CN217639853U - Electronic device - Google Patents

Abstract

Provided is an electronic device having excellent reliability. An electronic device according to an embodiment includes: a flexible substrate having a central region in which a plurality of electric elements are formed and a peripheral region surrounding the central region; a cover member provided on the flexible substrate; and a frame provided on the cover member to cover the peripheral region. The flexible substrate has a1 st end portion on which the circuit substrate is mounted. The cover member has a1 st side located on the 1 st end portion side and a2 nd side located on the opposite side of the 1 st side. An adhesive is provided between the 1 st side and the frame, and a gap is provided between the 2 nd side and the frame.

Description

Electronic device

This application is based on the priority claim of Japanese patent application No. 2021-004019, filed on 14.1.2021, the entire contents of which are hereby incorporated by reference.

Technical Field

The utility model relates to an electronic equipment.

Background

In recent years, electronic devices capable of folding or unfolding a display surface have been developed. The electronic device has good portability in the folded state and gives a user a good feeling of use in the unfolded state.

The electronic device is formed by laminating a flexible substrate having flexibility, a plurality of functional films, and the like. The flexible substrate has a mounting side on which a circuit board or the like for exchanging signals with the outside is mounted, and a bent portion may be formed at the mounting side.

When bending the electronic device, bending strain is generated in a flexible substrate or the like, and a mid-plane separation technique has been conventionally employed in order to suppress an increase in bending strain. However, if the midplanes are separated, the layers are displaced in the circumferential direction of bending during bending, and therefore, a load on the bent portion on the mounting side or the like can be expected.

SUMMERY OF THE UTILITY MODEL

An object of the present disclosure is to provide an electronic device having excellent reliability even when bent.

An electronic device according to an embodiment includes: a flexible substrate having a central region in which a plurality of electric elements are formed and a peripheral region surrounding the central region; a cover member provided on the flexible substrate; and a frame provided on the cover member and covering the peripheral region. The flexible substrate has a1 st end portion on which the circuit substrate is mounted. The cover member has a1 st side located on the 1 st end portion side and a2 nd side located on the opposite side of the 1 st side. An adhesive is provided between the 1 st side and the frame, and a gap is provided between the 2 nd side and the frame.

In addition, an electronic device according to an embodiment includes: a support body having a1 st surface and a2 nd surface located on the opposite side of the 1 st surface; a flexible substrate located on the 1 st surface and having a central region in which a plurality of electric elements are formed and a peripheral region surrounding the central region; and an adhesive layer located between the 1 st surface and the flexible substrate. The flexible substrate has a1 st end portion on which a circuit board is mounted and a side opposite to the 1 st end portion. The adhesive layer has a1 st member located on the 1 st end portion side and a2 nd member located on the side. The Young's modulus of the 2 nd member is smaller than that of the 1 st member, and the formation region of the 1 st member is smaller than that of the 2 nd member.

According to the above configuration, an electronic apparatus having excellent reliability even when bent can be provided.

Drawings

Fig. 1 is a schematic perspective view of an electronic apparatus according to embodiment 1.

FIG. 2 is a schematic sectional view of a laminate for application and separation.

Fig. 3 is a schematic enlarged view of a portion a of the laminate shown in fig. 2.

Fig. 4 is a schematic enlarged view of a portion a of the laminate shown in fig. 2.

Fig. 5 is a schematic exploded perspective view of the electronic apparatus according to embodiment 1.

Fig. 6 is a schematic perspective view of the electronic device according to embodiment 1 in an assembled state.

Fig. 7 is a schematic plan view of the electronic apparatus according to embodiment 1 in an assembled state.

Fig. 8 shows an example of the bonded portion between the cover member and the frame.

Fig. 9 shows another example of the bonded portion between the cover member and the frame.

Fig. 10 is a schematic cross-sectional view taken along line B-B of the electronic apparatus shown in fig. 7.

Fig. 11 is a schematic enlarged view of a portion C of the electronic apparatus shown in fig. 10.

Fig. 12 is a schematic enlarged cross-sectional view of the electronic device according to embodiment 2.

Fig. 13 is a schematic view of the 2 nd transmission part of the flexible substrate shown in fig. 12.

Fig. 14 is a schematic view showing an example of an adhesive of the electronic device shown in fig. 12.

Fig. 15 is a schematic view showing another example of the adhesive member of the electronic device shown in fig. 12.

Fig. 16 is a schematic view showing still another example of the adhesive of the electronic device shown in fig. 12.

Fig. 17 is a schematic sectional view of the electronic device according to embodiment 3.

Fig. 18 is a schematic plan view of the electronic apparatus according to embodiment 3.

Fig. 19 is a schematic plan view of the electronic apparatus according to embodiment 3.

Fig. 20 is a schematic plan view of the electronic apparatus according to embodiment 3.

Fig. 21 is a schematic cross-sectional view of the electronic apparatus according to embodiment 4.

Detailed Description

Several embodiments are described with reference to the accompanying drawings.

The disclosure is merely an example, and it is a matter of course that those skilled in the art can easily conceive of appropriate modifications while maintaining the gist of the present invention. The drawings are only an example and do not limit the explanation of the present invention, although the drawings schematically show the actual case for the sake of clarity. In the drawings, the same or similar elements arranged in series may be omitted. In the present specification and the drawings, the same reference numerals are given to components that perform the same or similar functions as those described with reference to the preceding drawings, and overlapping detailed descriptions are sometimes omitted.

In this embodiment, a self-light-emitting organic Electroluminescent (EL) display device is disclosed as an example of an electronic device. In addition, the disclosure is merely an example, and a transmissive liquid crystal display device, a Light Emitting Diode (LED) display device, and the like are also given as electronic devices. The electronic device may be various sensors such as an optical sensor, a temperature sensor, and a touch sensor, in addition to the display device.

[ 1 st embodiment ]

Fig. 1 is a schematic perspective view of an electronic apparatus 1 according to embodiment 1. In the present embodiment, the 1 st direction X, the 2 nd direction Y, and the 3 rd direction Z are defined as illustrated in the drawing. The 1 st direction X, the 2 nd direction Y, and the 3 rd direction Z are orthogonal to each other, but may intersect at an angle other than 90 °. Hereinafter, the X-Y plane defined by the 1 st direction X and the 2 nd direction Y is referred to as a plan view.

The electronic device 1 includes a flexible substrate 2 having a plurality of pixels PX, a cover member 3 overlapping the flexible substrate 2, and a frame 4 overlapping the cover member 3. The flexible substrate 2 has a multilayer structure, for example, and has a base material made of a resin material such as polyimide. The flexible substrate 2 may include various insulating layers, conductive layers, thin Film Transistors (TFTs), and the like. The cover member 3 can also be referred to as a cover film or a protective film.

In the illustrated example, the shape of the flexible substrate 2 in a plan view is a rectangle having a pair of long sides along the 1 st direction X and a pair of short sides along the 2 nd direction Y. The 3 rd direction Z corresponds to the thickness direction of the flexible substrate 2. The frame 4 has a rectangular opening frame shape. The region surrounded by the frame 4 corresponds to a display region DA including a plurality of pixels PX.

In the present embodiment, the elements of the electronic device 1 such as the flexible substrate 2, the cover member 3, and the frame 4 are flexible. Thereby, the electronic apparatus 1 can be bent in the opening direction R1 or the closing direction R2 along the bending axis AY. The electronic device 1 may be bendable along the bending axis AY in both the opening direction R1 and the closing direction R2.

For example, when the electronic device 1 of the embodiment is used as a display device as shown in the drawing, the display surface can be recognized by bending in the opening direction R1. On the other hand, when the display panel is bent in the closing direction R2, the display panel is closed so as not to be visually recognized from the outside.

In order to realize the foldable electronic apparatus 1 in this way, the surface separation is applied to the laminated body including the flexible substrate 2 and the cover member 3. Problems that may occur in the application and the surface-separated laminate will be described below with reference to fig. 2 to 4.

Fig. 2 is a schematic sectional view of a laminate 101 for application and surface separation. The laminate 101 includes a flexible substrate 102, a cover member 103, a support body 105, and a housing 106, which are stacked in the 3 rd direction Z. The housing 106 includes plate-like 1 st base 106A and 2 nd base 106B and a hinge 106C that rotatably connects these bases 106A and 106B around a bending axis AY.

Further, the laminate 101 includes an adhesive layer 107 for bonding the flexible substrate 102 and the cover member 103, and an adhesive layer 108 for bonding the flexible substrate 102 and the support body 105. The adhesive layers 107 and 108 are made of, for example, a soft adhesive material.

The soft adhesive material means that the young's modulus of the adhesive material in a cured state is smaller than the young's modulus of the flexible substrate 2 or the like. For example, the young's modulus of the adhesive in the cured state is preferably about 1/1000 of the young's modulus of the flexible substrate 2. On the other hand, for example, the young's modulus of the adhesive in a cured state is preferably the same as that of the flexible substrate 2 or the like.

The back surface of support 105 is bonded to substrates 106A and 106B. In the laminated body 101 having such a configuration, when the bases 106A and 106B are rotated with respect to each other, the flexible substrate 102, the cover member 103, and the support body 105 are bent.

Fig. 3 and 4 are schematic enlarged views of a portion a of the laminate 101 shown in fig. 2, and show an end portion on the 1 st base 106A side. In the example shown in fig. 3 and 4, one end of the flexible substrate 102 has an end portion 102a that protrudes beyond an end portion of the cover member 103 and an end portion of the support body 105. A circuit board is mounted on the end portion 102a. The end portion 102a is bent so that a part thereof is positioned on the back surface side of the support body 105. By bending the end portion 102a, the frame of the side on which the circuit board is mounted can be narrowed.

Fig. 3 shows a state before the laminate 101 is bent, in which the positions of the flexible substrate 102, the cover member 103, and the support body 105 are not shifted. Fig. 4 shows a state in which the laminate 101 is bent in the closing direction R2. In the application and the surface-separated laminate 101, the adhesive layers 107 and 108 function as stress separation layers.

When the laminated body 101 is bent, the flexible substrate 102 and the cover member 103 slide in the direction of the arrow, and the stress is released between the laminations. That is, the flexible substrate 102 and the cover member 103 can be said to be movable. The movable state means, for example, that the flexible substrate 102 and the cover member 103 move relative to the housing 106 when the laminated body 101 is bent, or that the flexible substrate 102 and the cover member 103 deform.

Thus, the flexible substrate 102 and the cover member 103 have their own neutral planes. Since the middle planes of the laminated body 101 are separated into a plurality of planes, the compressive stress and the tensile stress acting on the surfaces of the flexible substrate 102 and the cover member 103 are reduced.

As illustrated in fig. 4, the flexible substrate 102 is offset from the support 105 by a distance D1 as compared with fig. 3. Since the flexible substrate 102 includes wiring and the like, if a deviation of the distance D1 occurs during bending, a load acts on the end portion 102a, and a damage such as a crack may occur, which may cause a disconnection of the wiring.

The electronic device 1 of the present embodiment has a structure that can provide excellent reliability even when it is bent in this way. The structure of the electronic apparatus 1 will be described in detail below.

Fig. 5 is a schematic exploded perspective view of the electronic device 1 according to embodiment 1. Fig. 6 is a schematic perspective view of the electronic device 1 according to embodiment 1 in an assembled state. In these drawings, each part is shown more schematically than in fig. 1 for ease of explanation.

As shown in fig. 5, the electronic apparatus 1 includes the flexible substrate 2, the cover member 3, and the frame 4. Further, the electronic apparatus 1 includes a support body 5 and a case 6. The housing 6 includes plate-like 1 st and 2 nd bases 6A and 6B and a hinge 6C that connects the bases 6A and 6B to be rotatable about a bending axis AY.

In the example of fig. 5, the bending axis AY is parallel to the 2 nd direction Y. However, the bending axis AY may intersect the 2 nd direction Y. The position of the bending axis AY is not particularly limited, and may be located not near the center of the housing 6 in the 1 st direction X as shown in the drawing, for example. The structure of the hinge 6C is not particularly limited, and may include a plurality of members for connecting the substrates 6A and 6B as shown in the drawing, or may be a flexible film-like member connected to the substrates 6A and 6B.

The flexible substrate 2 has a display area (central area) DA in which a plurality of pixels PX for displaying an image on a display surface are formed, and a peripheral area SA around the display area DA. The pixel PX is an example of an electric element.

The pixel PX includes, for example, red, green, and blue sub-pixels. The sub-pixel includes a switching element, a pixel electrode connected to the switching element, a common electrode facing the pixel electrode, and an organic layer disposed between the pixel electrode and the common electrode. The organic layer emits light in response to a potential difference between the pixel electrode and the common electrode.

The flexible substrate 2 includes a plurality of signal lines for supplying video signals to the switching elements of the respective sub-pixels, and a plurality of scanning lines for supplying scanning signals to the switching elements of the respective sub-pixels. The plurality of signal lines extend in the 1 st direction X and are arranged in the 2 nd direction Y in the display area DA. A plurality of scan lines extend in the 2 nd direction Y and are arranged in the 1 st direction X in the display area DA.

The flexible substrate 2 has a1 st end 2a on which the circuit substrate 20 is mounted and a side 2b opposite to the 1 st end 2a in the 1 st direction X. In the illustrated example, the 1 st end 2a and the side 2b are parallel to the 2 nd direction Y.

The 1 st end 2a is a portion where the circuit board 20 is mounted, and has a portion protruding from the support body 5. In the example shown in fig. 5, the 1 st end 2a is in a state before being bent. When the electronic apparatus 1 is assembled, a part of the 1 st end portion 2a is bent to be positioned between the support body 5 and the base body 6A. The circuit board 20 is, for example, a flexible circuit board, and is connected to the flexible board 2 via a plurality of terminals formed in the 1 st end portion 2a.

The circuit board 20 is mounted with, for example, a control module. The 1 st end 2a can also be referred to as a mounting edge. Further, the flexible substrate 2 has a bent portion 2c between the 1 st end portion 2a and the side 2B, which is bent when the bases 6A, 6B are rotated with each other. The bending portion 2C overlaps the hinge 6C and the bending axis AY in the 3 rd direction Z. The curved portion 2c is a portion that is curved when the electronic device 1 is curved, and has a curvature when the electronic device 1 is curved.

The cover member 3 is rectangular, is provided on the flexible substrate 2 in the 3 rd direction Z, and covers both the display area DA and the peripheral area SA. The cover member 3 has a1 st side 3a located on the 1 st end 2a side of the flexible board 2 and a2 nd side 3b located on the side 2b side in the 1 st direction X. Further, the cover member 3 has a 3 rd side 3c located at one end in the 2 nd direction Y and connecting the 1 st side 3a and the 2 nd side 3b, and a 4 th side 3d located on the opposite side of the 3 rd side 3 c. In the illustrated example, the 1 st side 3a and the 2 nd side 3b are parallel to the 2 nd direction Y, and the 3 rd side 3c and the 4 th side 3d are parallel to the 1 st direction X.

As the cover member 3, for example, a flexible and transparent film made of a material such as polyethylene terephthalate (PET), cycloolefin polymer (COP), or polyimide can be used.

The support 5 is rectangular, is located below the flexible substrate 2 in the 3 rd direction Z, and overlaps the flexible substrate 2. The support 5 is a support film or the like, for example, which supports the flexible substrate 2. The support 5 has a1 st surface 51 opposed to the flexible substrate 2 and a2 nd surface 52 located on the opposite side of the 1 st surface 51. The flexible substrate 2 is positioned between the 1 st surface 51 and the cover member 3. The laminate including the flexible substrate 2, the cover member 3, and the support body 5 is connected to the base bodies 6A and 6B by an appropriate method such as adhesion.

The frame 4 is provided on the cover member 3 in the 3 rd direction Z and has a rectangular opening 40 having a size corresponding to the display area DA. Further, the frame 4 has a base end portion 41 connected to the case 6 in a state where the electronic apparatus 1 is assembled, and an edge portion 42 around the opening 40. The rim 42 can also be referred to as an edge.

The base end portion 41 and the rim portion 42 are integrally formed, for example. The edge 42 is, for example, a frame shape parallel to the 1 st direction X and the 2 nd direction Y, and covers the cover member 3 and the peripheral area SA of the flexible substrate 2. The frame 4 is formed of a flexible material such as rubber, and deforms together with the flexible substrate 2, the cover member 3, and the support body 5 when the base bodies 6A and 6B rotate. The proximal end portion 41 is connected to the housing 6 by an appropriate method such as adhesion.

In the example illustrated in fig. 6, the entirety of the display area DA is flat. Hereinafter, the shape of the electronic device 1 in this state is referred to as a flat shape F0. By rotating the bases 6A, 6B from the flat shape F0 to each other, the electronic apparatus 1 can be deformed into the open shape F1 and the closed shape F2. The open shape F1 is a state in which the electronic device 1 is bent in the opening direction R1 shown in fig. 1 (convex bending), and the closed shape F2 is a state in which the electronic device 1 is bent in the closing direction R2 shown in fig. 1 (concave bending).

Fig. 7 is a schematic plan view of the electronic device 1 according to embodiment 1 in an assembled state. The flexible substrate 2 has a region FA between the bent portion 2c and the 1 st end portion 2a and a region NFA between the bent portion 2c and the side 2b in the 1 st direction X.

At least a part of the cover member 3 is bonded to the frame 4 at a portion overlapping the area FA. In the example shown in fig. 7, the 1 st side 3a of the cover member 3 is bonded to the portion overlapping the edge 42 of the frame 4. That is, the 1 st side 3a is adhesively fixed to the frame 4. In fig. 7, the bonded portion between the cover member 3 and the edge portion 42 is indicated by hatching.

On the other hand, the cover member 3 is not bonded to the frame 4 at the portion overlapping the region NFA. I.e. the 2 nd side 3b is not fixed to the frame 4. The cover member 3 is not bonded to the frame 4 at the portion overlapping the bent portion 2c. Preferably, in order to apply the surface separation during bending of the electronic device 1, a portion of the cover member 3 that is not bonded to the frame 4 (for example, a portion that overlaps the region NFA and the bent portion 2 c) extends from the 2 nd side 3b of the cover member 3 to the 1 st side 3a side of the center in the 1 st direction X.

The detection unit DP described later is located in the area FA. The position of the detection portion DP in the area FA is not particularly limited, and may be located not near the center of the area FA in the 2 nd direction Y, for example, as shown in the drawing.

Fig. 8 and 9 show an example of the bonded portion between the cover member 3 and the frame 4. In the example shown in fig. 8 and 9, the cover member 3 has portions that are bonded to the edge 42 of the frame 4 not only at the 1 st side 3a but also at the 3 rd side 3c and the 4 th side 3d in the 1 st direction X from the 1 st side 3 a. That is, the cover member 3 can be said to be bonded to the frame 4 at 3 sides of the 1 st side 3a, the 3 rd side 3c, and the 4 th side 3d. In each figure, the portion where the cover member 3 is bonded to the edge portion 42 is indicated by hatching.

In fig. 8, a part of the 3 rd side 3c and the 4 th side 3d overlapping the region FA from the 1 st side 3a in the 1 st direction X is adhesively fixed to the edge 42. In fig. 9, the entire portions of the 3 rd and 4 th sides 3c and 3d overlapping the area FA are adhesively fixed to the edge 42. In each figure, the detection portion DP is located between the portions of the 3 rd side 3c and the 4 th side 3d bonded to the edge portion 42 in the 2 nd direction Y. The detection portion DP may not be located between the portions of the 3 rd side 3c and the 4 th side 3d bonded to the edge portion 42 in the 2 nd direction Y.

In the examples shown in fig. 7 to 9, the entire 1 st side 3a is bonded to the edge 42, but only a part of the 1 st side 3a may be bonded to the edge 42. In addition, only a part of at least one of the 3 rd side 3c and the 4 th side 3d may be bonded to the edge 42. The portions where the 1 st side 3a, the 3 rd side 3c, and the 4 th side 3d are bonded to the edge portion 42 may overlap the area FA, and are not limited to the illustrated example. The range in which the 1 st side 3a, the 3 rd side 3c, and the 4 th side 3d are bonded to the edge 42 may be arbitrarily determined depending on the position of the detection portion DP.

Fig. 10 is a schematic sectional view taken along line B-B of the electronic apparatus 1 shown in fig. 7. Fig. 11 is a schematic enlarged view of a portion C of the electronic apparatus 1 shown in fig. 10. Fig. 11 shows the 1 st end 2a side of the flexible substrate 2. In fig. 10 and 11, the housing 6 is not shown. Here, although the adhesion of the 1 st side 3a to the edge 42 is described, the adhesion of the 3 rd side 3c to the edge 42 and the adhesion of the 4 th side 3d to the edge 42 are also the same.

As shown in the figures, the cover member 3 has a surface facing the flexible substrate 2 and an upper surface 3u located on the opposite side. The edge portion 42 has a lower surface 42a facing the upper surface 3u. As shown in fig. 11, the 1 st end 2a of the flexible substrate 2 has a portion protruding from the 1 st side 3a of the cover member 3 and the end of the support body 5. The 1 st end portion 2a is bent so that the circuit board 20 is positioned on the 2 nd surface 52 side.

The flexible substrate 2 is bent toward the 2 nd surface 52 of the support 5, and has an overlapping area MA in which portions of the flexible substrate 2 overlap each other in the 3 rd direction Z. The overlapping area MA overlaps with a portion of the flexible substrate 2 located between the cover member 3 and the support body 5. The bent portion of the flexible substrate 2 is connected to the 2 nd surface 52 by an appropriate method such as bonding.

In the example shown in fig. 10 and 11, the electronic device 1 includes a1 st adhesive layer AD11 that is positioned between the 1 st surface 51 of the support 5 and the flexible substrate 2 to bond the 1 st surface 51 to the flexible substrate 2, and a2 nd adhesive layer AD12 that is positioned between the flexible substrate 2 and the cover member 3 to bond the flexible substrate 2 to the cover member 3. The 1 st adhesive layer AD11 and the 2 nd adhesive layer AD12 are formed of, for example, a soft adhesive material described in fig. 2.

An adhesive 71 is provided between the 1 st side 3a and the edge 42, and the upper surface 3u on the 1 st side 3a side is adhered to the lower surface 42a of the edge 42 by the adhesive 71. On the other hand, a gap G is provided between the 2 nd side 3b and the edge 42, and the upper surface 3u on the 2 nd side 3b side is not bonded to the lower surface 42a.

The adhesive 71 may be a resin material or the like, and the upper surface 3u and the lower surface 42a may be adhered by providing a resin material or the like. Other members may be present between the support body 5 and the flexible substrate 2, between the flexible substrate 2 and the cover member 3, and between the cover member 3 and the frame 4.

The upper surface 3u on the 1 st side 3a is bonded to the lower surface 42a, and the upper surface 3u on the 1 st side 3a is connected to the housing 6 via the frame 4. Thus, when the electronic apparatus 1 is bent, the movement of the laminated body including the flexible substrate 2, the cover member 3, and the support 5 in the area FA is inhibited, and the 1 st end 2a of the flexible substrate 2, the 1 st side 3a of the cover member 3, and the end of the support 5 are less likely to be displaced with respect to the frame 4.

Since the laminate is less likely to shift in position when the electronic device 1 is bent, the load on the 1 st end portion 2a is suppressed, and the possibility of damage such as cracking in the wiring and the like of the flexible substrate 2 is reduced. In particular, as shown in fig. 11, it is possible to suppress the load on the bent portion of the 1 st end portion 2a and the bonding portions between the bent portion and the 1 st adhesive layer AD11, the 2 nd adhesive layer AD12, and the support body 5.

On the other hand, since the upper surface 3u on the 2 nd side 3b is not bonded to the lower surface 42a, the mid-plane separation can be applied, and the movement of the flexible substrate 2, the cover member 3, and the support 5 in the region NFA when the electronic device 1 is bent is not easily hindered. That is, the side 2b of the flexible substrate 2, the 2 nd side 3b of the cover member 3, and the support 5 can move relative to the frame 4 when the electronic device 1 is bent. In addition, the cover member 3 is not bonded to the edge 42 of the frame 4 at the portion overlapping the bent portion 2c, and therefore, deformation of the cover member 3 and the like is not easily inhibited.

The electronic device 1 further includes a detection element DE disposed opposite the 2 nd surface 52 and between the 1 st end 2a and the bending axis AY. The detection element DE is, for example, a camera module (e.g., a pinhole camera), a sensor module, or the like. The electronic apparatus 1 has a detection portion DP at a position overlapping the detection element DE in the 3 rd direction Z. In the example illustrated in fig. 11, the position where the detection element DE is provided does not overlap the overlap area MA in the 3 rd direction Z.

The detection portion DP has a1 st transmission portion TP1 that transmits light (for example, visible light) of the flexible substrate 2, a1 st opening O1 of the 1 st adhesive layer AD11, a2 nd opening O2 of the support 5, and a 3 rd opening O3 of the 2 nd adhesive layer AD12.

The 1 st transmissive portion TP1 is a region which transmits light more easily than the other portions of the display region DA. For example, in the 1 st transmissive portion TP1, the pixels PX and the sub-pixels are reduced in size compared with other portions of the display area DA, and a transmissive area for light is formed between the pixels PX and between the sub-pixels. As another example, in the 1 st transmissive portion TP1, the arrangement of the pixels PX and the sub-pixels is different from that in other portions of the display area DA, and the pixels PX and the sub-pixels are thinned out in at least one of the 1 st direction X and the 2 nd direction Y, and a transmissive area for light is formed in the thinned-out portion.

As still another example, the pixels PX and the sub-pixels are not arranged in the 1 st transmissive portion TP1, and a transmissive region for light is formed substantially in the entire region. As still another example, the 1 st transmissive part TP1 may be a through hole. With the above-described configuration, the 1 st transmissive portion TP1 can be formed as a transparent (high transmittance) region in the flexible substrate 2 compared to other regions.

The openings O1 to O3 are, for example, through holes. The shape of each of the openings O1 to O3 may be circular or rectangular. The 1 st transmissive portion TP1, the 1 st opening O1, the 2 nd opening O2, and the 3 rd opening O3 are coaxially positioned in the 3 rd direction Z and overlap each other. The 1 st opening O1 overlaps the 1 st transmissive portion TP1, and the 2 nd opening O2 overlaps the 1 st opening O1. With such a configuration, the detection portion DP can transmit light between the cover member 3 and the detection element DE.

Since the movement of the flexible substrate 2, the cover member 3, and the support 5 is blocked in the area FA, the positions of the 1 st transmission portion TP1, the 1 st opening O1, the 2 nd opening O2, and the 3 rd opening O3 of the detection portion DP are less likely to shift when the electronic device 1 is bent.

When the positions of the respective layers constituting the detection portion DP are shifted during bending, for example, the transmission of light in the 1 st transmission portion TP1 is blocked by the openings O1 to O3. Therefore, when the electronic apparatus 1 is bent, the area through which light can be transmitted through the detection element DE via the detection portion DP becomes smaller than before the electronic apparatus 1 is bent. Therefore, when the detection element DE is provided, it is necessary to select the detection element DE in advance in accordance with the area of the detection portion DP when the electronic apparatus 1 is bent.

Since the positions of the respective layers constituting the detection portion DP are not easily shifted, the change in the area of the detection portion DP before and after the bending of the electronic device 1 is reduced. This makes it possible to provide the detection element DE having a size approximately equal to the area of the detection section DP in front of the bending electronic device 1, and the detection element DE can be easily provided.

According to the present embodiment described above, the electronic apparatus 1 having excellent reliability even when bent can be obtained. That is, the upper surface 3u on the 1 st side 3a side is bonded to the lower surface 42a, and unlike the comparative example shown in fig. 2, since the movement of the flexible substrate 2, the cover member 3, and the support 5 in the area FA is inhibited when the electronic device 1 is bent, the positions of the 1 st end 2a of the flexible substrate 2, the 1 st side 3a of the cover member 3, and the support 5 are not easily displaced.

This suppresses the load on the 1 st end portion 2a of the mounted circuit board 20, reduces the possibility of damage such as cracking of the wiring and the like of the flexible substrate 2, and improves the reliability of the electronic device 1 when it is bent.

On the other hand, since the cover member 3 is not bonded to the frame 4 at the portion overlapping the region NFA and the bent portion 2c, the neutral surface separation can be applied when the electronic device 1 is bent. That is, both the improvement of reliability when the electronic apparatus 1 is bent and the application of the neutral plane separation can be achieved.

Further, when the 1 st transmissive portion TP1 is formed by reducing the pixel PX, the sub-pixel, or the thinning-out pixel PX, the sub-pixel at the position overlapping the detection element DE, or by not providing the pixel PX, the sub-pixel, or the like, it is not necessary to perform processing such as hole forming, notch forming, or the like on the flexible substrate 2. This can eliminate defects due to processing as well as reduce the number of processing steps, and thus can provide the electronic device 1 with high reliability. In addition, the present embodiment can also obtain the above-described various effects.

In the present embodiment, the upper surface 3u of the cover member 3 and the lower surface 42a of the rim 42 are bonded by the adhesive 71, but a resin material or the like may be provided in a gap formed between the base end portion 41 in the 1 st direction X and a side surface or the like of the cover member 3 facing the base end portion 41. In the present embodiment, the electronic device 1 includes the detection element DE, but may not include the detection element DE. The 1 st end 2a of the mounted circuit board 20 is bent toward the 2 nd surface 52, but the 1 st end 2a may not be bent.

[ 2 nd embodiment ]

Embodiment 2 will be explained. The same configuration as that of embodiment 1 can be applied to the configuration not particularly mentioned.

Fig. 12 is a schematic enlarged cross-sectional view of the electronic device 1 according to embodiment 2. In fig. 12, the first end 2a of the flexible substrate 2 of the electronic device 1 is shown enlarged. As in embodiment 1, the 1 st end portion 2a is bent so that the circuit board 20 is positioned on the 2 nd surface 52 side. The point that the position where the detection element DE is provided overlaps the overlap area MA in the 3 rd direction Z is different from the example illustrated in fig. 11. In fig. 12, illustration of the case 6 is omitted.

The electronic apparatus 1 includes the flexible substrate 2, the cover member 3, the frame 4, and the support 5, as in embodiment 1. Further, the electronic device 1 includes a1 st adhesive layer AD11 for bonding the 1 st surface 51 of the support body 5 and the flexible board 2, and a2 nd adhesive layer AD12 for bonding the flexible board 2 and the cover member 3, and the upper surface 3u of the cover member 3 includes a portion bonded to the lower surface 42a of the edge portion 42 by the adhesive 71 at a portion overlapping the area FA. Although not shown, the cover member 3 is not bonded to the lower surface 42a of the edge 42 in the portion overlapping the region NFA.

The electronic device 1 further includes an adhesive 72. The bent portion of the 1 st end 2a of the flexible substrate 2 is bonded to the 2 nd surface 52 of the support 5 by the adhesive 72 in the overlap area MA. The adhesive 72 is, for example, a Pressure Sensitive Adhesive (PSA). The adhesive 72 can be applied similarly to embodiment 1.

Since the position where the detection element DE is provided overlaps the overlap area MA in the 3 rd direction Z, the detection portion DP also overlaps the overlap area MA in the 3 rd direction Z. The detection portion DP has a1 st transmission portion TP1, a1 st opening O1, a2 nd opening O2, and a 3 rd opening O3, and further has a2 nd transmission portion TP2 for transmitting light of a bent portion of the 1 st end portion 2a. The 1 st and 2 nd transmissive portions TP1 and TP2 are provided in the overlapping area MA of the flexible substrate 2. The configuration described in embodiment 1 can be applied to the 1 st transmissive part TP 1. The openings O1 to O3 are, for example, through holes.

Fig. 13 is a schematic view of the 2 nd transmissive part TP2 of the flexible substrate 2 shown in fig. 12. In the 2 nd transmissive portion TP2, as illustrated in fig. 13, the wiring W such as a signal line provided in the flexible substrate 2 bypasses a portion overlapping with the detection portion DP (the 2 nd transmissive portion TP 2). That is, the wiring W includes a portion extending linearly and a portion bent along the shape of the detection portion DP (the 2 nd transmission portion TP 2). Thus, the 2 nd transmission part TP2 can be formed as a transparent (high transmittance) region in the flexible substrate 2 as compared with the other regions, similarly to the 1 st transmission part TP 1.

When the detection section DP is provided in the overlap area MA, the filling materials LM are filled in the openings O1 to O3. The filler LM may be, for example, an Optically Clear Resin (OCR). The filler LM may be filled in all of the openings O1 to O3, or may be filled in only a part of the openings O1 to O3.

When the detection portion DP is provided in the overlap area MA, the thickness (film thickness) of the detection portion DP in the 3 rd direction Z is likely to change due to the influence of the electronic device 1 to return to its original shape when it is bent. By filling the filling material LM in each of the openings O1 to O3, the thickness variation of the detection portion DP in the 3 rd direction Z can be reduced while suppressing this influence. In addition, when the 1 st transmissive part TP1 is a through hole, the filling material LM may be filled in the 1 st transmissive part TP 1. The filler LM can be similarly applied to embodiment 1. Instead of the filler LM, an optical element such as a lens module may be embedded.

Next, the relationship between the detection portion DP (filler LM) and the adhesive 72 will be described. Fig. 14 to 16 are schematic views showing examples of the adhesive 72 of the electronic device 1 shown in fig. 12. Fig. 14 to 16 show the relationship between the detection portion DP (filler LM) and the adhesive 72 in plan view. As illustrated in the drawings, the detection portion DP is provided at a position not overlapping the adhesive 72 in the 3 rd direction Z, and the adhesive 72 does not overlap the optical axis of the detection element DE.

In fig. 14, the adhesive 72 is provided at a position not overlapping the detection portion DP in the 2 nd direction Y. In fig. 15 and 16, the adhesive 72 is provided at a position overlapping the detection portion DP in the 2 nd direction Y. In fig. 15, the adhesive 72 overlaps the detection portion DP as a whole in the 1 st direction X. In fig. 16, the adhesive 72 overlaps the detection portion DP in a part in the 1 st direction X.

As illustrated in fig. 15 and 16, the adhesive 72 has a notch N1. The notch N1 is provided at a position overlapping the detection portion DP in the 3 rd direction Z. Therefore, even when the adhesive 72 is provided at a position overlapping the detection portion DP in the 2 nd direction Y, the adhesive 72 does not easily interfere with the transmission of light to the detection element DE.

The position and shape of the notch N1 are not limited to the illustrated examples, and can be appropriately changed in relation to the detection portion DP. For example, in the example shown in fig. 14 and 16, the adhesive 72 and the detection portion DP may be positioned opposite to each other in the 1 st direction X.

With the structure of the electronic apparatus 1 according to the present embodiment, an electronic apparatus 1 having excellent reliability even when bent as in embodiment 1 can be obtained. In addition, even when the detection element DE is provided at a position overlapping the overlapping region MA as in the present embodiment, the 1 st transmissive portion TP1 and the 2 nd transmissive portion TP2 are provided in the flexible substrate 2, so that the sensing of the detection element DE is not easily hindered.

Further, when the wiring W is routed around the position overlapping the detection element DE to form the 2 nd transmission part TP2, it is not necessary to perform processing such as drilling or chipping on the flexible substrate 2 as in the 1 st transmission part TP1, and thus it is possible to reduce the number of processing steps and eliminate defects due to the processing. In addition, even when the detection portion DP is provided in the overlap area MA, the filler LM is filled in the openings O1 to O3, whereby the change in thickness of the detection portion DP in the 3 rd direction Z can be reduced.

[ embodiment 3 ]

Embodiment 3 will be explained. The same configurations as those of the above-described embodiments can be applied to the configurations not specifically mentioned.

Fig. 17 is a schematic sectional view of the electronic apparatus 1 according to embodiment 3. The electronic apparatus 1 includes the flexible substrate 2, the cover member 3, and the support 5, as in the above-described embodiment. The electronic device 1 includes the frame 4 and the case 6 described in embodiment 1, but illustration thereof is omitted here.

The flexible substrate 2 has a region FA between the bent portion 2c and the 1 st end portion 2a in the 1 st direction X, and a region NFA between the bent portion 2c and the side 2b. As shown in fig. 17, the 1 st end 2a of the flexible substrate 2 has a portion protruding from the 1 st side 3a of the cover member 3 and the end of the support body 5. The 1 st end 2a is bent so that the circuit board 20 is positioned on the 2 nd surface 52 side. The flexible substrate 2 is bent toward the 2 nd surface 52 of the support 5, and has an overlapping area MA in which portions of the flexible substrate 2 overlap each other in the 3 rd direction Z. The overlapping area MA overlaps with a portion of the flexible substrate 2 located between the cover member 3 and the support body 5.

The bent portion of the flexible substrate 2 may be connected to the 2 nd surface 52 by an appropriate method such as bonding, or may be bonded by an adhesive 72 described with reference to fig. 12. It is preferable that the cover member 3 is not bonded to the frame 4, not shown.

The electronic device 1 includes a1 st adhesive layer AD11 for bonding the 1 st surface 51 of the support body 5 and the flexible substrate 2, and a2 nd adhesive layer AD12 for bonding the flexible substrate 2 and the cover member 3. The 1 st adhesive layer AD11 further includes A1 st member A1 and A2 nd member A2 having a young's modulus smaller than that of the 1 st member A1 in a cured state. For example, the boundary between the 1 st member A1 and the 2 nd member A2 has a gradually decreasing young's modulus in a cured state from the 1 st member A1 to the 2 nd member A2. The 1 st adhesive layer AD11 is different from the above embodiments mainly in that it includes the 1 st member A1 and the 2 nd member A2.

The 2 nd member A2 and the 2 nd adhesive layer AD12 of the 1 st adhesive layer AD11 are formed of, for example, a soft adhesive material described in fig. 2. The 1 st member A1 is formed of, for example, OCR, optical Clear Adhesive (OCA), or the like, and is a harder Adhesive than the above-described soft Adhesive.

The 1 st member A1 is positioned on the 1 st end 2a side, and bonds at least a part of the 1 st end 2a of the flexible substrate 2 to the support 5. The 2 nd member A2 is positioned on the side 2b, and bonds the side 2b to the support 5. In order to apply the surface separation when the electronic apparatus 1 is bent, a region (formation region) where the 2 nd part A2 is formed preferably extends from the side 2b side of the flexible substrate 2 to the 1 st end 2a side of the 1 st direction X with respect to the center. The formation area of the 1 st part A1 is preferably smaller than that of the 2 nd part A2.

The 1 st end 2a of the flexible substrate 2 is bonded to the support 5 via the 1 st member A1, and thus movement of the laminated body including the flexible substrate 2, the cover member 3, and the support 5 in the area FA is inhibited when the electronic apparatus 1 is bent. This makes it difficult for the first end 2a, the first side 3a of the cover member 3, and the support body 5 to be displaced. The 1 st end portion 2a can be said to be connected to the 1 st member A1 via the support 5 to the not-shown casing 6.

Since the position of the laminate in the region FA is less likely to shift when the electronic device 1 is bent, a load on the 1 st end portion 2a is suppressed, and the possibility of damage such as a crack occurring in the wiring or the like of the flexible substrate 2 is reduced.

On the other hand, the side 2b of the flexible substrate 2 is bonded to the support 5 via the 2 nd member A2. Therefore, when the electronic device 1 is bent, the movement of the flexible substrate 2, the cover member 3, and the support body 5 in the region NFA is not easily hindered.

The side 2b, the 2 nd side 3b of the cover member 3, and the support 5 can move in the region NFA when the electronic device 1 is bent. Since the bent portion 2c of the flexible substrate 2 is bonded to the support body 5 by the 2 nd member A2, deformation of the bent portion 2c, the cover member 3, and the like is not easily hindered.

The electronic device 1 includes a detection element DE facing the 2 nd surface 52 and located between the 1 st end 2a and the bending axis AY. In the example illustrated in fig. 17, the detection element DE is disposed at a position not overlapping the overlapping area MA in the 3 rd direction Z.

The electronic apparatus 1 has a detection portion DP at a position overlapping the detection element DE in the 3 rd direction Z. The detection portion DP has a1 st transmission portion TP1 for transmitting light of the flexible substrate 2, a1 st opening O1 of the 1 st adhesive layer AD11, a2 nd opening O2 of the support body 5, and a 3 rd opening O3 of the 2 nd adhesive layer AD12.

The 1 st transmissive portion TP1, the 1 st opening O1, the 2 nd opening O2, and the 3 rd opening O3 are coaxially positioned in the 3 rd direction Z and overlap each other. The configuration described in embodiment 1 can be applied to the 1 st transmissive part TP 1. The openings O1 to O3 are, for example, through holes. The detection portion DP may be filled with the filling material LM described in embodiment 2.

Fig. 18 to 20 are schematic plan views of the electronic device 1 according to embodiment 3. Fig. 18 to 20 illustrate a region where the 1 st adhesive layer AD11 is formed in the 1 st member A1 and a region where the 2 nd member A2 is formed.

In the example shown in fig. 18, the 1 st member A1 is formed in the 1 st direction X from the 1 st end 2a in a range where the range including the detection portion DP (the 1 st opening O1) is bonded to the support 5. In the example shown in fig. 19, the 1 st member A1 is formed from the 1 st end 2a in a range where a range not overlapping with the detection portion DP is bonded to the support 5 and around the detection portion DP (the 1 st opening O1). In this case, the 1 st member A1 may be formed so as to surround the 2 nd opening O2 of the support 5. Further, the 1 st component A1 does not overlap the detection portion DP. Since the 1 st opening O1 is surrounded by the 1 st member A1, the positions of the flexible substrate 2 and the support 5 are less likely to shift even in the vicinity of the 1 st opening O1 when the electronic device 1 is bent.

In the example shown in fig. 20, the electronic device 1 does not have the detection portion DP, and the 1 st member A1 is formed in a range where only the vicinity of the 1 st end portion 2a is bonded to the support body 5. In the example illustrated in fig. 18 to 20, the formation area of the 1 st component A1 is smaller than that of the 2 nd component A2. The formation region of the 1 st member A1 may be a region overlapping with the region FA in the 3 rd direction Z, and the 1 st member A1 may bond the entire region FA to the support 5. The formation region of the 1 st part A1 may be arbitrarily determined according to the position of the detection element DE. The 1 st member A1 may not be formed around the detection portion DP.

With the configuration of the electronic apparatus 1 according to the present embodiment, an electronic apparatus 1 having excellent reliability even when bent as in the above-described embodiment can be obtained. Further, the same effects as those of the above-described embodiments can be obtained. As in the present embodiment, the 1 st end portion 2a is bonded to the 1 st surface 51 of the support 5 via the 1 st member A1, whereby the positional displacement between the flexible substrate 2 and the support 5 when the electronic device 1 is bent can be further suppressed.

Further, the 1 st opening O1 of the detection portion DP is surrounded by the 1 st member A1, and the positions of the layers constituting the detection portion DP are less likely to be displaced. Further, by making the formation region of the 1 st member A1 smaller than the formation region of the 2 nd member A2, both improvement of reliability when the electronic apparatus 1 is bent and application of neutral plane separation can be achieved.

[ 4 th embodiment ]

Embodiment 4 will be explained. The same configurations as those of the above-described embodiments can be applied to configurations not specifically mentioned.

Fig. 21 is a schematic cross-sectional view of the electronic apparatus 1 according to embodiment 4. The point that the position where the detection element DE is provided overlaps the overlap area MA in the 3 rd direction Z is different from the example illustrated in fig. 17.

The electronic device 1 includes the flexible substrate 2, the cover member 3, and the support 5, as in the above-described embodiments. The electronic device 1 includes the frame 4 and the case 6 described in embodiment 1, but illustration thereof is omitted here.

The electronic device 1 includes a1 st adhesive layer AD11 for bonding the 1 st surface 51 of the support body 5 to the flexible substrate 2, and a2 nd adhesive layer AD12 for bonding the flexible substrate 2 to the cover member 3. Further, similarly to embodiment 3, the 1 st adhesive layer AD11 includes the 1 st member A1 and the 2 nd member A2 having a young's modulus smaller than that of the 1 st member A1 in a cured state.

The electronic device 1 further includes the adhesive 72 described in embodiment 2. The bent portion of the 1 st end 2a of the flexible substrate 2 is bonded to the 2 nd surface 52 of the support 5 by the adhesive 72 in the overlap area MA.

The detection element DE and the detection portion DP overlap the overlap area MA in the 3 rd direction Z. The detection part DP has a1 st transmission part TP1, a1 st opening O1, a2 nd opening O2 and a 3 rd opening O3, and further has a2 nd transmission part TP2 for transmitting light at a bent part of the 1 st end 2a. The 1 st transmissive part TP1 and the 2 nd transmissive part TP2 are provided in the overlapping region MA of the flexible substrate 2.

The configuration described in embodiment 1 and embodiment 2 can be applied to the 1 st transmissive part TP1 and the 2 nd transmissive part TP2. The opening portions O1 to O3 are filled with the filler LM described in embodiment 2, but the filler LM may not be filled. As described in embodiment 2, the detection portion DP is provided at a position not overlapping the adhesive 72 in the 3 rd direction Z.

For example, the adhesive 72 is provided at a position not overlapping the detection portion DP in the 2 nd direction Y, or the adhesive 72 has the notch portion N1, so that the obstruction of the light transmission of the detection element DE by the adhesive 72 is suppressed.

With the structure of the electronic apparatus 1 according to the present embodiment, the electronic apparatus 1 having excellent reliability even when bent as in the above-described embodiment can be obtained. Further, the same effects as those of the above-described embodiments can be obtained. Even when the detection element DE is provided at a position overlapping the overlapping region MA as in the present embodiment, the 1 st end portion 2a of the flexible substrate 2 is bonded to the 1 st surface 51 of the support body 5 by the 1 st member A1, whereby the thickness variation of the detection portion DP in the 3 rd direction Z can be reduced.

As described above, in the electronic device according to the embodiment of the present invention, all electronic devices that can be implemented by those skilled in the art with appropriate design changes include the gist of the present invention.

Although the organic EL display device is shown as an example of the electronic device 1, the configuration disclosed in each of the above embodiments can be applied to a display device including a pixel PX as an electric element such as a liquid crystal display element or a light emitting diode display element. The configuration disclosed in each of the above embodiments can also be applied to an electronic device including various sensors such as an optical sensor, a temperature sensor, and a touch sensor as electric elements.

In the scope of the idea of the present invention, various modifications can be conceived by those skilled in the art, and these modifications are also understood to fall within the scope of the present invention. For example, in the above-described embodiments, those skilled in the art can add, delete, or modify the design of components, or add, omit, or modify the conditions of the processes as appropriate, and the gist of the present invention is included in the scope of the present invention.

It is to be understood that the present invention is not limited to the above-described embodiments, but is applicable to various other embodiments as long as the embodiments are applicable to various fields of the invention.

Claims (7)

1. An electronic device, characterized in that,

the disclosed device is provided with:

a flexible substrate having a central region in which a plurality of electric elements are formed and a peripheral region surrounding the central region;

a cover member provided on the flexible substrate; and

a frame provided on the cover member and covering the peripheral region;

the flexible substrate has a1 st end portion on which a circuit substrate is mounted;

the cover member has a1 st side located on the 1 st end side and a2 nd side located on the opposite side of the 1 st side;

an adhesive member is arranged between the 1 st edge and the frame;

a gap is provided between the 2 nd side and the frame.

2. The electronic device of claim 1,

and bending along a bending axis parallel to the 1 st side and the 2 nd side.

3. The electronic device of claim 2,

the cover member has a 3 rd side connecting the 1 st side and the 2 nd side, and a 4 th side located on the opposite side of the 3 rd side;

a part of the 3 rd side and the 4 th side between the 1 st side and the bending axis is fixed to the frame by adhesion.

4. The electronic device of claim 1,

a support body having a1 st surface and a2 nd surface located on the opposite side of the 1 st surface;

the flexible board is located between the 1 st surface and the cover member, and the circuit board is bent at the 1 st end portion to be located on the 2 nd surface side.

5. The electronic device of claim 2,

a detecting element positioned between the 1 st end and the bending shaft;

the flexible substrate has a light-transmitting portion that transmits light at a position overlapping the detection element.

6. The electronic device of claim 1,

the 1 st side is fixed to the frame by adhesion.

7. The electronic device of claim 6,

the 2 nd side is not fixed to the frame.

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