CN217693821U - 3D interconnection high density PCB board - Google Patents
3D interconnection high density PCB board Download PDFInfo
- Publication number
- CN217693821U CN217693821U CN202123413515.9U CN202123413515U CN217693821U CN 217693821 U CN217693821 U CN 217693821U CN 202123413515 U CN202123413515 U CN 202123413515U CN 217693821 U CN217693821 U CN 217693821U
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- China
- Prior art keywords
- copper
- pcb board
- boss
- base plate
- copper base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 82
- 229910052802 copper Inorganic materials 0.000 claims abstract description 82
- 239000010949 copper Substances 0.000 claims abstract description 82
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 238000003801 milling Methods 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 17
- 238000005553 drilling Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract description 3
- 230000008054 signal transmission Effects 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 2
- 238000000151 deposition Methods 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000002313 adhesive film Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Images
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model belongs to the technical field of the PCB board processing, especially, be a 3D interconnection high density PCB board includes copper base plate, copper boss and bonding sheet, the milling flutes has been seted up to the equal symmetry in both sides of copper base plate surface mounting position, the inside at the milling flutes is all pegged graft to the bottom of copper boss. The utility model discloses a copper boss is fixed to both sides symmetry at copper base surface mounting heating element position, utilize the copper boss to conduct the heat that heating element produced on the copper base plate fast, and heating element is electrically conductive through the mode of subsides dress, the effect of electrothermal separation has been reached, heat dispersion has been improved, make copper boss and copper base bond together through setting up bonding sheet, make heat-conduction more smooth and easy, be multilayer PCB board through setting up this PCB board, it is high to have assembly density, small, the line shortens between the electronic components, characteristics such as signal transmission speed improves, cooperate outstanding heat dispersion, be applicable to the demand of 3D interconnection technique to high density PCB board.
Description
Technical Field
The utility model relates to a PCB board processing technology field specifically is a 3D interconnection high density PCB board.
Background
In recent years, copper-based PCB boards have been widely used, and compared with common FR-4 materials, the heat dissipation of copper-based PCB boards is widely accepted. The copper base has high heat conductivity coefficient which reaches 400W/m.K, but the heat conductivity coefficient of the insulating layer can only reach 2-4W/m.K, so that the heat conductivity of the insulating layer determines that the overall heat conductivity of the copper base PCB is low, the high heat conductivity of the copper base cannot be fully utilized, and the heat of heating components cannot be conducted out in time, so that the service life, the performance and the like of a product are greatly reduced, and therefore, the 3D interconnection high-density PCB is provided to solve the problems.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a 3D interconnection high density PCB board has solved the problem mentioned in the above-mentioned background art.
(II) technical scheme
The utility model discloses a realize above-mentioned purpose and specifically adopt following technical scheme:
the utility model provides a 3D interconnection high density PCB board, includes copper base plate, copper boss and bonding sheet, the equal symmetry in both sides of copper base plate surface mounting position has seted up the milling flutes, the bottom of copper boss is all pegged graft in the inside of milling flutes, the space packing between copper boss and the milling flutes has the bonding sheet, the surface subsides of copper base plate is equipped with heating element spare, and partial power is great the both ends of heating element spare lower surface and the upper end welded fastening of two copper bosses that correspond each other, drilling has been seted up with inside to the surface of copper base plate, and its upper and lower surface all is equipped with the solder mask.
Furthermore, the shape of the copper boss is in accordance with the corresponding figure of the PCB circuit shape, including round, oval, square and polygon.
Further, the bonding sheet is made of high-thermal-conductivity epoxy resin.
Further, the height difference between the copper boss and the copper substrate surface is not more than the allowable range of surface mounting.
Further, the drilling hole comprises a blind hole, a buried hole and a through hole.
