CN217721876U - Heat radiation structure and imaging device - Google Patents

Abstract

The utility model relates to a heat radiation structure and imaging device, imaging device include heat radiation structure and imager. The heat dissipation structure comprises a mounting piece, an extraction component and a heat exchange component, wherein a mounting cavity is formed in the mounting piece and used for placing the imager; a heat exchange channel is formed in the extraction assembly, the extraction assembly is arranged at the top of the installation piece, a first air inlet and a first air outlet which are communicated with the heat exchange channel are formed in the installation piece, and air in the installation cavity can enter the heat exchange channel from the first air inlet and return to the installation cavity from the first air outlet; the heat exchange assembly is arranged on the heat exchange channel and can exchange heat for gas in the heat exchange channel. The gas of installation cavity gets into in the heat transfer passageway by first air intake, is provided with heat exchange assembly on the heat transfer passageway and can carries out the heat transfer to gas, and then reduces gaseous temperature. The gas after the cooling gets into the installation intracavity by first air outlet, realizes cooling the installation intracavity gas, and then realizes the cooling to the imager.

Description

Heat radiation structure and imaging device

Technical Field

The utility model relates to an imaging device technical field especially relates to heat radiation structure and imaging device.

Background

In the existing life, the photoelectric imaging technology refers to a technology and a method for acquiring image information by using a photoelectric system, generally, light radiation is used as a carrier of information or energy, and a photoelectric device is used for a system for detection, sensing and measurement. With the continuous development of the photoelectric imaging device technology, the internal space arrangement is tight, so that the internal heat dissipation pressure is large, the heat dissipation effect is limited, and the high-strength working requirement cannot be met.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is necessary to provide a heat dissipation structure and an imaging apparatus capable of dissipating heat of an imager.

A heat dissipation structure comprises a mounting piece, an extraction assembly and a heat exchange assembly, wherein a mounting cavity is formed in the mounting piece and used for placing an imager; a heat exchange channel is formed in the extraction assembly, the extraction assembly is arranged at the top of the mounting piece, a first air inlet and a first air outlet which are communicated with the heat exchange channel are formed in the mounting piece, and gas in the mounting cavity can enter the heat exchange channel from the first air inlet and return to the mounting cavity from the first air outlet; the heat exchange assembly is arranged on the heat exchange channel and can exchange heat for the gas in the heat exchange channel.

In one embodiment, the extraction component comprises a heat exchange tube and a first fan, the heat exchange tube is arranged on the mounting component, the heat exchange component is connected with the heat exchange tube, a heat exchange channel is formed in the heat exchange tube, one port of the heat exchange tube is communicated with the first air inlet, the other port of the heat exchange tube is communicated with the first air outlet, and the first fan is installed in the heat exchange channel, so that gas in the heat exchange channel can move from the first air inlet to the first air outlet.

In one embodiment, the extraction assembly further comprises a spray head, the spray head is arranged at the first air outlet, and the inner diameter of a spray cavity of the spray head tends to decrease from the first air outlet in the direction towards the installation cavity.

In one embodiment, the heat exchange tubes are arranged on the mounting member in a concavo-convex arrangement.

In one embodiment, the heat exchange assembly comprises a first heat exchange member and a second heat exchange member, the first heat exchange member and the second heat exchange member are connected, the first heat exchange member is arranged on the heat exchange tube along a direction parallel to a horizontal plane, the second heat exchange member is arranged on one side surface of the heat exchange tube along a direction intersecting with the horizontal plane, and the first heat exchange member and the second heat exchange member can exchange heat with gas in the heat exchange channel.

In one embodiment, the number of the second heat exchange members is at least two, and at least two second heat exchange members are arranged on the first heat exchange member at intervals along the horizontal direction and are positioned on one side surface of the heat exchange tube.

