CN217693314U

CN217693314U - Electronic device

Info

Publication number: CN217693314U
Application number: CN202220748700.9U
Authority: CN
Inventors: 杨江涛; 范姝男; 周雷; 张诗豪
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-12-15
Filing date: 2022-03-31
Publication date: 2022-10-28
Anticipated expiration: 2032-03-31
Also published as: WO2023109552A1; CN116264469A

Abstract

The application provides an electronic device. The electronic equipment comprises a card seat component and a processor; the card seat assembly comprises a card connector, and when the two-in-one card is inserted into the card seat assembly, ten golden fingers of the two-in-one card are correspondingly abutted against and electrically connected with ten elastic sheets of the card connector one by one; the processor comprises a memory card controller, an SIM card controller, a power interface and a ground interface, wherein the interfaces of the memory card controller and the SIM card controller are connected to eight of the ten elastic pieces, and the power interface and the ground interface are respectively connected to the other two elastic pieces of the ten elastic pieces. The electronic equipment can communicate with two-in-one cards compatible with the Nano SIM card function and the memory card function, and one card seat component can meet the card inserting requirement of the electronic equipment, so that the number of the card seat components is reduced, and the lightening and thinning of the electronic equipment are facilitated.

Description

Electronic device

Technical Field

The present application relates to the field of communications technologies, and in particular, to an electronic device.

Background

With the development of electronic equipment products, a plurality of information cards need to be arranged in the electronic equipment to meet the functional requirements of the electronic equipment. Taking a mobile phone as an example, a Subscriber Identity Module (SIM) card, a memory card, and the like are usually installed in the mobile phone. All the card seat subassemblies that all need correspond of all kinds of information cards with it phase-match, consequently, need set up a plurality of card seat subassemblies usually in the electronic equipment, lead to the card seat subassembly account for the board area demand at the grow, occupy the inside space of electronic equipment, seriously restrict the development of electronic equipment frivolousization.

SUMMERY OF THE UTILITY MODEL

The application provides an electronic equipment, electronic equipment can communicate with the card of compatible Nano SIM card function and memory card function, and a card socket subassembly can satisfy electronic equipment's plug-in card demand to reduce the quantity of card socket subassembly, be favorable to electronic equipment's frivolousization.

In a first aspect, the present application provides an electronic device comprising a card holder assembly and a processor; the card socket assembly comprises a card connector, and when a card is inserted into the card socket assembly, ten golden fingers of the card are correspondingly abutted and electrically connected with ten elastic sheets of the card connector one by one. Wherein the card is an information card. The card comprises a storage card circuit and a SIM card circuit, and the card can be a two-in-one card. The processor comprises a memory card controller, a SIM card controller, a power interface and a ground interface, wherein the interfaces of the memory card controller and the SIM card controller are connected to eight of the ten elastic sheets, the power interface is connected to the other elastic sheet of the ten elastic sheets, and the ground interface is connected to the other elastic sheet of the ten elastic sheets.

In this application, the card connector of the card seat subassembly of electronic equipment can communicate with the card through ten shell fragments, realizes SIM card function and memory card function, has improved the integrated level, and electronic equipment can effectively reduce the information card quantity that needs the grafting, reduces the quantity of card seat subassembly, is favorable to electronic equipment's frivolousization, also can improve user's use and experience.

In some possible implementations, the electronic device further includes a switch, the switch is connected to the reset interface of the SIM card controller and one of the interfaces of the memory card controller, and the switch is further connected to one of the ten elastic pieces.

In this implementation, because the reset operation of the SIM card circuit of card is not frequently operated, and the reset process can be accomplished very fast, when the same shell fragment of one of them interface multiplexing of reset interface and storage card controller, can carry out signal transmission through this shell fragment of multiplexing mode make full use of timesharing, for example, when the SIM card circuit of card needs to reset, switch on a certain shell fragment of card connector to the SIM card controller including the reset interface earlier, in order to guarantee user's networking experience, after the reset process of the SIM card module of card is accomplished, then this shell fragment switches back to switching on the storage card controller, in order to continue to accomplish the read-write operation to the card, thereby improve electronic equipment's work efficiency.

In some possible implementations, the memory card controller supports an eMMC interface protocol; the switch is connected with a command and response multiplexing interface of the memory card controller; and among the ten elastic sheets, seven elastic sheets are connected with the four data interfaces of the memory card controller, the clock interface of the memory card controller, the data interface of the SIM card controller and the clock interface of the SIM card controller in a one-to-one correspondence manner.

In this implementation manner, nine elastic pieces of the ten elastic pieces of the card connector are respectively used for connecting fixed interfaces, and one of the elastic pieces switches different interfaces through a switch, so that the circuit structure of the processor is simple and stable, the reliability of signal transmission is favorably ensured, and the cost is low.

In some possible implementation manners, the ten elastic pieces are arranged in an array, the ten elastic pieces are arranged along the second direction to form a first row of elastic pieces and a second row of elastic pieces, the first row of elastic pieces comprises a first elastic piece, a third elastic piece, a fifth elastic piece, a seventh elastic piece and a ninth elastic piece which are arranged along the first direction, the second row of elastic pieces comprises a second elastic piece, a fourth elastic piece, a sixth elastic piece, an eighth elastic piece and a tenth elastic piece which are arranged along the first direction, and the first direction is perpendicular to the second direction.

The power interface is connected with the eighth elastic sheet, and the ground interface is connected with the seventh elastic sheet; the switch is connected with the sixth elastic sheet; the four data interfaces of the memory card controller are connected with the first elastic sheet, the second elastic sheet, the ninth elastic sheet and the tenth elastic sheet in a one-to-one correspondence manner, and the clock interface of the memory card controller is connected with the fifth elastic sheet; the data interface of the SIM card controller is connected with the third elastic sheet, and the clock interface of the SIM card controller is connected with the fourth elastic sheet.

In some possible implementations, the memory card controller supports an eMMC interface protocol; the switch is connected with a clock interface of the memory card controller; and among the ten elastic sheets, seven elastic sheets are connected with four data interfaces of the memory card controller, a command and response multiplexing interface of the memory card controller, a data interface of the SIM card controller and a clock interface of the SIM card controller in a one-to-one correspondence manner.

The power interface is connected with the eighth elastic sheet, and the ground interface is connected with the seventh elastic sheet; the switch is connected with the sixth elastic sheet; the four data interfaces of the memory card controller are connected with the first elastic sheet, the second elastic sheet, the ninth elastic sheet and the tenth elastic sheet in a one-to-one correspondence manner, and the command and response multiplexing interface of the memory card controller is connected with the fifth elastic sheet; the data interface of the SIM card controller is connected with the third elastic sheet, and the clock interface of the SIM card controller is connected with the fourth elastic sheet.

In some possible implementations, the memory card controller supports the UFS interface protocol or the PCIe interface protocol; the switch is connected with a reference clock interface of the memory card controller; and among the ten elastic sheets, seven elastic sheets are connected with the four data interfaces of the memory card controller, the second power interface of the memory card controller, the data interface of the SIM card controller and the clock interface of the SIM card controller in a one-to-one correspondence manner.

The power interface is connected with the eighth elastic sheet, and the ground interface is connected with the seventh elastic sheet; the switch is connected with the sixth elastic sheet; three data interfaces of the memory card controller are connected with the fifth elastic sheet, the ninth elastic sheet and the tenth elastic sheet in a one-to-one correspondence manner, one of the other data interface of the memory card controller and the second power interface of the memory card controller is connected with the first elastic sheet, and the other data interface of the memory card controller and the second power interface of the memory card controller are connected with the second elastic sheet; the data interface of the SIM card controller is connected with the third elastic sheet, and the clock interface of the SIM card controller is connected with the fourth elastic sheet.

In some possible implementations, the processor further includes a frequency divider, the memory card controller supports an eMMC interface protocol, the clock interface of the memory card controller is connected to one of the ten elastic pieces, and the clock interface of the memory card controller is connected to the clock interface of the SIM card controller via the frequency divider.

In this implementation, the frequency divider aligns the clock of the memory card controller and the clock of the SIM card controller, so that the ten elastic pieces of the card connector can be connected to the fixed interfaces respectively, and thus, circuit switching is not required.

In some possible implementations, seven of the ten spring pieces are connected to the four data interfaces of the memory card controller, the command and response multiplexing interface of the memory card controller, the data interface of the SIM card controller, and the reset interface of the SIM card controller in a one-to-one correspondence.

The power interface is connected with the eighth elastic sheet, and the ground interface is connected with the seventh elastic sheet; a clock interface of the memory card controller is connected with the fourth elastic sheet, four data interfaces of the memory card controller are connected with the first elastic sheet, the second elastic sheet, the ninth elastic sheet and the tenth elastic sheet in a one-to-one correspondence manner, and a command and response multiplexing interface of the memory card controller is connected with the fifth elastic sheet; the data interface of the SIM card controller is connected with the third elastic sheet, and the reset interface of the SIM card controller is connected with the sixth elastic sheet.

In some possible implementations, the processor further includes a frequency divider, the memory card controller supports the UFS interface protocol or the PCIe interface protocol, the reference clock interface of the memory card controller is connected to one of the ten elastic pieces, and the reference clock interface of the memory card controller is connected to the clock interface of the SIM card controller through the frequency divider.

In the implementation mode, the frequency divider aligns the clock of the memory card controller and the clock of the SIM card controller, so that ten elastic sheets of the card connector can be respectively connected with the fixed interfaces, circuit switching is not needed, the circuit structure of the processor is simple and stable, the reliability of signal transmission is favorably ensured, and the cost is low.

In some possible implementations, seven of the ten spring pieces are connected to the four data interfaces of the memory card controller, the second power interface of the memory card controller, the data interface of the SIM card controller, and the reset interface of the SIM card controller in a one-to-one correspondence.

The power interface is connected with the eighth elastic sheet, and the ground interface is connected with the seventh elastic sheet; a clock interface of the memory card controller is connected with the fourth elastic sheet, three data interfaces of the memory card controller are connected with the fifth elastic sheet, the ninth elastic sheet and the tenth elastic sheet in a one-to-one correspondence manner, one of the other data interface of the memory card controller and a second power interface of the memory card controller is connected with the first elastic sheet, and the other data interface of the memory card controller and the second power interface of the memory card controller are connected with the second elastic sheet; the data interface of the SIM card controller is connected with the third elastic sheet, and the reset interface of the SIM card controller is connected with the sixth elastic sheet.

In some possible implementations, the memory card controller supports a UFS interface protocol or a PCIe interface protocol; and among the ten elastic sheets, eight elastic sheets are connected with four data interfaces of the memory card controller, a reference clock interface of the memory card controller, a reset interface of the SIM card controller, a data interface of the SIM card controller and a clock interface of the SIM card controller in a one-to-one correspondence manner.

In this embodiment, the memory card controller of the electronic device is not provided with the second power interface, and when the electronic device communicates with the card, the card obtains the second power signal through the first power signal, thereby simplifying a communication path between the electronic device and the card.

In some possible implementation manners, the ten elastic pieces are arranged in an array, the ten elastic pieces are arranged along the second direction to form a first row of elastic pieces and a second row of elastic pieces, the first row of elastic pieces comprises a first elastic piece, a third elastic piece, a fifth elastic piece, a seventh elastic piece and a ninth elastic piece which are arranged along the first direction, the second row of elastic pieces comprises a second elastic piece, a fourth elastic piece, a sixth elastic piece, an eighth elastic piece and a tenth elastic piece which are arranged along the first direction, and the first direction is perpendicular to the second direction. The power interface is connected with the eighth elastic sheet, and the ground interface is connected with the seventh elastic sheet; the four data interfaces of the memory card controller are connected with the first elastic sheet, the second elastic sheet, the ninth elastic sheet and the tenth elastic sheet in a one-to-one correspondence manner; the data interface of the SIM card controller is connected with the third elastic sheet, and the clock interface of the SIM card controller is connected with the fourth elastic sheet; one of the reference clock interface of the memory card controller and the reset interface of the SIM card controller is connected with the fifth elastic sheet, and the other one is connected with the sixth elastic sheet.

In some possible implementations, the memory card controller supports the PCIe interface protocol. A reference clock interface and a second power interface of the memory card controller are connected to the same elastic sheet of the ten elastic sheets; the four data interfaces of the memory card controller are connected to the other four elastic sheets in the ten elastic sheets in a one-to-one correspondence manner; the reset interface of the SIM card controller, the data interface of the SIM card controller and the clock interface of the SIM card controller are connected to the other three elastic sheets in the ten elastic sheets in a one-to-one correspondence manner.

In this implementation, the reference clock signal and the second power signal of the memory card are transmitted through the same elastic sheet, and these two signals can be separated in the card, so that under the condition of ensuring normal communication, the number of the elastic sheets is reduced, the size of the card seat assembly is reduced, and the lightness and thinness of the electronic equipment are facilitated.

The power interface is connected with the eighth elastic sheet, and the ground interface is connected with the seventh elastic sheet; the four data interfaces of the memory card controller are connected to the first elastic sheet, the second elastic sheet, the ninth elastic sheet and the tenth elastic sheet in a one-to-one correspondence manner; the data interface of the SIM card controller is connected with the third elastic sheet, and the clock interface of the SIM card controller is connected with the fourth elastic sheet; the reference clock interface of the memory card controller and the second power interface of the memory card controller are connected to one of the fifth elastic sheet or the sixth elastic sheet, and the reset interface of the SIM card controller is connected to the other of the fifth elastic sheet or the sixth elastic sheet.

In some possible implementations, the ten resilient sheets are arranged in the first direction from the first row of resilient sheets to the fifth row of resilient sheets. The center distance between the second row of elastic sheets and the third row of elastic sheets is greater than the center distance between the first row of elastic sheets and the second row of elastic sheets and greater than the center distance between the fourth row of elastic sheets and the fifth row of elastic sheets. The distance between the centers of the third row of elastic sheets and the fourth row of elastic sheets is greater than the distance between the centers of the first row of elastic sheets and the second row of elastic sheets and greater than the distance between the centers of the fourth row of elastic sheets and the fifth row of elastic sheets.

In this application implementation, through the mode of arranging and the centre-to-centre spacing that set up a plurality of shell fragments for a plurality of shell fragments can form multiple combination, shell fragment quantity and position in the multiple combination can with the golden finger quantity and the position looks adaptation of polytype information card, make card connector can realize the communication with the information card of different grade type, realize many cards compatibility, and expansibility is better. Therefore, when the card connector is applied to the card holder assembly of the electronic equipment, the electronic equipment can adapt to various information cards through the same card holder assembly, so that the number of the card holder assemblies is reduced, the occupation of the internal space of the electronic equipment is reduced, and the light and thin electronic equipment is facilitated.

In a second aspect, the present application further provides an information card identification method, including: executing a first initialization process; if the first reply instruction is received, judging that the inserted information card is the first card; if the first reply instruction is not received, judging that the inserted information card is not the first card, and executing a second initialization process; if a second reply instruction is received, the inserted information card is judged to be a second card; and if the second reply instruction is not received, judging that the inserted information card is not the second card. One of the first initialization process and the second initialization process is a two-in-one card initialization process, and the other is an SIM card initialization process.

In this implementation manner, the electronic device executes the initialization process of the information card, and if a specific reply signal is received, can determine that the information card is the information card corresponding to the initialization process, and if the specific reply signal is not received, determine that the information card is not the information card corresponding to the initialization process, and execute the next initialization process, and determine whether the information card is the information card corresponding to the next initialization process. The electronic equipment can realize automatic identification of the Nano SIM card and the two-in-one card.

In some possible implementations, the first initialization procedure is executed when it is detected that the state of the card tray is switched from the detached state to the inserted state, or when it is detected that the electronic device is turned on or the electronic device is restarted.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

FIG. 2 is a schematic view of the cartridge assembly of FIG. 1 in some use states;

FIG. 3 is an exploded view of the cartridge of FIG. 2;

FIG. 4 is a schematic view of the card holder of FIG. 2 shown at another angle;

FIG. 5 is a schematic diagram of a card connector according to an embodiment of the present disclosure;

FIG. 6 is a first schematic view of the card connector shown in FIG. 5 at another angle;

FIG. 7 is a schematic view of the structure of the conductive body of the card connector shown in FIG. 6;

fig. 8 is an internal structural view of the structure at a of the card connector shown in fig. 6;

FIG. 9 is a second structural view of the card connector shown in FIG. 5 at another angle;

fig. 10 is a schematic block diagram of a Nano SIM card provided in an embodiment of the present application;

FIG. 11 is a schematic diagram of the Nano SIM card of FIG. 10 in some embodiments;

FIG. 12 is a schematic view of the Nano SIM card of FIG. 11 connected to the card connector of FIG. 5;

FIG. 13 is a schematic block diagram of a first NM card provided by an embodiment of the present application;

FIG. 14 is a schematic diagram of a first NM card of FIG. 13 in some embodiments;

fig. 15 is a schematic view illustrating a structure of the first NM card of fig. 14 when connected to the card connector of fig. 5;

FIG. 16 is a schematic block diagram of a two-in-one card according to an embodiment of the present disclosure;

FIG. 17 is a schematic diagram of the two-in-one card of FIG. 16 in some embodiments;

FIG. 18 is a schematic view of the two-in-one card of FIG. 17 connected to the card connector of FIG. 5;

FIG. 19 is a dimensional view of the two-in-one card of FIG. 17 in some embodiments;

FIG. 20A is a dimensional view of the two-in-one card of FIG. 16 in alternative embodiments;

FIG. 20B is another size view of the two-in-one card of FIG. 20A;

FIG. 21 is a dimensional view of the two-in-one card of FIG. 16 in other embodiments;

FIG. 22 is a dimensional view of the two-in-one card of FIG. 16 in other embodiments;

FIG. 23 is a schematic view of the two-in-one card of FIG. 17 in some embodiments;

FIG. 24A is a schematic diagram of a connection circuit between the two-in-one card of FIG. 23 and an electronic device;

fig. 24B is a schematic circuit diagram of a portion of an electronic device in some embodiments, according to an embodiment of the present application;

FIG. 25 is a schematic view of the two-in-one card of FIG. 17 in another embodiment;

FIG. 26A is a schematic diagram of a connection circuit between the two-in-one card of FIG. 25 and an electronic device;

fig. 26B is a schematic diagram of a partial circuit structure of an electronic device according to an embodiment of the present application in another embodiment;

FIG. 27 is a schematic view of the two-in-one card of FIG. 17 in another embodiment;

FIG. 28A is a schematic diagram of a connection circuit between the two-in-one card of FIG. 27 and an electronic device;

fig. 28B is a schematic diagram of a partial circuit structure of an electronic device according to an embodiment of the present application in another embodiment;

FIG. 29 is a schematic view of the two-in-one card of FIG. 17 in another embodiment;

FIG. 30 is a schematic diagram of a connection circuit of the two-in-one card of FIG. 29 with an electronic device;

FIG. 31 is a schematic view of the two-in-one card of FIG. 17 in another embodiment;

FIG. 32 is a schematic diagram of a connection circuit between the two-in-one card of FIG. 31 and an electronic device;

FIG. 33 is a schematic view of the two-in-one card of FIG. 17 in another embodiment;

FIG. 34 is a schematic diagram of a connection circuit between the two-in-one card of FIG. 33 and an electronic device;

FIG. 35 is a schematic view of the two-in-one card of FIG. 17 in another embodiment;

FIG. 36 is a schematic diagram of a connection circuit of the two-in-one card of FIG. 35 to an electronic device;

FIG. 37 is a schematic view of the two-in-one card of FIG. 17 in another embodiment;

FIG. 38 is a schematic diagram of a connection circuit of the two-in-one card of FIG. 37 to an electronic device;

FIG. 39 is a schematic view of the two-in-one card of FIG. 17 in another embodiment;

FIG. 40 is a schematic diagram of a connection circuit between the two-in-one card of FIG. 39 and an electronic device.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings. In the description of the embodiments herein, "/" means "or" unless otherwise specified, for example, a/B may mean a or B; "and/or" in the text is only an association relationship describing an associated object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone; "at least part" in the text includes both "part" and "all"; in the text "plurality" means two or more than two, and "plurality" means two or more than two.

The terms "first", "second", and the like are used hereinafter for descriptive purposes only and are not to be construed as implying or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

The directional terms used in the embodiments of the present application, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "side," "top," "bottom," and the like, refer only to the orientation of the figures, and thus, are used for better and clearer illustration and understanding of the embodiments of the present application, rather than to indicate or imply that the referenced device or element must be in a particular orientation, constructed and operated in a particular orientation, and therefore should not be considered as limiting the embodiments of the present application.

In the description of the embodiments of the present application, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "disposed on … …" are to be interpreted broadly, e.g., "connected" may or may not be detachably connected; may be directly connected or indirectly connected through an intermediate.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present disclosure. The electronic device 100 may be an electronic product such as a mobile phone, a tablet, an intelligent wearable device, and the like, and the embodiment of the application illustrates that the electronic device 100 is a mobile phone.

In some embodiments, the electronic device 100 may include a card-holder assembly 10, a processor 20, a housing 30, a display 40, and a circuit board 50. Wherein the display screen 40 may be mounted to the housing 30, the display screen 40 being for displaying images, videos, etc. The circuit board 50 is mounted inside the housing 30, and the processor 20 may be fixed to the circuit board 50 and electrically connected to the circuit board 50. The card holder assembly 10 includes a card holder 1 and a card holder 2. The card socket 1 can be installed inside the housing 30, and the card socket 1 can also be fixedly connected to the circuit board 50 and electrically connected to the circuit board 50. The processor 20 may be electrically connected to the socket 1 through the circuit board 50. The card holder 2 is detachably inserted into the card holder 1. The card holder 2 is used for mounting one or more information cards, and the card holder 2 can be inserted into the card socket 1 with the information card, so that the information card is inserted into the card socket assembly 10, and the information card is communicated with the electronic device 100.

For example, the information card may be a Nano SIM (subscriber identity module) card, a Nano memory card, or a Nano two-in-one card. The Nano SIM card is also called 4FF card, such as the SIM card with the ETSI TS 102 221V11.0.0 specification, and the size of the card body is 12.30mm in length, 8.80mm in width and 0.67mm in thickness. A user can insert a Nano SIM card into the card holder assembly 10, the Nano SIM card communicates with the processor 20, and the electronic device 100 interacts with a network through the Nano SIM card to realize functions such as communication and data communication. The Nano memory card may also be referred to as NM (Nano memory) card for short. The user can also insert an NM card into the card holder assembly 10, and the NM card communicates with the processor 20 to realize the data storage function. For example, files such as music, video, etc. may be saved in the NM card. The Nano two-in-one card may include a SIM card circuit for supporting a call and data communication, and a memory card circuit for supporting a data storage function. The user can also insert a Nano two-in-one card into the card holder assembly 10, and the Nano two-in-one card communicates with the processor 20 to realize functions such as communication, data communication and data storage.

In some embodiments, the electronic device 100 may further include one or more of an internal memory, a Universal Serial Bus (USB) interface, a charging management module, a power management module, a battery, an antenna, a mobile communication module, a wireless communication module, an audio module, a speaker, a receiver, a microphone, an earphone interface, a sensor module, a key, a motor, an indicator, a camera, and the like. In other embodiments, electronic device 100 may have more or fewer components than the above, may combine two or more components, or may have a different configuration of components. The various components described above may be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and/or application specific integrated circuits.

In some embodiments, a processor may include one or more processing units, such as: the processor may include one or more of an Application Processor (AP), a modem processor, a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a controller, a memory, a video codec, a Digital Signal Processor (DSP), a baseband processor, a neural Network Processor (NPU), and the like, which are not strictly limited in the embodiments of the present application. The different processing units may be separate devices or may be integrated into one or more processors. Wherein the processor may further comprise one or more interfaces by which the processor may communicate with other components of the electronic device.

In some embodiments, processor 20 may include one or more processing units, such as: the processor 20 may include one or more of an Application Processor (AP), a modem processor, a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a controller, a memory, a video codec, a Digital Signal Processor (DSP), a baseband processor, a neural-Network Processing Unit (NPU), and the like, which are not strictly limited in this embodiment. Wherein the different processing units may be separate devices or may be integrated in one or more processors 20. Wherein the processor 20 may further comprise one or more interfaces, through which the processor 20 may communicate with other components of the electronic device 100.

Referring to fig. 2 to 4 in combination, fig. 2 is a schematic structural view of the card-seat assembly 10 shown in fig. 1 in some use states, fig. 3 is an exploded structural view of the card seat 1 shown in fig. 2, and fig. 4 is a schematic structural view of the card holder 2 shown in fig. 2 at another angle.

In some embodiments, the card socket 1 may include a socket body 12, a first card connector 13, a second card connector 14, an ejection assembly 15, and an insertion detection spring 16. The seat body 12 is substantially in the shape of a cover, the seat body 12 includes a top plate 121 and a plurality of side plates 122 connected to the top plate 121, and the top plate 121 and the plurality of side plates 122 together enclose an inner space 123 of the seat body 12. The first card connector 13 is located in the inner space 123 of the housing 12 and is fixedly connected to the housing 12, and the first card connector 13 is disposed opposite to the top plate 121. The structure of the second card connector 14 may be the same as or different from that of the first card connector 13. The second card connector 14 is located in the inner space 123 of the housing 12, the second card connector 14 is located on a side of the first card connector 13 opposite to the top plate 121, the second card connector 14 is disposed opposite to the first card connector 13, and a gap is formed between the second card connector 14 and the first card connector 13. The first card connector 13, the second card connector 14 and the side plate 122 of the housing 12 together enclose the card slot 17 of the card socket 1. One end of the clamping groove 17 is open and forms an opening, and the other end of the clamping groove 17 forms the bottom of the clamping groove 17.

When the card socket 1 is installed in the electronic device 100, the ends of the side plates 122 far away from the top plate 121 are fixed to the circuit board 50 of the electronic device 100. The plurality of solder tails of the first card connector 13 are fixedly attached and electrically connected to the circuit board 50 such that the first card connector 13 can be electrically connected to the processor 20 of the electronic device 100. The second card connector 14 can be fixedly connected to the circuit board 50 to be fixedly connected to the housing 12 through the circuit board 50. Alternatively, the second card connector 14 may be directly fixed to the connector housing 12. The plurality of solder tails of the second card connector 14 are fixedly attached and electrically connected to the circuit board 50 such that the second card connector 14 can be electrically connected to the processor 20 of the electronic device 100.

Wherein, card holds in palm 2 can have first mounting groove 21 and the second mounting groove 22 of back to back the setting, and the opening of first mounting groove 21 and the opening of second mounting groove 22 are located the both sides surface that the card held in the palm 2 respectively. The first mounting groove 21 and the second mounting groove 22 are used for mounting an information card. For example, in fig. 2 and 4, two information cards may be mounted in the first mounting groove 21 and the second mounting groove 22, respectively. The sizes of the grooves of the first mounting groove 21 and the second mounting groove 22 can be the same or close to each other, and the sizes of the card bodies of the two information cards mounted in the first mounting groove 21 and the second mounting groove 22 are the same. In other embodiments, the first mounting groove 21 and the second mounting groove 22 may have different slot sizes, and the two information cards mounted in the first mounting groove 21 and the second mounting groove 22 have different card bodies.

The slot sizes of the first mounting slot 21 and the second mounting slot 22 are matched with the size of the card body of the corresponding information card, for example, the slot sizes of the first mounting slot 21 and the second mounting slot 22 may be slightly larger than the size of the card body of the corresponding information card, but the size difference is not large, so that the information card can be smoothly mounted in the first mounting slot 21 and the second mounting slot 22, and the mounting position is stable.

The card holder 2 can be inserted into the card slot 17 through the opening of the card slot 17, alone or with an information card. The direction in which the card holder 2 and/or the information card is inserted into the card slot 17 (i.e., the card insertion direction) is the direction in which the opening of the card slot 17 faces the bottom of the card slot 17. The size of the card slot 17 is matched with the size of the card holder 2, for example, the size of the card slot 17 may be slightly larger than the size of the card holder 2 but the difference between the size of the card holder 2 and the size of the card holder 2 is not large, and a certain fit clearance is provided between the card holder 2 and the slot wall of the card slot 17, so that the card holder 2 can be smoothly inserted into the card slot 17 and can be stably installed in the card slot 17. When the card holder 2 carries an information card and is inserted into the card slot 17, the information card mounted on the card holder 2 is electrically connected to the first card connector 13 or the second card connector 14 to electrically connect the electronic device 100.

Wherein, the ejection assembly 15 can be mounted on the housing 12 and/or the first card connector 13. When the card support 2 is inserted into the card slot 17, a user can control the ejection assembly 15 to enable the ejection assembly 15 to eject part of the card support 2 out of the card slot 17, so that the user can take down the card support 2 conveniently. For example, the insertion detection spring 16 may be mounted to the first card connector 13 and electrically connected to the circuit board 50. The insertion detection spring 16 may be at least partially located at the bottom of the card slot 17. The insertion detection spring 16 can be used for detecting whether the card holder 2 is inserted into the card slot 17.

In other embodiments, the card holder 1 may be provided with a card connector, the card holder assembly 10 is used for mounting an information card, and the structure of the card holder 2 is adapted. In other embodiments, the card socket 1 may also be provided with three or more card connectors, so that the card socket assembly 10 can be used for mounting more than three information cards, and the structure of the card holder 2 is adapted. The number and position of the card connectors of the card holder 1, the specific structure of the card holder 2, and the like are not strictly limited in the embodiments of the present application.

In other embodiments, the card socket 1 may also be provided with an ejection assembly 15 and/or an insertion detection spring 16 which are different from the illustrated structure. In other embodiments, the card-seat assembly 10 may include more or less components than the above embodiments, and the embodiments of the present application are not limited thereto.

Referring to fig. 5 and fig. 6 in combination, fig. 5 is a schematic structural diagram of a card connector 11 according to an embodiment of the present application, and fig. 6 is a schematic structural diagram of the card connector 11 shown in fig. 5 at another angle. For example, the card connector 11 shown in fig. 5 may be applied to the card socket 1 shown in fig. 3, and used as the first card connector 13 and/or the second card connector 14.

The embodiment of the present application provides a card connector 11, where the card connector 11 can be applied to a card socket 1 of an electronic device 100, and the card connector 11 is used for connecting an information card. The card connector 11 includes a plurality of elastic pieces, and when the card connector 11 is connected to an information card, the elastic pieces support the information card.

In some embodiments, the card connector 11 includes ten spring plates arranged in an array, the ten spring plates being spaced apart from each other. The ten spring plates may be arranged in a 2 x 5 array configuration. For example, the ten elastic pieces are arranged in the first direction to form a first row of elastic pieces to a fifth row of elastic pieces, and arranged in the second direction to form a first row of elastic pieces and a second row of elastic pieces. The first row of elastic sheets comprises a first elastic sheet 11a, a third elastic sheet 11c, a fifth elastic sheet 11e, a seventh elastic sheet 11g and a ninth elastic sheet 11i which are arranged along the first direction, and the second row of elastic sheets comprises a second elastic sheet 11b, a fourth elastic sheet 11d, a sixth elastic sheet 11f, an eighth elastic sheet 11h and a tenth elastic sheet 11j which are arranged along the first direction. The first elastic sheet 11a and the second elastic sheet 11b are located on the first row of elastic sheets, the third elastic sheet 11c and the fourth elastic sheet 11d are located on the second row of elastic sheets, the fifth elastic sheet 11e and the sixth elastic sheet 11f are located on the third row of elastic sheets, the seventh elastic sheet 11g and the eighth elastic sheet 11h are located on the fourth row of elastic sheets, and the ninth elastic sheet 11i and the tenth elastic sheet 11j are located on the fifth row of elastic sheets.

When the plurality of elastic sheets are arranged in a row along the first direction, center points of the plurality of elastic sheets located in the same row (that is, center points of portions of the elastic sheets for abutting against the information card) may be aligned in the first direction, or may not be aligned but slightly staggered. When the plurality of elastic sheets are arranged in rows along the second direction, the center points of the two elastic sheets located in the same row (that is, the center points of the portions of the elastic sheets for abutting against the information card) may be aligned in the second direction, or may not be aligned but slightly staggered.

Referring to fig. 2, fig. 3, fig. 5 and fig. 6, when the card connector 11 is applied to the card socket assembly 10, the insertion direction of the information card into the card slot 17 of the card socket assembly 10 is parallel to the second direction, that is, the insertion direction of the information card connected with the card connector 11 is parallel to the second direction. During insertion of the information card, the information card first contacts the front side of the card connector 11 and then contacts the rear side of the card connector 11. When the card connector 11 is mounted to the card holder 1, the structure of the card connector 11 arranged on the front side is close to the opening of the card slot 17, and the structure of the card connector 11 arranged on the rear side is far from the opening of the card slot 17. For example, the second row of resilient pieces of the card connector 11 may be located at the rear side of the first row of resilient pieces, and the second row of resilient pieces is far away from the opening of the card slot 17 of the card holder assembly 10 relative to the first row of resilient pieces. In other embodiments, the second row of elastic pieces of the card connector 11 may also be close to the opening of the card slot 17 of the card holder assembly 10 relative to the first row of elastic pieces, which is not described in this embodiment again.

