CN217709416U - Reaction vessel - Google Patents

Reaction vessel Download PDF

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Publication number
CN217709416U
CN217709416U CN202221839794.7U CN202221839794U CN217709416U CN 217709416 U CN217709416 U CN 217709416U CN 202221839794 U CN202221839794 U CN 202221839794U CN 217709416 U CN217709416 U CN 217709416U
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wall
reaction
reaction vessel
heat
force
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丁子谦
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Aituo Biotechnology Hangzhou Co ltd
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Aituo Biotechnology Hangzhou Co ltd
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Abstract

The application provides a reaction vessel, including the reaction wall, at least a part space formation reaction chamber in the reaction wall, the reaction chamber has perpendicular to the depth direction's of reaction vessel annular cross-section, first direction and second direction are defined to the plane of annular cross-section place, first direction and the second direction is perpendicular, the radial dimension of reaction chamber in first direction is greater than the radial dimension of reaction chamber in the second direction, the reaction wall includes at least one heat transfer wall, the heat transfer wall sets up along the first direction, the heat transfer wall can bear the effort and produce the deformation for with the corresponding application of heat face of temperature regulation module, and, the area that the heat transfer wall laminated with the application of heat face is not less than the area of application of heat face. Thus, the heat cycle efficiency of the heat transfer wall can be improved.

Description

Reaction vessel
Technical Field
The utility model relates to a be used for realizing in biological fields such as genetic engineering or enzyme engineering that biological reaction technical field based on temperature management especially relates to a reaction vessel.
Background
In the nucleic acid amplification process, the temperature of the sample needs to be increased or decreased frequently, and the sample is usually cycled between 60 ℃ and 95 ℃ to achieve the purpose of amplification detection.
In the prior art, a test tube is usually used to store a sample, and the sample is subjected to an amplification process in the test tube. Due to the limitations of the processing precision of the test tube and the processing precision of the heat applying structure of the device, the side wall of the test tube usually cannot be correctly attached to the heat applying surface of the heat applying structure, that is, there are usually a large number of gaps between the outer wall of the test tube and the heat applying wall of the heat applying structure, so that the sample is heated unevenly, and the sample has low heat exchange efficiency.
SUMMERY OF THE UTILITY MODEL
The present application is directed to solving at least one of the problems in the prior art.
In order to solve the technical problem, the technical scheme of the application is as follows:
in a first aspect, the present application provides a reaction vessel comprising a reaction wall, at least a part of the space in the reaction wall forming a reaction chamber, the reaction chamber having an annular cross section perpendicular to the depth direction of the reaction vessel, the annular cross section defining a first direction and a second direction on a plane, the first direction and the second direction being perpendicular, the radial dimension of the reaction chamber in the first direction being larger than the radial dimension of the reaction chamber in the second direction, the reaction wall comprising at least one heat transfer wall, the heat transfer wall being disposed along the first direction, the heat transfer wall being capable of bearing a force and being deformed for engaging with a corresponding heat application surface of a temperature adjustment module, and the area of the heat transfer wall engaging with the heat application surface being not smaller than the area of the heat application surface.
Compared with the prior art, the beneficial effect of this application lies in:
the heat conduction wall is arranged along the long edge of the reaction wall, so that the heat application surface corresponding to the temperature regulation module has a larger contact area, the heat conduction wall can bear acting force and deform to enable the heat conduction wall to be attached to the heat application surface of the temperature regulation module, the contact area between the heat conduction wall and the temperature regulation module can be further increased, the heat conduction efficiency is higher, and the temperature circulation efficiency of media in the reaction cavity is effectively improved.
Drawings
Fig. 1 is a schematic perspective view of a reaction vessel in a first embodiment of the present invention.
FIG. 2 is a schematic perspective view of the reaction vessel in the first embodiment of the present application in another direction.
FIG. 3 is a schematic sectional view of a reaction chamber of a reaction vessel in a first embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a temperature adjustment module in an embodiment of the present application.
Fig. 5 is a schematic perspective view of a reaction vessel in a second embodiment of the present application.
FIG. 6 is a schematic perspective view of a reaction vessel in a second embodiment of the present application, showing another orientation.
