CN217715230U - Semiconductor air conditioner - Google Patents
Semiconductor air conditioner Download PDFInfo
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- CN217715230U CN217715230U CN202220681439.5U CN202220681439U CN217715230U CN 217715230 U CN217715230 U CN 217715230U CN 202220681439 U CN202220681439 U CN 202220681439U CN 217715230 U CN217715230 U CN 217715230U
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Abstract
The present disclosure relates to a semiconductor air conditioner, which includes: the heat exchanger comprises a semiconductor heat exchange fin, a first radiator and a second radiator; a semiconductor mounting board comprising: the mounting hole penetrates through the first surface and the second surface of the semiconductor mounting plate and is used for mounting the semiconductor heat exchange plate, the first temperature change surface of the semiconductor heat exchange plate faces the first surface, and the second temperature change surface of the semiconductor heat exchange plate faces the second surface; the first mounting part is arranged on the first surface and used for mounting the first radiator; and the second mounting part is arranged on the second surface and used for mounting the second radiator.
Description
Technical Field
The present disclosure relates to a household electrical appliance, and more particularly, to a semiconductor air conditioner.
Background
With the continuous improvement of the living standard of people, the air conditioner becomes electrical equipment commonly used in the life of people; a new type of air conditioner, i.e. a semiconductor air conditioner, has been increasingly favored by consumers due to the requirements of the consumers for the cooling and heating effects and convenience of the air conditioner
The semiconductor air conditioner is internally provided with the semiconductor heat exchange fins and the radiator, and in order to change the temperature of air blown out by the semiconductor air conditioner by using the semiconductor heat exchange fins and the radiator and realize the effect of refrigeration or heating, the radiator needs to be in contact with the temperature changing surfaces of the semiconductor heat exchange fins.
In the related art, the radiator is fixed on the air duct and is in contact with the semiconductor heat exchange fins, but the semiconductor air conditioner is difficult to assemble due to the fixing mode, the mold stripping difficulty in the manufacturing process of the semiconductor air conditioner is high, and the installation difficulty of the radiator is also high.
Disclosure of Invention
To overcome the problems in the related art, the present disclosure provides a semiconductor air conditioner.
According to a first aspect of an embodiment of the present disclosure, there is provided a semiconductor air conditioner including:
the heat radiator comprises a semiconductor heat exchange fin, a first radiator and a second radiator;
a semiconductor mounting board comprising:
the mounting hole penetrates through the first surface and the second surface of the semiconductor mounting plate and is used for mounting the semiconductor heat exchange plate, the first temperature change surface of the semiconductor heat exchange plate faces the first surface, and the second temperature change surface of the semiconductor heat exchange plate faces the second surface;
the first mounting part is arranged on the first surface and used for mounting the first radiator;
and the second mounting part is arranged on the second surface and used for mounting the second radiator.
Optionally, the air conditioner includes:
an air outlet duct;
the heat dissipation air duct is arranged at an interval with the air outlet air duct, and the air outlet direction of the heat dissipation air duct and the air outlet direction of the air outlet air duct form a preset included angle; wherein the preset included angle is within the range of 30 degrees to 150 degrees.
Optionally, the air outlet duct includes:
the mounting position is arranged on the inner side wall of the air outlet air duct and is used for mounting the semiconductor mounting plate on the air outlet air duct;
the projection of the heat dissipation air duct to the air outlet air duct covers the installation position.
Optionally, the heat dissipation air duct includes:
and the mounting position is arranged at the top of the heat dissipation air duct in contact with the air outlet air duct and is used for mounting the semiconductor mounting plate on the heat dissipation air duct.
Optionally, the air conditioner includes:
the mounting opening is positioned on the side wall of the air outlet air duct and is communicated with the air outlet air duct and the heat dissipation air duct;
the projection of the mounting opening towards the direction of the semiconductor mounting plate covers the first mounting part or the second mounting part of the semiconductor mounting plate;
the semiconductor mounting plate is installed in the installation position, the first radiator passes through the first installation department install in the air-out dryer, the second radiator passes through the second installation department install in the heat dissipation dryer.
Optionally, the air conditioner includes:
the first positioning groove is arranged on the outer side wall of the air outlet air duct;
the first positioning screw hole is arranged on the outer side wall of the air outlet air duct and is arranged on two sides of the mounting opening opposite to the first positioning groove;
a positioning piece, one end of which is provided with a clamping hook and the other end of which is provided with a first fixing screw hole;
through the cooperation of setting element with first positioning groove, first positioning screw, the setting element with the outside wall of air-out dryer forms the centre gripping to the second radiator.
Optionally, the first mounting portion includes:
two limit structure that sets up relatively, two form the mounting groove between the limit structure, be used for supplying first radiator insert install in the mounting groove.
