CN217728098U - Liquid supplementing device for nano polishing of plasma liquid - Google Patents

Abstract

The utility model provides a fluid infusion device for plasma liquid nanometer polishing, this fluid infusion device includes fluid infusion groove, fluid infusion pipe and the first level sensor who is used for monitoring liquid level in the polishing solution basin, the fluid infusion groove is used for saving the polishing solution, the both ends of fluid infusion pipe respectively with fluid infusion groove and polishing solution basin fixed connection, the fluid infusion union coupling has the driving piece, the driving piece is used for carrying the polishing solution in the fluid infusion groove to the polishing solution basin, a level sensor and polishing solution basin fixed connection, a level sensor is connected with the controller, the controller is connected with the driving piece. The utility model discloses a fluid infusion device, with the polishing solution of fluid infusion inslot carry the polishing solution basin through fluid infusion pipe in, make the liquid level of polishing solution all the time high with the height of work piece, no longer need shut down artifical fluid infusion, reached the purpose that improves the machining efficiency of nanometer polishing.

Description

Liquid supplementing device for nano polishing of plasma liquid

Technical Field

The utility model belongs to the technical field of plasma liquid nanometer polishing technique and specifically relates to a fluid infusion device for polishing of plasma liquid nanometer.

Background

At present, plasma liquid nano polishing is based on a vapor-liquid plasma generation principle, a gas layer which completely wraps a workpiece is formed on the surface of the workpiece through polishing liquid, and the gas layer is excited to a plasma state, so that the roughness value of the surface of the polished workpiece can reach or approach a nano level.

During the nano polishing of the plasma liquid, the formed gas layer is unstable and the high-temperature liquid is boiled, so that the liquid is splashed and gushes out, the reduction of the liquid can expose the workpiece to the liquid surface, and the whole processing cannot be finished, so that the stability of the polishing liquid surface is an important factor for ensuring the normal processing; in the existing scheme, for a workpiece with a large volume or a complex shape, polishing liquid splashes or overflows due to instability of a gas layer, and the polishing is generally processed in an intermittent processing mode of processing in a short time and then manually supplementing the liquid for reprocessing, so that the processing efficiency of nano polishing is low.

In view of the foregoing, there is a need for a fluid replacement device for plasma liquid nano-polishing.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a fluid infusion device for plasma liquid nanometer polishing to solve the technical problem that the machining efficiency of the nanometer polishing that exists is low among the prior art.

For solving the technical problem, the utility model provides a pair of fluid infusion device for plasma liquid nanometer polishing, this fluid infusion device includes the fluid infusion groove, fluid infusion pipe and the first level sensor who is used for monitoring liquid level in the polishing solution basin, the fluid infusion groove is used for saving the polishing solution, the both ends of fluid infusion pipe respectively with fluid infusion groove and polishing solution basin fixed connection, the fluid infusion union coupling has the driving piece, the driving piece is used for carrying the polishing solution in the fluid infusion groove to the polishing solution basin, a level sensor and polishing solution basin fixed connection, a level sensor is connected with the controller, the controller is connected with the driving piece.

Through foretell technical scheme, when carrying out polishing processing, the polishing solution in the polishing solution basin is along with the going on of processing constantly splashes, lead to the polishing solution surface in the polishing solution basin to descend gradually, when the liquid level that first level sensor sensed the polishing solution drops below first level sensor, first level sensor gives the controller with signal transmission, controller control driving piece starts, the polishing solution of driving piece in with the fluid infusion inslot is carried to the polishing solution basin through the fluid infusion pipe, when the liquid level that first level sensor sensed the polishing solution rises above first level sensor, first level sensor gives the controller with signal transmission, controller control driving piece closes and no longer carries the polishing solution in the fluid infusion inslot to the liquid infusion inslot, thereby make the liquid level of polishing solution height and the height of work piece all the time, make the work piece soak in the polishing solution completely, no longer need shut down artifical fluid infusion, the mesh that has reached the improvement nanometer polishing's machining efficiency.

