CN217701897U - Novel silicon wafer laser cutting adds holds uses anchor clamps structure - Google Patents
Novel silicon wafer laser cutting adds holds uses anchor clamps structure Download PDFInfo
- Publication number
- CN217701897U CN217701897U CN202221340165.XU CN202221340165U CN217701897U CN 217701897 U CN217701897 U CN 217701897U CN 202221340165 U CN202221340165 U CN 202221340165U CN 217701897 U CN217701897 U CN 217701897U
- Authority
- CN
- China
- Prior art keywords
- groove
- laser cutting
- threaded rod
- clamping
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a novel silicon wafer laser cutting adds holds uses anchor clamps structure belongs to semiconductor manufacturing technical field, the spout that sets up on workstation and the workstation is included, set up the threaded rod in the spout, set up two sliders on the threaded rod, the slider is connected with the threaded rod through setting up the screw hole, the workstation side sets up driving motor, driving motor's output shaft is connected with the threaded rod tip, two set up first fixed block and second fixed block on the slider respectively, set up first bull stick and second bull stick through the bearing respectively on first fixed block and the second fixed block, all set up the supporting shoe on first bull stick and the second bull stick, all set up stop gear on the supporting shoe, set up fixture on the stopper; the utility model discloses can place the wafer between two splint, then control driving motor work just can make fixture carry out the centre gripping to the wafer, wave the rocking handle and just can make the angle of wafer change.
Description
Technical Field
The utility model relates to a semiconductor manufacturing technology field, concretely relates to novel silicon wafer laser cutting adds holds and uses anchor clamps structure.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape of the wafer is circular; at present, in the operation of processing and preparing silicon wafers, the silicon wafers need to be clamped and positioned through clamp equipment, and currently, in the operation, the clamp is various, and in operation, the traditional clamp has good positioning capacity, but can not be flexibly adjusted according to the working position of the positioned silicon wafers, so that the use flexibility and convenience are seriously influenced.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a novel silicon wafer laser cutting adds holds uses anchor clamps structure places the wafer between two splint, then control driving motor work just can make fixture carry out the centre gripping to the wafer, wave the rocking handle just can make the angle of wafer change.
For solving the technical problem, the utility model provides a novel silicon wafer laser cutting adds holds uses anchor clamps structure, the spout that sets up on workstation and the workstation, set up the threaded rod in the spout, set up two sliders on the threaded rod, the slider is connected with the threaded rod through setting up the screw hole, the workstation side sets up driving motor, driving motor's output shaft is connected, two with the threaded rod tip set up first fixed block and second fixed block on the slider respectively, set up first bull stick and second bull stick through the bearing on first fixed block and the second fixed block respectively, all set up the supporting shoe on first bull stick and the second bull stick, all set up stop gear on the supporting shoe, stop gear includes the stopper, set up fixture on the stopper.
Further, the threads on the two sides of the threaded rod are opposite.
Furthermore, the limiting mechanism further comprises a limiting groove arranged on the supporting block, a sliding groove is arranged on the limiting groove, an elastic tongue is arranged in the sliding groove, the end portion of the elastic tongue is of a conical structure, the end portion of the elastic tongue is corresponding to the conical mechanism, a groove is arranged at the end portion of the limiting block corresponding to the end portion of the elastic tongue, a baffle is arranged at the other end of the elastic tongue, a spring is arranged on the elastic tongue, one end of the spring is connected with the supporting block, and the other end of the spring is connected with the baffle.
Furthermore, the cross sections of the sliding groove and the spring tongue are both polygonal structures.
Furthermore, the limiting groove and the limiting block are both rectangular structures.
Furthermore, fixture is including setting up the splint at the stopper tip, set up the arc structure on the splint, set up in the arc structure and press from both sides the groove.
Further, a rocking handle is arranged at the end part of the first rotating rod.
Furthermore, the end part of the second rotating rod is provided with a first positioning groove, a plurality of second positioning grooves are formed in the second fixing block corresponding to the first positioning groove, a positioning plate is arranged corresponding to the first positioning groove and the second positioning groove, and a first positioning pin and a plurality of second positioning pins are arranged on the positioning plate.
The utility model discloses an above-mentioned technical scheme's beneficial effect as follows:
1. control driving motor just can make two sliders be close to together, and then makes two fixture carry out the centre gripping to the wafer to just can polish work such as cutting to the wafer.
2. Rocking the rocking handle just can make fixture take the wafer to rotate to make the angle of wafer change, then insert first locating pin and second locating pin on the locating plate and just can make obtaining of the position of second bull stick fixed with first constant head tank and second constant head tank, and then just can make the wafer position on the fixture keep fixed, thereby can not take place rotatoryly at the in-process of processing.
