CN217639289U

CN217639289U - Novel impedance test probe

Info

Publication number: CN217639289U
Application number: CN202221496136.2U
Authority: CN
Inventors: 谈炯尧; 邓宝明; 邓胜中; 郭锦涛
Original assignee: Shenzhen Shannon Technology Co ltd
Current assignee: Shenzhen Shannon Technology Co ltd
Priority date: 2022-06-15
Filing date: 2022-06-15
Publication date: 2022-10-21
Anticipated expiration: 2032-06-15

Abstract

The utility model discloses a novel impedance test probe, including the PCB board that has the stratum, be provided with two mutual symmetries in the PCB board and each other not the signal line that communicates, the one end of two signal lines communicates with two first signal pads of laying at PCB board surface one end respectively, two first signal pads are connected with different SMA connectors respectively, the other end of two signal lines extend to behind PCB's the other end respectively with expose out two second signal pads on PCB board surface and be connected, the common both sides of two second signal pads are provided with the first ground pad of mutual symmetry, two first ground pads all are connected with the stratum through laying a plurality of first ground holes above that, the probe has been welded respectively on second signal pad and the first ground pad. The two first ground pads of the utility model adopt coplanar grounding, so that the impedance continuity is good; the user can carry out single-ended test or difference test according to the demand, and the usage is extensive.

Description

Novel impedance test probe

Technical Field

The utility model relates to a PCB board field especially relates to a novel impedance test probe.

Background

With the rapid development of PCB technology, the requirement for impedance is higher and higher, and the demand of product companies for impedance testing of PCB bare boards produced by board factories is higher and higher. The impedance probe in the market is expensive, so the existing impedance test probe made of the PCB, the SMA head and the probe appears, and the impedance test probe has the advantage of low cost. However, the existing welding probe solution has large probe tip line coupling and discontinuous impedance, and needs improvement.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a novel impedance test probe.

In order to realize the purpose, the following technical scheme is adopted:

the utility model provides a novel impedance test probe, is including the PCB board that has the stratum, be provided with two mutual symmetries in the PCB board and each other the signal line that does not communicate, two the one end of signal line respectively with lay two first signal pads intercommunication, two of PCB board surface one end first signal pad is connected with the SMA connector of difference respectively, two the other end of signal line extends to behind the other end of PCB respectively with expose in two second signal pads on PCB board surface are connected, two the common both sides of second signal pad are provided with the first ground pad of mutual symmetry, two first ground pad all through lay a plurality of first ground holes above that with the stratum is connected, second signal pad with the probe has been welded respectively on the first ground pad.

Further, each the both sides of first signal pad symmetry respectively are provided with second ground pad, and the PCB board dorsad be provided with third ground pad on the corresponding position of the one side of first signal pad, the SMA connector with first signal pad the second ground pad with third ground pad is connected, wherein, the second ground pad the third ground pad with the stratum is connected.

Further, the surface shape of the second signal pad is consistent with the cross-sectional shape of the probe.

Further, one side of the surface of the PCB board, the first ground pad and the second signal pad is provided with a welding mark for guiding the welding position of the probe.

Further, the distance between the second signal pad and the first ground pad is 0.1-0.2 mm.

Furthermore, a plurality of second ground holes for backflow are arranged on one side of each of the two signal lines at equal intervals.

Further, the impedance of the signal line is 50 ohms.

Further, the probe is the POGO needle, when the probe is welded on the PCB board, the detection end of the probe is exposed to the outside of the PCB board.

Adopt above-mentioned scheme, the beneficial effects of the utility model are that:

a user can freely set the welding distance of the probe between the second signal bonding pad and the first ground bonding pad according to requirements, so that the probe can adapt to objects to be tested with different distances;

the two first ground pads are grounded in a coplanar manner, so that the impedance continuity is good;

a user can carry out single-ended test by adopting the SMA connector and the probe of one signal wire according to the requirement, and can also carry out differential test by adopting the SMA connectors and the probes of two signal wires, so that the application scene is wide.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a PCB board according to an embodiment of the present invention;

FIG. 3 is an enlarged schematic view of part A of FIG. 2;

fig. 4 is a schematic back structural view of a PCB board according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a probe according to an embodiment of the present invention;

fig. 6 is a cross-sectional view of a PCB board according to an embodiment of the present invention.

Wherein the figures identify the description:

1. a PCB board; 101. a circuit layer; 102. an earth formation; 2. a signal line; 3. a first signal pad; 4. an SMA connector; 5. a second signal pad; 6. a first ground pad; 7. a first ground hole; 8. a probe; 9. a second ground pad; 10. a third ground pad; 11. welding identification; 12. a second ground hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 to 6, a novel impedance testing probe includes a PCB 1 having a ground layer 102, two signal lines 2 that are symmetrical to each other and are not communicated with each other are disposed in the PCB 1, one end of each of the two signal lines 2 is respectively communicated with two first signal pads 3 disposed at one end of the surface of the PCB 1, the two first signal pads 3 are respectively connected with different SMA connectors 4, the other end of each of the two signal lines 2 extends to the other end of the PCB and is respectively connected with two second signal pads 5 exposed out of the surface of the PCB 1, first ground pads 6 that are symmetrical to each other are disposed on two common sides of the two second signal pads 5, the two first ground pads 6 are connected with the ground layer 102 through a plurality of first ground holes 7 disposed thereon, and probes 8 are respectively welded on the second signal pads 5 and the first ground pads 6.