Furthermore, the polishing solution water tank is provided with a splash-proof cover which is fixed above the polishing solution water tank.

Through above-mentioned modified technical scheme, set up in the top of polishing solution basin and prevent splashing the cover, when the polishing solution in the polishing solution basin splashes, the polishing solution splashes to prevent splashing and covers, and partial polishing solution is preventing splashing and is covering to assemble the back and dripping in the polishing solution basin again, has the effect that reduces the polishing solution loss.

Further, the polishing solution basin is fixed in the top in makeup groove, and the cover that prevents splashing covers establishes the area and is greater than the notch area in polishing solution basin, and prevents splashing covers and establishes the area and be less than the notch area in makeup groove.

Through above-mentioned modified technical scheme, set up the fluid infusion groove in the below of polishing solution basin to make the area in fluid infusion groove be greater than and prevent splashing the area of cover, make prevent splashing the polishing solution that covers and can instil into the fluid infusion inslot, retrieve the polishing solution, further reduce the loss to the polishing solution.

Further, prevent splashing the cover and include shielding plate and drainage plate, the shielding plate setting is in the top of polishing solution basin, and the shielding plate shelters from the notch of polishing solution basin completely, and the drainage plate is provided with a plurality ofly, and a plurality of drainage plate ring shielding plate set up, every drainage plate all with shielding plate fixed connection.

Through above-mentioned modified technical scheme, the shielding plate shelters from directly over the notch of polishing solution basin, then sets up the drainage plate at the edge of shielding plate again, utilizes the drainage plate to carry out the drainage to the polishing solution on the shielding plate, makes the polishing solution flow in the makeup tank, accomplishes the polishing solution recovery to splashing.

Furthermore, a second liquid level sensor is arranged in the liquid supplementing groove, the second liquid level sensor is fixedly connected with the side wall of the liquid supplementing groove, and the second liquid level sensor is connected with the controller.

Through above-mentioned modified technical scheme, through set up second liquid level sensor in the fluid infusion groove for detect the liquid level of fluid infusion inslot polishing solution, still continue to take out after avoiding the driving piece to find time the polishing solution in the fluid infusion inslot.

Further, the second liquid level sensor is close to the bottom of the liquid supplementing groove.

Furthermore, a salinity detection sensor is arranged in the fluid infusion tank and fixedly connected with the side wall of the fluid infusion tank, and the salinity detection sensor is connected with the controller.

Through above-mentioned modified technical scheme, the conductivity through setting up salinity sensor detection solution confirms the salinity in the solution, avoids unqualified polishing solution to supply into the polishing solution basin from the fluid infusion groove.

Furthermore, a workpiece is soaked in the polishing solution water tank, the workpiece is connected with a power supply, the positive pole of the power supply is connected with the workpiece, and the negative pole of the power supply is connected with the polishing solution water tank.

According to the improved technical scheme, when the workpiece is polished, the workpiece is firstly connected with the positive pole of the power supply, then the polishing solution water tank is connected with the negative pole of the power supply, and finally the workpiece is moved and soaked in the polishing solution.

Furthermore, first level sensor sets up in the polishing solution basin liftable ground, and the fluid infusion device still includes elevating system, and elevating system's both ends respectively with the lateral wall fixed connection of first level sensor and polishing solution basin for drive first level sensor goes up and down in the polishing solution basin.

Through above-mentioned modified technical scheme, through set up elevating system on polishing solution basin and first level sensor, adjust the position of first level sensor in the polishing solution basin, make the polishing solution basin be applicable to and polish and automatic fluid infusion to the work piece of co-altitude not.