FIG. 7 is a schematic sectional view of a reaction chamber of a reaction vessel in a second example of the present application.
Fig. 8 is a schematic flow chart of a method of using a reaction vessel in an embodiment of the present application.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and intended to explain the present application and should not be construed as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "connected," "secured," and the like are to be construed broadly and include, for example, fixed connections, removable connections, or integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic perspective view of a reaction vessel in a first embodiment of the present application, and fig. 2 is a schematic perspective view of the reaction vessel in the first embodiment of the present application in another direction. The reaction vessel 1 comprises a reaction wall 11. Referring to fig. 3, a reaction chamber 13 is formed in at least a portion of the reaction wall 11. The reaction chamber 13 has an annular cross section 15 perpendicular to the depth direction of the reaction vessel 1, the plane of the annular cross section 15 defines a first direction X and a second direction Y, the first direction X is perpendicular to the second direction Y, and the radial dimension of the reaction chamber 13 in the first direction X is greater than the radial dimension of the reaction chamber 13 in the second direction Y. The reaction wall 11 comprises at least one heat conducting wall 111, the heat conducting wall 111 being arranged along the first direction X. Referring to fig. 4, fig. 4 is a schematic structural diagram of the temperature adjustment module 2 according to an embodiment of the present disclosure. The heat conduction wall 111 can bear acting force and deform to be attached to the heat application surface 21 of the temperature regulation module 2, and the area of the heat conduction wall 111 attached to the heat application surface 21 is not smaller than the area of the heat application surface 21.
The reaction vessels of the prior art generally have a conical configuration. Compared with the prior art, in the present application, the heat conduction wall 111 of the reaction vessel 1 is disposed along the long side of the reaction wall 11, so that the heat conduction wall 111 has a larger contact area with the heat application surface 21 of the temperature adjustment module 2, and the heat conduction wall 111 can bear acting force and generate deformation so that the heat conduction wall 111 is attached to the heat application surface of the temperature adjustment module 2, so that the contact area between the heat conduction wall 111 and the heat application surface 21 of the temperature adjustment module 2 can be further increased, thereby further increasing the heat conduction efficiency and effectively increasing the temperature circulation efficiency of the medium in the reaction chamber 13.
The heat conducting wall 111 is disposed along the first direction X, which means that the heat conducting wall 111 is disposed substantially along the first direction X, and may be linear or curved as long as the heat conducting wall extends substantially along the first direction X.
Wherein, in an embodiment, the reaction chamber 13 has a radial maximum in the first direction X and the reaction chamber 13 has a radial minimum in the second direction Y.
Thus, the annular cross-section 15 of the reaction wall 11 is elliptical-like, or waisted-like.
The temperature regulation module 2 circulates the reaction medium between a first temperature and a second temperature, wherein the second temperature is higher than the first temperature. In this embodiment, the first temperature may be, but is not limited to, 60 degrees celsius, and the second temperature may be, but is not limited to, 95 degrees celsius. It is understood that in other embodiments, the first temperature and the second temperature may be adjusted according to actual needs. Therefore, the temperature adjustment module 2 should have both cooling and heating capabilities. The temperature regulation module 2 can adopt a semiconductor temperature regulation piece, and the semiconductor temperature regulation piece can be switched between refrigeration and heating by switching the polarity of current in the use process, so that the semiconductor temperature regulation piece can meet the functional requirements of the temperature regulation module 2.
Referring again to fig. 4, the temperature regulation module 2 includes a plurality of receiving compartments 20. The plurality of housing bins 20 are arranged at intervals. Each of the chambers 20 has a heat application surface 21 therein, and each of the chambers 20 is used for accommodating a reaction vessel 1 therein for thermal cycle. It is understood that one or two of the heat application surfaces 21 in each of the receiving chambers 20, or one or two of the heat application surfaces 21 in the two heat application surfaces 21 may be selected to turn off the heating function. That is, the heat application function of each heat application surface 21 in each housing compartment 20 can be selectively turned on. Thus, a plurality of reaction vessels 1 can be thermally cycled simultaneously. The temperature adjustment module 2 may have other forms, and fig. 4 is only an example and is not limited thereto. The heat transfer wall 111 includes a force distribution surface 112 on a side facing away from the reaction chamber 13, and the force distribution surface 112 can be in sufficient contact with the heat application surface 21 of the temperature adjustment module 2 to distribute a force applied to the heat transfer wall 111.
