CN209389058U - A kind of light emitting diode - Google Patents
A kind of light emitting diode Download PDFInfo
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- CN209389058U CN209389058U CN201822190829.9U CN201822190829U CN209389058U CN 209389058 U CN209389058 U CN 209389058U CN 201822190829 U CN201822190829 U CN 201822190829U CN 209389058 U CN209389058 U CN 209389058U
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- packing colloid
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Abstract
The utility model discloses a kind of light emitting diode, which includes: the first metal layer, second metal layer, resin portion, reflective layer and at least one LED chip；Resin portion is connected between the first metal layer and second metal layer, at least one LED chip is installed on the upper surface of the first metal layer, and the surrounding that reflective layer is set at least one LED chip forms reflective bowl；The lower surface of the first metal layer is provided with the first weld metal layers, and the first weld metal layers are provided at least one first groove close to one end of resin portion；The lower surface of second metal layer is provided with the second weld metal layers, and the second weld metal layers are provided at least one second groove close to one end of resin portion.The light emitting diode of the utility model can effectively increase the connection yield of light emitting diode, improve the reliability of light emitting diode.
Description
Technical field
The utility model relates to LED technology field more particularly to a kind of light emitting diodes.
Background technique
Light emitting diode has been widely used in general illumination, backlight module etc. because having many advantages, such as that light efficiency height, service life are long
Field.As shown in Figure 1, being the structural schematic diagram of existing light emitting diode.Existing light emitting diode includes the first metal layer
101, second metal layer 102, reflective layer 200, resin portion 103, LED chip 300 and packing colloid layer 400, wherein the first metal
Layer 101, second metal layer 102 and resin portion 103 constitute bracket, which is fixed on the first metal layer 101.
In the manufacturing process of bracket, since metal layer is different with the thermal expansion coefficient of resin portion, metal layer and resin portion
It can lead between metal layer and resin that there are gaps because thermal histories are inconsistent；Alternatively, being touched between bracket and clamp tool
It hits, so that deformation occurs for bracket, also results between metal layer and resin portion that there are gaps.When being deposited between metal layer and resin portion
At gap, during encapsulating light emitting diode, packaging silicon rubber, which is easy to leak out from gap, is attached to the metal layer back side, in turn
Lead to the bad connection of light emitting diode.
Utility model content
In view of the above-mentioned problems, a kind of light emitting diode of the utility model, can effectively increase the connection of light emitting diode
Yield improves the reliability of light emitting diode.
In order to solve the above technical problems, a kind of light emitting diode of the utility model, comprising: the first metal layer, the second gold medal
Belong to layer, resin portion, reflective layer and at least one LED chip；Wherein,
The resin portion is connected between the first metal layer and the second metal layer, at least one described LED core
Piece is installed on the upper surface of the first metal layer, and the surrounding that the reflective layer is set at least one LED chip is formed
Reflective bowl；
The lower surface of the first metal layer is provided with the first weld metal layers, and first weld metal layers are close to described
One end of resin portion is provided at least one first groove；
The lower surface of the second metal layer is provided with the second weld metal layers, and second weld metal layers are close to described
One end of resin portion is provided at least one second groove.
Compared with prior art, in the light emitting diode of the utility model, the first metal layer, second metal layer and resin
Portion constitutes bracket, wherein the first metal layer is for carrying at least one LED chip, and the first metal layer and second metal layer tool
There is conductive force.Due to being provided with the first groove, Yi Ji in the first weld metal layers for being located at the first metal layer lower surface
The second groove is provided in the second weld metal layers of second metal layer lower surface, and the first groove and the second groove are equal
Close to resin portion, then when between resin portion and the first metal layer or second metal layer there are when gap, the first groove or second recessed
Slot can accommodate the packing colloid gone out from clearance leakage, avoid being attached to the first weld metal layers or the second weld metal layers back side
Packing colloid level product is excessive, can increase the connection yield of light emitting diode, improve the reliability of light emitting diode.
As an improvement of the above scheme, the first protrusion of first groove is provided at least one first drainage trough,
First drainage trough is communicated with first groove；First protrusion of first groove is first groove close to described
The protrusion of resin portion；
First protrusion of second groove is provided at least one second drainage trough, second drainage trough with it is described
Second groove communicates；First protrusion of second groove is second groove close to the protrusion of the resin portion.