Adopt above-mentioned technical scheme, the utility model discloses following beneficial effect has:

the utility model provides a pair of fluid infusion device for plasma liquid nanometer polishing, when polishing man-hour, polishing solution in the polishing solution basin is along with going on constantly spattering of processing, lead to the polishing solution surface in the polishing solution basin to descend gradually, when the liquid level that first level sensor sensed polishing solution drops below first level sensor, first level sensor gives the controller with signal transmission, controller control driving piece starts, the driving piece passes through fluid infusion pipe with polishing solution in the fluid infusion inslot and transports in the polishing solution basin, when the liquid level that first level sensor sensed polishing solution rises above first level sensor, first level sensor gives the controller with signal transmission, controller control driving piece closes and no longer carries polishing solution inslot with polishing solution in the fluid infusion inslot, thereby make the liquid level of polishing solution height all the time and the height of work piece, make the work piece soak completely in polishing solution, no longer need shut down artifical fluid infusion, the mesh that has reached the machining efficiency who improves nanometer polishing.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments or the description in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of a solution supplementing device for plasma liquid nano polishing according to an embodiment of the present invention;

fig. 2 is a schematic view showing a structure of the splash guard.

Reference numerals are as follows:

1. a polishing solution tank; 2. a workpiece; 3. a drive member; 4. a first liquid level sensor; 5. a splash guard; 51. a shielding plate; 52. a drainage plate; 6. a power source; 7. a liquid supplementing pipe; 8. a liquid supplementing groove; 9. a second liquid level sensor; 10. a controller; 20. and a salinity detection sensor.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The present invention will be further explained with reference to specific embodiments.

As shown in fig. 1, the solution supplementing device for plasma liquid nano polishing provided in this embodiment includes a solution supplementing tank 8, a solution supplementing pipe 7, and a first liquid level sensor 4 for monitoring a liquid level in a polishing liquid tank 1, where the solution supplementing tank 8 is used for storing polishing liquid, two ends of the solution supplementing pipe 7 are respectively and fixedly connected to the solution supplementing tank 8 and the polishing liquid tank 1, the solution supplementing pipe 7 is connected to a driving member 3, and the driving member 3 is used for conveying polishing liquid in the solution supplementing tank 8 to the polishing liquid tank 1, in this embodiment, the driving member 3 is a solution supplementing pump; the first liquid level sensor 4 is fixedly connected with the polishing solution water tank 1, the first liquid level sensor 4 is connected with the controller 10, and the controller 10 is connected with the driving piece 3; the upper part of the polishing solution water tank 1 is provided with a splash-proof cover 5, the splash-proof cover 5 is fixedly connected with the polishing solution water tank 1, and the solution supplementing tank 8 is arranged below the polishing solution water tank 1.

Polishing solution in the polishing solution basin 1 continuously splashes along with going on of processing, lead to the polishing solution in the polishing solution basin 1 to descend gradually, when the liquid level that first level sensor 4 sensed the polishing solution drops below first level sensor 4, first level sensor 4 gives controller 10 with signal transmission, controller 10 control driving piece 3 starts, driving piece 3 carries polishing solution basin 1 in with the polishing solution in the fluid infusion groove 8 through fluid infusion pipe 7, thereby make the liquid level of polishing solution height and work piece 2's height all the time, work piece 2 soaks in the polishing solution completely, no longer need shut down artifical fluid infusion, the purpose that has improved the machining efficiency of nanometer polishing has been reached.

As shown in fig. 1, a workpiece 2 is immersed in a polishing solution tank 1, the workpiece 2 is connected to a power source 6, the positive electrode of the power source 6 is connected to the workpiece 2, and the negative electrode of the power source 6 is connected to the polishing solution tank 1.