In an embodiment, the heat dissipation structure further includes a heat dissipation assembly, the heat dissipation assembly is disposed in the mounting cavity and is used for being attached to the imager, a heat dissipation channel is formed in the heat dissipation assembly, a second air inlet and a second air outlet, which are communicated with the heat dissipation channel, are formed on the mounting member, and the second air inlet is used for introducing an external air flow into the heat dissipation channel and discharging heat of the heat dissipation assembly to an external environment through the second air outlet.

In one embodiment, the heat dissipation assembly includes a first heat dissipation member configured to attach to the imager, and a second heat dissipation member disposed on the first heat dissipation member and extending into the heat dissipation channel.

In one embodiment, the heat dissipation assembly further comprises a second fan, the second fan is arranged at the second air inlet, and the second fan can guide outside air into the heat dissipation channel.

In one embodiment, the second air inlet is further provided with a filter element, and the filter element can filter impurities in the outside air.

In one embodiment, the second air inlet is further provided with a cleaning piece, the cleaning piece is in contact with the filtering piece and is positioned on one side of the filtering piece facing the outside, and the cleaning piece can clean foreign matters on the filtering piece.

In one embodiment, the heat dissipation structure further comprises a buffer component, the buffer component can elastically deform under stress, and the mounting component is arranged on the buffer component.

An imaging device comprising the heat dissipation structure as described above and an imager disposed within the mounting cavity.

Above-mentioned heat radiation structure and imaging device, the imager is placed to the installation intracavity of installed part, and imager work can produce a large amount of heats in the installation intracavity. The extraction subassembly is started this moment, promotes the gaseous heat transfer passageway that gets into of installation cavity by first air intake in, is provided with heat exchange assemblies on the heat transfer passageway and can carries out the heat transfer to gaseous, and then reduces gaseous temperature. The gas after the cooling gets into the installation intracavity by first air outlet, realizes cooling the installation intracavity gas, and then realizes the cooling to the imager.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification.

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic configuration diagram of an image forming apparatus in an embodiment;

FIG. 2 is a schematic structural diagram of the heat dissipation structure in the embodiment of FIG. 1;

fig. 3 is a partially enlarged view of the heat dissipation structure in the embodiment of fig. 2.

The elements in the figure are labeled as follows:

10. an image forming apparatus; 100. a mounting member; 110. a mounting cavity; 120. a first air inlet; 130. a first air outlet; 140. a second air inlet; 150. a second air outlet; 160. a limiting groove; 200. an extraction assembly; 210. a heat exchange channel; 220. a heat exchange pipe; 230. a first fan; 240. a spray head; 300. a heat exchange assembly; 310. a first heat exchange member; 320. a second heat exchange member; 400. a heat dissipating component; 410. a first heat sink; 420. a second heat sink; 430. a second fan; 440. a heat dissipation channel; 500. a buffer assembly; 510. a support member; 520. a buffer member; 600. a filter member; 700. cleaning the workpiece; 800. an imager.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

Referring to fig. 1 and 2, an imaging device 10 in one embodiment includes a heat dissipation structure and an imager 800. The heat dissipation structure comprises a mounting piece 100, an extraction assembly 200 and a heat exchange assembly 300, wherein a mounting cavity 110 is formed in the mounting piece 100, and the mounting cavity 110 is used for placing the imager 800; a heat exchange channel 210 is formed in the extraction assembly 200, the extraction assembly 200 is arranged on the top of the mounting member 100, a first air inlet 120 and a first air outlet 130 which are communicated with the heat exchange channel 210 are formed in the mounting member 100, and the gas in the installation cavity 110 can enter the heat exchange channel 210 through the first air inlet 120 and return to the installation cavity 110 through the first air outlet 130; the heat exchange assembly 300 is disposed on the heat exchange channel 210, and the heat exchange assembly 300 can exchange heat with the gas in the heat exchange channel 210.

