CN217694106U - Water-cooling heat abstractor with two-sided heat dissipation function - Google Patents
Water-cooling heat abstractor with two-sided heat dissipation function Download PDFInfo
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- CN217694106U CN217694106U CN202220269773.XU CN202220269773U CN217694106U CN 217694106 U CN217694106 U CN 217694106U CN 202220269773 U CN202220269773 U CN 202220269773U CN 217694106 U CN217694106 U CN 217694106U
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Abstract
The utility model relates to a water-cooling heat abstractor with two-sided heat dissipation function, include: a device body and a heat dissipation wall. The device main body comprises a water pump, a water tank and a water cooling bar bridged between the water pump and the water tank; the heat dissipation wall is convexly arranged at one position of the device main body and is internally provided with a flow channel, the heat dissipation wall is provided with a wall water inlet hole and a wall water outlet hole which are communicated with the flow channel, the wall water inlet hole and the wall water outlet hole are also respectively communicated with the water pump and the water tank, the heat dissipation wall is provided with two heat conduction surfaces, and the two heat conduction surfaces are respectively attached to two heating elements to dissipate heat. Therefore, the device main body can be combined into a whole without a water pipe, thereby having the effect of preventing water seepage and water leakage; and the heat dissipation wall can be used for having double-sided heat dissipation effect.
Description
Technical Field
The present invention relates to water cooling, and more particularly to a water cooling device with double-sided heat dissipation.
Background
A common water-cooled heat dissipation device mainly comprises a water-cooled head, a water pump, a water tank, a water-cooled row and a plurality of water delivery hoses, wherein the water-cooled head, the water pump and the water-cooled row are communicated through the water delivery hoses and joints.
Although the conventional water-cooled heat dissipation device has the required heat dissipation effect, the following problems exist in practical use:
1. because the components are communicated through the water delivery hose and the joint, the problems of water seepage and water leakage which are difficult to solve are easily generated at each joint, and further, the adjacent electronic components are damaged due to damp and short circuit;
2. the conventional water-cooled heat dissipation device has only one heat conduction surface, which results in heat dissipation only for the heat generating elements located on the same side, but not for the heat generating elements located on other sides, and thus, is not suitable for plural electronic products (having heat generating elements).
Therefore, how to design the present application capable of overcoming the above-mentioned deficiencies in the prior art is a major issue to be solved by the present inventors.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a liquid cooling device with two-sided heat dissipation function can borrow to make up into a holistic device main part and no water pipe, consequently can avoid the infiltration, leak to can borrow to have two-sided radiating effect concurrently by the heat dissipation wall.
The second objective of the present invention is to provide a water-cooling heat dissipation device with double-sided heat dissipation function, which can be applied to narrow space by means of thin design.
In order to achieve the above object, the present application provides a water-cooling heat dissipation device with double-sided heat dissipation function, which is used for dissipating heat of a heating element on an electronic product and includes: the device comprises a device main body, a water pump, a water tank and a water cooling drain, wherein the water cooling drain is communicated between the water pump and the water tank in a bridging manner; the heat dissipation wall is convexly arranged at one position of the device main body and internally provided with a flow channel, the heat dissipation wall is provided with a wall water inlet hole and a wall water outlet hole which are communicated with the flow channel, the wall water inlet hole and the wall water outlet hole are also respectively communicated with the water pump and the water tank, and the heat dissipation wall is provided with two heat conduction surfaces; wherein, the two heat conducting surfaces of the heat dissipation wall are respectively attached with the two heating elements for heat dissipation.
The utility model provides a technical scheme as follows: the utility model provides a liquid cooling device with two-sided heat dissipation function for to the heating element heat dissipation on the electronic product, characterized by includes: the device comprises a device main body, a water pump, a water tank and a water cooling drain, wherein the water cooling drain is communicated between the water pump and the water tank in a bridging way; the heat dissipation wall is convexly arranged at one position of the device main body and internally provided with a flow channel, the heat dissipation wall is provided with a wall water inlet hole and a wall water outlet hole which are communicated with the flow channel, the wall water inlet hole and the wall water outlet hole are also respectively communicated with the water pump and the water tank, and the heat dissipation wall is provided with two heat conduction surfaces; wherein, the two heat conducting surfaces of the heat dissipation wall are respectively attached to the two heating elements for heat dissipation.