As shown in fig. 1 and fig. 2, the cover of the anti-splash cover 5 is provided with a notch area larger than the polishing solution water tank 1, the cover of the anti-splash cover 5 is provided with a notch area smaller than the feed tank 8, the anti-splash cover 5 comprises a shielding plate 51 and a drainage plate 52, the shielding plate 51 is arranged above the polishing solution water tank 1, the shielding plate 51 completely shields the notch of the polishing solution water tank 1, the drainage plate 52 is provided with a plurality of shielding plates, the plurality of drainage plates 52 are connected end to form the shielding plate 51, and each drainage plate 52 is fixedly connected with the shielding plate 51. The polishing liquid in the polishing liquid water tank 1 starts to splash along with the processing, the splashed polishing liquid is shielded by the splash-preventing cover 5, the polishing liquid is continuously gathered on the splash-preventing cover 5 and then dripped into the polishing liquid water tank 1, and part of the polishing liquid flows into the liquid supplementing tank 8 along the drainage plate 52.

As shown in fig. 1, a second liquid level sensor 9 is arranged in the fluid-replenishing tank 8, the second liquid level sensor 9 is fixedly connected with the side wall of the fluid-replenishing tank 8, the second liquid level sensor 9 is connected with a controller 10, and the second liquid level sensor 9 is close to the bottom of the fluid-replenishing tank 8; a salinity detection sensor 20 is also arranged in the liquid replenishing tank 8, the salinity detection sensor 20 is fixedly connected with the side wall of the liquid replenishing tank 8, and the salinity detection sensor 20 is connected with the controller 10.

When the polishing liquid level in the liquid supplementing tank 8 is gradually reduced along with the extraction of the polishing liquid in the liquid supplementing tank 8, and when the second liquid level sensor 9 senses that the liquid level of the polishing liquid is reduced below the second liquid level sensor 9, the second liquid level sensor 9 transmits a signal to the controller 10, and the controller 10 controls the driving part 3 to be closed, so that the driving part 3 is prevented from being empty and pumped; when the salinity detection sensor 20 detects that the salinity of the polishing solution in the fluid infusion tank 8 is not enough, the driving part 3 is controlled to be closed by the controller 10, so that the unqualified polishing solution is prevented from being infused into the polishing solution tank 1 from the fluid infusion tank 8.

In this embodiment, the first liquid level sensor 4 is further arranged in the polishing liquid tank 1 in a liftable manner, the liquid replenishing device further comprises a lifting mechanism, two ends of the lifting mechanism are respectively fixedly connected with the first liquid level sensor 4 and the side wall of the polishing liquid tank 1, and the lifting mechanism can be an air cylinder or a hydraulic cylinder and is used for driving the first liquid level sensor 4 to lift in the polishing liquid tank 1; the preferred elevating system of this embodiment includes regulating plate and couple, and the couple articulates the cooperation with the lateral wall of polishing solution basin 1, and regulating plate and couple fixed connection have seted up a plurality of spliced eye on the regulating plate, and first level sensor 4 is pegged graft with the spliced eye and is cooperated.

When the height of the first liquid level sensor 4 in the polishing solution water tank 1 is adjusted according to the height of the workpiece 2, firstly, the inserting hole with the corresponding height is selected according to the height of the workpiece 2, then, the first liquid level sensor 4 is inserted in the inserting hole, and then the movable hook is in hooking fit with the side wall of the polishing solution water tank 1.

The embodiment of the utility model provides a fluid infusion device's implementation principle for plasma liquid nanometer polishing does: when the liquid replenishing device is used, firstly, the height of the first liquid level sensor 4 in the polishing liquid water tank 1 is adjusted by using the lifting mechanism according to the height of the workpiece 2; then, the positive electrode of the power supply 6 is connected with the workpiece 2, the negative electrode of the power supply 6 is connected with the polishing solution tank 1, the workpiece 2 is immersed in the polishing solution tank 1, and then the power supply 6 is started to polish the workpiece 2.

The polishing liquid in the polishing liquid water tank 1 begins to splash along with the processing, the splashed polishing liquid is shielded by the splash-proof cover 5, the polishing liquid is continuously gathered on the splash-proof cover 5 and then dripped into the polishing liquid water tank 1, and part of the polishing liquid flows into the liquid supplementing tank 8 along the drainage plate 52.

