CN217731105U

CN217731105U - Tray structure for chip electronic component

Info

Publication number: CN217731105U
Application number: CN202221162690.7U
Authority: CN
Inventors: 胡红斌
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-05-14
Filing date: 2022-05-14
Publication date: 2022-11-04
Anticipated expiration: 2032-05-14

Abstract

The utility model provides a tray structure for slice electronic components, includes the tray, be provided with in the tray and hold the chamber, superpose about two or more slice electronic components and hold the intracavity, be provided with the grafting boss on holding the one side inner wall in chamber, be provided with the inserting groove that is used for the pin cartridge of slice electronic components on the grafting boss. The number of the inserting grooves is more than two, and the inserting grooves are arranged at intervals up and down. The insertion boss is step-shaped. The left side and the right side or the front side and the back side of the accommodating cavity are provided with clamping vacant positions used for clamping the chip electronic components. The tray is provided with a first placing groove for placing an identification card of the chip electronic component, and/or the first placing groove is/are formed in the tray; a second placing groove for placing an identity identification card of the chip electronic component is formed in the tray; the first placement groove and/or the second placement groove are provided in the middle or at the edge of the tray. The utility model has the characteristics of production efficiency is high.

Description

Tray structure for chip electronic component

Technical Field

The utility model relates to a tray structure for slice electronic components.

Background

LCD glass material is as common electronic components, when appearing on the assembly line, generally all directly puts LCD glass material in traditional blister supporting plate, and this kind of traditional blister supporting plate adopts blister material to make, and its disk body is lighter, and the wall of the dish is frivolous, yielding, mainly puts, transports the use for the material to the body profile of material is as the location standard, and the precision is lower, and the error is more than 1 mm. When the traditional special-shaped component inserter grabs or clamps the LCD glass material, the LCD glass material can be grabbed or clamped by the manipulator only after the camera is used for photographing and identifying the LCD glass material. However, the placement position and the front and back directions of the LCD glass materials in the conventional blister tray are not stable enough, so that the production efficiency is low, and therefore, the improvement is needed.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a tray structure for slice electronic components that production efficiency is high to overcome the weak point among the prior art.

The tray structure for the chip electronic components comprises a tray and is structurally characterized in that a containing cavity is formed in the tray, more than two chip electronic components are vertically overlapped in the containing cavity, an inserting boss is arranged on the inner wall of one side of the containing cavity, and an inserting groove for inserting pins of the chip electronic components is formed in the inserting boss.

Furthermore, the number of the insertion grooves is more than two, and the insertion grooves are arranged at intervals from top to bottom.

Further, the insertion boss is step-shaped.

Furthermore, the left side or the front side and the rear side of the accommodating cavity are provided with clamping vacant positions for clamping the chip electronic components.

Further, the tray is made of a material added with antistatic property; guide rails convenient to transport are arranged on two sides of the bottom of the tray; the height of the outer wall of the upper portion of the tray is larger than the height of the inner side of the upper portion of the tray, and the inner side of the upper portion of the tray comprises the containing cavity and the clamping vacant position.

Further, a first placing groove for placing an identification card of the chip electronic component is arranged on the tray, and/or; a second placing groove for placing an identification card of the chip electronic component is formed in the tray; the first placement groove and/or the second placement groove are/is provided in the middle or at the edge of the tray.

Furthermore, a through groove which penetrates through the tray up and down is formed in the inner bottom surface of the accommodating cavity.

Furthermore, a plurality of inserting holes used for positioning and inserting to achieve stacking of the trays are formed in the upper end face of each tray, inserting columns used for inserting into the inserting holes are arranged on the lower end face of each tray, and penetrating grooves which penetrate through the trays outwards are formed in the side walls of the inserting holes.

Further, the through groove is communicated with the inserting hole; the inserting holes and the inserting columns are arranged in the middle or at the edge of the tray; the tray is provided with a positioning hole for transferring and positioning.

