CN217654995U

CN217654995U - Detection device

Info

Publication number: CN217654995U
Application number: CN202221876601.5U
Authority: CN
Inventors: 佟杰; 郭青杨; 李瑞青; 周尧; 马铁中
Original assignee: Beijing Ankun Semiconductor Equipment Co ltd
Current assignee: Ongkun Vision Beijing Technology Co ltd
Priority date: 2022-07-20
Filing date: 2022-07-20
Publication date: 2022-10-25
Anticipated expiration: 2032-07-20

Abstract

The utility model provides a detection device, including the supporting component, first drive slip table, the setting is on the supporting component, sliding assembly, the setting is on first drive slip table, first drive slip table is used for driving sliding assembly and removes, the objective table, the setting is on sliding assembly, carrier assembly, the setting is on the objective table, vertical drive subassembly, the setting is in the supporting component top, test probe and a plurality of groups lower test probe are gone up to a plurality of groups, all be used for detecting the wafer, it sets up on vertical drive subassembly to go up test probe, vertical drive subassembly is used for driving upper test probe longitudinal movement, lower test probe sets up in the objective table. The utility model provides a detection device can solve among the prior art detection device and adopt single probe to detect not only inefficiency, produces the problem that detects the dead angle easily when detecting moreover.

Description

Detection device

Technical Field

The utility model relates to a wafer check out test set technical field, in particular to detection device.

Background

With the rapid development of electronic products, as the production and manufacture of electronic products do not depart from the semiconductor industry, the industry utilizes semiconductor equipment to carry out complex process treatment on wafers, the wafers after the treatment need to be detected, a wafer surface shape measuring and sorting system is an important application of an automatic optical detection technology, and besides the detection capability, the yield is a key index of evaluation equipment.

Among the prior art, detection device is single probe and carries out line by line scanning detection to the wafer surface, and not only detection efficiency is lower, produces the detection dead angle moreover easily when detecting the wafer.

SUMMERY OF THE UTILITY MODEL

Based on this, the utility model aims at providing a detection device, its aim at solves prior art, and detection device adopts single probe to detect not only inefficiency, produces the detection dead angle easily when detecting moreover.

The utility model provides the following technical proposal, a detection device, which comprises a shell;

a support assembly;

the first driving sliding table is arranged on the supporting assembly;

the sliding assembly is arranged on the first driving sliding table, and the first driving sliding table is used for driving the sliding assembly to move;

the object stage is arranged on the sliding assembly;

the bearing assembly is arranged on the objective table;

a longitudinal drive assembly disposed above the support assembly;

the wafer detection device is characterized in that a plurality of groups of upper detection probes are arranged on the longitudinal driving assembly, a plurality of groups of lower detection probes are arranged in the objective table, the upper detection probes and the lower detection probes are used for detecting the wafer, and the longitudinal driving assembly is used for driving the upper detection probes to move longitudinally.

Compared with the prior art, the beneficial effects of the utility model are that: through setting up test probe and test probe down on a plurality of groups for this detection device's detection range is wider than the detection range of single probe, effectively promotes detection efficiency, and through first drive slip table drive slip subassembly, the slip subassembly drives the objective table that bears the weight of the wafer and slides, thereby can adjust test probe and test probe's down detection range, avoids producing and detects the dead angle.

Furthermore, the supporting assembly comprises a platform and a plurality of supporting legs arranged at the bottom of the platform, and the supporting legs are connected with each other through reinforcing ribs.

Further, the reinforcing ribs are arranged at the top and the bottom of the supporting leg.

Furthermore, a shock pad is arranged at the joint of the supporting leg and the platform.

Furthermore, the bottom of the supporting leg is connected with a universal wheel and an anti-slip pad, and the anti-slip pad is arranged on one side of the universal wheel.

Furthermore, the sliding assembly comprises a first sliding table and a second sliding table, the first sliding table is arranged on the first driving sliding table in a sliding mode, the second sliding table is arranged on the first sliding table in a sliding mode, the first driving sliding table is used for driving the first sliding table and the second sliding table to slide, and the sliding directions of the first sliding table and the second sliding table are perpendicular to each other.

