicon material, and then the liquid silicon material is conveyed to the single crystal furnace 3 by the liquid feeding device 2 at any time according to needs. Thus, time can be saved and crystal pulling efficiency can be improved.

It should be clear that, the first air inlet pipe 61 takes away the dust shoes of solid silicon material, and the second air inlet pipe 62 and the third air inlet pipe 63 take away the dust entering the liquid feeding device 2, so as to avoid the dust from attaching to the inner wall of the liquid feeding device 2, in an alternative embodiment, only the second air inlet pipe 62 and/or the third air inlet pipe 63 are provided, and as for the dust attached to the inner wall of the solid feeding device, the dust can be removed by regular cleaning and maintenance, so that the conveying device 5 can exit the liquid feeding device 2, and can be detached to clean the conveying channel, and the feeding chamber 11 can be opened to clean the inner wall of the feeding chamber 11.

In a possible embodiment, shown with reference to fig. 1, the solids feeding device further comprises a container 12 arranged on the feeding bin 11, the container 12 having a discharge opening 121; the feeding bin 11, the conveying device 5, the liquid feeding device 2 and the single crystal furnace 3 are sequentially communicated along the silicon material conveying direction; the conveying device 5 has a charging position 51 and a discharging position 52, the charging position 51 is located in the charging bin 11 and is spaced below the discharging port 121 in the gravity direction; the blanking position 52 is positioned in the liquid feeding device 2, and the conveying device 5 is used for conveying the solid silicon material obtained in the feeding bin 11 to the liquid feeding device 2; the liquid feeding device 2 heats and melts the solid silicon material into liquid silicon material, and the single crystal furnace 3 receives the liquid silicon material. When the solid silicon material falls from the discharge port 121 to the charging position 51, dusts are generated, and these dusts enter the single crystal furnace 3 along with the silicon material moving path. Here, the silicon material moving passage includes a conveying passage of a solid silicon material and a conveying passage of a liquid silicon material.

Wherein the container 12 may be a funnel-shaped container 21 to facilitate smooth silicon material falling from the discharge opening 121 to the charging position 51.

In one example, a first air inlet pipe 61 is provided in communication with a side portion of the hopper 11. Under the condition of adopting the technical scheme, the cleaning gas introduced into the first gas inlet pipe 61 firstly enters the feeding bin 11, then enters the conveying device 5 from the feeding bin 11, and enters the single crystal furnace 3 through the conveying device 5 and the liquid feeding device 2. In the process that the solid silicon material enters the conveying device 5 and enters the single crystal furnace 3 from the conveying device 5, the generated dust can be carried away by the clean gas, so that the dust can be reduced to fall on the surface of the liquid silicon material in the single crystal furnace 3, and the adverse effect on the crystal pulling quality is reduced; silicon vapor generated when the solid silicon material is melted into a liquid state in the single crystal furnace 3 can also be carried away by the cleaning gas.

In an example, referring to fig. 1, an air outlet of the first air inlet pipe 61 extends into the feeding bin 11 and corresponds to the feeding position 51, and an air outlet direction of the first air inlet pipe 61 is along a silicon material conveying direction. In this way, the cleaning gas introduced from the first gas inlet pipe 61 can enter the silicon material conveying channel from the charging position 51, so that the dust generated when the solid silicon material falls from the discharging port 121 to the charging position 51 can be carried away as much as possible. Therefore, on the first aspect, the accumulation of dust in the production equipment (especially in a silicon material conveying channel) can be reduced, and the cleanliness of the interior of the crystal pulling production equipment is improved; in the second aspect, dust falling on the surface of the liquid silicon material in the single crystal furnace 3 can be reduced, the adverse effect on the crystal pulling quality is reduced, and the success rate of crystal pulling is improved; in the third aspect, silicon vapor generated in the process of melting the solid silicon material into the liquid silicon material can be carried away, so that the silicon vapor is reduced or avoided from entering the liquid silicon material in the single crystal furnace 3, the adverse effect on the crystal pulling quality is further reduced, and the success rate of crystal pulling is improved.