Polishing solution in polishing solution basin 1 continuously splashes along with the going on of processing, lead to the polishing solution in polishing solution basin 1 to descend gradually, when the liquid level that first level sensor 4 sensed polishing solution drops below first level sensor 4, first level sensor 4 gives controller 10 with signal transmission, controller 10 control driving piece 3 starts, driving piece 3 carries polishing solution in fluid reservoir 8 in polishing solution basin 1 through fluid reservoir 7, when the liquid level that first level sensor 4 sensed polishing solution rises to first level sensor 4 more than, first level sensor 4 gives controller 10 with signal transmission, controller 10 control driving piece 3 closes and no longer carries polishing solution in fluid reservoir 8 in polishing solution basin 1, thereby make the liquid level of polishing solution high all the time and the height of work piece 2, make work piece 2 soak in polishing solution completely, no longer need shut down artifical fluid reservoir, the mesh that has reached the improvement nanometer polishing's machining efficiency.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications or substitutions do not depart from the scope of the invention in its corresponding aspects.

Claims (8)

1. The utility model provides a fluid infusion device for plasma liquid nano-polishing, a serial communication port, this fluid infusion device includes fluid infusion groove (8), fluid infusion pipe (7) and first level sensor (4) that are used for monitoring liquid level in polishing solution basin (1), fluid infusion groove (8) are used for saving the polishing solution, the both ends of fluid infusion pipe (7) respectively with fluid infusion groove (8) and polishing solution basin (1) fixed connection, fluid infusion pipe (7) are connected with driving piece (3), driving piece (3) are used for carrying the polishing solution in fluid infusion groove (8) to polishing solution basin (1), first level sensor (4) and polishing solution basin (1) fixed connection, first level sensor (4) are connected with controller (10), controller (10) are connected with driving piece (3).

2. The fluid replacement device for plasma liquid nano polishing according to claim 1, wherein the polishing liquid tank (1) is provided with a splash-proof cover (5), and the splash-proof cover (5) is fixed above the polishing liquid tank (1).

3. The fluid replacement device for plasma liquid nano polishing according to claim 2, wherein the polishing liquid tank (1) is fixed above the fluid replacement tank (8), the cover area of the anti-splash cover (5) is larger than the notch area of the polishing liquid tank (1), and the cover area of the anti-splash cover (5) is smaller than the notch area of the fluid replacement tank (8).

4. The fluid infusion device for plasma liquid nano-polishing according to claim 3, wherein the splash-proof cover (5) comprises a shielding plate (51) and a plurality of flow guiding plates (52), the shielding plate (51) is arranged above the polishing liquid water tank (1), the shielding plate (51) completely shields the notch of the polishing liquid water tank (1), the plurality of flow guiding plates (52) are arranged around the shielding plate (51), and each flow guiding plate (52) is fixedly connected with the shielding plate (51).

5. The fluid infusion device for plasma liquid nano-polishing according to claim 1, wherein a second liquid level sensor (9) is arranged in the fluid infusion tank (8), the second liquid level sensor (9) is fixedly connected with the side wall of the fluid infusion tank (8), and the second liquid level sensor (9) is connected with a controller (10).

6. The fluid replacement device for plasma liquid nano-polishing according to claim 5, wherein the second liquid level sensor (9) is close to the bottom of the fluid replacement tank (8).

7. The fluid infusion device for plasma liquid nano-polishing according to claim 1, wherein a salinity detection sensor (20) is arranged in the fluid infusion tank (8), the salinity detection sensor (20) is fixedly connected with the side wall of the fluid infusion tank (8), and the salinity detection sensor (20) is connected with the controller (10).

8. The fluid replacement device for plasma liquid nano polishing according to claim 1, wherein the polishing fluid in the polishing fluid tank (1) is soaked with the workpiece (2), the workpiece (2) is connected with the power supply (6), the positive pole of the power supply (6) is connected with the workpiece (2), and the negative pole of the power supply (6) is connected with the polishing fluid tank (1).

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