When the existing reaction vessel is assembled with the temperature adjusting module, the heat conducting wall bears an acting force, which may cause the heat conducting wall to be sunken into the reaction cavity, i.e. the heat conducting wall is locally deformed to cause a part of the heat conducting wall to be sunken into the reaction cavity, and the part of the heat conducting wall sunken into the reaction cavity cannot be contacted with the heat applying surface of the temperature adjusting module, thereby causing the heat conducting efficiency of the heat conducting wall to be reduced. In the present application, by providing the force-dividing surface 112, the force-dividing surface 112 can fully contact with the heat-applying surface 21 of the temperature adjusting module 2, and increasing the contact area can disperse the force applied to the heat-conducting wall 111 from point contact to surface contact, so as to uniformly apply force to each position of the force-dividing surface 112, and uniformly deform the heat-conducting wall 111, and after the heat-conducting wall 111 deforms, the force-dividing surface 112 of the heat-conducting wall 111 further has a larger contact area with the heat-applying surface 21 of the temperature adjusting module 2, that is, the deformation generated by the heat-conducting wall 111 can compensate the processing errors of the reaction vessel 1 and the temperature adjusting module 2, so that the contact effect of the heat-conducting wall 111 and the temperature adjusting module 2 is better, so as to further increase the contact area of the heat-conducting wall 111 and the heat-applying surface 21 of the temperature adjusting module 2, and effectively prevent the heat-conducting wall 111 from being partially excessively stressed to cause the heat-conducting wall 111 to sink inwards into the reaction chamber 13, so that the heat-conducting wall 111 can effectively contact with the heat-applying surface 21 of the temperature adjusting module 2, and further improve the heat-conducting efficiency of the heat-conducting wall 111.
Further, in one embodiment, the force-dividing surface 112 is arc-shaped and protrudes from the reaction chamber 13 in a direction away from the central axis of the reaction chamber 13.
Therefore, the force distribution surface 112 protrudes out of the reaction chamber 13, when a force is applied to the force distribution surface 112, the force distribution surface 112 distributes the force, the heat conduction wall 111 is not easily recessed into the reaction chamber 13 after the force is applied to the force distribution surface 112, and the heat conduction wall 111 is prevented from being recessed into the reaction chamber 13 due to the local excessive force applied to the force distribution surface 112, so that the reaction vessel 1 is easily assembled with the temperature adjustment module 2.
Alternatively, please refer to fig. 5, fig. 6 and fig. 7, fig. 5 is a schematic perspective view of a reaction vessel in a second embodiment of the present application; FIG. 6 is a schematic perspective view of a reaction vessel in a second embodiment of the present application, in another direction; FIG. 7 is a schematic sectional view of a reaction chamber of a reaction vessel in a second example of the present application. In the second embodiment, the force-dividing surface 112 is a plane, and is gradually away from the central axis of the reaction vessel 1 from the side close to the bottom of the reaction vessel 1 to the side away from the bottom of the reaction vessel 1, and is inclined with respect to a plane formed by the first direction X and the central axis.
In one embodiment, the force-dividing plane 112 is a three-dimensional plane inclined to both a horizontal plane and a vertical plane. The horizontal plane is a plane parallel to the annular cross section 15, and the vertical plane is a plane parallel to the depth direction.
The force-dividing surface 112 having a three-dimensional plane shape still has a function of dividing the applied force, and since the force-dividing surface 112 is a three-dimensional plane, when the applied force is applied to the force-dividing surface 112 having a three-dimensional plane shape, the force-dividing surface 112 having a three-dimensional plane shape divides the applied force into a plurality of force components in different directions, so that the force-dividing surface 112 having a three-dimensional plane shape can prevent the heat-transfer wall 111 from being locally stressed too much to cause the heat-transfer wall 111 to be recessed into the reaction chamber 13.
Alternatively, in another embodiment, the force-dividing surface 112 is a three-dimensional curved surface, which may be any three-dimensional curved surface with or without rules.
