CN217641337U - Pixel unit and display panel - Google Patents
Pixel unit and display panel Download PDFInfo
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- CN217641337U CN217641337U CN202221294344.4U CN202221294344U CN217641337U CN 217641337 U CN217641337 U CN 217641337U CN 202221294344 U CN202221294344 U CN 202221294344U CN 217641337 U CN217641337 U CN 217641337U
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Abstract
The utility model provides a pixel unit and display panel, pixel unit includes: a substrate pedestal including a top surface, a bottom surface, and at least three side surfaces; and the red sub-pixel, the green sub-pixel and the blue sub-pixel are respectively arranged on the first side surface, the second side surface and the third side surface of the substrate base. The red sub-pixels, the green sub-pixels and the blue sub-pixels are arranged on the side face of the substrate base, so that the damage probability of the sub-pixels in the transfer process is reduced, and the yield is improved; meanwhile, each sub-pixel point is sequentially arranged from one side of the side surface of the substrate base far away from the substrate base, so that the electrode of each sub-pixel point is positioned on the side surface of the sub-pixel point, the distance between the electrodes of adjacent pixel points is increased, and the crosstalk between the adjacent pixel points is reduced.
Description
Technical Field
The utility model relates to a display screen technical field especially relates to a pixel unit and display panel.
Background
At present, the mainstream scheme for realizing full-color of the Micro-LED is to adopt a separated RGB three-color Micro-LED chip and realize RGB full-color by transferring and bonding the chip to a driving backboard for multiple times. The scheme currently has the following problems: firstly, the transfer bonding of the RGB three-color Micro-LED chip needs to be carried out for three times, so that the production efficiency is low, most of the existing pixel structures are vertical superposition structures, and the structures are easy to damage in the transfer process, so that the yield is low; secondly, the transfer precision of the current pixel structure is low in the transfer bonding process, the requirement of high PPI cannot be met, and bonding failure is easily caused in the bonding process; thirdly, even if high PPI is realized, crosstalk between pixels is severe under the current pixel structure, which may reduce the light emitting brightness and the accuracy of color display.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned shortcomings of the related art, the present application aims to provide a pixel unit and a display panel, which aim to solve the problems that the current pixel structure is easy to be damaged during the transfer bonding process, the PPI is difficult to be improved, and the crosstalk is easy to be generated.
The utility model provides a pixel unit, pixel unit includes:
a substrate pedestal comprising a top surface, a bottom surface, and at least three side surfaces;
and the red sub-pixel, the green sub-pixel and the blue sub-pixel are respectively arranged on the first side surface, the second side surface and the third side surface of the substrate base.
According to the pixel unit, the red sub-pixel, the green sub-pixel and the blue sub-pixel are respectively arranged on different sides of the substrate base, and the red sub-pixel, the green sub-pixel and the blue sub-pixel are integrated into the pixel unit through the substrate base, so that the flow steps of transfer bonding are reduced, and the production yield and the production efficiency are improved.
Optionally, the first electrode group is located on a side of the first epitaxial structure far away from the substrate base;
the second electrode group is positioned on one side, far away from the substrate base, of the second epitaxial structure;
the third electrode group is located on one side, far away from the substrate base, of the third epitaxial structure.
According to the pixel unit, the positions of the electrode groups of the red sub-pixel, the green sub-pixel and the blue pixel are arranged on the sides, far away from the substrate base, of the respective directions, so that the distance between the electrodes is increased, and the crosstalk between adjacent pixel points is reduced.
Based on same utility model conceive, this application still provides a display panel, display panel includes:
a plurality of pixel units as described above;
the driving substrate is provided with a plurality of accommodating grooves with shapes corresponding to the pixel units, and the pixel units are arranged in the accommodating grooves;
and the packaging adhesive is arranged on one side of the substrate and used for covering the pixel unit.