The imager 800 is disposed within the mounting cavity 110 of the mounting member 100, and operation of the imager 800 generates a significant amount of heat within the mounting cavity 110. At this time, the extraction assembly 200 is started, gas in the installation cavity 110 is promoted to enter the heat exchange channel 210 through the first air inlet 120, and the heat exchange assembly 300 arranged on the heat exchange channel 210 can exchange heat with the gas, so that the temperature of the gas is reduced. In the gaseous installation cavity 110 that gets into by first air outlet 130 after the cooling, the gaseous heat transfer cooling of carrying on in the installation cavity 110 is realized, and then the realization is to imager 800's cooling.

In one embodiment, the extraction assembly 200 includes a heat exchange tube 220 and a first fan 230, the heat exchange tube 220 is disposed on the mounting member 100, the heat exchange assembly 300 is connected to the heat exchange tube 220, a heat exchange channel 210 is formed in the heat exchange tube 220, one port of the heat exchange tube 220 is communicated with the first air inlet 120, the other port of the heat exchange tube 220 is communicated with the first air outlet 130, and the first fan 230 is installed in the heat exchange channel 210, so that the gas in the heat exchange channel 210 can move from the first air inlet 120 to the first air outlet 130. The first fan 230 can accelerate the air flow to ensure the heat dissipation efficiency of the imager 800.

In one embodiment, the extraction assembly 200 further includes a spray head 240, the spray head 240 is disposed at the first outlet opening 130, and the inner diameter of the spray cavity of the spray head 240 decreases from the first outlet opening 130 in a direction toward the installation cavity 110. From this, according to bernoulli's principle, can accelerate by spouting the gaseous velocity of flow of chamber spun, gas temperature can reduce, and then further reduces the temperature that first air outlet 130 released, guarantees the radiating effect to imager 800.

In one embodiment, the heat exchange tubes 220 are disposed on the mounting member 100 in a concavo-convex arrangement. Therefore, the residence time of the gas in the heat exchange tube 220 can be prolonged, and the heat exchange assembly 300 can fully exchange heat and cool the gas in the heat exchange tube 220. Thereby ensuring the cooling effect.

In one embodiment, the heat exchange assembly 300 includes a first heat exchange member 310 and a second heat exchange member 320, the first heat exchange member 310 and the second heat exchange member 320 are connected, the first heat exchange member 310 is disposed on the heat exchange pipe 220 in a direction parallel to a horizontal plane, the second heat exchange member 320 is disposed on one side of the heat exchange pipe 220 in a direction intersecting the horizontal plane, and both the first heat exchange member 310 and the second heat exchange member 320 can exchange heat with the gas in the heat exchange channel 210. The first heat exchange member 310 and the second heat exchange member 320 can exchange heat with the heat exchange pipe 220 from different directions, thereby ensuring the cooling effect in the heat exchange channel 210.

Specifically, the first heat exchanging member 310 includes a semiconductor chilling plate and a metal plate. The cooling effect of the heat exchanging pipe 220 can be realized.

Referring to fig. 1 and 2, in one embodiment, the number of the second heat exchange members 320 is at least two, and at least two second heat exchange members 320 are arranged on the first heat exchange member 310 at intervals in a horizontal direction and are located on one side surface of the heat exchange pipe 220. The plurality of second heat exchange members 320 can further improve heat exchange efficiency.

Referring to fig. 1 and 2, in an embodiment, the heat dissipation structure further includes a heat dissipation assembly 400, the heat dissipation assembly 400 is disposed in the mounting cavity 110 and is used for attaching to the imager 800, a heat dissipation channel 440 is formed in the heat dissipation assembly 400, a second air inlet 140 and a second air outlet 150, which are communicated with the heat dissipation channel 440, are formed on the mounting member 100, and the second air inlet 140 is used for introducing an external air flow into the heat dissipation channel 440 and discharging heat of the heat dissipation assembly 400 to an external environment through the second air outlet 150. The heat sink assembly 400 is attached to the imager 800 to ensure the heat absorption effect of the imager 800. Meanwhile, after absorbing the heat of the imager 800, the heat dissipation assembly 400 can discharge the heat to the outside through the heat dissipation channel 440, thereby further improving the heat dissipation and cooling effects on the imager 800.