As an improvement of the above scheme, the first protrusion and the second protrusion of first groove and second groove
The first protrusion and the second protrusion flushed with the bottom surface of the resin portion；Wherein the second protrusion of first groove is far from institute
The protrusion of resin portion is stated, the second protrusion of second groove is the protrusion far from the resin portion.
As an improvement of the above scheme, the gross area of first groove and second groove is less than first welding
The 20% of metal layer and the second weld metal layers gross area.
As an improvement of the above scheme, be at least sequentially laminated under in the reflective bowl the first packing colloid layer and
Second packing colloid layer；Wherein, the viscosity of the first packing colloid layer be located in 100mPas~7000mPas, moisture-inhibiting
Oxygen transmission rate is located at 0cc/cm2Day/1mm~1000cc/cm2In day/1mm；The viscosity of the first packing colloid layer is less than
The viscosity of the second packing colloid layer, and the moisture-inhibiting oxygen permeable layer rate of the first packing colloid layer is less than second packaging plastic
The moisture-inhibiting oxygen transmission rate of body layer.
As an improvement of the above scheme, it is provided with third packing colloid layer on the second packing colloid layer, described
The moisture-inhibiting oxygen permeable layer rate of three packing colloid layers is less than the moisture-inhibiting oxygen transmission rate of the second packing colloid layer.
As an improvement of the above scheme, the first packing colloid layer includes the first YAG fluorescent powder layer, second encapsulation
Colloid layer includes the second YAG fluorescent powder layer, and the third packing colloid layer includes KFS phosphor powder layer and green phosphor layer.
As an improvement of the above scheme, the upper surface of the first metal layer is provided with the first metallic reflective layer, and described
The upper surface of two metal layers is provided with the second metallic reflective layer.
As an improvement of the above scheme, the resin portion is in inverted T-shaped；The first metal layer close to the resin portion one
End is equipped with the first tomography, and the second metal layer is provided with the second tomography close to one end of the resin portion；First tomography
It engages with the both ends of the resin portion with second tomography and closely connect respectively.
The utility model also provides a kind of production method of light emitting diode, is suitable for the first weld metal layers and the
The bracket of two weld metal layers, wherein first weld metal layers are set to the lower surface of the first metal layer, and described
Two weld metal layers are set to the lower surface of the second metal layer, and the production method includes the following steps:
It is stamped and formed out at least in first weld metal layers close to one end of the resin portion respectively using Sheet Metal Forming Technology
One the first groove, close to one end of the resin portion to be stamped and formed out at least one in second weld metal layers second recessed
Slot；
In-mould injection technique is used to make reflective layer on the bracket to form reflective bowl；
At least one LED chip is fixed on the bottom of the reflective bowl and carries out routing；
The first packing colloid is injected into the reflective bowl and is heating and curing, to form the first packing colloid layer；
The second packing colloid is injected into the reflective bowl and is heating and curing.
Compared with prior art, in the production method of the light emitting diode of the utility model, the first metal layer, the second gold medal
Belong to layer and resin portion constitutes bracket, due to being stamped and formed out first in the first weld metal layers for being located at the first metal layer lower surface
Groove, and it is stamped and formed out the second groove in the second weld metal layers for being located at second metal layer lower surface, and first is recessed
Slot and the second groove are close to resin portion, then when between resin portion and the first metal layer or second metal layer there are when gap, can
Gap is filled using injecting the first packing colloid into reflective bowl and being heating and curing, and passes through the first groove or second
Groove accommodates the first extra packing colloid, keeps away the packing colloid layer to be formed and is attached to the first weld metal layers or the second welding gold
The packing colloid level product for belonging to the layer back side is excessive, increases the connection yield of light emitting diode, improves the reliability of light emitting diode.
As an improvement of the above scheme, it is stamped and formed out at least in first weld metal layers respectively using Sheet Metal Forming Technology
One the first groove is stamped and formed out at least one second groove in the second weld metal layers punching press, further includes as follows
Step:
At least one first drainage trough, first drainage trough and institute are stamped and formed out in the first protrusion of first groove
The first groove is stated to communicate；First protrusion of first groove is first groove close to the protrusion of the resin portion；
At least one second drainage trough, second drainage trough and institute are stamped and formed out in the first protrusion of second groove
The second groove is stated to communicate；First protrusion of second groove is second groove close to the protrusion of the resin portion.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of existing light emitting diode.
Fig. 2 is a kind of structural schematic diagram of light emitting diode of the utility model embodiment 1.
Fig. 3 is the backside structure figure of the first weld metal layers and the second weld metal layers in the utility model embodiment 1.