Further, the height position of the air outlet of the first air inlet pipe 61 in the gravity direction can be located between the feeding position 51 and the discharging position 121, so that the dust generated in the process of falling the solid silicon material from the discharging position 121 of the container 12 to the feeding position 51 is carried into the silicon material conveying channel of the conveying device 5 to the maximum extent, and the dust is discharged out of the crystal pulling production equipment as much as possible.

In one example, the first air inlet pipe 61 may be a straight pipe, and the extending direction is the same as the silicon material conveying passage direction of the conveyor 5.

In one embodiment, referring to fig. 1, the liquid feeding device 2 comprises a containing chamber 22, a container 21 and a heater, the container 21 has a feeding port 211 and a discharging port communicated with the single crystal furnace 3, the container 21 and the heater are both located in the containing chamber 22, and the heater is used for heating and melting the silicon material in the container 21; the conveying device 5 extends into the accommodating chamber 22 and corresponds to the feed port 211 of the container 21 to convey the solid silicon material into the container 21. Under the condition of adopting the technical scheme, when the container 21 can receive the solid silicon material from the conveying device 5, the solid silicon material is melted into liquid by the heater; the feed port 211 of the vessel 21 may also receive the liquid silicon material directly and the heater may heat it to maintain it in the liquid state. The accommodating cavity 22 can play a role in heat preservation and sealing, and can also play a role in avoiding scalding caused by mistakenly touching the heater and the container 21.

In one example, the drop location 52 of the conveyor 5 may be spaced gravitationally above the feed port 211 of the vessel 21, with solid silicon material falling from the feed port 211 into the vessel 21, but with dust being generated in the process.

In one example, the second air inlet pipe 62 is disposed at the top of the accommodating chamber 22 in a communicating manner, and an air outlet of the second air inlet pipe 62 is communicated with the feeding hole 211 of the container 21. Under the condition of adopting the technical scheme, the cleaning gas introduced into the second air inlet pipe 62 can directly enter the container 21 and flows towards the single crystal furnace 3 in the container 21 along the silicon material conveying channel, at the moment, the dust entering the container 21 and the silicon steam generated in the container 21 can be carried away, the dust and the silicon steam falling on the surface of the liquid silicon material in the single crystal furnace 3 can be reduced, the adverse effect on the crystal pulling quality is reduced, and the crystal pulling success rate is improved.

In one example, the air outlet of the second air inlet pipe 62 extends into the accommodating cavity 22 and corresponds to the blanking position 52, and the air outlet direction of the second air inlet pipe 62 is along the gravity direction. With this technical solution, the containing cavity 22 is in a sealed state, and the cleaning gas introduced by the second gas inlet pipe 62 and the cleaning gas introduced by the first gas inlet pipe 61 flow together along the silicon material conveying direction and enter the feeding port 211 of the container 21 (see the arrow in fig. 1). Wherein, the direction of giving vent to anger of second intake pipe 62 is along the gravity direction, this more does benefit to the clean gas that second intake pipe 62 lets in and enters into feed inlet 211, thereby do benefit to on the basis that the clean gas let in at first intake pipe 61, on the one hand, can as much as possible take away the dust that produces in solid silicon material falls to feed inlet 211 from blanking position 52 (blanking position 52 and feed inlet 211 are at the interval distribution in the gravity direction) and the silicon steam that produces in the solid silicon material melting is liquid silicon material in-process, on the other hand, two clean gases all enter into single crystal growing furnace 3, make the flow of the clean gas on silicon liquid surface increase in the single crystal growing furnace 3, do benefit to the dust on the silicon liquid surface that reduces in single crystal growing furnace 3.

Therefore, by adopting the technical scheme, on one hand, the accumulation of dust in the material containing device and the single crystal furnace 3 can be further reduced, and the cleanliness of the material containing device and the single crystal furnace 3 is improved, on the other hand, the dust and silicon vapor falling into the liquid silicon material can be further reduced, the adverse effect on the crystal pulling quality is further reduced, and the success rate of crystal pulling is improved.