The force-dividing surface 112 with the three-dimensional curved surface still has the function of dispersing the acting force, and because the force-dividing surface 112 is the three-dimensional curved surface, when the acting force is applied to the force-dividing surface 112, the force-dividing surface 112 divides the acting force into a plurality of force-dividing components in different directions, therefore, the force-dividing surface 112 with the three-dimensional curved surface can prevent the heat-conducting wall 111 from being recessed into the reaction chamber 13 due to the over-large local force applied to the heat-conducting wall 111.
Further, in one embodiment, the wall thickness of the heat conducting wall 111 is about 0.01 mm to about 1mm. Preferably, the wall thickness of the heat transfer wall 111 is about 0.2 to 0.4mm. The heat transfer efficiency of the heat transfer wall 111 can be further improved by making the wall thickness of the heat transfer wall 111 thinner than that of the conventional conical test tube.
Further, in one embodiment, the reaction wall 11 further includes a secondary wall 113, the secondary wall 113 is connected to the heat conducting wall 111 to form the reaction chamber 13, and the secondary wall 113 and the heat conducting wall 111 are smoothly transited.
Preferably, the cross-sectional shape of the secondary wall 113 is arc-shaped, and the secondary wall 113 and the heat transfer wall 111 smoothly transition.
Thus, the secondary wall 113 cooperates with the heat-conducting wall 111 to form the shape of the reaction chamber 13. The secondary wall 113 and the heat conducting wall 111 are in smooth transition, and the cross section of the secondary wall 113 is arc-shaped, so that the reaction vessel 1 does not have sharp edges or sharp corners, stress concentration is not easy to generate on the reaction vessel 1, and unnecessary deformation of the reaction vessel 1 caused by uneven stress can be prevented. Meanwhile, because the reaction vessel 1 has no sharp edges and sharp corners, the reaction vessel 1 is easy to process, for example, a mold can be used for processing, and the manufacturing cost of the reaction vessel 1 is reduced.
It can be understood that, in one embodiment, there is one heat conducting wall 111, there is one heat applying surface 21 in the corresponding receiving chamber 20 of the temperature adjusting module 2, the heat conducting wall 111 is attached to the heat applying surface 21 for heat conduction, optionally, in another embodiment, there are two heat conducting walls 111, there are two secondary walls 113, the two heat conducting walls 111 are disposed oppositely, the two secondary walls 113 are disposed oppositely, two ends of each heat conducting wall 111 are respectively connected to the two secondary walls 113, and two ends of each secondary wall 113 are respectively connected to the two heat conducting walls 111. At this time, the two heat conduction walls 111 are respectively in contact with the two opposite heat application surfaces 21 in the corresponding accommodating chambers 20 of the temperature adjustment module 2, so that the reaction vessel 1 has a larger heat conduction area, and the temperature circulation efficiency of the reaction medium is further improved.
Further, in one embodiment, referring to fig. 1 again, the reaction container 1 further includes a guide wall 12, a guide channel 14 is formed in the guide wall 12, and the reaction wall 11 is communicated with the guide wall 12. The guide channel 14 serves to guide the reaction medium into the reaction chamber 13.
Further, in one embodiment, the reaction container 1 further includes a bottom wall 114 capable of transmitting light, the bottom wall 114 is disposed at an end of the reaction chamber 13 away from the guiding channel 14, the bottom wall 114 is connected to the heat conducting wall 111, and the bottom wall 114 is connected to the secondary wall 113.
Further, in one embodiment, the bottom wall 114 is in smooth transition with the heat conducting wall 111, and the bottom wall 114 is in smooth transition with the secondary wall 113.
Therefore, the bottom wall 114, the heat transfer wall 111 and the secondary wall 113 are all in smooth transition, stress concentration is not easy to generate, and the processing is easy, so that the processing technology is simplified, and the processing cost is reduced.
Further, in one embodiment, the cross section of the bottom wall 114 perpendicular to the depth direction of the reaction container 1 is arc-shaped, and the bottom wall 114 protrudes from the reaction chamber 13 to the end far away from the guide channel 14.