Fig. 4 is a kind of structural schematic diagram of light emitting diode of the utility model embodiment 2.
Specific embodiment
Many details are explained in the following description in order to fully understand the utility model.But this is practical new
Type can be implemented with the other modes for being much different from this description, and those skilled in the art can be without prejudice to the utility model
Similar popularization is done in the case where intension, therefore the utility model is not limited by the specific embodiments disclosed below.
With specific embodiments and the drawings carries out clear, complete description to the technical solution of the utility model.
Embodiment 1
Fig. 2 is referred to, is a kind of structural schematic diagram of light emitting diode of the utility model embodiment 1.
As shown in Fig. 2, the light emitting diode includes: the first metal layer 11, second metal layer 12, resin portion 13, reflective layer 2
With at least one LED chip 3；Wherein, resin portion 13 is connected between the first metal layer 11 and second metal layer 12, at least one
LED chip 3 is installed on the upper surface of the first metal layer 11, and the surrounding that reflective layer 2 is set at least one LED chip 3 is formed instead
Light bowl；The lower surface that 4 the first metal layer 11 of packing colloid layer is provided in reflective cupulate bowl is provided with the first weld metal layers 51,
First weld metal layers 51 are provided at least one first groove 511 close to one end of resin portion 13；Under second metal layer 12
Surface is provided with the second weld metal layers 52, the second weld metal layers 52 close to one end of resin portion 13 be provided at least one
Two grooves 521.
Compared with prior art, in the light emitting diode of the utility model, the first metal layer 11,12 and of second metal layer
Resin portion 13 constitutes bracket, wherein the first metal layer 11 is for carrying at least one LED chip 3, and the first metal layer 11 and the
Two metal layers 12 have conductive force.Due to being provided in the first weld metal layers 51 for being located at 11 lower surface of the first metal layer
First groove 511, and the second groove is provided in the second weld metal layers 52 for being located at 12 lower surface of second metal layer
521, and the first groove 511 and the second groove 521 are close to resin portion 13, then when resin portion 13 and the first metal layer 11 or the
There are when gap between two metal layers 12, the first groove 511 or the second groove 521 can accommodate the packaging plastic gone out from clearance leakage
Body avoids the packing colloid level product for being attached to 52 back side of the first weld metal layers 51 or the second weld metal layers excessive, can
The connection yield for increasing light emitting diode, improves the reliability of light emitting diode.
Further, as shown in Figures 2 and 3, for the ease of by the packing colloid in gap drain into the first groove 511 or
In second groove 521, so that packing colloid forms packing colloid in homogeneous thickness in the first groove 511 or the second groove 521
Layer, is provided at least one first drainage trough 512, the first drainage trough 512 and the first groove in the first protrusion of the first groove 511
511 communicate；First protrusion of the first groove 511 is the first groove 511 close to the protrusion of resin portion 13；In the second groove 521
First protrusion is provided at least one second drainage trough 522, and the second drainage trough 522 is communicated with the second groove 521；Second groove
521 the first protrusion is the second groove 521 close to the protrusion of resin portion 13.
Preferably, as shown in Fig. 2, flowing into the first groove 511 or the second groove 521 for the ease of packing colloid, first is recessed
The bottom surface of the first protrusion and the second protrusion of slot 511 and the first protrusion of the second groove 521 and the second protrusion and resin portion 13
It flushes；Wherein the second protrusion of the first groove 511 is the protrusion far from resin portion 13, and the second protrusion of the second groove 521 is remote
Protrusion from resin portion 13.
Preferably, in the light emitting diode, the gross area of the first groove 511 and the second groove 521 is less than the first welding
The 20% of 52 gross area of metal layer 51 and the second weld metal layers, so that the first weld metal layers 51 and the second weld metal layers 52
When carrying out subsequent encapsulating process, there is biggish contact area.For example, the gross area of the first groove 511 and the second groove 521
It can be the 10% or 1% of 52 gross area of the first weld metal layers 51 and the second weld metal layers.
Embodiment 2
Fig. 4 is referred to, is a kind of structural schematic diagram of light emitting diode of the utility model embodiment 2.