According to the display panel, the substrate is provided with the plurality of accommodating grooves with the shapes corresponding to the pixel units, and the pixel units are arranged in the accommodating grooves, so that the flow steps of transfer bonding are reduced, and the generation yield and the production efficiency are improved.
Optionally, the surface of the accommodating groove is provided with a first pad group, a second pad group and a third pad group at positions corresponding to the first electrode group, the second electrode group and the third electrode group of the pixel unit, respectively.
In the display panel, the electrode groups of the red sub-pixel, the green sub-pixel and the blue sub-pixel in the pixel unit are all located at one side far away from the substrate base in the respective directions, so that the pad group corresponding to the surface of the accommodating groove is far away as possible, the distance between the electrodes is increased, and the crosstalk between adjacent pixel points is reduced.
Drawings
The invention will be further explained with reference to the drawings and examples, wherein:
fig. 1 is a schematic structural diagram of a pixel unit according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another pixel unit according to an embodiment of the present invention;
fig. 3 is a front view of a partial area of a display panel according to an embodiment of the present invention;
fig. 4 is a cross-sectional view of a single pixel of a display panel according to an embodiment of the present invention.
100-a substrate pedestal; 200-green sub-pixel; 300-red sub-pixel; 400-blue sub-pixel; a 210-n type semiconductor layer; 220-green semiconductor light emitting layer; 320-red semiconductor light emitting layer; 420-blue semiconductor light emitting layer; a 230-p type semiconductor layer; a 240-p electrode; a 250-n electrode; 510-a drive substrate; 520-an accommodating groove; a 530-n bonding region; a 540-p bonding region; 550-a bonding material; 560-packaging glue; 570-a reflective layer; 580-black coating.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
The current Micro-LED full-color display scheme has three problems: firstly, the transfer bonding of the RGB three-color Micro-LED chip needs to be carried out for three times, so that the production efficiency is low, most of the existing pixel structures are vertical superposition structures, and the structures are easy to damage in the transfer process, so that the yield is low; secondly, the transfer precision of the current pixel structure is low in the transfer bonding process, the high PPI requirement is not met, and bonding failure is easily caused; thirdly, even if high PPI is realized, crosstalk between pixels is severe under the current pixel structure, which may reduce the light emitting brightness and the accuracy of color display.
Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
The present embodiment provides a pixel unit, including: a substrate pedestal 100, said substrate pedestal 100 comprising a top surface a, a bottom surface B, and at least three side surfaces C; and a red sub-pixel 300, a green sub-pixel 200, and a blue sub-pixel 400 respectively disposed on a first side, a second side, and a third side of the substrate base 100.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a pixel unit with different viewing angles provided in this embodiment, where 1-1 is a left view of the pixel unit, and fig. 1-2 is a front view of the pixel unit. The pixel unit includes: a substrate pedestal 100, the substrate pedestal 100 comprising a top surface a, a bottom surface B, and at least three side surfaces C; and a red sub-pixel 300, a green sub-pixel 200 and a blue sub-pixel 400 respectively disposed on different sides of the substrate base 100, wherein the red sub-pixel 300 is located on a first side, the green sub-pixel 200 is located on a second side, and the blue sub-pixel 400 is located on a third side. In this embodiment, the substrate base 100 has a certain thickness, so that the sub-pixels located on the side surface have enough fixing surfaces, i.e. the side surface C of the substrate base 100, and the thickness of the substrate base 100 is the same as the thickness of the pixel points on the side surface in a normal case, which is not absolute, and the thickness of the substrate base 100 may be greater than or less than the thickness of the pixel points on the side surface.