Optionally, the first ends of the two limiting structures are bent towards a direction close to each other to form a limiting baffle for limiting the installation position of the first radiator in the installation groove;
the second ends of the two limiting structures incline towards the direction away from each other to form a guide inclined plane for guiding the first radiator to be inserted into the mounting groove.
Optionally, the semiconductor mounting board includes:
the second positioning groove is arranged on the first surface of the semiconductor mounting plate and is close to the first end of the limiting structure;
the second positioning screw hole is arranged on the first side wall of the semiconductor mounting plate, wherein the first side wall is far away from the second positioning groove;
the first radiator is installed in the installation groove, the fixing flange of the first radiator is inserted into the second positioning groove, the second fixing screw hole of the first radiator is aligned with the second positioning screw hole of the semiconductor installation plate, and the first radiator is fixedly installed in the installation groove through the screw connector.
Optionally, the semiconductor mounting board is in an arc structure.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
according to the embodiment of the disclosure, the semiconductor heat exchange fin, the first radiator and the second radiator are arranged on the semiconductor mounting plate by utilizing the semiconductor mounting plate, so that the first radiator and the second radiator are in contact with the temperature changing surface of the semiconductor heat exchange fin, and heat exchange is performed. Through installing the semiconductor mounting panel in the semiconductor air conditioner to be fixed in semiconductor air conditioner with semiconductor heat exchanger fin, first radiator and second radiator, reduce the installation degree of difficulty of radiator, reduce the assembly degree of difficulty of semiconductor air conditioner, reduce the demolding degree of difficulty of semiconductor air conditioner.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a first schematic structural diagram of a semiconductor air conditioner according to an exemplary embodiment.
Fig. 2 is a schematic view illustrating a disassembled structure of a semiconductor air conditioner according to an exemplary embodiment.
Fig. 3 is a schematic structural view of a semiconductor mounting board and heat sink assembly shown in accordance with an exemplary embodiment.
Fig. 4 is a partially disassembled structural schematic diagram of a semiconductor air conditioner according to an exemplary embodiment.
Fig. 5 is a first schematic structural view of a semiconductor mounting board according to an exemplary embodiment.
Fig. 6 is a structural schematic diagram of a semiconductor mounting board according to an exemplary embodiment.
Fig. 7 is a schematic cross-sectional structure diagram of a semiconductor air conditioner according to an exemplary embodiment.
Fig. 8 is a partially enlarged schematic view of fig. 7.
Fig. 9 is a second schematic structural diagram of a semiconductor air conditioner according to an exemplary embodiment.
Fig. 10 is a schematic structural diagram three of a semiconductor air conditioner according to an exemplary embodiment.
Fig. 11 is a first schematic structural diagram of an air outlet duct according to an exemplary embodiment.
Fig. 12 is a second schematic structural diagram of an air outlet duct according to an exemplary embodiment.
In the above figures: 10, a semiconductor air conditioner; 11, semiconductor heat exchange fins; 12, a first heat sink; 13, a second heat sink; 14, a semiconductor mounting board; 15, an air outlet air duct; 16, a heat radiation air duct; 17, a positioning member; 141, mounting holes; 142, a first mounting portion; 143, a second mounting portion; 144, a limiting chute; 145, a limit notch; 146, third positioning screw holes; 147, a second positioning groove; 148, a second positioning screw hole; 151, a position-limiting flange; 152, a positioning plate; 153, a mounting opening; 154, a first positioning groove; 155, a first positioning screw hole.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
The embodiment of the present disclosure provides a semiconductor air conditioner, as shown in fig. 1, fig. 1 is a schematic structural diagram of a semiconductor air conditioner according to an exemplary embodiment; fig. 2 is a schematic view illustrating a disassembled structure of a semiconductor air conditioner according to an exemplary embodiment. Fig. 3 is a schematic diagram illustrating a semiconductor mounting board and heat sink combination in accordance with an exemplary embodiment. Fig. 4 is a partially disassembled structural view of a semiconductor air conditioner according to an exemplary embodiment. FIG. 5 is a first block diagram illustrating a semiconductor mounting board according to one exemplary embodiment; fig. 6 is a structural schematic diagram of a semiconductor mounting board according to an exemplary embodiment.
The semiconductor air conditioner 10 includes:
the heat radiator comprises a semiconductor heat exchange fin 11, a first radiator 12 and a second radiator 13;
a semiconductor mounting board 14, comprising:
the mounting hole 141 penetrates through the first surface and the second surface of the semiconductor mounting board 14, and is used for mounting the semiconductor heat exchange plate 11, wherein the first temperature changing surface of the semiconductor heat exchange plate 11 faces the first surface, and the second temperature changing surface faces the second surface;
a first mounting portion 142, provided on the first surface, for mounting the first heat sink 12;
and a second mounting portion 143 provided to the second surface for mounting the second heat sink 13.