As shown in figure 4, the light emitting diode is other than comprising whole building blocks in embodiment 1, the light-emitting diodes
The packing colloid layer of pipe includes the first packing colloid layer 41 and the second packing colloid layer 42, the first packing colloid layer 41 and the second envelope
Dress colloid layer 42 is cascading from the bottom to top in reflective bowl；Wherein, the viscosity of the first packing colloid layer 41 is located at
100mPas~7000mPas is interior, moisture-inhibiting oxygen transmission rate is located at 0cc/cm2Day/1mm~1000cc/cm2In day/1mm；
Viscosity of the viscosity of first packing colloid layer 41 less than the second packing colloid layer 42, and the moisture-inhibiting oxygen flow of the first packing colloid layer 41
Moisture-inhibiting oxygen transmission rate of the layer rate less than the second packing colloid layer 42.
In this embodiment, being located in 100mPas~7000mPas due to the first packing colloid layer 41, viscosity
Smaller, more liquid, then during forming packing colloid layer, the first packing colloid layer 41 is easy to be filled into the first metal
In layer 11 or the gap between second metal layer 12 and resin portion 13；Simultaneously as a small amount of the first packing colloid layer 41 setting
In the bottom of reflective bowl, excessive colloid can be avoided to leak into the first groove 511 or the second under conditions of filling gap
In groove 521, excessive colloid is prevented to be adhered to the first weld metal layers 51 or the second weld metal layers 52, can further promote
The connection yield of one weld metal layers 51 or the second weld metal layers 52；In addition, since the second packing colloid layer 42 is laminated in
On one packing colloid layer 41, oxygen and moisture can further be prevented to enter the first packing colloid layer from the top of reflective bowl
41 and LED chip 3 in, play a protective role.In addition, because the moisture-inhibiting oxygen transmission rate of the first packing colloid layer 41 is located at 0cc/
cm2Day/mm~1000cc/cm2In day/mm, and moisture-inhibiting oxygen transmission rate is low, moreover it is possible to moisture and oxygen be prevented to seep by gap
Enter in bracket and reflective bowl, thus the first packing colloid layer 41 can carry out effective protection to bracket and reflective bowl, extend
The service life of light emitting diode.
Preferably, in order to increase the intensity of light emitting diode, third packaging plastic is provided on the second packing colloid layer 42
Body layer 43, the moisture-inhibiting oxygen permeable layer rate of third packing colloid layer 43, can be into one less than the moisture-inhibiting oxygen transmission rate of the second packing colloid layer 42
Step plays the role of hindering dampness oxygen.
Preferably, in order to increase the luminous efficiency of light emitting diode, the first packing colloid layer 41 includes the first YAG fluorescent powder
Layer, the second packing colloid layer 42 include the second YAG fluorescent powder layer, and third packing colloid layer 43 includes KFS phosphor powder layer and green
Phosphor powder layer.
Optionally, the luminous efficiency of light emitting diode in order to further increase is arranged in the upper surface of the first metal layer 11
There is the first metallic reflective layer 41, the upper surface of second metal layer 12 is provided with the second metallic reflective layer 42, by reflective bowl
Interior light is reflected, and the luminous intensity of light emitting diode is promoted.
Preferably, as shown in figure 4, in the light emitting diode, resin portion 13 is in inverted T-shaped；The first metal layer 11 is close to tree
The one end in rouge portion 13 is equipped with the first tomography, and second metal layer 12 is provided with the second tomography close to one end of the resin portion 13；The
One tomography and institute's tomography are engaged with the both ends of resin portion 13 respectively and are closely connect, and can effectively increase the first metal layer 11 or the second
Combination path between metal layer 12 and resin portion 13 avoids excessive first to accommodate more first packing colloid layers 41
Packing colloid layer 41 is attached in the first weld metal layers 51 and the second weld metal layers 52；Simultaneously as the first metal layer 11
Or the combination path between second metal layer 12 and resin portion 13 increases, so that the path that moisture and oxygen penetrate into increases, it can
Promote the ability that light emitting diode stops moisture and oxygen to penetrate into.
It should be noted that as shown in figure 4, using the utility model light emitting diode carry out SMT welding when, due to
First groove 511 or the second groove 521 can accommodate the packaging part colloid of clearance leakage, avoid in the first weld metal layers 51 or
The area coverage of the packing colloid layer 41 formed in second weld metal layers 52 is excessive, and then can avoid occurring when SMT welding inclined
It moves, improves SMT and weld yield.
In the above-described embodiments, the first packing colloid layer 41 or the second packing colloid layer 42 include silica gel, silicone and epoxy
One of resin or multiple combinations.
Optionally, the first packing colloid layer 41 or the second packing colloid layer 42 are the phosphor powder layer with fluorescent powder.