Referring to fig. 2, in one embodiment, the heat dissipation assembly 400 includes a first heat dissipation member 410 and a second heat dissipation member 420, the first heat dissipation member 410 is configured to be attached to the imager 800, and the second heat dissipation member 420 is disposed on the first heat dissipation member 410 and extends into the heat dissipation channel 440. The extension of the second heat dissipation element 420 into the heat dissipation channel 440 can ensure that the heat absorbed by the first heat dissipation element 410 attached to the imager 800 can be fully released into the heat dissipation channel 440 and taken away by the outside air. Further ensuring the heat dissipation effect.

In one embodiment, the number of the second heat dissipation members 420 is at least two, and at least two of the second heat dissipation members 420 are spaced apart in the horizontal direction and extend into the heat dissipation channel 440. The heat dissipation effect of the first heat dissipation member 410 is further improved.

In one embodiment, the heat dissipation assembly 400 further includes a second fan 430, the second fan 430 is disposed at the second air inlet 140, and the second fan 430 can guide the external air into the heat dissipation channel 440. The second fan 430 can accelerate the air flow rate in the heat dissipation channel 440, and further ensure the heat dissipation effect.

Referring to fig. 2 and 3, in one embodiment, a filter element 600 is further disposed at the second air inlet 140, and the filter element 600 is capable of filtering impurities in the external air. The filter member 600 can prevent foreign substances from entering the installation cavity 110 and causing damage to the imager 800.

Referring to fig. 2 and 3, in an embodiment, a cleaning member 700 is further disposed at the second air inlet 140, the cleaning member 700 is in contact with the filter member 600 and is located at a side of the filter member 600 facing the outside, and the cleaning member 700 can clean foreign matters on the filter member 600. Therefore, the impurity is prevented from blocking the filter element 600 and the second air inlet 140, and the air inlet efficiency at the second air inlet 140 is ensured.

Referring to fig. 2 and 3, in an embodiment, the second air inlet 140 is provided with a limiting groove 160, and the cleaning member 700 is movably disposed in the limiting groove 160. Thereby, the utility of the cleaning member 700 is ensured.

Referring to fig. 1 and 2, in an embodiment, the heat dissipation structure further includes a buffer assembly 500, the buffer assembly 500 can be elastically deformed when being stressed, and the mounting member 100 is disposed on the buffer assembly 500. The damping assembly 500 can act as a damping cushion for the mounting member 100, thereby protecting the safety of the imager 800 in the mounting cavity 110.

Referring to fig. 1 and 2, in one embodiment, the buffering assembly 500 includes a buffering member 520 and a supporting member 510, the supporting member 510 is connected to the mounting member 100, the buffering member 520 is connected to the bottom of the mounting member 100, and the buffering member 520 can be elastically deformed when being stressed. The supporting member 510 can limit the mounting member 100, so as to prevent the buffer member 520 from providing a stable support for the mounting member 100.

In one embodiment, the imaging device 10 further includes a control panel, and the first fan 230, the second fan 430 and the semiconductor chilling plate are electrically connected to the control panel.