Alternatively, in other embodiments, the bottom wall 114 has an arc-shaped cross section perpendicular to the depth direction of the reaction vessel 1, the bottom wall 114 has an arc-shaped cross section parallel to the depth direction of the reaction vessel 1, and the bottom wall 114 protrudes from the reaction chamber 13 toward the end away from the guide passage 14.
Therefore, the bottom wall 114 does not generate stress concentration with the heat transfer wall 111 and the sub-wall 113, and is easy to process, and deformation of the heat transfer wall 111 is facilitated, thereby ensuring the fit of the heat transfer wall 111 with the heat application surface 21.
Further, in one embodiment, since the bottom wall 114 is in a convex lens shape, the bottom wall 114 can condense the light transmitted from the inside of the reaction container 1 to the outside of the bottom wall 114 within a predetermined angle range. Stray light can be filtered out by the condensation in the preset range of the bottom wall 114, so that the influence of the stray light on the detection result is avoided, and in addition, the condensation of the bottom wall 114 refers to the refraction and condensation of the light due to different media when the light is transmitted out of the bottom wall 114 from the reaction cavity 13.
Because the bottom wall 114 is connected with an optical fiber at the outer side, the optical fiber inputs the light transmitted from the bottom wall 114 into the lens module for light analysis, so as to obtain the quantity of the target substances (such as viruses) in the sample. The existing reaction vessel needs to arrange a light-gathering sheet between the bottom wall of the reaction vessel and the optical fiber, and the structural complexity is increased. However, the bottom wall 114 itself of the present application has the function of a light-gathering sheet, and can replace the light-gathering sheet, and meanwhile, the cross section or/and the longitudinal section of the bottom wall 114 is arc-shaped, and the shape of the bottom wall 114 has no sharp edge and has better light transmission capability, thereby simplifying the structure of the reaction container 1.
Further, in one embodiment, the cross-sectional area of the reaction chamber 13 perpendicular to the depth direction of the reaction container 1 is gradually increased from one end away from the guide channel 14 to the end of the reaction chamber 13 connected to the guide channel 14.
Therefore, one end of the reaction chamber 13 close to the guide channel 14 has a larger cross-sectional area, so that the medium in the guide channel 14 can easily and completely enter the reaction chamber 13, and the phenomenon that the medium is suspended on the side wall of the reaction chamber 13 due to the tension of the medium to cause the medium to be unable to participate in the reaction is prevented, the operation performance of the reaction vessel 1 is optimized, and the operation is more convenient when the medium is injected into the reaction vessel 1.
Further, in one embodiment, referring to fig. 1, fig. 2, fig. 4 and fig. 5, the guiding wall 12 and the heat conducting wall 111 are in smooth transition, and the guiding wall 12 and the secondary wall 113 are in smooth transition.
Thus, the medium in the guide channel 14 easily enters the reaction chamber 13.
Alternatively, in other embodiments, the guide wall 12 and the heat transfer wall 111 smoothly transition, the guide wall 12 and the secondary wall 113 smoothly transition, and the area of the cross section perpendicular to the depth direction of the reaction vessel 1 of the end of the guide channel 14 away from the reaction chamber 13 is larger than the area of the cross section perpendicular to the depth direction of the reaction vessel 1 of the end of the guide channel 14 connected to the reaction chamber 13.
Therefore, the guide channel 14 is open and the reaction medium can easily enter the reaction chamber 13.
Further, in one embodiment, the liquid inlet is formed at the position where the guide channel 14 meets the reaction chamber 13; the liquid inlet is in smooth transition between any adjacent positions in the circumferential direction of the shape of the liquid inlet. In this embodiment, the shape of inlet is fillet rectangle, perhaps, the shape of inlet is oval.
The loading port is thus mainly used for feeding the medium in the guide channel 14 into the reaction chamber 13. When the liquid inlet is in the shape of a rounded rectangle or an ellipse, because the stress on each part of the medium is uneven, the condition that the medium cannot enter the reaction cavity 13 because the medium is suspended at the liquid inlet due to surface tension can be effectively avoided by limiting the shape of the liquid inlet, and the medium can rapidly enter the reaction cavity 13.