Preferably, the heat dissipating wall is hollow, a plurality of partition plates are arranged in the hollow space, the partition plates are used for guiding the flow to form a flow channel, and the wall water inlet hole and the wall water outlet hole are respectively communicated with two ends of the flow channel.
Further preferably, the electronic device further includes two fixing members, the two fixing members are disposed on the device main body, and the two electronic products are respectively fixed between each fixing member and each heat conduction surface.
Further preferably, the fixing member is a plate, each plate is protruded at the one position of the device main body, the heat dissipation wall is located between the two plates, two clamping spaces are formed between each plate and each heat conduction surface at intervals in parallel, and the two electronic products are respectively clamped and fixed in the clamping spaces.
Further preferably, the device body has a main body side, the water pump and the water tank have sides respectively, the sides together form the main body side, the heat dissipation wall has a wall side, and the wall side and the main body side are juxtaposed to each other and at least adjacent to the side of the water pump and the side of the water tank.
Further preferably, the water-cooling bank also has a side, and the side of the water pump, the side of the water-cooling bank and the side of the water tank together form the side of the main body.
Preferably, the heat dissipating wall is provided with a wall inlet and a wall outlet on a side of the wall, the wall inlet is connected to the water pump through the side of the water pump, and the wall outlet is connected to the water tank through the side of the water tank.
Further preferably, wherein the apparatus body is a thin body, the water pump, the water-cooled bank and the water tank are arranged side by side with each other.
Preferably, the side of the water pump is provided with a pump connection hole, the side of the water tank is provided with a tank connection hole, the wall water inlet hole and the pump connection hole are correspondingly communicated, and the wall water outlet hole and the tank connection hole are correspondingly communicated.
Further preferably, wherein an intake chamber and an intake and outlet chamber are provided in the water pump, an outlet chamber and an inlet and outlet chamber are provided in the water tank, the water pump has a pump cross-over side separating the intake chamber and the inlet and outlet chamber at the same time, the water tank has a tank cross-over side separating the outlet chamber and the inlet and outlet chamber at the same time, the pump cross-over side is opposite to the tank cross-over side, and the water-cooling discharge cross-over is provided between the pump cross-over side and the tank cross-over side and communicates the water pump and the water tank.
Further preferably, the water-cooling row comprises a plurality of rows of tubes and a plurality of heat dissipation fins, each row of tubes is spaced from each other and arranged side by side, and the heat dissipation fins are connected between any two adjacent rows of tubes.
Compared with the prior art, the application has the following effects: the device main body can be combined into a whole without a water pipe, so that water seepage and water leakage can be avoided, and the device can have double-sided heat dissipation effect by virtue of the heat dissipation wall; even in narrow spaces by means of a thin body design.
Drawings
The above features, technical features, advantages and implementation of a water-cooled heat sink with double-sided heat dissipation will be further described in the following detailed description of preferred embodiments with reference to the accompanying drawings.
Fig. 1 is a perspective view of the water-cooling heat dissipation device of the present invention when viewed from above.
Fig. 2 is a perspective view of the water-cooling heat dissipation device of the present invention viewed from above.
Fig. 3 is a schematic sectional view of the water-cooling heat dissipation device of the present invention when viewed from the front.
Fig. 4 is a schematic cross-sectional view of the water-cooling heat dissipation device of the present invention when viewed from the side.
FIG. 5 is another schematic sectional view of the water-cooling heat dissipation device of the present invention.
Fig. 6 is a schematic cross-sectional view of the water-cooling heat dissipation device of the present invention simultaneously dissipating heat from two electronic products according to fig. 4.
The reference numbers illustrate:
100: water-cooling heat dissipation device with double-sided heat dissipation function, 1: device body, 11: water pump, 111: side, 1111: pump connection hole, 11a: water inlet chamber, 11b: water inlet and outlet chamber, 12: water tank, 121: side, 1211: case connection hole, 12a: outlet chamber, 12b: water inlet and outlet chambers 13, water cooling rows 131, side edges 132, discharge pipes 133, heat dissipation fins 2, heat dissipation walls 211: separator, 21: flow channel, 22 heat conduction surface, 23: clamping space, 24: wall inlet opening, 25: wall water outlet hole, 3: fixing piece, 900: electronic product, 9: heating element, S1: main body side, S2: the side of the wall body.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the present application. However, it will be apparent to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
For the sake of simplicity, only the parts relevant to the present invention are schematically shown in the drawings, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "one" means not only "only one" but also a case of "more than one".