In one embodiment, referring to fig. 1 and 2, the third air inlet pipe 63 is disposed at a side portion of the accommodating chamber 22, and an air outlet of the third air inlet pipe 63 is communicated with the inlet 211 of the container 21. Under the condition of adopting the technical scheme, the cleaning gas introduced by the third air inlet pipe 63 can enter the feed inlet 211 of the container 21, so that the inner wall of the container 21 can be washed, the cleanliness of the container 21 is improved, and the silicon steam and the dust in the container 21 are carried away.

In one example, referring to fig. 1 and 2, the outlet of the third gas inlet 63 extends into the accommodating chamber 22 and corresponds to the inlet 211 of the container 21, the outlet of the third gas inlet 63 is along the silicon material conveying direction, and the third gas inlet 63 is used for introducing the cleaning gas. Under the condition of adopting the technical scheme, the cleaning gas introduced from the third air inlet pipe 63 enters the feed inlet 211 of the container 21 through the vent hole 231, so that the inner wall of the container 21 can be washed, silicon vapor and dust in the container 21 can be carried away, and the cleanliness in the container 21 is improved.

After the cleaning gas introduced into the first gas inlet pipe 61 and/or the second gas inlet pipe 62 flows into the feed port 211 along the silicon material conveying direction, the cleaning gas introduced into the third gas inlet pipe 63 enters the liquid feeding device 2, and then flows into the feed port 211 of the container 21 along the silicon material conveying direction together with the cleaning gas introduced into the first gas inlet pipe 61 and/or the second gas inlet pipe 62 (see arrows in fig. 1).

If the three parts of clean gas enter the container 21 and the single crystal furnace 3, on one hand, dust and silicon vapor which are stored between the container 21 and the gas outlet of the single crystal furnace 3 can be carried away as much as possible, and on the other hand, the flow of the clean gas passing through the surface of the liquid silicon material in the single crystal furnace 3 is increased, which is beneficial to reducing the dust falling on the surface of the liquid silicon material in the single crystal furnace 3. Therefore, by adopting the technical scheme, on one hand, the accumulation of dust in the material containing device and the single crystal furnace 3 can be further reduced, and the cleanliness of the material containing device and the single crystal furnace 3 is improved, on the other hand, the dust and silicon steam falling into the liquid silicon material can be further reduced, the adverse effect on the crystal pulling quality is further reduced, and the success rate of crystal pulling is improved.

In a possible embodiment, shown with reference to fig. 1 and 2, the liquid charging device 2 further comprises an insulating member 23 located in the containing chamber 22, the insulating member 23 having an inner chamber in which the container 21 and the heater are both located. By adopting the technical scheme, the heat-insulating member 23 can play a role in heat insulation, and is beneficial to keeping the container 21 above the melting point temperature of the silicon material so as to ensure that the solid silicon material is quickly and sufficiently melted into the liquid silicon material in the container 21. The accommodating cavity 22 can play a role in heat preservation and sealing, and can also play a role in avoiding scalding caused by mistakenly touching the heating assembly and the container 21.

In one example, the heater may be a heat radiation type heater, which is located below the container 21 and spaced apart from the container 21. The heater may be shaped to match the shape of the vessel 21 to better heat the solid silicon material in the vessel 21 to melt it.

In one example, the insulating member 23 has relief holes corresponding to the feed ports 211 of the vessel 21, through which silicon material enters the vessel 21.

In a possible embodiment, as shown with reference to fig. 1 and 2, the liquid feeding device 2 further comprises a guide tube 24, the thermal insulation member 23 has an avoiding hole, the guide tube 24 passes through the avoiding hole, one end of the guide tube corresponds to the feeding hole 211 of the container 21, and the other end corresponds to the blanking position 52; under the condition of adopting the technical scheme, the solid silicon material falls from the blanking position 52 of the conveying device 5 and enters the guide pipe 24, and can accurately enter the feeding hole 211 of the container 21 under the guiding and limiting of the guide pipe 24, so that the solid silicon material is prevented from being scattered outside the container 21. Meanwhile, the guide pipe 24 can play a role in protecting the heat-insulating member 23, so that the solid silicon material is prevented from polluting and wearing the heat-insulating member 23 when passing through the avoiding hole, and the service life of the heat-insulating member 23 can be prolonged.