In the present embodiment, the substrate base 100 may be made of any one of materials including, but not limited to, a sapphire substrate, a glass substrate, and a silicon substrate; the bottom surface B and the top surface a of the substrate pedestal 100 are generally planar and polygonal in shape, while the shape of the bottom surface B and the top surface a of the substrate pedestal 100 may alternatively include, but is not limited to, any of a triangular substrate pedestal, a rectangular substrate pedestal 100, a hexagonal pedestal, and an octagonal pedestal; and the side of the substrate pedestal 100 includes at least three side planes. The bottom surface and the top surface of the substrate base 100 are made to be flat surfaces, and a stress point is kept on the substrate base 100 in the transferring process, wherein the stress point can be the top surface A or the bottom surface B, so that the transferring, the positioning and the fixing of a pixel unit are facilitated, and the sub-pixel can be prevented from being damaged; while side C of the substrate base 100 may also be made planar, which facilitates the fixing of the sub-pixels.
It should be noted that the arrangement sequence of the red sub-pixel 300, the green sub-pixel 200, and the blue sub-pixel 400 shown in fig. 2 is only one of many arrangement sequences; in addition, in the substrate bases 100 of different shapes, the arrangement may be other than the adjacent arrangement shown in fig. 1; for example, on the eight-sided base, the red pixels, the green pixels and the blue pixels do not necessarily need to be adjacent to each other, and may be arranged with a side surface therebetween. The sub-pixel materials that can be selected for the red sub-pixel 300, the green sub-pixel 200, and the blue sub-pixel 400 in terms of material selection include, but are not limited to, micro-LED, mini-LED, oled organic light emitting material, and QLED light emitting material.
In another embodiment, the red sub-pixel 300, the green sub-pixel 200, and the blue sub-pixel 400 are arranged in a T-shape.
Referring to fig. 1, the red sub-pixel 300, the green sub-pixel 200 and the blue sub-pixel 400 in the pixel unit shown in fig. 1 are arranged in a T-shape, it is understood that in some other embodiments, for example, the red sub-pixel 300, the green sub-pixel 200 and the blue sub-pixel 400 may be arranged with a side of an octagon, and may also be arranged in a T-shape.
In another embodiment, the red sub-pixel 300, the green sub-pixel 200, and the blue sub-pixel 400 are all light emitting diodes.
Optional light emitting diodes include, but are not limited to, micro light emitting diodes including Micro-LEDs, which are a semiconductor light emitting material, and Mini light emitting diodes including Mini-LEDs, which are an LED device having a chip size of 50 to 200 μm, which are semiconductor light emitting materials.
In another embodiment, the red sub-pixel 300 is sequentially provided with a first epitaxial structure and a first electrode group connected to the first epitaxial structure in a vertical direction of the first side surface; the green sub-pixel 200 is sequentially provided with a second epitaxial structure and a second electrode group connected with the second epitaxial structure in the vertical direction of the second side surface; the blue sub-pixel 400 is sequentially provided with a third epitaxial structure and a third electrode group connected to the third epitaxial structure in a vertical direction of the third side.
Referring to fig. 2, fig. 2 is a schematic structural diagram of another pixel unit provided in this embodiment. The red sub-pixel 300 in the pixel unit includes a first epitaxial structure and a first electrode set, the green sub-pixel 200 includes a second epitaxial structure and a second electrode set, and the blue sub-pixel 400 includes a third epitaxial structure and a third electrode set, wherein the first epitaxial structure, the second epitaxial structure and the third epitaxial structure are similar, and the first electrode set, the second electrode set and the third electrode set have the same structure, although the structures of the epitaxial structures and the electrode sets are only shown in fig. 2, and the epitaxial structures and the electrode sets of the sub-pixels may be different in other embodiments.