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
The following detailed description and technical contents of the present invention are described with reference to the drawings, but the drawings are only provided for reference and illustration, and are not intended to limit the present invention.
The utility model provides a water-cooling heat abstractor with two-sided heat dissipation function, as shown in fig. 6 for heat dissipation to the heating element 9 on the electronic product 900.
As shown in fig. 1 to 4, a water-cooling heat dissipation device (hereinafter, referred to as a water-cooling heat dissipation device) 100 with double-sided heat dissipation function includes: a device body 1 and a heat dissipation wall 2, and preferably two fixing members 3. The electronic product 900 may be a memory plugged into or built in an electronic device (e.g., a personal computer or a server).
The device body 1 comprises a water pump 11, a water tank 12 and a water cooling bar 13, wherein the water cooling bar 13 is directly connected between the water pump 11 and the water tank 12 in a bridging manner, so that no water pipe (such as a water delivery hose) is completely arranged between the water pump 11, the water tank 12 and the water cooling bar 13 to form a whole, and the problems of water seepage and water leakage of the water pipe can be further avoided.
It should be noted that the water pump 11, the water tank 12, and the water cooling drain 13 are arranged side by side with each other, so that the apparatus body 1 is a thin body, and the thin body as shown in fig. 1 and 2 is a flat rectangular body, and thus is suitable for a narrow space in the electronic equipment. The parallel arrangement may be a straight line (as shown in fig. 1 to 3), or a non-straight line (not shown, for example, an inverted U-shaped parallel arrangement, where the water pump 11 and the water tank 12 are parallel to each other from left to right, and the water cooling rows 13 are stacked on the water pump 11 and the water tank 12 which are parallel to each other from left to right).
The apparatus body 1 has a linear body side S1 (for example, a thickness side of the apparatus body 1), the water pump 11, the water tank 12, and the water cooling bank 13 have sides 111, 121, and 131, respectively, as shown in fig. 2, and the sides 111, 121, and 131 together form the body side S1. The pump 11 has a pump port 1111 at the side 111, and the tank 12 has a tank port 1211 at the side 131. The sides 111, 121, 131 that together form the main body side S1 may be flush with each other as shown in fig. 2 and 3, but in other embodiments not shown in the drawings, only the side 131 of the water cooling row 13 may be recessed relative to the main body side S1 and not flush with the other two sides 111, 121.
The heat dissipating wall 2 is protruded from one portion of the device body 1 (e.g., the side S1 of the device body) and has two heat conducting surfaces 22 and 22. The heat dissipating wall 2 is hollow, and the hollow interior is guided by a plurality of partition boards 211 to form a flow channel 21. The heat dissipating wall 2 also has a linear wall side S2 (for example, the thickness of the heat dissipating wall 2 is the same as the thickness of the heat dissipating wall 2), and the heat dissipating wall 2 has a wall inlet 24 and a wall outlet 25 at the wall side S2, which are respectively connected to two ends of the flow channel 21.
In a situation where the wall side S2 and the body side S1 are adjacent to each other side by side (in a situation where only the side 131 is not flush as described above, the wall side S2 is adjacent to only the side 111 and the side 121, not shown), the wall inlet hole 24 and the pump connection hole 1111 are correspondingly communicated with each other, and the wall outlet hole 24 and the tank connection hole 1211 are correspondingly communicated with each other, so that there is no water pipe between the heat dissipating wall 2 and the device body 1 (between the water pump 11 and the heat dissipating wall 2 and between the water tank 12 and the heat dissipating wall 2), and the problems of water seepage and water leakage of the water pipe can be avoided. The assembled water-cooled heat sink 100 of the present invention is still a thin body, and is still suitable for the narrow space in the electronic device, except that the profile is enlarged.
