CN217641386U

CN217641386U - LED packaging structure

Info

Publication number: CN217641386U
Application number: CN202221039726.2U
Authority: CN
Inventors: 刘晓丽; 易巨荣; 周建华; 张振强
Original assignee: Guangdong Tianji Optoelectronics Co ltd
Current assignee: Guangdong Tianji Optoelectronics Co ltd
Priority date: 2022-04-29
Filing date: 2022-04-29
Publication date: 2022-10-21
Anticipated expiration: 2032-04-29

Abstract

The utility model relates to an illumination lamps and lanterns field discloses a LED packaging structure, including plastic substrate, a chip, first pad and second pad, plastic substrate is provided with the cavity, the opening of cavity up, just partly leak in the bottom of cavity outward in first pad and the second pad embedding plastic substrate, two electrodes of chip are connected with first pad and second pad respectively, the opening top edge department of cavity has the chimb towards the middle part level extension of cavity, the upper surface of first pad and second pad is provided with a plurality of concave points, the cavity intussuseption is filled with the encapsulation and glues, the encapsulation is glued and is bonded with chimb and concave point respectively. According to the utility model discloses a LED packaging structure, through optimizing the structure, improve the encapsulation reliability that the encapsulation was glued, improve life.

Description

LED packaging structure

Technical Field

The utility model relates to an illumination lamps and lanterns field especially relates to a LED packaging structure.

Background

The LED lamp is used as an energy-saving semiconductor device and is more and more widely applied. In the packaging process of the LED, die bonding is an essential step. Die bonding refers to injecting packaging glue into a lamp cavity of a plastic substrate to fix a chip. However, in the actual use process, the aging of the packaging adhesive is accelerated due to the high heat generated by the light emission of the chip, the packaging adhesive is easy to fall off from the plastic substrate, the packaging reliability is reduced, and the LED lamp cannot be normally used.

SUMMERY OF THE UTILITY MODEL

The utility model aims at: the utility model provides a LED packaging structure, through optimizing structure, improve the encapsulation reliability of encapsulation glue, improve life.

In order to achieve the above object, the present invention provides an LED package structure, which includes a plastic substrate, a chip, a first bonding pad and a second bonding pad.

The chip comprises a plastic substrate and a chip, wherein the plastic substrate is provided with a concave cavity, the opening of the concave cavity faces upwards, a first bonding pad and a second bonding pad are embedded into the plastic substrate and partially leak out of the bottom of the concave cavity, two electrodes of the chip are respectively connected with the first bonding pad and the second bonding pad, and the upper edge of the opening of the concave cavity horizontally extends towards the middle of the concave cavity to form a convex edge; a plurality of concave points are arranged on the upper surfaces of the first bonding pad and the second bonding pad; and the cavity is filled with packaging glue, and the packaging glue is respectively bonded with the convex edge and the concave point.

According to some embodiments of the utility model, the chimb is close to one side at the middle part of cavity is provided with the sawtooth.

According to some embodiments of the present invention, the first pad and the second pad respectively leak outside in both sides of the plastic substrate.

According to some embodiments of the present invention, the first pad and the second pad all protrude from the underside of the plastic substrate.

According to some embodiments of the present invention, the encapsulation adhesive is an epoxy resin with phosphor.

The embodiment of the utility model provides a LED packaging structure, compared with the prior art, its beneficial effect lies in:

the utility model discloses LED packaging structure, through adding and establishing the chimb, the chimb sets up in the opening top edge department of cavity, chimb and first pad, form the recess between the second pad, the encapsulation is glued and is flowed into in the recess, treat that the encapsulation glues the back that solidifies, the chimb plays the gluey effect of fixed encapsulation, be favorable to preventing that the encapsulation from gluing to drop, be provided with the pit on first pad and the second pad simultaneously, be favorable to improving the encapsulation and glue and first pad, the bonding area of second pad, thereby be favorable to improving the encapsulation reliability that the encapsulation was glued. Therefore, the utility model discloses LED packaging structure through optimizing the structure, improves the encapsulation reliability that the encapsulation was glued, improves life.

Drawings

Fig. 1 is a schematic view of a first plane of depression of an LED package structure according to an embodiment of the present invention;

fig. 2 is a second schematic top view of an LED package structure according to an embodiment of the present invention;

fig. 3 is a third side cross-sectional view of an LED package structure according to an embodiment of the present invention;

fig. 4 is a fourth side cross-sectional view of an LED package structure according to an embodiment of the present invention.

Reference numerals:

a plastic substrate 1; a cavity 11; a flange 12; saw teeth 13; a first pad 2; a second pad 3; a pit 4; packaging glue 5; and a chip 6.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of meanings are one or more, a plurality of meanings are two or more, and the terms greater than, smaller than, exceeding, etc. are understood as excluding the number, and the terms greater than, lower than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

An LED package structure according to an embodiment of the present invention is described below with reference to fig. 1 to 4.

As shown in fig. 1, according to the embodiment of the present invention, the present invention provides a LED package structure, which comprises a plastic substrate 1, a chip 6, a first bonding pad 2 and a second bonding pad 3.