In fig. 2, the first epitaxial structure, the second epitaxial structure and the third epitaxial structure each include: the n-type semiconductor layer 210, the p-type semiconductor layer 230, and the semiconductor light emitting layer corresponding to the red sub-pixel 300 are the red semiconductor light emitting layer 320, the semiconductor light emitting layer corresponding to the green sub-pixel 200 is the green semiconductor light emitting layer 220, and the semiconductor light emitting layer corresponding to the blue sub-pixel 400 is the red semiconductor light emitting layer 420. In fig. 2, the first electrode set, the second electrode set and the third electrode set are all composed of P electrodes 240 and n electrodes 250
In fig. 2, the red sub-pixel 300, the green sub-pixel 200, and the blue sub-pixel 400 are Micro-LEDs, which are semiconductor light-emitting materials, and the substrate base 100 has a certain thickness, so that the semiconductor sub-pixels located on the side surface have enough growth surface to make the light-emitting brightness of the pixel meet the requirement, and the thickness of the substrate base 100 is generally the same as the width of the semiconductor pixel. In fig. 2, the n-type semiconductor layer 210 and the p-type semiconductor layer 230 are usually GaN semiconductor layers, but other semiconductor materials, such as silicon semiconductor layers, germanium semiconductor layers, etc., may be used in other embodiments.
In another embodiment, the first electrode set is located on a side of the first epitaxial structure away from the substrate pedestal 100; the second electrode set is located on a side of the second epitaxial structure away from the substrate pedestal 100; the third electrode set is located on a side of the third epitaxial structure away from the substrate base 100.
Referring to fig. 2, the direction a in fig. 2 is a side far from the substrate base 100, wherein the direction a is generally perpendicular to the side of the substrate base 100, and by arranging the positions of the respective electrode groups of the red sub-pixel 300, the green sub-pixel 200, and the blue sub-pixel 400 at the side far from the substrate base in the respective directions, the distance between the respective electrode groups is increased, and the crosstalk between the adjacent pixel points can be reduced.
In another embodiment, the red, green, and blue semiconductor light emitting layers 320, 220, and 420 are multiple quantum well material layers.
In this embodiment, the red semiconductor light emitting layer 320, the green semiconductor light emitting layer 220, and the blue semiconductor light emitting layer 420 are main light emitting materials, which can emit blue light, red light, and green light respectively after being excited by current, and the common semiconductor light emitting materials include multiple quantum well materials MQW, i.e. electro-optical effect materials, and currently, the selectable multiple quantum well materials include, but are not limited to, gaAs/AIGaAsMQW, inGaAs/InAIAsMQW, gaInAsP/InPMQW.
In another embodiment, the substrate pedestal 100 includes: any one of a sapphire substrate, a glass substrate, and a silicon substrate; the top and bottom surface shapes of the substrate base 100 of the regular polygon type include: any of triangular, rectangular, hexagonal and octagonal.
In the present embodiment, the substrate base 100 may be made of any one of materials including, but not limited to, a sapphire substrate, a glass substrate, and a silicon substrate; the shape of the top and bottom surfaces of the substrate base 100 may be regular polygons, which facilitates the growth of semiconductor pixels and the uniform arrangement of sub-pixels, and also facilitates the transfer, positioning and fixing, and the shape of the substrate base 100 may optionally include, but is not limited to, any one of triangular, rectangular, hexagonal and octagonal.
The present embodiment provides a pixel unit, including: a substrate pedestal 100, the substrate pedestal 100 comprising a top surface, a bottom surface, and at least three side surfaces; and a red sub-pixel 300, a green sub-pixel 200, and a blue sub-pixel 400 respectively disposed at different sides of the substrate base 100. By arranging the red sub-pixel 300, the green sub-pixel 200 and the blue sub-pixel 400 on the side surface of the substrate base 100, the probability of damage to the sub-pixels in the transfer process is reduced, and the yield is improved; meanwhile, the electrode group of each sub-pixel point is arranged on one side far away from the substrate base, so that the electrode group of each sub-pixel point is positioned on the side face of the electrode group, the distance between the electrode groups of adjacent pixel points is increased, and the crosstalk between the adjacent pixel points is reduced.
The utility model discloses still another optional embodiment:
the present embodiment provides a display panel including: a plurality of pixel cells provided in the above embodiments; a driving substrate 510, wherein a plurality of accommodating grooves 520 with shapes corresponding to the pixel units are formed in the driving substrate 510, and the pixel units are disposed in the accommodating grooves 520; and an encapsulation adhesive 560 disposed on one side of the substrate for covering the pixel unit.