By the combination of the above components, the fluid for heat dissipation can circulate in the water pump 11, the water cooling bar 13, the water tank 12 and the flow channel 21 of the heat dissipation wall 2, so that the heat conducted to the two heat conduction surfaces 22 of the heat dissipation wall 2 can be rapidly taken away for heat dissipation, in other words, the water cooling heat dissipation device 100 of the present application has a double-sided heat dissipation function, and can simultaneously dissipate the heat of the two heat generation elements 9 by only attaching the two heat conduction surfaces 22 to the two heat generation elements 9 respectively.
The water-cooled heat dissipation device 100 of the present application is particularly suitable for memories (electronic products 900) arranged in parallel at intervals, and as long as the heat dissipation wall 2 is inserted between two memories (electronic products 900) arranged in parallel at intervals as shown in fig. 6, the heat generating elements 9 on the two memories can be respectively attached to the two heat conduction surfaces 22 to dissipate heat in a large area.
Preferably, the water-cooled heat sink 100 further includes two fixing members 3. The fixing member 3 can be any member that can be used with the heat dissipation wall 2 to fix the electronic product 900, and in this embodiment, the plate is illustrated as an example.
The two fixing members 3 are protruded from the side S1 of the main body of the device main body 1, so that the heat dissipating wall 2 is located between the two fixing members 3 and spaced side by side, and two clamping spaces 23, 23 are formed between each fixing member 3 and each heat conducting surface 22, as shown in fig. 6, so that two electronic products 900 can be clamped and fixed in each clamping space 23, and the fixing members 3 can be used to force the heating elements 9 on each electronic product 900 to be attached to each heat conducting surface 22 more firmly.
In addition, as shown in fig. 3 and 5, in the device body 1, the water pump 11 has a water inlet chamber 11a (capable of being filled with water by the water cooling drain 13) and a water inlet and outlet chamber 11b (capable of being filled with water and drained of water by the water cooling drain 13), and the water pump 11 has a pump bridging side 112 that separates the water inlet chamber 11a and the water inlet and outlet chamber 11b, in other words, the water inlet chamber 11a and the water inlet and outlet chamber 11b are located on the same side of the water pump 11 (pump bridging side 112). The water tank 12 has an outlet chamber 12a (capable of discharging water via the water cooling outlet 13) and an inlet/outlet chamber 12b (capable of feeding and discharging water via the water cooling outlet 13), and the water tank 12 has a tank bridging side 122 that separates the outlet chamber 12a and the inlet/outlet chamber 12b, in other words, the outlet chamber 12a and the inlet/outlet chamber 12b are located on the same side of the water tank 12 (the tank bridging side 122). And, the pump crossover side 112 is disposed opposite the tank crossover side 122.
The water cooling bank 13 includes a plurality of bank pipes 132 and a plurality of heat dissipating fins 133. The rows of tubes 132 are spaced and arranged side by side, and the water-cooling row 13 is connected with the heat dissipation fins 133 at least between any two adjacent rows of tubes 132, and the heat dissipation fins 133 are respectively connected outside the two rows of tubes 132 at the two outermost sides as shown in the figure.
When the water cooling bank 13 is bridged between the pump bridge side 112 and the tank bridge side 122, one end of each of the bank pipes 132 is inserted into the pump bridge side 112 to communicate with the inlet chamber 11a and the inlet chamber 11b, and the other end of each of the bank pipes 132 is inserted into the tank bridge side 122 to communicate with the outlet chamber 12a and the inlet chamber 12b. The case connection hole 1211 is opened corresponding to the outlet chamber 12a and communicates with the outlet chamber 12a.
To sum up, the utility model discloses water-cooling heat abstractor with two-sided heat dissipation function can reach anticipated use purpose surely to solve prior art's disappearance, accord with novel patent application requirement completely.
The above description is only a preferred and practical embodiment of the present invention, and not intended to limit the scope of the present invention, and all structural equivalents made by using the contents of the specification and drawings are included in the scope of the present invention.