The plastic substrate 1 is provided with a cavity 11 and a convex edge 12, and the chip 6 and the packaging adhesive 5 are arranged in the cavity 11. The cavity 11 is opened upward, and the cavity 11 is provided on the upper surface of the plastic substrate 1. The rim 12 is provided at the upper edge of the opening of the cavity 11, and the rim 12 extends toward the middle of the cavity 11 such that the opening of the cavity 11 becomes smaller. It will be appreciated that the plane of the rim 12 may be level with the upper plane of the plastic substrate 1.

The first bonding pad 2 and the second bonding pad 3 are arranged at intervals and are respectively a positive electrode and a negative electrode of the LED lamp, the first bonding pad 2 and the second bonding pad 3 are embedded in the plastic substrate 1, and the parts of the first bonding pad 2 and the second bonding pad 3, which protrude out of the plastic substrate 1, are connected with an external circuit.

First pad

2 and 3 partial bottom of leaking in cavity 11 of second pad, chimb 12, the side of plastic substrate 1 and first pad 2 constitute the recess, chimb 12, the side of plastic substrate 1 and second pad 3 also constitute the recess, when filling encapsulation glue 5 in the cavity 11, partial encapsulation glue 5 flows into in the recess, after encapsulation glue 5 solidifies, chimb 12 is fixed in cavity 11 with encapsulation glue 5 in for encapsulation glue 5 is difficult to break away from cavity 11. The upper surface of first pad 2 and second pad 3 is provided with a plurality of

concave points

4, and 11 intussuseptions of cavity are filled with the encapsulation and are glued 5, and the encapsulation is glued 5 and is bonded with chimb 12, concave point 4 respectively, through installing concave point 4 additional, can increase the bonding area that the encapsulation was glued 5 and first pad 2, second pad 3 to be favorable to reducing the possibility that the encapsulation was glued 5 and is come off.

It will be understood that the rim 12 may be provided around the entire periphery of the opening of the cavity 11 as shown in fig. 1 and 2, and the rim 12 may be provided around part of the periphery of the opening of the cavity 11, for example, when the plastic substrate 1 and the cavity 11 are square, the rim 12 may be provided around the four peripheries of the opening of the cavity 11, and the rim 12 may be provided around one, two or more of the peripheries of the cavity 11.

It should be noted that the encapsulation adhesive 5 may be a silica gel with phosphor or an epoxy resin, and the epoxy resin has a characteristic of low cost.

The utility model discloses LED packaging structure, establish chimb 12 through adding, chimb 12 sets up the opening top edge department at cavity 11, chimb 12 and first pad 2, form the recess between the

second pad

3, 5 flows into in the recess are glued in the encapsulation, treat that encapsulation glues 5 and solidify the back, chimb 12 plays the effect that fixed encapsulation glued 5, be favorable to preventing that encapsulation glues 5 and drops, be provided with concave point 4 on first pad 2 and the second pad 3 simultaneously, be favorable to improving encapsulation and glue 5 and first pad 2, the bonding area of second pad 3, thereby be favorable to improving the encapsulation reliability that 5 was glued in the encapsulation. Therefore, the utility model discloses LED packaging structure, through optimizing the structure, improve the encapsulation reliability that the encapsulation was glued 5, improve life.

In some embodiments of the present invention, as shown in fig. 2, the convex edge 12 is provided with the saw teeth 13 near the middle of the cavity 11, so as to increase the bonding area between the encapsulation adhesive 5 and the convex edge 12, which is beneficial to improving the reliability of the encapsulation adhesive 5.

In some embodiments of the utility model, as shown in fig. 3 and 4, adopt the mode of installing chimb 12 additional at cavity 11 opening, be applicable to first pad 2 and second pad 3 and leak the packaging mode in plastic substrate 1 both sides respectively outward, also be applicable to first pad 2 and second pad 3 and all leak the packaging mode in plastic substrate 1 lower surface outward, application scope is more extensive.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. The utility model provides a LED packaging structure, includes plastic substrate, chip, first pad and second pad, plastic substrate is provided with the cavity, the opening of cavity up, first pad with the embedding of second pad plastic substrate and part leak outward in the bottom of cavity, two electrodes of chip are connected its characterized in that with first pad and second pad respectively:

the upper edge of the opening of the concave cavity extends horizontally towards the middle of the concave cavity to form a convex edge; a plurality of concave points are arranged on the upper surfaces of the first bonding pad and the second bonding pad; and the concave cavity is filled with packaging glue, and the packaging glue is respectively bonded with the convex edge and the concave point.

2. The LED package structure of claim 1, wherein a side of the raised edge near the middle of the cavity is provided with serrations.

3. The LED package structure of claim 1, wherein the first bonding pad and the second bonding pad respectively leak out of two sides of the plastic substrate.

4. The LED package structure of claim 1, wherein the first pad and the second pad both leak out of the lower surface of the plastic substrate.

5. The LED package structure of claim 1, wherein the encapsulant is an epoxy with phosphor.