Further, the bearing component comprises a bearing plate arranged on the objective table, through holes are formed in the bearing plate, a plurality of groups of supporting pieces are arranged on the inner wall of each through hole at equal intervals, and the supporting pieces are used for supporting the edges of the wafers.

Furthermore, the longitudinal driving assembly comprises a cross beam and a second driving sliding table arranged on the cross beam, the cross beam is overlapped above the supporting assembly, the second driving sliding table is arranged on the cross beam, and the second driving sliding table is used for driving the upper detection probe to longitudinally slide.

Furthermore, the bottom of the object stage is connected with a support, and the object stage is connected to the sliding assembly through the support.

Further, be equipped with the installation department in the sliding assembly, the installation department is installed bearing assembly below, and be used for the installation lower test probe.

Drawings

Fig. 1 is a schematic perspective view of a detection device according to a first embodiment of the present invention;

fig. 2 is a front view of a detecting device according to a first embodiment of the present invention;

fig. 3 is a top view of a detecting device according to a first embodiment of the present invention;

fig. 4 is a top view of the stage of the present invention;

fig. 5 is a schematic perspective view of a detecting device according to a second embodiment of the present invention;

fig. 6 is a front view of a detecting device according to a second embodiment of the present invention;

fig. 7 is a plan view of a detecting device according to a second embodiment of the present invention;

description of the main element symbols:

the following detailed description of the invention will be further described in conjunction with the above-identified drawings.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the invention are presented in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for purposes of illustration only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Example one

Referring to fig. 1 to 4, a detecting apparatus according to a first embodiment of the present invention is shown, which includes a supporting assembly 10, a first driving sliding table 20, an object stage 40, a sliding assembly 30, a longitudinal driving assembly 60, a carrying assembly 80, a plurality of sets of upper detecting probes 71, and a plurality of sets of lower detecting probes 72.

Wherein, go up test probe 71 with test probe 72 is two sets of down, first drive slip table 20 sets up on the supporting component 10, slip subassembly 30 sets up on the first drive slip table 20, first drive slip table 20 is used for driving slip subassembly 30 and removes, objective table 40 sets up on the slip subassembly 30, vertical drive subassembly 60 sets up the top of supporting component 10 is two sets of it sets up to go up test probe 71 and set up on the vertical drive subassembly 60, vertical drive subassembly 60 is used for the drive go up test probe 71 and carry out fore-and-aft removal, and is two sets of test probe 72 sets up down in the objective table 40, objective table 40 slide subassembly 30 first drive slip table 20 all is hollow structure for test probe 72 under the installation.

It can be understood that, place the wafer that awaits measuring on bearing component 80 on objective table 40, then detect the wafer through two sets of test probes 71 and two sets of lower test probes 72 of going up, in order to enlarge detection range, can remove through first drive slip table 20 drive sliding assembly 30, sliding assembly 30 can drive objective table 40 and remove, thereby make the wafer of placing on objective table 40 can follow the removal of objective table 40 and reach the adjusting position, and then make the detection range of wafer wider, avoid producing the detection dead angle, and sliding assembly 30 can drive objective table 40 and remove in two mutually perpendicular's directions, make the moving range of objective table 40 more extensive, and drive the wafer on objective table 40 and carry out wider removal in scope, reduce the dead angle of wafer detection time measuring.

Referring to fig. 1 and 2, in the present embodiment, the support assembly 10 includes a platform 11 and four sets of support legs 12, the support legs 12 are connected to the bottom of the platform 11 at equal intervals, so that the support legs 12 can support the platform 11 more stably, the four sets of support legs 12 are connected to each other through reinforcing ribs 13, the reinforcing ribs 13 can effectively improve the strength between the support legs 12, so that the support legs 12 can support the platform 11 more firmly without generating the phenomena such as tilting, and the reinforcing ribs 13 connect the top and the bottom of the support legs 12, so that the four sets of support legs 12 are connected together more firmly.