Referring to fig. 6 and 7, fig. 7 is a schematic structural diagram of the conductive body 113 of the card connector 11 shown in fig. 6.

In some embodiments, card connector 11 includes an insulative body 112 and an electrical conductor 113. The insulating body 112 may be substantially plate-shaped, and the insulating body 112 further has a plurality of hollow areas spaced apart from each other. For example, the insulation body 112 may include six first hollow-out regions 1121, a plurality of second hollow-out regions 1122, and a plurality of third hollow-out regions 1123. The six first hollow-out areas 1121 may be arranged in two rows and three rows, and include a first row of first hollow-out areas 1121 and a second row of first hollow-out areas 1121 located behind the first row of first hollow-out areas 1121. The second hollow areas 1122 may be arranged in two rows, and the two rows of second hollow areas 1122 are located at the rear side of the two rows of first hollow areas 1121 respectively. The third hollow-out regions 1123 may be arranged in a row and located at the rear side of the first hollow-out regions 1121 in the second row.

Illustratively, the electrical conductor 113 is embedded in the insulating body 112. The conductive body 113 may be formed by punching a unitary metal plate. The conductor 113 includes ten elastic pieces and ten fixing pieces 1131, the ten elastic pieces may include the first elastic piece 11a to the tenth elastic piece 11j, the ten fixing pieces 1131 are connected to the ten elastic pieces in a one-to-one correspondence, and the fixing pieces 1131 and the elastic pieces are made of a conductive material. The conductive body 113 includes ten conductive blocks, and a corresponding one of the fixing members 1131 and one of the elastic pieces are located on the same conductive block, and the ten conductive blocks are arranged at intervals. Ten fixing members 1131 are embedded in the insulating body 112 to be fixedly connected to the insulating body 112, and the ten spring pieces are respectively and fixedly connected to the insulating body 112 through the ten fixing members 1131.

For example, each spring (for simplicity, one of the springs (e.g., 11 j) is indicated in the drawings) includes a fixed end 111a, an abutting end 111b, and a movable end 111c, the fixed end 111a, the abutting end 111b, and the movable end 111c are sequentially arranged along an extending direction of the spring, and the extending direction of the spring is perpendicular to the first direction, that is, parallel to the second direction. The fixed end 111a is connected to the fixing member 1131, and the fixed end 111a is fixed to the insulating body 112 through the fixing member 1131. The abutting end 111b protrudes from a side surface of the insulating body 112 to elastically abut against the information card when the card connector 11 is connected to the information card. The movable end 111c is movably mounted to the insulating body 112, and the movable end 111c can move in a second direction relative to the insulating body 112.

In this embodiment, when the card connector 11 is connected to an information card, the abutting end 111b abuts against the information card, the abutting end 111b moves towards the direction close to the insulating body 112, the movable end 111c moves relative to the insulating body 112, the elastic piece deforms smoothly, and the elastic force of the elastic piece abutting against the information card is moderate, so that the information card can be connected to the card connector 11 smoothly, the risk of damaging the information card due to too large elastic force of the elastic piece can be reduced, and the reliability is improved.

The elastic sheet further comprises a first connecting section 111d and a second connecting section 111e, the first connecting section 111d connects the fixed end 111a and the abutting end 111b, the second connecting section 111e connects the abutting end 111b and the movable end 111c, and the abutting end 111b is convex relative to the first connecting section 111d and the second connecting section 111 e. That is, in the thickness direction (perpendicular to the first and second directions) of the card connector 11, the abutting end 111b is located highest, the first connecting section 111d and the second connecting section 111e are next to each other, and the fixed end 111a and the movable end 111c are located lowest. When the elastic sheet is connected with the information card, the elastic sheet is abutted by the abutting end 111b and electrically connected with the information card, and the first connecting section 111d, the fixed end 111a, the second connecting section 111e and the movable end 111c are not in contact with the information card and form a gap with the information card.

The abutting end 111b may include a protruding abutting contact 111f, and the abutting contact 111f has a certain contact area. When the card connector 11 is connected to the information card, the contact 111f abuts against the gold finger of the information card, so that the card connector 11 is electrically connected to the information card.

For example, the third elastic piece 11c to the eighth elastic piece 11h may be located in six first hollow areas 1121 respectively, the first elastic piece 11a may be located in the same first hollow area 1121 as the third elastic piece 11c, the second elastic piece 11b may be located in the same first hollow area 1121 as the fourth elastic piece 11d, the seventh elastic piece 11g may be located in the same first hollow area 1121 as the ninth elastic piece 11i, and the eighth elastic piece 11h may be located in the same first hollow area 1121 as the tenth elastic piece 11 j.

Each fastener 1131 surrounds or semi-surrounds a corresponding spring. The elastic sheet is separately located in one of the first hollow areas 1121, and the fixing member 1131 corresponding to the elastic sheet completely surrounds the elastic sheet. For example, the fifth elastic piece 11e is separately located in one of the first hollow areas 1121, and the fixing member 1131 connected to the fifth elastic piece 11e completely surrounds the fifth elastic piece 11e. The sixth elastic sheet 11f is separately located in one of the first hollow areas 1121, and the fixing member 1131 connected to the sixth elastic sheet 11f completely surrounds the sixth elastic sheet 11f.

The two elastic pieces sharing the same first hollow region 1121 are provided with two corresponding fixing pieces 1131 in a surrounding trend, and the two corresponding elastic pieces are included together and respectively semi-surround the corresponding elastic pieces. For example, the first elastic piece 11a and the third elastic piece 11c are located in the same first hollow region 1121, the fixing member 1131 connected to the first elastic piece 11a and the fixing member 1131 connected to the third elastic piece 11c surround the first elastic piece 11a and the third elastic piece 11c together, the fixing member 1131 connected to the first elastic piece 11a surrounds the first elastic piece 11a in half, and the fixing member 1131 connected to the third elastic piece 11c surrounds the third elastic piece 11c in half. The seventh elastic piece 11g and the ninth elastic piece 11i are located in the same first hollow region 1121, the fixing member 1131 connected to the seventh elastic piece 11g and the fixing member 1131 connected to the ninth elastic piece 11i surround the seventh elastic piece 11g and the ninth elastic piece 11i together, the fixing member 1131 connected to the seventh elastic piece 11g surrounds the seventh elastic piece 11g in half, and the fixing member 1131 connected to the ninth elastic piece 11i surrounds the ninth elastic piece 11i in half. The relationship between the second elastic piece 11b and the fourth elastic piece 11d and the corresponding fixing element 1131, and the relationship between the eighth elastic piece 11h and the tenth elastic piece 11j and the corresponding fixing element 1131 refer to the above description, and are not described herein again.

Referring to fig. 6 and 8 in combination, fig. 8 is a schematic view of the internal structure of the card connector 11 shown in fig. 6 at a position a. Fig. 8 shows a connection structure between the movable end 111c of the elastic piece and the insulating body 112. In fig. 6, the tenth elastic piece 11j is taken as an example for reference.

In some embodiments, the insulating body 112 further includes a communication hole 1124, and the communication hole 1124 communicates the adjacent first and second

hollow regions

1121 and 1122. The movable end 111c of the spring plate is inserted into the communication hole 1124, the end of the movable end 111c includes a stop block 1111, and the stop block 1111 cooperates with the insulation body 112 to form an anti-falling structure. In this embodiment, the anti-separation structure can effectively prevent the movable end 111c of the elastic sheet from separating from the insulating body 112, so as to improve the connection reliability between the elastic sheet and the insulating body 112, and the reliability of the card connector 11 is high.

Illustratively, the fixed end 111a and the abutting end 111b of the elastic sheet are located in the first hollow region 1121, the movable end 111c of the elastic sheet is inserted into the communication hole 1124 and extends to the second hollow region 1122 through the communication hole 1124, and the stop block 1111 is at least partially located in the second hollow region 1122. The width of the communication hole 1124 in the clamping direction is smaller than the width of the stop block 1111 in the clamping direction, the clamping direction can be any one direction, the size of the communication hole 1124 in a certain direction is smaller than the size of the stop block 1111 in the same direction, that is, the stop block 1111 and the insulation body 112 are matched to form an anti-falling structure, so that the stop block 1111 is prevented from penetrating through the communication hole 1124 to cause the movable end 111c of the elastic sheet to be separated from the insulation body 112. For example, in a direction perpendicular to the extending direction of the spring plate, that is, in the first direction, the width of the stopper 1111 is larger than the width of the communication hole 1124. It is to be understood that the shape and size of the communication hole 1124 and the shape and size of the stopper 1111 are not strictly limited in the embodiments of the present application.

Referring to fig. 6 and 7 again, in some embodiments, each conductive block of the conductive body 113 further includes a solder tail 1132 (part of the solder tail 1132 is labeled for brevity), the solder tail 1132 is fixedly connected to the fixing member 1131, and the solder tail 1132 is used for being soldered to the circuit board 50 (see fig. 1), so that the card connector 11 is fixedly connected to the circuit board 50, and the elastic sheet is electrically connected to the circuit board 50. Wherein the number of the solder tails 1132 in each conductive block is at least one.

Illustratively, the at least one solder 1132 of each conductive block includes a first solder 1133, and the first solder 1133 is disposed near the fixed end 111a of the spring. That is, the first solder tail 1133 is connected to the end of the fixing member 1131 close to the fixed end 111a of the elastic piece. During the insertion of the information card, a friction force is generated between the information card and the abutting end 111b of the elastic piece, the elastic piece tends to move in the insertion direction (i.e. the second direction), and the fixed end 111a of the elastic piece is pulled. The conducting block is through setting up the first leg 1133 that is close to the stiff end 111a of shell fragment, and first leg 1133 welds circuit board 50 for atress on the shell fragment is transmitted to circuit board 50 by first leg 1133, and the mounting 1131 of conducting block is difficult for taking place to warp, and the mounting 1131 is stable with insulator 112's relation of connection, is favorable to improving card connector 11 and card seat subassembly 10's reliability. It will be appreciated that first solder tail 1133 is also capable of transferring stress during the card removal process of the information card.

The at least one solder foot 1132 of the partial conductive block may further include a second solder foot 1134, where the second solder foot 1134 is disposed near the movable end 111c of the elastic piece. That is, the second solder tail 1134 is connected to the end of the fixing member 1131 close to the movable end 111c of the elastic piece. In the process of pulling out the information card, a friction force is generated between the information card and the abutting end 111b of the elastic sheet, the elastic sheet has a tendency of moving along the card pulling direction (i.e. the direction opposite to the second direction), the moving end 111c of the elastic sheet generates a pulling force on the insulating body 112 through the anti-falling structure, the conductive block is provided with a second solder foot 1134 close to the moving end 111c of the elastic sheet, the second solder foot 1134 is welded to the circuit board 50, so that the stress on the insulating body 112 is transmitted to the circuit board 50 from the second solder foot 1134, the fixing member 1131 of the conductive block is not easily deformed, the connection relationship between the fixing member 1131 and the insulating body 112 is stable, and the improvement of the reliability of the card connector 11 and the card holder assembly 10 is facilitated. It will be appreciated that first solder tail 1133 is also capable of transferring stress during the card removal process of the information card. Both first and

second solder fillets

1133 and 1134 are capable of transferring stress during insertion of an information card.

In other embodiments, the solder 1132 of the conductive block may also be connected to other positions of the fixing member 1131, such as connecting the middle portion of the fixing member 1131, which is not limited in this embodiment.

For example, a portion of the plurality of solder legs 1132 of the conductive body 113 may be located in the first hollow region 1121, and a portion of the solder legs 1132 may be located in the third hollow region 1123, and the arrangement position may refer to fig. 6. In other embodiments, the plurality of solder legs 1132 of the conductive body 113 may have other arrangements, for example, the plurality of solder legs 1132 of the conductive body 113 are all located in the first hollow-out region 1121, and the insulating body 112 may not be provided with the third hollow-out region 1123, which is not strictly limited in this embodiment of the present disclosure.

Referring to fig. 9, fig. 9 is a second schematic structural view of the card connector 11 shown in fig. 5 at another angle.

In some embodiments, the center-to-center distance S2 between the second row of resilient sheets (11 c, 11 d) and the third row of resilient sheets (11 e, 11 f) is greater than the center-to-center distance S1 between the first row of resilient sheets (11 a, 11 b) and the second row of resilient sheets (11 c, 11 d), and greater than the center-to-center distance S4 between the fourth row of resilient sheets (11 g, 11 h) and the fifth row of resilient sheets (11 i, 11 j). The center-to-center distance S3 between the third row of elastic sheets (11 e, 11 f) and the fourth row of elastic sheets (11 g, 11 h) is larger than the center-to-center distance S1 between the first row of elastic sheets (11 a, 11 b) and the second row of elastic sheets (11 c, 11 d), and is larger than the center-to-center distance S4 between the fourth row of elastic sheets (11 g, 11 h) and the fifth row of elastic sheets (11 i, 11 j). That is, the center-to-center distance S2 between the second row of elastic sheets (11 c, 11 d) and the third row of elastic sheets (11 e, 11 f), the center-to-center distance S3 between the third row of elastic sheets (11 e, 11 f) and the fourth row of elastic sheets (11 g, 11 h) are larger, the center-to-center distance S1 between the first row of elastic sheets (11 a, 11 b) and the second row of elastic sheets (11 c, 11 d), and the center-to-center distance S4 between the fourth row of elastic sheets (11 g, 11 h) and the fifth row of elastic sheets (11 i, 11 j) are smaller.

When two elastic sheets in the same row are aligned, the center distance between the two rows of elastic sheets is the center distance between the two elastic sheets in the same column; the center-to-center distance between the two spring pieces is a distance between center points of portions (for example, the contact points 111 f) of the two spring pieces for abutting against the information card in the first direction. When the two elastic sheets in the same row are slightly staggered in the second direction, the center distance between the two elastic sheets in the two rows is the average value of the center distance between the two elastic sheets in the first row of elastic sheets and the center distance between the two elastic sheets in the second row of elastic sheets.

As shown in fig. 9, the center distance between the third elastic piece 11c and the fifth elastic piece 11e is greater than the center distance between the first elastic piece 11a and the third elastic piece 11c and the center distance between the seventh elastic piece 11g and the ninth elastic piece 11 i; the center distance between the fifth elastic piece 11e and the seventh elastic piece 11g is larger than the center distance between the first elastic piece 11a and the third elastic piece 11c and the center distance between the seventh elastic piece 11g and the ninth elastic piece 11 i; the center distance between the fourth elastic piece 11d and the sixth elastic piece 11f is larger than the center distance between the second elastic piece 11b and the fourth elastic piece 11d and the center distance between the eighth elastic piece 11h and the tenth elastic piece 11 j; the center distance between the sixth elastic piece 11f and the eighth elastic piece 11h is greater than the center distance between the second elastic piece 11b and the fourth elastic piece 11d and the center distance between the eighth elastic piece 11h and the tenth elastic piece 11 j.

Exemplarily, the center-to-center distance S2 between the second row of spring pieces (11 c, 11 d) and the third row of spring pieces (11 e, 11 f) may be in a range of 1.0mm to 3.0mm, for example, may be in a range of 1.5mm to 2.8mm, for example, may be 2.48mm, 2.54mm, 2.59mm, 2.63mm, and the like; and/or the centre-to-centre spacing S3 between the third row of domes (11 e, 11 f) and the fourth row of domes (11 g, 11 h) may be in the range 1.0mm to 3.0mm, for example may be in the range 1.5mm to 2.8mm, for example may be 2.48mm, 2.54mm, 2.59mm, 2.63mm, etc.; and/or the center-to-center distance S1 between the first row of spring pieces (11 a, 11 b) and the second row of spring pieces (11 c, 11 d) may be in the range of 1.0mm to 1.7mm, for example, 1.03mm, 1.07mm, 1.12mm, etc.; and/or the center-to-center distance S4 between the fourth row of elastic sheets (11 g, 11 h) and the fifth row of elastic sheets (11 i, 11 j) can be in the range of 1.0mm to 1.7mm, such as 1.32mm, 1.37mm, 1.41mm and the like.

The center distance S2 between the second row of elastic sheets (11 c, 11 d) and the third row of elastic sheets (11 e, 11 f) and the center distance S3 between the third row of elastic sheets (11 e, 11 f) and the fourth row of elastic sheets (11 g, 11 h) may be equal or unequal, which is not strictly limited in the embodiments of the present application. The center distances between two corresponding spring plates in two adjacent rows of spring plates may be equal or unequal, and this is not strictly limited in the embodiments of the present application. For example, in the first row of elastic sheets (11 a, 11 b) and the second row of elastic sheets (11 c, 11 d), the center distance between the first elastic sheet 11a and the third elastic sheet 11c and the center distance between the second elastic sheet 11b and the fourth elastic sheet 11d may be equal or unequal.

In this application embodiment, through the mode of arranging and the centre-to-centre spacing that sets up a plurality of shell fragments for a plurality of shell fragments can form multiple combination, and shell fragment quantity and position in the multiple combination can with the golden finger quantity and the position looks adaptation of multiple type information card, make card connector 11 can realize the communication with the information card of different grade type, realize that many cards are compatible, and expansibility is better. Therefore, when the card connector 11 is applied to the card holder assembly 10 of the electronic device 100, the electronic device 100 can adapt to multiple types of information cards through the same card holder assembly 10, so that the number of the card holder assemblies 10 is reduced, the occupation of the internal space of the electronic device 100 is reduced, and the electronic device 100 is light and thin.

In some embodiments, the card connector 11 can communicate with a Nano SIM card having six gold fingers (also referred to as terminals, ports, metal contacts, etc.) and also with a two-in-one card having at least ten gold fingers to be compatible with the Nano SIM card and the two-in-one card. The size of the card body of the two-in-one card is the same as that of the Nano SIM card. In the present application, the same size of the card bodies of the two information cards may mean that the size of the card bodies of the two information cards is the same, or the size of the card bodies of the two information cards is very similar, and both the two information cards can be stably placed in the same mounting groove of the card holder 2 of the card seat assembly 10.

In other embodiments, the card connector 11 can communicate with a Nano SIM card with six gold fingers, a two-in-one card with at least ten gold fingers, and a first NM card with eight gold fingers, so as to be compatible with the Nano SIM card, the two-in-one card, and the first NM card.

In other embodiments, the card connector 11 can communicate with a Nano SIM card with six gold fingers, a two-in-one card with at least ten gold fingers, and a second NM card with ten gold fingers or eight gold fingers or other numbers of gold fingers, so as to be compatible with the Nano SIM card, the two-in-one card, and the second NM card. Wherein the size of the second NM card body is the same as the size of the Nano SIM card body. The first NM card is the first generation NM card, the second NM card is the second generation NM card, the transmission rate of the second NM card is larger than that of the first NM card. The size of the body of the first NM card may be the same as the size of the body of the Nano SIM card.

In other embodiments, the card connector 11 may also be compatible with the first NM card and/or the second NM card when compatible with the Nano SIM card and the two-in-one card, which is not strictly limited in this embodiment of the present application.

The present application provides a Nano SIM card, which can be adapted to the card connector 11, and the structure of the Nano SIM card and the connection structure of the Nano SIM card and the card connector 11 will be exemplified below.

Referring to fig. 10 to 12 in combination, fig. 10 is a schematic block diagram of a Nano SIM card 3 according to an embodiment of the present disclosure, fig. 11 is a schematic structural diagram of the Nano SIM card 3 shown in fig. 10 in some embodiments, and fig. 12 is a schematic structural diagram of the Nano SIM card 3 shown in fig. 11 when connected with the card connector 11 shown in fig. 5.

In some embodiments, as shown in fig. 10 and 11, the Nano SIM card 3 may include a card body 31 and a card interface 32. The card body 31 includes a package 311, and a control circuit 312 and a SIM circuit 313 provided in the package 311. The card interface 32 is fixed to the card body 31 and exposed relative to the card body 31, and the card interface 32 is electrically connected to the control circuit 312. The package 311 is used to package the control circuit 312, the SIM circuit 313 and electrical connection lines between the control circuit 312 and the SIM circuit 313 and the card interface 32 for protection. The package 311 is made of a dielectric material, which includes but is not limited to ethylene-vinyl acetate (EVA), polyvinyl butyral (PVB), ionomer, polyolefin (PO), silicon, thermoplastic polyurethane, and the like.

The Nano SIM card 3 has a length direction, a width direction and a thickness direction which are perpendicular to each other, the maximum size of the card body 31 of the Nano SIM card 3 in the length direction is the length thereof, the maximum size in the width direction is the width thereof, and the maximum size in the thickness direction is the thickness thereof. The dimensions of the card body 31 of the Nano SIM card 3 are length 12.30mm, width 8.80mm, thickness 0.67mm. In the embodiment of the present application, the size of the card body of the information card is the size of the outer contour of the package of the card body.

The card interface 32 of the Nano SIM card 3 in fig. 11 is arranged upward; the view angle of the Nano SIM card 3 in fig. 12 is turned over from top to bottom relative to the view angle of the Nano SIM card 3 in fig. 11, the card interface 32 of the Nano SIM card 3 in fig. 12 is disposed downward, and the card connector 11 is located below the Nano SIM card 3.

In some embodiments, the card body 31 of the Nano SIM card 3 includes a first side 3111, a second side 3112, a third side 3113 and a fourth side 3114, the first side 3111 and the third side 3113 are disposed opposite to each other and extend along the length direction of the Nano SIM card 3, and the second side 3112 and the fourth side 3114 are disposed opposite to each other and extend along the width direction of the Nano SIM card 3. The distance between the second side 3112 and the fourth side 3114 is greater than the distance between the first side 3111 and the third side 3113. In other words, the first side 3111 and the third side 3113 are long sides, and the second side 3112 and the fourth side 3114 are short sides. Here, the first side 3111 and the third side 3113 may be disposed in parallel or approximately in parallel, and the second side 3112 and the fourth side 3114 may be disposed in parallel or approximately in parallel.

One corner of the card body 31 of the Nano SIM card 3 is a corner cut, and the corner cut is disposed between the first edge 3111 and the second edge 3112. The cut angle forms a cut edge 3115, and the cut edge 3115 forms an obtuse angle with the first edge 3111 and an obtuse angle with the second edge 3112. An arc transition structure or a chamfer transition structure may be disposed between adjacent sides (including the first side 3111, the second side 3112, the third side 3113, the fourth side 3114 and the cut edge 3115) of the card body 31 of the Nano SIM card 3. In other embodiments, the card body 31 of the Nano SIM card 3 may not be provided with the above-mentioned chamfer, and the present application is not limited thereto.

Illustratively, the card interface 32 of the Nano SIM card 3 includes at least six gold fingers, for example, a first gold finger 321, a second gold finger 322, a third gold finger 323, a fourth gold finger 324, a fifth gold finger 325 and a sixth gold finger 326 arranged in an array. The first gold finger 321 is closer to the cut edge 3115 of the card body 31 of the Nano SIM card 3 than the other gold fingers.

When the Nano SIM card 3 is installed on the card holder 2, the Nano SIM card 3 is inserted into the card holder assembly 10, and the Nano SIM card 3 is connected to the card connector 11, ten elastic pieces of the card connector 11 all support against the Nano SIM card 3, wherein the third elastic piece 11c to the eighth elastic piece 11h (i.e. the second row of elastic pieces to the fourth row of elastic pieces) of the card connector 11 support against and electrically connect the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 one-to-one, so as to electrically connect the Nano SIM card 3. In the embodiment of the present application, when the elastic sheet of the card connector 11 abuts against the gold finger of the information card, the two can be electrically connected.

In this embodiment, the card connector 11 arranges the third elastic sheet 11c to the eighth elastic sheet 11h in two rows and three rows, the third elastic sheet 11c to the eighth elastic sheet 11h can correspondingly abut against the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3, and the card connector 11 can be electrically connected with the Nano SIM card 3 to realize communication.

With reference to fig. 9 and 12, the center distance between the second row of elastic sheets (11 c, 11 d) and the third row of elastic sheets (11 e, 11 f) and the center distance between the third row of elastic sheets (11 e, 11 f) and the fourth row of elastic sheets (11 g, 11 h) are set within the range of 1.5mm to 2.8mm, so that the electronic device 100 can communicate with the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 through the third elastic sheets 11c to the eighth elastic sheets 11h, and the risk of short circuit between the gold fingers of the Nano SIM card 3 can be effectively reduced, and the electrical connection relationship between the card connector 11 and the Nano SIM card 3 is reliable.

It can be understood that the shapes and sizes of the golden fingers of the Nano SIM cards 3 of different countries and different operators may be different, so as to form different golden finger arrangements. For example, the Nano SIM card 3 shown in fig. 11 is one of the gold finger arrangements defined for compliance with the specification. The card connector 11 and the card holder assembly 10 in the embodiment of the present application can be compatible with Nano SIM cards 3 of different countries and different operators.

When the Nano SIM card 3 is connected to the card connector 11, the first row of elastic sheets (11 a, 11 b) and the fifth row of elastic sheets (11 i, 11 j) of the card connector 11 abut against the Nano SIM card 3. In some embodiments, as shown in fig. 11 and 12, when the Nano SIM card 3 is connected to the card connector 11, the first elastic piece 11a and the third elastic piece 11c may abut against and electrically connect to the first gold finger 321 of the Nano SIM card 3, the second elastic piece 11b and the fourth elastic piece 11d may abut against and electrically connect to the second gold finger 322 of the Nano SIM card 3, the seventh elastic piece 11g and the ninth elastic piece 11i may abut against and electrically connect to the fifth gold finger 325 of the Nano SIM card 3, and the eighth elastic piece 11h and the tenth elastic piece 11j may abut against and electrically connect to the sixth gold finger 326 of the Nano SIM card 3. Wherein, two shrapnels abutting against the same golden finger can be conducted through the golden finger.

In other embodiments, the plurality of gold fingers of the card interface 32 of the Nano SIM card 3 may have an arrangement different from that shown in fig. 11, when the Nano SIM card 3 is connected to the card connector 11, the first row of elastic pieces (11 a, 11 b) and the fifth row of elastic pieces (11 i, 11 j) of the card connector 11 abut against the card body 31 of the Nano SIM card 3; or, the first elastic piece 11a and the third elastic piece 11c of the card connector 11 may abut against and electrically connect to the first gold finger 321 of the Nano SIM card 3, the second elastic piece 11b and the fourth elastic piece 11d may abut against and electrically connect to the second gold finger 322 of the Nano SIM card 3, and the fifth row of elastic pieces (11 i, 11 j) of the card connector 11 abuts against the card body 31 of the Nano SIM card 3; or, the seventh elastic piece 11g and the ninth elastic piece 11i may abut against and electrically connect to the fifth finger 325 of the Nano SIM card 3, the eighth elastic piece 11h and the tenth elastic piece 11j may abut against and electrically connect to the sixth finger 326 of the Nano SIM card 3, and the first row of elastic pieces (11 a, 11 b) of the card connector 11 abuts against the card body 31 of the Nano SIM card 3. When the first row of elastic sheets (11 a, 11 b) and/or the fifth row of elastic sheets (11 i, 11 j) of the card connector 11 abut against the card body 31 of the Nano SIM card 3, the first row of elastic sheets (11 a, 11 b) and/or the fifth row of elastic sheets (11 i, 11 j) are not in contact with the golden finger of the Nano SIM card 3, and no electrical connection relationship exists between the first row of elastic sheets (11 a, 11 b) and/or the fifth row of elastic sheets. The embodiment of the present application does not strictly limit the specific connection structure between the first row of resilient tabs (11 a, 11 b) and the fifth row of resilient tabs (11 i, 11 j) of the card connector 11 and the Nano SIM card 3.

For example, six gold fingers of the Nano SIM card 3 may be used to transmit a DATA signal (DATA), a clock signal (CLK), a programming voltage/input signal (VPP), a Reset Signal (RST), a ground signal (GND), and a power signal (VCC), respectively. Wherein, the DATA signal (DATA), also called I/O signal, is used to realize DATA transmission communication; the programming voltage/input signal (VPP) is used to program the Nano SIM card 3, and may also be used to communicate on a Near Field Communication (NFC) enabled card.

As shown in table 1 below, table 1 is a table of correspondence between a plurality of elastic pieces of the card connector 11 and a plurality of gold fingers of the Nano SIM card 3 and their transmission signals. Illustratively, the third elastic piece 11c of the card connector 11 is electrically connected to the first golden finger 321 of the Nano SIM card 3, and the first golden finger 321 is used for transmitting DATA signals (DATA); the fourth elastic sheet 11d is electrically connected with the second golden finger 322 of the Nano SIM card 3, and the second golden finger 322 is used for transmitting a clock signal (CLK); the fifth elastic sheet 11e is electrically connected with a third golden finger 323 of the Nano SIM card 3, and the third golden finger 323 is used for programming a voltage/input signal (VPP); the sixth elastic piece 11f is electrically connected to the fourth gold finger 324 of the Nano SIM card 3, and the fourth gold finger 324 is used for transmitting a Reset Signal (RST); the seventh elastic sheet 11g is electrically connected with a fifth finger 325 of the Nano SIM card 3, and the fifth finger 325 is used for transmitting a ground signal (GND); the eighth elastic piece 11h is electrically connected to the sixth golden finger 326 of the Nano SIM card 3, and the sixth golden finger 326 is used for transmitting a power supply signal (VCC).

TABLE 1

In other embodiments, the six gold fingers of the Nano SIM card 3 may have other corresponding relationships with the six signals, and the six gold fingers of the Nano SIM card 3 may also be used to transmit other combined signals, for example, the Nano SIM card 3 may not transmit a programming voltage/input signal (VPP), the third gold finger 323 is set in a floating manner, and correspondingly, the fifth elastic piece 11e corresponding to the third gold finger 323 may not provide the programming voltage/input signal (VPP). The examples of the present application are not limited thereto. In the embodiment of the present application, the gold finger is suspended, that is, the gold finger is not used for transmitting signals and is not used for providing a signal port for the information card.

The present application provides a first NM card that can be fitted to the card connector 11, and the structure of the first NM card and the connection structure of the first NM card and the card connector 11 will be exemplified below.

Referring to fig. 13, 14 and 15 in combination, fig. 13 is a schematic block diagram of a first NM card 4 according to an embodiment of the present disclosure, fig. 14 is a schematic structural diagram of the first NM card 4 shown in fig. 13 in some embodiments, and fig. 15 is a schematic structural diagram of the first NM card 4 shown in fig. 14 when connected with the card connector 11 shown in fig. 5.

In some embodiments, as shown in fig. 13 and 14, the first NM card 4 includes a card body 41 and a card interface 42. The card body 41 includes a package 411, and a control circuit 412 and a storage circuit 413 provided in the package 411. The card interface 42 is fixed to the card body 41 and exposed relative to the card body 41, and the card interface 42 is electrically connected to the control circuit 412. The package 411 is used to package the control circuit 412, the storage circuit 413, and the electrical connection lines between the control circuit 412, the storage circuit 413 and the card interface 42 for protection. The package 411 is made of a dielectric material, which includes but is not limited to ethylene-vinyl acetate (EVA), polyvinyl butyral (PVB), ionomer, polyolefin (PO), silicon, thermoplastic polyurethane, and the like.

Therein, the size of the card body 41 of the first NM card 4 may be the same as the size of the card body 31 of the Nano SIM card 3. The first NM card 4 has a length direction, a width direction, and a thickness direction perpendicular to each other, and the maximum dimension of the card body 41 of the first NM card 4 in the length direction is the length thereof, the maximum dimension in the width direction is the width thereof, and the maximum dimension in the thickness direction is the thickness thereof. For example, the size of the card body 41 of the first NM card 4 may be 12.30mm in length, 8.80mm in width, and 0.67mm in thickness.

Wherein the card interface 42 of the first NM card 4 in fig. 14 is disposed upward; the first NM card 4 in fig. 15 is positioned at a viewing angle that is turned upside down with respect to the first NM card 4 in fig. 14, the card interface 42 of the first NM card 4 in fig. 15 is positioned downward, and the card connector 11 is positioned below the first NM card 4.

In some embodiments, the card body 41 of the first NM card 4 includes a first side 4111, a second side 4112, a third side 4113, and a fourth side 4114, wherein the first side 4111 and the third side 4113 are disposed opposite to each other and extend along a length direction of the first NM card 4, and the second side 4112 and the fourth side 4114 are disposed opposite to each other and extend along a width direction of the first NM card 4. The distance between the second side 4112 and the fourth side 4114 is greater than the distance between the first side 4111 and the third side 4113. In other words, the first side 4111 and the third side 4113 are long sides, and the second side 4112 and the fourth side 4114 are short sides. In this case, the first side 4111 and the third side 4113 may be disposed in parallel or approximately in parallel, and the second side 4112 and the fourth side 4114 may be disposed in parallel or approximately in parallel.

