CN217542847U

CN217542847U - Novel AOI inspection is with falling piece device

Info

Publication number: CN217542847U
Application number: CN202220406865.8U
Authority: CN
Inventors: 洪加添; 陈雅君
Original assignee: Fujian Prima Optoelectronics Co Ltd
Current assignee: Fujian Prima Optoelectronics Co Ltd
Priority date: 2022-02-28
Filing date: 2022-02-28
Publication date: 2022-10-04
Anticipated expiration: 2032-02-28

Abstract

The utility model provides a novel AOI is rewinding device for inspection, including body and picture peg, the body middle part is provided with accommodation space and relative both sides wall and is provided with the slot that corresponds the jam box wafer position, picture peg and slot assorted are pegged graft in the slot, the utility model discloses a rewinding device sets up in the device body and holds the chamber to set up the slot that corresponds with the draw-in groove size of the jam box that has enough to meet the need the wafer usefulness, can place the transfer wafer through the slot, and can peg graft in the slot and place the picture peg, fill through the picture peg and need not to place the slot of wafer, can take out the picture peg that the appointed wafer that needs the transfer corresponds the position during use, the top opening that the card that will be equipped with the wafer box aims at this device falls downwards, the wafer that need not to shift can be blockked by the picture peg, the wafer that needs the transfer then can be poured into in the slot that does not have the picture peg graft, thereby can once only shift appointed multi-disc, operating efficiency is high and be difficult for making mistakes and fish tail wafer.

Description

Novel AOI inspection is with falling piece device

Technical Field

The utility model relates to a AOI detects technical field, concretely relates to novel AOI inspects and uses rewinding device.

Background

AOI (Automated Optical Inspection) automatic Optical Inspection refers to an apparatus that detects common defects encountered in solder production based on Optical principles. In the field of LEDs, after production, manufactured wafers are usually loaded into a cassette, and then quality inspection is performed, where a batch of 24 wafers are usually fixed for AOI inspection, and the machine can perform operations in sequence, and cannot perform operations with a specified number of wafers. When the number of wafers is specified, the suction pen is required to suck the wafers in the clamping and plugging box and put the wafers into the AOI jig, then AOI inspection operation is carried out, and after the operation is finished, the wafers in the AOI jig are sucked and put back into the clamping and plugging box. The time consumption of the conventional suction pen operation is long, the wafer is scratched due to the improper wafer suction operation twice, the product is abnormally lost, and the risk of sucking wrong wafer numbers exists.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the utility model provides a novel AOI is flip chip device for inspection, can once only shift appointed multi-disc wafer, the high just difficult mistake of operating efficiency and fish tail wafer.

In order to solve the technical problem, the utility model discloses a technical scheme be:

the utility model provides a novel AOI inspection is with falling piece device, includes body and picture peg, the body middle part is provided with accommodation space and relative both sides wall and is provided with the slot that corresponds the jam box wafer position, the picture peg with the slot phase-match peg graft in the slot.

Furthermore, the body is provided with a positioning hole and a positioning column corresponding to the blocking box.

Furthermore, the thickness of one end, facing the bottom of the slot, of the inserting plate is smaller than that of the other opposite end of the inserting plate, and the inserting plate is in interference fit with the slot.

Furthermore, the middle part of the inserting plate is provided with a hooking through hole.

Further, the upper end of the body is provided with a wafer direction mark.

Further, the main body is provided with 25 pairs of slots.

The beneficial effects of the utility model reside in that: the device body is provided with a containing cavity and a slot with the size corresponding to the size of a slot of a blocking box for transferring the wafer, the wafer can be placed and transferred through the slot, an inserting plate can be inserted and placed in the slot, the slot without placing the wafer is plugged through the inserting plate, the inserting plate at the corresponding position of the appointed wafer to be transferred can be taken out when in use, the plug box with the wafers is aligned with the upper opening of the device and falls downwards, the wafers which do not need to be transferred can be blocked by the plug board, and the wafers which need to be transferred can be poured into the slots without the plug board, so that the appointed wafers can be transferred at one time, the operation efficiency is high, and the wafers are not prone to error and scratching.