The above descriptions are merely preferred embodiments of the present invention, not does in any form to the utility model
Limitation, therefore all contents without departing from technical solutions of the utility model are implemented according to the technical essence of the utility model to above
Any simple modification, equivalent change and modification that example is done, are still within the scope of the technical solutions of the present invention.
Claims (9)
1. a kind of light emitting diode characterized by comprising the first metal layer, second metal layer, resin portion, reflective layer and extremely
A few LED chip；Wherein,
The resin portion is connected between the first metal layer and the second metal layer, at least one LED chip peace
Upper surface loaded on the first metal layer, the surrounding that the reflective layer is set at least one LED chip form reflective
Bowl；
The lower surface of the first metal layer is provided with the first weld metal layers, and first weld metal layers are close to the resin
The one end in portion is provided at least one first groove；
The lower surface of the second metal layer is provided with the second weld metal layers, and second weld metal layers are close to the resin
The one end in portion is provided at least one second groove.
2. light emitting diode as described in claim 1, which is characterized in that the first protrusion of first groove be provided with to
Few first drainage trough, first drainage trough are communicated with first groove；First protrusion of first groove is institute
The first groove is stated close to the protrusion of the resin portion；
First protrusion of second groove is provided at least one second drainage trough, second drainage trough and described second
Groove communicates；First protrusion of second groove is second groove close to the protrusion of the resin portion.
3. light emitting diode as claimed in claim 2, which is characterized in that the first protrusion of first groove and second convex
The first protrusion and the second protrusion of portion and second groove are flushed with the bottom surface of the resin portion；Wherein described first is recessed
Second protrusion of slot is the protrusion far from the resin portion, and the second protrusion of second groove is convex far from the resin portion
Portion.
4. light emitting diode as claimed in claim 2, which is characterized in that total face of first groove and second groove
Product is less than the 20% of first weld metal layers and the second weld metal layers gross area.
5. light emitting diode as described in claim 1, which is characterized in that at least stacked gradually under in the reflective bowl
There are the first packing colloid layer and the second packing colloid layer；Wherein, the viscosity of the first packing colloid layer be located at 100mPas~
7000mPas is interior, moisture-inhibiting oxygen transmission rate is located at 0cc/cm2Day/1mm~1000cc/cm2In day/1mm；First envelope
The viscosity for filling colloid layer is less than the viscosity of the second packing colloid layer, and the moisture-inhibiting oxygen permeable layer rate of the first packing colloid layer
Less than the moisture-inhibiting oxygen transmission rate of the second packing colloid layer.
6. light emitting diode as claimed in claim 5, which is characterized in that be provided with third on the second packing colloid layer
Packing colloid layer, the moisture-inhibiting oxygen permeable layer rate of the third packing colloid layer are less than the moisture-inhibiting oxygen flow of the second packing colloid layer
Rate.
7. light emitting diode as claimed in claim 6, which is characterized in that the first packing colloid layer includes the first YAG glimmering
Light bisque, the second packing colloid layer include the second YAG fluorescent powder layer, and the third packing colloid layer includes KFS fluorescent powder
Layer and green phosphor layer.
8. light emitting diode as described in claim 1, which is characterized in that the upper surface of the first metal layer is provided with the first gold medal
Belong to reflective layer, the upper surface of the second metal layer is provided with the second metallic reflective layer.
9. light emitting diode as described in claim 1, which is characterized in that the resin portion is in inverted T-shaped；The first metal layer
It is equipped with the first tomography close to one end of the resin portion, the second metal layer is provided with second close to one end of the resin portion
Tomography；First tomography and second tomography are engaged with the both ends of the resin portion respectively and are closely connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822190829.9U CN209389058U (en) | 2018-12-25 | 2018-12-25 | A kind of light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822190829.9U CN209389058U (en) | 2018-12-25 | 2018-12-25 | A kind of light emitting diode |
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| Publication Number | Publication Date |
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| CN209389058U true CN209389058U (en) | 2019-09-13 |
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| CN201822190829.9U Active CN209389058U (en) | 2018-12-25 | 2018-12-25 | A kind of light emitting diode |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109817785A (en) * | 2018-12-25 | 2019-05-28 | 广东晶科电子股份有限公司 | A kind of light emitting diode and preparation method thereof |
-
2018
- 2018-12-25 CN CN201822190829.9U patent/CN209389058U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109817785A (en) * | 2018-12-25 | 2019-05-28 | 广东晶科电子股份有限公司 | A kind of light emitting diode and preparation method thereof |
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