In an embodiment of the present disclosure, the air conditioner includes: the radiator comprises a semiconductor heat exchange fin, a first radiator and a second radiator.
Here, the first and second radiators each include: the heat conduction block, the heat conduction pipe and the plurality of radiating fins; the first end of the heat conduction pipe is connected with the heat conduction block, and the second end of the heat conduction pipe is connected with the plurality of radiating fins.
The first radiator, the semiconductor heat exchange fins and the second radiator are arranged in a stacked mode; and the first variable temperature surface of the semiconductor heat exchange sheet is in contact with the heat conduction block of the first radiator, and the first variable temperature surface of the semiconductor heat exchange sheet is radiated by the first radiator. And the second variable-temperature surface of the semiconductor heat exchange sheet is in contact with the heat conduction block of the second radiator, and the second variable-temperature surface of the semiconductor heat exchange sheet is radiated by the second radiator.
In some embodiments, the first end of the heat conductive pipe is formed with a bending part bent toward the plurality of heat dissipation fins; the connection surface of the heat conduction block and the heat conduction pipe is provided with a gap space, and the gap space at least partially accommodates the bending part.
The heat conducting blocks of the first radiator and the second radiator are at least partially accommodated in the bent parts of the heat conducting pipes of the first radiator and the second radiator by utilizing the gap spaces in the heat conducting blocks of the first radiator and the second radiator, and the volumes of the first radiator and the second radiator are reduced under the condition that the contact area between the heat conducting block of the first radiator and the first variable temperature surface and the contact area between the heat conducting block of the second radiator and the second variable temperature surface are not reduced, so that the volume of the semiconductor air conditioner is reduced.
The airflow flowing in the semiconductor air conditioner indirectly exchanges heat with the first temperature changing surface of the semiconductor heat exchange plate through the first radiator; and the heat exchange is indirectly carried out between the second radiator and the second variable temperature surface of the semiconductor heat exchange sheet, so that the temperature of the air flow is changed, and the effect of refrigeration or heating is realized.
The air conditioner further comprises: a semiconductor mounting board;
the semiconductor mounting plate is internally provided with a mounting hole, and the size of the mounting hole is matched with that of the semiconductor heat exchange sheet; the mounting hole penetrates through the first surface and the second surface of the semiconductor mounting plate; here, the first surface and the second surface are two opposing surfaces of the semiconductor mounting board.
Mounting the semiconductor heat exchange plate in the mounting hole, wherein the first temperature-changing surface of the semiconductor heat exchange plate faces to the first surface of the semiconductor mounting plate; the second variable temperature surface of the semiconductor heat exchange plate faces the second surface of the semiconductor mounting plate.
Because the heat conduction blocks of the first radiator and the second radiator are respectively contacted with the first variable-temperature surface and the second variable-temperature surface of the semiconductor heat exchange fin, the first surface of the semiconductor mounting plate is provided with the first mounting part, the second surface of the semiconductor mounting plate is provided with the second mounting part, and the heat conduction blocks of the first radiator and the second radiator are respectively mounted by utilizing the first mounting part and the second mounting part.
Here, the position of the first mounting portion on the first surface corresponds to the position of the second mounting portion on the second surface.
It can be understood that the heat dissipation efficiency of the heat sink is related to the contact area between the heat conduction block and the semiconductor heat exchange fins; in order to improve the heat dissipation efficiency of the first radiator and the second radiator, after the heat conduction block of the first radiator is installed on the first installation part, the heat conduction block of the first radiator covers the first variable temperature surface of the semiconductor heat exchange sheet, and heat exchange is carried out between the first radiator and the first variable temperature surface of the semiconductor heat exchange sheet.
After the heat conducting block of the second radiator is arranged on the second installation part, the heat conducting block of the second radiator covers the second variable temperature surface of the semiconductor heat exchange sheet, the second radiator and the second variable temperature surface of the semiconductor heat exchange sheet are utilized to carry out heat exchange, and the first variable temperature surface and the second variable temperature surface are two opposite surfaces of the semiconductor heat exchange sheet, so that the position of the first installation part corresponds to the position of the second installation part.
It should be noted that, because the heat conduction blocks of the first radiator and the second radiator need to contact with the variable temperature surface of the semiconductor heat exchange fin, the temperature of the output airflow of the semiconductor air conditioner can be changed through the heat exchange between the variable temperature surface and the first radiator and the second radiator, so as to achieve the cooling or heating effect; however, in the assembly process of the semiconductor air conditioner, the fixing among the first radiator, the second radiator and the semiconductor heat exchange fins is complex, and the mold stripping difficulty is high.