One corner of the card body 41 of the first NM card 4 is a tangent corner, and the tangent corner is disposed between the first edge 4111 and the second edge 4112. The cut angle forms a cut edge 4115, and cut edge 4115 forms an obtuse angle with first edge 4111 and an obtuse angle with second edge 4112. An arc transition structure or a chamfer transition structure may be disposed between adjacent sides (including the first side 4111, the second side 4112, the third side 4113, the fourth side 4114, and the trimming side 4115) of the card body 41 of the first NM card 4. In other embodiments, the card body 41 of the first NM card 4 may not be provided with the above-mentioned chamfer, and the present application is not limited thereto. Here, when the size of the corner cut of the card body 41 of the first NM card 4 is the same as or different from the size of the corner cut of the card body 31 of the Nano SIM card 3, and when the two are different, the size of the card body 41 of the first NM card 4 is considered to be the same as the size of the card body 31 of the Nano SIM card 3.

Illustratively, the card interface 42 of the first NM card 4 includes at least eight gold fingers, for example, the first gold finger 421, the second gold finger 422, the third gold finger 423, the fourth gold finger 424, the fifth gold finger 425, the sixth gold finger 426, the seventh gold finger 427, and the eighth gold finger 428 may be arranged in an array. The first gold finger 421 is closer to the trimming edge 4115 of the card body 41 than the other gold fingers.

When the first NM card 4 is mounted on the card holder 2, the first NM card 4 is inserted into the card holder assembly 10, and the first NM card 4 is connected to the card connector 11, the ten spring pieces of the card connector 11 all support against the first NM card 4, wherein the third to tenth spring pieces 11c to 11j (i.e., the second to fourth row of spring pieces) of the card connector 11 support against the first to eighth gold fingers 421 to 428 of the first NM card 4 in a one-to-one correspondence manner to electrically connect the first NM card 4.

In this embodiment, the card connector 11 arranges the third elastic sheet 11c to the tenth elastic sheet 11j into two rows and two columns, and the center distance between the fourth row of elastic sheets (11 g, 11 h) and the fifth row of elastic sheets (11 i, 11 j) is smaller than the center distance between the second row of elastic sheets (11 c, 11 d) and the third row of elastic sheets (11 e, 11 f) and the center distance between the third row of elastic sheets (11 e, 11 f) and the fourth row of elastic sheets (11 g, 11 h), so that the third elastic sheet 11c to the eighth elastic sheet 11h of the card connector 11 can be electrically connected with six golden fingers of the Nano SIM card 3 in a one-to-one correspondence manner, and the third elastic sheet 11c to the tenth elastic sheet 11j can be electrically connected with eight golden fingers of the first NM card 4 in a one-to-one correspondence manner, so that the card connector 11 can be compatible with the Nano SIM card 3 and the first NM card 4.

With reference to fig. 9, 12 and 15, because the number of the Nano SIM card 3 and the first NM card 4 is different, the shapes of the golden fingers are different, the sizes of the golden fingers are different, the arrangement positions of the golden fingers and the spacing distance between the golden fingers are also different, the center distance between the second row of the elastic pieces (11 c, 11 d) and the third row of the elastic pieces (11 e, 11 f), and the center distance between the third row of the elastic pieces (11 e, 11 f) and the fourth row of the elastic pieces (11 g, 11 h) are set in the range of 1.5mm to 2.8mm, the center distance between the fourth row of the elastic pieces (11 g, 11 h) and the fifth row of the elastic pieces (11 i, 11 j) is set in the range of 1.0mm to 1.7mm, so that the third elastic piece 11c to the eighth elastic piece 11h can respectively communicate with six golden fingers of the Nano SIM card 3, and the third elastic piece 11c to the tenth elastic piece (11 j) can respectively communicate with the first NM 4, the NM 4 and the NM 4 can respectively communicate with the first NM 4, and the third elastic piece, and the third elastic pieces can be electrically connected to the Nano SIM card, and the first card, when the first card are electrically connected, and the first card, the first and the third elastic pieces, the third elastic pieces can be electrically connected to the first card, and the third elastic pieces, which are electrically.

Although the seventh gold finger 427 and the eighth gold finger 428 of the first NM card 4 are L-shaped as shown in fig. 15, since the elastic sheet of the card connector 11 is abutted to the gold finger of the information card through the abutting contact thereof, and gaps are formed between the rest of the elastic sheet and the gold finger, the ninth elastic sheet 11i is electrically connected to the seventh gold finger 427, the seventh elastic sheet 11g is not in contact with the seventh gold finger 427, and there is no electrical connection therebetween, the tenth elastic sheet 11j is electrically connected to the eighth gold finger 428, and the eighth elastic sheet 11h is not in contact with the eighth gold finger 428, and there is no electrical connection therebetween.

When the first NM card 4 is connected to the card connector 11, the first row of spring pieces (11 a, 11 b) of the card connector 11 abuts against the first NM card 4. In some embodiments, the first elastic piece 11a and the third elastic piece 11c abut against and are electrically connected to the first gold finger 421 of the first NM card 4, and the second elastic piece 11b and the fourth elastic piece 11d abut against and are electrically connected to the second gold finger 422 of the first NM card 4; in other embodiments, the first row of spring pieces (11 a, 11 b) abuts against the card body 41 of the first NM card 4, and at this time, there is no electrical connection between the first row of spring pieces (11 a, 11 b) and the first NM card 4. The embodiment of the present application does not strictly limit the specific connection structure between the first row of resilient pieces (11 a, 11 b) of the card connector 11 and the first NM card 4.

Illustratively, the first NM card 4 may employ an Embedded Multimedia Memory Card (EMMC) interface protocol. Of the eight fingers of the first NM card 4, there may be four fingers for transmitting DATA signals (DATA 0, DATA1, DATA2, DATA 3), one for transmitting a clock signal (CLK), one for transmitting command and response signals (CMD), one for transmitting a ground signal (GND), and one for transmitting a power signal (VCC). Wherein the DATA signals (DATA 0, DATA1, DATA2, DATA 3) are used to enable DATA transmission communication. The command and response signal (CMD) may issue a command from the external device to the memory card, or be a response for the memory card to a command from the external device.

As shown in table 2 below, table 2 is a table of correspondence between a plurality of resilient sheets of the card connector 11, a plurality of gold fingers of the Nano SIM card 3 and the first NM card 4, and their transmission signals. When the first NM card 4 is connected to the card connector 11, the third to tenth resilient sheets 11c to 11j of the card connector 11 correspondingly abut against and electrically connect the first to eighth gold fingers 421 to 428 of the first NM card 4. In the present application, if two gold fingers on two information cards abut against and are electrically connected to the same elastic piece when connected to the card connector 11 of the electronic device 100, the two gold fingers are considered to correspond in position. For example, the first gold finger 421 to the sixth gold finger 426 of the first NM card 4 correspond to the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 in a one-to-one correspondence. When the two golden fingers of the two information cards correspond to each other in position, the shapes, sizes and specific positions of the two golden fingers on the card body of the information card may be the same or different, and this is not strictly limited in the embodiments of the present application.

Illustratively, the first gold finger 421, the fourth gold finger 424, the seventh gold finger 427, and the eighth gold finger 428 of the first NM card 4 may be used to transmit data signals; for example, the first gold finger 421 is used to transmit a DATA signal (DATA 1), the fourth gold finger 424 is used to transmit a DATA signal (DATA 0), the seventh gold finger 427 is used to transmit a DATA signal (DATA 3), and the eighth gold finger 428 is used to transmit a DATA signal (DATA 2), and the signals transmitted by the first gold finger 421, the fourth gold finger 424, the seventh gold finger 427, and the eighth gold finger 428 may be exchanged with each other in other embodiments, which is not described herein again. The second gold finger 422 of the first NM card 4 is used to transmit a clock signal (CLK), the third gold finger 423 is used to transmit a command and response signal (CMD), the fifth gold finger 425 is used to transmit a ground signal (GND), and the sixth gold finger 426 is used to transmit a power supply signal (VCC).

TABLE 2

In other embodiments, the eight gold fingers of the first NM card 4 may have other corresponding relations with the eight signals, and the eight gold fingers of the first NM card 4 may also be used to transmit other combined signals, which is not limited in this embodiment of the present application.

For example, the first gold finger 421, the fourth gold finger 424, and the eighth gold finger 428 of the first NM card 4 may be electrically connected to a high voltage resistant circuit or a protection switch, so as to prevent the circuit of the first NM card 4 from being burned out when the third elastic sheet 11c to the fifth elastic sheet 11e and the eighth elastic sheet 11h provide high voltage. Wherein the high voltage tolerant circuits or protection switches are located within the package 411 of the first NM card 4. In other embodiments, this may be achieved by providing high impedance protection circuitry within the electronic device, such as by adding protection circuitry within the interface controller.

The application also provides a two-in-one card, the two-in-one card integrates an SIM card circuit and a memory card circuit, and the SIM card circuit and the memory card circuit realize the communication with external equipment such as electronic equipment through ten golden fingers so as to compatibly realize the functions of conversation, data communication, data storage and the like.

Referring to fig. 16, 17 and 18 in combination, fig. 16 is a schematic block diagram of a two-in-one card 7 according to an embodiment of the present disclosure, fig. 17 is a schematic structural diagram of the two-in-one card 7 shown in fig. 16 in some embodiments, and fig. 18 is a schematic structural diagram of the two-in-one card 7 shown in fig. 17 when connected with the card connector shown in fig. 5.

In some embodiments, as shown in fig. 16 and 17, the two-in-one card 7 includes a card body 71 and a card interface 72. The card body 71 includes a package 711, and a memory card circuit 712 and a SIM card circuit 713 which are provided in the package 711. The card interface 72 is fixed to the card body 71 and exposed with respect to the card body 71, and the card interface 72 electrically connects the memory card circuit 712 and the SIM card circuit 713. The package 711 is used to package the memory card circuit 712, the SIM card circuit 713, and electrical connection lines between the memory card circuit 712 and the SIM card circuit 713 and the card interface 72 for protection. The package 711 is made of a dielectric material, which includes, but is not limited to, ethylene-vinyl acetate (EVA), polyvinyl butyral (PVB), ionomer, polyolefin (PO), silicon, thermoplastic polyurethane, and the like.

The memory card circuit 712 may employ an Embedded Multimedia Memory Card (EMMC) interface protocol, a Flash memory Storage (UFS) interface protocol, a Peripheral Component Interconnect Express (PCIE) interface protocol, a Secure Data (SD) interface protocol, and other interface protocols. The memory card circuit 712 may include a control portion electrically connected to the card interface 72 of the two-in-one card 7, and a storage portion electrically connected to the storage portion, the control portion carrying interface protocol contents, the control portion being configured to receive data transmitted from the card interface 72 and perform identification and processing of commands according to the received data, and the storage portion being configured to store data. The SIM card circuit 713 may also include a control portion electrically connected to the card interface 72 of the two-in-one card 7, and a storage portion electrically connected to the SIM portion, where the control portion carries interface protocol contents, the control portion is configured to receive data transmitted from the card interface 72 and perform identification and processing of commands according to the received data, and the SIM portion is configured to store data.

Other circuit portions may be disposed in the card interface 72, the memory card circuit 712 and the SIM card circuit 713, so that the card interface 72 performs a signal transmission process with the memory card circuit 712 and the SIM card circuit 713 being adapted.

The size of the card body 71 of the two-in-one card 7 can be the same as that of the Nano SIM card. The two-in-one card 7 has a length direction, a width direction and a thickness direction which are perpendicular to each other, the maximum size of the card body 71 of the two-in-one card 7 in the length direction is the length thereof, the maximum size in the width direction is the width thereof, and the maximum size in the thickness direction is the thickness thereof. For example, the size of the card body 71 of the two-in-one card 7 may be 12.30mm in length, 8.80mm in width, and 0.67mm in thickness.

Wherein, the card interface 72 of the two-in-one card 7 in fig. 17 is arranged upward; the viewing angle of the two-in-one card 7 in fig. 18 is reversed from the viewing angle of the two-in-one card 7 in fig. 17, the card interface 72 of the two-in-one card 7 in fig. 18 is disposed downward, and the card connector is located below the two-in-one card 7.

In some embodiments, the card body 71 of the two-in-one card 7 includes a first side 7111, a second side 7112, a third side 7113 and a fourth side 7114, the first side 7111 and the third side 7113 are disposed opposite to each other and extend along a length direction of the two-in-one card 7, and the second side 7112 and the fourth side 7114 are disposed opposite to each other and extend along a width direction of the two-in-one card 7. The distance between the second side 7112 and the fourth side 7114 is greater than the distance between the first side 7111 and the third side 7113. In other words, the first side 7111 and the third side 7113 are long sides, and the second side 7112 and the fourth side 7114 are short sides. The first side 7111 and the third side 7113 may be disposed in parallel or approximately in parallel, and the second side 7112 and the fourth side 7114 may be disposed in parallel or approximately in parallel.

One corner of the card body 71 of the two-in-one card 7 is a corner cut, and the corner cut is disposed between the first side 7111 and the second side 7112. The cut angle forms a cut edge 7115, with the cut edge 7115 forming an obtuse angle with the first side 7111 and an obtuse angle with the second side 7112. An arc transition structure or a chamfer transition structure may be disposed between adjacent sides (including the first side 7111, the second side 7112, the third side 7113, the fourth side 7114 and the cut edge 7115) of the card body 71. In other embodiments, the card body 71 of the two-in-one card 7 may not be provided with the above-mentioned chamfer, and the present application is not limited thereto. The size of the corner cut of the card body 71 of the two-in-one card 7 may be the same as or different from the size of the corner cut of the card body 31 of the Nano SIM card 3, and when the two are different, the size of the card body 71 of the two-in-one card 7 is considered to be the same as the size of the card body 31 of the Nano SIM card 3.

Illustratively, the card interface 72 of the two-in-one card 7 includes a plurality of gold fingers exposed on the same side of the card body 71. The number of the gold fingers of the two-in-one card 7 is at least ten, and the plurality of gold fingers may include, for example, a first gold finger 721, a second gold finger 722, a third gold finger 723, a fourth gold finger 724, a fifth gold finger 725, a sixth gold finger 726, a seventh gold finger 727, an eighth gold finger 728, a ninth gold finger 729 and a tenth gold finger 7210. The first gold finger 721, the third gold finger 723, the fifth gold finger 725, the seventh gold finger 727 and the ninth gold finger 729 of the two-in-one card 7 are arranged in a first row of gold fingers along the width direction of the two-in-one card 7, the second gold finger 722, the fourth gold finger 724, the sixth gold finger 726, the eighth gold finger 728 and the tenth gold finger 7210 are arranged in a second row of gold fingers along the width direction of the two-in-one card 7, the first row of gold fingers and the second row of gold fingers are arranged in the length direction of the two-in-one card 7, five gold fingers of the first row of gold fingers (721, 723, 725, 727, 729) are in one-to-one correspondence with five gold fingers of the second row of gold fingers (722, 724, 726, 728, 7210), and are arranged in a row two-by-to-two manner, that is, the ten gold fingers are arranged in the first row (721, 722), the second row of gold fingers (723, 724), the third row of gold fingers (725, 726), the fourth row of gold fingers (727) and the fifth row of gold fingers (729) along the width direction of the two-in the card 7. That is, the first through tenth gold fingers 321 through 7210 are arranged in two rows and five columns.

The first row of golden fingers (721, 723, 725, 727 and 729) is located between the second side 7112 and the second row of golden fingers (722, 724, 726, 728 and 7210), namely the first row of golden fingers (721, 723, 725, 727 and 729) are arranged near the second side 7112, and the second row of golden fingers (722, 724, 726, 728 and 7210) are arranged near the fourth side 7114.

The first gold finger 721 is located between the first edge 7111 and the third gold finger 723, and the second gold finger is located between the first edge 7111 and the fourth gold finger 714. That is, the first row of goldfingers (721, 722) is arranged proximate to the first edge 7111 and the fifth row of goldfingers (729, 7210) is arranged proximate to the third edge 7113.

The first gold finger 721 may have an oblique side to form a right trapezoid, the oblique side of the first gold finger 721 faces the cut edge 7115 of the card body 71, and the distance between the two is greater than or equal to 0.1mm, for example, may be 0.2mm; the second through tenth gold fingers 722 through 7210 may be rectangular. In other embodiments, the first gold finger 721 may also be rectangular.

The center distance between the second row of golden fingers (723, 724) and the third row of golden fingers (725, 726) is larger than the center distance between the first row of golden fingers (721, 722) and the second row of golden fingers (723, 724), and is larger than the center distance between the fourth row of golden fingers (727, 728) and the fifth row of golden fingers (729, 7210). The center distance between the third row of golden fingers (725, 726) and the fourth row of golden fingers (727, 728) is larger than the center distance between the first row of golden fingers (721, 722) and the second row of golden fingers (723, 724), and is larger than the center distance between the fourth row of golden fingers (727, 728) and the fifth row of golden fingers (729, 7210).

For example, the center-to-center spacing between the second row of fingers (723, 724) and the third row of fingers (725, 726) may be in the range of 1.5mm to 2.8mm, the center-to-center spacing between the third row of fingers (725, 726) and the fourth row of fingers (727, 728) may be in the range of 1.5mm to 2.8mm, the center-to-center spacing between the first row of fingers (721, 722) and the second row of fingers (723, 724) may be in the range of 1.0mm to 1.7mm, and the center-to-center spacing between the fourth row of fingers (727, 728) and the fifth row of fingers (729, 7210) may be in the range of 1.0mm to 1.7 mm.

When the two-in-one card 7 is mounted on the card holder 2, the two-in-one card 7 is inserted into the card holder assembly 10, and the two-in-one card 7 is connected to the card connector 11, the width direction of the two-in-one card 7 is parallel to the first direction of the card connector 11, the length direction is parallel to the second direction of the card connector 11, and ten elastic pieces of the card connector 11 all support against the two-in-one card 7. When the two-in-one card 7 is connected to the card connector 11, ten spring pieces of the card connector 11 correspondingly abut against ten gold fingers of the two-in-one card 7 one by one, and the first to tenth spring pieces 11a to 11j correspondingly abut against the first to tenth gold fingers 721 to 7210 of the two-in-one card 7 one by one.

In this embodiment, the first elastic pieces 11a to the tenth elastic pieces 11j of the card connector 11 are arranged in two rows and five rows, and the center distance between the second row of elastic pieces (11 c, 11 d) and the third row of elastic pieces (11 e, 11 f) and the center distance between the third row of elastic pieces (11 e, 11 f) and the fourth row of elastic pieces (11 g, 11 h) are both greater than the center distance between the first row of elastic pieces (11 a, 11 b) and the second row of elastic pieces (11 c, 11 d) and the center distance between the fourth row of elastic pieces (11 g, 11 h) and the fifth row of elastic pieces (11 i, 11 j), so that the third row of elastic pieces 11c to the eighth row of elastic pieces 11h of the card connector 11 can correspondingly abut against and electrically connect the first golden fingers 321 to the sixth golden fingers 326 of the Nano SIM card 3, the third row of the fourth row of elastic pieces 11c to the tenth row of the card connector 11j can correspondingly abut against and electrically connect the first golden fingers NM 4 to the eighth golden fingers 428 of the first golden fingers 721, and the tenth elastic pieces of the card connector 11a, and the third row of the tenth elastic pieces of the second row of the golden fingers 727 and 10 golden cards can correspondingly abut against each other. In other embodiments, the card connector 11 may be designed to be compatible with the Nano SIM card 3 and the two-in-one card 7.

For example, referring to fig. 9, 12, 15 and 18, the center distance between the second row of elastic pieces (11 c, 11 d) and the third row of elastic pieces (11 e, 11 f) of the card connector 11 and the center distance between the third row of elastic pieces (11 e, 11 f) and the fourth row of elastic pieces (11 g, 11 h) are set within the range of 1.5mm to 2.8mm, the center distance between the first row of elastic pieces (11 a, 11 b) and the second row of elastic pieces (11 c, 11 d) is set within the range of 1.0mm to 1.7mm, the center distance between the fourth row of elastic pieces (11 g, 11 h) and the fifth row of elastic pieces (11 i, 11 j) is set within the range of 1.0mm to 1.7mm, so that the third elastic pieces 11c to the eighth elastic pieces 11h can respectively communicate with six golden fingers of the Nano SIM card 3, and the third elastic pieces (11 c) to the tenth elastic pieces can respectively communicate with the first NM 4 and the eighth elastic pieces (11 a) and the tenth elastic pieces can respectively communicate with ten golden fingers of the tenth elastic pieces.

Because the numbers of the golden fingers of the Nano SIM card 3, the first NM card 4 and the two-in-one card 7 are different, the shapes of the golden fingers are different, the arrangement positions of the golden fingers and the spacing distance of the golden fingers are also different, and through the unique design of the spacing distance from the first elastic sheet 11a to the tenth elastic sheet 11j, the card connector 11 can be compatible with the Nano SIM card 3, the first NM card 4 and the two-in-one card 7, the risk that the golden fingers of the Nano SIM card 3 and the elastic sheets of the card connector 11 are short-circuited when the Nano SIM card 3 is arranged on the card connector 11 is effectively reduced, the risk that the golden fingers of the Nano SIM card 3 and the elastic sheets of the card connector 11 are short-circuited when the first NM card 4 is arranged on the card connector 11, and the risk that the golden fingers of the two-in-one card 7 and the elastic sheets of the card connector 11 are short-circuited when the two-in-one card 7 is arranged on the card connector 11, so that the card connector 11 and the Nano card 3, the first NM card 4 and the two-in-one card 7 can share the same time. It is understood that in other embodiments, the card connector 11 may be designed to be compatible with the Nano SIM card 3 and the two-in-one card 7.

In the present application, the card interface of the two-in-one card 7 can be implemented in various ways, and the two-in-one card 7 in the following embodiments can be connected to the card connector 11 shown in fig. 5 by way of example.

Referring to fig. 19, fig. 19 is a size diagram of the two-in-one card 7 of fig. 17 in some embodiments.

In some embodiments, the ten gold fingers of the two-in-one card 7 are arranged in two rows and five rows, the first row of gold fingers (721, 723, 725, 727, 729) is arranged near the second edge 7112, the second row of gold fingers (722, 724, 726, 728, 7210) is arranged near the fourth edge 7114, each row of gold fingers is aligned in the width direction, the first row of gold fingers (721, 722) is arranged near the first edge 7111, the fifth row of gold fingers (729, 7210) is arranged near the third edge 7113, and each row of gold fingers is aligned in the length direction. The first golden finger 721 can be provided with a cut edge to form a right trapezoid, the oblique edge of the first golden finger 721 faces the cut edge 7115 of the card body 71, and the distance between the two can be 0.2mm; the second through tenth gold fingers 722 through 7210 may be rectangular.

Illustratively, the distance between the center of the second row of gold fingers (723, 724) and the first side 7111 may be 1.95mm, the distance between the center of the third row of gold fingers (725, 726) and the first side 7111 may be 4.25mm, the distance between the center of the third row of gold fingers (725, 726) and the third side 7113 may be 4.55mm, and the distance between the center of the fourth row of gold fingers (727, 728) and the third side 7113 may be 1.95mm in the width direction. In the width direction, the distance between the first row of gold fingers (721, 722) and the second row of gold fingers (723, 724) may be 0.25mm, and the distance between the first row of gold fingers (721, 722) and the first edge 7111 may be 0.2mm. In the width direction, the distance between the fourth row of golden fingers (727 and 728) and the fifth row of golden fingers (729 and 7210) can be 0.25mm, and the distance between the fifth row of golden fingers (729 and 7210) and the third edge 7113 can be 0.2mm. In the length direction, the distance between the first row of gold fingers (721, 723, 725, 727, 729) and the second side 7112 may be 1.1mm, and the distance between the second row of gold fingers (722, 724, 726, 728, 7210) and the fourth side 7114 may be 1.1mm.

Wherein, the length of each golden finger can be 3.2mm, and the width can be 1.0mm. The length of the first gold finger 721 is the size of the bottom side thereof, and the width of the first gold finger 721 is the size of the height thereof.

Wherein the tolerance of the shape dimension and the spacing dimension is +/-0.1 mm.

Referring to fig. 20A and 20B in combination, fig. 20A is a size diagram of the two-in-one card 7 shown in fig. 16 in other embodiments, and fig. 20B is another size diagram of the two-in-one card 7 shown in fig. 20A.

In some embodiments, the package 711 of the card body 71 of the two-in-one card 7 includes a first side 7111, a third side 7113, a second side 7112, and a fourth side 7114, where the first side 7111 and the third side 7113 are opposite to each other and are long sides, the second side 7112 and the fourth side 7114 are opposite to each other and are short sides, and a circular arc transition structure or a chamfer transition structure may be disposed between adjacent sides.

Illustratively, the ten gold fingers of the two-in-one card 7 are arranged in two columns, the first column (721, 723, 725, 727, 729) is arranged near the second side 7112, and the second column (722, 724, 726, 728, 7210) is arranged near the fourth side 7114. The first gold fingers 721 to the sixth gold fingers 726 are arranged in two rows and three rows, each row of gold fingers is aligned in the width direction, the first row of gold fingers (721, 722) is arranged near the first edge 7111, and each row of gold fingers is aligned in the length direction. The fourth row of golden fingers (727, 728) are aligned in the length direction. The first golden finger 721 can be provided with a cut edge to form a right trapezoid, the oblique edge of the first golden finger 721 faces the cut edge 7115 of the card body 71, and the distance between the two can be 0.2mm; the second through eighth gold fingers 722 through 728 may be rectangular. Ninth gold finger 729 and tenth gold finger 7210 may be L-shaped. The ninth gold finger 729 semi-surrounds the seventh gold finger 727. Ninth gold finger 729 includes first portion 7291 and second portion, first portion 7291 extending in the length direction and second portion 7292 extending in the width direction. The first section 7291 of the ninth gold finger 729 is located between the seventh gold finger 727 and the third side 7113, and the second section 7292 of the ninth gold finger 729 is connected to the first section 7291 and located between the seventh gold finger 727 and the second side 7112. Tenth gold finger 7210 includes first portion 72101 and second portion 72102, first portion 72101 extending in a length direction and second portion 72102 extending in a width direction. The first section 72101 of the tenth gold finger 7210 is located between the eighth gold finger 728 and the third side 7113 and the second section 72102 of the tenth gold finger 7210 connects the first section 7291 and is located between the eighth gold finger 728 and the second side 7112. As described above, ninth gold finger 729 and tenth gold finger 7210 may be understood as a fifth row of gold fingers (729, 7210).

Illustratively, the distance between the center of the second row of gold fingers (723, 724) and the first side 7111 may be 1.95mm, the distance between the center of the third row of gold fingers (725, 726) and the first side 7111 may be 4.25mm, the distance between the center of the third row of gold fingers (725, 726) and the third side 7113 may be 4.55mm, and the distance between the center of the fourth row of gold fingers (727, 728) and the third side 7113 may be 1.95mm in the width direction. In the width direction, the distance between the first row of gold fingers (721, 722) and the second row of gold fingers (723, 724) may be 0.25mm, and the distance between the first row of gold fingers (721, 722) and the first edge 7111 may be 0.2mm. In the width direction, the distance between the fourth row of golden fingers (727 and 728) and the fifth row of golden fingers (729 and 7210) can be 0.25mm, and the distance between the fifth row of golden fingers (729 and 7210) and the third edge 7113 can be 0.2mm. That is, in the width direction, the distance between the ninth gold finger 729 and the third side 7113 may be 0.2mm, and the distance between the first portion 7291 and the seventh gold finger 727 of the ninth gold finger 729 may be 0.25mm; the distance between the tenth golden finger 7210 and the third side 7113 may be 0.2mm, and the distance between the first portion 72101 of the tenth golden finger 7210 and the eighth golden finger 728 may be 0.25mm. Wherein a top edge of the second portion 7292 of the ninth gold finger 729 near the first edge 7111 may be flush with a top edge of the seventh gold finger 727 near the first edge 7111; the top edge of the second portion 72102 of the tenth gold finger 7210 near the first edge 7111 may be flush with the top edge of the eighth gold finger 728 near the first edge 7111. In the width direction, the widths of the first through eighth gold fingers 721 through 728, the first portion 7291 of the ninth gold finger 729, and the first portion 72101 of the tenth gold finger 7210 may be 1.0mm.

For example, in the length direction, the distance between the first gold finger 721, the third gold finger 723, the fifth gold finger 725 and the second edge 7112 may be 1.1mm, and the distance between the second gold finger 722, the fourth gold finger 724, the sixth gold finger 726 and the fourth edge 7114 may be 1.1mm. In the length direction, both the side edge of the seventh golden finger 727 close to the fourth edge 7114 and the side edge of the first part 7291 of the ninth golden finger 729 close to the fourth edge 7114 can be flush with the side edge of the fifth golden finger 725 close to the fourth edge 7114; the distance between the seventh gold finger 727 and the second portion 7292 of the ninth gold finger 729 may be 0.2mm, and the distance between the ninth gold finger 729 and the second edge 7112 may be 0.5mm; the width of the second portion 7292 of the ninth gold finger 729 may be 0.9mm. In the length direction, both the side edge of the eighth gold finger 728 close to the second edge 7112 and the side edge of the first section 72101 of the tenth gold finger 7210 close to the second edge 7112 may be flush with the side edge of the sixth gold finger 726 close to the second edge 7112; the distance between the eighth golden finger 728 and the second portion 72102 of the tenth golden finger 7210 may be 0.2mm, and the distance between the tenth golden finger 7210 and the fourth side 7114 may be 0.5mm; second portion 72102 of tenth golden finger 7210 may have a width of 0.9mm.

Referring to fig. 21, fig. 21 is a size diagram of the two-in-one card 7 shown in fig. 16 in other embodiments.

Illustratively, the first gold fingers 721 to the tenth gold fingers 7210 of the two-in-one card 7 are arranged in two rows and five rows, the first row of gold fingers (721, 723, 725, 727, 729) is arranged near the second side 7112, and the second row of gold fingers (722, 724, 726, 728, 7210) is arranged near the fourth side 7114; the first row of gold fingers (721, 722) is arranged adjacent to the first edge 7111, the fifth row of gold fingers (729, 7210) is arranged adjacent to the third edge 7113, and each row of gold fingers is aligned in the length direction. The two-in-one card 7 further includes an eleventh gold finger 7220 and a twelfth gold finger 7230, the eleventh gold finger 7220 and the twelfth gold finger 7230 are arranged in the fourth row of gold fingers (727, 728, 7220 and 7230), the eleventh gold finger 7220 is positioned between the second edge 7112 and the seventh gold finger 727, and the twelfth gold finger 7230 is positioned between the fourth edge 7114 and the eighth gold finger 728. The first golden finger 721 can be provided with a cut edge to form a right trapezoid, the oblique edge of the first golden finger 721 faces the cut edge 7115 of the card body 71, and the distance between the two can be 0.2mm; the second through twelfth gold fingers 722 through 7230 may be rectangular.

Illustratively, the distance between the center of the second row of gold fingers (723, 724) and the first side 7111 may be 1.95mm, the distance between the center of the third row of gold fingers (725, 726) and the first side 7111 may be 4.25mm, the distance between the center of the third row of gold fingers (725, 726) and the third side 7113 may be 4.55mm, and the distance between the center of the fourth row of gold fingers (727, 728, 7220, 7230) and the third side 7113 may be 1.95mm in the width direction. In the width direction, the distance between the first row of gold fingers (721, 722) and the second row of gold fingers (723, 724) may be 0.25mm, and the distance between the first row of gold fingers (721, 722) and the first edge 7111 may be 0.2mm. In the width direction, the distance between the fourth row of golden fingers (727, 728, 7220 and 7230) and the fifth row of golden fingers (729 and 7210) can be 0.25mm, and the distance between the fifth row of golden fingers (729 and 7210) and the third edge 7113 can be 0.2mm. Wherein, the width of each of the first gold finger 721 to the twelfth gold finger 7230 may be 1.0mm in the width direction.

For example, in the length direction, the distance between the first gold finger 721, the third gold finger 723, the fifth gold finger 725 and the second edge 7112 may be 1.1mm, and the distance between the second gold finger 722, the fourth gold finger 724, the sixth gold finger 726 and the fourth edge 7114 may be 1.1mm. In the length direction, both the side edge of the seventh golden finger 727 close to the fourth edge 7114 and the side edge of the ninth golden finger 729 close to the fourth edge 7114 may be flush with the side edge of the fifth golden finger 725 close to the fourth edge 7114; the side edge of the eleventh golden finger 7220 adjacent to the second edge 7112 is flush with the side edge of the ninth golden finger 729 adjacent to the second edge 7112; the distance between the seventh gold finger 727 and the eleventh gold finger 7220 may be 0.2mm, the distance between the eleventh gold finger 7220 and the second edge 7112 may be 0.5mm, and the length of the eleventh gold finger 7220 may be 0.9mm. In the length direction, both the side edge of the eighth golden finger 728 close to the second edge 7112 and the side edge of the tenth golden finger 7210 close to the second edge 7112 can be flush with the side edge of the sixth golden finger 726 close to the second edge 7112; the side of the twelfth golden finger 7230 adjacent to the fourth side 7114 is flush with the side of the tenth golden finger 7210 adjacent to the fourth side 7114; the distance between the eighth gold finger 728 and the twelfth gold finger 7230 may be 0.2mm, the distance between the twelfth gold finger 7230 and the fourth side 7114 may be 0.5mm, and the length of the twelfth gold finger 7230 may be 0.9mm.

Referring to fig. 22, fig. 22 is a size diagram of the two-in-one card 7 shown in fig. 16 according to another embodiment.