Drawings

Fig. 1 is a schematic top view of a novel rewinding device for AOI inspection according to a first embodiment of the present invention;

fig. 2 is a schematic left side structural view of a body of a novel rewinding device for AOI inspection according to a first embodiment of the present invention;

fig. 3 is a schematic left side structural view of a plug board of a novel rewinding device for AOI inspection according to a first embodiment of the present invention;

fig. 4 is a schematic front side structural diagram of a novel insert plate of a rewinding device for AOI inspection according to a first embodiment of the present invention.

Description of reference numerals:

1. a body; 11. an accommodating space; 12. inserting slots; 13. a positioning column; 14. positioning holes; 15. marking the direction of the wafer; 2. inserting plates; 21. and hooking the through hole.

Detailed Description

In order to explain the technical contents, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1 to 4, a novel AOI inspection rewinding device includes a body and an insertion board, wherein the body has a receiving space in the middle and slots corresponding to the positions of the wafers in the plugging boxes are disposed on two opposite side walls, and the insertion board and the slots are inserted into the slots in a matching manner.

From the above description, the beneficial effects of the utility model reside in that: set up in the device body and hold the chamber, and set up and hold the slot that the size of position corresponds with the wafer of the jam box that has enough to meet the need the wafer is held, can place the transfer wafer through the slot, and can peg graft in the slot and place the picture peg, fill the slot that need not to place the wafer through the picture peg, can take out the picture peg that the appointed wafer that needs the transfer corresponds the position during use, the top opening that the jam box that will be equipped with the wafer aims at this device falls down, the wafer that need not to shift can be blockked by the picture peg, the wafer that needs the transfer then can be poured into the slot that does not have the picture peg, thereby can once only shift appointed multi-disc wafer, high operating efficiency and difficult mistake and fish tail wafer.

According to the device, the positioning columns and the positioning holes corresponding to the fixing holes and the fixing columns on the clamping and plugging box are arranged on the device body, when the clamping and plugging box is aligned to the device, the clamping and plugging box can be aligned accurately and quickly through the positioning columns and the positioning holes, and the wafer and the slot are prevented from being scratched in a staggered mode due to inaccurate alignment.

Furthermore, the thickness of one end of the inserting plate facing the bottom of the slot is smaller than that of the other opposite end, and the inserting plate is in interference fit with the slot.

According to the description, the inserting plate is arranged to be approximately wedge-shaped, the upper part of the inserting plate is thick, the lower part of the inserting plate is thin, the inserting plate is in interference fit with the inserting groove of the body, the inserting plate can be firmly inserted into the inserting groove, and the shifting and scattering in the rewinding and transferring processes are avoided.

As can be seen from the above description, the hooking through hole is formed in the middle of the board to facilitate taking out the board at a specific position from the densely arranged boards.

Further, the upper end of the body is provided with a wafer direction mark.

According to the description, the wafer direction mark for guiding the direction is arranged on the device body, and the wafer is poured into the device body correspondingly according to the mark, so that the wafer pouring scratch caused by the direction error is avoided.

Further, the main body is provided with 25 pairs of slots.

As can be seen from the above description, the slots are set to 25 pairs, corresponding to the number of AOI device jams. The flip chip device can perform the inspection operation of 24 wafers at a time, and can also perform the inspection operation of 25 wafers at a time corresponding to the AOI inspection equipment.

The utility model discloses a novel AOI inspection is with falling piece device can be used to carry out the wafer transfer work in the AOI inspection, especially can be used to once only shift the wafer of a plurality of assigned positions. Taking out the inserting plate hook in the slot at the corresponding position of the appointed wafer on the device body, directly inverting the wafer by corresponding the positioning column and the positioning hole of the device body to the fixing hole and the fixing column of the original clamping and plugging box, pouring the wafer at the appointed position into the inverting device at one time, and then pouring the appointed wafer in the inverting device into the special AOI equipment clamping and plugging for machine-on inspection. Use the utility model discloses a rewinding unit can once only shift appointed multi-disc wafer, and operating efficiency is high and be difficult for making mistakes and fish tail wafer.

