CN217689521U - 10G double-fiber bidirectional optical module - Google Patents
10G double-fiber bidirectional optical module Download PDFInfo
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- CN217689521U CN217689521U CN202221366280.4U CN202221366280U CN217689521U CN 217689521 U CN217689521 U CN 217689521U CN 202221366280 U CN202221366280 U CN 202221366280U CN 217689521 U CN217689521 U CN 217689521U
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Abstract
The utility model provides a two-way optical module of 10G two-fiber belongs to optical device technical field, include, sealed lid, the outer wall department of sealed lid is located to the heat exchange assembly, wherein: the heat exchange assembly comprises a heat conducting rod, a heat radiating plate, a circulating pipe, a heat conducting block and a clamping frame, the heat conducting rod is fixedly connected with the heat radiating plate, the outer wall of one end of the circulating pipe is fixedly arranged at the bottom of the outer wall of the heat radiating plate, the heat conducting block is fixedly arranged at the center of the top of the outer wall of the sealing cover, the top of the outer wall of the heat conducting block is attached to the bottom of the outer wall of the heat radiating plate, and the clamping frame is embedded in the inner wall of the sealing cover. Through the heat exchange assembly, can realize stable chip heat dispersion, the heat that chip electric connection position and chip logic circuit part produced disperses through centre gripping frame and heat conduction piece respectively, concentrates on cooling through the heating panel, and cooling air current and heating panel carry out the heat exchange, improve the radiating effect, secondly adopt the circulating pipe, can realize stable supplementary heat dissipation, avoid the heat to pile up.
Description
Technical Field
The utility model belongs to the technical field of optical device, concretely relates to two-way optical module of 10G double fiber.
Background
Optical parts, also called optical elements, basic components of an optical system, most of which play a role in imaging, such as lenses, prisms, mirrors, etc., and also some parts playing special roles (such as light splitting, image transmission, filtering, etc.) in the optical system, such as reticles, filters, gratings for optical fiber parts, etc., holographic lenses, gradient index lenses, binary optical elements, etc.
In the actual use process, the multi-path parallel optical module structure formed by the optical component and the MT-FA array optical fiber finds that the heat generation points are inconsistent, a single heat dissipation mode easily causes a large amount of heat to be accumulated on a chip, so that the chip is damaged, the existing heat dissipation structure is limited by the surface area, the heat dissipation efficiency is not high, the optical fiber occupies partial space, and the overall heat dissipation effect is further reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a two-way optical module of 10G double fiber aims at solving the problem that the background art provided.
A10G double-fiber bidirectional optical module comprises,
a sealing cover;
the heat exchange assembly is arranged at the outer wall of the sealing cover, wherein: the heat exchange assembly comprises a heat conducting rod, a heat radiating plate, a circulating pipe, a heat conducting block and a clamping frame, wherein the heat conducting rod is fixedly connected with the heat radiating plate, one end outer wall of the circulating pipe is fixedly arranged at the bottom of the outer wall of the heat radiating plate, the heat conducting block is fixedly arranged at the center of the top of the outer wall of the sealing cover, the top of the outer wall of the heat conducting block is attached to the bottom of the outer wall of the heat radiating plate, the clamping frame is embedded in the position of the inner wall of the sealing cover, and the clamping frame is fixedly connected with the heat conducting rod.
Furthermore, a communicating pipe is embedded in the center of one side of the outer wall of the sealing cover, and a protection pipe is communicated with one end of the communicating pipe.
Furthermore, the protection tube is embedded in the inner wall of the circulating tube.
Furthermore, three dispersing holes are formed in the bottom of the outer wall of the sealing cover, the heat conducting rod is matched with the dispersing holes, and a chip is embedded in the inner wall of the clamping frame.
Furthermore, the bottom of the outer wall of the sealing cover is provided with heat dissipation holes.
Furthermore, the top of the outer wall of the heat dissipation plate is provided with honeycomb holes.
Compared with the prior art, the beneficial effects of the utility model are that:
in this scheme, through the heat exchange assembly, can realize stable chip heat dispersion, the heat that chip electric connection position and chip logic circuit part produced disperses through centre gripping frame and heat conduction piece respectively, concentrates on cooling through the heating panel, and cooling air current and heating panel carry out the heat exchange, improve the radiating effect, secondly adopt the circulating pipe, can realize stable supplementary heat dissipation, avoid the heat to pile up.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the principles of the invention. In the drawings:
fig. 1 is a perspective view of the present invention;
FIG. 2 is a front view of the present invention;
fig. 3 is a bottom view of the present invention;
FIG. 4 is a perspective view of the heat conducting block of the present invention;
FIG. 5 is a schematic diagram of the chip of the present invention;
fig. 6 is a schematic view of the dispersion holes of the present invention.