Illustratively, the first gold fingers 721 to the tenth gold fingers 7210 of the two-in-one card 7 are arranged in two rows and five rows, the first row of gold fingers (721, 723, 725, 727, 729) is arranged near the second side 7112, the second row of gold fingers (722, 724, 726, 728, 7210) is arranged near the fourth side 7114, and each row of gold fingers are aligned in the width direction; the first row of gold fingers (721, 722) is arranged adjacent to the first edge 7111, the fifth row of gold fingers (729, 7210) is arranged adjacent to the third edge 7113, and each row of gold fingers is aligned in the length direction. The first gold finger 721 to the tenth gold finger 7210 may be rectangular. The first gold finger 721 may be closer to the cut edge 7115 of the card body 71 than the other gold fingers.

Illustratively, the distance between the center of the second row of gold fingers (723, 724) and the first side 7111 may be 1.86mm, the distance between the center of the third row of gold fingers (725, 726) and the first side 7111 may be 4.4mm, the distance between the center of the third row of gold fingers (725, 726) and the third side 7113 may be 4.4mm, and the distance between the center of the fourth row of gold fingers (727, 728) and the third side 7113 may be 1.86mm in the width direction. The distance between the first row of golden fingers (721, 722) and the first edge 7111 may be 0.2mm, and the distance between the fifth row of golden fingers (729, 7210) and the third edge 7113 may be 0.2mm.

Illustratively, the distance between the center of the first row of gold fingers (721, 723, 725, 727, 729) and the second side 7112 may be 2.68mm, and the distance between the center of the second row of gold fingers (722, 724, 726, 728, 7210) and the fourth side 7114 may be 2.0mm in the length direction. Wherein, the length of the card body 71 of the two-in-one card 7 can be 12.3mm.

It is understood that the structural dimensions of the two-in-one card 7 shown in fig. 19 to 22 are some examples of the two-in-one card 7, the card interface 72 of the two-in-one card 7 may have more arrangement and dimensions of gold fingers, and the card interface 72 of the two-in-one card 7 at least includes the first gold finger 721 to the tenth gold finger 7210, which is not strictly limited in this embodiment of the present invention.

The signal arrangement and internal circuit of the card interface 72 of the two-in-one card 7 will be described below by way of example, and part of the circuit of the electronic device to which the two-in-one card 7 can be connected will be described below by way of example. The signal arrangement of the card interface 72 of the two-in-one card 7 in the following embodiments can be applied to the two-in-one card 7 having the first golden finger to the tenth golden finger, such as the two-in-one card 7 shown in fig. 17 and fig. 19 to 22 and the two-in-one card 7 having other card interface 72 structures, and the following embodiments are illustrated by taking the card interface 72 structure shown in fig. 17 as an example.

Referring to fig. 23, fig. 23 is a schematic diagram of the two-in-one card 7 shown in fig. 17 in some embodiments.

In some embodiments, the memory card circuit 712 of the two-in-one card 7 supports the EMMC interface protocol. The card interface 72 of the two-in-one card 7 includes first through tenth gold fingers 721 through 7210 arranged in an array. Among the first through tenth gold fingers 721 through 7210, one of the gold fingers is used to transmit a DATA signal (SIM DATA) of the SIM card, one of the gold fingers is used to transmit a clock signal (SIM CLK) of the SIM card, four of the gold fingers are used to transmit DATA signals (NM DATA0, NM DATA1, NM DATA2, NM DATA 3) of the memory card, one of the gold fingers is used to transmit a clock signal (NM CLK) of the memory card, one of the gold fingers is used to transmit a reset signal (SIM RST) of the SIM card and a command and response signal (NM CMD) of the memory card, one of the gold fingers is used to transmit a ground signal (SIM GND) of the SIM card and a ground signal (NM GND) of the memory card, and one of the gold fingers is used to transmit a power supply signal (SIM VCC) of the SIM card and a power supply signal (NM VCC) of the memory card.

Illustratively, the first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are used for transmitting DATA signals (NM DATA0, NM DATA1, NM DATA3, NM DATA 2) of the memory card. The following embodiments are described by taking as an example that the first gold finger 721 is used for transmitting the DATA signal (NM DATA 0), the second gold finger 722 is used for transmitting the DATA signal (NM DATA 1), the ninth gold finger 729 is used for transmitting the DATA signal (NM DATA 3), and the tenth gold finger 7210 is used for transmitting the DATA signal (NM DATA 2). In other embodiments, the data signals transmitted by the first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 can be interchanged with each other. For example, the data signals transmitted by the first gold finger 721 and the second gold finger 722 are exchanged, and the data signals transmitted by the ninth gold finger 729 and the tenth gold finger 7210 are exchanged, which are not described herein again in other embodiments.

The third gold finger 723 is used for transmitting a DATA signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used for transmitting a clock signal (SIM CLK) of the SIM card; the fifth finger 725 is used to transfer the clock signal (NM CLK) of the memory card; the sixth gold finger 726 is used for transmitting a reset signal (SIM RST) of the SIM card and a command and response signal (NM CMD) of the memory card; the seventh gold finger 727 is used for transmitting a ground signal (SIM GND) of the SIM card and a ground signal (NMGND) of the memory card; the eighth gold finger 728 is used to transmit a power supply signal (SIM VCC) of the SIM card and a power supply signal (NM VCC) of the memory card.

Referring to fig. 23 and fig. 24A in combination with table 3, table 3 is a schematic table of the corresponding relationship between the gold finger and the interface of the circuit of the two-in-one card 7 shown in fig. 23. In the embodiments of the present application, for convenience of illustration, the interfaces of the circuits and the interfaces of the controllers referred to in the following and the drawings are correspondingly identified by signals transmitted by the interfaces and the interfaces.

TABLE 3

In some embodiments, the memory card circuit 712 includes four DATA interfaces (DATA 0, DATA1, DATA2, DATA 3), a clock interface (CLK), a command and response multiplexing interface (CMD), a ground interface (GND), and a power interface (VCC). Four DATA interfaces (DATA 0, DATA1, DATA2, DATA 3) of the memory card circuit 712 are used to transmit DATA signals (NM DATA0, NM DATA1, NM DATA2, NM DATA 3) of the memory card, a clock interface (CLK) of the memory card circuit 712 is used to transmit a clock signal (NM CLK) of the memory card, a command and response multiplexing interface (CMD) of the memory card circuit 712 is used to transmit a command and response signal (NM CMD) of the memory card, a ground interface (GND) of the memory card circuit 712 is used to transmit a ground signal (NM GND) of the memory card, and a power interface (VCC) of the memory card circuit 712 is used to transmit a power signal (NM VCC) of the memory card. The interface of the memory card circuit 712 described above may be located in the control portion of the memory card circuit 712.

The SIM card circuit 713 includes a DATA interface (DATA), a clock interface (CLK), a reset interface (RST), a ground interface (GND), and a power interface (VCC). The DATA interface (DATA) of the SIM card circuit 713 is used for transmitting a DATA signal (SIM DATA) of the SIM card, the clock interface (CLK) of the SIM card circuit 713 is used for transmitting a clock signal (SIM CLK) of the SIM card, the reset interface (RST) of the SIM card circuit 713 is used for transmitting a reset signal (SIM RST) of the SIM card, the ground interface (GND) of the SIM card circuit 713 is used for transmitting a ground signal (SIM GND) of the SIM card, and the power interface (VCC) of the SIM card circuit 713 is used for transmitting a power signal (SIM VCC) of the SIM card. The interface to the SIM card circuitry 713 described above may be located in the control portion of the SIM card circuitry 713.

The two-in-one card 7 further includes a switching circuit 714. The first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are electrically connected to four DATA interfaces (DATA 0, DATA1, DATA3 and DATA 2) of the memory card circuit 712, respectively, the third gold finger 723 is electrically connected to the DATA interface (DATA) of the SIM card circuit 713, the fourth gold finger 724 is electrically connected to the clock interface (CLK) of the SIM card circuit 713, the fifth gold finger 725 is electrically connected to the clock interface (CLK) of the memory card circuit 712, the sixth gold finger 726 is electrically connected to the reset interface (RST) of the SIM card circuit 713 and the command and response multiplexing interface (CMD) of the memory card circuit 712 via the switching circuit 714, the seventh gold finger 727 is electrically connected to the ground interface (GND) of the SIM card circuit 713 and the ground interface (GND) of the memory card circuit 712, and the eighth gold finger is electrically connected to the power interface (VCC) of the SIM card circuit 713 and the power interface (VCC) of the memory card circuit 712.

In this embodiment, the two-in-one card 7 realizes signal transmission of the SIM card circuit 713 and signal transmission of the memory card circuit 712 through the first gold finger 721 to the tenth gold finger 7210, so that the two-in-one card 7 can integrate a SIM card function and a memory card function, thereby realizing multi-functionalization and improving integration level. When the electronic equipment is plugged with the two-in-one card 7, the number of information cards needing to be plugged can be effectively reduced, the number of card seat assemblies is reduced, the electronic equipment is light and thin, and the use experience of a user can be improved.

In addition, the first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 are exclusive gold fingers of the memory card circuit 712, and are used for transmitting high-speed data of the memory card, and the first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 do not need to perform a switching design of a connection circuit between a high-speed data interface and a low-speed data interface, so that the difficulty in designing the internal circuit of the two-in-one card 7 can be effectively reduced, and the implementation is easy.

In addition, the third gold finger 723, the fourth gold finger 724 and the fifth gold finger 725 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712, and these gold fingers also do not need to perform a switching design of a connection circuit, so that the difficulty of designing the internal circuit of the two-in-one card 7 is low, and the implementation is easy.

Illustratively, the switching circuit 714 is configured to detect the signal transmitted by the sixth gold finger 726 and implement a corresponding switch. For example, if the switching circuit 714 detects that the signal transmitted by the sixth gold finger 726 is a reset signal (SIM RST) of the SIM card, the sixth gold finger 726 and the reset interface (RST) of the SIM card circuit 713 are turned on. The sixth gold finger 726 is in a disconnected state with the command and response multiplexing interface (CMD) of the memory card circuit 712 at this time. If the switching circuit 714 detects that the signal transmitted by the sixth gold finger 726 is a command and response signal (NM CMD) of the memory card, the command and response multiplexing interface (CMD) of the sixth gold finger 726 and the memory card circuit 712 is turned on. At this time, the sixth gold finger 726 is in an off state with the reset interface (RST) of the SIM card circuit 713.

In this embodiment, the two-in-one card 7 realizes transmission switching of two signals through the switching circuit 714, so that both the reset signal (SIM RST) of the SIM card and the command and response signal (CMD) of the memory card circuit 712 can be transmitted through the sixth gold finger 726, the integration level of the card interface 72 of the two-in-one card 7 is high, and the switching difficulty of the connection circuit with the interface of the SIM card circuit 713 and the interface of the memory card circuit 712 is low, which is easy to realize, so that the reliability of the two-in-one card 7 is high.

Here, since the reset signal (SIM RST) of the SIM card is not a common signal, the default state of the switching circuit 714 may be set to the command and response multiplexing interface (CMD) for turning on the sixth gold finger 726 and the memory card circuit 712, and the reset interface (RST) of the sixth gold finger 726 and the SIM card circuit 713 is in the disconnected state.

Exemplarily, the SIM card circuit 713 and the memory card circuit 712 both transmit the ground signal through the seventh gold finger 727 and transmit the power signal through the eighth gold finger 728, and the two-in-one card 7 may not be provided with a switching scheme of a related connection circuit, or the switching scheme is easy to implement, so that the integration level of the card interface 72 of the two-in-one card 7 can be improved, and the design difficulty of the internal circuit is low, so that the reliability of the two-in-one card 7 is high and the cost is low.

For example, a ground signal is transmitted via the seventh gold finger 727, and the ground signal is transmitted to both the ground interface (GND) of the SIM card circuit 713 and the ground interface (GND) of the memory card circuit 712. A power signal is transmitted through the eighth gold finger 728, and when the pressure of the power signal (SIM VCC) of the SIM card and the pressure of the power signal (NM VCC) of the memory card are the same, the power signal is transmitted to the power interface (VCC) of the SIM card circuit 713 and the power interface (VCC) of the memory card circuit 712; when the power supply signal (SIM VCC) of the SIM card and the power supply signal (NM VCC) of the memory card are different in pressure, the eighth golden finger 728 is electrically connected with a direct transmission branch and a voltage regulation branch, the direct transmission branch is connected with the voltage regulation branch in parallel, the direct transmission branch is used for transmitting the power supply signal passing through the eighth golden finger 728, the voltage regulation branch continues to transmit the power supply signal of the eighth golden finger 728 after voltage regulation, one of the direct transmission branch and the voltage regulation branch is electrically connected with the power supply interface (VCC) of the SIM card circuit 713, and the other is electrically connected with the power supply interface (VCC) of the memory card circuit 712. The voltage regulating branch can be connected in series with a voltage regulator (regulator) to realize voltage regulation.

In some other embodiments, when the voltages of the power signal (SIM VCC) of the SIM card and the power signal (NM VCC) of the memory card are the same, the eighth gold finger 728 may also electrically connect two voltage-regulating branches connected in parallel, where the two voltage-regulating branches are respectively connected to the power interface (VCC) of the SIM card circuit 713 and the power interface (VCC) of the memory card circuit 712.

In other embodiments, when the power supply signal (SIM VCC) of the SIM card and the power supply signal (NM VCC) of the memory card are the same in pressure, the voltage regulating action of the power supply signal may also be performed by the memory card circuit 712 or the SIM card circuit 713, and the power supply signal transmitted by the eighth gold finger 728 is directly transmitted to the power supply interface (VCC) of the SIM card circuit 713 and the power supply interface (VCC) of the memory card circuit 712. The embodiment of the application does not strictly limit whether the power supply signal (SIM VCC) of the SIM card and the power supply signal (NMVCC) of the memory card are subjected to voltage regulation, voltage regulation implementation modes and the like.

In other embodiments, the power interface and the ground interface of the memory card circuit 712 and the SIM card circuit 713 may be separated to form the power interface and the ground interface of the two-in-one card 7.

Referring to fig. 23 and fig. 24A in combination, fig. 24A is a schematic diagram of a connection circuit between the two-in-one card 7 shown in fig. 23 and an electronic device.

In some embodiments, when the two-in-one card 7 is inserted into the card socket assembly of the electronic device and electrically connected to the card connector 11, the first to tenth resilient sheets of the card connector 11 correspondingly abut against and electrically connect the first to tenth gold fingers 721 to 7210 of the two-in-one card 7. Illustratively, the processor 20 of the electronic device may include a memory card controller 201, a SIM card controller 202, a switch 203, a power interface, and a ground interface. The memory card controller 201 may be used to control the operation of the memory card circuitry of the two-in-one card 7, and the SIM card controller 202 may be used to control the operation of the SIM card circuitry of the two-in-one card 7. The plurality of controllers of the processor 20 may be independent components, may be combined by an integrated component, or may be split into a plurality of components by one controller, which is not strictly limited in this embodiment of the present application.

Illustratively, the power interface of the processor 20 is used to transmit power signals and the ground interface is used to transmit ground signals. The power signal may be a power signal (SIM VCC) of the SIM card interacting with the two-in-one card 7 or a power signal (NM VCC) of the memory card, and the ground signal may be a ground signal (NM GND) of the memory card interacting with the two-in-one card 7 or a ground signal (SIM GND) of the SIM card. The power interface and the ground interface may be independent from the SIM card controller 202 and the memory card controller 201, or may be separated and integrated in the SIM card controller 202 and the memory card controller 201, which is not limited in this embodiment of the present invention. In fig. 24A and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 202 and the memory card controller 201, and are respectively identified as power and ground.

Illustratively, the interface of the memory card controller 201 and the interface of the SIM card controller 202 are connected to eight of the ten spring pieces of the card connector 11. The power interface is connected to the other spring plate of the ten spring plates, and the ground interface is connected to the other spring plate of the ten spring plates. In this embodiment, the electronic device realizes interaction with the two-in-one card 7, such as communication, data storage, etc., through the ten elastic pieces of the card connector 11, the number of the elastic pieces is small, and the volume of the card connector 11 and the card socket assembly is small, which is beneficial to the light weight and the thin weight of the electronic device.

Illustratively, the SIM card controller 202 includes a reset interface (RST) for transmitting a reset signal (SIM RST) of the SIM card. The switch 203 may be connected to the SIM card controller 202, including the reset interface (RST) and one of the interfaces of the memory card controller 201, and the switch 203 is further connected to one of the ten elastic pieces of the card connector 11.

In this embodiment, since the reset operation of the SIM card circuit of the two-in-one card 7 is not frequently performed, and the reset process can be completed quickly, when the reset interface (RST) and one of the interfaces of the memory card controller 201 reuse the same elastic piece, the elastic piece can be fully utilized to perform signal transmission in a time-sharing multiplexing manner, for example, when the SIM card circuit of the two-in-one card 7 needs to be reset, a certain elastic piece of the card connector 11 is first conducted to the SIM card controller 202 including the reset interface (RST) to ensure the networking experience of the user, and after the reset process of the SIM card module of the two-in-one card 7 is completed, the elastic piece is switched back to the memory card controller 201 to continue to complete the read-write operation of the two-in-one card 7, thereby improving the working efficiency of the electronic device.

In some embodiments, the memory card controller 201 supports the EMMC interface protocol. The memory card controller 201 includes four DATA interfaces (DATA 0, DATA1, DATA2, DATA 3) for transmitting DATA signals (NM DATA0, NM DATA1, NM DATA2, NM DATA 3) of the memory card, a clock interface (CLK) for transmitting a clock signal (NM CLK) of the memory card, and a command and response multiplexing interface (CMD) for transmitting command and response signals (NM CMD) of the memory card. The SIM card controller 202 further comprises a DATA interface (DATA) for transmitting the DATA signal (SIM DATA) of the SIM card and a clock interface (CLK) for transmitting the clock signal (SIM CLK) of the SIM card.

The switch 203 is also connected to a command and response multiplexing interface (CMD) of the memory card controller 201. Seven of the ten shell springs of the card connector 11 are connected to the four DATA interfaces (DATA 0, DATA1, DATA2, DATA 3) of the memory card controller 201, the clock interface (CLK) of the memory card controller 201, the DATA interface (DATA) of the SIM card controller 202, and the clock interface (CLK) of the SIM card controller 202 in a one-to-one correspondence.

Illustratively, the four DATA interfaces (DATA 0, DATA1, DATA3, DATA 2) of the memory card controller 201 are electrically connected to the first, second, ninth and tenth spring pieces of the card connector 11 in a one-to-one correspondence, and the clock interface (CLK) of the memory card controller 201 is electrically connected to the fifth spring piece of the card connector 11. The DATA interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11, and the clock interface (CLK) of the SIM card controller 202 is electrically connected to the fourth elastic piece of the card connector 11. The switch 203 connects the command and response multiplexing interface (CMD) of the memory card controller 201 and the reset interface (RST) of the SIM card controller 202, and the switch 203 is also connected to the sixth elastic piece of the card connector 11. The switch 203 is used to conduct a command and response multiplexing interface (CMD) between the sixth clip and the memory card controller 201, or conduct a reset interface (RST) between the sixth clip and the SIM card controller 202. The power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11, and the ground interface is electrically connected to the seventh elastic piece of the card connector 11.

In this embodiment, when the two-in-one card 7 is inserted into the electronic device and the memory card circuit 712 of the two-in-one card 7 is working, the memory card controller 201 transmits the DATA signals (NM DATA0, NM DATA1, NM DATA3, NM DATA 2) of the memory card between the two-in-one card 7 via the first, second, ninth, and tenth elastic pieces, transmits the clock signal (NM CLK) of the memory card between the fifth elastic piece and the two-in-one card 7, and transmits the command and response signals (NM CMD) of the memory card between the sixth elastic piece and the two-in-one card 7; the power interface of the processor 20 transmits the power signal (NM VCC) of the memory card to the two-in-one card 7 through the eighth elastic piece, the ground interface transmits the ground signal (NM GND) of the memory card to the two-in-one card 7 through the seventh elastic piece, and the two-in-one card 7 realizes a data storage function.

When the electronic device needs to store data, the control switch 203 turns on the command and response multiplexing interface (CMD) and the sixth elastic piece of the memory card controller 201, the sixth elastic piece sends a signal to the sixth golden finger 726 of the two-in-one card 7, the switching circuit 714 connected with the sixth golden finger 726 identifies the transmission signal or the signal to be transmitted as the command and response signal (NM CMD) of the memory card, and the switching circuit 714 turns on the command and response multiplexing interface (CMD) of the sixth golden finger 726 and the memory card circuit 712, so as to realize the transmission of the command and response signal (NM CMD) of the memory card.

When the two-in-one card 7 is inserted into the electronic device and the SIM card circuit 713 of the two-in-one card 7 operates, the SIM card controller 202 transmits the DATA signal (SIM DATA) of the SIM card between the third elastic piece and the two-in-one card 7, and transmits the clock signal (SIM CLK) of the SIM card between the fourth elastic piece and the two-in-one card 7; the power interface of the processor 20 transmits the power signal (SIM VCC) of the SIM card between the eighth elastic piece and the two-in-one card 7, the ground interface transmits the ground signal (SIM GND) of the SIM card between the seventh elastic piece and the two-in-one card 7, and the two-in-one card 7 realizes the functions of communication and data communication.

When the electronic device needs to reset the SIM card circuit 713 of the two-in-one card 7, the processor 20 controls the switch 203 to conduct the reset interface (RST) and the sixth elastic piece of the SIM card controller 202, the sixth elastic piece sends a signal to the sixth golden finger 726 of the two-in-one card 7, the switching circuit 714 connected to the sixth golden finger 726 identifies the transmission signal or the signal to be transmitted as the reset signal (SIM RST) of the SIM card, and the switching circuit 714 conducts the sixth golden finger 726 and the reset interface (SIM RST) of the SIM card circuit 713, so that the transmission of the reset signal (SIM RST) of the SIM card is realized, and the SIM card circuit 713 is controlled to be reset.

In this embodiment, the reset operation of the SIM card is not frequent, and the reset process can be completed quickly, when the SIM card needs to be reset, the sixth gold finger 726 of the two-in-one card 7 is firstly conducted to the reset interface (RST) of the SIM card to ensure the networking experience of the user, and after the reset process of the SIM card is completed, the sixth gold finger 726 is switched back to the conducting memory card circuit 712 to continue to complete the read-write operation, thereby improving the work efficiency of the two-in-one card 7.

In other embodiments, the signal arrangement of the card interface 72 of the two-in-one card 7 may be in other manners. For example, the fifth finger 725 is used to transmit the command and response signal (NM CMD) of the memory card, the sixth finger 726 is used to transmit the reset signal (SIM RST) of the SIM card and the clock signal (NM CLK) of the memory card, and the signal arrangement of the other fingers is unchanged. At this time, the switching circuit 714 of the two-in-one card 7 electrically connects the clock interface (CLK) of the memory card circuit 712 and the reset interface (RST) of the SIM card circuit 713, the fifth finger 725 connects the command and response multiplexing interface (CMD) of the memory card circuit 712, and the connection circuits of the other interfaces and the gold finger are unchanged; the command and response multiplexing interface (CMD) of the memory card controller 201 of the electronic device is electrically connected with the fifth elastic sheet, the clock interface (CLK) of the memory card controller 201 is electrically connected with the switch 203, and the connection circuit of the other interfaces and the elastic sheet of the card connector 11 is unchanged; the two-in-one card 7 and the work flow of the electronic device are adaptively adjusted, and details are not described here.

Referring to table 4, table 4 is a table of correspondence between a plurality of resilient sheets of the card connector 11 and the Nano SIM card 3, the first NM card 4 and a plurality of gold fingers of the two-in-one card 7 shown in fig. 23 and their transmission signals. When the two-in-one card 7 is connected to the card connector 11, the first to tenth elastic pieces of the card connector 11 correspondingly abut against and electrically connect the first gold finger 721 to the tenth gold finger 7210 of the two-in-one card 7, and the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 correspondingly correspond to the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3. In some embodiments, the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

TABLE 4

When the electronic device is compatible with the Nano SIM card 3 and the two-in-one card 7 shown in fig. 23, the SIM card controller 202 of the electronic device may not support programming voltages/input signals. Alternatively, the SIM card controller 202 of the electronic device may also support programming voltages/input signals. At this time, the SIM card controller 202 of the electronic device may further include a programming voltage/input signal interface (VPP), and the processor 20 may set a switch, where the switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the clock interface (CLK) of the memory card controller 201, and is further connected to the fifth elastic piece of the card connector 11. When the electronic device is inserted into the Nano SIM card 3, the switch conducts a programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth elastic sheet; when the electronic device is inserted into the two-in-one card 7, the switch connects the clock interface (CLK) of the memory card controller 201 and the fifth elastic piece.

Referring to fig. 24B and table 4 in combination, fig. 24B is a schematic circuit structure diagram of a portion of an electronic device according to an embodiment of the present disclosure in some embodiments. The electronic device of this embodiment may include most technical contents of the electronic device corresponding to fig. 24A, and the following mainly explains differences between the two.

In some embodiments, the electronic device is compatible with the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in fig. 23. The processor 20 of the electronic device includes a memory card controller 201, a SIM card controller 202, and an interface controller 205, wherein the interface controller 205 is electrically connected to the memory card controller 201 and the SIM card controller 202, and the interface controller 205 is further electrically connected to a plurality of elastic pieces of the card connector 11. An interface protocol (e.g., EMMC interface protocol) of the memory card controller 201 is capable of communicating with the memory card circuits of the first NM card 4 and the two-in-one card 7 for controlling the operation of the first NM card 4 and the operation of the memory card circuits of the two-in-one card 7, and the SIM card controller 202 for controlling the operation of the Nano SIM card 3. When a different information card is inserted into the card holder assembly 10 of the electronic device and electrically connected to the card connector 11, the interface controller 205 can control the memory card controller 201 and/or the SIM card controller 202 to communicate with the information card via the card connector 11. For example, when the Nano SIM card 3 is installed in the card holder 2 and the Nano SIM card 3 is inserted into the card socket assembly 10, the interface controller 205 controls the SIM card controller 202 to communicate with the Nano SIM card 3 through the card connector 11; when the first NM card 4 is installed on the card holder 2 and the first NM card 4 is inserted into the card socket assembly 10, the interface controller 205 controls the memory card controller 201 to communicate with the first NM card 4 via the card connector 11; when the two-in-one card 7 is mounted on the card holder 2 and the two-in-one card 7 is inserted into the card seat assembly 10, the interface controller 205 controls the memory card controller 201 and the SIM card controller 202 to communicate with the two-in-one card 7 via the card connector 11.

The interface controller 205 may include a plurality of switches, and switch the connection relationship between the plurality of clips of the card connector 11 and the plurality of controllers in the processor 20 through the plurality of switches, so as to implement the communication requirements in different scenarios. The interface controller 205 may also include a plurality of conductors. An exemplary implementation of the interface controller 205 can be seen in fig. 24B, which is not described herein. Other technical contents of this embodiment may refer to the related description of the embodiment corresponding to fig. 24A, and are not described herein again. The switch 203 may be part of the interface controller 205.

Referring to fig. 25, fig. 25 is a schematic view of the two-in-one card 7 shown in fig. 17 according to another embodiment.

In some embodiments, the memory card circuit 712 of the two-in-one card 7 supports the UFS interface protocol. The UFS interface protocol is a standard established by the Joint Electron Device Engineering Council (JEDEC) association for defining the electrical interface of UFS universal flash memory and UFS storage devices. The UFS defines a complete protocol stack, which is an application layer, a transport layer, and an interconnection layer in sequence from top to bottom. The UFS defines a unique UFS feature set, and uses the feature set of the EMMC standard as a subset, using the UniPro Interface of the MIPI (Mobile Industry Processor 20 Interface) alliance as the data link Layer and the M-PHY Interface of the MIPI as the physical Layer, which are collectively referred to as the InterConnect Layer (UFS InterConnect Layer). The UFS interface protocol released version 1.0 since 2011, and then released version 1.1, version 2.0, version 2.1, and version 3.0 in 2012, version 2013, version 2016, and version 2018, respectively, and each version is updated with an increase in speed. The UFS interface protocol is a concatenation after the EMMC interface protocol version 4.5. The main improvement of the UFS interface protocol lies in a transmission layer, the UFS interface protocol adopts differential serial transmission on data signal transmission to support simultaneous reading and writing of data, and meanwhile, the UFS interface protocol has the characteristics of high speed and low power consumption compared with the previous generation protocol standard EMMC because differential signals have strong anti-interference capability and can provide wider bandwidth.

The card interface 72 of the two-in-one card 7 includes first through tenth gold fingers 721 through 7210. Among the first through tenth gold fingers 721 through 7210, one of the gold fingers is used to transmit a DATA signal (SIM DATA) of the SIM card, one of the gold fingers is used to transmit a clock signal (SIM CLK) of the SIM card, four of the gold fingers are used to transmit DATA signals (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card, one of the gold fingers is used to transmit a second power signal (NM VCCQ) of the memory card, one of the gold fingers is used to transmit a reset signal (SIM RST) of the SIM card and a reference clock signal (NM RCLK) of the memory card, one of the gold fingers is used to transmit a ground signal (SIM GND) of the SIM card and a ground signal (NM GND) of the memory card, and one of the gold fingers is used to transmit a power signal (SIM VCC) of the SIM card and a first power signal (NM VCC) of the memory card.

Wherein, the data signal (NMRX +) of the memory card and the data signal (NMRX-) of the memory card are input differential signals; the data signal (NMTX +) of the memory card and the data signal (NMTX-) of the memory card are output differential signals; the first power supply signal (NM VCC) of the memory card is responsible for supplying power to the flash memory particles (i.e., the memory portion) of the memory card circuit 712 of the two-in-one card 7; the second power supply signal (NM VCCQ) of the memory card is responsible for power supply to the control portion of the memory card circuit 712 of the two-in-one card 7. Therein, in some embodiments, the second power signal (NM VCCQ) of the memory card may also be responsible for powering the M-PHY interface, flash memory input output, and other internal low voltage circuits of the memory card circuitry 712. Wherein a voltage of the first power supply signal (NM VCC) of the memory card may be in a range of 1.7V to 1.95V, or in a range of 2.7V to 3.6V. The voltage of the second power signal (NM VCCQ) of the memory card may be in a range of 1.1V to 1.3V.

Illustratively, the first gold finger 721, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are used for transmitting data signals (NMRX +, NMRX-, NMTX +, NMTX-) of the memory card. The following embodiments are described by way of example, in which the first gold finger 721 is used to transmit a data signal (NM RX +), the fifth gold finger 725 is used to transmit a data signal (NM RX-), the ninth gold finger 729 is used to transmit a data signal (NM TX +), and the tenth gold finger 7210 is used to transmit a data signal (NM TX-). In other embodiments, the data signals transmitted by the first gold finger 721, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 can be interchanged with each other. For example, the data signals transmitted by the first golden finger 721 and the fifth golden finger 725 are exchanged, and the data signals transmitted by the ninth golden finger 729 and the tenth golden finger 7210 are exchanged, which is not described herein again in other embodiments.

The second gold finger 722 is used for transmitting a second power supply signal (NM VCCQ) of the memory card; the third gold finger 723 is used for transmitting a DATA signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used for transmitting a clock signal (SIM CLK) of the SIM card; the sixth gold finger 726 is used for transmitting a reset signal (SIM RST) of the SIM card and a reference clock signal (NM RCLK) of the memory card; the seventh gold finger 727 is used for transmitting a ground signal (SIM GND) of the SIM card and a ground signal (NMGND) of the memory card; the eighth gold finger 728 is used to transmit a power supply signal (SIM VCC) of the SIM card and a first power supply signal (NM VCC) of the memory card.

Referring to fig. 25 and table 5, table 5 is a schematic table of the corresponding relationship between the gold finger and the interface of the circuit of the two-in-one card 7 shown in fig. 25. In the embodiments of the present application, for convenience of illustration, the interfaces of the circuits and the interfaces of the controllers referred to in the following and the drawings are correspondingly identified by signals transmitted by the interfaces and the interfaces.

TABLE 5

In some embodiments, the memory card circuitry 712 includes four data interfaces (RX +, RX-, TX +, TX-), a second power interface (VCCQ), a reference clock interface (RCLK), a ground interface (GND), and a first power interface (VCC). The four data interfaces (RX +, RX-, TX +, TX-) of the memory card circuit 712 are used to transmit data signals (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card, the second power interface (VCCQ) of the memory card circuit 712 is used to transmit a second power signal (NM VCCQ) of the memory card, the reference clock interface (RCLK) of the memory card circuit 712 is used to transmit a reference clock signal (NM RCLK) of the memory card, the ground interface (GND) of the memory card circuit 712 is used to transmit a ground signal (NM GND) of the memory card, and the first power interface (VCC) of the memory card circuit 712 is used to transmit a first power signal (NM VCC) of the memory card.