Drawings
Fig. 1 is a schematic structural view of a novel clamp structure for laser cutting and holding silicon wafers according to the present invention;
fig. 2 is a schematic structural view of the utility model a;
fig. 3 is a schematic structural diagram of a top view of the clamping plate of the present invention;
FIG. 4 is a schematic structural view of the positioning plate of the present invention;
1. a work table; 2. a chute; 3. a threaded rod; 4. a slider; 5. a drive motor; 6. a first fixed block; 7. a second fixed block; 8. a first rotating lever; 9. a second rotating rod; 10. a support block; 11. a limiting groove; 12. a sliding groove; 13. a spring tongue; 14. a limiting block; 15. a groove; 16. a baffle plate; 17. a spring; 18. a splint; 19. a clamping groove; 20. a rocking handle; 21. a first positioning groove; 22. a second positioning groove; 23. positioning a plate; 24. a first positioning pin; 25. and a second positioning pin.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to fig. 1 to 4 of the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived from the description of the embodiments of the present invention by a person skilled in the art, are within the scope of the present invention.
As shown in fig. 1-4: a novel clamp structure for laser cutting and clamping of silicon wafers comprises a workbench 1 and a sliding groove 2 arranged on the workbench 1, wherein a threaded rod 3 is arranged in the sliding groove 2, two sliding blocks 4 are arranged on the threaded rod 3, the sliding blocks 4 are connected with the threaded rod 3 through threaded holes, a driving motor 5 is arranged on the side edge of the workbench 1, an output shaft of the driving motor 5 is connected with the end part of the threaded rod 3, a first fixing block 6 and a second fixing block 7 are respectively arranged on the two sliding blocks 4, a first rotating rod 8 and a second rotating rod 9 are respectively arranged on the first fixing block 6 and the second fixing block 7 through bearings, supporting blocks 10 are respectively arranged on the first rotating rod 8 and the second rotating rod 9, limiting mechanisms are respectively arranged on the supporting blocks 10 and comprise limiting blocks 14, and clamping mechanisms are arranged on the limiting blocks 14; the wafer is placed between the two clamping plates 18, then the driving motor 5 is controlled to work, so that the clamping mechanism clamps the wafer, and the angle of the wafer can be changed by shaking the rocking handle 20.
Particularly, a novel silicon wafer laser cutting adds holds uses anchor clamps structure, control driving motor 5 work just can make threaded rod 3 at 2 internal rotations of spout, because the screw on 3 both sides of threaded rod is opposite, and slider 4 sets up on the both sides of threaded rod 3, thereby threaded rod 3 rotates and just can make two sliders 4 relative movement or the back of the body of moving together, two sliders 4 relative movement just can make first fixed block 6 and second fixed block 7 draw close together to together, and then make two fixture carry out the centre gripping to the wafer.
According to another embodiment of the present invention, as shown in figures 1-2,
the limiting mechanism further comprises a limiting groove 11 arranged on the supporting block 10, a sliding groove 12 is arranged on the limiting groove 11, an elastic tongue 13 is arranged in the sliding groove 12, the end portion of the elastic tongue 13 is of a conical structure, the end portion corresponding to the elastic tongue 13 is of a conical mechanism, a groove 15 is arranged at the end portion of the limiting block 14 corresponding to the end portion of the elastic tongue 13, a baffle 16 is arranged at the other end of the elastic tongue 13, a spring 17 is arranged on the elastic tongue 13, one end of the spring 17 is connected with the supporting block 10, and the other end of the spring 17 is connected with the baffle 16. When wafers with different diameters are clamped, different clamping plates 18 can be used instead, when the clamping plates 18 are mounted, the limiting blocks 14 on the clamping plates 18 are inserted into the limiting grooves 11 in an aligning mode, when the limiting blocks 14 are mounted, the end portions of the elastic tongues 13 connected to the limiting grooves 11 on the limiting blocks 14 are in contact, the end portions of the elastic tongues 13 can be retracted into the sliding grooves 12, then when the grooves 15 in the limiting blocks 14 are moved to the positions corresponding to the sliding grooves 12, the baffle plates 16 and the elastic tongues 13 can be driven by the springs 17 to reset, the end portions of the elastic tongues 13 can extend into the grooves 15 to limit the limiting blocks 14, therefore, under the condition that the baffle plates 16 are not poked, the limiting blocks 14 can be taken out of the limiting grooves 11, when the clamping plates 18 need to be replaced, the limiting blocks 14 are taken out of the limiting grooves 11, the baffle plates 16 are pulled outwards until the end portions of the elastic tongues 13 retract into the sliding grooves 12, the elastic tongues 13 do not limit the limiting blocks 14, and accordingly, the limiting blocks 14 can be taken out of the limiting grooves 11.