Furthermore, a counter sink hole is formed in the upper end face of the tray, a positioning column which extends downwards and can be inserted into the counter sink hole of the other tray is arranged on the tray below the counter sink hole, and a through hole which penetrates through the positioning column upwards is formed in the counter sink hole; the counter sink hole and the positioning column are arranged in the middle or at the edge of the tray.

Furthermore, two clamping grooves matched with the manipulator to clamp are respectively arranged on the left side and the right side of the outer wall surfaces of the front side, the rear side or the left side and the right side of the tray.

Furthermore, a positioning groove is arranged between the two clamping grooves; and the bottom of the tray is provided with a reinforcing rib used for being in press joint with the chip electronic component on the other tray.

The tray in the utility model is internally provided with a containing cavity, more than two sheet electronic components are superposed in the containing cavity from top to bottom, the inner wall of one side of the containing cavity is provided with a splicing boss, and the splicing boss is provided with a splicing groove for pin splicing of the sheet electronic components; then, on the basis the same with original tray size, the slice electronic components more than the double quantity can be placed to this tray to, each slice electronic components's locating place and the position of its pin all are definite, snatch or press from both sides for the later stage and get and provide very big facility, thereby improved production efficiency.

In the utility model, the height of the outer wall of the upper part of the tray is greater than the height of the inner side of the upper part of the tray, and the inner side of the upper part of the tray comprises the accommodating cavity and the clamping vacant position; after the cartridge has slice electronic components on a tray, slice electronic components's height can not surpass the height of the outer wall on this tray upper portion, then can be through the bottom crimping of another tray on this tray, and can not make slice electronic components by another tray clamping ring to improve the stability of product, reduced the defective rate.

The utility model discloses not only can be applicable to flaky LCD glass material, but also be applicable to other flaky electronic components, its application scope that has the broad.

To sum up, the utility model has the characteristics of production efficiency is high.

Drawings

Fig. 1 is a schematic perspective view of an embodiment of the present invention.

Fig. 2 is a second schematic perspective view of the present invention.

Fig. 3 is a schematic cross-sectional view of the present invention.

Fig. 4 is an enlarged schematic view of a portion a in fig. 3.

Fig. 5 is a schematic view of the partial cutting structure of the present invention.

FIG. 6 is a schematic diagram of the structure of a sheet of LCD glass material.

Fig. 7 is a third schematic view of a three-dimensional structure of the present invention.

Fig. 8 is a partially cut-away perspective view of an embodiment of the present invention.

In the figure: 10 is the tray, 20 is the LCD glass material, 100 is for holding the chamber, 101 the inserting groove, 102 is the logical groove, 110 is the heavy platform hole, 111 is the reference column, 120 is the second standing groove, 130 is the first standing groove, 140 is the locating hole, 150 is for pressing from both sides and gets the groove, 160 is the spliced eye, 161 is the spliced pole, 162 is for running through the groove, 170 is the constant head tank, 180 is the strengthening rib, 200 is the pin of LCD glass material, 300 is for pressing from both sides and gets the vacancy.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and examples.

Referring to fig. 1-8, a tray structure for a chip electronic component includes a tray 10, a containing cavity 100 is provided in the tray 10, more than two chip electronic components 20 are stacked in the containing cavity 100, an insertion boss is provided on an inner wall of one side of the containing cavity 100, and an insertion groove 101 for inserting pins 200 of the chip electronic component is provided on the insertion boss.

During the use, through putting into the intracavity that holds slice electronic components, slice electronic components's pin is pegged graft in the inserting groove, and stability in placement is good, when using, presss from both sides to holding the intracavity through the manipulator and gets. Simple structure, and meets the use requirement.

In this embodiment, the number of the inserting grooves 101 is two or more, and the inserting grooves are spaced up and down.

A plurality of chip electronic components are stacked up and down to improve the storage capacity and the utilization rate of the tray.

The insertion boss is step-shaped.

The accommodation chamber 100 is provided with gripping vacant positions 300 for gripping the chip electronic components 20 on the left and right sides or on the front and rear sides.