Therefore, the semiconductor heat exchange fin, the first radiator and the second radiator are arranged on the semiconductor mounting plate by utilizing the semiconductor mounting plate, and the semiconductor mounting plate is arranged on the semiconductor air conditioner, so that the semiconductor heat exchange fin, the first radiator and the second radiator are fixed, the assembly difficulty of the semiconductor air conditioner is reduced, and the mold stripping difficulty of the semiconductor air conditioner is reduced.
Alternatively, as shown in FIGS. 2,7-8, FIG. 7 is a schematic cross-sectional structure of a semiconductor air conditioner according to an exemplary embodiment; fig. 8 is a partially enlarged schematic view of fig. 7. The air conditioner 10 includes:
an air outlet duct 15;
the heat dissipation air duct 16 is arranged at an interval with the air outlet air duct 15, and the air outlet direction of the heat dissipation air duct 16 and the air outlet direction of the air outlet air duct 15 form a preset included angle; wherein the preset included angle is within the range of 30 degrees to 150 degrees.
In an embodiment of the present disclosure, the air conditioner includes: an air outlet air duct and a heat dissipation air duct; the air outlet air duct and the heat dissipation air duct are arranged at intervals and are isolated from each other. Here, the air outlet duct is used for outputting cold air or hot air; the heat dissipation air duct is used for dissipating heat outwards.
It can be understood that the semiconductor mounting plate can be mounted in a connection region between the air outlet duct and the heat dissipation duct, and the first variable temperature surface of the semiconductor heat exchange fins mounted on the semiconductor mounting plate faces into the air outlet duct; and the air flow circulating in the air outlet air duct exchanges heat with the first temperature changing surface, so that the temperature of the air flow is changed, the air flow after heat exchange is output from an air outlet of the air outlet air duct, and the refrigerating or heating effect is realized.
The second variable temperature surface of the semiconductor heat exchange fins mounted on the semiconductor mounting plate faces the inside of the heat dissipation air duct, and the second variable temperature surface is dissipated by air flow circulating in the heat dissipation air duct through the second radiator.
In the embodiment of the present disclosure, the air outlet direction of the heat dissipation air duct and the air outlet direction of the air outlet air duct form a preset included angle, where the preset included angle is in a range from 30 degrees to 150 degrees, so as to reduce mutual interference between the air flows with different temperatures output by the air outlet air duct and the heat dissipation air duct.
In some embodiments, the air outlet direction of the heat dissipation air duct is perpendicular to the air outlet direction of the air outlet air duct.
Alternatively, as shown in fig. 9-10, fig. 9 is a schematic structural diagram of a semiconductor air conditioner shown according to an exemplary embodiment; fig. 10 is a third structural schematic diagram of a semiconductor air conditioner according to an exemplary embodiment. Air-out dryer 15 includes:
the mounting position is arranged on the inner side wall of the air outlet air duct 15 and is used for mounting the semiconductor mounting plate 14 on the air outlet air duct 15;
and the projection of the heat dissipation wind barrel 16 to the direction of the air outlet wind barrel 15 covers the installation position.
In the embodiment of the present disclosure, the air outlet duct includes: an installation position; the mounting position is arranged on the inner side wall of the air outlet air duct, and the projection of the heat dissipation air duct towards the air outlet air duct covers the mounting position.
The semiconductor mounting plate is mounted at the mounting position of the air outlet air duct, and the first variable temperature surface of the semiconductor heat exchange sheet in the semiconductor mounting plate is positioned in the air outlet air duct; and connecting the air outlet air duct and the heat dissipation air, wherein at the moment, the second temperature change surface of the semiconductor heat exchange sheet is positioned in the heat dissipation air duct, so that the air flow circulating in the air outlet air duct and the heat dissipation air duct respectively exchanges heat with different temperature change surfaces of the semiconductor heat exchange sheet, and the refrigeration or heating function is realized.
In some embodiments, as shown in fig. 6, 9-10, the semiconductor mounting board 14 includes:
a plurality of stopper slide grooves 144 provided on the side wall of the semiconductor mounting board 14;
the semiconductor mounting board 14 is slidably mounted to the mounting site by the engagement of the stopper slide groove 144 of the semiconductor mounting board 14 with the stopper flange 151 of the mounting site.
In the embodiment of the present disclosure, a plurality of limiting sliding grooves are provided on the semiconductor mounting plate, and the limiting sliding grooves are located on the outer side wall of the semiconductor mounting plate contacting the air outlet duct.
The inside wall of air-out dryer is provided with a plurality of limit flange, limit flange is located the installation position of air-out dryer.
When the semiconductor mounting plate is installed, the limiting flange can be clamped into the limiting sliding groove, and the semiconductor mounting plate is installed at the installation position of the air outlet air duct through the sliding of the limiting flange in the limiting sliding groove.