The damping pad 16 is arranged at the joint of the supporting leg 12 and the platform 11, so that fine vibration caused by the fact that the ground is hit by a heavy object can be buffered through the damping pad 16, the influence of the fine vibration on the detection of the device on the wafer is avoided, and the influence of accidental events on the wafer during detection is prevented. The material that platform 11 adopted is the marble material, and marble material nature is stable, and is not fragile, and can polish its surface smoothly level, so not only can promote platform 11's life, but also can make first drive slip table 20, the sliding component 30 etc. that set up on platform 11, can be more level, avoid placing crooked and produce the influence to wafer detection.

Wherein, landing leg 12 bottom is connected with universal wheel 14 and slipmat 15, makes removing that the device can be convenient through setting up universal wheel 14, and the vibration that produces at the removal in-process all can reduce through shock pad 16, avoids vibrating the accuracy nature that too big influence set up the spare part on platform 11. When the device is moved to a proper position, the device is prevented from sliding freely on the ground by the anti-slip mat 15 attached to the bottom surface, so that the stability of the device during detection is improved.

Referring to fig. 1 and fig. 2, in the present embodiment, the sliding assembly 30 includes a first sliding table 31 and a second sliding table 32, the first sliding table 31 is slidably disposed on the first driving sliding table 20, the second sliding table 32 is slidably disposed on the first sliding table 31, the first driving sliding table 20 is configured to drive the first sliding table 31 and the second sliding table 32 to slide, the sliding directions of the first sliding table 31 and the second sliding table 32 are perpendicular to each other, the longitudinal driving assembly 60 includes a cross beam 61 and a second driving sliding table 62 disposed on the cross beam 61, the cross beam 61 is overlapped above the supporting assembly 10, that is, above the platform 11, the second driving sliding table 62 is disposed on the cross beam 61, the second driving sliding table 62 is configured to drive the upper detection probe 71 to slide longitudinally, the first sliding table 31 and the second sliding table 32 move in the x direction and the y direction on the plane of the first driving sliding table 20, so that after the sliding directions of the first sliding table 31 and the second sliding table 32 are staggered together, all places in the plane can be covered, therefore, when the first driving sliding table 20 drives the first sliding table 31 to move in the x direction, the first sliding table 31 drives the second sliding table 32 to move in the x direction, the second sliding table 32 drives the object stage 40 to move in the x direction, so that a wafer placed on the object stage 40 can also move in the x direction, the first driving sliding table 20 drives the second sliding table 32 to move in the y direction, the second sliding table 32 drives the object stage 40 to move in the y direction, so that the wafer placed on the object stage 40 can also move in the y direction, further, the moving range of the wafer is wider, and the range of the wafer to be detected is widened, the wafer is prevented from generating dead angles during detection, and the detection effect of the wafer is improved. And because the upper detection probe 71 and the lower detection probe 72 of the device are both provided with two groups, the moving range of the wafer is smaller than that of a single probe, so that the detection time can be reduced, and the detection efficiency can be improved. The second driving sliding table 62 drives the upper detection probe 71 to move up and down, so that the device can detect wafers with different thicknesses, and the practicability of the device is improved.

Referring to fig. 4, in the present embodiment, the carrier assembly 80 includes a carrier plate 81 disposed on the stage 40, through holes 82 are disposed on the carrier plate 81, a plurality of sets of supporting members 83 are disposed on an inner wall of the through holes 82 at equal intervals, the supporting members 83 are used for supporting an edge of the wafer, and after the edge of the wafer is supported, an upper surface and a lower surface of the wafer are not covered, so that the upper detection probe 71 and the lower detection probe 72 can effectively detect the wafer.

Referring to fig. 1 and fig. 2, in the present embodiment, four sets of support columns 41 are equidistantly connected to the bottom of the object stage 40, the object stage 40 is connected to the sliding assembly 30 through the support columns 41, a mounting portion 50 is disposed in the sliding assembly 30, and the mounting portion 50 is disposed below the bearing assembly 80 and is used for mounting the lower detection probe 72.