The tray 10 is provided with a first placing groove 130 for placing an identification card of a chip electronic component, and/or; a second placing groove 120 for placing an identification card of the chip electronic component is arranged on the tray 10; the first placing groove 130 and/or the second placing groove 120 are provided in the middle or at the edge of the tray 10.

In this embodiment, a square first placing groove 130 is disposed on the left side of the middle position of the top of the tray, and is used for attaching a two-dimensional code or an RFID electronic tag, that is, an identification card of a chip electronic component, which is a unique code of the tray, and is used for marking the type of the tray and its unique encoding data. The tray type can be according to material specification design die sinking, through two-dimensional code or RFID electronic tags's discernment, in the transfer machine transportation, can bind tray information through sweeping the sign indicating number, realizes binding, reading, modification, unbinding of information such as the tray realization model, quantity, parameter in automation line, realizes automatic application.

The right side of tray top intermediate position is provided with second standing groove 120 for place activity two-dimensional code or RFID electronic tags, also be exactly electronic components's interim identification card, be used for placing the same size, the material two-dimensional code or the RFID electronic tags of different parameters, be used for the parameter change.

A through groove 102 penetrating the tray 10 up and down is formed on the inner bottom surface of the accommodating chamber 100. The through-grooves 102 allow the chip electronic components to be ejected upward from the accommodation chamber 100, preventing the chip electronic components from being stuck in the accommodation chamber 100.

A plurality of inserting holes 160 for positioning and inserting to realize stacking of the trays 10 are formed in the upper end face of the tray 10, inserting columns 161 for inserting into the inserting holes 160 are formed in the lower end face of the tray 10, and through grooves 162 which penetrate through the tray 10 outwards are formed in the side walls of the inserting holes 160; the through groove 162 is communicated with the inserting hole 160; the inserting holes 160 and the inserting columns 161 are arranged in the middle or at the edge of the tray 10; the tray 10 is provided with a positioning hole 140 for transferring and positioning.

In the present embodiment, the positioning hole 140 is an extracting position for fixing the through hole after a plurality of trays are stacked up and down. After the trays are stacked up and down, the trays can be strung together by a shaft from the middle, and the transportation is convenient.

A counter sink hole 110 is formed in the upper end face of the tray 10, a positioning column 111 which extends downwards and can be inserted into the counter sink hole 110 of another tray 10 is arranged on the tray 10 below the counter sink hole 110, and a through hole 112 which penetrates through the positioning column 111 upwards is formed in the counter sink hole 110; the counter sink holes 110 and the positioning pillars 111 are provided in the middle or the edge of the tray 10.

Through these posts and holes, can pile up the tray through the mode of piling up from top to bottom, can cover the component top simultaneously, prevent that it from deviating from the tray, the security when having improved the transportation.

In the embodiment, the through holes 112 prevent air from being extruded out of the counter sink holes 110 to generate vacuum adsorption when the trays are stacked up and down, so that the trays stacked up and down cannot be separated normally, and the production efficiency is ensured.

Two clamping grooves 150 matched with a manipulator for clamping are respectively arranged on the left side and the right side of the outer wall surfaces of the front side, the back side or the left side and the right side of the tray 10, and a positioning groove 170 is arranged between the two clamping grooves 150; the bottom of the tray 10 is provided with a reinforcing rib 180 for press-contacting the chip electronic component 20 on another tray 10.

In this embodiment, constant head tank 170 is the trapezium structure, can realize tray machinery location, makes the plug-in components head fix a position accurately when getting the material, realizes uniformity, the commonality that the tray material snatched.

The square gripping groove 150 can achieve consistency and versatility in gripping the pallet.

The sheet-like electronic components 20 on the lower tray 10 can be pressed by the reinforcing ribs 180 of the upper tray, thereby effectively preventing unnecessary vibration of the sheet-like electronic components 20 in the tray due to midway transfer, and ensuring the product quality.