In other embodiments, as shown in fig. 9-10, the semiconductor mounting board 14 includes:
the limiting notch 145 is positioned on the first side wall of the semiconductor mounting plate 14, and the opening direction of the limiting notch 145 faces the air outlet of the air outlet duct 15;
third positioning screw holes 146 located on a second sidewall of the semiconductor mounting board 14;
the semiconductor mounting plate 14 is slidably mounted at the mounting position of the air outlet duct 15, the limiting notch 145 of the semiconductor mounting plate 14 is clamped with the positioning plate 152 of the air outlet duct 15, and the third positioning screw hole 146 of the semiconductor mounting plate 14 is aligned with the third fixing screw hole of the air outlet duct 15; the semiconductor mounting plate 14 is fixedly mounted on the air outlet air duct 15 through a screw connector.
In an embodiment of the present disclosure, the semiconductor mounting board includes: the semiconductor mounting plate comprises a limiting notch and a third positioning screw hole, wherein the limiting notch and the third positioning screw hole are respectively arranged on a first side wall and a second side wall of the semiconductor mounting plate; the first side wall and the second side wall are two opposite side walls of the semiconductor mounting plate, and the second side wall is close to an air inlet of the air outlet air duct.
The air-out dryer includes:
the third positioning screw hole is arranged at the air inlet of the air outlet air duct;
and the positioning plate is arranged on the side wall of the air outlet air duct.
In the sliding process of the limiting flange in the limiting sliding chute, the limiting notch of the semiconductor mounting plate penetrates through the third fixing screw hole of the air outlet air duct and is clamped with the positioning plate to limit the semiconductor mounting plate to continuously slide; at the moment, a third positioning screw hole of the semiconductor mounting plate is aligned with a third fixing screw hole of the air outlet duct; the semiconductor mounting plate can be fixedly mounted in the air outlet air duct by utilizing a screw connector.
Optionally, the heat dissipation dryer includes:
and the mounting position is arranged at the top of the heat dissipation air duct in contact with the air outlet air duct and is used for mounting the semiconductor mounting plate on the heat dissipation air duct.
In an embodiment of the present disclosure, the heat dissipation air duct includes: an installation position;
the air outlet air duct is arranged on the heat dissipation air duct, so that the installation position is arranged at the top of the heat dissipation air duct, which is in contact with the air outlet air duct; it can be understood that the mounting position is arranged in the connecting area of the air outlet air duct and the heat dissipation air duct.
The semiconductor mounting plate is mounted at the mounting position of the heat dissipation air duct, and the second temperature change surface of the semiconductor heat exchange fins in the semiconductor mounting plate is positioned in the heat dissipation air duct; and connecting the heat dissipation air duct and the air outlet air duct, wherein the first temperature-variable surface of the semiconductor heat exchange fins is positioned in the air outlet air duct, so that air flows circulating in the air outlet air duct and the heat dissipation air duct respectively exchange heat with different temperature-variable surfaces of the semiconductor heat exchange fins, and a refrigerating or heating function is realized.
Optionally, as shown in fig. 7-8 and 11-12, fig. 11 is a first schematic structural diagram of an air outlet duct according to an exemplary embodiment; fig. 12 is a second schematic structural diagram of an air outlet duct according to an exemplary embodiment. The air conditioner 10 includes:
the mounting opening 153 is located on the side wall of the air outlet duct 15 and communicates the air outlet duct 15 with the heat dissipation duct 16;
a projection of the mounting opening 153 toward the semiconductor mounting board 14 to cover the first mounting portion 142 or the second mounting portion 143 of the semiconductor mounting board 14;
the semiconductor mounting plate 14 is mounted in the mounting position, the first radiator 12 is mounted in the air outlet duct 15 through the first mounting portion 142, and the second radiator 13 is mounted in the heat dissipating duct 16 through the second mounting portion 143.
In the embodiment of the present disclosure, a mounting opening is formed on a side wall of the air outlet duct, and the mounting opening is located in a connection region between the air outlet duct and the heat dissipation duct; the air outlet air duct is communicated with the heat dissipation air duct through the mounting opening.
The semiconductor mounting plate is arranged behind the mounting position, covers the mounting opening and isolates the air outlet air duct and the heat dissipation air duct.
If the mounting position is arranged on the air outlet air duct, the projection of the mounting opening towards the direction of the semiconductor mounting plate covers the second mounting part of the semiconductor mounting plate; it is understood that after the semiconductor mounting board is mounted at the mounting position, the mounting opening exposes the second mounting portion of the semiconductor mounting board, and the second heat sink is mounted to the second mounting portion through the mounting opening.