In one embodiment of the present invention, as shown in figures 1-2,
the cross sections of the sliding groove 12 and the spring tongue 13 are polygonal structures. Therefore, the elastic tongue 13 cannot rotate in the process of moving back and forth in the sliding groove 12, the inclined surface at the end part of the elastic tongue 13 cannot rotate, and the elastic tongue 13 can normally limit the limiting block 14.
In another embodiment of the present invention, as shown in figures 1-2,
the limiting groove 11 and the limiting block 14 are both rectangular structures. Thereby reducing the positioning time of the stopper 14 and enabling the groove 15 on the stopper 14 to be matched with the sliding groove 12.
According to another embodiment of the present invention, as shown in figures 1-3,
the clamping mechanism comprises a clamping plate 18 arranged at the end part of the limiting block 14, an arc-shaped structure is arranged on the clamping plate 18, and a clamping groove 19 is arranged in the arc-shaped structure. When the two clamping plates 18 clamp the wafer, the wafer is located in the clamping groove 19, and the rubber layer is arranged in the clamping groove 19, so that the wafer is stable between the two clamping plates 18.
According to another embodiment of the present invention, as shown in figure 1,
the end of the first rotating rod 8 is provided with a rocking handle 20. The rocking handle 20 is shaken to enable the first rotating rod 8 to rotate, the first rotating rod 8 can drive one of the supporting blocks 10 to drive the clamping plate 18 to rotate, and therefore the wafers are subjected to hybrid motion, the angles of the wafers are changed, and the wafers can be processed at different angles.
According to another embodiment of the present invention, as shown in figures 1, 2 and 4,
the end of the second rotating rod 9 is provided with a first positioning groove 21, a plurality of second positioning grooves 22 are arranged on the second fixing block 7 corresponding to the first positioning groove 21, a positioning plate 23 is arranged corresponding to the first positioning groove 21 and the second positioning grooves 22, and a first positioning pin 24 and a plurality of second positioning pins 25 are arranged on the positioning plate 23. The first positioning pin 24 and the second positioning pin 25 on the positioning plate 23 are inserted into the first positioning groove 21 and the second positioning groove 22, so that the second rotating rod 9 cannot rotate in the second fixing block 7, and further when the wafer is processed, the first rotating rod 8 and the second rotating rod 9 cannot rotate with the clamping mechanism, that is, the position of the wafer can be fixed during processing.
The utility model discloses a theory of operation:
place the wafer in the clamp groove 19 on one of them splint 18, then control driving motor 5 work, driving motor 5 work just can make two sliders 4 draw close together indirectly, thereby make two splint 18 carry out the centre gripping to the wafer, when the processing angle of wafer needs the adjustment, extract locating plate 23, then wave rocking handle 20 and just can articulate and make splint 18 take the wafer upset together, after the position adjustment finishes, insert first locating pin 24 and second locating pin 25 on locating plate 23 in first locating groove 21 and the second locating groove 22 just can make second bull stick 9 can't be at second fixed block 7 internal rotation, and then add man-hour to the wafer, just can not take place first bull stick 8 and second bull stick 9 and take fixture to rotate, the position of wafer just can be fixed in processing promptly.
In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (8)
1. The utility model provides a novel silicon wafer laser cutting adds holds uses anchor clamps structure which characterized in that: spout (2) that set up on workstation (1) and workstation (1), set up threaded rod (3) in spout (2), set up two slider (4) on threaded rod (3), slider (4) are connected with threaded rod (3) through setting up the screw hole, workstation (1) side sets up driving motor (5), the output shaft and the threaded rod (3) tip of driving motor (5) are connected, two set up first fixed block (6) and second fixed block (7) on slider (4) respectively, set up first bull stick (8) and second bull stick (9) through the bearing respectively on first fixed block (6) and second fixed block (7), all set up supporting shoe (10) on first bull stick (8) and second bull stick (9), all set up stop gear on supporting shoe (10), stop gear includes stopper (14), set up fixture on stopper (14).
2. The novel clamp structure for laser cutting and clamping silicon wafers as claimed in claim 1, wherein: the threads on the two sides of the threaded rod (3) are opposite.
3. The novel clamp structure for laser cutting and clamping silicon wafers as claimed in claim 1, wherein: the limiting mechanism further comprises a limiting groove (11) formed in the supporting block (10), a sliding groove (12) is formed in the limiting groove (11), an elastic tongue (13) is arranged in the sliding groove (12), the end portion of the elastic tongue (13) is of a conical structure and corresponds to the end portion of the elastic tongue (13) and is of a conical mechanism, a groove (15) is formed in the end portion of the limiting block (14) corresponding to the end portion of the elastic tongue (13), a baffle (16) is arranged at the other end of the elastic tongue (13), a spring (17) is arranged on the elastic tongue (13), one end of the spring (17) is connected with the supporting block (10), and the other end of the spring (17) is connected with the baffle (16).