The two sides of each first signal pad 3 are symmetrically provided with a second ground pad 9, and the corresponding position of the side of the PCB 1 opposite to the first signal pad 3 is provided with a third ground pad 10, the SMA connector 4 is connected with the first signal pad 3, the second ground pad 9 and the third ground pad 10, wherein the second ground pad 9 and the third ground pad 10 are connected with the ground layer 102. The SMA connector 4 may be of a clamping type, which has connecting pins matching with the two second ground pads 9, the third ground pad 10 and the first signal pad 3, and the connection is completed by soldering.

The surface shape of the second signal pad 5 conforms to the cross-sectional shape of the probe 8. It is possible to make the probe 8 completely cover the second signal pad 5, reduce the area of the second signal pad 8 as much as possible, and make the resistance by reducing the soldering small.

The surface of the PCB board 1, one side of the first ground pad 6 and the second signal pad 5 are provided with a soldering mark 11 for guiding a soldering position of the probe pin 8. It should be noted that, there are four soldering marks 11 on one PCB 1, as shown in fig. 3, two soldering marks 11 are disposed above two first ground pads 6 and two second signal pads 5, two of which are used for indicating the position of the probe 8 on the second signal pad 5, and the other two are used for indicating the distance between the first ground pad 6 and the second signal pad 5, that is, in design, in order to reduce the coupling of the probe 8, the distance between the first ground pad 6 and the second signal pad 5 should be set as small as possible, which may exceed the range recognizable by human eyes, so that the soldering mark 11 with obvious color is disposed, so that the user can easily distinguish the distance between the first ground pad 6 and the second signal pad 5. In addition, it is preferable that the distance between the second signal pad 5 and the first ground pad 6 is 0.1 to 0.2 mm.

A plurality of second ground holes 12 for backflow are provided at equal intervals at one side of the two signal lines 2. The second borehole 12 is connected to the earth formation 102.

The impedance of the signal line 2 is 50 ohms. It is worth explaining that the impedance of the signal line 2 is controlled to be 50 ohms, and the control principle is determined according to the line width and the height of the underlying reference layer. The line width can be calculated in particular with SI 9000 software.

The probe 8 is a POGO needle, and when the probe 8 is welded on the PCB board 1, the detection end of the probe 8 is exposed to the outside of the PCB board 1.

Description of the principle: when the test device is used, the PCB board 1 is prefabricated, a user welds the SMA connector 4 and the probe 8 to the top and the bottom of the PCB board 1 respectively according to needs, the SMA connector 4 is connected with test equipment, and the user puts the probe 8 on an object to be tested to test. According to the requirement, two probes 8 can be welded, the two probes are welded on the second signal bonding pad 5 and the first ground bonding pad 6 on the same side, and the four probes 8 can be welded to be used as a differential probe.

In addition, it is worth explaining that, as shown in fig. 6, the PCB 1 has a multilayer structure, and specifically, may have a ground layer 102 and a line layer 101, where the ground layer 102 is a common ground reference layer of the PCB 1 and is used for connecting with the first ground via 7 and the second ground via 12, so that two first ground pads 6 are grounded in a coplanar manner to reduce reactive interference on adjacent second signal pads 5, and the line layer 101 is used for disposing the signal lines 2.

a user can freely set the welding distance of the probe 8 between the second signal bonding pad 5 and the first ground bonding pad 6 according to requirements, so that the probe can adapt to objects to be tested with different distances;

the two first ground pads 6 are grounded in a coplanar manner and are close to the second signal pads 5 to form a coplanar configuration, so that the impedance is continuous;

the user can adopt SMA connector 4 and probe 8 of a signal line 2 to carry out single-ended test according to the demand, also can adopt SMA connector 4 and probe 8 of two signal lines 2 to carry out differential test, and the usage scenario is extensive.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. The utility model provides a novel impedance test probe, its characterized in that, including the PCB board that has the stratum, be provided with two mutual symmetries in the PCB board and the signal line that does not communicate each other, two the one end of signal line respectively with lay two first signal pad intercommunication, two of PCB board surface one end first signal pad is connected with different SMA connector respectively, two the other end of signal line extends to respectively with expose in behind the other end of PCB board two second signal pads on PCB board surface are connected, two the common both sides of second signal pad are provided with the first ground pad of mutual symmetry, two first ground pad all through lay a plurality of first ground holes above that with the stratum is connected, second signal pad with the probe has been welded respectively on the first ground pad.

2. The novel impedance test probe of claim 1, wherein two sides of each first signal pad are symmetrically provided with a second ground pad, and a third ground pad is arranged at a corresponding position of one surface of the PCB board opposite to the first signal pad, the SMA connector is connected with the first signal pad, the second ground pad and the third ground pad, wherein the second ground pad and the third ground pad are connected with the ground layer.

3. The novel impedance test probe of claim 1, wherein the second signal pad has a surface shape that conforms to the cross-sectional shape of the probe.

4. The novel impedance testing probe of claim 1, wherein one side of the PCB board surface, the first ground pad and the second signal pad is provided with a solder mark for directing a solder location of the probe.

5. The novel impedance test probe of claim 1, wherein the distance between the second signal pad and the first ground pad is 0.1-0.2 millimeters.

6. The novel impedance testing probe of claim 1, wherein a plurality of second ground holes for reflow are equidistantly disposed on one side of two of the signal lines.

7. The novel impedance test probe of claim 1, wherein the impedance of the signal line is 50 ohms.

8. The novel impedance testing probe of claim 1 wherein the probes are POGO pins, and wherein the sensing ends of the probes are exposed to the outside of the PCB when the probes are soldered to the PCB.