If the mounting position is arranged on the heat dissipation air duct, the projection of the mounting opening towards the direction of the semiconductor mounting plate covers the first mounting part of the semiconductor mounting plate; it is understood that, after the semiconductor mounting board is mounted at the mounting position, the mounting opening exposes the first mounting portion of the semiconductor mounting board, and the first heat sink is mounted to the first mounting portion through the mounting opening.
Here, the position of the first mounting portion corresponds to the position of the second mounting portion.
It should be noted that, the mounting positions may be different, and the assembly sequence of the components in the semiconductor air conditioner may be different. For example, if the mounting position is arranged on the air outlet duct, the semiconductor heat exchanger fin and the first radiator may be sequentially mounted on the mounting hole and the first mounting portion of the semiconductor mounting plate, and then the semiconductor mounting plate is mounted on the mounting position of the air outlet duct; and the second radiator is arranged on the second installation part of the semiconductor installation plate through the installation opening, and finally the second radiator is connected with the heat dissipation air duct and the air outlet air duct.
For another example, if the mounting position is arranged on the heat dissipation air duct, the semiconductor heat exchange fin and the second heat sink may be sequentially mounted on the mounting hole and the second mounting portion of the semiconductor mounting plate, and then the semiconductor mounting plate is mounted on the mounting position of the heat dissipation air duct; connect air-out dryer and heat dissipation dryer, through the installation opening of air-out dryer at last, install first radiator in the first installation department of semiconductor mounting panel.
The semiconductor mounting plate is mounted at the mounting position, a first mounting part of the semiconductor mounting plate is positioned in the air outlet air duct, and a second mounting part of the semiconductor mounting plate is positioned in the heat dissipation air duct; the first radiator is arranged in the air outlet air duct through the first installation part; the second radiator is arranged in the heat dissipation air duct through the second installation part.
In some embodiments, the stacking direction of the plurality of heat dissipation fins in the first heat sink is perpendicular to the air outlet direction of the air outlet duct; the stacking direction of the plurality of radiating fins in the second radiator is perpendicular to the air outlet direction of the radiating air duct.
In the embodiment of the present disclosure, the first heat sink includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are stacked; the stacking direction of the plurality of radiating fins in the first radiator is vertical to the air outlet direction of the air outlet air duct; an airflow channel is formed among the plurality of radiating fins of the first radiator, and the extending direction of the airflow channel is parallel to the air outlet direction of the air outlet air duct.
The second radiator comprises a plurality of radiating fins, the radiating fins are arranged in a stacked mode, and the stacked direction of the radiating fins in the second radiator is perpendicular to the air outlet direction of the radiating air duct; and a heat dissipation channel is formed among the plurality of heat dissipation fins of the second heat radiator, and the extension direction of the heat dissipation channel is parallel to the air outlet direction of the heat dissipation air duct.
It should be noted that, by making the stacking direction of the plurality of heat dissipation fins in the first heat sink perpendicular to the air outlet direction of the air outlet duct, and making the stacking direction of the plurality of heat dissipation fins in the second heat sink perpendicular to the air outlet direction of the heat dissipation duct, it can be ensured that the air in the air outlet duct can more smoothly circulate in the airflow channel, the air in the heat dissipation duct can more smoothly circulate in the heat dissipation channel, and the air resistance in the air outlet duct and the heat dissipation duct is reduced.
Alternatively, as shown in fig. 11 to 12, the air conditioner 10 includes:
the first positioning groove 154 is arranged on the outer side wall of the air outlet wind barrel 15;
the first positioning screw hole 155 is arranged on the outer side wall of the air outlet duct 15, and is arranged on two sides of the mounting opening 153 opposite to the first positioning groove 154;
a positioning member 17, one end of which is formed with a hook and the other end of which is formed with a first fixing screw hole;
through the matching of the positioning element 17, the first positioning groove 154 and the first positioning screw hole 155, the positioning element 17 and the outer sidewall of the air outlet duct 15 form a clamp for the second heat sink 13.
In an embodiment of the present disclosure, the air conditioner includes: the first positioning groove and the first positioning screw hole are formed in the base; the first positioning groove and the first positioning screw hole are arranged on the outer side wall of the air outlet air duct, and the first positioning groove and the first positioning screw hole are oppositely arranged on two sides of the mounting opening.
The air conditioner further comprises: the positioning device comprises a positioning piece, a first fixing screw hole and a second fixing screw hole, wherein one end of the positioning piece is provided with a clamping hook, and the other end of the positioning piece is provided with a first fixing screw hole; it can be understood that the pothook of setting element inserts first positioning groove, and with first positioning groove joint, first fixed screw with first positioning screw aligns, utilizes the spiro union piece will setting element fixed connection in on the lateral wall of air-out dryer.