The tray 10 is made of a material added with antistatic property; the tray 10 is provided at both sides of the bottom thereof with guide rails for easy transportation. The automatic transportation of the track of tray can be realized through the guide rail, and the uniformity and the commonality are guaranteed.

In the embodiment, the overall dimension of each tray 10 is the same size and the same specification, so that a strong guarantee is provided for realizing automatic production and improving production efficiency.

In this embodiment, the height of the outer wall of the upper part of the tray 10 is greater than the height of the inner side of the upper part of the tray 10, and the inner side of the upper part of the tray 10 includes the accommodation chamber 100 and the gripping vacant position 300; as shown in fig. 8.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore are not to be construed as limiting the invention, and the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying a number of technical features indicated.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only illustrative of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the present invention, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a tray structure for slice electronic components, includes tray (10), characterized by be provided with in tray (10) and hold chamber (100), superpose about two or more slice electronic components (20) is in holding chamber (100), be provided with the grafting boss on holding one side inner wall in chamber (100), be provided with inserting groove (101) that are used for pin (200) cartridge of slice electronic components on the grafting boss.

2. The tray structure for chip electronic components as claimed in claim 1, wherein the number of the inserting grooves (101) is two or more, and the inserting grooves are spaced up and down.

3. The tray structure for chip electronic components as claimed in claim 2, wherein said insertion projection is stepped.

4. The tray structure for chip electronic components as claimed in claim 1, wherein the housing cavity (100) is provided with gripping vacant positions (300) for gripping the chip electronic components (20) at left and right sides or front and rear sides thereof.

5. The tray structure for chip electronic components as claimed in claim 4, wherein the tray (10) is made of a material to which an antistatic property is added; guide rails convenient to transport are arranged on two sides of the bottom of the tray (10); the height of the outer wall of the upper portion of the tray (10) is larger than the height of the inner side of the upper portion of the tray (10), and the inner side of the upper portion of the tray (10) comprises the accommodating cavity (100) and the clamping vacant position (300).

6. The tray structure for chip electronic components as claimed in claim 1, wherein the tray (10) is provided with a first placing groove (130) for placing an identification card of a chip electronic component, and/or; a second placing groove (120) for placing an identification card of the chip electronic component is arranged on the tray (10); the first placement groove (130) and/or the second placement groove (120) are arranged in the middle or at the edge of the tray (10).

7. The tray structure for chip electronic components as claimed in claim 1, wherein a through groove (102) penetrating the tray (10) up and down is provided on an inner bottom surface of the accommodation chamber (100).

8. The tray structure for chip electronic components as claimed in claim 1, wherein the upper end surface of the tray (10) is provided with a plurality of insertion holes (160) for positioning and inserting to realize stacking of the trays (10), the lower end surface of the tray (10) is provided with insertion posts (161) for inserting into the insertion holes (160), and the side walls of the insertion holes (160) are provided with through grooves (162) outwardly penetrating the tray (10); the through groove (162) is communicated with the inserting hole (160); the plug holes (160) and the plug columns (161) are arranged in the middle or at the edge of the tray (10); the tray (10) is provided with a positioning hole (140) for transferring and positioning.

9. The tray structure for chip electronic components as claimed in claim 1, wherein a counter sink hole (110) is formed on an upper end surface of the tray (10), a positioning post (111) extending downward and being capable of being inserted into the counter sink hole (110) of another tray (10) is formed on the tray (10) below the counter sink hole (110), and a through hole (112) penetrating the positioning post (111) upward is formed in the counter sink hole (110); the counter sink hole (110) and the positioning column (111) are arranged in the middle or at the edge of the tray (10).

10. The tray structure for chip electronic components as claimed in claim 1, wherein two gripping grooves (150) for gripping with a robot are provided on the left and right of the outer wall surface of the tray (10) on the front and rear sides or on the left and right sides, respectively, and a positioning groove (170) is provided between the two gripping grooves (150); the bottom of the tray (10) is provided with a reinforcing rib (180) which is used for being pressed on the chip electronic component (20) on the other tray (10).