Further, in one embodiment, the heat conducting wall 111 further includes an inner wall surface 115, and the inner wall surface 115 is parallel to the force dividing surface 112. The heat transfer wall 111 has a uniform thickness, which is beneficial to the processing of the reaction vessel 1 and reduces the processing cost of the reaction vessel 1, and on the other hand, the heat transfer wall 111 is uniformly stressed when bearing the force, so that the heat transfer wall 111 is effectively prevented from being recessed into the reaction chamber 13 due to nonuniform stress.
Referring to fig. 8, fig. 8 is a schematic flow chart illustrating a method for using a reaction vessel according to an embodiment of the present disclosure. It is understood that the method shown in fig. 8 can be adjusted or deleted according to actual needs. The method comprises the following steps:
step 81: injecting a medium for completing the reaction into the reaction vessel 1;
step 82: applying a first force to insert the reaction vessel 1 into the accommodating chamber 20 of the temperature regulating module 2, pressing the heat conducting wall 111 of the reaction vessel 1 and the heat applying surface 21 in the accommodating chamber 20 of the temperature regulating module 2 against each other, deforming the heat conducting wall 111 to make the overlapped part of the heat conducting wall 111 and the heat applying surface 21 of the temperature regulating module 2 completely contact, and removing the first force, wherein the area of the heat conducting wall 111 attached to the heat applying surface 21 is not less than the area of the heat applying surface 21;
step 83: the reaction vessel 1 receives heat transfer from the temperature regulation module 2 through the heat transfer wall 111 or heat within the reaction vessel 1 is transferred to the temperature regulation module 2 via the heat transfer wall 111 so that the reaction medium within the reaction vessel 1 is circulated between the first temperature and the second temperature.
In one embodiment, the first temperature is 60 degrees, and the second temperature is 95 degrees. In other embodiments, the first temperature and the second temperature may be adjusted according to testing requirements, and are not limited herein.
Therefore, when the reaction vessel 1 and the temperature regulating module 2 are assembled, the acting force applied on the reaction vessel 1 is dispersed to prevent the local stress of the reaction vessel 1 from being too large and prevent the local part of the reaction vessel 1 from being recessed into the reaction cavity 13, so that the heat conduction wall 111 and the heat applying surface 21 of the reaction vessel 1 have a larger contact area, the heat conduction efficiency of the reaction vessel 1 is improved, and the reaction efficiency of the medium is further improved.
Preferably, the heat application surface 21 of the temperature control module 2 distributes the applied force evenly over the heat transfer wall 111 of the reaction vessel 1.
The acting force is uniformly distributed on the heat conduction wall 111 of the reaction vessel 1 through the heat applying surface 21, so that the local indentation of the reaction vessel 1 into the reaction cavity 13 caused by the excessive local deformation of the reaction vessel 1 can be prevented, the heat conduction efficiency of the reaction vessel 1 is improved, and the reaction efficiency of the medium is further improved.
Preferably, the medium enters the reaction chamber 13 of the reaction vessel 1 via the guide channel 14 of the reaction vessel 1.
Thereby, the reaction medium is prevented from being spilled or overflowed.
The subject technical solution and the corresponding details of the present invention are introduced above, it can be understood that the above description is only some embodiments of the subject technical solution of the present invention, and some details can be omitted during the specific implementation thereof.
In addition, in some embodiments of the above utility model, there is a possibility that a plurality of embodiments may be combined to be implemented, and various combinations are not listed at length. The implementation embodiments can be freely combined according to the requirements when the technical personnel in the field implement the embodiments so as to obtain better application experience.
In summary, the present application is able to provide the above-mentioned excellent features, so that the present application can be used to enhance the performance of the prior art and provide practicability, and thus is a product with practical value.
The above description is only for the purpose of illustrating the preferred embodiments of the present application and is not to be construed as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principles of the present application are intended to be included within the scope of the present application.