In the figure: 1. a sealing cover; 2. a heat conducting rod; 3. a heat dissipation plate; 4. a circulation pipe; 5. protecting the tube; 6. a heat conducting block; 7. a clamping frame; 8. a chip; 9. a communicating pipe; 101. heat dissipation holes; 102. a dispersion hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; the connection can be mechanical connection or electrical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-6, the technical solution provided by this embodiment is as follows:
A10G dual-fiber bidirectional optical module comprises,
a sealing cover 1;
the heat exchange assembly is arranged at the outer wall of the sealing cover 1, wherein: the heat exchange assembly comprises a heat conducting rod 2, a heating panel 3, a circulating pipe 4, a heat conducting block 6 and a clamping frame 7, the heat conducting rod 2 is fixedly connected with the heating panel 3, one end outer wall of the circulating pipe 4 is fixedly arranged at the bottom of the outer wall of the heating panel 3, the heat conducting block 6 is fixedly arranged at the center of the top of the outer wall of the sealing cover 1, the top of the outer wall of the heat conducting block 6 is attached to the bottom of the outer wall of the heating panel 3, the clamping frame 7 is embedded in the position of the inner wall of the sealing cover 1, and the clamping frame 7 is fixedly connected with the heat conducting rod 2.
The utility model discloses an in the concrete embodiment, through the heat exchange assembly, can realize stable 8 heat dispersions of chip, the heat that 8 electric connection positions of chip and 8 logic circuit parts produced disperses through centre gripping frame 7 and heat conduction piece 6 respectively, concentrates and cools off through heating panel 3, and cooling air current and heating panel 3 carry out the heat exchange, improve the radiating effect, secondly adopt circulating pipe 4, can realize stable supplementary heat dissipation, avoid the heat to pile up.
Specifically, the center of one side of the outer wall of the sealing cover 1 is embedded with a communicating pipe 9, and one end of the communicating pipe 9 is communicated with a protection pipe 5.
The utility model discloses an in the embodiment, through communicating pipe 9, can realize that stable protection tube 5 is sealed, avoid producing infiltration moisture and the air of sealed lid 1.
Specifically, the protection tube 5 is embedded in the inner wall of the circulation tube 4.
In the embodiment of the present invention, the protection tube 5 is embedded in the inner wall of the circulation tube 4, so that stable auxiliary heat dissipation can be realized.
Specifically, three dispersing holes 102 are formed in the bottom of the outer wall of the sealing cover 1, the heat conducting rod 2 is matched with the dispersing holes 102, and the chip 8 is embedded in the inner wall of the clamping frame 7.
In the embodiment of the present invention, the heat generated by the logic circuit of the chip 8 can be stably exchanged through the clamping frame 7.
Specifically, the bottom of the outer wall of the sealing cover 1 is provided with a heat radiation hole 101.
The utility model discloses an in the embodiment, louvre 101 has been seted up through the outer wall bottom of sealed lid 1, can improve the radiating effect.
Specifically, honeycomb holes are formed in the top of the outer wall of the heat dissipation plate 3.
In the embodiment of the present invention, the honeycomb holes are formed on the top of the outer wall of the heat dissipation plate 3, so that the flow of the cooling air flow can be ensured.
The utility model provides a pair of two-way optical module of 10G double fiber's working process does:
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A10G double-fiber bidirectional optical module is characterized by comprising,
a sealing cover (1);
the heat exchange assembly is arranged on the outer wall of the sealing cover (1), wherein: the heat exchange assembly comprises a heat conducting rod (2), a heat radiating plate (3), a circulating pipe (4), a heat conducting block (6) and a clamping frame (7), the heat conducting rod (2) is fixedly connected with the heat radiating plate (3) in a mutual mode, the outer wall of one end of the circulating pipe (4) is fixedly arranged at the bottom of the outer wall of the heat radiating plate (3), the heat conducting block (6) is fixedly arranged at the center of the top of the outer wall of the sealing cover (1), the top of the outer wall of the heat conducting block (6) is attached to the bottom of the outer wall of the heat radiating plate (3), the clamping frame (7) is embedded in the inner wall of the sealing cover (1), and the clamping frame (7) is fixedly connected with the heat conducting rod (2) in a mutual mode.
2. The 10G dual-fiber bidirectional optical module according to claim 1, wherein a communication pipe (9) is embedded in a center of one side of an outer wall of the sealing cover (1), and one end of the communication pipe (9) is communicated with a protection pipe (5).
3. A 10G dual-fiber bidirectional optical module according to claim 2, wherein the protection tube (5) is embedded at an inner wall of the circulation tube (4).
4. A 10G bi-directional optical module as claimed in claim 3, wherein the bottom of the outer wall of the sealing cover (1) is provided with three dispersion holes (102), the heat conduction rod (2) and the dispersion holes (102) are matched with each other, and the inner wall of the clamping frame (7) is embedded with the chip (8).
5. A10G double-fiber bidirectional optical module according to claim 4, wherein the bottom of the outer wall of the sealing cover (1) is provided with a heat dissipation hole (101).
6. A10G double-fiber bidirectional optical module according to claim 5, wherein the top of the outer wall of the heat dissipation plate (3) is provided with honeycomb holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221366280.4U CN217689521U (en) | 2022-06-01 | 2022-06-01 | 10G double-fiber bidirectional optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221366280.4U CN217689521U (en) | 2022-06-01 | 2022-06-01 | 10G double-fiber bidirectional optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217689521U true CN217689521U (en) | 2022-10-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221366280.4U Active CN217689521U (en) | 2022-06-01 | 2022-06-01 | 10G double-fiber bidirectional optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217689521U (en) |
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2022
- 2022-06-01 CN CN202221366280.4U patent/CN217689521U/en active Active
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