In one example, referring to fig. 1 and 2, the conveying device 5 and the thermal insulation member 23 have a gap therebetween, and the end of the guide tube 24 protrudes through the relief hole to correspond to the blanking position 52. Therefore, the solid silicon material can be ensured to completely enter the guide pipe 24, and the adverse effect of high temperature on the conveying device 5 can be reduced.

In one example, the guide pipe 24 is toward one end of the vessel 21, may have the same shape as the feed opening 211 of the vessel 21, and is sized to match the feed opening 211 in the width direction of the feed opening 211 (which is perpendicular to the silicon material conveying direction) so that the guide pipe 24 and the feed opening 211 of the vessel 21 are butted to allow the solid silicon material to accurately enter the vessel 21.

In one example, as shown with reference to fig. 1, in the length direction of the feed port 211 (which direction coincides with the silicon material conveying direction), the size of the end of the guide pipe 24 facing the vessel 21 may be smaller than the size of the feed port 211. In this case, the heat insulating member 23 may be engaged with both ends of the inlet 211, and the gas introduced through the third gas inlet pipe 63 may enter the container 21 from the end of the inlet 211.

In one example, referring to fig. 2, the outlet of the third air inlet pipe 63 extends into the accommodating chamber 22, the heat insulating member 23 has a vent hole 231, the inner end of the vent hole 231 communicates with the inlet 211 of the container 21, and the outer end corresponds to the outlet of the third air inlet pipe 63. Under the condition of adopting the technical scheme, the cleaning gas introduced from the third air inlet pipe 63 enters the feed inlet 211 of the container 21 through the vent hole 231, so that the inner wall of the container 21 can be washed, silicon vapor and dust in the container 21 can be carried away, and the cleanliness in the container 21 is improved. Under the condition of adopting the technical scheme, the vent hole 231 can facilitate the cleaning gas introduced by the third gas inlet pipe 63 to enter the feed inlet 211 of the container 21 through the vent hole 231, so that the scouring strength of the cleaning gas on the inner wall of the container 21 can be increased, and the cleanliness of the inner wall of the container 21 is improved; the scouring force of the cleaning gas on the surface of the silicon material can be increased, and silicon steam and dust as much as possible are carried away.

In a possible implementation, referring to fig. 1, the delivery device 5 may include a delivery tube 53, an end of the delivery tube 53 extending into the loading chamber 11 has a first gap, and/or an end of the delivery tube 53 extending into the accommodating chamber 22 has a second gap. By adopting the technical scheme, the arrangement of the first notch and the second notch can play a role in reducing the weight of the conveying pipe 53.

When the conveying device 5 adopts a vibration feeding mode, the conveying device 5 further comprises a vibrator, and the vibrator is in transmission connection with the conveying pipe 53 and can drive the conveying pipe 53 to vibrate so as to realize the movement of the solid silicon material in the conveying pipe 53 and finish the conveying of the solid silicon material. And by reducing the weight of the conveying pipe 53, it is possible to ensure effective vibration of the vibrating pipe to convey the solid silicon material from the charging position 51 to the blanking position 52.

The first notch can be located at the end of the delivery pipe 53 and corresponds to the discharge port 121 of the container 12, and the position of the first notch is the charging position 51, so that the cleaning gas introduced by the first gas inlet pipe 61 can conveniently enter the delivery pipe 53; the second gap may be located at the end of the conveying pipe 53, and the location of the second gap is the blanking position 52, so that the cleaning gas introduced through the second gas inlet pipe 62 is convenient to blow the solid silicon material at the blanking position 52, and the dust is carried away as much as possible.

In a possible embodiment, the end of the conveying device 5 that protrudes into the receiving chamber 22 is coated with a high-temperature-resistant coating. Since the solid silicon material needs to be melted in the liquid feeding device 2, the temperature inside the containing chamber 22 is high. In order to reduce the cost, the conveying device 5 can be made of common materials (such as quartz), and then the conveying device 5 can be protected by coating a high-temperature-resistant coating.