After the semiconductor mounting plate is mounted at the mounting position, the heat conducting block of the second radiator can be mounted at the second mounting part of the semiconductor mounting plate, and the heat conducting block of the second radiator is fixedly mounted at the second mounting part through the matching of the positioning piece, the first positioning groove and the first positioning screw hole; at this time, the heat conducting block of the second radiator is clamped between the positioning piece and the outer side wall of the air outlet air duct.
Alternatively, as shown in fig. 5, the first mounting portion 142 includes:
two limit structure that sets up relatively, two form the mounting groove between the limit structure, be used for supplying first radiator insert install in the mounting groove.
In an embodiment of the present disclosure, the first mounting portion includes: the two limiting structures are oppositely arranged on two sides of the mounting opening; the two limiting structures are matched to form the mounting groove, and the heat conducting block of the first radiator can be inserted into the mounting groove from one end of the mounting groove; the space of the mounting groove is matched with the heat conducting block of the first radiator.
The first radiator is inserted into the mounting groove, and the insertion direction of the first radiator can be the same as the air outlet direction of the air outlet air duct, or can be opposite to the air outlet direction of the air outlet air duct.
It is understood that the insertion direction of the first heat sink inserted into the mounting groove is related to the assembly sequence of the components in the semiconductor air conditioner.
If need with first radiator install in the first installation department of semiconductor mounting panel, then install the semiconductor mounting panel in the installation position of air-out dryer, at this moment, first radiator insert install in the inserting direction of mounting groove can with the air-out direction of air-out dryer is the same, also can with the air-out direction of air-out dryer is opposite.
If need install the semiconductor mounting panel in the installation position of heat dissipation dryer earlier, then install first radiator in the first installation department of semiconductor mounting panel, at this moment, first radiator insert install in the inserting direction of mounting groove can with the air-out direction of air-out dryer is the same.
Optionally, as shown in fig. 5, first ends of the two limiting structures are bent toward a direction close to each other to form a limiting baffle for limiting an installation position of the first heat sink in the installation groove;
the second ends of the two limiting structures incline towards the direction away from each other to form a guide inclined plane for guiding the first radiator to be inserted into the mounting groove.
In the embodiment of the disclosure, the first ends of the two limiting structures are bent towards the direction close to each other to form a limiting baffle; the heat conducting block of the first radiator is inserted into the mounting groove from one end of the mounting groove and moves along the insertion direction; the side wall of the heat conducting block of the first radiator is abutted against the limiting baffle, and the limiting baffle limits the first radiator to continuously move along the insertion direction, so that the installation position of the heat conducting block of the first radiator in the installation groove is limited.
The second ends of the two limiting structures incline towards the direction away from each other to form a guide inclined plane, and the distance between the guide inclined planes is greater than the distance between the two limiting structures, so that the heat conducting block of the first radiator is guided to be inserted into the mounting groove through the guide inclined plane.
Alternatively, as shown in fig. 5, the semiconductor mounting board 14 includes:
a second positioning groove 147 disposed on the first surface of the semiconductor mounting board 14 and close to the first end of the limiting structure;
a second positioning screw hole 148, which is disposed on a first side wall of the semiconductor mounting board 14, wherein the first side wall is far away from the second positioning groove;
the first heat sink 12 is mounted in the mounting groove, the fixing flange of the first heat sink 12 is inserted into the second positioning groove 147, the second fixing screw hole of the first heat sink 12 is aligned with the second positioning screw hole 148 of the semiconductor mounting board 14, and the first heat sink 12 is fixedly mounted in the mounting groove by means of a screw member.
In the embodiment of the present disclosure, a second positioning groove is formed in the first surface of the semiconductor mounting board, and the second positioning groove is close to the first ends of the two limiting structures, that is, the second positioning groove is close to the limiting baffle.
A first side wall of the semiconductor mounting plate is provided with a second positioning screw hole; here, the first side wall is a side wall of the semiconductor mounting board remote from the second positioning groove.
The first heat sink includes: the fixing flange and the second fixing screw hole; the fixing flange and the second fixing screw hole are respectively formed on two opposite side walls of the heat conducting block of the first radiator.
It can be understood that the side where the fixing flange is located is a first end of the heat conducting block of the first heat sink, and the side where the second fixing screw hole is located is a second end of the heat conducting block of the first heat sink. The first end of heat conduction piece inserts the mounting groove to remove along the direction of insertion, the first end of heat conduction piece with limit baffle supports and presses, at this moment, the fixed flange inserts in the second constant head tank, the fixed screw of the second of first radiator with second location screw on the semiconductor mounting panel aligns, and usable spiro union piece can with the heat conduction piece fixed mounting of first radiator is in on the semiconductor mounting panel.
