CN217689875U - Shunt subassembly of high accuracy - Google Patents
Shunt subassembly of high accuracy Download PDFInfo
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- CN217689875U CN217689875U CN202122815708.0U CN202122815708U CN217689875U CN 217689875 U CN217689875 U CN 217689875U CN 202122815708 U CN202122815708 U CN 202122815708U CN 217689875 U CN217689875 U CN 217689875U
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- shunt
- printed circuit
- circuit board
- assembly
- temperature
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Abstract
The utility model discloses a high-precision shunt assembly, which comprises a shunt, a first printed circuit board, a second printed circuit board, at least one power resistor, at least one thermistor, a heat-conducting medium and a fixing external member; the shunt is arranged on the first printed circuit board, the power resistor and the thermistor are arranged on the second printed circuit board, the first printed circuit board and the second printed circuit board are assembled together by using a fixing sleeve, the power resistor, the thermistor and the shunt are close to but not in contact, and a gap is filled with a heat-conducting medium; the power resistor can effectively heat the shunt and control the temperature of the shunt, and the thermistor can effectively detect the actual temperature of the shunt.
Description
Technical Field
The utility model belongs to the thermostatic control field especially relates to a shunt that will detect heavy current usefulness and shunt thermostatic control's relevant parts equipment method.
Background
A shunt for detecting a large current, when the large current flows, the temperature rises due to self-heating, and the temperature rise changes the resistance value of the shunt, so-called temperature drift, and a typical value is 50PPM (parts per million); therefore, when the shunt is used for measuring large current, the temperature of the shunt body is stabilized, and the reduction of temperature drift is an effective mode for improving the detection precision. The shunt and other temperature sensitive devices such as an operational amplifier, an ADC, a crystal oscillator and the like are placed in a thermostat box, which is a typical thermostatic means, but the thermostat box has a large size and complicated control, and when the self-heating power of the shunt changes relatively greatly due to current change, the temperature of the shunt cannot be quickly stabilized at a certain temperature value, which causes great hysteresis in temperature control.
Disclosure of Invention
The utility model aims to overcome the not enough among the prior art and the shunt subassembly of an invention of a high accuracy can be fast, direct control and detect the temperature of shunt to realize the current detection of high accuracy.
The invention mounts the shunt on the first printed circuit board; the heating resistor and the temperature detecting component are arranged on a second printed circuit board, two sides of the temperature detecting component on the second printed circuit board are provided with grooves, and the temperature detecting component can be a positive temperature coefficient thermistor (PTC), a temperature coefficient thermistor (NTC), a Resistance Temperature Detector (RTD), an IC temperature sensor or a thermocouple. Filling a heat-conducting medium between the first printed circuit board and the second printed circuit board, and then passing through a screw and a screw column sleeve; after the components of the first printed circuit board and the second printed circuit board are assembled and fixed together face to face, the groove formed in the second printed circuit board is used for clearing heat conducting media on two sides of the temperature detection component, and the power resistor, the temperature detection component and the shunt are close to but not in contact with each other, so that the shunt can be directly heated by the heating resistor, and the temperature of the shunt body can also be directly detected by the temperature detection component, thereby directly and rapidly controlling and detecting the temperature of the shunt body.
Drawings
The present invention will be further explained with reference to the drawings and examples.
FIG. 1 is a front view of an assembled shunt and its thermostatic control member.
Figure 2 is an exploded view showing the assembly details of the diverter.
Fig. 3 is an exploded view showing details of heating resistance and temperature detection.
FIG. 4 is a detail view of slots on both sides of the thermistor.
Detailed Description
The invention is further described with reference to the following drawings and detailed description.
A high-precision shunt assembly comprises a shunt 101, at least one power resistor 102, a thermistor 103, a first printed circuit board 104, a second printed circuit board 105, a fixing screw 107 and a corresponding screw 106, and a heat conducting medium 108; the shunt 101 is mounted on a first printed circuit board 104 in a patch manner, the power resistor 102 and the thermistor 103 are mounted on a second printed circuit board 105 in a patch manner, and the device surfaces of the two printed circuit boards are opposite and fixed through screws and screws.