Alternatively, in another possible implementation, the conveying device 5 may also be made of a material resistant to high temperatures.

In one possible embodiment, the liquid feeding device 2 further comprises an isolation valve 25, the liquid feeding device 2 having an inlet, the isolation valve 25 being mounted at the inlet, the solids feeding device extending into the liquid feeding device 2 through the inlet when the isolation valve 25 is open; when the solids addition means exits the liquid addition means 2, the isolation valve 25 is closed. Under the condition of adopting the technical scheme, the solid silicon material can be conveyed completely, the solid feeding device is withdrawn from the liquid feeding device 2, and the adverse effect of high temperature in the liquid feeding device 2 on the solid feeding device is reduced.

In one example, the inlet of the liquid feeding device 2 is communicated with the containing cavity 22, when the isolation valve 25 is opened, the conveying device 5 of the solid feeding device extends into the containing cavity 22 through the inlet, and the blanking position 52 of the conveying device 5 corresponds to the feeding hole 211 of the container 21; when the conveying device 5 exits the receiving chamber 22, the isolation valve 25 closes. Adopt under this technical scheme's the condition, can make conveyor 5 withdraw and hold chamber 22 after the solid material transports, reduce the adverse effect of the high temperature in holding chamber 22 to conveyor 5.

In one example, the conveying device 5 is retractable so that it extends into or out of the accommodating cavity 22, and when extending into the accommodating cavity 22, the conveying device 5 extends to the upper part of the container 21, and the blanking position 52 corresponds to the feeding hole 211.

When the isolation valve 25 is opened and the conveying device 5 extends into the accommodating cavity 22 through the inlet, the first air inlet pipe 61, the second air inlet pipe 62 and the third air inlet pipe 63 can be simultaneously introduced with the cleaning gas.

When the conveying device 5 exits the accommodating cavity 22 and the isolation valve 25 is closed, the first air inlet pipe 61 stops introducing the clean air, and the second air inlet pipe 62 and the third air inlet pipe 63 can continue to simultaneously introduce the clean air.

The cleaning gas introduced by the first gas inlet pipe 61 can enter the conveying device 5 from the feeding position 51, then be discharged from the discharging position 52, flow toward the feeding hole 211 to enter the container 21, flow from the melt segment toward the outflow segment 212 in the container 21 to enter the single crystal furnace 3, and finally be discharged from the single crystal furnace 3. In the flowing process of the part of gas, dust generated in the process of conveying the solid material and silicon steam generated in the process of melting the solid silicon material into the liquid silicon material can be carried away, and the surface of the liquid silicon material in the single crystal furnace 3 (especially in the single crystal furnace 3) can be blown to reduce dust falling on the surface of the liquid silicon material and improve the success rate of crystal pulling.

The cleaning gas introduced by the second gas inlet pipe 62 can flow from the drop position 52 toward the inlet 211, enter the container 21, flow from the melt segment toward the outlet 212 in the container 21, enter the single crystal furnace 3, and finally be discharged from the single crystal furnace 3. In the flowing process of the part of gas, dust generated in the process of conveying the solid material and silicon steam generated in the process of melting the solid silicon material into the liquid silicon material can be carried away, and the surface of the liquid silicon material in the single crystal furnace 3 (especially in the single crystal furnace 3) can be blown to reduce dust falling on the surface of the liquid silicon material and improve the success rate of crystal pulling.

The cleaning gas introduced from the third gas inlet pipe 63 can flow from the vent hole 231 of the heat insulating member 23 toward the feed port 211 into the container 21, flow from the melt section toward the outflow section 212 in the container 21, enter the single crystal furnace 3, and finally be discharged from the single crystal furnace 3 to the outside. In the flowing process of the part of gas, dust generated in the process of conveying the solid material and silicon steam generated in the process of melting the solid silicon material into the liquid silicon material can be carried away, and the surface of the liquid silicon material in the single crystal furnace 3 (especially in the single crystal furnace 3) can be blown to reduce dust falling on the surface of the liquid silicon material and improve the success rate of crystal pulling.