The SIM card circuit 713 includes a DATA interface (DATA), a clock interface (CLK), a reset interface (RST), a ground interface (GND), and a power interface (VCC). The DATA interface (DATA) of the SIM card circuit 713 is used for transmitting a DATA signal (SIM DATA) of the SIM card, the clock interface (CLK) of the SIM card circuit 713 is used for transmitting a clock signal (SIM CLK) of the SIM card, the reset interface (RST) of the SIM card circuit 713 is used for transmitting a reset signal (SIM RST) of the SIM card, the ground interface (GND) of the SIM card circuit 713 is used for transmitting a ground signal (SIM GND) of the SIM card, and the power interface (VCC) of the SIM card circuit 713 is used for transmitting a power signal (SIM VCC) of the SIM card.

The two-in-one card 7 further includes a switching circuit 714. The first gold finger 721, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are electrically connected to four DATA interfaces (RX +, RX-, TX +, TX-) of the memory card circuit 712, respectively, the second gold finger 722 is electrically connected to the second power interface (VCCQ) of the memory card circuit 712, the third gold finger 723 is electrically connected to the DATA interface (DATA) of the SIM card circuit 713, the fourth gold finger 724 is electrically connected to the clock interface (CLK) of the SIM card circuit 713, the sixth gold finger 726 is electrically connected to the reset interface (RST) of the SIM card circuit 713 and the reference clock interface (RCLK) of the memory card circuit 712 via the switching circuit 714, the seventh gold finger 727 is electrically connected to the ground interface (GND) of the SIM card circuit 713 and the ground interface (GND) of the memory card circuit 712, and the eighth gold finger is electrically connected to the power interface (VCC) of the SIM card circuit 713 and the first power interface (VCC) of the memory card circuit 712.

In addition, the first gold finger 721, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 are exclusive gold fingers of the memory card circuit 712, and are used for transmitting high-speed data of the memory card, and the first gold finger 721, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 do not need to perform a switching design of a connection circuit of a high-speed data interface and a low-speed data interface, so that the difficulty in designing the internal circuit of the two-in-one card 7 can be effectively reduced, and the implementation is easy.

In addition, the second gold finger 722, the third gold finger 723 and the fourth gold finger 724 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712, and these gold fingers also do not need to perform a switching design of a connection circuit, so that the difficulty of designing the internal circuit of the two-in-one card 7 is low, and the implementation is easy.

Illustratively, the switching circuit 714 is configured to detect the signal transmitted by the sixth gold finger 726 and implement a corresponding switch. For example, if the switching circuit 714 detects that the signal transmitted by the sixth gold finger 726 is a reset signal (SIM RST) of the SIM card, the sixth gold finger 726 and the reset interface (RST) of the SIM card circuit 713 are turned on. At this point the sixth gold finger 726 is in a disconnected state from the reference clock interface (RCLK) of the memory card circuitry 712. If the switching circuit 714 detects that the signal transmitted by the sixth gold finger 726 is the reference clock signal (NM RCLK) of the memory card, the sixth gold finger 726 is turned on with the reference clock interface (RCLK) of the memory card circuit 712. At this time, the sixth gold finger 726 is in an off state with the reset interface (RST) of the SIM card circuit 713.

In this embodiment, the two-in-one card 7 realizes transmission switching of two signals through the switching circuit 714, so that both the reset signal (SIM RST) of the SIM card and the reference clock interface (RCLK) of the memory card circuit 712 can be transmitted through the sixth golden finger 726, the integration level of the card interface 72 of the two-in-one card 7 is high, and the switching difficulty of the connection circuit with the interface of the SIM card circuit 713 and the interface of the memory card circuit 712 is low, which is easy to realize, so that the reliability of the two-in-one card 7 is high.

Since the reset signal (SIM RST) of the SIM card is not a common signal, the default state of the switching circuit 714 may be set to conduct the sixth gold finger 726 and the reference clock interface (RCLK) of the memory card circuit 712, and the sixth gold finger 726 and the reset interface (RST) of the SIM card circuit 713 are in a disconnected state.

Exemplarily, the SIM card circuit 713 and the memory card circuit 712 both transmit the ground signal through the seventh gold finger 727 and transmit the power signal through the eighth gold finger 728, and the two-in-one card 7 may not be provided with a switching scheme of a related connection circuit, or the switching scheme is easy to implement, so that the integration level of the card interface 72 of the two-in-one card 7 can be improved, and the design difficulty of the internal circuit is low, so that the reliability of the two-in-one card 7 is high and the cost is low. For the scheme of the SIM card circuit 713 and the memory card circuit 712 transmitting the ground signal and the power signal through the seventh gold finger 727 and the eighth gold finger 728, reference may be made to the related description of the foregoing embodiments, and details are not repeated herein.

Referring to fig. 25 and 26A in combination, fig. 26A is a schematic diagram of a connection circuit between the two-in-one card 7 shown in fig. 25 and an electronic device.

Illustratively, the power interface of the processor 20 is used to transmit power signals and the ground interface is used to transmit ground signals. The power supply signal may be a power supply signal (SIM VCC) of the SIM card or a first power supply signal (NM VCC) of the memory card, and the ground signal may be a ground signal (NM GND) of the memory card or a ground signal (SIM GND) of the SIM card. The power interface and the ground interface may be independent from the SIM card controller 202 and the memory card controller 201, or may be separated and integrated in the SIM card controller 202 and the memory card controller 201, which is not limited in this embodiment of the present invention. In fig. 26A and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 202 and the memory card controller 201, and are respectively identified as power and ground.

In some embodiments, the memory card controller 201 supports the UFS interface protocol. The memory card controller 201 includes four data interfaces (RX +, RX-, TX +, TX-), a second power interface (VCCQ) for transmitting data signals (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card, and a reference clock interface (RCLK) for transmitting a reference clock signal (NM RCLK) of the memory card. The SIM card controller 202 further comprises a DATA interface (DATA) for transmitting the DATA signal (SIM DATA) of the SIM card and a clock interface (CLK) for transmitting the clock signal (SIM CLK) of the SIM card.

Among them, the switch 203 is also connected to the reference clock interface (RCLK) of the memory card controller 201, and seven of the ten elastic pieces of the card connector 11 are connected to the four DATA interfaces (RX +, RX-, TX +, TX-) of the memory card controller 201, the second power interface (VCCQ) of the memory card controller 201, the DATA interface (DATA) of the SIM card controller 202, and the DATA interface (DATA) of the SIM card controller 202 in a one-to-one correspondence.

Illustratively, the four data interfaces (RX +, RX-, TX +, TX-) of the memory card controller 201 are electrically connected to the first, fifth, ninth, and tenth spring plates of the card connector 11, respectively, and the second power interface (VCCQ) of the memory card controller 201 is electrically connected to the second spring plate of the card connector 11. The DATA interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11, and the DATA interface (DATA) of the SIM card controller 202 is electrically connected to the fourth elastic piece of the card connector 11. The switch 203 is connected to the reference clock interface (RCLK) of the memory card controller 201 and the reset interface (RST) of the SIM card controller 202, and the switch 203 is also connected to the sixth elastic piece of the card connector 11. The switch 203 is used to connect the sixth elastic piece with the reference clock interface (RCLK) of the memory card controller 201, or connect the sixth elastic piece with the reset interface (RST) of the SIM card controller 202. The power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11, and the ground interface is electrically connected to the seventh elastic piece of the card connector 11.

In this embodiment, when the two-in-one card 7 is inserted into the electronic device and the memory card circuit 712 of the two-in-one card 7 is working, the memory card controller 201 transmits the data signal (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card between the two-in-one card 7 via the first, fifth, ninth, and tenth elastic pieces, transmits the second power signal (NM VCCQ) of the memory card between the second elastic piece and the two-in-one card 7, and transmits the reference clock signal (NM RCLK) of the memory card between the sixth elastic piece and the two-in-one card 7; the power interface of the processor 20 transmits the first power signal (NM VCC) of the memory card to the two-in-one card 7 through the eighth elastic piece, the ground interface transmits the ground signal (NM GND) of the memory card to the two-in-one card 7 through the seventh elastic piece, and the two-in-one card 7 realizes a data storage function.

When the electronic device needs to store data, the control switch 203 connects the reference clock interface (RCLK) and the sixth elastic piece of the memory card controller 201, the sixth elastic piece sends a signal to the sixth golden finger 726 of the two-in-one card 7, the switching circuit 714 connected to the sixth golden finger 726 identifies the transmission signal or the signal to be transmitted as the reference clock signal (NM RCLK) of the memory card, and the switching circuit 714 connects the sixth golden finger 726 and the reference clock interface (RCLK) of the memory card circuit 712, so as to transmit the reference clock signal (NM RCLK) of the memory card.

In other embodiments, the signal arrangement of the card interface 72 of the two-in-one card 7 may be in other manners. For example, the first gold finger 721 is used to transmit the second power signal (NM VCCQ) of the memory card, the second gold finger 722 is used to transmit one of the data signals (e.g., NM RX +) of the memory card, and the signal arrangement of the other gold fingers is unchanged. At this time, the first gold finger 721 of the two-in-one card 7 is electrically connected to the second power interface (VCCQ) of the memory card circuit 712, the second gold finger 722 is connected to one of the data interfaces (e.g., RX +) of the memory card circuit 712, and the other interfaces are unchanged from the connection circuit of the gold finger; a second power interface (VCCQ) of the memory card controller 201 of the electronic device is electrically connected to the first elastic piece, one of the data interfaces (e.g., RX +) of the memory card controller 201 is electrically connected to the second elastic piece, and the connection circuit between the other interfaces and the elastic pieces of the card connector 11 is unchanged; the two-in-one card 7 and the work flow of the electronic device are adaptively adjusted, and details are not described here.

Referring to table 6, table 6 shows a correspondence table between a plurality of resilient sheets of the card connector 11 and the Nano SIM card 3, the first NM card 4 and the plurality of gold fingers of the two-in-one card 7 shown in fig. 25 and their transmission signals. When the two-in-one card 7 is connected to the card connector 11, the first to tenth elastic pieces of the card connector 11 correspondingly abut against and electrically connect the first gold finger 721 to the tenth gold finger 7210 of the two-in-one card 7, and the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 correspondingly correspond to the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3. In some embodiments, the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

TABLE 6

When the electronic device is compatible with the Nano SIM card 3 and the two-in-one card 7 shown in fig. 25, the SIM card controller 202 of the electronic device may not support programming voltages/input signals. Alternatively, the SIM card controller 202 of the electronic device may also support programming voltages/input signals. At this time, the SIM card controller 202 of the electronic device may further include a programming voltage/input signal interface (VPP), and the processor 20 may set a switch, where the switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the data interface (e.g., RX-) of the memory card controller 201, and is also connected to the fifth elastic piece of the card connector 11. When the electronic device is inserted into the Nano SIM card 3, the switch conducts a programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth elastic sheet; when the electronic device is inserted into the two-in-one card 7, the switch connects the data interface (e.g., RX-) of the memory card controller 201 and the fifth elastic piece.

Referring to fig. 26B and table 6 in combination, fig. 26B is a schematic circuit diagram of a portion of an electronic device according to an embodiment of the present application in other embodiments. The electronic device of this embodiment may include most technical contents of the electronic device corresponding to fig. 26A, and the following mainly explains differences between the two.

In some embodiments, the electronic device is compatible with the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in fig. 25. The processor 20 of the electronic device includes a memory card controller 201, a second memory card controller 206, a SIM card controller 202, and an interface controller 205, wherein the interface controller 205 is electrically connected to the memory card controller 201, the second memory card controller 206, and the SIM card controller 202, and the interface controller 205 is further electrically connected to a plurality of elastic pieces of the card connector 11.

The interface protocol (e.g., UFS interface protocol) of the memory card controller 201 is capable of communicating with the memory card circuit of the two-in-one card 7 for controlling the operation of the memory card circuit of the two-in-one card 7, the SIM card controller 202 is capable of controlling the operation of the Nano SIM card 3, and the interface protocol (e.g., EMMC interface protocol) of the second memory card controller 206 is capable of communicating with the first NM card 4 for controlling the operation of the first NM card 4.

When a different information card is inserted into the card holder assembly 10 of the electronic device and electrically connected to the card connector 11, the interface controller 205 can control the SIM card controller 202 to communicate with the information card via the card connector 11, or the memory card controller 201 and the SIM card controller 202 to communicate with the information card via the card connector 11, or the second memory card controller 206 to communicate with the information card via the card connector 11. For example, when the Nano SIM card 3 is installed in the card holder 2 and the Nano SIM card 3 is inserted into the card socket assembly 10, the interface controller 205 controls the SIM card controller 202 to communicate with the Nano SIM card 3 through the card connector 11; when the first NM card 4 is mounted on the card holder 2 and the first NM card 4 is inserted into the card socket assembly 10, the interface controller 205 controls the second memory card controller 206 to communicate with the first NM card 4 via the card connector 11; when the two-in-one card 7 is mounted on the card holder 2 and the two-in-one card 7 is inserted into the card seat assembly 10, the interface controller 205 controls the memory card controller 201 and the SIM card controller 202 to communicate with the two-in-one card 7 via the card connector 11.

The interface controller 205 may include a plurality of switches, and switch the connection relationship between the plurality of clips of the card connector 11 and the plurality of controllers in the processor 20 through the plurality of switches, so as to implement the communication requirements in different scenarios. The interface controller 205 may also include a plurality of conductors. An exemplary implementation of the interface controller 205 can be seen in fig. 26B, which is not described herein. Other technical contents of this embodiment may refer to the related description of the embodiment corresponding to fig. 26A, and are not described herein again. The switch 203 may be part of the interface controller 205.

In this embodiment, the two-in-one card 7 arranges a high-speed signal (for example, NM RX +) in the first gold finger 721, and since the first gold finger 721 of the two-in-one card 7 has no position corresponding relationship with all the gold fingers of the Nano SIM card 3 and the first NM card 4, no matter the information card inserted into the electronic device is the two-in-one card 7, the Nano SIM card 3 or the first NM card 4, the processor 20 does not need to switch the interface electrically connected with the first elastic piece, so that the circuit of the processor 20 can be simplified, and the design difficulty and the cost can be reduced.

The second power signal (NM VCCQ) of the memory card is arranged on the second golden finger 722 by the two-in-one card 7, and because the second golden finger 722 of the two-in-one card 7 has no position corresponding relation with all golden fingers of the Nano SIM card 3 and the first NM card 4, the second golden finger 722 of the two-in-one card 7 does not need to share the same elastic piece of the card connector 11 of the electronic device with the Nano SIM card 3 and the first NM card 4, so that the risk of burning of the second power signal (NM VCCQ) of the memory card and the data signals of the Nano SIM card 3 and the first NM card 4 when the Nano SIM card 3 and the first NM card 4 are inserted into the electronic device and connected with the card connector 11 is avoided, and the reliability of the electronic device compatible with the Nano SIM card 3, the first NM card 4 and the two-in-one card 7 is high. In addition, the first NM card 4 and the Nano SIM card 3 do not need to be provided with a high voltage tolerant design for avoiding the circuit from being burned out by the second power signal (NM VCCQ) of the memory card, enabling cost reduction.

Referring to fig. 27, fig. 27 is a schematic view of the two-in-one card 7 shown in fig. 17 according to another embodiment.

In some embodiments, the memory card circuit 712 of the two-in-one card 7 supports the PCIE interface protocol. PCIE, also known as PCI Express, is a layered protocol consisting of a transaction layer, a data link layer, and a physical layer. Its main advantages are high data transmission rate, high anti-interference power, long transmission distance and low power consumption. The transmission mode of the PCI Express is changed from parallel to serial of the PCI, and differential transmission is used. The transmission mode transmits the same content through a positive mirror and a negative mirror to improve the efficiency of finding and correcting the interference, and the PCI Express can adopt full duplex, so that the transmission efficiency of the PCI Express is greatly improved compared with that of the PCI. Since 2001, PCI Express was updated from version 1.0 to version 5.0 in 20 years and will be formally updated to version 6.0 in 2021, certainly PCI Express is a popular transport bus standard. For PCIE1.0, the bandwidth is nearly twice that of PCI, while PCI express6.0, which is planned to be released in 2021, has a bandwidth up to 256GB/s. In 2018, SD Association formally announced that SD (Secure Digital) cards are compatible with PCI Express channels, which is a reality compatible with mobile memory cards, and for NM cards, PCI Express has the advantage of providing large bandwidth.

The card interface 72 of the two-in-one card 7 includes first through tenth gold fingers 721 through 7210. Among the first through tenth gold fingers 721 through 7210, one of the gold fingers is used to transmit a DATA signal (SIM DATA) of the SIM card, one of the gold fingers is used to transmit a clock signal (SIM CLK) of the SIM card, four of the gold fingers are used to transmit DATA signals (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card, one of the gold fingers is used to transmit a second power signal (NM VDD 2) of the memory card, one of the gold fingers is used to transmit a reset signal (SIM RST) of the SIM card and a reference clock signal (NM RCLK) of the memory card, one of the gold fingers is used to transmit a ground signal (SIM GND) of the SIM card and a ground signal (NM GND) of the memory card, and one of the gold fingers is used to transmit a power signal (SIM VCC) of the SIM card and a first power signal (NM 1) of the memory card.

Illustratively, the second gold finger 722, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are used for transmitting data signals (NMRX +, NMRX-, NMTX +, NMTX-) of the memory card. The following embodiments are described by taking as an example that the second gold finger 722 is used for transmitting the data signal (NM RX-), the fifth gold finger 725 is used for transmitting the data signal (NM RX +), the ninth gold finger 729 is used for transmitting the data signal (NM TX +), and the tenth gold finger 7210 is used for transmitting the data signal (NM TX-). In other embodiments, the data signals transmitted by the second gold finger 722, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 can be interchanged with each other. For example, the data signals transmitted by the second gold finger 722 and the fifth gold finger 725 are exchanged, and the data signals transmitted by the ninth gold finger 729 and the tenth gold finger 7210 are exchanged, which is not described herein again in other embodiments.

The first gold finger 721 is used to transmit a second power signal (NM VDD 2) of the memory card; the third gold finger 723 is used for transmitting a DATA signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used for transmitting a clock signal (SIM CLK) of the SIM card; the sixth gold finger 726 is used for transmitting a reset signal (SIM RST) of the SIM card and a reference clock signal (NM RCLK) of the memory card; the seventh gold finger 727 is used for transmitting a ground signal (SIM GND) of the SIM card and a ground signal (NMGND) of the memory card; the eighth gold finger 728 is used to transmit a power signal (SIM VCC) of the SIM card and a first power signal (NM VDD 1) of the memory card.

Referring to fig. 27 and table 7 in combination, table 7 is a schematic table of the corresponding relationship between the gold finger and the interface of the circuit of the two-in-one card 7 shown in fig. 27. In the embodiments of the present application, for convenience of illustration, the interfaces of the circuits and the interfaces of the controllers referred to in the following and the drawings are correspondingly identified by signals transmitted by the interfaces and the interfaces.

TABLE 7

In some embodiments, the memory card circuitry 712 includes four data interfaces (RX +, RX-, TX +, TX-), a second power interface (VDD 2), a reference clock interface (RCLK), a ground interface (GND), and a first power interface (VDD 1). The four data interfaces (RX +, RX-, TX +, TX-) of the memory card circuit 712 are used to transmit data signals (NMRX +, NMRX-, NMTX +, NMTX-) of the memory card, the second power interface (VDD 2) of the memory card circuit 712 is used to transmit a second power signal (NMVDD 2) of the memory card, the reference clock interface (RCLK) of the memory card circuit 712 is used to transmit a reference clock signal (NMRCLK) of the memory card, the ground interface (GND) of the memory card circuit 712 is used to transmit a ground signal (NMGND) of the memory card, and the first power interface (VDD 1) of the memory card circuit 712 is used to transmit a first power signal (NMVDD 1) of the memory card.

The second gold finger 722, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are electrically connected to four DATA interfaces (RX +, RX-, TX +, TX-) of the memory card circuit 712, respectively, the first gold finger 721 is electrically connected to the second power interface (VDD 2) of the memory card circuit 712, the third gold finger 723 is electrically connected to the DATA interface (DATA) of the SIM card circuit 713, the fourth gold finger 724 is electrically connected to the clock interface (CLK) of the SIM card circuit 713, the sixth gold finger 726 is electrically connected to the reset interface (RST) of the SIM card circuit 713 and the reference clock interface (RCLK) of the memory card circuit 712 via the switching circuit 714, the seventh gold finger 727 is electrically connected to the ground interface (GND) of the SIM card circuit 713 and the ground interface (GND) of the memory card circuit 712, and the eighth gold finger 728 is electrically connected to the power interface (VCC) of the SIM card circuit 713 and the first power interface (VDD 1) of the memory card circuit 712.

In addition, the second gold finger 722, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 are exclusive gold fingers of the memory card circuit 712, and are used for transmitting high-speed data of the memory card, and the second gold finger 722, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 do not need to perform a switching design of a connection circuit of a high-speed data interface and a low-speed data interface, so that the difficulty in designing the internal circuit of the two-in-one card 7 can be effectively reduced, and the implementation is easy.

In addition, the first gold finger 721, the third gold finger 723 and the fourth gold finger 724 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712, and these gold fingers do not need to be switched to connect circuits, so that the difficulty of designing the internal circuit of the two-in-one card 7 is low, and the implementation is easy.

Referring to fig. 27 and 28A in combination, fig. 28A is a schematic diagram of a connection circuit between the two-in-one card 7 shown in fig. 27 and an electronic device.

Illustratively, the power interface of the processor 20 is used to transmit power signals and the ground interface is used to transmit ground signals. The power supply signal may be a power supply signal (SIM VCC) of the SIM card or a first power supply signal (NM VDD 1) of the memory card, and the ground signal may be a ground signal (NM GND) of the memory card or a ground signal (SIM GND) of the SIM card. The power interface and the ground interface may be independent from the SIM card controller 202 and the memory card controller 201, or may be separated and integrated in the SIM card controller 202 and the memory card controller 201, which is not limited in this embodiment of the present invention. In fig. 28A and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 202 and the memory card controller 201, and are respectively identified as power and ground.

In some embodiments, the memory card controller 201 supports the PCIE interface protocol. The memory card controller 201 includes four data interfaces (RX +, RX-, TX +, TX-), a second power interface (VDD 2), and a reference clock interface (RCLK), the four data interfaces (RX +, RX-, TX +, TX-) are used to transmit data signals (NMRX +, NMRX-, NMTX +, NMTX-) of the memory card, the second power interface (VDD 2) is used to transmit a second power signal (NMVDD 2) of the memory card, and the reference clock interface (RCLK) is used to transmit a reference clock signal (NMRCLK) of the memory card. The SIM card controller 202 further comprises a DATA interface (DATA) for transmitting the DATA signal (SIM DATA) of the SIM card and a clock interface (CLK) for transmitting the clock signal (SIM CLK) of the SIM card.

The switch is further connected to a reference clock interface (RCLK) of the memory card controller 201, and seven of the ten elastic pieces of the card connector 11 are connected to four DATA interfaces (RX +, RX-, TX +, TX-) of the memory card controller 201, a second power interface (VDD 2) of the memory card controller 201, a DATA interface (DATA) of the SIM card controller 202, and a DATA interface (DATA) of the SIM card controller 202 in a one-to-one correspondence.

Illustratively, the four data interfaces (RX +, RX-, TX +, TX-) of the memory card controller 201 are electrically connected to the second, fifth, ninth, and tenth spring plates of the card connector 11, respectively, and the second power interface (VDD 2) of the memory card controller 201 is electrically connected to the first spring plate of the card connector 11. The DATA interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11, and the DATA interface (DATA) of the SIM card controller 202 is electrically connected to the fourth elastic piece of the card connector 11. The switch 203 is connected to the reference clock interface (RCLK) of the memory card controller 201 and the reset interface (RST) of the SIM card controller 202, and the switch 203 is also connected to the sixth elastic piece of the card connector 11. The switch 203 is used to connect the sixth elastic piece with the reference clock interface (RCLK) of the memory card controller 201, or connect the sixth elastic piece with the reset interface (RST) of the SIM card controller 202. The power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11, and the ground interface is electrically connected to the seventh elastic piece of the card connector 11.

In this embodiment, when the two-in-one card 7 is inserted into the electronic device and the memory card circuit 712 of the two-in-one card 7 is working, the memory card controller 201 transmits the data signal (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card between the two-in-one card 7 via the second, fifth, ninth, and tenth elastic pieces, transmits the second power signal (NM VDD 2) of the memory card between the first elastic piece and the two-in-one card 7, and transmits the reference clock signal (NM RCLK) of the memory card between the sixth elastic piece and the two-in-one card 7; the power interface of the processor 20 transmits the first power signal (NM VDD 1) of the memory card to the two-in-one card 7 through the eighth elastic piece, the ground interface transmits the ground signal (NM GND) of the memory card to the two-in-one card 7 through the seventh elastic piece, and the two-in-one card 7 realizes a data storage function.

In other embodiments, the signal arrangement of the card interface 72 of the two-in-one card 7 may be in other manners. For example, the first gold finger 721 is used for transmitting one data signal (e.g. NM RX-) of the memory card, the second gold finger 722 is used for transmitting the second power signal (NM VDD 2) of the memory card, and the signal arrangement of the other gold fingers is not changed. At this time, the first gold finger 721 of the two-in-one card 7 is connected to one of the data interfaces (e.g., RX-) of the memory card circuit 712, the second gold finger 722 is electrically connected to the second power interface (VDD 2) of the memory card circuit 712, and the connection circuit between the other interfaces and the gold finger is not changed; one of the data interfaces (e.g., RX-) of the memory card controller 201 of the electronic device is electrically connected to the first elastic piece, the second power interface (VDD 2) of the memory card controller 201 is electrically connected to the second elastic piece, and the connection circuit between the other interfaces and the elastic pieces of the card connector 11 is unchanged; the two-in-one card 7 and the work flow of the electronic device are adaptively adjusted, and details are not described here.

Referring to fig. 8, table 8 shows a correspondence table between a plurality of resilient sheets of the card connector 11 and the Nano SIM card 3, the first NM card 4 and a plurality of gold fingers of the two-in-one card 7 shown in fig. 27 and their transmission signals. When the two-in-one card 7 is connected to the card connector 11, the first to tenth elastic pieces of the card connector 11 correspondingly abut against and electrically connect the first gold finger 721 to the tenth gold finger 7210 of the two-in-one card 7, and the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 correspondingly correspond to the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3. In some embodiments, the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

TABLE 8

When the electronic device is compatible with the Nano SIM card 3 and the two-in-one card 7 shown in fig. 27, the SIM card controller 202 of the electronic device may not support programming voltages/input signals. Alternatively, the SIM card controller 202 of the electronic device may also support programming voltages/input signals. At this time, the SIM card controller 202 of the electronic device may further include a programming voltage/input signal interface (VPP), and the processor 20 may set a switch, which connects the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the data interface (e.g., RX +) of the memory card controller 201, and also connects the fifth dome of the card connector 11. When the electronic device is inserted into the Nano SIM card 3, the switch conducts a programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth elastic sheet; when the electronic device is inserted into the two-in-one card 7, the switch connects the data interface (e.g., RX +) of the memory card controller 201 and the fifth elastic piece.

Referring to fig. 28B and table 8 in combination, fig. 28B is a schematic circuit diagram of a portion of an electronic device according to an embodiment of the present application in another embodiment. The electronic device of this embodiment may include most technical contents of the electronic device corresponding to fig. 28A, and the following mainly explains differences between the two.

In some embodiments, the electronic device is compatible with the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in fig. 27. The processor 20 of the electronic device includes a memory card controller 201, a second memory card controller 206, a SIM card controller 202, and an interface controller 205, wherein the interface controller 205 is electrically connected to the memory card controller 201, the second memory card controller 206, and the SIM card controller 202, and the interface controller 205 is further electrically connected to a plurality of elastic pieces of the card connector 11.

The interface protocol (e.g., EMMC interface protocol) of the memory card controller 201 can communicate with the memory card circuit of the two-in-one card 7, and is used to control the operation of the memory card circuit of the two-in-one card 7, the SIM card controller 202 is used to control the operation of the Nano SIM card 3, and the interface protocol (e.g., PCIE interface protocol) of the second memory card controller 206 can communicate with the first NM card 4, and is used to control the operation of the first NM card 4.

The interface controller 205 may include a plurality of switches, and switch the connection relationship between the plurality of clips of the card connector 11 and the plurality of controllers in the processor 20 through the plurality of switches, so as to implement the communication requirements in different scenarios. The interface controller 205 may also include a plurality of conductors. An exemplary implementation of the interface controller 205 can be seen in fig. 28B, which is not described herein. Other technical contents of this embodiment may refer to the related description of the embodiment corresponding to fig. 28A, and are not described herein again. The switch 203 may be part of the interface controller 205.

In this embodiment, the two-in-one card 7 arranges the second power signal (NM VDD 2) of the memory card in the first golden finger 721, because the first golden finger 721 of the two-in-one card 7 has no position corresponding relationship with all golden fingers of the Nano SIM card 3 and the first NM card 4, the first golden finger 721 of the two-in-one card 7 does not need to share the same elastic piece of the card connector 11 of the electronic device with the Nano SIM card 3 and the first NM card 4, so as to avoid the risk of the second power signal (NM VDD 2) of the memory card being burned out by the second power signal (NM 2) of the memory card when the Nano SIM card 3 and the first NM card 4 are inserted into the electronic device and connected to the card connector 11, and the electronic device is highly reliable when the electronic device is compatible with the Nano SIM card 3, the first NM card 4 and the two-in-one card 7. In addition, the first NM card 4 and the Nano SIM card 3 do not need to be provided with a high voltage tolerant design for avoiding the circuit being burned by the second power supply signal (NM VDD 2) of the memory card, which can reduce the cost.

The two-in-one card 7 arranges a high-speed signal (such as NM RX-) on the second gold finger 722, and since the second gold finger 722 of the two-in-one card 7 has no position corresponding relation with all the gold fingers of the Nano SIM card 3 and the first NM card 4, no matter the information card inserted into the electronic device is the two-in-one card 7, the Nano SIM card 3 or the first NM card 4, the processor 20 does not need to switch the interface electrically connected with the second elastic piece, so that the circuit of the processor 20 can be simplified, and the design difficulty and the cost can be reduced.

Referring to fig. 29, fig. 29 is a schematic view of the two-in-one card 7 shown in fig. 17 according to another embodiment.

In some embodiments, the memory card circuit 712 of the two-in-one card 7 employs the EMMC interface protocol. The card interface 72 of the two-in-one card 7 includes first through tenth gold fingers 721 through 7210. Among the first through tenth gold fingers 721 through 7210, one of the gold fingers is used to transmit a DATA signal (SIM DATA) of the SIM card, one of the gold fingers is used to transmit a reset signal (SIM RST) of the SIM card, four of the gold fingers are used to transmit DATA signals (NM DATA0, NM DATA1, NM DATA2, NM DATA 3) of the memory card, one of the gold fingers is used to transmit a command and response signal (NM CMD) of the memory card, one of the gold fingers is used to transmit a clock signal (SIM CLK) of the SIM card and a clock signal (NM CLK) of the memory card, one of the gold fingers is used to transmit a ground signal (SIM GND) of the SIM card and a ground signal (NM GND) of the memory card, and one of the gold fingers is used to transmit a power supply signal (SIM VCC) of the SIM card and a power supply signal (NM VCC) of the memory card.

The third gold finger 723 is used for transmitting a DATA signal (SIM DATA) of the SIM card; the fourth golden finger 724 is used for transmitting a clock signal (SIM CLK) of the SIM card and a clock signal (NMCLK) of the memory card; the fifth finger 725 is used to transmit a command and response signal (NM CMD) of the memory card; the sixth gold finger 726 is used for transmitting a reset signal (SIM RST) of the SIM card; the seventh gold finger 727 is used for transmitting a ground signal (SIM GND) of the SIM card and a ground signal (NMGND) of the memory card; the eighth gold finger 728 is used to transmit a power supply signal (SIM VCC) of the SIM card and a power supply signal (NM VCC) of the memory card.

Referring to fig. 29 and table 9, table 9 is a schematic table of the corresponding relationship between the gold finger and the interface of the circuit of the two-in-one card 7 shown in fig. 29. In the embodiments of the present application, for convenience of illustration, the interfaces of the circuits and the interfaces of the controllers referred to in the following and the drawings are correspondingly identified by signals transmitted by the interfaces and the interfaces.

TABLE 9

The two-in-one card 7 further includes a frequency divider 715. The first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are electrically connected to four DATA interfaces (DATA 0, DATA1, DATA3 and DATA 2) of the memory card circuit 712, respectively, the third gold finger 723 is electrically connected to the DATA interface (DATA) of the SIM card circuit 713, the fourth gold finger 724 is electrically connected to the clock interface (CLK) of the memory card circuit 712 and is electrically connected to the clock interface (CLK) of the SIM card circuit 713 via the frequency divider 715, the fifth gold finger is electrically connected to the command and response multiplexing interface (CMD) of the memory card circuit 712, the sixth gold finger 726 is electrically connected to the reset interface (RST) of the SIM card circuit 713, the seventh gold finger 727 is electrically connected to the ground interface (GND) of the SIM card circuit 713 and the ground interface (725) of the memory card circuit 712, and the eighth gold finger 728 is electrically connected to the power interface (VCC) of the SIM card circuit 713 and the power interface (VCC) of the memory card circuit 712.