Alternatively, as shown in fig. 5 to 6, the semiconductor mounting board has an arc-shaped structure
In the embodiment of the present disclosure, the semiconductor mounting plate is of an arc-shaped structure, and it can be understood that, because the air outlet duct is of a cylindrical structure, the semiconductor mounting plate is located in a connection region between the air outlet duct and the heat dissipation duct, and the second surface of the semiconductor mounting plate is attached to the inner side wall of the air outlet duct, or the first surface of the semiconductor mounting plate is attached to the outer side wall of the air outlet duct; therefore, the shape of the semiconductor mounting plate is matched with that of the side wall of the air outlet air duct.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (10)
1. A semiconductor air conditioner, characterized in that, the air conditioner includes:
the heat radiator comprises a semiconductor heat exchange fin, a first radiator and a second radiator;
a semiconductor mounting board comprising:
the mounting hole penetrates through the first surface and the second surface of the semiconductor mounting plate and is used for mounting the semiconductor heat exchange plate, the first temperature change surface of the semiconductor heat exchange plate faces the first surface, and the second temperature change surface of the semiconductor heat exchange plate faces the second surface;
the first mounting part is arranged on the first surface and used for mounting the first radiator;
and the second mounting part is arranged on the second surface and used for mounting the second radiator.
2. The air conditioner according to claim 1, wherein the air conditioner comprises:
an air outlet duct;
the heat dissipation air duct is arranged at an interval with the air outlet air duct, and the air outlet direction of the heat dissipation air duct and the air outlet direction of the air outlet air duct form a preset included angle; wherein the preset included angle is within the range of 30 degrees to 150 degrees.
3. The air conditioner of claim 2, wherein the outlet air duct comprises:
the mounting position is arranged on the inner side wall of the air outlet air duct and is used for mounting the semiconductor mounting plate on the air outlet air duct;
the projection of the heat dissipation air duct to the air outlet air duct covers the installation position.
4. The air conditioner of claim 2, wherein the heat dissipating air duct comprises:
and the mounting position is arranged at the top of the heat dissipation air duct in contact with the air outlet air duct and is used for mounting the semiconductor mounting plate on the heat dissipation air duct.
5. The air conditioner according to claim 3 or 4, wherein the air conditioner comprises:
the mounting opening is positioned on the side wall of the air outlet air duct and is communicated with the air outlet air duct and the heat dissipation air duct;
the projection of the mounting opening towards the direction of the semiconductor mounting plate covers the first mounting part or the second mounting part of the semiconductor mounting plate;
the semiconductor mounting plate is installed in the installation position, the first radiator passes through the first installation department install in the air-out dryer, the second radiator passes through the second installation department install in the heat dissipation dryer.
6. The air conditioner according to claim 5, wherein the air conditioner comprises:
the first positioning groove is arranged on the outer side wall of the air outlet air duct;
the first positioning screw hole is arranged on the outer side wall of the air outlet air duct and is arranged on two sides of the mounting opening opposite to the first positioning groove;
a positioning piece, one end of which is provided with a clamping hook and the other end of which is provided with a first fixing screw hole;
through the cooperation of the positioning piece with the first positioning groove and the first positioning screw hole, the positioning piece and the outer side wall of the air outlet air duct form clamping for the second radiator.
7. The air conditioner according to claim 1, wherein the first mounting portion includes:
two limit structure that sets up relatively, two form the mounting groove between the limit structure, be used for supplying first radiator insert install in the mounting groove.
8. The air conditioner according to claim 7, wherein the first ends of the two limiting structures are bent towards the direction of approaching each other to form a limiting baffle for limiting the installation position of the first radiator in the installation groove;
the second ends of the two limiting structures incline towards the direction away from each other to form a guide inclined plane for guiding the first radiator to be inserted into the mounting groove.
9. The air conditioner of claim 8, wherein the semiconductor mounting plate comprises:
the second positioning groove is arranged on the first surface of the semiconductor mounting plate and is close to the first end of the limiting structure;
the second positioning screw hole is arranged on the first side wall of the semiconductor mounting plate, wherein the first side wall is far away from the second positioning groove;
the first radiator is installed in the installation groove, the fixing flange of the first radiator is inserted into the second positioning groove, the second fixing screw hole of the first radiator is aligned with the second positioning screw hole of the semiconductor installation plate, and the first radiator is fixedly installed in the installation groove through the screw connector.
10. The air conditioner of claim 1, wherein the semiconductor mounting plate has an arc-shaped configuration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220681439.5U CN217715230U (en) | 2022-03-25 | 2022-03-25 | Semiconductor air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220681439.5U CN217715230U (en) | 2022-03-25 | 2022-03-25 | Semiconductor air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217715230U true CN217715230U (en) | 2022-11-01 |
Family
ID=83790461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220681439.5U Active CN217715230U (en) | 2022-03-25 | 2022-03-25 | Semiconductor air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217715230U (en) |
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2022
- 2022-03-25 CN CN202220681439.5U patent/CN217715230U/en active Active
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