When the conveying device 5 extends into the accommodating cavity 22 through the inlet, and the solid silicon material is continuously conveyed, the solid silicon material enters the feeding position 51 and leaves the blanking position 52 to generate dust, the dust amount is large, the three parts of clean gas flow simultaneously, the gas flow is large, and more dust can be carried away.

When the conveying device 5 exits the accommodating cavity 22 and the isolating valve 25 is closed, only the solid silicon material stored on the conveying device 5 falls from the blanking position 52 to the feeding hole 211 to generate dust, the dust amount is small, and the two parts of cleaning gas introduced by the second air inlet pipe 62 and the third air inlet pipe 63 can carry away a small amount of dust.

In a possible implementation manner, referring to fig. 1, the crystal pulling production facility further comprises a vacuum generating device 4, and the single crystal furnace 3 and the cooling gas outlet pipe 72 are both connected with the vacuum generating device 4. Adopt this technical scheme, under the effect of vacuum generating device 4, do benefit to during the clean gas that above-mentioned first intake pipe 61 let in enters into conveyor 5 fast, do benefit to during the clean gas that second intake pipe 62 and third intake pipe 63 let in enters into container 21 fast to and do benefit to during cooling gas enters into cooling outlet pipe 72 from cooling intake pipe 71 fast, reduce the flow of cooling gas in liquid feeding device 2, thereby reduce or avoid during cooling gas gets into container 21. For example, the vacuum generating device 4 may be a vacuum pump.

In one example, the first air inlet conduit 61, the second air inlet conduit 62 and the third air inlet conduit 63 may be connected to the same air supply. The cleaning gas may be nitrogen, hydrogen, argon or helium.

In one example, referring to FIG. 1, a crystal pulling crucible is provided in the single crystal furnace 3 for holding the liquid silicon material and for crystal growth, the crucible having a gap with the inner wall of the single crystal furnace 3, the single crystal furnace 3 having a gas outlet at the bottom wall, the gas outlet communicating with the vacuum generating device 4. The gas outlet is positioned at the bottom, so that gas flow can conveniently pass through the surface of the liquid silicon material and the periphery of the crucible, dust and silicon vapor on the surface of the liquid silicon material can be conveniently taken away, and dust around the crucible can be conveniently taken away.

In accordance with the crystal pulling production apparatus described above, the present application also provides a crystal pulling method comprising:

sealing the crystal pulling production equipment to enable the crystal pulling production equipment to be in a preset low-pressure state;

continuously introducing clean gas by using the gas inlet pipe, and continuously discharging the clean gas from the single crystal furnace 3 to keep a preset low-pressure state;

adding a silicon material to the single crystal furnace 3 by using the feeding assembly to pull;

and after crystal pulling is finished, stopping introducing the clean gas.

By adopting the technical scheme, the cleaning gas is continuously introduced until the crystal pulling is finished, so that dust and silicon steam generated in the crystal pulling process can be carried away as much as possible, the adverse effect on the crystal pulling is reduced, and the crystal pulling quality and the success rate are improved.

In one example, a vacuum generator 4 can be connected to the single crystal furnace 3 to continuously draw gas from the crystal pulling production facility, maintain the crystal pulling production facility at a predetermined low pressure, and continuously discharge cleaning gas from the single crystal furnace 3 under the action of the vacuum generator 4 to carry away dust and silicon vapor to clean the interior of the crystal pulling production facility.

In one example, when the crystal pulling production apparatus includes at least one of the first gas inlet pipe 61, the second gas inlet pipe 62 and the third gas inlet pipe 63, when the cleaning gas needs to be introduced, the cleaning gas can be introduced simultaneously by using all the gas inlet pipes, and the cleaning gas with a large flow rate can carry away as much dust and silicon vapor as possible.

In one example, when the solid feeding device exits the liquid feeding device 2, the communication between the solid feeding device and the single crystal furnace 3 is cut off, and the cleaning gas introduced through the first gas inlet pipe 61 cannot enter the single crystal furnace 3, so that the first gas inlet pipe 61 needs to be closed.