The mounting member 100 in the above embodiment is further provided with a gaussian filtering module, a down-sampling module, a memory, a sparse representation module and a signal reconstruction module, wherein the gaussian filtering module is used for implementing gaussian filtering on an incident optical image while performing optical imaging; the down-sampling module is used for down-sampling the image subjected to Gaussian filtering to obtain a low-resolution image signal; the memory is mainly used for storing the downsampled low-resolution image signal; the sparse representation module is mainly used for carrying out sparse representation on the received low-resolution image signals based on a compressive sensing theory; the signal reconstruction module is mainly used for reconstructing an original image based on a compressive sensing theory and performing high-resolution reconstruction on the digital image signal after sparse representation.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and for simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contradictory to the second feature, or indirectly contradictory to the first and second features through intervening media. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. A heat dissipation structure, comprising:

the mounting component is internally provided with a mounting cavity, and the mounting cavity is used for placing the imager;

the extraction component is arranged at the top of the installation piece, a first air inlet and a first air outlet which are communicated with the heat exchange channel are formed in the installation piece, and gas in the installation cavity can enter the heat exchange channel from the first air inlet and return to the installation cavity from the first air outlet; and

the heat exchange component is arranged on the heat exchange channel and can exchange heat for the gas in the heat exchange channel.

2. The heat dissipation structure as claimed in claim 1, wherein the extraction assembly includes a heat exchange tube and a first fan, the heat exchange tube is disposed on the mounting member, the heat exchange assembly is connected to the heat exchange tube, a heat exchange channel is formed in the heat exchange tube, one port of the heat exchange tube is communicated with the first air inlet, the other port of the heat exchange tube is communicated with the first air outlet, and the first fan is installed in the heat exchange channel so that the air in the heat exchange channel can move from the first air inlet to the first air outlet.

3. The heat dissipation structure as claimed in claim 2, wherein the extraction assembly further comprises a nozzle disposed at the first air outlet, and an inner diameter of a nozzle cavity of the nozzle is decreased from the first air outlet in a direction toward the installation cavity; and/or

The heat exchange tubes are arranged on the mounting piece in a concave-convex shape.

4. The heat dissipation structure according to claim 2, wherein the heat exchange assembly comprises a first heat exchange member and a second heat exchange member, the first heat exchange member and the second heat exchange member are connected, the first heat exchange member is disposed on the heat exchange tube in a direction parallel to a horizontal plane, the second heat exchange member is disposed on one side of the heat exchange tube in a direction intersecting the horizontal plane, and both the first heat exchange member and the second heat exchange member are capable of exchanging heat with the gas in the heat exchange channel.

5. The heat dissipating structure according to claim 4, wherein the number of the second heat exchanging elements is at least two, and at least two of the second heat exchanging elements are arranged on the first heat exchanging element at intervals in a horizontal direction and are each located on one side surface of the heat exchanging pipe.

6. The heat dissipation structure of any one of claims 1 to 5, further comprising a heat dissipation assembly, wherein the heat dissipation assembly is disposed in the mounting cavity and is used for attaching to the imager, a heat dissipation channel is formed in the heat dissipation assembly, a second air inlet and a second air outlet, which are communicated with the heat dissipation channel, are formed on the mounting member, and the second air inlet is used for introducing an external air flow into the heat dissipation channel and discharging heat of the heat dissipation assembly to an external environment through the second air outlet.

7. The heat dissipation structure of claim 6, wherein the heat dissipation assembly comprises a first heat dissipation element for attachment to the imager and a second heat dissipation element disposed on the first heat dissipation element and extending into the heat dissipation channel; the heat dissipation assembly further comprises a second fan, the second fan is arranged at the second air inlet, and the second fan can guide outside air to enter the heat dissipation channel.

8. The heat dissipating structure of claim 6, wherein the second air inlet is further provided with a filter member capable of filtering foreign substances in the external air; the second air intake department still is provided with the clearance piece, the clearance piece with filter the piece contact, and be located filter a side towards the external world, the clearance piece can be right filter the external impurity on the piece and clear up.

9. The heat dissipation structure of any one of claims 1 to 5, further comprising a buffer assembly capable of being elastically deformed by a force applied thereto, wherein the mounting member is disposed on the buffer assembly.

10. An image forming apparatus, characterized in that the image forming apparatus comprises:

the heat dissipation structure of any one of claims 1-9; and

an imager disposed within the mounting cavity.

Images