In addition, the third gold finger 723, the fifth gold finger 725, and the sixth gold finger 726 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712, and these gold fingers also do not need to perform a switching design of a connection circuit, so that the internal circuit design difficulty of the two-in-one card 7 is low, and the implementation is easy.

Illustratively, divider 715 is used to change the frequency of the signal. In this embodiment, the divider 715 is configured to enable the initial clock signal transmitted by the fourth gold finger 724 to be the clock signal (NM CLK) of the memory card, the clock signal (NM CLK) of the memory card is directly transmitted to the clock interface (CLK) of the memory card circuit 712, the frequency divider 715 performs frequency adjustment on the clock signal (NM CLK) of the memory card to form the clock signal (SIM CLK) of the SIM card, and then the clock signal (SIM CLK) of the SIM card is transmitted to the clock interface (CLK) of the SIM card circuit 713. For example, the frequency of the clock signal (NM CLK) of the memory card is 200MHz, and the frequency can be adjusted to 5MHz by the frequency divider 715 to form the clock signal (SIM CLK) of the SIM card.

In this embodiment, the two-in-one card 7 can realize multiplexing of the clock signal (NM CLK) of the memory card and the clock interface (CLK) of the SIM card circuit 713 through the same gold finger (i.e., the fourth gold finger 724), so that the integration level of the card interface 72 of the two-in-one card 7 is high, and the fourth gold finger 724 does not need to perform connection circuit switching, and therefore the two-in-one card 7 is low in implementation difficulty and easy to implement, and the reliability of the two-in-one card 7 is high. The clock signal (NM CLK) of the memory card and the clock interface (CLK) of the SIM card circuit 713 may be time-division multiplexed with the fourth gold finger 724, or the fourth gold finger 724 may be used synchronously, which is not limited in this application.

Referring to fig. 29 and 30 in combination, fig. 30 is a schematic diagram of a connection circuit between the two-in-one card 7 shown in fig. 29 and an electronic device.

In some embodiments, when the two-in-one card 7 is inserted into the card socket assembly of the electronic device and electrically connected to the card connector 11, the first to tenth resilient sheets of the card connector 11 correspondingly abut against and electrically connect the first to tenth gold fingers 721 to 7210 of the two-in-one card 7. Illustratively, the processor 20 of the electronic device may include a memory card controller 201, a SIM card controller 202, a frequency divider 204, a power interface, and a ground interface. The memory card controller 201 may be used to control the operation of the memory card circuitry of the two-in-one card 7, and the SIM card controller 202 may be used to control the operation of the SIM card circuitry of the two-in-one card 7. The plurality of controllers of the processor 20 may be independent components, may be combined by an integrated component, or may be split into a plurality of components by one controller, which is not strictly limited in this embodiment of the present application. The plurality of controllers of the processor 20 may be independent components, may be combined by an integrated component, or may be split into a plurality of components by one controller, which is not strictly limited in this embodiment of the present application.

Illustratively, the power interface of the processor 20 is used to transmit power signals and the ground interface is used to transmit ground signals. The power supply signal may be a power supply signal (SIM VCC) of the SIM card or a power supply signal (NM VCC) of the memory card, and the ground signal may be a ground signal (NM GND) of the memory card or a ground signal (SIM GND) of the SIM card. The power interface and the ground interface may be independent from the SIM card controller 202 and the memory card controller 201, or may be separated and integrated in the SIM card controller 202 and the memory card controller 201, which is not limited in this embodiment of the present invention. In fig. 30 and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 202 and the memory card controller 201, and are respectively identified as power and ground.

Illustratively, the memory card controller 201 supports the EMMC interface protocol, and the memory card controller 201 includes a clock interface (CLK) for transferring a clock signal (NM CLK) of the memory card. The SIM card controller 202 comprises a clock interface (CLK) for transferring a clock signal (SIM CLK) of the SIM card. The clock interface (CLK) of the memory card controller 201 is connected to one of the ten spring pieces of the card connector 11, and the clock interface (CLK) of the memory card controller 201 is connected to the clock interface (CLK) of the SIM card controller 202 via the frequency divider 204.

In this embodiment, the frequency divider 204 connects the clock interface (CLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202, and the frequency divider 204 is configured to perform frequency adjustment on the clock signal (NM CLK) of the memory card transmitted by the clock interface (CLK) of the memory card controller 201 to form the clock signal (SIM CLK) of the SIM card and transmit the clock signal (NM CLK) to the clock interface (CLK) of the SIM card controller 202, so that the SIM card controller 202 and the memory card controller 201 realize clock alignment. For example, the frequency of the clock signal (NM CLK) of the memory card is 200MHz, and the frequency can be adjusted to 5MHz by the frequency divider 204 to form the clock signal (SIM CLK) of the SIM card.

Because the processor 20 of the electronic device provides the clock signal (NM CLK) of the memory card through one of the elastic pieces of the card connector 11, so as to provide the required clock signal for the two-in-one card 7, and at the same time, the clock interface (CLK) of the memory card controller 201 is connected with the clock interface (CLK) of the SIM card controller 202 through the frequency divider 204, so that the clock of the SIM card controller 202 can be aligned with the memory card controller 201, so as to improve the communication efficiency and communication quality of the electronic device and the two-in-one card 7.

Illustratively, the memory card controller 201 supports the EMMC interface protocol. The memory card controller 201 also includes four DATA interfaces (DATA 0, DATA1, DATA2, DATA 3) for transmitting DATA signals (NM DATA0, NM DATA1, NM DATA2, NM DATA 3) of the memory card and a command and response multiplexing interface (CMD) for transmitting command and response signals (NM CMD) of the memory card. The SIM card controller 202 also comprises a reset interface (RST) for transmitting a reset signal (SIM RST) of the SIM card and a DATA interface (DATA) for transmitting a DATA signal (SIM DATA) of the SIM card.

Seven of the ten spring pieces of the card connector 11 are connected to the four DATA interfaces (DATA 0, DATA1, DATA3, DATA 2) of the memory card controller 201, the command and response multiplexing interface (CMD) of the memory card controller 201, the DATA interface (DATA) of the SIM card controller 202, and the reset interface (RST) of the SIM card controller 202 in a one-to-one correspondence.

Illustratively, the four DATA interfaces (DATA 0, DATA1, DATA3, DATA 2) of the memory card controller 201 are electrically connected to the first, second, ninth and tenth spring pieces of the card connector 11 in a one-to-one correspondence, the clock interface (CLK) of the memory card controller 201 is electrically connected to the fourth spring piece of the card connector 11, and the command and response multiplexing interface (CMD) of the memory card controller 201 is electrically connected to the fifth spring piece of the card connector. The DATA interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11, and the reset interface (RST) of the SIM card controller 202 is electrically connected to the sixth elastic piece of the card connector 11. The power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11, and the ground interface is electrically connected to the seventh elastic piece of the card connector 11.

In this embodiment, when the two-in-one card 7 is inserted into the electronic device and the memory card circuit 712 of the two-in-one card 7 is working, the memory card controller 201 transmits the DATA signals (NM DATA0, NM DATA1, NM DATA3, NM DATA 2) of the memory card between the two-in-one card 7 via the first, second, ninth, and tenth elastic pieces, transmits the command and response signals (NM CMD) of the memory card between the fifth elastic piece and the two-in-one card 7, and transmits the clock signal (NM CLK) of the memory card between the fourth elastic piece and the two-in-one card 7; the power interface of the processor 20 transmits the power signal (NM VCC) of the memory card to the two-in-one card 7 through the eighth elastic piece, the ground interface transmits the ground signal (NM GND) of the memory card to the two-in-one card 7 through the seventh elastic piece, and the two-in-one card 7 realizes a data storage function.

When the two-in-one card 7 is inserted into the electronic device and the SIM card circuit 713 of the two-in-one card 7 operates, the SIM card controller 202 receives the clock signal sent by the memory card controller 201 and adjusted by the frequency divider 204, and the SIM card controller 202 transmits the DATA signal (SIM DATA) of the SIM card to the two-in-one card 7 through the third elastic piece; the power interface of the processor 20 transmits the power signal (SIM VCC) of the SIM card between the eighth elastic piece and the two-in-one card 7, the ground interface transmits the ground signal (SIM GND) of the SIM card between the seventh elastic piece and the two-in-one card 7, and the two-in-one card 7 realizes the functions of communication and data communication.

When the electronic device needs to reset the SIM card circuit 713 of the two-in-one card 7, the SIM card controller 202 transmits a reset signal (SIM RST) of the SIM card to the two-in-one card 7 through the sixth elastic piece, so as to control the SIM card circuit 713 to reset.

In other embodiments, the frequency divider 204 may not be provided in the processor 20, and the frequency divider 715 may not be provided in the two-in-one card 7. In the processor 20 of the electronic device, the clock interface (CLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202 are both electrically connected to the fourth elastic piece of the card connector 11. In the two-in-one card 7, the clock interface (CLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are electrically connected to the fourth gold finger 724 of the card interface 72. The memory card controller 201 sends the clock signal (NM CLK) of the memory card to the fourth gold finger 724 via the fourth spring, the SIM card controller 202 sends the clock signal (SIM CLK) of the SIM card to the fourth gold finger 724 via the fourth spring, and the memory card circuit 712 and the SIM card circuit 713 perform corresponding processing according to the received signals, that is, only the clock signal recognizable by the circuit is processed. For example, when the signal transmitted by the fourth gold finger 724 is only the clock signal (NM CLK) of the memory card, the memory card circuit 712 processes the clock signal (NM CLK) of the memory card; when the signal transmitted by the fourth gold finger 724 is only the clock signal (SIM CLK) of the SIM card, the SIM card circuit 713 processes the clock signal (SIM CLK) of the SIM card; when the signal transmitted by the fourth gold finger 724 includes a memory card clock signal (NM CLK) and a SIM card clock signal (SIM CLK), the memory card circuit 712 processes the memory card clock signal (NM CLK), for example, acquiring signals above 100MHz, and the SIM card circuit 713 processes the SIM card clock signal (SIM CLK), for example, acquiring signals below 5 MHz.

In some other embodiments, the frequency divider 204 may not be provided in the processor 20, and the frequency divider 715 may not be provided in the two-in-one card 7, so as to increase the frequency of the clock signal (SIM CLK) of the SIM card to be the same as the frequency of the clock signal (NM CLK) of the memory card, for example, to increase the frequency of the clock signal (SIM CLK) of the SIM card to the 19.2MHz frequency or the 20MHz frequency required by the clock signal (NM CLK) of the memory card, so as to achieve the sharing of the clocks. At this time, in the electronic device, the clock interface (CLK) of the memory card controller 201 is electrically connected to the clock interface (CLK) of the SIM card controller 202, and one of the clock interfaces is electrically connected to the fourth elastic piece of the card connector 11. In the two-in-one card 7, the clock interface (CLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are electrically connected to the fourth gold finger 724.

In other embodiments, the frequency divider 204 may be replaced by a switch in the processor 20, and the frequency divider 715 may not be provided in the two-in-one card 7. At this time, in the processor 20 of the electronic device, the switch is connected to the clock interface (CLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202, and is also connected to the fourth elastic sheet; in the two-in-one card 7, the clock interface (CLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are electrically connected to the fourth gold finger 724. The electronic equipment provides a clock signal of the memory card and a clock signal of the SIM card through time division multiplexing of the same elastic sheet, provides the clock signal of the SIM card when the SIM card service exists, and provides the clock signal of the memory card when the memory card service exists. In some cases, if the clock signal of the SIM card and the clock signal of the memory card are the same, the same clock signal may be provided. In some cases, if the SIM card and the memory card have services at the same time, the clock signal of the SIM card may be preferentially provided, and the provision of the clock signal of the memory card may be resumed after the SIM card finishes the services. In some other embodiments, in the case where the processor 20 replaces the frequency divider 204 with a switch, the frequency divider 715 in the two-in-one card 7 may also be replaced with a switch.

It is understood that there are other schemes for implementing the multiplexing of the clock signal (NM CLK) of the memory card and the clock signal (SIM CLK) of the SIM card with the fourth gold finger 724 for transmission, and this is not strictly limited in this application.

Referring to table 10, table 10 is a table of correspondence between a plurality of resilient sheets of the card connector 11 and a plurality of gold fingers and transmission signals of the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in fig. 29. When the two-in-one card 7 is connected to the card connector 11, the first to tenth elastic pieces of the card connector 11 correspondingly abut against and electrically connect the first gold finger 721 to the tenth gold finger 7210 of the two-in-one card 7, and the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 correspondingly correspond to the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3. In some embodiments, the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

Watch 10

When the electronic device is compatible with the Nano SIM card 3 and the two-in-one card 7 shown in fig. 29, the SIM card controller 202 of the electronic device may not support programming voltages/input signals. Alternatively, the SIM card controller 202 of the electronic device may also support programming voltages/input signals. At this time, the SIM card controller 202 of the electronic device may further include a programming voltage/input signal interface (VPP), and the processor 20 may set a switch, where the switch connects the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the command and response multiplexing interface (CMD) of the memory card controller 201, and further connects the fifth elastic piece of the card connector 11. When the electronic device is inserted into the Nano SIM card 3, the switch conducts a programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth elastic sheet; when the electronic device is inserted into the two-in-one card 7, the switch connects the command and response multiplexing interface (CMD) and the fifth elastic piece of the memory card controller 201.

In other embodiments, the present application further provides an electronic device, which is compatible with the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in fig. 29. The processor of the electronic device may include a memory card controller, a SIM card controller, and an interface controller, where the interface controller is electrically connected to the memory card controller and the SIM card controller, and the interface controller is further electrically connected to the plurality of elastic pieces of the card connector 11. An interface protocol (e.g., EMMC interface protocol) of the memory card controller can communicate with the memory card circuits of the first NM card 4 and the two-in-one card 7, for controlling the operation of the first NM card 4 and the operation of the memory card circuits of the two-in-one card 7, and the SIM card controller 202 is for controlling the operation of the Nano SIM card 3. When a different information card is inserted into the card-holder assembly of the electronic device and electrically connected to the card connector 11, the interface controller can control the memory card controller and/or the SIM card controller to communicate with the information card via the card connector. For example, when the Nano SIM card 3 is installed on the card holder 2 and the Nano SIM card 3 is inserted into the card seat assembly 10, the interface controller controls the SIM card controller to communicate with the Nano SIM card 3 through the card connector 11; when the first NM card 4 is installed on the card holder 2 and the first NM card 4 is inserted into the card seat assembly 10, the interface controller controls the memory card controller to communicate with the first NM card 4 through the card connector 11; when the two-in-one card 7 is installed on the card holder 2 and the two-in-one card 7 is inserted into the card seat assembly 10, the interface controller controls the memory card controller and the SIM card controller to communicate with the two-in-one card 7 through the card connector 11.

The interface controller may include a plurality of switches, and the connection relationship between the plurality of clips of the card connector 11 and the plurality of controllers in the processor is switched through the plurality of switches, so as to meet the communication requirements in different scenarios. The interface controller may also include a plurality of wires. Other technical contents of this embodiment may refer to the related description of the embodiment corresponding to fig. 30, and are not described herein again.

Referring to fig. 31, fig. 31 is a schematic view of the two-in-one card 7 shown in fig. 17 according to another embodiment.

In some embodiments, the memory card circuit 712 of the two-in-one card 7 supports the UFS interface protocol. The card interface 72 of the two-in-one card 7 includes first through tenth gold fingers 721 through 7210. Among the first through tenth gold fingers 721 through 7210, one of the gold fingers is used to transmit a DATA signal (SIM DATA) of the SIM card, one of the gold fingers is used to transmit a reset signal (SIM RST) of the SIM card, four of the gold fingers are used to transmit DATA signals (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card, one of the gold fingers is used to transmit a second power signal (NM VCCQ) of the memory card, one of the gold fingers is used to transmit a clock signal (SIM CLK) of the SIM card and a reference clock signal (NM RCLK) of the memory card, one of the gold fingers is used to transmit a ground signal (SIM GND) of the SIM card and a ground signal (NM GND) of the memory card, and one of the gold fingers is used to transmit a power signal (SIM VCC) of the SIM card and a first power signal (NM VCC) of the memory card.

The third gold finger 723 is used for transmitting a DATA signal (SIM DATA) of the SIM card; the fourth golden finger 724 is used for transmitting a clock signal (SIM CLK) of the SIM card and a reference clock signal (NMRCLK) of the memory card; the second gold finger 722 is used for transmitting a second power supply signal (NM VCCQ) of the memory card; the sixth gold finger 726 is used for transmitting a reset signal (SIM RST) of the SIM card; the seventh gold finger 727 is used for transmitting a ground signal (SIM GND) of the SIM card and a ground signal (NMGND) of the memory card; the eighth gold finger 728 is used to transmit a power supply signal (SIM VCC) of the SIM card and a first power supply signal (NM VCC) of the memory card.

Referring to fig. 31 and table 11 in combination, table 11 is a schematic table of the corresponding relationship between the gold finger and the interface of the circuit of the two-in-one card 7 shown in fig. 31. In the embodiments of the present application, for convenience of illustration, the interfaces of the circuits and the interfaces of the controllers referred to in the following and the drawings are correspondingly identified by signals transmitted by the interfaces and the interfaces.

TABLE 11

In some embodiments, the memory card circuitry 712 includes four data interfaces (RX +, RX-, TX +, TX-), a reference clock interface (RCLK), a second power interface (VCCQ), a ground interface (GND), and a first power interface (VCC). The four data interfaces (RX +, RX-, TX +, TX-) of the memory card circuit 712 are used to transmit data signals (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card, the reference clock interface (RCLK) of the memory card circuit 712 is used to transmit a reference clock signal (NM RCLK) of the memory card, the second power interface (VCCQ) of the memory card circuit 712 is used to transmit a second power signal (NM VCCQ) of the memory card, the ground interface (GND) of the memory card circuit 712 is used to transmit a ground signal (NM GND) of the memory card, and the first power interface (VCC) of the memory card circuit 712 is used to transmit a first power signal (NM VCC) of the memory card. The interface of the memory card circuit 712 described above may be located in the control portion of the memory card circuit 712.

The first gold finger 721, the fifth gold finger 725, the ninth gold finger 729, and the tenth gold finger 7210 of the two-in-one card 7 are electrically connected to four DATA interfaces (RX +, RX-, TX +, TX-) of the memory card circuit 712, respectively, the second gold finger 722 is electrically connected to the second power interface (VCCQ) of the memory card circuit 712, the third gold finger 723 is electrically connected to the DATA interface (DATA) of the SIM card circuit 713, the fourth gold finger 724 is electrically connected to the reference clock interface (CLK) of the memory card circuit 712, and is electrically connected to the clock interface (CLK) of the SIM card circuit 713 via the frequency divider 715, the sixth gold finger 726 is electrically connected to the reset interface (RST) of the SIM card circuit 713, the seventh gold finger 727 is electrically connected to the ground interface (GND) of the SIM card circuit 713 and the ground interface (GND) of the memory card circuit 712, and the eighth gold finger 728 is electrically connected to the power interface (VCC) of the SIM card circuit 713 and the first power interface (VCC) of the memory card circuit 712.

In addition, the second gold finger 722, the third gold finger 723 and the sixth gold finger 726 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712, and these gold fingers also do not need to perform a switching design of a connection circuit, so that the difficulty of designing the internal circuit of the two-in-one card 7 is low, and the implementation is easy.

Illustratively, divider 715 is used to change the frequency of the signal. In this embodiment, the divider 715 is configured to enable the initial clock signal transmitted by the fourth gold finger 724 to be the reference clock signal (NM RCLK) of the memory card, the reference clock signal (NM RCLK) of the memory card is directly transmitted to the reference clock interface (RCLK) of the memory card circuit 712, the divider 715 performs frequency adjustment on the reference clock signal (NM RCLK) of the memory card to form the clock signal (SIM CLK) of the SIM card, and then transmits the clock signal (SIM CLK) of the SIM card to the clock interface (CLK) of the SIM card circuit 713. For example, the frequency of the reference clock signal (NM RCLK) of the memory card is 200MHz, and the frequency can be adjusted to 5MHz by the frequency divider 715, forming the clock signal (SIM CLK) of the SIM card.

In this embodiment, the two-in-one card 7 can realize multiplexing of the reference clock signal (NM RCLK) of the memory card and the clock interface (CLK) of the SIM card circuit 713 through the same gold finger (i.e., the fourth gold finger 724), so that the integration level of the card interface 72 of the two-in-one card 7 is high, and the fourth gold finger 724 does not need to perform switching of the connection circuit, and the two-in-one card 7 has low implementation difficulty and is easy to implement, so that the reliability of the two-in-one card 7 is high. The reference clock signal (NM RCLK) of the memory card and the clock interface (CLK) of the SIM card circuit 713 may time-division multiplex the fourth gold finger 724, or may synchronously use the fourth gold finger 724, which is not strictly limited in this application.

Referring to fig. 31 and 32 in combination, fig. 32 is a schematic diagram of a connection circuit between the two-in-one card 7 shown in fig. 31 and an electronic device.

Illustratively, the power interface of the processor 20 is used to transmit power signals and the ground interface is used to transmit ground signals. The power supply signal may be a power supply signal (SIM VCC) of the SIM card or a first power supply signal (NM VCC) of the memory card, and the ground signal may be a ground signal (NM GND) of the memory card or a ground signal (SIM GND) of the SIM card. The power interface and the ground interface may be independent from the SIM card controller 202 and the memory card controller 201, or may be separated and integrated in the SIM card controller 202 and the memory card controller 201, which is not limited in this embodiment of the present invention. In fig. 32 and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 202 and the memory card controller 201, and are respectively identified as power and ground.

Illustratively, the memory card controller 201 supports the UFS interface protocol. The memory card controller 201 includes a reference clock interface (RCLK) for transferring a reference clock signal (NM RCLK) of the memory card. The SIM card controller 202 comprises a clock interface (CLK) for transferring a clock signal (SIM CLK) of the SIM card. The reference clock interface (RCLK) of the memory card controller 201 is connected to one of the ten spring pieces of the card connector 11, and the reference clock interface (RCLK) of the memory card controller 201 is connected to the clock interface (CLK) of the SIM card controller 202 via the frequency divider 204.

In this embodiment, the frequency divider 204 is connected to the reference clock interface (RCLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202, and the frequency divider 204 is configured to perform frequency adjustment on the reference clock signal (NM RCLK) of the memory card transmitted by the reference clock interface (RCLK) of the memory card controller 201 to form the clock signal (SIM CLK) of the SIM card and transmit the clock signal (NM RCLK) to the clock interface (CLK) of the SIM card controller 202, so that the SIM card controller 202 and the memory card controller 201 realize clock alignment. For example, the frequency of the reference clock signal (NM RCLK) of the memory card is 200MHz, and the frequency can be adjusted to 5MHz by the frequency divider 204 to form the clock signal (SIM CLK) of the SIM card.

Because the processor 20 of the electronic device provides the reference clock signal (NM RCLK) of the memory card through one of the elastic pieces of the card connector 11, so as to provide the required clock signal for the two-in-one card 7, and at the same time, the reference clock interface (RCLK) of the memory card controller 201 is connected with the clock interface (CLK) of the SIM card controller 202 through the frequency divider 204, so that the clock of the SIM card controller 202 can be aligned with the memory card controller 201, so as to improve the communication efficiency and communication quality of the electronic device and the two-in-one card 7.

Illustratively, the memory card controller 201 further includes four data interfaces (RX +, RX-, TX +, TX-) for transmitting data signals (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card and a second power interface (VCCQ) for transmitting a second power signal (NM VCCQ) of the memory card. The SIM card controller 202 also comprises a reset interface (RST) for transmitting a reset signal (SIM RST) of the SIM card and a DATA interface (DATA) for transmitting a DATA signal (SIM DATA) of the SIM card.

Seven of the ten spring pieces of the card connector 11 are connected to four DATA interfaces (RX +, RX-, TX +, TX-) of the memory card controller 201, the second power interface (VCCQ) of the memory card controller 201, the DATA interface (DATA) of the SIM card controller 202, and the reset interface (RST) of the SIM card controller 202 in a one-to-one correspondence.

Illustratively, the four data interfaces (RX +, RX-, TX +, TX-) of the memory card controller 201 are electrically connected to the first, fifth, ninth, and tenth spring plates of the card connector 11 in a one-to-one correspondence, the second power interface (VCCQ) is electrically connected to the second spring plate of the card connector 11, and the reference clock interface (RCLK) is electrically connected to the fourth spring plate of the card connector 11. The DATA interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11, and the reset interface (RST) of the SIM card controller 202 is electrically connected to the sixth elastic piece of the card connector 11. The power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11, and the ground interface is electrically connected to the seventh elastic piece of the card connector 11.

In this embodiment, when the two-in-one card 7 is inserted into the electronic device and the memory card circuit 712 of the two-in-one card 7 is working, the memory card controller 201 transmits the data signal (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card between the two-in-one card 7 via the first, fifth, ninth, and tenth elastic pieces, transmits the second power signal (NM VCCQ) of the memory card between the second elastic piece and the two-in-one card 7, and transmits the reference clock signal (NM RCLK) of the memory card between the fourth elastic piece and the two-in-one card 7; the power interface of the processor 20 transmits the first power signal (NM VCC) of the memory card to the two-in-one card 7 through the eighth elastic piece, the ground interface transmits the ground signal (NM GND) of the memory card to the two-in-one card 7 through the seventh elastic piece, and the two-in-one card 7 realizes a data storage function.

When the two-in-one card 7 is inserted into the electronic device and the SIM card circuit 713 of the two-in-one card 7 operates, the SIM card controller 202 receives the clock signal sent by the memory card controller 201 and adjusted by the frequency divider 204, and the SIM card controller 202 transmits the DATA signal (SIM DATA) of the SIM card to the two-in-one card 7 through the third elastic piece; the power interface of the processor 20 transmits the power signal (SIM VCC) of the SIM card between the eighth elastic piece and the two-in-one card 7, the ground interface transmits the ground signal (SIM GND) of the SIM card between the seventh elastic piece and the two-in-one card 7, and the two-in-one card 7 realizes the functions of communication and data communication. When the electronic device needs to reset the SIM card circuit 713 of the two-in-one card 7, the SIM card controller 202 transmits a reset signal (SIM RST) of the SIM card to the two-in-one card 7 through the sixth elastic piece, so as to control the SIM card circuit 713 to reset.

In other embodiments, the frequency divider 204 may not be provided in the processor 20, and the frequency divider 715 may not be provided in the two-in-one card 7. In the processor 20 of the electronic device, the reference clock interface (RCLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202 are both electrically connected to the fourth elastic piece of the card connector 11. In the two-in-one card 7, the reference clock interface (RCLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are electrically connected to the fourth gold finger 724 of the card interface 72. The memory card controller 201 sends the reference clock signal (NM RCLK) of the memory card to the fourth golden finger 724 via the fourth elastic piece, the SIM card controller 202 sends the clock signal (SIM CLK) of the SIM card to the fourth golden finger 724 via the fourth elastic piece, and the memory card circuit 712 and the SIM card circuit 713 perform corresponding processing according to the received signals, that is, only the clock signal recognizable by the circuits is processed. For example, when the signal transmitted by the fourth golden finger 724 is only the reference clock signal (NMRCLK) of the memory card, the memory card circuitry 712 processes the reference clock signal (NMRCLK) of the memory card; when the signal transmitted by the fourth gold finger 724 is only the clock signal (SIM CLK) of the SIM card, the SIM card circuit 713 processes the clock signal (SIM CLK) of the SIM card; when the signal transmitted by the fourth gold finger 724 has the reference clock signal (NM RCLK) of the memory card and the clock signal (SIM CLK) of the SIM card, the memory card circuit 712 processes the reference clock signal (NM RCLK) of the memory card, for example, collects signals above 100MHz, and the SIM card circuit 713 processes the clock signal (SIM CLK) of the SIM card, for example, collects signals below 5 MHz.

In some other embodiments, the frequency divider 204 may not be provided in the processor 20, and the frequency divider 715 may not be provided in the two-in-one card 7, so as to increase the frequency of the clock signal (SIM CLK) of the SIM card to be the same as the frequency of the reference clock signal (NM RCLK) of the memory card, for example, to increase the frequency of the clock signal (SIM CLK) of the SIM card to the 19.2MHz frequency or the 20MHz frequency required by the reference clock signal (NM RCLK) of the memory card, so as to implement the sharing of the clocks. At this time, in the electronic device, the reference clock interface (RCLK) of the memory card controller 201 is electrically connected to the clock interface (CLK) of the SIM card controller 202, and one of the clock interfaces is electrically connected to the fourth elastic piece of the card connector 11. In the two-in-one card 7, the reference clock interface (RCLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are electrically connected to the fourth gold finger 724.

In other embodiments, the frequency divider 204 may be replaced by a switch in the processor 20, and the frequency divider 715 may not be provided in the two-in-one card 7. At this time, in the processor 20 of the electronic device, the switch is connected to the reference clock interface (RCLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202, and is also connected to the fourth elastic piece; in the two-in-one card 7, the reference clock interface (RCLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are electrically connected to the fourth gold finger 724. The electronic equipment provides a reference clock signal of the memory card and a clock signal of the SIM card through time division multiplexing of the same elastic sheet, provides the clock signal of the SIM card when the SIM card service exists, and provides the reference clock signal of the memory card when the memory card service exists. In some cases, if the clock signal of the SIM card and the reference clock signal of the memory card are the same, the same clock signal may be provided. In some cases, if the SIM card and the memory card have services simultaneously, the clock signal of the SIM card may be preferentially provided, and the reference clock signal of the memory card is restored after the SIM card finishes the services. In some other embodiments, in the case where the processor 20 replaces the frequency divider 204 with a switch, the frequency divider 715 in the two-in-one card 7 may also be replaced with a switch.

It is understood that there are other schemes for implementing the multiplexing of the fourth gold finger 724 by the reference clock signal (NM RCLK) of the memory card and the clock signal (SIM CLK) of the SIM card, and this is not strictly limited in this application.

Referring to table 12, table 12 is a table of correspondence between a plurality of resilient sheets of the card connector 11 and the Nano SIM card 3, the first NM card 4 and a plurality of gold fingers of the two-in-one card 7 shown in fig. 31 and their transmission signals. When the two-in-one card 7 is connected to the card connector 11, the first to tenth elastic pieces of the card connector 11 correspondingly abut against and electrically connect the first gold finger 721 to the tenth gold finger 7210 of the two-in-one card 7, and the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 correspondingly correspond to the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3. In some embodiments, the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

TABLE 12

When the electronic device is compatible with the Nano SIM card 3 and the two-in-one card 7 shown in fig. 31, the SIM card controller 202 of the electronic device may not support programming voltages/input signals. Alternatively, the SIM card controller 202 of the electronic device may also support programming voltages/input signals. At this time, the SIM card controller 202 of the electronic device may further include a programming voltage/input signal interface (VPP), and the processor 20 may set a switch, where the switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the data interface (e.g., RX-) of the memory card controller 201, and is also connected to the fifth elastic piece of the card connector 11. When the electronic device is inserted into the Nano SIM card 3, the switch conducts a programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth elastic sheet; when the electronic device is inserted into the two-in-one card 7, the switch connects the data interface (e.g., RX-) of the memory card controller 201 and the fifth elastic piece.

In other embodiments, the present application further provides an electronic device, which is compatible with the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in fig. 31. The processor of the electronic device may include a memory card controller, a second memory card controller, a SIM card controller, and an interface controller, where the interface controller is electrically connected to the memory card controller, the second memory card controller, and the SIM card controller, and the interface controller is further electrically connected to the plurality of elastic pieces of the card connector 11.

The interface protocol (for example, UFS interface protocol) of the memory card controller can communicate with the memory card circuit of the two-in-one card 7, and is used for controlling the operation of the memory card circuit of the two-in-one card 7, the SIM card controller is used for controlling the operation of the Nano SIM card 3, and the interface protocol (for example, EMMC interface protocol) of the second memory card controller can communicate with the first NM card 4, and is used for controlling the operation of the first NM card 4.

When a different information card is inserted into the card-holder assembly 10 of the electronic device and electrically connected to the card connector 11, the interface controller can control the SIM card controller to communicate with the information card via the card connector 11, or the memory card controller and the SIM card controller to communicate with the information card via the card connector 11, or the second memory card controller to communicate with the information card via the card connector 11. For example, when the Nano SIM card 3 is installed on the card holder 2 and the Nano SIM card 3 is inserted into the card seat assembly 10, the interface controller controls the SIM card controller to communicate with the Nano SIM card 3 through the card connector 11; when the first NM card 4 is installed on the card holder 2 and the first NM card 4 is inserted into the card seat assembly 10, the interface controller controls the second memory card controller to communicate with the first NM card 4 through the card connector 11; when the two-in-one card 7 is installed on the card holder 2 and the two-in-one card 7 is inserted into the card seat assembly 10, the interface controller controls the memory card controller and the SIM card controller to communicate with the two-in-one card 7 through the card connector 11.