The utility model also provides a manufacturing process of the 3D interconnected high-density PCB board, which comprises the following steps;
s1: cutting, namely cutting the substrate;
s2: the inner layer is used for manufacturing inner layer circuits of the cut substrate;
s3: automatic optical detection, which is used for detecting the inner layer circuit of the substrate;
s4: pressing, namely pressing the copper substrate, the copper boss and the bonding sheet together;
s5: drilling holes, namely drilling the slotted holes with required sizes on the multilayer circuit board by using slotted cutters with different specifications;
s6: copper deposition and electroplating, namely plating copper on the outer surface of the multilayer circuit board and in the slotted holes in a chemical reaction mode to ensure that the slotted holes can be conducted among all layers;
s7: the outer layer circuit is used for manufacturing the outer layer circuit of the multilayer circuit board;
s8: developing, etching and stripping, displaying the pattern on the adhesive film on the multilayer circuit board, etching the exposed surface copper by using etching solution to form a circuit pattern, and stripping the shielded part of the adhesive film;
s9: automatic optical detection is carried out, and the circuit pattern on the surface of the multilayer circuit board is detected;
s10: depositing copper, namely depositing a layer of chemical copper on the drilled non-conductive hole wall base material to serve as a substrate for later copper electroplating;
s11: a layer of dry film is covered on the outer surface of the multilayer circuit board, and a circuit image is formed on the outer surface of the multilayer circuit board in an image transfer mode;
s12: baking to make the dry film and the surface of the substrate be jointed;
s13: copper plating, namely plating a layer of copper on the multilayer circuit board forming the circuit image to protect the circuit on the surface;
s14: removing the film, and stripping the dry film for the electroplating resistance by using a liquid medicine;
s15: solder mask, covering a layer of printing ink on the outer surface of the multilayer circuit board in a printing mode;
s16: characters are printed on the outer surface of the multilayer circuit board in a printing mode to form corresponding symbols;
s17: surface treatment, namely increasing the resistance of the surface to oxidation and corrosion;
s18: forming, namely removing useless frames from the whole multi-layer circuit board, and finishing the multi-layer circuit board into a specified shape and specification after chemical cleaning;
s19: electrical measurement, which is used for testing open circuit and short circuit of the circuit;
s20: carrying out shipment inspection to determine whether the surface of the PCB has defects;
s21: and (6) packaging.
(III) advantageous effects
Compared with the prior art, the utility model provides a 3D interconnection high density PCB board possesses following beneficial effect:
1. the utility model discloses, through the fixed copper boss of both sides symmetry at copper base surface mounting heating element position, utilize the copper boss to conduct the heat that heating element produced on the copper base plate fast, and heating element is electrically conductive through the mode of subsides dress, the effect of electrothermal separation has been reached, heat dispersion has been improved, make copper boss and copper base bond together through setting up bonding sheet, make heat-conduction more smooth and easy, be multilayer PCB board through setting up this PCB board, it is high to have assembly density, small, the line shortens between the electronic components, characteristics such as signal transmission speed improves, cooperate outstanding heat dispersion, be applicable to the demand of 3D interconnection technique to high density PCB board.
Drawings
FIG. 1 is a heat dissipation diagram of the present invention;
FIG. 2 is a process flow diagram of the present invention.
In the figure: 1. a copper substrate; 2. a copper boss; 3. a bonding sheet; 4. a heat generating element; 5. drilling; 6. and a solder resist layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Examples
As shown in fig. 1, the utility model discloses a 3D interconnection high density PCB board that embodiment provided, including copper base plate 1, copper boss 2 and bonding sheet 3, the equal symmetry in both sides of copper base plate 1 surface mounting position has seted up the milling flutes, the inside at the milling flutes is all pegged graft to copper boss 2's bottom, space packing between copper boss 2 and the milling flutes has bonding sheet 3, copper base plate 1's surface mounting is equipped with heating element device 4, the great heating element device 4 lower surface of partial power's both ends and the upper end welded fastening of two copper boss 2 of mutual correspondence, drilling 5 has been seted up to copper base plate 1's surface and inside, and its upper and lower surface all is equipped with solder mask 6, this PCB board is multilayer PCB board, it is high to have assembly density, small, the line shortens between the electronic components, characteristics such as signal transmission speed improves, can be applicable to the demand of 3D interconnection technique to high density PCB board, through seting up the milling flutes on copper base plate 1's surface, make to connect more firm between copper boss 2 and the copper base plate 1, and simultaneously, also be convenient for copper boss 2 directly transmits the heat conduction component of heating 4, make better heat conduction performance.
As shown in fig. 1, in some embodiments, the shape of the copper boss 2 corresponds to the shape of the PCB circuit, including a circle, an ellipse, a square and a polygon, and the shape of the copper boss 2 is adapted to the shape requirement of the PCB circuit without any special limitation.
In some embodiments, the material of the bonding sheet 3 is high thermal conductivity epoxy resin, and the bonding sheet 3 made of the high thermal conductivity epoxy resin facilitates heat conduction.
As shown in fig. 1, in some embodiments, the height difference between the copper boss 2 and the copper substrate surface 1 is not greater than the allowable range of surface mounting, so that the copper boss 2 quickly conducts heat generated by the heating elements 4 to the copper substrate 1, and the heating elements 4 are electrically conductive in a mounting manner, thereby achieving the effect of electric-thermal separation.