In this embodiment, the heating resistor 102 is a 2512 packaged chip power resistor, the thermistor is an NTC component 0402, and the heights of the two components are about 0.5mm, so that both the heating resistor and the thermistor can be flatly close to the shunt, and a heat-conducting medium, such as silicone grease or a heat-conducting gasket, needs to be filled in the middle due to the need of functional insulation.
The two printed circuit boards can be connected through screws and screw columns, and can also be connected through pins and corresponding connectors thereof; in this embodiment, the screw is preferably connected to a screw post, which is riveted to the first printed circuit board.
The shunt needs to transmit large current, so the printed circuit board where the shunt is located is generally a main board, and the main control device, such as an MCU, an operational amplifier, an analog-to-digital conversion chip and the like, can be contained on the main board; the printed circuit board on which the thermal resistor and the thermistor are arranged can be regarded as a daughter board; because the connecting part is metal, the fixed external member can be used for transmitting electric signals directly on the two printed circuit boards, temperature detection signals on the daughter boards are transmitted to the MCU of the mainboard through the fixed external member, and signals related to power control sent by the MCU of the mainboard can also control the heating of the heating resistor through the fixed external member.
In order to allow the thermistor to accurately detect the temperature of the shunt without being affected by the adjacent heating resistor, as shown in fig. 4, grooves 109 with a width exceeding 1mm may be formed on the circuit boards on both sides of the thermistor; after the two printed circuit boards are mounted, the heat conducting medium between the heating resistor and the thermistor can be removed through the opened groove 109, the influence of the heating resistor on the thermistor is reduced, and the real temperature of the shunt is detected.
While the disclosure has been disclosed by the description of the specific embodiments thereof, it will be appreciated that those skilled in the art will be able to devise various modifications, improvements, or equivalents of the disclosure within the spirit and scope of the appended claims. Such modifications, improvements and equivalents are also intended to be included within the scope of this disclosure.
Claims (5)
1. A high-precision shunt assembly is characterized by comprising a shunt, a first printed circuit board, a second printed circuit board, at least one power resistor, at least one temperature detection component, a heat conducting medium and a fixing sleeve; the shunt is arranged on the first printed circuit board, the power resistor and the temperature detection component are arranged on the second printed circuit board, the first printed circuit board and the second printed circuit board are assembled together by utilizing the fixing sleeve, the power resistor, the temperature detection component and the shunt are close to but not in contact, and a gap is filled with a heat conduction medium.
2. The high precision shunt assembly of claim 1, wherein the temperature sensing member is formed with a groove on the second pcb on both sides of the temperature sensing member, and the heat transfer medium on both sides of the temperature sensing member is removed through the groove formed on the second pcb after the assembly.
3. The shunt assembly of claim 1, wherein said temperature sensing element is selected from the group consisting of a PTC thermistor, a NTC thermistor, a resistance temperature sensor, an IC temperature sensor, and a thermocouple.
4. The high precision shunt assembly of claim 1, wherein said fastening assembly is a screw and stud assembly; or a pin header and its corresponding connector.
5. The high precision shunt assembly of claim 4, wherein said first printed circuit board and said second printed circuit board transmit electrical signals through said mounting assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122815708.0U CN217689875U (en) | 2021-11-17 | 2021-11-17 | Shunt subassembly of high accuracy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122815708.0U CN217689875U (en) | 2021-11-17 | 2021-11-17 | Shunt subassembly of high accuracy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217689875U true CN217689875U (en) | 2022-10-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122815708.0U Active CN217689875U (en) | 2021-11-17 | 2021-11-17 | Shunt subassembly of high accuracy |
Country Status (1)
| Country | Link |
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| CN (1) | CN217689875U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116360523A (en) * | 2023-03-26 | 2023-06-30 | 深圳市开步电子有限公司 | Shunt temperature control method, shunt, electric equipment and energy storage equipment |
-
2021
- 2021-11-17 CN CN202122815708.0U patent/CN217689875U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116360523A (en) * | 2023-03-26 | 2023-06-30 | 深圳市开步电子有限公司 | Shunt temperature control method, shunt, electric equipment and energy storage equipment |
| CN116360523B (en) * | 2023-03-26 | 2024-02-27 | 深圳市开步电子有限公司 | Shunt temperature control method, shunt, electric equipment and energy storage equipment |
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