Referring to fig. 1 to 4, a first embodiment of the present invention is:

a novel rewinding device for AOI inspection comprises a body 1 and an inserting plate 2. As shown in fig. 1 and 2, the body 1 has a receiving space 11 in the middle, and 25 pairs of slots 12 are disposed on two opposite side walls of the receiving space 11, and the length, width and depth of the slots 12 correspond to the wafer receiving position of the cassette and the size of the wafer to be detected. The body 1 is provided with a positioning hole 14 and a positioning column 13 which correspond to the fixing column and the fixing hole of the blocking box, and the upper end of the body 1 is provided with a wafer direction mark 15, so that the wafer can be kept in the correct direction when being rewound.

As shown in fig. 1 and fig. 3 to 4, the inserting plate 2 and the inserting groove 12 are inserted into the inserting groove 12 in a matching manner, a thickness of one end of the inserting plate 2 facing the bottom of the inserting groove 12 is smaller than a thickness of the other end, and the inserting plate 2 and the inserting groove 12 are in interference fit. The middle part of the inserting plate 2 is provided with a hooking through hole 21, the hooking through hole 21 can be arranged in the middle and is round, and the hooking through hole can also be arranged at a position and other shapes which are convenient for hooking and taking out the appointed inserting plate 2 among the inserting plates 2 which are arranged relatively densely.

The utility model discloses a novel AOI inspects with falling piece device's application method does:

taking the designated wafer of the 1 st, 5 th, 10 th, 15 th, 20 th and 24 th positions of the original cassette to be transferred to carry out operation inspection as an example, the inserting plate 2 corresponding to the 1 st, 5 th, 10 th, 15 th, 20 th and 24 th positions is hooked out from the slot 12 through the hooking through hole 21 in the reversing device, then the fixing column and the fixing hole of the original cassette are aligned with the positioning hole 14 and the positioning column 13 on the body 1 of the reversing device, namely the fixing column of the original cassette is inserted into the positioning hole 14 on the body 1, the fixing hole on the original cassette is sleeved on the positioning column 13 on the body 1, and the wafer is poured into the slot 12 of the reversing device. At the moment, the wafer rewinding device is provided with slots 12 with the 1 st, 5 th, 10 th, 15 th, 20 th and 24 th positions, wafers can enter 6 slots 12, and the other slots 12 are inserted with inserting plates 2, so that the wafers cannot enter, and multiple appointed wafers can be accurately and efficiently transferred at one time without scratching the wafers.

To sum up, the utility model provides a pair of novel AOI is rewinding device for inspection, through with set up on the body with the fixed wafer disk of chamber and slot that holds of former calorie of stopper box and wafer corresponding dimension, and set up the dismantled and assembled picture peg with slot interference fit, vacate the slot so that hold and shift appointed wafer through the picture peg that takes out to correspond appointed wafer position, and block the wafer that need not to shift through other unknown picture pegs, reference column and locating hole through the body are aimed at with the quick accurate matching of former calorie of stopper box, the rewinding device can be direct once only pours into whole appointed wafer into, can enough improve the efficiency of shifting the wafer, can avoid appearing the condition of fish tail wafer in the multiple transfer again.

The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.

Claims

1. The novel wafer rewinding device for AOI (automatic optical inspection) is characterized by comprising a body and an inserting plate, wherein the middle part of the body is provided with an accommodating space, opposite two side walls of the body are provided with inserting slots corresponding to the positions of wafers in a plug box, the length, the width and the depth of each inserting slot correspond to the accommodating position of the wafers in the plug box and the size of the wafer to be detected, and the inserting plate is inserted into the inserting slots in a matched manner;

the body is provided with a positioning hole and a positioning column corresponding to the blocking box.

2. The novel flip chip device for AOI inspection as claimed in claim 1, wherein the thickness of the insert plate is smaller at one end facing the bottom of the slot than at the opposite end, and the insert plate is in interference fit with the slot.

3. The novel rewinding device for AOI inspection as claimed in claim 1, wherein a hooking through hole is formed in the middle of the insert plate.

4. The novel flip chip device for AOI inspection as claimed in claim 1, wherein the upper end of the body is provided with a wafer orientation mark.

5. The novel flip chip device for AOI inspection as claimed in claim 1, wherein the body is provided with 25 pairs of slots.