As shown in fig. 1, in some embodiments, the drilled hole 5 includes a blind hole, a buried hole and a through hole, and the blind hole, the buried hole and the through hole are arranged to match the requirement of the multilayer PCB, so that the use space of the internal circuit layer is increased.
As shown in fig. 2, the utility model also provides a manufacturing process of the 3D interconnected high-density PCB board, comprising the following steps;
s1: cutting, namely cutting the substrate;
s2: the inner layer is used for manufacturing inner layer circuits of the cut substrate;
s3: automatic optical detection, which is used for detecting the inner layer circuit of the substrate;
s4: pressing, namely pressing the copper substrate 1, the copper boss 2 and the bonding sheet 3 together;
s5: drilling holes, namely drilling the slotted holes with required sizes on the multilayer circuit board by using slotted cutters with different specifications;
s6: copper deposition and electroplating, namely plating copper on the outer surface of the multilayer circuit board and in the slotted holes in a chemical reaction mode to ensure that the slotted holes can be communicated among all layers;
s7: the outer layer circuit is used for manufacturing the outer layer circuit of the multilayer circuit board;
s8: developing, etching and stripping, displaying the graph on the adhesive film on the multilayer circuit board, etching the exposed surface copper by using an etching solution to form a circuit graph, and stripping the shielded part of the adhesive film;
s9: automatic optical detection is carried out, and the circuit pattern on the surface of the multilayer circuit board is detected;
s10: depositing copper, namely depositing a layer of chemical copper on the drilled non-conductive hole wall base material to serve as a substrate for later copper electroplating;
s11: a layer of dry film is covered on the outer surface of the multilayer circuit board, and a circuit image is formed on the outer surface of the multilayer circuit board in an image transfer mode;
s12: baking to make the dry film adhere to the surface of the substrate;
s13: copper plating, namely plating a layer of copper on the multilayer circuit board forming the circuit image to protect the circuit on the surface;
s14: removing the film, and stripping the dry film for the electroplating resistance by using a liquid medicine;
s15: solder mask, covering a layer of printing ink on the outer surface of the multilayer circuit board in a printing mode;
s16: characters, printing corresponding symbols on the outer surface of the multilayer circuit board in a printing mode;
s17: surface treatment, namely increasing the resistance of the surface to oxidation and corrosion;
s18: forming, namely removing useless frames from the whole multi-layer circuit board, and finishing the multi-layer circuit board into a specified shape and specification after chemical cleaning;
s19: electrical testing, namely testing open circuit and short circuit of the circuit;
s20: carrying out shipment inspection to determine whether the surface of the PCB has defects;
s21: and (6) packaging.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides a 3D interconnection high density PCB board, includes copper base plate (1), copper boss (2) and bonding sheet (3), its characterized in that: milling flutes have all been seted up to the equal symmetry in both sides in copper base plate (1) surface mounting position, the bottom of copper boss (2) is all pegged graft in the inside of milling flutes, the space between copper boss (2) and the milling flutes is filled there is bonding sheet (3), the surface mounting of copper base plate (1) is equipped with heating element spare (4), drilling (5) have been seted up with inside on the surface of copper base plate (1), and its upper and lower surface all is equipped with solder mask (6).
2. The 3D interconnected high-density PCB board of claim 1, wherein: the shape of the copper boss (2) is in accordance with the corresponding figure of the shape of the PCB circuit, and the figure comprises a circle, an ellipse, a square and a polygon.
3. The 3D interconnected high-density PCB board as claimed in claim 1, wherein: the bonding sheet (3) is made of high-thermal-conductivity epoxy resin.
4. A 3D interconnect high density PCB board as claimed in claim 3 wherein: the height difference between the copper boss (2) and the copper substrate (1) is not larger than the allowable range of surface mounting.
5. A 3D interconnect high density PCB board as claimed in claim 3 wherein: the drilling hole (5) comprises a blind hole, a buried hole and a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123413515.9U CN217693821U (en) | 2021-12-31 | 2021-12-31 | 3D interconnection high density PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123413515.9U CN217693821U (en) | 2021-12-31 | 2021-12-31 | 3D interconnection high density PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217693821U true CN217693821U (en) | 2022-10-28 |
Family
ID=83728007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123413515.9U Active CN217693821U (en) | 2021-12-31 | 2021-12-31 | 3D interconnection high density PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217693821U (en) |
-
2021
- 2021-12-31 CN CN202123413515.9U patent/CN217693821U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A 3D interconnect high-density PCB board Granted publication date: 20221028 Pledgee: China Co. truction Bank Corp Jiaxing branch Pledgor: CHENGYI ELECTRONICS (JIAXING) CO.,LTD. Registration number: Y2024330000090 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |