CN217628736U

CN217628736U - Wafer etching machine

Info

Publication number: CN217628736U
Application number: CN202221184064.8U
Authority: CN
Inventors: 王健
Original assignee: Wuxi Dingstoneware Electronic Engineering Co ltd
Current assignee: Wuxi Dingstoneware Electronic Engineering Co ltd
Priority date: 2022-05-17
Filing date: 2022-05-17
Publication date: 2022-10-21
Anticipated expiration: 2032-05-17

Abstract

The utility model relates to a crystal processing technology field, specific wafer etching machine that says so, including base, ventilation groove and control box, be provided with the control box on the base, the control chamber has been seted up to the inside of control box, the bottom of control box is provided with the reservoir with the control chamber intercommunication, the inside of reservoir is provided with the hydraulic stem, the bottom of hydraulic stem is provided with places the board, the symmetry is provided with two aviation baffles on the outer wall of control box, the ventilation groove with the control chamber intercommunication is seted up to the inside of aviation baffle, the inside in ventilation groove is provided with the filter plate, the control chamber is provided with the lifter plate with the intercommunication department in ventilation groove, the bottom of lifter plate is provided with the push rod. The wafer etching machine has the advantages of reasonable design, simple structure, high practicability and wide application.

Description

Wafer etching machine

Technical Field

The utility model relates to a crystal processing technology field, specific wafer etching machine that says so.

Background

The chemical component of the quartz crystal is SiO2, and the crystal belongs to oxide minerals of a trigonal system, namely low-temperature quartz, and is a mineral species which is most widely distributed in quartz group minerals. The quartz in a broad sense also includes high temperature quartz, and the production process of the quartz crystal requires an etching process in the research development and production activities of the quartz crystal.

The drive arrangement of current quartz wafer etching machine drives the corrosive rack up-and-down motion in the corrosive liquid, then takes out, but drive arrangement contacts the corrosive liquid for a long time like this and influences life, takes out the in-process at the corrosive rack simultaneously, easily with the corrosive liquid spill, can produce harmful gas at the in-process that uses simultaneously, influences staff's health, for this reason, provides a wafer etching machine.

SUMMERY OF THE UTILITY MODEL

To the problems in the prior art, the utility model provides a wafer etching machine.

The utility model provides a technical scheme that its technical problem adopted is: a wafer etching machine comprises a base, a ventilation groove and an operation box, wherein the base is provided with the operation box, an operation chamber is arranged in the operation box, the bottom of the operation box is provided with a liquid storage groove communicated with the operation chamber, a hydraulic rod is arranged in the liquid storage groove, and a placing plate is arranged at the bottom of the hydraulic rod;

the air guide plate type air conditioner is characterized in that two air guide plates are symmetrically arranged on the outer wall of the operation box, a ventilation groove communicated with the operation chamber is formed in each air guide plate, and a filter plate is arranged in each ventilation groove.

Preferably, a lifting plate is arranged at the communication position of the operation chamber and the ventilation groove, and a push rod is arranged at the bottom of the lifting plate.

Preferably, a guide rod is arranged on the top end face of the inside of the operating room, a sliding seat is movably arranged on the outer wall of the guide rod, a telescopic rod is installed at the bottom of the sliding seat, and a clamping seat is arranged at the bottom of the telescopic rod.

Preferably, one side of the operation box is provided with a transmission frame, and the transmission frame is provided with a plurality of transmission rods.

Preferably, the both ends of control box all are provided with the closing plate, the closing plate is provided with the polylith and articulates each other.

Preferably, a support is arranged inside the ventilation groove, a fan is mounted on the support, and a protective net is arranged on the outer wall of the air deflector.

The beneficial effects of the utility model are that:

1. a wafer etching machine, set up the hydraulic stem and place the board through the inside at the reservoir and mutually support to the board is placed in the drive and is removed, makes and places the inside corrosive liquid direct contact of object on the board and reservoir, promotes the device's result of use.

2. A wafer etching machine, set up the filter plate through the inside at the ventilation groove, be convenient for filter the device's of discharging air when using, avoid harmful gas to discharge to cause the influence to external environment.

Drawings

The present invention will be further described with reference to the accompanying drawings and examples.

FIG. 1 is a schematic view of the present invention;

FIG. 2 is a schematic view of the internal structure of the present invention;

fig. 3 is a schematic view of the internal structure of the air deflector of the present invention.

In the figure: 1. a base; 101. a transmission rack; 102. a transmission rod; 103. sealing plates; 104. an air deflector; 105. a protective net; 106. a support; 107. a fan; 108. filtering a plate; 109. a lifting plate; 119. a push rod; 110. a ventilation slot; 11. an operation box; 111. a guide bar; 112. a sliding seat; 113. a telescopic rod; 114. a clamping seat; 115. a hydraulic lever; 116. placing the plate; 10. an operating room; 100. a reservoir.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying fig. 1-3 and the embodiments.

Examples

The wafer etching machine comprises a base 1, a ventilation groove 110 and an operation box 11, wherein the operation box 11 is arranged on the base 1, an operation chamber 10 is arranged in the operation box 11, a liquid storage tank 100 communicated with the operation chamber 10 is arranged at the bottom of the operation box 11, a hydraulic rod 115 is arranged in the liquid storage tank 100, a placing plate 116 is arranged at the bottom of the hydraulic rod 115, and the hydraulic rod 115 and the placing plate 116 are arranged in the liquid storage tank 100 and matched with each other, so that the placing plate 116 is driven to move, objects on the placing plate 116 are in direct contact with corrosive liquid in the liquid storage tank 100, and the using effect of the device is improved;

the outer wall of the operation box 11 is symmetrically provided with two air deflectors 104, the inside of the air deflectors 104 is provided with a ventilation groove 110 communicated with the operation chamber 10, the inside of the ventilation groove 110 is provided with a filter plate 108, and the filter plate 108 is arranged inside the ventilation groove 110, so that air exhausted out of the device is conveniently filtered when the device is used, harmful gas is prevented from being exhausted, and influence on the external environment is avoided.

As can be seen from fig. 3, a lifting plate 109 is disposed at a communication position between the operation chamber 10 and the ventilation slot 110, a push rod 119 is disposed at a bottom of the lifting plate 109, the push rod 119 is connected to a driving motor (the driving motor may be, but is not limited to, a brushless motor) disposed inside the air guide plate 104, a bracket 106 is disposed inside the ventilation slot 110, a fan 107 is mounted on the bracket 106, and a protective mesh 105 is disposed on an outer wall of the air guide plate 104.

As can be seen from fig. 2, a guide rod 111 is disposed on a top end surface inside the operation chamber 10, a sliding seat 112 is movably disposed on an outer wall of the guide rod 111, an expansion rod 113 is mounted at a bottom of the sliding seat 112, a clamping seat 114 is disposed at a bottom of the expansion rod 113 (the clamping seat 114 is a mechanical arm in the prior art and is not illustrated here), and the guide rod 111 is a threaded rod and is connected to a lead screw motor (the lead screw motor may be, but is not limited to, three motors) disposed inside the operation box 11.

As can be seen from fig. 1, a transmission frame 101 is disposed on one side of the operation box 11, a plurality of transmission rods 102 are disposed on the transmission frame 101, and sealing plates 103 are disposed at two ends of the operation box 11, and the sealing plates 103 are hinged to each other.

Principle of operation

When the wafer etching machine is used, processing materials to be transmitted are transmitted to the operation box 11 through the transmission rod 102 arranged on the transmission frame 101, articles are clamped through the clamping seat 114 arranged at the bottom of the telescopic rod 113, so that the articles are placed on the placing plate 116, the hydraulic rod 115 arranged in the liquid storage tank 100 drives the placing plate 116 to move, so that the articles are in contact with corrosive liquid arranged in the liquid storage tank 100, and etching processing is performed; after the device is used, the lifting plate 109 is driven to move by the push rod 119 arranged inside the ventilation groove 110, meanwhile, air inside the operation chamber 10 is sucked out by the fan 107 arranged on the support 106, and the air is filtered by the filter plate 108, so that the harmful gas is prevented from affecting the outside.

It is apparent that those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. To the extent that such modifications and variations of the embodiments of the present invention fall within the scope of the claims and their equivalents, it is intended that the present invention also encompass such modifications and variations.

Claims

1. The utility model provides a wafer etching machine, includes base (1), ventilation groove (110) and control box (11), its characterized in that: an operation box (11) is arranged on the base (1), an operation chamber (10) is arranged in the operation box (11), a liquid storage tank (100) communicated with the operation chamber (10) is arranged at the bottom of the operation box (11), a hydraulic rod (115) is arranged in the liquid storage tank (100), and a placing plate (116) is arranged at the bottom of the hydraulic rod (115);

two air guide plates (104) are symmetrically arranged on the outer wall of the operation box (11), a ventilation groove (110) communicated with the operation chamber (10) is formed in each air guide plate (104), and a filter plate (108) is arranged in each ventilation groove (110).

2. The wafer etcher of claim 1, wherein: a lifting plate (109) is arranged at the communication position of the operation chamber (10) and the ventilation groove (110), and a push rod (119) is arranged at the bottom of the lifting plate (109).

3. The wafer etcher of claim 1, wherein: the top end face of the interior of the operation chamber (10) is provided with a guide rod (111), the outer wall of the guide rod (111) is movably provided with a sliding seat (112), the bottom of the sliding seat (112) is provided with a telescopic rod (113), and the bottom of the telescopic rod (113) is provided with a clamping seat (114).

4. The wafer etching machine of claim 1, wherein: one side of the operation box (11) is provided with a transmission frame (101), and a plurality of transmission rods (102) are arranged on the transmission frame (101).

5. The wafer etcher of claim 1, wherein: both ends of control box (11) all are provided with closing plate (103), closing plate (103) are provided with the polylith and articulated each other.

6. The wafer etcher of claim 1, wherein: a support (106) is arranged inside the ventilation groove (110), a fan (107) is mounted on the support (106), and a protective net (105) is arranged on the outer wall of the air deflector (104).