The interface controller may include a plurality of switches, and the connection relationship between the plurality of clips of the card connector 11 and the plurality of controllers in the processor is switched through the plurality of switches, so as to meet the communication requirements in different scenarios. The interface controller may also include a plurality of wires. Other technical contents of this embodiment may refer to the related description of the embodiment corresponding to fig. 32, and are not described herein again.

Referring to fig. 33, fig. 33 is a schematic view of the two-in-one card 7 shown in fig. 17 in other embodiments.

In some embodiments, the memory card circuit 712 of the two-in-one card 7 employs a PCIE interface protocol. The card interface 72 of the two-in-one card 7 includes first through tenth gold fingers 721 through 7210. Among the first through tenth gold fingers 721 through 7210, one of the gold fingers is used to transmit a DATA signal (SIM DATA) of the SIM card, one of the gold fingers is used to transmit a reset signal (SIM RST) of the SIM card, four of the gold fingers are used to transmit DATA signals (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card, one of the gold fingers is used to transmit a second power signal (NM VDD 2) of the memory card, one of the gold fingers is used to transmit a clock signal (SIM CLK) of the SIM card and a reference clock signal (NM RCLK) of the memory card, one of the gold fingers is used to transmit a ground signal (SIM GND) of the SIM card and a ground signal (NM GND) of the memory card, and one of the gold fingers is used to transmit a power signal (SIM VCC) of the SIM card and a first power signal (NM 1) of the memory card.

The third gold finger 723 is used for transmitting a DATA signal (SIM DATA) of the SIM card; the fourth golden finger 724 is used for transmitting a clock signal (SIM CLK) of the SIM card and a reference clock signal (NMRCLK) of the memory card; the second gold finger 722 is used for transmitting a second power supply signal (NM VDD 2) of the memory card; the sixth gold finger 726 is used for transmitting a reset signal (SIM RST) of the SIM card; the seventh gold finger 727 is used for transmitting a ground signal (SIM GND) of the SIM card and a ground signal (NMGND) of the memory card; the eighth gold finger 728 is used to transmit a power signal (SIM VCC) of the SIM card and a first power signal (NM VDD 1) of the memory card.

Referring to fig. 33 and table 13 in combination, table 13 is a schematic table of the corresponding relationship between the gold finger and the interface of the circuit of the two-in-one card 7 shown in fig. 33. In the embodiments of the present application, for convenience of illustration, the interfaces of the circuits and the interfaces of the controllers referred to in the following and the drawings are correspondingly identified by signals transmitted by the interfaces and the interfaces.

Watch 13

In some embodiments, the memory card circuitry 712 includes four data interfaces (RX +, RX-, TX +, TX-), a reference clock interface (RCLK), a second power interface (VDD 2), a ground interface (GND), and a first power interface (VDD 1). The four data interfaces (RX +, RX-, TX +, TX-) of the memory card circuit 712 are used to transmit data signals (NMRX +, NMRX-, NMTX +, NMTX-) of the memory card, the reference clock interface (RCLK) of the memory card circuit 712 is used to transmit a reference clock signal (NMRCLK) of the memory card, the second power interface (VDD 2) of the memory card circuit 712 is used to transmit a second power signal (NMVDD 2) of the memory card, the ground interface (GND) of the memory card circuit 712 is used to transmit a ground signal (NMGND) of the memory card, and the first power interface (VDD 1) of the memory card circuit 712 is used to transmit a first power signal (NMVDD 1) of the memory card. The interface of the memory card circuit 712 described above may be located in the control portion of the memory card circuit 712.

The first gold finger 721, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are electrically connected to four DATA interfaces (RX +, RX-, TX +, TX-) of the memory card circuit 712, respectively, the second gold finger 722 is electrically connected to the second power interface (VDD 2) of the memory card circuit 712, the third gold finger 723 is electrically connected to the DATA interface (DATA) of the SIM card circuit 713, the fourth gold finger 724 is electrically connected to the reference clock interface (CLK) of the memory card circuit 712 and is electrically connected to the clock interface (CLK) of the SIM card circuit 713 via the frequency divider 715, the sixth gold finger 726 is electrically connected to the reset interface (RST) of the SIM card circuit 713, the seventh gold finger 727 is electrically connected to the ground interface (GND) of the SIM card circuit 713 and the ground interface (GND) of the memory card circuit 712, and the eighth gold finger 728 is electrically connected to the power interface (VCC) of the SIM card circuit 713 and the first power interface (VDD 1) of the memory card circuit 712.

In some embodiments, please refer to fig. 33 and 34 in combination, fig. 34 is a schematic diagram of a connection circuit between the two-in-one card 7 shown in fig. 33 and an electronic device.

In some embodiments, when the two-in-one card 7 is inserted into the card socket assembly of the electronic device and electrically connected to the card connector 11, the first to tenth resilient sheets of the card connector 11 correspondingly abut against and electrically connect the first to tenth gold fingers 721 to 7210 of the two-in-one card 7. Illustratively, the processor 20 of the electronic device may include a memory card controller 201, a SIM card controller 202, a frequency divider 204, a power interface, and a ground interface. The memory card controller 201 may be used to control the operation of the memory card circuitry of the two-in-one card 7, and the SIM card controller 202 may be used to control the operation of the SIM card circuitry of the two-in-one card 7. The plurality of controllers of the processor 20 may be independent components, may be combined by an integrated component, or may be split into a plurality of components by one controller, which is not strictly limited in this embodiment of the present application.

Illustratively, the power interface of the processor 20 is used to transmit power signals and the ground interface is used to transmit ground signals. The power supply signal may be a power supply signal (SIM VCC) of the SIM card or a first power supply signal (NM VDD 1) of the memory card, and the ground signal may be a ground signal (NM GND) of the memory card or a ground signal (SIM GND) of the SIM card. The power interface and the ground interface may be independent from the SIM card controller 202 and the memory card controller 201, or may be separated and integrated in the SIM card controller 202 and the memory card controller 201, which is not limited in this embodiment of the present invention. In fig. 34 and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 202 and the memory card controller 201, and are respectively identified as power and ground.

Illustratively, the memory card controller 201 supports the PCIE interface protocol. The memory card controller 201 includes a reference clock interface (RCLK) for transferring a reference clock signal (NM RCLK) of the memory card. The SIM card controller 202 comprises a clock interface (CLK) for transferring a clock signal (SIM CLK) of the SIM card. The reference clock interface (RCLK) of the memory card controller 201 is connected to one of the ten spring pieces of the card connector 11, and the reference clock interface (RCLK) of the memory card controller 201 is connected to the clock interface (CLK) of the SIM card controller 202 via the frequency divider 204.

Illustratively, the memory card controller 201 further includes four data interfaces (RX +, RX-, TX +, TX-) for transmitting data signals (NMRX +, NMRX-, NMTX +, NMTX-) of the memory card and a second power interface (VDD 2) for transmitting a second power signal (NMVDD 2) of the memory card. The SIM card controller 202 comprises a reset interface (RST) for transmitting a reset signal (SIM RST) of the SIM card and a DATA interface (DATA) for transmitting a DATA signal (SIM DATA) of the SIM card.

Seven of the ten elastic pieces of the card connector 11 are connected to the four DATA interfaces (RX +, RX-, TX +, TX-) of the memory card controller 201, the second power interface (VDD 2) of the memory card controller 201, the DATA interface (DATA) of the SIM card controller 202, and the reset interface (RST) of the SIM card controller 202 in a one-to-one correspondence.

Illustratively, the four data interfaces (RX +, RX-, TX +, TX-) of the memory card controller 201 are electrically connected to the first, fifth, ninth, and tenth spring plates of the card connector 11 in a one-to-one correspondence, the second power interface (VDD 2) is electrically connected to the second spring plate of the card connector 11, and the reference clock interface (RCLK) is electrically connected to the fourth spring plate of the card connector 11. The DATA interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11, and the reset interface (RST) of the SIM card controller 202 is electrically connected to the sixth elastic piece of the card connector 11. The power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11, and the ground interface is electrically connected to the seventh elastic piece of the card connector 11.

In this embodiment, when the two-in-one card 7 is inserted into the electronic device and the memory card circuit 712 of the two-in-one card 7 is working, the memory card controller 201 transmits the data signal (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card between the two-in-one card 7 via the first, fifth, ninth, and tenth elastic pieces, transmits the second power signal (NM VDD 2) of the memory card between the second elastic piece and the two-in-one card 7, and transmits the reference clock signal (NM RCLK) of the memory card between the fourth elastic piece and the two-in-one card 7; the power interface of the processor 20 transmits the first power signal (NM VDD 1) of the memory card to the two-in-one card 7 through the eighth elastic piece, the ground interface transmits the ground signal (NM GND) of the memory card to the two-in-one card 7 through the seventh elastic piece, and the two-in-one card 7 realizes a data storage function.

When the two-in-one card 7 is inserted into the electronic device and the SIM card circuit 713 of the two-in-one card 7 operates, the SIM card controller 202 receives the clock signal sent by the memory card controller 201 and adjusted by the frequency divider 204, and the SIM card controller 202 transmits the DATA signal (SIM DATA) of the SIM card to the two-in-one card 7 through the third elastic piece; the power interface of the processor 20 transmits the power signal (SIM VCC) of the SIM card between the eighth elastic piece and the two-in-one card 7, the ground interface transmits the ground signal (SIM GND) of the SIM card between the seventh elastic piece and the two-in-one card 7, and the two-in-one card 7 realizes the functions of communication and data communication. When the electronic device needs to reset the SIM card circuit 713 of the two-in-one card 7, the SIM card controller 202 transmits a reset signal (SIM RST) of the SIM card to the two-in-one card through the sixth elastic piece, so as to control the SIM card circuit 713 to reset.

In other embodiments, the frequency divider 204 may not be provided in the processor 20, and the frequency divider 715 may not be provided in the two-in-one card 7. In the processor 20 of the electronic device, the reference clock interface (RCLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202 are both electrically connected to the fourth elastic piece of the card connector 11. In the two-in-one card 7, the reference clock interface (RCLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are electrically connected to the fourth gold finger 724 of the card interface 72. The memory card controller 201 sends the reference clock signal (NMRCLK) of the memory card to the fourth gold finger 724 via the fourth spring, the SIM card controller 202 sends the clock signal (SIM CLK) of the SIM card to the fourth gold finger 724 via the fourth spring, and the memory card circuit 712 and the SIM card circuit 713 perform corresponding processing according to the received signals, that is, only process clock signals recognizable by the circuits. For example, when the signal transmitted by the fourth golden finger 724 is only the reference clock signal (NMRCLK) of the memory card, the memory card circuitry 712 processes the reference clock signal (NMRCLK) of the memory card; when the signal transmitted by the fourth gold finger 724 is only the clock signal (SIM CLK) of the SIM card, the SIM card circuit 713 processes the clock signal (SIM CLK) of the SIM card; when the signal transmitted by the fourth gold finger 724 has the memory card reference clock signal (NM RCLK) and the SIM card clock signal (SIM CLK), the memory card circuit 712 processes the memory card reference clock signal (NM RCLK), for example, collects signals above 100MHz, and the SIM card circuit 713 processes the SIM card clock signal (SIM CLK), for example, collects signals below 5 MHz.

In other embodiments, the signal arrangement of the card interface 72 of the two-in-one card 7 may be in other manners. For example, the second gold finger 722 is used for transmitting one data signal (e.g., NM RX +) of the memory card, the first gold finger 721 is used for transmitting the second power signal (NM VDD 2) of the memory card, and the signal arrangement of the other gold fingers is not changed. At this time, the second gold finger 722 of the two-in-one card 7 is connected to one of the data interfaces (e.g., RX +) of the memory card circuit 712, the first gold finger 721 is electrically connected to the second power interface (VDD 2) of the memory card circuit 712, and the connection circuit between the other interfaces and the gold finger is not changed; one of the data interfaces (e.g., RX +) of the memory card controller 201 of the electronic device is electrically connected to the second elastic piece, the second power interface (VDD 2) of the memory card controller 201 is electrically connected to the first elastic piece, and the connection circuit between the other interfaces and the elastic pieces of the card connector 11 is unchanged; the two-in-one card 7 and the work flow of the electronic device are adaptively adjusted, and details are not described here.

Referring to table 14, table 14 is a table of correspondence between a plurality of resilient sheets of the card connector 11 and the Nano SIM card 3, the first NM card 4 and the plurality of gold fingers of the two-in-one card 7 shown in fig. 33 and their transmission signals. When the two-in-one card 7 is connected to the card connector 11, the first to tenth elastic pieces of the card connector 11 correspondingly abut against and electrically connect the first gold finger 721 to the tenth gold finger 7210 of the two-in-one card 7, and the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 correspondingly correspond to the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3. In some embodiments, the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

TABLE 14

When the electronic device is compatible with the Nano SIM card 3 and the two-in-one card 7 shown in fig. 33, the SIM card controller 202 of the electronic device may not support the programming voltage/input signal. Alternatively, the SIM card controller 202 of the electronic device may also support programming voltages/input signals. At this time, the SIM card controller 202 of the electronic device may further include a programming voltage/input signal interface (VPP), and the processor 20 may set a switch, where the switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the data interface (e.g., RX-) of the memory card controller 201, and is also connected to the fifth elastic piece of the card connector 11. When the electronic device is inserted into the Nano SIM card 3, the switch conducts a programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth elastic sheet; when the electronic device is inserted into the two-in-one card 7, the switch connects the data interface (e.g., RX-) of the memory card controller 201 and the fifth elastic piece.

The interface protocol (for example, PCIE interface protocol) of the memory card controller can communicate with the memory card circuit of the two-in-one card 7, and is used to control the memory card circuit of the two-in-one card 7 to operate, the SIM card controller is used to control the Nano SIM card 3 to operate, and the interface protocol (for example, EMMC interface protocol) of the second memory card controller can communicate with the first NM card 4, and is used to control the first NM card 4 to operate.

The two-in-one card 7 arranges the second power signal (NM VDD 2) of the memory card in the second golden finger 722, because the second golden finger 722 of the two-in-one card 7 has no position corresponding relation with all golden fingers of the Nano SIM card 3 and the first NM card 4, the second golden finger 722 of the two-in-one card 7 does not need to share the same elastic piece of the card connector 11 of the electronic device with the Nano SIM card 3 and the first NM card 4, the risk of burning out the second power signal (NM VDD 2) of the memory card and the data signals of the Nano SIM card 3 and the first NM card 4 when the Nano SIM card 3 and the first NM card 4 are inserted into the electronic device and connected to the card connector 11 is reduced, and the reliability of the electronic device compatible with the Nano SIM card 3, the first NM card 4 and the two-in-one card 7 is high. In addition, the first NM card 4 and the Nano SIM card 3 do not need to be provided with a high voltage tolerant design for avoiding the circuit being burned by the second power supply signal (NM VDD 2) of the memory card, which can reduce the cost.

Referring to fig. 35, fig. 35 is a schematic view of the two-in-one card 7 shown in fig. 17 according to another embodiment.

In some embodiments, the memory card circuit 712 of the two-in-one card 7 supports the UFS interface protocol. The card interface 72 of the two-in-one card 7 includes first through tenth gold fingers 721 through 7210. Among the first through tenth gold fingers 721 through 7210, one of the gold fingers is used to transmit a DATA signal (SIM DATA) of the SIM card, one of the gold fingers is used to transmit a clock signal (SIM CLK) of the SIM card, one of the gold fingers is used to transmit a reset signal (SIM RST) of the SIM card, four of the gold fingers are used to transmit DATA signals (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card, one of the gold fingers is used to transmit a reference clock signal (NM RCLK) of the memory card, one of the gold fingers is used to transmit a ground signal (SIM GND) of the SIM card and a ground signal (NM GND) of the memory card, and one of the gold fingers is used to transmit a power signal (SIM VCC) of the SIM card and a first power signal (NM VCC) of the memory card.

Illustratively, the first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are used for transmitting data signals (NMRX +, NMRX-, NMTX +, NMTX-) of the memory card. The following embodiments are described by way of example, in which the first gold finger 721 is used to transmit a data signal (NM RX +), the second gold finger 722 is used to transmit a data signal (NM RX-), the ninth gold finger 729 is used to transmit a data signal (NM TX +), and the tenth gold finger 7210 is used to transmit a data signal (NM TX-). In other embodiments, the data signals transmitted by the first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 can be interchanged with each other. For example, the data signals transmitted by the first gold finger 721 and the second gold finger 722 are exchanged, and the data signals transmitted by the ninth gold finger 729 and the tenth gold finger 7210 are exchanged, which are not described herein again in other embodiments.

The third gold finger 723 is used for transmitting a DATA signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used for transmitting a clock signal (SIM CLK) of the SIM card; fifth finger 725 is used to transfer the memory card's reference clock signal (NM RCLK); the sixth gold finger 726 is used for transmitting a reset signal (SIM RST) of the SIM card; the seventh gold finger 727 is used for transmitting a ground signal (SIM GND) of the SIM card and a ground signal (NMGND) of the memory card; the eighth gold finger 728 is used to transmit a power supply signal (SIM VCC) of the SIM card and a first power supply signal (NM VCC) of the memory card.

Referring to fig. 35 and table 15, table 15 is a schematic table of the corresponding relationship between the gold finger and the interface of the circuit of the two-in-one card 7 shown in fig. 35. In the embodiments of the present application, for convenience of illustration, the interfaces of the circuits and the interfaces of the controllers referred to in the following and the drawings are correspondingly identified by signals transmitted by the interfaces and the interfaces.

Watch 15

The two-in-one card 7 further includes a voltage regulator 716. The first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are electrically connected to four DATA interfaces (RX +, RX-, TX +, TX-) of the memory card circuit 712, respectively, the third gold finger 723 is electrically connected to the DATA interface (DATA) of the SIM card circuit 713, the fourth gold finger 724 is electrically connected to the clock interface (CLK) of the SIM card circuit 713, the fifth gold finger 725 is electrically connected to the reference clock interface (RCLK) of the memory card circuit 712, the sixth gold finger 726 is electrically connected to the reset interface (RST) of the SIM card circuit 713, the seventh gold finger 727 is electrically connected to the ground interface (GND) of the SIM card circuit 713 and the ground interface (GND) of the memory card circuit 712, and the eighth gold finger 728 is electrically connected to the power interface (VCC) of the SIM card circuit 713 and the first power interface (VCC) of the memory card circuit 712. The eighth gold finger 728 is also electrically connected to the second power supply interface (VCCQ) of the memory card circuit 712 via the voltage regulator 716.

In addition, the third gold finger 723 to the sixth gold finger 726 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712, and these gold fingers do not need to perform a switching design of a connection circuit, so that the difficulty of designing the internal circuit of the two-in-one card 7 is low, and the implementation is easy.

Illustratively, the eighth gold finger 728 is electrically connected to the second power interface (VCCQ) of the memory card circuitry 712 through the voltage regulator 716, and the voltage regulator 716 is capable of regulating the power signal transmitted by the eighth gold finger 728 to form a second power signal (NM VCCQ) of the memory card and transmitted to the second power interface (VCCQ) of the memory card circuitry 712. For example, the voltage of the first power signal (NM VCC) of the memory card is 2.5V, and the voltage regulator 716 may be adjusted to 1.2V to 1.25V to form the second power signal (NM VCCQ) of the memory card.

In this embodiment, since the second power signal (NM VCCQ) of the memory card can be obtained by voltage regulation of the first power signal (NM VCC) of the memory card, it is not necessary to perform data transmission through a separate golden finger, so that the number of golden fingers of the card interface 72 of the two-in-one card 7 is saved, the integration level of the card interface 72 is improved, and the internal circuit structure of the two-in-one card 7 is simple and easy to implement.

Referring to fig. 35 and 36 in combination, fig. 36 is a schematic diagram of a connection circuit between the two-in-one card 7 shown in fig. 35 and an electronic device.

In some embodiments, when the two-in-one card 7 is inserted into the card socket assembly of the electronic device and electrically connected to the card connector 11, the first to tenth resilient sheets of the card connector 11 correspondingly abut against and electrically connect the first to tenth gold fingers 721 to 7210 of the two-in-one card 7. Illustratively, the processor 20 of the electronic device may include a memory card controller 201, a SIM card controller 202, a power interface, and a ground interface. The memory card controller 201 may be used to control the operation of the memory card circuitry of the two-in-one card 7, and the SIM card controller 202 may be used to control the operation of the SIM card circuitry of the two-in-one card 7. The plurality of controllers of the processor 20 may be independent components, may be combined by an integrated component, or may be split into a plurality of components by one controller, which is not strictly limited in this embodiment of the present application. The plurality of controllers of the processor 20 may be independent components, may be combined by an integrated component, or may be split into a plurality of components by one controller, which is not strictly limited in this embodiment of the present application.

Illustratively, the power interface of the processor 20 is used to transmit power signals and the ground interface is used to transmit ground signals. The power supply signal may be a power supply signal (SIM VCC) of the SIM card or a first power supply signal (NM VCC) of the memory card, and the ground signal may be a ground signal (NM GND) of the memory card or a ground signal (SIM GND) of the SIM card. The power interface and the ground interface may be independent from the SIM card controller 202 and the memory card controller 201, or may be separated and integrated in the SIM card controller 202 and the memory card controller 201, which is not limited in this embodiment of the present invention. In fig. 36 and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 202 and the memory card controller 201, and are respectively identified as power and ground.

Illustratively, the memory card controller 201 supports the UFS interface protocol. The memory card controller 201 includes four data interfaces (RX +, RX-, TX +, TX-) for transmitting data signals (NMRX +, NMRX-, NMTX +, NMTX-) of the memory card and a reference clock interface (RCLK) for transmitting a reference clock signal (NMRCLK) of the memory card. The SIM card controller 202 comprises a reset interface (RST) for transmitting a reset signal (SIM RST) of the SIM card, a DATA interface (DATA) for transmitting a DATA signal (SIM DATA) of the SIM card, and a clock interface (CLK) for transmitting a clock signal (SIM CLK) of the SIM card.

Eight of the ten elastic pieces of the card connector 11 are connected to four DATA interfaces (RX +, RX-, TX +, TX-) of the memory card controller 201, a reference clock interface (RCLK) of the memory card controller 201, a DATA interface (DATA) of the SIM card controller 202, a clock interface (CLK) of the SIM card controller 202, and a reset interface (RST) of the SIM card controller 202 in a one-to-one correspondence.

Illustratively, four data interfaces (RX +, RX-, TX +, TX-) of the memory card controller 201 are electrically connected to the first, second, ninth, and tenth spring plates of the card connector 11, respectively, and the reference clock interface (RCLK) of the memory card controller 201 is electrically connected to the fifth spring plate of the card connector 11. The DATA interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11, the clock interface (CLK) of the SIM card controller 202 is electrically connected to the fourth elastic piece of the card connector 11, and the reset interface (RST) of the SIM card controller 202 is electrically connected to the sixth elastic piece. The power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11, and the ground interface is electrically connected to the seventh elastic piece of the card connector 11.

In this embodiment, when the two-in-one card 7 is inserted into the electronic device and the memory card circuit 712 of the two-in-one card 7 is working, the memory card controller 201 transmits the data signal (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card between the two-in-one card 7 via the first, second, ninth, and tenth elastic pieces, and transmits the reference clock signal (NM RCLK) of the memory card between the fifth elastic piece and the two-in-one card 7; the power interface of the processor 20 transmits the first power signal (NM VCC) of the memory card between the eighth elastic piece and the two-in-one card 7, the first power signal (NM VCC) of the memory card is adjusted to the second power signal (NM VCCQ) of the memory card in the two-in-one card 7 by the voltage regulator 716, and is transmitted to the memory card circuit 712, the ground interface transmits the ground signal (NM GND) of the memory card between the seventh elastic piece and the two-in-one card 7, and the two-in-one card 7 realizes the data storage function.

When the two-in-one card 7 is inserted into the electronic device and the SIM card circuit 713 of the two-in-one card 7 operates, the SIM card controller 202 transmits the DATA signal (SIM DATA) of the SIM card between the third elastic piece and the two-in-one card 7, and transmits the clock signal (SIM CLK) of the SIM card between the fourth elastic piece and the two-in-one card 7; the power interface of the processor 20 transmits the power signal (SIM VCC) of the SIM card between the eighth elastic piece and the two-in-one card 7, the ground interface transmits the ground signal (SIM GND) of the SIM card between the seventh elastic piece and the two-in-one card 7, and the two-in-one card 7 realizes the functions of communication and data communication. When the electronic device needs to reset the SIM card circuit 713 of the two-in-one card 7, the sixth elastic piece and the two-in-one card 7 transmit a reset signal (SIM RST) of the SIM card, so as to control the SIM card circuit 713 to reset.

Referring to table 16, table 16 is a table of correspondence between a plurality of resilient sheets of the card connector 11 and a plurality of gold fingers and transmission signals of the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in fig. 35. When the two-in-one card 7 is connected to the card connector 11, the first to tenth elastic pieces of the card connector 11 correspondingly abut against and electrically connect the first gold finger 721 to the tenth gold finger 7210 of the two-in-one card 7, and the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 correspondingly correspond to the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3. In some embodiments, the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

TABLE 16

When the electronic device is compatible with the Nano SIM card 3 and the two-in-one card 7 shown in fig. 35, the SIM card controller 202 of the electronic device may not support programming voltages/input signals. Alternatively, the SIM card controller 202 of the electronic device may also support programming voltages/input signals. At this time, the SIM card controller 202 of the electronic device may further include a programming voltage/input signal interface (VPP), and the processor 20 may set a switch, where the switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the reference clock interface (RCLK) of the memory card controller 201, and is further connected to the fifth elastic piece of the card connector 11. When the electronic device is inserted into the Nano SIM card 3, the switch conducts a programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth elastic sheet; when the electronic device is inserted into the two-in-one card 7, the switch connects the reference clock interface (RCLK) of the memory card controller 201 and the fifth elastic piece.

In other embodiments, the present application further provides an electronic device, which is compatible with the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in fig. 35. The processor of the electronic device may include a memory card controller, a second memory card controller, a SIM card controller, and an interface controller, where the interface controller is electrically connected to the memory card controller, the second memory card controller, and the SIM card controller, and the interface controller is further electrically connected to the plurality of elastic pieces of the card connector 11.

In this embodiment, the two-in-one card 7 arranges two high-speed signals (e.g., NM RX +, NM RX-) in the first gold finger 721 and the second gold finger 722 respectively, and since the first gold finger 721 and the second gold finger 722 of the two-in-one card 7 have no position corresponding relationship with all the gold fingers of the Nano SIM card 3 and the first NM card 4, no matter whether the information card inserted into the electronic device is the two-in-one card 7, the Nano SIM card 3 or the first NM card 4, the processor 20 does not need to switch the interface electrically connected with the first elastic sheet and the second elastic sheet, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

Referring to fig. 37, fig. 37 is a schematic view of the two-in-one card 7 shown in fig. 17 according to another embodiment.

In some embodiments, the memory card circuit 712 of the two-in-one card 7 employs a PCIE interface protocol. The card interface 72 of the two-in-one card 7 includes first through tenth gold fingers 721 through 7210. Among the first through tenth gold fingers 721 through 7210, one of the gold fingers is used to transmit a DATA signal (SIM DATA) of the SIM card, one of the gold fingers is used to transmit a clock signal (SIM CLK) of the SIM card, one of the gold fingers is used to transmit a reset signal (SIM RST) of the SIM card, four of the gold fingers are used to transmit DATA signals (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card, one of the gold fingers is used to transmit a reference clock signal (NM RCLK) of the memory card, one of the gold fingers is used to transmit a ground signal (SIM GND) of the SIM card and a ground signal (NM GND) of the memory card, and one of the gold fingers is used to transmit a power signal (SIM VCC) of the SIM card and a first power signal (NM VDD 1) of the memory card.

The third gold finger 723 is used for transmitting a DATA signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used for transmitting a clock signal (SIM CLK) of the SIM card; the fifth finger 725 is used to transmit a reset signal (SIM RST) of the SIM card; sixth golden finger 726 is used to transfer the memory card's reference clock signal (NM RCLK); the seventh gold finger 727 is used for transmitting a ground signal (SIM GND) of the SIM card and a ground signal (NMGND) of the memory card; the eighth gold finger 728 is used to transmit a power signal (SIM VCC) of the SIM card and a first power signal (NM VDD 1) of the memory card.

Referring to fig. 37 and table 17, table 17 is a schematic table of the corresponding relationship between the gold finger and the interface of the circuit of the two-in-one card 7 shown in fig. 37. In the embodiments of the present application, for convenience of illustration, the interfaces of the circuits and the interfaces of the controllers referred to in the following and the drawings are correspondingly identified by signals transmitted by the interfaces and the interfaces.

TABLE 17

The first gold finger 721, the second gold finger 722, the ninth gold finger 729, and the tenth gold finger 7210 of the two-in-one card 7 are electrically connected to four DATA interfaces (RX +, RX-, TX +, and TX-) of the memory card circuit 712, respectively, the third gold finger 723 is electrically connected to the DATA interface (DATA) of the SIM card circuit 713, the fourth gold finger 724 is electrically connected to the clock interface (CLK) of the SIM card circuit 713, the fifth gold finger 725 is electrically connected to the reset interface (RST) of the SIM card circuit 713, the sixth gold finger 726 is electrically connected to the reference clock interface (RCLK) of the memory card circuit 712, the seventh gold finger 727 is electrically connected to the ground interface (GND) of the SIM card circuit 713 and the ground interface (GND) of the memory card circuit 712, and the eighth gold finger 728 is electrically connected to the power interface (VCC) of the SIM card circuit 713 and the first power interface (VDD 1) of the memory card circuit 712. The eighth gold finger 728 is also electrically connected to the second power interface (VDD 2) of the memory card circuit 712 via the voltage regulator 716.

Illustratively, the eighth gold finger 728 is electrically connected to the second power interface (VDD 2) of the memory card circuit 712 through the voltage regulator 716, and the voltage regulator 716 is capable of regulating the power signal transmitted by the eighth gold finger 728 to form a second power signal (NM VDD 2) of the memory card and transmit the second power signal (NM VDD 2) to the second power interface (VDD 2) of the memory card circuit 712.

In this embodiment, the second power signal (NM VDD 2) of the memory card can be obtained by adjusting the voltage of the first power signal (NM VDD 1) of the memory card, and therefore data transmission through a separate golden finger is not required, so that the number of golden fingers of the card interface 72 of the two-in-one card 7 is saved, the integration level of the card interface 72 is improved, and the internal circuit structure of the two-in-one card 7 is simple and easy to implement.

Referring to fig. 37 and 38 in combination, fig. 38 is a schematic diagram of a connection circuit between the two-in-one card 7 shown in fig. 37 and an electronic device.

Illustratively, the power interface of the processor 20 is used to transmit power signals and the ground interface is used to transmit ground signals. The power supply signal may be a power supply signal (SIM VCC) of the SIM card or a first power supply signal (NM VDD 1) of the memory card, and the ground signal may be a ground signal (NM GND) of the memory card or a ground signal (SIM GND) of the SIM card. The power interface and the ground interface may be independent from the SIM card controller 202 and the memory card controller 201, or may be separated and integrated in the SIM card controller 202 and the memory card controller 201, which is not limited in this embodiment of the present invention. In fig. 38 and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 202 and the memory card controller 201, and are respectively identified as power and ground.

Illustratively, the memory card controller 201 supports the PCIE interface protocol. The memory card controller 201 includes four data interfaces (RX +, RX-, TX +, TX-) for transmitting data signals (NMRX +, NMRX-, NMTX +, NMTX-) of the memory card and a reference clock interface (RCLK) for transmitting a reference clock signal (NMRCLK) of the memory card. The SIM card controller 202 comprises a reset interface (RST) for transmitting a reset signal (SIM RST) of the SIM card, a DATA interface (DATA) for transmitting a DATA signal (SIM DATA) of the SIM card, and a clock interface (CLK) for transmitting a clock signal (SIM CLK) of the SIM card.

Illustratively, four data interfaces (RX +, RX-, TX +, TX-) of the memory card controller 201 are electrically connected to the first, second, ninth, and tenth spring plates of the card connector 11, respectively, and the reference clock interface (RCLK) of the memory card controller 201 is electrically connected to the sixth spring plate of the card connector 11. The DATA interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11, the clock interface (CLK) of the SIM card controller 202 is electrically connected to the fourth elastic piece of the card connector 11, and the reset interface (RST) of the SIM card controller 202 is electrically connected to the fifth elastic piece. The power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11, and the ground interface is electrically connected to the seventh elastic piece of the card connector 11.

In this embodiment, when the two-in-one card 7 is inserted into the electronic device and the memory card circuit 712 of the two-in-one card 7 is working, the memory card controller 201 transmits the data signal (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card between the two-in-one card 7 via the first, second, ninth, and tenth elastic pieces, and transmits the reference clock signal (NM RCLK) of the memory card between the sixth elastic piece and the two-in-one card 7; the power interface of the processor 20 transmits the first power signal (NM VDD 1) of the memory card to the two-in-one card 7 through the eighth elastic piece, the first power signal (NM VDD 1) of the memory card is adjusted to the second power signal (NM VDD 2) of the memory card in the two-in-one card 7 through the voltage regulator 716, and is transmitted to the memory card circuit 712, the ground interface transmits the ground signal (NM GND) of the memory card to the two-in-one card 7 through the seventh elastic piece, and the two-in-one card 7 realizes the data storage function.