It will be appreciated that the object table 40 can be raised to its height by the support posts 41, thereby facilitating a space beneath the object table 40 for receiving the lower inspection probe 72. The middle of the sliding assembly 30 is hollow, and the mounting portion 50 is fixedly disposed in the sliding assembly 30, that is, in the hollow position of the sliding assembly 30, so that the sliding assembly 30 has enough space to dispose the mounting portion 50, and the lower detection probe 72 can be more stably mounted on the mounting portion 50.

Example two

Referring to fig. 5 to 7, a detecting device according to a second embodiment of the present invention is shown, wherein the detecting device of the present embodiment is different from the detecting device of the first embodiment in that: the upper detection probe 71 and the lower detection probe 72 are provided with four groups, and the four groups of upper detection probes 71 and the four groups of lower detection probes 72 are smaller in scanning range of the wafer by each detection probe in the four groups of detection probes than the two groups of upper detection probes 71 and the two groups of lower detection probes 72, so that scanning time is reduced, the wafer can be detected more quickly, and detection efficiency is effectively improved.

To sum up, the utility model discloses detection device in the middle of the above-mentioned embodiment is through the last test probe 71 and the lower test probe 72 that set up the multiunit to use can remove for the objective table 40 of placing the wafer, thereby make test probe 71 and multiunit down test probe 72 can be quick on the multiunit detect the wafer, and the wafer of removal not only can reduce and detect the dead angle, can also promote detection efficiency, the effectual productivity that promotes this detection device.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A detection device for wafer detection, comprising:

a support assembly;

the first driving sliding table is arranged on the supporting assembly;

the object stage is arranged on the sliding assembly;

the bearing assembly is arranged on the objective table;

a longitudinal drive assembly disposed above the support assembly;

the wafer detection device is characterized in that a plurality of groups of upper detection probes are arranged on the longitudinal driving assembly, a plurality of groups of lower detection probes are arranged in the objective table, the upper detection probes and the lower detection probes are all used for detecting the wafer, and the longitudinal driving assembly is used for driving the upper detection probes to move longitudinally.

2. The testing device of claim 1, wherein the support assembly comprises a platform and a plurality of legs disposed at a bottom of the platform, the plurality of legs being interconnected by a stiffener.

3. The test device of claim 2, wherein the stiffeners are disposed at the top and bottom of the legs.

4. The detection device according to claim 2, wherein a shock pad is provided at a junction of the leg and the platform.

5. The detection device according to claim 2, wherein a universal wheel and a non-slip mat are connected to the bottom of the leg, and the non-slip mat is arranged on one side of the universal wheel.

6. The detection device according to claim 1, wherein the sliding assembly includes a first sliding table and a second sliding table, the first sliding table is slidably disposed on the first driving sliding table, the second sliding table is slidably disposed on the first sliding table, the first driving sliding table is configured to drive the first sliding table and the second sliding table to slide, and sliding directions of the first sliding table and the second sliding table are perpendicular to each other.

7. The detecting apparatus according to claim 1, wherein the supporting assembly includes a supporting plate disposed on the stage, the supporting plate has through holes, and a plurality of sets of supporting members are disposed at equal intervals on inner walls of the through holes, and the supporting members are used for supporting edges of the wafer.

8. The detection device according to claim 1, wherein the longitudinal driving assembly comprises a cross beam and a second driving sliding table arranged on the cross beam, the cross beam is overlapped above the supporting assembly, the second driving sliding table is arranged on the cross beam, and the second driving sliding table is used for driving the upper detection probe to slide longitudinally.

9. The inspection device of claim 1, wherein a support post is attached to the bottom of the stage, the stage being attached to the slide assembly via the support post.

10. The inspection device of claim 1, wherein a mounting portion is provided in the slide assembly, the mounting portion being mounted below the carrier assembly and configured to mount the lower inspection probe.