Claims (10)

1. A reaction vessel comprising a reaction wall, at least a portion of the space in the reaction wall forming a reaction chamber, the reaction chamber having an annular cross-section perpendicular to the depth direction of the reaction vessel, the annular cross-section defining a first direction and a second direction in a plane, the first direction and the second direction being perpendicular, the radial dimension of the reaction chamber in the first direction being greater than the radial dimension of the reaction chamber in the second direction, the reaction wall comprising at least one heat transfer wall disposed along the first direction, the heat transfer wall being capable of withstanding a force and being deformed for engaging with a corresponding heat application surface of a temperature regulation module, and the area of the heat transfer wall engaging with the heat application surface being not less than the area of the heat application surface.
2. A reaction vessel according to claim 1, wherein the heat-conducting wall comprises a force-dividing surface on a side facing away from the reaction chamber, the force-dividing surface dispersing a force applied to the heat-conducting wall;
the shape of the force-dividing surface is one of the following shapes:
the force dividing surface is arc-shaped and protrudes out of the reaction cavity in the direction far away from the central axis of the reaction cavity; alternatively, the first and second electrodes may be,
the force distribution surface is a plane, and is gradually far away from the central axis of the reaction vessel from one side close to the bottom of the reaction vessel to one side far away from the bottom of the reaction vessel and is obliquely arranged relative to a surface formed by the first direction and the central axis; alternatively, the first and second liquid crystal display panels may be,
the force-dividing surface is a three-dimensional curved surface.
3. The reaction vessel of claim 1, wherein the reaction wall further comprises a secondary wall connected to the heat conductive wall to form the reaction chamber, and wherein the secondary wall is in smooth transition with the heat conductive wall.
4. A reaction vessel according to claim 3, wherein: the heat conduction device comprises two heat conduction walls, two secondary walls and two heat conduction walls, wherein the two heat conduction walls are arranged oppositely, the two secondary walls are arranged oppositely, two ends of each heat conduction ratio are respectively connected with the two secondary walls, and two ends of each secondary wall are respectively connected with the two heat conduction walls.
5. A reaction vessel according to claim 3 or 4, wherein: the reaction vessel further comprises a guide wall, a guide channel is formed in the guide wall and communicated with the reaction cavity, the vessel body further comprises a bottom wall with light transmission capacity, the bottom wall is arranged at one end, far away from the guide channel, of the reaction cavity, the bottom wall is connected with the heat conduction wall, and the bottom wall is connected with the secondary wall.
6. The reaction vessel of claim 5, wherein: the cross section of the bottom wall, which is perpendicular to the depth direction of the reaction container, is arc-shaped, and the bottom wall protrudes out of the reaction cavity towards one end far away from the guide channel;
or the cross section of the bottom wall in the vertical direction of the depth direction of the reaction vessel is arc-shaped, the cross section of the bottom wall parallel to the depth direction of the reaction vessel is arc-shaped, and the bottom wall protrudes out of the reaction cavity towards one end far away from the guide channel.
7. The reaction vessel of claim 6, wherein: the bottom wall condenses light transmitted from the inside of the reaction vessel to the outside of the bottom wall within a predetermined angle range.
8. A reaction vessel according to claim 3 or 4, wherein: the reaction vessel also comprises a guide wall, a guide channel is formed in the guide wall, the guide channel is communicated with the reaction cavity, the guide wall and the heat conduction wall are in smooth transition, and the guide wall and the secondary wall are in smooth transition;
or, the guide wall and the heat conduction wall are in smooth transition, the guide wall and the secondary wall are in smooth transition, and the area of the cross section, perpendicular to the depth direction of the reaction vessel, of one end, far away from the reaction chamber, of the guide channel is larger than the area of the cross section, perpendicular to the depth direction of the reaction vessel, of one end, connected with the reaction chamber, of the guide channel.
9. A reaction vessel according to claim 1, wherein: the reaction container also comprises a guide wall, a guide channel is formed in the guide wall and is communicated with the reaction cavity, and the cross-sectional area of the reaction cavity, which is perpendicular to the depth direction of the reaction container, is gradually increased from one end, which is far away from the guide channel, to the end, which is connected with the guide channel, of the reaction cavity.
10. A reaction vessel according to claim 9, wherein: a liquid inlet is formed at the joint of the guide channel and the reaction cavity; the liquid inlet is in smooth transition between any adjacent positions in the circumferential direction.
CN202221839794.7U 2022-07-15 2022-07-15 Reaction vessel Active CN217709416U (en)

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