As shown in fig. 3 and fig. 4, fig. 3 is a front view of a partial region of a display panel provided in this embodiment, and fig. 4 is a cross-sectional view of a single pixel of the display panel provided in this embodiment. The display panel includes: a plurality of pixel cells provided by the above implementation; a driving substrate 510, wherein a plurality of accommodating grooves 520 corresponding to the pixel units in shape are formed in the driving substrate 510, and the pixel units are arranged in the accommodating grooves 520; and an encapsulation adhesive 560 disposed on one side of the substrate 510 for covering the pixel unit.
Fig. 3 is a schematic diagram of a partial region of a display panel according to this embodiment, where the schematic diagram includes two pixel units, and the display panel in this embodiment is formed by repeatedly arranging a plurality of pixel units. It should be understood that the pixel arrangement shown in fig. 3 is only one of the pixel arrangements, and in other embodiments, an arrangement such as a staggered arrangement, a diamond arrangement, etc. may also be adopted, which is not limited herein.
In this embodiment, the accommodating groove 520 improves the precision of chip transfer and bonding by limiting the shape and size; and because one pixel unit integrates three luminous sub-pixels, full colorization can be met by transfer bonding once, and the transfer bonding efficiency and the production yield are improved.
In this embodiment, the driving substrate 510 is provided with the encapsulation adhesive 560, the encapsulation adhesive 560 can be filled on the driving substrate 510 and the pixel units through a compression molding injection molding process, the material of the encapsulation adhesive 560 can be selected from epoxy resin or silicone resin, the transmittance is selected to be greater than 70% to reduce the brightness loss, and the thickness of the encapsulation adhesive is designed to be greater than 100um to protect the pixel units from being scratched and improve the reliability of the display screen; meanwhile, the surface of the packaging adhesive 560 can also be subjected to diffusion particle compression molding transfer printing so as to improve the product visual angle.
In another embodiment, the surface of the accommodating groove is provided with a first pad group, a second pad group and a third pad group at positions corresponding to the first electrode group, the second electrode group and the third electrode group of the pixel unit, respectively.
Referring to fig. 3, the structure of the pixel unit in fig. 3 is the same as fig. 2, the first pad group, the second pad group and the third pad group in fig. 3 have the same structure, the n-bonding region 530 and the p-bonding region 540 in fig. 3 correspond to the pad groups, and the pad groups are connected to the electrode groups through the bonding material 550. Wherein, an n bonding area 530 and a P bonding area 540 are arranged in the accommodating groove 520 at the positions corresponding to the n electrode 250 and the P electrode 240 of the pixel unit, the n electrode 250 of the pixel unit is connected with the n bonding area 530 through a bonding material 550, and the P electrode 240 of the pixel unit is connected with the P bonding area 540240 through the bonding material 550. In this embodiment, the size of each light emitting sub-pixel on the pixel unit may be selected to be a Micro-LED, the pixel unit is bonded to the bonding region on the substrate 210 by using a bonding material 550, the bonding material 550 may be selected from, but not limited to, a solder material or Anisotropic Conductive Film (ACF), the solder material may be selected from a material with a low melting point, and may be selected from, but not limited to, gold-tin alloy, indium tin, and the like.
In another embodiment, the surface of the vessel 220 is provided with a reflective layer 570.
In this embodiment, the reflective layer 570 may be a silver-plated coating, and the reflective layer 570 may reflect light emitted from the pixel units to the bottom surface and four side surfaces to the front surface, so as to prevent color crosstalk between pixels and improve the brightness of the display screen.
In another embodiment, the driving substrate 510 is provided with a black coating 580 on one side of the receiving groove 520 except for the receiving groove 520.
In this embodiment, the black coating 580 is disposed on the driving substrate 510 to improve the display effect, prevent crosstalk between adjacent pixel units, improve the blackening effect of the display screen, reduce the reflection of ambient light, and improve the contrast, and the black coating 580 may be made of a material including, but not limited to, an ink-jet layer, and the thickness of the ink-jet layer may be designed to be about 30 μm to blacken the surface of the driving substrate 510. It is understood that the black coating 580 is generally disposed between the driving substrate 510 and the encapsulant 560, and the thickness of the encapsulant 560 is greater than 100um based on the black coating 580.
The present embodiment provides a display panel including: a plurality of pixel units; a driving substrate 510, wherein a plurality of accommodating grooves 520 corresponding to the pixel units in shape are formed in the driving substrate 510, and the pixel units are arranged in the accommodating grooves 520; and an encapsulation adhesive 560 disposed on the substrate. Through be equipped with a plurality of shape on the base plate with the holding tank 520 that pixel unit corresponds, adopted the pixel unit that this application provided simultaneously, reduced the flow that shifts the bonding, improved and generated yield and production efficiency, simultaneously because red pixel, green pixel and blue pixel bonding zone position each separately all are located the outside in direction separately, have increased the distance between each electrode, have reduced the crosstalk between the adjacent pixel.
It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. A pixel cell, comprising:
a substrate pedestal comprising a top surface, a bottom surface, and at least three side surfaces;
and the red sub-pixel, the green sub-pixel and the blue sub-pixel are respectively arranged on the first side surface, the second side surface and the third side surface of the substrate base.
2. The pixel cell of claim 1, wherein said red, green, and blue subpixels are arranged in a T-shape.
3. The pixel cell of claim 1, wherein said red sub-pixel, said green sub-pixel, and said blue sub-pixel are all light emitting diodes.
4. The pixel unit according to claim 3, wherein the red sub-pixel is sequentially provided with a first epitaxial structure and a first electrode group connected to the first epitaxial structure in a vertical direction of the first side surface;
the green sub-pixel is sequentially provided with a second epitaxial structure and a second electrode group connected with the second epitaxial structure in the vertical direction of the second side surface;
the blue sub-pixel is sequentially provided with a third epitaxial structure and a third electrode group connected with the third epitaxial structure in the vertical direction of the third side face.
5. The pixel cell of claim 4, wherein the first electrode set is located on a side of the first epitaxial structure away from the substrate pedestal;
the second electrode group is positioned on one side of the second epitaxial structure far away from the substrate base;
the third electrode group is located on one side of the third epitaxial structure far away from the substrate base.
6. The pixel cell of any of claims 1-5, wherein the substrate base comprises: any one of a sapphire substrate base, a glass substrate base, and a silicon substrate base;
the top and bottom surface shapes of the substrate pedestal include: any one of triangular, rectangular, hexagonal and octagonal.
7. A display panel, comprising:
a number of pixel cells as claimed in any one of claims 1-6;
the driving substrate is provided with a plurality of accommodating grooves with shapes corresponding to the pixel units, and the pixel units are arranged in the accommodating grooves;
and the packaging adhesive is arranged on one side of the substrate and used for covering the pixel unit.
8. The display panel according to claim 7, wherein the surface of the accommodating groove is provided with a first pad group, a second pad group and a third pad group at positions corresponding to the first electrode group, the second electrode group and the third electrode group of the pixel unit, respectively.
9. The display panel according to claim 7, wherein a surface of the receiving groove is provided with a reflective layer.
10. The display panel according to any one of claims 7 to 9, wherein a black coating layer is provided on the driving substrate at a side of the receiving groove except for the receiving groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202221294344.4U CN217641337U (en) | 2022-05-26 | 2022-05-26 | Pixel unit and display panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202221294344.4U CN217641337U (en) | 2022-05-26 | 2022-05-26 | Pixel unit and display panel |
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| CN217641337U true CN217641337U (en) | 2022-10-21 |
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| CN202221294344.4U Active CN217641337U (en) | 2022-05-26 | 2022-05-26 | Pixel unit and display panel |
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