When the two-in-one card 7 is inserted into the electronic device and the SIM card circuit 713 of the two-in-one card 7 operates, the SIM card controller 202 transmits the DATA signal (SIM DATA) of the SIM card between the third elastic piece and the two-in-one card 7, and transmits the clock signal (SIM CLK) of the SIM card between the fourth elastic piece and the two-in-one card 7; the power interface of the processor 20 transmits the power signal (SIM VCC) of the SIM card between the eighth elastic piece and the two-in-one card 7, the ground interface transmits the ground signal (SIM GND) of the SIM card between the seventh elastic piece and the two-in-one card 7, and the two-in-one card 7 realizes the functions of communication and data communication. When the electronic device needs to reset the SIM card circuit 713 of the two-in-one card 7, the fifth elastic piece and the two-in-one card 7 transmit a reset signal (SIM RST) of the SIM card to control the SIM card circuit 713 to reset.

In other embodiments, the fifth finger 725 of the two-in-one card 7 may be used for transmitting the reference clock signal (NM RCLK) of the memory card, and the sixth finger 726 is used for transmitting the reset signal (SIM RST) of the SIM card. At this time, the reference clock interface (RCLK) of memory card circuitry 712 is electrically coupled to fifth finger 725 of card interface 72 and the reset interface (RST) of SIM card circuitry 713 is electrically coupled to fifth finger 725 of card interface 72. On the electronic device side, the reference clock interface (RCLK) of the memory card controller 201 is electrically connected to the fifth elastic piece of the card connector 11, and the reset interface (RST) of the SIM card controller 202 is electrically connected to the sixth elastic piece of the card connector 11.

Referring to table 18, table 18 is a table of correspondence between a plurality of resilient sheets of the card connector 11 and the Nano SIM card 3, the first NM card 4 and a plurality of gold fingers of the two-in-one card 7 shown in fig. 37 and their transmission signals. When the two-in-one card 7 is connected to the card connector 11, the first to tenth elastic pieces of the card connector 11 correspondingly abut against and electrically connect the first gold finger 721 to the tenth gold finger 7210 of the two-in-one card 7, and the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 correspondingly correspond to the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3. In some embodiments, the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

Watch 18

When the electronic device is compatible with the Nano SIM card 3 and the two-in-one card 7 shown in fig. 37, the SIM card controller 202 of the electronic device may not support the programming voltage/input signal. Alternatively, the SIM card controller 202 of the electronic device may also support programming voltages/input signals. At this time, the SIM card controller 202 of the electronic device may further include a programming voltage/input signal interface (VPP), and the processor 20 may set a first switch, where the first switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the reset interface (RST) of the SIM card controller 202, and is further connected to the fifth elastic piece of the card connector 11. When the electronic device is inserted into the Nano SIM card 3, the first switch conducts a programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth elastic sheet; when the electronic device is inserted into the two-in-one card 7, the first switch connects the reset interface (RST) of the SIM card controller 202 and the fifth elastic piece.

The processor 20 of the electronic device includes a second switch, which connects the reset interface (RST) of the SIM card controller 202 and the reference clock interface (RCLK) of the memory card controller 201, and also connects the sixth elastic piece of the card connector 11. When the electronic device is inserted into the Nano SIM card 3, the second switch conducts the reset interface (RST) of the SIM card controller 202 and the sixth elastic sheet; when the electronic device is inserted into the two-in-one card 7, the second switch connects the reference clock interface (RCLK) of the memory card controller 201 and the sixth elastic piece.

Referring to fig. 39, fig. 39 is a schematic view of the two-in-one card 7 shown in fig. 17 in another embodiment.

In some embodiments, the memory card circuit 712 of the two-in-one card 7 employs a PCIE interface protocol. The card interface 72 of the two-in-one card 7 includes first through tenth gold fingers 721 through 7210. Among the first through tenth gold fingers 721 through 7210, one of the gold fingers is used to transmit a DATA signal (SIM DATA) of the SIM card, one of the gold fingers is used to transmit a clock signal (SIM CLK) of the SIM card, one of the gold fingers is used to transmit a reset signal (SIM RST) of the SIM card, four of the gold fingers are used to transmit DATA signals (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card, one of the gold fingers is used to transmit a reference clock signal (NM RCLK) of the memory card and a second power signal (NM VDD 2) of the memory card, one of the gold fingers is used to transmit a ground signal (SIM GND) of the SIM card and a ground signal (NM GND) of the memory card, and one of the gold fingers is used to transmit a power signal (SIM VCC) of the SIM card and a first power signal (NM VDD 1) of the memory card.

The third gold finger 723 is used for transmitting a DATA signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used for transmitting a clock signal (SIM CLK) of the SIM card; the fifth finger 725 is used to transmit a reset signal (SIM RST) of the SIM card; the sixth gold finger 726 is used to transfer a reference clock signal (NMRCLK) of the memory card and a second power signal (NMVDD 2) of the memory card; the seventh gold finger 727 is used for transmitting a ground signal (SIM GND) of the SIM card and a ground signal (NMGND) of the memory card; the eighth gold finger 728 is used to transmit a power signal (SIM VCC) of the SIM card and a first power signal (NM VDD 1) of the memory card.

Referring to fig. 39 and table 19, table 19 is a schematic table of the corresponding relationship between the gold finger and the interface of the circuit of the two-in-one card 7 shown in fig. 39. In the embodiments of the present application, for convenience of illustration, the interfaces of the circuits and the interfaces of the controllers referred to in the following and the drawings are correspondingly identified by signals transmitted by the interfaces and the interfaces.

Watch 19

The first gold finger 721, the second gold finger 722, the ninth gold finger 729, and the tenth gold finger 7210 of the two-in-one card 7 are electrically connected to four DATA interfaces (RX +, RX-, TX +, and TX-) of the memory card circuit 712, respectively, the third gold finger 723 is electrically connected to the DATA interface (DATA) of the SIM card circuit 713, the fourth gold finger 724 is electrically connected to the clock interface (CLK) of the SIM card circuit 713, the fifth gold finger 725 is electrically connected to the reset interface (RST) of the SIM card circuit 713, the sixth gold finger 726 is electrically connected to the reference clock interface (RCLK) of the memory card circuit 712 and the second power interface (VDD 2) of the memory card circuit 712, the seventh gold finger 727 is electrically connected to the ground interface (GND) of the SIM card circuit 713 and the ground interface (GND) of the memory card circuit 712, and the eighth gold finger 728 is electrically connected to the power interface (VCC) of the SIM card circuit 713 and the first power interface (VDD 1) of the memory card circuit 712.

In addition, the third gold finger 723 to the fifth gold finger 725 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712, and these gold fingers do not need to be switched to connect circuits, so that the internal circuit design of the two-in-one card 7 is difficult and easy to implement.

The two-in-one card 7 is provided with a separating circuit 717, the separating circuit 717 is electrically connected with the reference clock interface (RCLK) of the sixth golden finger 726 and the memory card circuit 712 and the second power interface (VDD 2) of the memory card circuit 712, the separating circuit 717 is used for separating the signal transmitted by the sixth golden finger 726 from the reference clock signal (NM RCLK) of the memory card and transmitting the signal to the reference clock interface (RCLK) of the memory card circuit 712, and is also used for separating the signal transmitted by the sixth golden finger 726 from the second power signal (NM VDD 2) of the memory card and transmitting the signal to the second power interface (VDD 2) of the memory card circuit 712.

Referring to fig. 39 and 40 in combination, fig. 40 is a schematic diagram of a connection circuit between the two-in-one card 7 shown in fig. 39 and an electronic device. In some embodiments, when the two-in-one card 7 is inserted into the card socket assembly of the electronic device and electrically connected to the card connector 11, the first to tenth resilient sheets of the card connector 11 correspondingly abut against and electrically connect the first to tenth gold fingers 721 to 7210 of the two-in-one card 7. Illustratively, the processor 20 of the electronic device may include a memory card controller 201, a SIM card controller 202, a power interface, and a ground interface. The memory card controller 201 may be used to control the operation of the memory card circuitry of the two-in-one card 7, and the SIM card controller 202 may be used to control the operation of the SIM card circuitry of the two-in-one card 7. The plurality of controllers of the processor 20 may be independent components, may be combined by an integrated component, or may be split into a plurality of components by one controller, which is not strictly limited in this embodiment of the present application. The plurality of controllers of the processor 20 may be independent components, may be combined by an integrated component, or may be split into a plurality of components by one controller, which is not strictly limited in this embodiment of the present application.

Illustratively, the power interface of the processor 20 is used to transmit power signals and the ground interface is used to transmit ground signals. The power supply signal may be a power supply signal (SIM VCC) of the SIM card or a first power supply signal (NM VDD 1) of the memory card, and the ground signal may be a ground signal (NM GND) of the memory card or a ground signal (SIM GND) of the SIM card. The power interface and the ground interface may be independent from the SIM card controller 202 and the memory card controller 201, or may be separated and integrated in the SIM card controller 202 and the memory card controller 201, which is not limited in this embodiment of the present invention. In fig. 40 and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 202 and the memory card controller 201, and are respectively identified as power and ground.

Illustratively, the memory card controller 201 supports the PCIE interface protocol. The memory card controller 201 includes four data interfaces (RX +, RX-, TX +, TX-), four reference clock interfaces (RCLK) for transmitting data signals (NMRX +, NMRX-, NMTX +, NMTX-) of the memory card, and a second power interface (VDD 2) for transmitting a second power signal (NMVDD 2) of the memory card. The SIM card controller 202 comprises a reset interface (RST) for transmitting a reset signal (SIM RST) of the SIM card, a DATA interface (DATA) for transmitting a DATA signal (SIM DATA) of the SIM card, and a clock interface (CLK) for transmitting a clock signal (SIM CLK) of the SIM card.

Illustratively, the reference clock interface (RCLK) and the second power interface (VDD 2) of the memory card controller 201 are connected to the same one of the ten spring pieces of the card connector 11. In this embodiment, since the reference clock signal (NM RCLK) of the memory card and the second power signal (NM VDD 2) of the memory card can be separated, the two signals are transmitted through the same elastic piece of the card connector 11, the number of the elastic pieces of the card connector 11 can be reduced, thereby reducing the area thereof and facilitating the miniaturization of the electronic device.

Illustratively, the four data interfaces (RX +, RX-, TX +, TX-) of the memory card controller 201 are electrically connected to the first, second, ninth, and tenth spring plates of the card connector 11, respectively, and the reference clock interface (RCLK) and the second power interface (VDD 2) of the memory card controller 201 are electrically connected to the sixth spring plate of the card connector 11. The DATA interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11, the clock interface (CLK) of the SIM card controller 202 is electrically connected to the fourth elastic piece of the card connector 11, and the reset interface (RST) of the SIM card controller 202 is electrically connected to the fifth elastic piece. The power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11, and the ground interface is electrically connected to the seventh elastic piece of the card connector 11.

In this embodiment, when the two-in-one card 7 is inserted into the electronic device and the memory card circuit 712 of the two-in-one card 7 is working, the memory card controller 201 transmits the data signal (NM RX +, NM RX-, NM TX +, NM TX-) of the memory card between the two-in-one card 7 via the first, second, ninth, and tenth elastic pieces, and transmits the reference clock signal (NM RCLK) of the memory card and the second power signal (NM VDD 2) of the memory card between the sixth elastic piece and the two-in-one card 7; the power interface of the processor 20 transmits the first power signal (NM VDD 1) of the memory card to the two-in-one card 7 through the eighth elastic piece, the ground interface transmits the ground signal (NM GND) of the memory card to the two-in-one card 7 through the seventh elastic piece, and the two-in-one card 7 realizes a data storage function.

In other embodiments, the fifth finger 725 of the two-in-one card 7 may be used for transmitting the reference clock signal (NM RCLK) of the memory card and the second power signal (NM VDD 2) of the memory card, and the sixth finger 726 is used for transmitting the reset signal (SIM RST) of the SIM card. At this time, the reference clock interface (RCLK) of the memory card circuit 712 and the second power interface (VDD 2) are electrically connected to the fifth finger 725 of the card interface 72, and the reset interface (RST) of the SIM card circuit 713 is electrically connected to the fifth finger 725 of the card interface 72. On the electronic device side, the reference clock interface (RCLK) and the second power interface (VDD 2) of the memory card controller 201 are electrically connected to the fifth elastic piece of the card connector 11, and the reset interface (RST) of the SIM card controller 202 is electrically connected to the sixth elastic piece of the card connector 11.

Referring to table 20, table 20 is a table of correspondence between a plurality of resilient sheets of the card connector 11 and the Nano SIM card 3, the first NM card 4 and a plurality of gold fingers of the two-in-one card 7 shown in fig. 39 and their transmission signals. When the two-in-one card 7 is connected to the card connector 11, the first to tenth elastic pieces of the card connector 11 correspondingly abut against and electrically connect the first gold finger 721 to the tenth gold finger 7210 of the two-in-one card 7, and the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 correspondingly correspond to the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3. In some embodiments, the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

Watch 20

When the electronic device is compatible with the Nano SIM card 3 and the two-in-one card 7 shown in fig. 39, the SIM card controller 202 of the electronic device may not support the programming voltage/input signal. Alternatively, the SIM card controller 202 of the electronic device may also support programming voltages/input signals. At this time, the SIM card controller 202 of the electronic device may further include a programming voltage/input signal interface (VPP), and the processor 20 may set a first switch, where the first switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the reset interface (RST) of the SIM card controller 202, and is further connected to the fifth elastic piece of the card connector 11. When the electronic device is inserted into the Nano SIM card 3, the first switch conducts a programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth elastic sheet; when the electronic device is inserted into the two-in-one card 7, the first switch connects the reset interface (RST) of the SIM card controller 202 and the fifth elastic piece.

The processor 20 of the electronic device includes a second switch, and the second switch is connected to the reset interface (RST) of the SIM card controller 202, the reference clock interface (RCLK) of the memory card controller 201, and the second power interface (VDD 2), and is also connected to the sixth elastic piece of the card connector 11. When the electronic device is inserted into the Nano SIM card 3, the second switch conducts the reset interface (RST) of the SIM card controller 202 and the sixth elastic sheet; when the electronic device is inserted into the two-in-one card 7, the second switch connects the reference clock interface (RCLK) of the memory card controller 201, the second power interface (VDD 2), and the sixth elastic sheet.

Based on the description of the above embodiments, in some other embodiments of the present application, when the first gold finger 721, the second gold finger 722 and the tenth gold finger 7210 of the two-in-one card 7 are used as data interfaces, the high voltage tolerant circuit or the protection switch may be electrically connected to avoid that the circuit is burned out due to the short circuit of the spring plate when the third spring plate of the card connector 11 outputs the high voltage data signal of the SIM card controller 202, the fourth spring plate outputs the high voltage clock signal of the SIM card controller 202, and the eighth spring plate outputs the high voltage power signal, so as to improve the reliability of the two-in-one card 7. The high voltage tolerant circuit or the protection switch is located in the package 711 of the two-in-one card 7. In other embodiments, the circuit of the two-in-one card 7 can be prevented from being burned out by providing a high impedance protection circuit in the electronic device, for example, by adding a protection circuit in an interface controller or other controllers of the electronic device.

In other embodiments of the present application, the two-in-one card may have other designs, and the adapted card connector and card holder assembly may not be compatible with the first NM card.

In other embodiments of the present application, the two-in-one card may have other designs, and the card connector and the card holder assembly may not be compatible with the Nano SIM card. At this moment, the arrangement positions of the first golden finger to the tenth golden finger of the two-in-one card can be adjusted, the signal arrangement positions of the first golden finger to the tenth golden finger can be exchanged, and the size of the card body of the two-in-one card can be changed.

In some embodiments, the electronic device may identify the type of information card inserted into the electronic device through an information card identification method.

In some embodiments, the information card identification method can identify whether the information card is a Nano SIM card or a two-in-one card, and the information card identification method can be applied to an electronic device compatible with the Nano SIM card and the two-in-one card.

The information card identification method comprises the following steps:

step 001: executing a first initialization process;

step 002: if the first reply instruction is received, judging that the inserted information card is the first card; if the first reply instruction is not received, judging that the inserted information card is not the first card, and executing a second initialization process;

Step 003: if a second reply instruction is received, the inserted information card is judged to be a second card; and if the second reply instruction is not received, judging that the inserted information card is not the second card.

In this embodiment, the electronic device executes an initialization procedure of the information card, and if a specific reply signal is received, can determine that the information card is an information card corresponding to the initialization procedure, and if a specific reply signal is not received, determine that the information card is not an information card corresponding to the initialization procedure, and execute a next initialization procedure, and determine whether the information card is an information card corresponding to the next initialization procedure.

In this embodiment, the electronic device can automatically identify the type of the information card through the processor, and control the controller corresponding to the information card to be connected with the card connector, so that the information card can be automatically matched with the electronic device, thereby performing communication and improving the use experience of a user.

In some embodiments, the first initialization process may be a SIM card initialization process, and the first card is a Nano SIM card; the second initialization process may be a two-in-one card initialization process, and the second card is a two-in-one card. Or, the first initialization process may be a two-in-one card initialization process, where the first card is a two-in-one card; the second initialization process may be an SIM card initialization process, and the second card is a Nano SIM card.

In some embodiments, the information card identification method is in response to a power-on of the electronic device or a reboot of the electronic device.

In some embodiments, the information card identification method switches from the disengaged state to the inserted state in response to detecting the card-holding state. Referring to fig. 3, the electronic device can detect whether the card holder is in the disengaged state or the inserted state through the insertion detection spring piece in the card holder assembly.

In other embodiments, the information card identification method can identify whether the information card is a Nano SIM card, a first NM card or a two-in-one card, and the information card identification method can be applied to an electronic device compatible with the Nano SIM card, the first NM card and the two-in-one card.

The information card identification method comprises the following steps:

step 001: executing a first initialization process;

step 003: if a second reply instruction is received, the inserted information card is judged to be a second card; if the second reply instruction is not received, judging that the inserted information card is not the second card, and executing a third initialization process;

Step 004: if a third reply instruction is received, the inserted information card is judged to be a third card; and if the third reply instruction is not received, judging that the inserted information card is not the third card.

The main difference between the information card identification method of this embodiment and the information card identification method of the previous embodiment is that in step 003, when the inserted information card is determined not to be the second card, the information card identification method then performs a third initialization procedure to determine whether the information card is the third card.

In some embodiments, one of the first initialization procedure, the second initialization procedure, and the third initialization procedure is a SIM card initialization procedure, the other is a first NM card initialization procedure, and the other is a two-in-one card initialization procedure. Correspondingly, one of the first card, the second card and the third card is a Nano SIM card, the other is a first NM card, and the other is a two-in-one card.

In some embodiments, the information card identification method is in response to a start-up of the electronic device or a restart of the electronic device, wherein the first initialization process may be a SIM card initialization process or a two-in-one card initialization process. In this embodiment, when the electronic device is turned on or restarted, the information card identification method first performs an SIM card initialization procedure or a two-in-one card initialization procedure to determine whether the information card is a Nano SIM card or a two-in-one card, so as to enter the internet first. Of course, in some other embodiments, when the information card identification method responds to the start-up of the electronic device or the restart of the electronic device, the information card identification method may also perform other initialization processes first, which is not strictly limited in this embodiment of the present application.

Other contents of the information card identification method in this embodiment can refer to the related description of the information card identification method in the previous embodiment, and are not described herein again.

In other embodiments, the processor may also be provided with a detection circuit for detecting the type of the information card, and the processor may be capable of identifying the type of the information card according to the detection result of the detection circuit. The embodiment of the application does not strictly limit the specific way of identifying the type of the information card by the processor.

The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device (100) comprising a card-holder assembly (10) and a processor (20);

the card seat assembly (10) comprises a card connector (11), when a card (7) is inserted into the card seat assembly (10), ten gold fingers of the card (7) are correspondingly abutted and electrically connected with ten elastic sheets of the card connector (11), the ten elastic sheets are arranged in an array, and the card (7) comprises a memory card circuit (712) and a SIM card circuit (713);

The processor (20) comprises a memory card controller (201), a SIM card controller (202), a power interface and a ground interface, wherein the interfaces of the memory card controller (201) and the SIM card controller (202) are connected to eight of the ten elastic pieces, and the power interface and the ground interface are respectively connected to the other two of the ten elastic pieces.

2. The electronic device (100) of claim 1, wherein the electronic device (100) further comprises a switch (203), the switch (203) connects a reset interface of the SIM card controller (202) and one interface of the memory card controller (201), and the switch (203) further connects one of ten spring pieces.

3. The electronic device (100) of claim 2, wherein the memory card controller (201) supports an eMMC interface protocol;

the switch (203) is connected with a command and response multiplexing interface of the memory card controller (201);

seven of the ten spring pieces are connected with four data interfaces of the memory card controller (201), a clock interface of the memory card controller (201), a data interface of the SIM card controller (202) and a clock interface of the SIM card controller (202) in a one-to-one correspondence manner.

4. The electronic device (100) according to claim 3, wherein the ten resilient pieces are arranged in a second direction to form a first row of resilient pieces and a second row of resilient pieces, the first row of resilient pieces comprises a first resilient piece (11 a), a third resilient piece (11 c), a fifth resilient piece (11 e), a seventh resilient piece (11 g) and a ninth resilient piece (11 i) arranged in the first direction, the second row of resilient pieces comprises a second resilient piece (11 b), a fourth resilient piece (11 d), a sixth resilient piece (11 f), an eighth resilient piece (11 h) and a tenth resilient piece (11 j) arranged in the first direction, and the first direction is perpendicular to the second direction;

the power interface is connected with the eighth elastic sheet (11 h), and the ground interface is connected with the seventh elastic sheet (11 g);

the switch (203) is connected with the sixth elastic sheet (11 f);

four data interfaces of the memory card controller (201) are connected with the first elastic sheet (11 a), the second elastic sheet (11 b), the ninth elastic sheet (11 i) and the tenth elastic sheet (11 j) in a one-to-one correspondence manner, and a clock interface of the memory card controller (201) is connected with the fifth elastic sheet (11 e);

the data interface of the SIM card controller (202) is connected with the third elastic sheet (11 c), and the clock interface of the SIM card controller (202) is connected with the fourth elastic sheet (11 d).

5. The electronic device (100) of claim 2, wherein the memory card controller (201) supports an eMMC interface protocol;

the switch (203) is connected with a clock interface of the memory card controller (201);

seven of the ten spring pieces are connected with four data interfaces of the memory card controller (201), a command and response multiplexing interface of the memory card controller (201), a data interface of the SIM card controller (202) and a clock interface of the SIM card controller (202) in a one-to-one correspondence manner.

6. The electronic device (100) according to claim 5, wherein the ten resilient pieces are arranged in a second direction to form a first row of resilient pieces and a second row of resilient pieces, the first row of resilient pieces comprises a first resilient piece (11 a), a third resilient piece (11 c), a fifth resilient piece (11 e), a seventh resilient piece (11 g) and a ninth resilient piece (11 i) arranged in the first direction, the second row of resilient pieces comprises a second resilient piece (11 b), a fourth resilient piece (11 d), a sixth resilient piece (11 f), an eighth resilient piece (11 h) and a tenth resilient piece (11 j) arranged in the first direction, and the first direction is perpendicular to the second direction;

The switch (203) is connected with the sixth elastic sheet (11 f);

four data interfaces of the memory card controller (201) are connected with the first elastic sheet (11 a), the second elastic sheet (11 b), the ninth elastic sheet (11 i) and the tenth elastic sheet (11 j) in a one-to-one correspondence manner, and a command and response multiplexing interface of the memory card controller (201) is connected with the fifth elastic sheet (11 e);

7. The electronic device (100) of claim 2, wherein the memory card controller (201) supports a UFS interface protocol or a PCIe interface protocol;

the switch (203) is connected with a reference clock interface of the memory card controller (201);

seven of the ten spring pieces are connected with four data interfaces of the memory card controller (201), a second power interface of the memory card controller (201), a data interface of the SIM card controller (202) and a clock interface of the SIM card controller (202) in a one-to-one correspondence manner.

8. The electronic device (100) according to claim 7, wherein the ten resilient pieces are arranged in a second direction to form a first row of resilient pieces and a second row of resilient pieces, the first row of resilient pieces comprises a first resilient piece (11 a), a third resilient piece (11 c), a fifth resilient piece (11 e), a seventh resilient piece (11 g) and a ninth resilient piece (11 i) arranged in the first direction, the second row of resilient pieces comprises a second resilient piece (11 b), a fourth resilient piece (11 d), a sixth resilient piece (11 f), an eighth resilient piece (11 h) and a tenth resilient piece (11 j) arranged in the first direction, and the first direction is perpendicular to the second direction;

the switch (203) is connected with the sixth elastic sheet (11 f);

three data interfaces of the memory card controller (201) are connected with the fifth elastic sheet (11 e), the ninth elastic sheet (11 i) and the tenth elastic sheet (11 j) in a one-to-one correspondence manner, and one of the other data interface of the memory card controller (201) and the second power interface of the memory card controller (201) is connected with the first elastic sheet (11 a), and the other data interface is connected with the second elastic sheet (11 b);

9. The electronic device (100) of claim 1, wherein the processor (20) further comprises a frequency divider (204), the memory card controller (201) supports an eMMC interface protocol, a clock interface of the memory card controller (201) is connected to one of ten spring clips, and a clock interface of the memory card controller (201) is connected to a clock interface of the SIM card controller (202) via the frequency divider (204).

10. The electronic device (100) according to claim 9, wherein seven of the ten spring pieces are connected to four data interfaces of the memory card controller (201), a command and response multiplexing interface of the memory card controller (201), a data interface of the SIM card controller (202), and a reset interface of the SIM card controller (202) in a one-to-one correspondence.

11. The electronic device (100) according to claim 10, wherein the ten resilient pieces are arranged in a second direction to form a first row of resilient pieces and a second row of resilient pieces, the first row of resilient pieces comprises a first resilient piece (11 a), a third resilient piece (11 c), a fifth resilient piece (11 e), a seventh resilient piece (11 g) and a ninth resilient piece (11 i) arranged in the first direction, the second row of resilient pieces comprises a second resilient piece (11 b), a fourth resilient piece (11 d), a sixth resilient piece (11 f), an eighth resilient piece (11 h) and a tenth resilient piece (11 j) arranged in the first direction, and the first direction is perpendicular to the second direction;

a clock interface of the memory card controller (201) is connected with the fourth elastic sheet (11 d), four data interfaces of the memory card controller (201) are connected with the first elastic sheet (11 a), the second elastic sheet (11 b), the ninth elastic sheet (11 i) and the tenth elastic sheet (11 j) in a one-to-one correspondence manner, and a command and response multiplexing interface of the memory card controller (201) is connected with the fifth elastic sheet (11 e);

the data interface of the SIM card controller (202) is connected with the third elastic sheet (11 c), and the reset interface of the SIM card controller (202) is connected with the sixth elastic sheet (11 f).

12. The electronic device (100) of claim 1, wherein the processor (20) further comprises a frequency divider (204), the memory card controller (201) supports UFS interface protocol or PCIe interface protocol, a reference clock interface of the memory card controller (201) is connected to one of ten spring pieces, and a reference clock interface of the memory card controller (201) is connected to a clock interface of the SIM card controller (202) via the frequency divider (204).

13. The electronic device (100) of claim 12, wherein seven of the ten spring pieces are connected to four data interfaces of the memory card controller (201), the second power interface of the memory card controller (201), the data interface of the SIM card controller (202), and the reset interface of the SIM card controller (202) in a one-to-one correspondence.

14. The electronic device (100) according to claim 13, wherein the ten resilient pieces are arranged in a second direction to form a first row of resilient pieces and a second row of resilient pieces, the first row of resilient pieces comprises a first resilient piece (11 a), a third resilient piece (11 c), a fifth resilient piece (11 e), a seventh resilient piece (11 g) and a ninth resilient piece (11 i) arranged in the first direction, the second row of resilient pieces comprises a second resilient piece (11 b), a fourth resilient piece (11 d), a sixth resilient piece (11 f), an eighth resilient piece (11 h) and a tenth resilient piece (11 j) arranged in the first direction, and the first direction is perpendicular to the second direction;

a clock interface of the memory card controller (201) is connected with the fourth elastic sheet (11 d), three data interfaces of the memory card controller (201) are connected with the fifth elastic sheet (11 e), the ninth elastic sheet (11 i) and the tenth elastic sheet (11 j) in a one-to-one correspondence manner, one of the other data interface of the memory card controller (201) and a second power interface of the memory card controller (201) is connected with the first elastic sheet (11 a), and the other data interface of the memory card controller (201) is connected with the second elastic sheet (11 b);

15. The electronic device (100) of claim 1, wherein the memory card controller (201) supports a UFS interface protocol or a PCIe interface protocol;

eight of the ten spring pieces are connected with four data interfaces of the memory card controller (201), a reference clock interface of the memory card controller (201), a reset interface of the SIM card controller (202), a data interface of the SIM card controller (202) and a clock interface of the SIM card controller (202) in a one-to-one correspondence manner.

16. The electronic device (100) according to claim 15, wherein the ten resilient pieces are arranged in a second direction to form a first row of resilient pieces and a second row of resilient pieces, the first row of resilient pieces comprises a first resilient piece (11 a), a third resilient piece (11 c), a fifth resilient piece (11 e), a seventh resilient piece (11 g) and a ninth resilient piece (11 i) arranged in the first direction, the second row of resilient pieces comprises a second resilient piece (11 b), a fourth resilient piece (11 d), a sixth resilient piece (11 f), an eighth resilient piece (11 h) and a tenth resilient piece (11 j) arranged in the first direction, and the first direction is perpendicular to the second direction;

four data interfaces of the memory card controller (201) are connected with the first elastic sheet (11 a), the second elastic sheet (11 b), the ninth elastic sheet (11 i) and the tenth elastic sheet (11 j) in a one-to-one correspondence manner;

a data interface of the SIM card controller (202) is connected with the third elastic sheet (11 c), and a clock interface of the SIM card controller (202) is connected with the fourth elastic sheet (11 d);

one of a reference clock interface of the memory card controller (201) and a reset interface of the SIM card controller (202) is connected with the fifth elastic sheet (11 e), and the other one is connected with the sixth elastic sheet (11 f).

17. The electronic device (100) of claim 1, wherein the memory card controller (201) supports a PCIe interface protocol;

a reference clock interface and a second power interface of the memory card controller (201) are connected to the same one of the ten elastic pieces;

four data interfaces of the memory card controller (201) are connected to the other four spring pieces in ten spring pieces in a one-to-one correspondence manner;

the reset interface of the SIM card controller (202), the data interface of the SIM card controller (202) and the clock interface of the SIM card controller (202) are connected to the other three spring pieces in the ten spring pieces in a one-to-one correspondence manner.

18. The electronic device (100) according to claim 17, wherein the ten resilient pieces are arranged in a second direction to form a first row of resilient pieces and a second row of resilient pieces, the first row of resilient pieces comprises a first resilient piece (11 a), a third resilient piece (11 c), a fifth resilient piece (11 e), a seventh resilient piece (11 g) and a ninth resilient piece (11 i) arranged in the first direction, the second row of resilient pieces comprises a second resilient piece (11 b), a fourth resilient piece (11 d), a sixth resilient piece (11 f), an eighth resilient piece (11 h) and a tenth resilient piece (11 j) arranged in the first direction, and the first direction is perpendicular to the second direction;

four data interfaces of the memory card controller (201) are connected to the first elastic sheet (11 a), the second elastic sheet (11 b), the ninth elastic sheet (11 i) and the tenth elastic sheet (11 j) in a one-to-one correspondence manner;

a reference clock interface of the memory card controller (201) and a second power interface of the memory card controller (201) are connected to one of the fifth elastic sheet (11 e) or the sixth elastic sheet (11 f), and a reset interface of the SIM card controller (202) is connected to the other of the fifth elastic sheet (11 e) or the sixth elastic sheet (11 f).

19. The electronic device (100) according to any one of claims 4, 6, 8, 11, 14, 16 and 18, wherein ten of the resilient tabs are arranged in a first direction in a first row of resilient tabs (11 a, 11 b) to a fifth row of resilient tabs (11 i, 11 j);

the center distance between the second row of elastic sheets (11 c and 11 d) and the third row of elastic sheets (11 e and 11 f) is larger than the center distance between the first row of elastic sheets (11 a and 11 b) and the second row of elastic sheets (11 c and 11 d), and is larger than the center distance between the fourth row of elastic sheets (11 g and 11 h) and the fifth row of elastic sheets (11 i and 11 j);

The center distance between the third row of elastic sheets (11 e, 11 f) and the fourth row of elastic sheets (11 g, 11 h) is larger than the center distance between the first row of elastic sheets (11 a, 11 b) and the second row of elastic sheets (11 c, 11 d), and is larger than the center distance between the fourth row of elastic sheets (11 g, 11 h) and the fifth row of elastic sheets (11 i, 11 j).