4. The novel clamp structure for silicon wafer laser cutting and clamping as claimed in claim 3, wherein: the cross sections of the sliding groove (12) and the spring tongue (13) are both polygonal structures.
5. The novel clamp structure for laser cutting and clamping silicon wafers as claimed in claim 3, wherein: the limiting groove (11) and the limiting block (14) are both rectangular structures.
6. The novel clamp structure for laser cutting and clamping silicon wafers as claimed in claim 1, wherein: the clamping mechanism comprises a clamping plate (18) arranged at the end part of the limiting block (14), an arc-shaped structure is arranged on the clamping plate (18), and a clamping groove (19) is formed in the arc-shaped structure.
7. The novel clamp structure for laser cutting and clamping silicon wafers as claimed in claim 1, wherein: the end part of the first rotating rod (8) is provided with a rocking handle (20).
8. The novel clamp structure for silicon wafer laser cutting and holding as claimed in claim 1, wherein: the end part of the second rotating rod (9) is provided with a first positioning groove (21), a plurality of second positioning grooves (22) are arranged on the second fixing block (7) corresponding to the first positioning groove (21), a positioning plate (23) is arranged corresponding to the first positioning groove (21) and the second positioning groove (22), and a first positioning pin (24) and a plurality of second positioning pins (25) are arranged on the positioning plate (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221340165.XU CN217701897U (en) | 2022-05-31 | 2022-05-31 | Novel silicon wafer laser cutting adds holds uses anchor clamps structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221340165.XU CN217701897U (en) | 2022-05-31 | 2022-05-31 | Novel silicon wafer laser cutting adds holds uses anchor clamps structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217701897U true CN217701897U (en) | 2022-11-01 |
Family
ID=83795361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221340165.XU Active CN217701897U (en) | 2022-05-31 | 2022-05-31 | Novel silicon wafer laser cutting adds holds uses anchor clamps structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217701897U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115401343A (en) * | 2022-11-02 | 2022-11-29 | 西安晟光硅研半导体科技有限公司 | Tool for manually cutting crystal ingot on double faces of water jet laser |
-
2022
- 2022-05-31 CN CN202221340165.XU patent/CN217701897U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115401343A (en) * | 2022-11-02 | 2022-11-29 | 西安晟光硅研半导体科技有限公司 | Tool for manually cutting crystal ingot on double faces of water jet laser |
| CN115401343B (en) * | 2022-11-02 | 2023-03-14 | 西安晟光硅研半导体科技有限公司 | A frock that is used for two-sided cutting ingot of manual of water jet laser |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN212122431U (en) | Clamp for bearing machining | |
| CN217701897U (en) | Novel silicon wafer laser cutting adds holds uses anchor clamps structure | |
| CN210757254U (en) | Rotating body type clamping device based on machining | |
| CN219521702U (en) | Automatic steel pipe polishing machine | |
| CN218612058U (en) | Gear grinding machine gear clamp convenient to adjust | |
| CN116728282A (en) | Double-sided grinding equipment and grinding method for semiconductor silicon wafer | |
| CN111055171A (en) | Straight cutting edge grinding device for scalpel | |
| JP3000353B1 (en) | Simultaneous chamfering machine on both ends | |
| CN116141177A (en) | Quartz ring step polishing device for semiconductor | |
| CN213859135U (en) | Be used for automatic many sizes of upset fast and adapt to type anchor clamps | |
| CN214134042U (en) | Drilling equipment for machining hardware | |
| CN211166152U (en) | Full-automatic processing engraving device of crown | |
| CN103317401B (en) | Top hammer inclined-plane plain grinding dividing head | |
| CN217195380U (en) | Robot that can pinpoint presss from both sides embraces smelting tool | |
| CN218397626U (en) | Polisher anchor clamps | |
| CN220783001U (en) | Quick positioning tool for milling transmission shaft | |
| CN218658342U (en) | Crystal wafer side grinding and polishing clamp and polishing machine | |
| CN218592481U (en) | Index plate for processing ball screw | |
| CN220547953U (en) | Clamp with adjustable octagonal angle | |
| CN114055260B (en) | Drill bit grinding device is used in production of PCB drill bit | |
| CN220880951U (en) | Laser cutting device for wafer | |
| CN212888313U (en) | Disk chamfer frock clamp | |
| CN221079980U (en) | Stable clamping device for semiconductor wafer | |
| CN212887039U (en) | Novel grinding machine fixture | |
| CN216991262U (en) | Grinding machine grinding wheel fixing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |