CN217639853U - Electronic device - Google Patents

Abstract

Provided is an electronic device having excellent reliability. An electronic device according to an embodiment includes: a flexible substrate having a central region in which a plurality of electric elements are formed and a peripheral region surrounding the central region; a cover member provided on the flexible substrate; and a frame provided on the cover member to cover the peripheral region. The flexible substrate has a1 st end portion on which the circuit substrate is mounted. The cover member has a1 st side located on the 1 st end portion side and a2 nd side located on the opposite side of the 1 st side. An adhesive is provided between the 1 st side and the frame, and a gap is provided between the 2 nd side and the frame.

Description

Electronic equipment

This application claims priority based on Japanese Patent Application No. 2021-004019 filed on January 14, 2021, the entire contents of which are incorporated herein by reference.

technical field

The utility model relates to electronic equipment.

Background technique

In recent years, electronic devices that can fold or unfold a display surface have been developed. The electronic device has good portability in a folded state, and can bring a user a good feeling of use in an unfolded state.

This electronic device is formed by laminating a flexible substrate having flexibility, various functional films, and the like. The flexible board has a mounting side on which a circuit board or the like for exchanging signals with the outside is mounted, and a bent portion may be formed on the side of the mounting side.

When bending this electronic device, bending strain occurs in a flexible substrate or the like, and in order to suppress an increase in the bending strain, a neutralization plane separation technique has been conventionally employed. However, when the neutralized surfaces are separated, each layer is shifted in the circumferential direction of the bending during bending, so a load on the bent portion on the side of the attachment and the like can be expected.

Utility model content

One of the objects of the present disclosure is to provide an electronic device having excellent reliability even when it is bent.

An electronic device according to one embodiment includes: a flexible substrate having a central area where a plurality of electrical elements are formed and a peripheral area surrounding the central area; a cover member provided on the flexible substrate; and a frame provided on the cover member, Cover the surrounding area above. The said flexible board has a 1st edge part on which a circuit board is mounted. The said cover member has the 1st side located in the said 1st edge part side, and the 2nd side located in the opposite side of the said 1st side. An adhesive is provided between the first side and the frame, and a gap is provided between the second side and the frame.

Further, the electronic device according to one embodiment includes a support body having a first surface and a second surface located on the opposite side of the first surface, and a flexible substrate located on the first surface and having a center on which a plurality of electrical components are formed. an area and a peripheral area surrounding the central area; and an adhesive layer, located between the first surface and the flexible substrate. The said flexible board has the 1st edge part which mounts a circuit board, and the side located on the opposite side of the said 1st edge part. The said adhesive layer has the 1st member located in the said 1st edge part side, and the 2nd member located in the said side side. The Young's modulus of the second member is smaller than the Young's modulus of the first member, and the formation region of the first member is smaller than the formation region of the second member.

According to the above configuration, it is possible to provide an electronic device having excellent reliability even when it is bent.

Description of drawings

FIG. 1 is a schematic perspective view of the electronic device according to the first embodiment.

FIG. 2 is a schematic cross-sectional view of a laminated body in which the neutralization surface is separated during application.

FIG. 3 is a schematic enlarged view of a portion A of the laminate shown in FIG. 2 .

FIG. 4 is a schematic enlarged view of a portion A of the laminate shown in FIG. 2 .

5 is a schematic exploded perspective view of the electronic device according to the first embodiment.

6 is a schematic perspective view of the electronic device according to the first embodiment in an assembled state.

7 is a schematic plan view of the electronic device according to the first embodiment in an assembled state.

FIG. 8 shows an example of a bonding portion between the cover member and the frame.

FIG. 9 shows another example of the bonding portion between the cover member and the frame.

FIG. 10 is a schematic cross-sectional view taken along line BB of the electronic device shown in FIG. 7 .

FIG. 11 is a schematic enlarged view of a portion C of the electronic device shown in FIG. 10 .

12 is a schematic enlarged cross-sectional view of an electronic device according to a second embodiment.

FIG. 13 is a schematic diagram of a second transmissive portion of the flexible substrate shown in FIG. 12 .

FIG. 14 is a schematic diagram showing an example of the adhesive material of the electronic device shown in FIG. 12 .

FIG. 15 is a schematic view showing another example of the adhesive material of the electronic device shown in FIG. 12 .

FIG. 16 is a schematic view showing still another example of the adhesive material of the electronic device shown in FIG. 12 .

17 is a schematic cross-sectional view of an electronic device according to a third embodiment.

18 is a schematic plan view of an electronic device according to a third embodiment.

19 is a schematic plan view of an electronic device according to a third embodiment.

20 is a schematic plan view of an electronic device according to a third embodiment.

21 is a schematic cross-sectional view of an electronic device according to a fourth embodiment.

Detailed ways

Several embodiments are described with reference to the drawings.

In addition, the disclosure is merely an example, and those skilled in the art can easily conceive of suitable changes while maintaining the gist of the invention, and are of course included in the scope of the invention. In addition, in order to make description clearer, although an accompanying drawing is shown typically rather than an actual situation, it is only an example, and does not limit the interpretation of this invention. In each drawing, the same or similar elements arranged consecutively may be omitted from the reference numerals. In addition, in this specification and each drawing, the same reference number is attached|subjected to the component which has the same or similar function as the component described with respect to the previous drawing, and the repeated detailed description may be abbreviate|omitted.

In this embodiment mode, a self-luminous organic electroluminescence (EL) display device is disclosed as an example of an electronic device. In addition, the disclosure is merely an example, and there are also transmissive liquid crystal display devices, light emitting diode (LED) display devices, and the like as electronic equipment. In addition, the electronic device may be various sensors such as a light sensor, a temperature sensor, and a touch sensor other than the display device.

[First Embodiment]

FIG. 1 is a schematic perspective view of the electronic device 1 according to the first embodiment. In the present embodiment, the first direction X, the second direction Y, and the third direction Z are defined as shown in the drawings. The first direction X, the second direction Y, and the third direction Z are orthogonal to each other, but may intersect at an angle other than 90°. Hereinafter, viewing the XY plane defined by the first direction X and the second direction Y is referred to as a plan view.

The electronic device 1 includes a flexible substrate 2 having a plurality of pixels PX, a cover member 3 overlapping the flexible substrate 2 , and a frame 4 overlapping the cover member 3 . The flexible substrate 2 has a multilayer structure, for example, and has a base material formed of a resin material such as polyimide. The flexible substrate 2 may include various insulating layers, conductive layers, thin film transistors (TFTs), and the like. The cover part 3 can also be referred to as a cover film or a protective film.

In the illustrated example, the shape of the flexible substrate 2 in plan view is a rectangle having a pair of long sides along the first direction X and a pair of short sides along the second direction Y. The third direction Z corresponds to the thickness direction of the flexible substrate 2 . The frame 4 is in the shape of a frame having a rectangular opening. The area enclosed by the frame 4 corresponds to the display area DA including a plurality of pixels PX.

In the present embodiment, the elements of the electronic device 1 such as the flexible substrate 2 , the cover member 3 , and the frame 4 are flexible. Thereby, the electronic device 1 can be bent in the opening direction R1 or the closing direction R2 along the bending axis AY. In addition, the electronic device 1 may be bendable in both the opening direction R1 and the closing direction R2 along the bending axis AY.

For example, when the electronic device 1 of the embodiment is used as a display device as shown in the figure, the display surface can be recognized by bending in the opening direction R1. On the other hand, when curved in the closing direction R2, the display surface is closed without being recognized from the outside.

When the foldable electronic device 1 is realized in this way, the neutral plane separation is applied to the laminate including the flexible substrate 2 and the cover member 3 . Hereinafter, with reference to FIGS. 2-4, the problem which may arise in the laminated body which neutralizes surface separation during application is demonstrated.

FIG. 2 is a schematic cross-sectional view of the laminated body 101 in which surface separation is applied during application. The laminated body 101 includes the flexible substrate 102 , the cover member 103 , the support body 105 , and the case 106 , which are stacked in the third direction Z. The case 106 has a plate-shaped first base body 106A and a second base body 106B, and a hinge 106C rotatably connecting these base bodies 106A and 106B around the bending axis AY.

Furthermore, the laminated body 101 has the adhesive layer 107 which adheres the flexible board|substrate 102 and the cover member 103, and the adhesive layer 108 which adheres the flexible board|substrate 102 and the support body 105. The adhesive layer 107 and the adhesive layer 108 are formed of, for example, a flexible adhesive material.

A soft adhesive material means that the Young's modulus of the adhesive material in the hardened state is smaller than the Young's modulus of the flexible substrate 2 or the like. As an example, it is preferable that the Young's modulus of the adhesive material in the cured state is about 1/1000 of the Young's modulus of the flexible substrate 2 . On the other hand, as a so-called hard adhesive, it is preferable that, for example, the Young's modulus of the adhesive in the hardened state is approximately the same as that of the flexible substrate 2 or the like.

The back surface of the support body 105 is bonded to the base bodies 106A and 106B. In the laminated body 101 having such a structure, when the base bodies 106A and 106B are rotated to each other, the flexible substrate 102 , the cover member 103 , and the support body 105 are bent.

FIGS. 3 and 4 are schematic enlarged views of the portion A of the laminate 101 shown in FIG. 2 , and show the end portion on the side of the first base body 106A. In the example illustrated in FIGS. 3 and 4 , one end of the flexible substrate 102 has an end portion 102 a that protrudes further than the end portion of the cover member 103 and the end portion of the support body 105 . A circuit board is attached to the end portion 102a. The end portion 102 a is bent so that a part of the end portion 102 a is positioned on the back side of the support body 105 . By bending the end portion 102a, the side on which the circuit board is mounted can be narrowed.

FIG. 3 is a state before the laminated body 101 is bent, and the positions of the flexible substrate 102 , the cover member 103 , and the support body 105 are not shifted in this state. FIG. 4 is a state in which the laminated body 101 is bent in the closing direction R2. In the laminated body 101 in which the surfaces are separated during application, the adhesive layers 107 and 108 function as stress separation layers.

When the laminated body 101 is bent, the flexible substrate 102 and the cover member 103 slide in the arrow directions, respectively, and the stress is separated between the laminations. That is, it can be said that the flexible substrate 102 and the cover member 103 can move. The term "movable" means that when the laminated body 101 is bent, the flexible substrate 102 and the cover member 103 are moved relative to the case 106, respectively, or the flexible substrate 102 and the cover member 103 are deformed.

Thereby, the flexible substrate 102 and the cover member 103 have respective neutralization surfaces. Since the neutralization surface of the laminated body 101 is divided into a plurality of parts, the compressive stress and the tensile stress acting on the flexible substrate 102, the surface of the cover member 103, and the like are reduced.

As illustrated in FIG. 4 , in the flexible substrate 102 , a deviation of the distance D1 is generated with respect to the support 105 compared to FIG. 3 . Since the flexible substrate 102 has wirings and the like, when a deviation of the distance D1 occurs during bending, a load acts on the end portion 102a and may be damaged such as cracks, which may cause disconnection of the wirings.

The electronic device 1 of the present embodiment has a structure capable of providing excellent reliability even when it is bent in this way. Hereinafter, the structure of the electronic device 1 will be described in detail.

FIG. 5 is a schematic exploded perspective view of the electronic device 1 according to the first embodiment. FIG. 6 is a schematic perspective view of the electronic device 1 according to the first embodiment in an assembled state. In addition, in these figures, each part is shown more typically than FIG. 1 in order to make description easy.

As shown in FIG. 5 , the electronic device 1 includes the above-described flexible substrate 2 , cover member 3 , and frame 4 . Furthermore, the electronic device 1 includes a support body 5 and a case 6 . The case 6 has a plate-shaped first base body 6A and a second base body 6B, and a hinge 6C that connects the base bodies 6A and 6B so as to be rotatable about the bending axis AY.

In the example of FIG. 5 , the bending axis AY is parallel to the second direction Y. However, the bending axis AY may intersect the second direction Y. In addition, the position of the bending axis AY is not particularly limited, and may be located in the vicinity of the center in the first direction X of the casing 6 as shown, for example. The structure of the hinge 6C is not particularly limited, and may include, for example, a plurality of members for connecting the base bodies 6A and 6B as illustrated, or may be a flexible film-like member connected to the base bodies 6A and 6B.

The flexible substrate 2 has a display area (center area) DA in which a plurality of pixels PX for displaying an image on the display surface are formed, and a peripheral area SA around the display area DA. The pixel PX is an example of an electrical element.

The pixel PX includes, for example, red, green, and blue sub-pixels. The sub-pixel includes a switching element, a pixel electrode connected to the switching element, a common electrode facing the pixel electrode, and an organic layer disposed between the pixel electrode and the common electrode. The organic layer emits light according to the potential difference between the pixel electrode and the common electrode.

The flexible substrate 2 includes a plurality of signal lines for supplying video signals to the switching elements of each sub-pixel, and a plurality of scanning lines for supplying scanning signals to the switching elements of each sub-pixel. The plurality of signal lines extend in the first direction X and are arranged in the second direction Y in the display area DA. The plurality of scanning lines extend in the second direction Y and are aligned in the first direction X in the display area DA.

The flexible board 2 has, in the first direction X, a first end portion 2a on which the circuit board 20 is mounted, and a side 2b located on the opposite side of the first end portion 2a. In the illustrated example, the first end portion 2a and the side 2b are parallel to the second direction Y.

The first end portion 2 a is a portion on which the circuit board 20 is mounted, and has a portion protruding from the support body 5 . In addition, in the example shown in FIG. 5, the 1st edge part 2a is the state before bending. When the electronic device 1 is assembled, a part of the first end portion 2a is bent so as to be positioned between the support body 5 and the base body 6A. The circuit board 20 is, for example, a flexible circuit board, and is connected to the flexible board 2 via a plurality of terminals formed on the first end portion 2a.

On the circuit board 20, for example, a control module or the like is mounted. The first end portion 2a can also be referred to as a mounting side. Moreover, the flexible board|substrate 2 has the curved part 2c which bends when the base bodies 6A and 6B are mutually rotated between the 1st edge part 2a and the side 2b. The bent portion 2c overlaps the hinge 6C and the bending axis AY in the third direction Z. The bent portion 2c is a portion that is bent when the electronic device 1 is bent, and is a portion that has a curvature when the electronic device 1 is bent.

The cover member 3 has a rectangular shape, is provided on the flexible substrate 2 in the third direction Z, and covers both the display area DA and the peripheral area SA. The cover member 3 has, in the first direction X, a first side 3a located on the side of the first end portion 2a of the flexible substrate 2, and a second side 3b located on the side 2b side. Furthermore, the cover member 3 has the 3rd side 3c located at one end in the 2nd direction Y and connecting the 1st side 3a and the 2nd side 3b, and the 4th side 3d located on the opposite side of the 3rd side 3c. In the example shown in the figure, the first side 3a and the second side 3b are parallel to the second direction Y, and the third side 3c and the fourth side 3d are parallel to the first direction X.

As the cover member 3, for example, a flexible and transparent film formed of a material such as polyethylene terephthalate (PET), cycloolefin polymer (COP), or polyimide can be used.

The support body 5 has a rectangular shape, is positioned below the flexible substrate 2 in the third direction Z, and overlaps the flexible substrate 2 . The support body 5 supports the flexible substrate 2 and is, for example, a support film or the like. The support body 5 has a first surface 51 facing the flexible substrate 2 and a second surface 52 located on the opposite side of the first surface 51 . The flexible board 2 is located between the first surface 51 and the cover member 3 . The laminate including the flexible substrate 2 , the cover member 3 , and the support body 5 is connected to the base bodies 6A and 6B by an appropriate method such as adhesion.

The frame 4 is provided on the cover member 3 in the third direction Z, and has a rectangular opening 40 having a size corresponding to the display area DA. Furthermore, the frame 4 has a base end portion 41 connected to the housing 6 in a state in which the electronic device 1 is assembled, and an edge portion 42 around the opening 40 . The edge portion 42 can also be referred to as an edge.

The base end portion 41 and the edge portion 42 are formed integrally, for example. The edge portion 42 is, for example, a frame shape parallel to the first direction X and the second direction Y, and covers the peripheral region SA of the cover member 3 and the flexible substrate 2 . The frame 4 is formed of a flexible material such as rubber, for example, and deforms together with the flexible substrate 2 , the cover member 3 , and the support body 5 when the base bodies 6A and 6B are rotated. The base end portion 41 is connected to the case 6 by an appropriate method such as adhesion.

In the example illustrated in FIG. 6 , the entire display area DA is flat. Hereinafter, the shape of the electronic device 1 in this state is referred to as a flat shape F0. The electronic device 1 can be deformed into the open shape F1 and the closed shape F2 by mutually rotating the base bodies 6A, 6B from the flat shape F0. The open shape F1 is a state in which the electronic device 1 is bent in the opening direction R1 shown in FIG. 1 (convex bending), and the closed shape F2 is a state in which the electronic device 1 is bent in the closing direction R2 shown in FIG. 1 ( concave curvature).

FIG. 7 is a schematic plan view of the electronic device 1 according to the first embodiment in an assembled state. The flexible substrate 2 has, in the first direction X, an area FA located between the curved portion 2c and the first end portion 2a, and an area NFA located between the curved portion 2c and the side 2b.

At least a part of the cover member 3 is bonded to the frame 4 at a portion overlapping the area FA. In the example shown in FIG. 7 , the first side 3 a of the cover member 3 is bonded to the portion overlapping the edge portion 42 of the frame 4 . That is, the first side 3a is bonded and fixed to the frame 4 . In FIG. 7 , the bonded portion between the cover member 3 and the edge portion 42 is shown with hatched lines.

On the other hand, the cover member 3 is not bonded to the frame 4 at the portion overlapping the area NFA. That is, the second side 3b is not fixed to the frame 4 . Also, the cover member 3 is not bonded to the frame 4 at the portion overlapping the bent portion 2c. It is preferable that the portion of the cover member 3 not adhered to the frame 4 (for example, the portion overlapping with the area NFA and the curved portion 2 c ) is removed from the second side of the cover member 3 in order to achieve surface separation during use when the electronic device 1 is bent. 3b is extended to the 1st side 3a side rather than the center in the 1st direction X.

The detection unit DP, which will be described later, is located in the area FA. The position of the detection unit DP in the area FA is not particularly limited, and may be located in the vicinity of the center in the second direction Y of the area FA, for example, as shown in the drawing.

8 and 9 show an example of a bonding portion between the cover member 3 and the frame 4 . In the example shown in FIGS. 8 and 9, the cover member 3 has not only the first side 3a, but also the third side 3c and the fourth side 3d from the first side 3a along the first direction X and the frame 4 respectively. The portion where the edge portion 42 is bonded. That is, it can be said that the cover member 3 is bonded to the frame 4 on three sides of the first side 3a, the third side 3c, and the fourth side 3d. In each figure, the part where the cover member 3 and the edge part 42 are adhered is shown by hatching.

In FIG. 8, a part of the part which overlaps with the area|region FA along the 1st direction X from the 1st side 3a among the 3rd side 3c and the 4th side 3d is adhesive-fixed to the edge part 42. In FIG. 9 , the entire portions of the third side 3c and the fourth side 3d overlapping with the area FA are adhered and fixed to the edge portion 42 . In each figure, the detection part DP is located in the 2nd direction Y between the part adhering to the edge part 42 among the 3rd side 3c and the 4th side 3d. The detection part DP may not be located in the 2nd direction Y between the part adhering to the edge part 42 among the 3rd side 3c and the 4th side 3d.

In the examples shown in FIGS. 7 to 9 , the entire first side 3 a is bonded to the edge portion 42 , but only a part of the first side 3 a may be bonded to the edge portion 42 . In addition, only a part of at least one of the third side 3c and the fourth side 3d may be bonded to the edge portion 42 . The portion where the first side 3a, the third side 3c, and the fourth side 3d are bonded to the edge portion 42 may be a portion that overlaps with the area FA, and is not limited to the example shown in the figure. The range in which the 1st side 3a, the 3rd side 3c, and the 4th side 3d adhere to the edge part 42 can be arbitrarily determined according to the position of the detection part DP.

FIG. 10 is a schematic cross-sectional view taken along line BB of the electronic device 1 shown in FIG. 7 . FIG. 11 is a schematic enlarged view of the C portion of the electronic device 1 shown in FIG. 10 . FIG. 11 shows the side of the first end portion 2 a of the flexible substrate 2 . In addition, illustration of the case 6 is abbreviate|omitted in FIG.10 and FIG.11. Here, the adhesion between the first side 3a and the edge portion 42 will be described, but the same applies to the adhesion of the third side 3c to the edge portion 42 and the adhesion of the fourth side 3d to the edge portion 42 .

As shown in each figure, the cover member 3 has a surface facing the flexible substrate 2 and an upper surface 3u located on the opposite side. The edge part 42 has the lower surface 42a which opposes the upper surface 3u. As shown in FIG. 11 , the first end portion 2 a of the flexible substrate 2 has a portion protruding from the first side 3 a of the cover member 3 and the end portion of the support body 5 . The first end portion 2a is bent so that the circuit board 20 is positioned on the second surface 52 side.

The flexible substrate 2 is bent toward the second surface 52 side of the support body 5 and has an overlapping area MA in which the portions of the flexible substrate 2 overlap in the third direction Z. The overlapping area MA overlaps with a portion of the flexible substrate 2 between the cover member 3 and the support body 5 . The bent portion of the flexible substrate 2 is connected to the second surface 52 by an appropriate method such as bonding.

In the example shown in FIGS. 10 and 11 , the electronic device 1 has a first adhesive layer that is positioned between the first surface 51 of the support body 5 and the flexible substrate 2 to bond the first surface 51 and the flexible substrate 2 AD11 and the second adhesive layer AD12 that is located between the flexible substrate 2 and the cover member 3 and bonds the flexible substrate 2 and the cover member 3 to each other. The 1st adhesive layer AD11 and the 2nd adhesive layer AD12 are formed by the flexible adhesive material demonstrated in FIG. 2, for example.

An adhesive member 71 is provided between the first side 3 a and the edge portion 42 , and the upper surface 3 u on the side of the first side 3 a is bonded to the lower surface 42 a of the edge portion 42 by the adhesive member 71 . On the other hand, a gap G is provided between the second side 3b and the edge portion 42, and the upper surface 3u on the side of the second side 3b is not bonded to the lower surface 42a.

The adhesive material 71 may be a resin material or the like, and the upper surface 3u and the lower surface 42a may be bonded together by providing the resin material or the like. Other members may exist between the support body 5 and the flexible substrate 2 , between the flexible substrate 2 and the cover member 3 , and between the cover member 3 and the frame 4 .

The upper surface 3u on the side of the first side 3a is bonded to the lower surface 42a, and the upper surface 3u on the side of the first side 3a is connected to the case 6 via the frame 4 . Accordingly, when the electronic device 1 is bent, the movement of the laminate including the flexible substrate 2 , the cover member 3 , and the support body 5 in the area FA is hindered, so that the first end portion 2 a of the flexible substrate 2 and the first end portion 2 a of the cover member 3 are blocked. The edge 3 a and the end of the support body 5 are difficult to shift with respect to the frame 4 .

Since the position of the laminated body is not easily displaced when the electronic device 1 is bent, the load on the first end portion 2a is suppressed, and the possibility of damage such as cracks occurring in wiring or the like included in the flexible substrate 2 is reduced. In particular, as shown in FIG. 11 , it is possible to suppress the bent portion toward the first end portion 2 a and the contact between the portion and the first adhesive layer AD11 , the second adhesive layer AD12 , and the support body 5 . The load of the bonded part.

On the other hand, since the upper surface 3u on the side of the second side 3b is not bonded to the lower surface 42a, it is possible to apply neutralization surface separation, and movement of the flexible substrate 2, the cover member 3, and the support body 5 in the area NFA when the electronic device 1 is bent. Not easily hindered. That is, when the electronic device 1 is bent, the side 2b of the flexible substrate 2, the second side 3b of the cover member 3, and the support body 5 can move relative to the frame 4. In addition, the cover member 3 is not bonded to the edge portion 42 of the frame 4 at the portion overlapping the curved portion 2c, so that deformation of the cover member 3 and the like is not easily hindered.

Furthermore, the electronic apparatus 1 is provided with the detection element DE located between the 1st end part 2a and the bending axis|shaft AY which opposes the 2nd surface 52, and is located. The detection element DE is, for example, a camera module (eg, a pinhole camera), a sensor module, or the like. The electronic apparatus 1 has the detection part DP in the position which overlaps with the detection element DE in the 3rd direction Z. In the example illustrated in FIG. 11 , the position where the detection element DE is provided does not overlap with the overlapping area MA in the third direction Z. As shown in FIG.

The detection part DP has the 1st transmission part TP1 which transmits the light (for example, visible light) which the flexible board|substrate 2 has, the 1st opening part O1 which the 1st adhesive layer AD11 has, the 2nd opening part O2 which the support body 5 has, and the 1st opening part O1 which the 1st adhesive layer AD11 has. 2. The 3rd opening part O3 which the adhesive layer AD12 has.

The first transmission portion TP1 is an area that transmits light more easily than other parts of the display area DA. For example, in the first transmissive portion TP1 , the pixels PX and the sub-pixels are reduced in size compared with other parts of the display area DA, and light transmissive regions are formed between the pixels PX and the sub-pixels. As another example, in the first transmissive portion TP1, the arrangement of the pixels PX and the sub-pixels is different from that of other parts of the display area DA, and the pixels PX and the sub-pixels are thinned out in at least one of the first direction X and the second direction Y. , a light transmission area is formed in the thinned part.

As yet another example, the pixel PX and the sub-pixels are not arranged in the first transmissive portion TP1, and a light transmissive region is formed in substantially the entirety thereof. As yet another example, the first transmissive portion TP1 may be a through hole. According to the structure exemplified above, the first transmissive portion TP1 can be formed as a transparent (high transmittance) region in the flexible substrate 2 compared to other regions.

Each of the openings O1 to O3 is, for example, a through hole. The shape of each of the openings O1 to O3 may be circular or quadrangular. The first transmissive portion TP1, the first opening portion O1, the second opening portion O2, and the third opening portion O3 are coaxial in the third direction Z, and overlap each other. It can be said that the 1st opening part O1 overlaps with the 1st transmissive part TP1, and the 2nd opening part O2 overlaps with the 1st opening part O1. With such a configuration, the detection portion DP can transmit light between the cover member 3 and the detection element DE.

Since the movement of the flexible substrate 2 , the cover member 3 , and the support body 5 is hindered in the area FA, when the electronic device 1 is bent, the first transmissive portion TP1 , the first opening portion O1 , the second opening portion O2 and the The position of the third opening O3 is not easily displaced.

When the positions of the layers constituting the detection portion DP are shifted during bending, for example, the transmission of light in the first transmission portion TP1 is blocked by the respective openings O1 to O3 . Therefore, when the electronic device 1 is bent, the area through which light can be transmitted through the detection element DE via the detection portion DP becomes smaller than before the electronic device 1 is bent. Therefore, when installing the detection element DE, it is necessary to select the detection element DE in advance according to the area of the detection portion DP when the electronic device 1 is bent.

Since the positions of the layers constituting the detection portion DP are not easily shifted, the change in the area of the detection portion DP before and after the electronic device 1 is bent is reduced. Thereby, the detection element DE of the same size as the area of the detection part DP before bending the electronic device 1 can be provided, and the installation of the detection element DE becomes easy.

According to the present embodiment described above, the electronic device 1 having excellent reliability even when bent can be obtained. That is, the upper surface 3u on the side of the first side 3a is adhered to the lower surface 42a, and unlike the comparative example shown in FIG. 2, the flexible substrate 2, the cover member 3 and the flexible substrate 2 in the area FA when the electronic device 1 is bent Since the movement of the support body 5 is hindered, the positions of the first end portion 2 a of the flexible substrate 2 , the first side 3 a of the cover member 3 , and the support body 5 are not easily displaced.

This suppresses the load applied to the first end portion 2a of the mounted circuit board 20, reduces the possibility of cracks or the like in the wiring or the like included in the flexible board 2, and improves reliability when the electronic device 1 is bent.

On the other hand, since the cover member 3 is not bonded to the frame 4 in the portion overlapping the area NFA and the bent portion 2c, neutralization can be applied when the electronic device 1 is bent. That is, the improvement of the reliability when the electronic device 1 is bent and the application of the neutralization surface separation can be achieved.

Furthermore, when the first transmissive portion TP1 is formed by reducing the pixels PX, sub-pixels, or thinning out the pixels PX and sub-pixels at the positions overlapping the detection elements DE, or by not providing the pixels PX and sub-pixels, the flexible substrate is not required to be 2 Carry out processing such as openings and incisions. Thereby, not only processing steps but also defects due to processing can be eliminated, so that the electronic device 1 with high reliability can be provided. In addition to this, the various effects described above can be obtained from the present embodiment.

In this embodiment, the upper surface 3u of the cover member 3 and the lower surface 42a of the edge portion 42 are bonded by the adhesive 71, but the proximal end portion 41 in the first direction X may be opposed to the proximal end portion. A resin material or the like is provided in a gap formed between the side surfaces of the cover member 3 and the like of 41 to be bonded. In addition, in this embodiment, although the electronic device 1 is provided with the detection element DE, it may not be provided with the detection element DE. Although the first end portion 2a of the mounted circuit board 20 is bent toward the second surface 52, the first end portion 2a may not be bent.

[Second Embodiment]

The second embodiment will be described. About the structure not mentioned in particular, the structure similar to 1st Embodiment can be applied.

FIG. 12 is a schematic enlarged cross-sectional view of the electronic device 1 according to the second embodiment. In FIG. 12 , the side of the first end portion 2 a of the flexible substrate 2 of the electronic device 1 is enlarged and shown. Like the first embodiment, the first end portion 2a is bent so that the circuit board 20 is positioned on the second surface 52 side. The point where the position where the detection element DE is provided overlaps the overlapping area MA in the third direction Z is different from the example illustrated in FIG. 11 . In addition, in FIG. 12, illustration of the case 6 is abbreviate|omitted.

The electronic device 1 includes a flexible substrate 2 , a cover member 3 , a frame 4 , and a support body 5 as in the first embodiment. Furthermore, the electronic device 1 includes a first adhesive layer AD11 for bonding the first surface 51 of the support body 5 and the flexible substrate 2, and a second adhesive layer AD12 for bonding the flexible substrate 2 and the cover member 3 together. In the portion where the area FA overlaps, the upper surface 3 u of the cover member 3 has a portion bonded to the lower surface 42 a of the edge portion 42 by the adhesive 71 . Although not shown, the cover member 3 is not bonded to the lower surface 42a of the edge portion 42 in the portion overlapping the area NFA.

The electronic device 1 further includes an adhesive 72 . The bent portion of the first end portion 2 a of the flexible substrate 2 is bonded to the second surface 52 of the support body 5 by the adhesive 72 in the overlapping region MA. The adhesive member 72 is, for example, a pressure sensitive adhesive (Pressure Sensitive Adhensive (PSA)). The adhesive 72 can be similarly applied to the first embodiment.

Since the position where the detection element DE is provided overlaps with the overlapping area MA in the third direction Z, the detection portion DP also overlaps with the overlapping area MA in the third direction Z. As shown in FIG. The detection part DP has the 1st transmission part TP1, the 1st opening part O1, the 2nd opening part O2, and the 3rd opening part O3, and also has the 2nd transmission part which transmits the light which the folded part of the 1st end part 2a has. TP2. The first transmissive part TP1 and the second transmissive part TP2 are provided in the overlapping area MA of the flexible substrate 2 . The structure described in the first embodiment can be applied to the first transmissive portion TP1. Each of the openings O1 to O3 is, for example, a through hole.

FIG. 13 is a schematic diagram of the second transmission portion TP2 of the flexible substrate 2 shown in FIG. 12 . In the second transmissive portion TP2, as shown in FIG. 13, the wiring W such as the signal line included in the flexible substrate 2 bypasses the portion overlapping the detection portion DP (second transmissive portion TP2). That is, the wiring W includes a portion extending in a straight line and a portion curved along the shape of the detection portion DP (second transmissive portion TP2 ). Thereby, the 2nd transmissive part TP2 can be formed as a transparent (high transmittance) area|region in the flexible board|substrate 2 similarly to 1st transmissive part TP1 compared with another area|region.

When the detection part DP is provided in the overlap area|region MA, each opening part O1-O3 is filled with the filler LM. As the filler LM, there is, for example, an optically clear resin (Optical Clear Resin (OCR)). The filler LM may be filled in all of the openings O1 to O3, or may be filled only in a part of the openings O1 to O3.

When the detection part DP is provided in the overlapping area MA, the thickness (film thickness) in the third direction Z of the detection part DP tends to change due to the influence of returning to the original shape when the electronic device 1 is bent. By filling each of the openings O1 to O3 with the filler LM, this influence can be suppressed and the thickness variation in the third direction Z of the detection portion DP can be reduced. In addition, when the 1st transmissive part TP1 is a through-hole, you may fill the 1st transmissive part TP1 with the filler LM. The filler LM can be similarly applied to the first embodiment. Instead of the filler LM, an optical element such as a lens module may be embedded.

Next, the relationship between the detection part DP (filler LM) and the adhesive material 72 will be described. 14 to 16 are schematic views showing examples of the adhesive material 72 of the electronic device 1 shown in FIG. 12 . 14 to 16 show the relationship between the detection part DP (filler LM) and the adhesive material 72 in plan views. As shown in each figure, the detection part DP is provided in the position which does not overlap with the adhesive material 72 in the 3rd direction Z, and the adhesive material 72 does not overlap with the optical axis of the detection element DE.

In FIG. 14, the adhesive material 72 is provided in the position which does not overlap the detection part DP in the 2nd direction Y. As shown in FIG. In FIGS. 15 and 16 , the adhesive 72 is provided at a position overlapping the detection portion DP in the second direction Y. As shown in FIG. In FIG. 15, the adhesive material 72 overlaps with the detection part DP in the whole 1st direction X. As shown in FIG. In FIG. 16, the adhesive material 72 overlaps with the detection part DP in a part of 1st direction X.

As shown in FIGS. 15 and 16 , the adhesive material 72 has a notch portion N1 . The notch part N1 is provided in the position which overlaps with the detection part DP in the 3rd direction Z. Therefore, even when the adhesive material 72 is provided at a position overlapping the detection portion DP in the second direction Y, the adhesive material 72 is also less likely to hinder the transmission of light to the detection element DE.

The position and shape of the notch portion N1 are not limited to the illustrated example, and can be appropriately changed in relation to the detection portion DP. For example, in the example shown in FIGS. 14 and 16 , the positions of the adhesive 72 and the detection portion DP may be reversed in the first direction X.

With the structure of the electronic device 1 of the present embodiment, the electronic device 1 having excellent reliability even when bent in the same manner as in the first embodiment can be obtained. In addition, even when the detection element DE is provided at a position overlapping with the overlapping area MA as in the present embodiment, the flexible substrate 2 is provided with the first transmissive portion TP1 and the second transmissive portion TP2, so that the detection element DE can sense the Not easily hindered.

Furthermore, when the wiring W bypasses the position overlapping the detection element DE to form the second transmissive portion TP2, similarly to the first transmissive portion TP1, it is not necessary to process the flexible substrate 2, such as a hole, a notch, and the like, and the processing can be reduced. Process to exclude defects caused by processing. Moreover, when the detection part DP is provided in the overlapping area MA, the thickness variation in the third direction Z of the detection part DP can be reduced by filling the filler LM in each of the openings O1 to O3.

[Third Embodiment]

The third embodiment will be described. About the structure not mentioned in particular, the structure similar to each embodiment mentioned above can be applied.

FIG. 17 is a schematic cross-sectional view of the electronic device 1 according to the third embodiment. The electronic device 1 includes a flexible substrate 2 , a cover member 3 , and a support body 5 as in the above-described embodiment. The electronic device 1 includes the frame 4 and the casing 6 described in the first embodiment, but the illustration is omitted here.

The flexible substrate 2 has an area FA located between the curved portion 2c and the first end portion 2a in the first direction X, and an area NFA located between the curved portion 2c and the side 2b. As shown in FIG. 17 , the first end portion 2 a of the flexible substrate 2 has a portion protruding from the first side 3 a of the cover member 3 and the end portion of the support body 5 . The first end portion 2a is bent so that the circuit board 20 is positioned on the second surface 52 side. The flexible substrate 2 is bent toward the second surface 52 side of the support body 5 and has an overlapping area MA in which the portions of the flexible substrate 2 overlap in the third direction Z. The overlapping area MA overlaps with a portion of the flexible substrate 2 between the cover member 3 and the support body 5 .

The bent portion of the flexible substrate 2 is connected to the second surface 52 by an appropriate method such as bonding, and may be bonded by the adhesive 72 described in FIG. 12 . In addition, it is preferable that the cover member 3 is not bonded to the frame 4 (not shown).

The electronic device 1 includes a first adhesive layer AD11 for bonding the first surface 51 of the support body 5 and the flexible substrate 2 and a second adhesive layer AD12 for bonding the flexible substrate 2 and the cover member 3 together. Furthermore, the 1st adhesive layer AD11 has the 1st member A1 and the 2nd member A2 whose Young's modulus is smaller than the Young's modulus of the 1st member A1 in a hardened state. For example, regarding the boundary between the first member A1 and the second member A2, the Young's modulus in the hardened state gradually decreases from the first member A1 to the second member A2. The point that the 1st adhesive layer AD11 has the 1st member A1 and the 2nd member A2 differs mainly from each said embodiment.

The 2nd member A2 which the 1st adhesive layer AD11 has, and the 2nd adhesive layer AD12 are formed by the flexible adhesive material demonstrated in FIG. 2, for example. The first member A1 is formed of, for example, OCR, Optical Clear Adhesive (OCA), or the like, and is an adhesive harder than the above-mentioned soft adhesive.

The 1st member A1 is located in the 1st edge part 2a side, and adheres to the support body 5 at least a part of the 1st edge part 2a of the flexible board 2. The second member A2 is located on the side 2b side, and bonds the side 2b and the support body 5 to each other. In order to achieve surface separation during application when the electronic device 1 is bent, the region where the second member A2 is formed (formation region) preferably extends from the side 2b side of the flexible substrate 2 to the first end portion 2a side in the first direction X rather than the center . The formation area of the first member A1 is preferably smaller than the formation area of the second member A2.

The first end portion 2a of the flexible substrate 2 is bonded to the support body 5 via the first member A1, so that when the electronic device 1 is bent, the movement of the laminate including the flexible substrate 2, the cover member 3, and the support body 5 in the area FA is prevented. hinder. Thereby, the 1st edge part 2a, the 1st side 3a of the cover member 3, and the support body 5 are hard to be displaced. It can be said that the 1st edge part 2a is connected to the housing|casing 6 which is not shown in figure via the support body 5 by the 1st member A1.

Since the position of the laminated body in the area FA is not easily displaced when the electronic device 1 is bent, the load on the first end portion 2a is suppressed, and the possibility of breakage such as cracks in the wiring or the like included in the flexible substrate 2 is reduced.

On the other hand, the side 2b of the flexible substrate 2 is bonded to the support body 5 via the second member A2. Therefore, when the electronic device 1 is bent, the movement of the flexible substrate 2 , the cover member 3 , and the support body 5 in the area NFA is less likely to be hindered.

When the electronic device 1 is bent, the side 2b, the second side 3b of the cover member 3, and the support body 5 can move in the area NFA. Since the curved portion 2c of the flexible substrate 2 is bonded to the support body 5 by the second member A2, deformation of the curved portion 2c, the cover member 3 and the like is not easily hindered.

The electronic device 1 is provided with the detection element DE which opposes the 2nd surface 52, and is located between the 1st end part 2a and the bending axis|shaft AY. In the example shown in FIG. 17, the position where the detection element DE is provided does not overlap with the overlapping area MA in the third direction Z. As shown in FIG.

The electronic apparatus 1 has the detection part DP in the position which overlaps with the detection element DE in the 3rd direction Z. As shown in FIG. The detection part DP has the 1st transmission part TP1 which transmits the light which the flexible board|substrate 2 has, the 1st opening part O1 which the 1st adhesive layer AD11 has, the 2nd opening part O2 which the support body 5 has, and the 2nd adhesive layer AD12 has the third opening O3.

The first transmissive portion TP1, the first opening portion O1, the second opening portion O2, and the third opening portion O3 are coaxial in the third direction Z, and overlap each other. The structure described in the first embodiment can be applied to the first transmissive portion TP1. Each of the openings O1 to O3 is, for example, a through hole. In addition, the detection part DP may be filled with the filler LM described in the second embodiment.

18 to 20 are schematic plan views of the electronic device 1 according to the third embodiment. In FIGS. 18-20, the formation area of the 1st member A1 and the formation area of the 2nd member A2 in the 1st adhesive layer AD11 are illustrated.

In the example shown in FIG. 18 , the first member A1 is formed in the first direction X from the first end portion 2a in the range including the detection portion DP (first opening portion O1 ) and the support body 5 bonded thereto. In the example shown in FIG. 19 , the first member A1 is formed from the first end portion 2a in the range where the range that does not overlap the detection portion DP is bonded to the support body 5 and the detection portion DP (first opening O1 ) around. In this case, it can also be said that the first member A1 is formed so as to surround the second opening O2 of the support body 5 . Moreover, the 1st member A1 does not overlap with the detection part DP. The first opening O1 is surrounded by the first member A1, so that the positions of the flexible substrate 2 and the support body 5 are not easily displaced in the vicinity of the first opening O1 when the electronic device 1 is bent.

In the example shown in FIG. 20, the electronic device 1 does not have the detection part DP, and the 1st member A1 is formed in the range which adheres only the vicinity of the 1st end part 2a to the support body 5. In the example shown in FIGS. 18-20, the formation area of the 1st member A1 is smaller than the formation area of the 2nd member A2. The formation region of the first member A1 may be a range overlapping with the region FA in the third direction Z, and the first member A1 may bond the entire region FA to the support body 5 . The formation region of the first member A1 can be arbitrarily determined according to the position of the detection element DE. In addition, the first member A1 may not be formed around the detection portion DP.

With the configuration of the electronic device 1 of the present embodiment, the electronic device 1 having excellent reliability even when bent in the same manner as in the above-described embodiment can be obtained. In addition, the same effects as those of the above-described embodiments can be obtained. By bonding the first end portion 2a to the first surface 51 of the support body 5 through the first member A1 as in the present embodiment, the positions of the flexible substrate 2 and the support body 5 when the electronic device 1 is bent can be further suppressed. offset.

Furthermore, since the 1st opening O1 which the detection part DP has is surrounded by the 1st member A1, the position of each layer which comprises the detection part DP is less likely to shift. Moreover, by making the formation area of the 1st member A1 smaller than the formation area of the 2nd member A2, the improvement of the reliability at the time of bending of the electronic device 1 and the application of neutralization surface separation can be compatible.

[4th Embodiment]

The fourth embodiment will be described. About the structure not mentioned in particular, the structure similar to each embodiment mentioned above can be applied.

FIG. 21 is a schematic cross-sectional view of the electronic device 1 according to the fourth embodiment. The point in which the position where the detection element DE is provided overlaps with the overlapping area MA in the third direction Z is different from the example illustrated in FIG. 17 .

The electronic device 1 includes the flexible substrate 2 , the cover member 3 , and the support body 5 as in the above-described embodiment. The electronic device 1 includes the frame 4 and the casing 6 described in the first embodiment, but the illustration is omitted here.

The electronic device 1 includes a first adhesive layer AD11 that bonds the first surface 51 of the support body 5 and the flexible substrate 2 and a second adhesive layer AD12 that bonds the flexible substrate 2 and the cover member 3 to each other. Furthermore, as in the third embodiment, the first adhesive layer AD11 includes a first member A1 and a second member A2 having a Young's modulus smaller than that of the first member A1 in a cured state.

The electronic device 1 further includes the adhesive material 72 described in the second embodiment. The bent portion of the first end portion 2a of the flexible substrate 2 is bonded to the second surface 52 of the support body 5 by the adhesive 72 in the overlapping region MA.

The detection element DE and the detection portion DP overlap with the overlapping area MA in the third direction Z. The detection part DP has the 1st transmission part TP1, the 1st opening part O1, the 2nd opening part O2, and the 3rd opening part O3, and also has the 2nd transmission part TP2 which transmits the light which the folded part of the 1st end part 2a has. . The first transmissive part TP1 and the second transmissive part TP2 are provided in the overlapping area MA of the flexible substrate 2 .

The structures described in the first and second embodiments can be applied to the first transmissive portion TP1 and the second transmissive portion TP2. In addition, although the filler LM demonstrated in 2nd Embodiment is filled with each opening part O1-O3, the filler LM may not be filled. Further, as described in the second embodiment, the detection portion DP is provided in the third direction Z at a position that does not overlap with the adhesive 72 .

For example, the adhesive member 72 is provided at a position not overlapping the detection portion DP in the second direction Y, or the adhesive member 72 has a notch portion N1, thereby preventing the adhesive member 72 from hindering the light transmission of the detection element DE.

With the structure of the electronic device 1 of the present embodiment, it is possible to obtain the electronic device 1 having excellent reliability even when it is bent like the above-described embodiment. In addition, the same effects as those of the above-described embodiments can be obtained. Even when the detection element DE is provided at a position overlapping the overlapping area MA as in the present embodiment, the first end 2a of the flexible substrate 2 can be adhered to the first surface 51 of the support body 5 by the first member A1 Next, the thickness variation in the third direction Z of the detection portion DP is reduced.

All electronic devices that can be implemented by those skilled in the art by appropriately changing designs based on the electronic devices described above as embodiments of the present invention belong to the scope of the present invention as long as they include the gist of the present invention.

An organic EL display device is shown as an example of the electronic device 1, but the structures disclosed in the above-described embodiments can also be applied to a display device including a liquid crystal display element as an electric element, a pixel PX as a light emitting diode display element, or the like. In addition, the configuration disclosed in each of the above-described embodiments can also be applied to an electronic device including various sensors such as an optical sensor, a temperature sensor, and a touch sensor as electrical elements.

Within the scope of the idea of the present invention, various modifications can be conceived by those skilled in the art, and these modifications should also be understood as belonging to the scope of the present invention. For example, those skilled in the art can appropriately add, delete, or change the design of the above-described embodiment, or add, omit, or change a process, and include those obtained as long as they have the gist of the present invention. within the scope of the present invention.

In addition, about other functions and effects brought about by the aspects described in the above-mentioned embodiments, those that are clear from the description of this specification or can be appropriately conceived by those skilled in the art should be understood to be brought about by the present invention. .

Claims (7)

1. An electronic device, characterized in that, have: a flexible substrate having a central area forming a plurality of electrical components and a peripheral area surrounding the central area; a cover member provided on the above-mentioned flexible substrate; and a frame, arranged on the above-mentioned cover member, covering the above-mentioned peripheral area; The flexible substrate has a first end portion on which the circuit substrate is mounted; The cover member has a first side located on the side of the first end portion and a second side located on a side opposite to the first side; An adhesive member is arranged between the first side and the frame; A gap is provided between the second side and the frame. 2. The electronic device of claim 1, wherein It bends along the bending axis parallel to the said 1st side and the said 2nd side. 3. electronic equipment as claimed in claim 2, is characterized in that, The cover member has a third side connecting the first side and the second side, and a fourth side located on the opposite side of the third side; Parts of the third side and the fourth side located between the first side and the bending axis are bonded and fixed to the frame. 4. The electronic device of claim 1, wherein, Also includes a support body having a first surface and a second surface located on the opposite side of the first surface; The flexible board is positioned between the first surface and the cover member, and the circuit board is positioned on the second surface side by being bent at the first end portion. 5. The electronic device of claim 2, wherein, further comprising a detection element located between the first end portion and the bending axis; The said flexible board|substrate has the transmissive part which transmits light in the position which overlaps with the said detection element. 6. The electronic device of claim 1, wherein, The first side is bonded and fixed to the frame. 7. The electronic device of claim 6, wherein, The second side is not fixed to the frame.

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