Claims (11)
1. The utility model provides a water-cooling heat abstractor with two-sided heat dissipation function for dispel the heat to the heating element on the electronic product, characterized by includes:
the device comprises a device main body, a water pump, a water tank and a water cooling drain, wherein the water cooling drain is communicated between the water pump and the water tank in a bridging manner; and
the heat dissipation wall is convexly arranged at one position of the device main body and internally provided with a flow passage, the heat dissipation wall is provided with a wall water inlet hole and a wall water outlet hole which are communicated with the flow passage, the wall water inlet hole and the wall water outlet hole are also respectively communicated with the water pump and the water tank, and the heat dissipation wall is provided with two heat conduction surfaces;
wherein, the two heat conducting surfaces of the heat dissipation wall are respectively attached to the two heating elements for heat dissipation.
2. The water-cooled heat dissipating device with double-sided heat dissipation as defined in claim 1, wherein the heat dissipating wall is hollow, a plurality of partition boards are disposed inside the hollow, the partition boards are guided to form a flow channel, and the wall inlet and outlet are connected to two ends of the flow channel respectively.
3. The water-cooled heat dissipating device with double-sided heat dissipating function as claimed in claim 1, further comprising two fixing members disposed on the device body, wherein two electronic products are respectively fixed between each fixing member and each heat conducting surface.
4. The water-cooled heat dissipating device with dual-sided heat dissipation as claimed in claim 3, wherein the fixing member is a plate, each plate is protruded from the one portion of the device body, the heat dissipating wall is disposed between the two plates, two clamping spaces are formed between each plate and each heat conducting surface, and two electronic products are respectively clamped and fixed in the clamping spaces.
5. The water-cooled heat dissipating device with double-sided heat dissipating function as claimed in claim 1, wherein the device body has a body side, the water pump and the water tank have sides respectively, the sides together form the body side, the heat dissipating wall has a wall side, and the wall side and the body side are juxtaposed to each other and at least adjacent to the side of the water pump and the side of the water tank.
6. The apparatus of claim 5, wherein the water cooling row has a side, and the side of the water pump, the side of the water cooling row and the side of the water tank together form the side of the main body.
7. The water-cooled heat dissipating device with dual-sided heat dissipating function as claimed in claim 5, wherein the heat dissipating wall has the wall inlet hole and the wall outlet hole formed on the side of the wall, the wall inlet hole is connected to the water pump through the side of the water pump, and the wall outlet hole is connected to the water tank through the side of the water tank.
8. The apparatus of claim 5, wherein the apparatus body is a thin body, and the water pump, the water-cooling unit and the water tank are arranged side by side.
9. The water-cooled heat dissipating device with dual-sided heat dissipating function as claimed in claim 5, wherein the side of the water pump is formed with a pump connecting hole, the side of the water tank is formed with a tank connecting hole, the wall inlet hole and the pump connecting hole are correspondingly connected, and the wall outlet hole and the tank connecting hole are correspondingly connected.
10. The water-cooled heat dissipating device with double-sided heat dissipation as claimed in claim 1, wherein the water pump has an inlet chamber and an outlet chamber therein, the water tank has an outlet chamber and an inlet/outlet chamber therein, the water pump has a pump cross-over side separating the inlet chamber and the outlet chamber, the water tank has a tank cross-over side separating the outlet chamber and the inlet/outlet chamber, the pump cross-over side is opposite to the tank cross-over side, and the water-cooled water is discharged across between the pump cross-over side and the tank cross-over side and communicates the water pump and the water tank.
11. The apparatus of claim 1, wherein the water cooling bank comprises a plurality of rows of tubes and a plurality of fins, each row of tubes is spaced apart from each other and arranged side by side, and the fins are connected between at least two adjacent rows of tubes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220269773.XU CN217694106U (en) | 2022-02-10 | 2022-02-10 | Water-cooling heat abstractor with two-sided heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220269773.XU CN217694106U (en) | 2022-02-10 | 2022-02-10 | Water-cooling heat abstractor with two-sided heat dissipation function |
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| Publication Number | Publication Date |
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| CN217694106U true CN217694106U (en) | 2022-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220269773.XU Active CN217694106U (en) | 2022-02-10 | 2022-02-10 | Water-cooling heat abstractor with two-sided heat dissipation function |
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- 2022-02-10 CN CN202220269773.XU patent/CN217694106U/en active Active
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