In one example, when the crystal pulling production apparatus includes a cooling device, the container 21 is cooled by the cooling device while the container 21 is heated by the heater so that the container 21 is in an appropriate temperature range, avoiding a situation in which the container 21 softens due to an excessively high heating temperature. Specifically, when the cooling device includes the cooling air inlet pipe 71 and the cooling air outlet pipe 72, when the container 21 is heated by the heater, the cooling air is introduced through the cooling air inlet pipe 71, so that the container 21 is in a proper temperature range, and the condition that the container 21 is softened due to overhigh heating temperature is avoided.

In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (12)

1. The crystal pulling production equipment comprises a single crystal furnace and a feeding assembly, wherein the feeding assembly is positioned outside the single crystal furnace, and the crystal pulling production equipment is characterized in that the feeding assembly is provided with an air inlet pipe, the air inlet pipe is used for introducing clean gas, and the clean gas enters the single crystal furnace through the feeding assembly.

2. A crystal puller as set forth in claim 1 wherein the feed assembly includes a liquid feed device for adding liquid silicon material into the single crystal furnace; the air inlet pipe comprises a second air inlet pipe and/or a third air inlet pipe which are arranged on the liquid feeding device.

3. A crystal pulling apparatus as set forth in claim 2 wherein the liquid charging device comprises a receiving chamber, a vessel for holding solid and/or liquid silicon charge, the vessel having a discharge port communicating with the single crystal furnace, the vessel and the heater both being located in the receiving chamber, and a heater for heating and melting the silicon charge in the vessel.

4. A crystal pulling production apparatus as set forth in claim 3 wherein the second inlet tube is disposed in communication with the top of the containment chamber, and the outlet of the second inlet tube corresponds to the feed inlet of the vessel.

5. A crystal puller as set forth in claim 3 wherein the liquid feed device further comprises an insulation member in the receiving chamber, the insulation member having an inner chamber, the vessel and the heater both being located in the inner chamber;

the heat preservation component is provided with an avoiding hole, and the avoiding hole corresponds to the feed inlet of the container.

6. A crystal pulling production apparatus as set forth in claim 5 wherein the third gas inlet pipe is disposed in communication with a side portion of the accommodating chamber, the heat insulating member having a vent hole with an inner end communicating with the feed port of the container and an outer end corresponding to the gas outlet of the third gas inlet pipe.

7. A crystal puller as set forth in claim 3 further comprising a cooling device disposed at a side or bottom of the receiving chamber.

8. A crystal pulling apparatus as set forth in claim 1 wherein the feed assembly comprises a solids feed device for adding a solid silicon charge into the single crystal furnace, the gas inlet tube comprising a first gas inlet tube positioned on the solids feed device.

9. A crystal pulling production apparatus as set forth in claim 8 wherein the solid feed device includes a feed bin and a delivery device, both ends of the delivery device communicating with the feed bin and the single crystal furnace, respectively, for delivering the solid silicon material from the feed bin to the single crystal furnace; the first air inlet pipe is communicated with the side part of the feeding bin, and the clean gas enters the single crystal furnace through the conveying device.

10. A crystal pulling production apparatus as set forth in claim 1 wherein the feed assembly includes a solid feed device and a liquid feed device, the solid feed device delivering a solid silicon charge into the liquid feed device, the liquid feed device delivering the solid silicon charge into the single crystal furnace after melting it into a liquid silicon charge; the air inlet pipe comprises at least one of a first air inlet pipe, a second air inlet pipe and a third air inlet pipe, the first air inlet pipe is located on the solid feeding device, and the second air inlet pipe and the third air inlet pipe are located on the liquid feeding device.

11. A crystal puller as set forth in claim 10 wherein the liquid feed device further comprises an isolation valve, the liquid feed device having an inlet, the isolation valve being mounted at the inlet,

the solid feed device extends into the liquid feed device through the inlet when the isolation valve is open;

the isolation valve closes when the solid feeding device exits the liquid feeding device.

12. A crystal puller as set forth in any one of claims 1 to 11 further comprising a vacuum generating device with which the single crystal furnace is connected.

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