CN217597523U

CN217597523U - Crystal ingot fixing device

Info

Publication number: CN217597523U
Application number: CN202221665215.1U
Authority: CN
Inventors: 张舸
Original assignee: Xian Eswin Material Technology Co Ltd
Current assignee: Xian Eswin Material Technology Co Ltd
Priority date: 2022-06-29
Filing date: 2022-06-29
Publication date: 2022-10-18
Anticipated expiration: 2032-06-29

Abstract

The utility model discloses an ingot fixing device, which is used for a linear cutting device and comprises a bearing platform, a workpiece plate, a resin plate, a limiting block and a first screw; the workpiece plate is fixed at the top end of the bearing table and is provided with a sliding groove for receiving the resin plate; the bottom end of the resin plate is provided with a sliding block structure matched with the cross section shape of the chute, the sliding block structure is installed in the chute, the top end of the resin plate is provided with an arc-shaped groove structure matched with the appearance of the crystal ingot, the crystal ingot is bonded in the groove structure through an adhesive, the resin plate is provided with an adhesive overflow pipeline, and the adhesive overflow pipeline is used for guiding and collecting the adhesive overflowing from the groove structure; the limiting block is fixed in the sliding groove through a first screw to limit the sliding block structure, so that the sliding block structure is prevented from sliding out of the sliding groove. The device can improve the efficiency of removing the excessive glue, save the cost and reduce the energy consumption.

Description

Crystal ingot fixing device

Technical Field

The utility model relates to a cutting field of crystal especially relates to a crystal ingot fixing device.

Background

With the global development of informatization, semiconductor silicon materials are the most widely used semiconductor materials so far, and the silicon materials account for about 95% in the production and use of the whole semiconductor materials, and the processing technology of silicon wafers gradually becomes an important driving force for the development of the electronic information industry. The silicon wafer is manufactured by slicing a single crystal silicon ingot pulled by a Czochralski (Czochralski) method, which mainly comprises ingot pulling, rounding, cutting, polishing, cleaning, and the like. With the increasing diameter of silicon wafers and the decreasing feature size of integrated circuits, the requirements for the quality of wafers are increasing, and how to reduce energy consumption and save cost on the premise of ensuring the quality of wafers is becoming the focus of people's attention.

In the above process, the cutting of the ingot is an important process, and the bonding effect of the ingot directly affects the cutting quality. When bonding the crystal ingot in the prior art, firstly, an adhesive with a certain thickness is uniformly coated on the resin plate and the workpiece plate respectively, then the resin plate is bonded on the workpiece plate, and then the crystal ingot is bonded on the resin plate according to a set angle. In the subsequent process flow, in order to ensure that the ingot can smoothly enter the wire cutting machine after being bonded and fixed, a large amount of adhesive adhered between the resin plate and the workpiece plate and between the resin plate and the ingot after overflowing must be scraped completely. In the prior art, the whole gluing process completely depends on manual experience, in order to ensure the gluing effect, the glue layer is required to be uniformly coated and has a certain thickness, a large amount of adhesive overflows after extrusion and is attached to the periphery of a workpiece plate and a resin plate, the overflowing adhesive cannot be removed completely, the workpiece plate on which a crystal ingot is bonded cannot be moved into a guide rail of a wire cutting machine, and therefore the overflowing adhesive needs to be scraped, but the glue scraping process in the prior art completely depends on manual operation, once the strength is not well mastered, deviation of the bonding angle of the crystal ingot can be caused, and the quality of the cut wafer is influenced.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, an embodiment of the utility model provides a desire provides a crystal ingot fixing device, it overflows a large amount of adhesive water conservancy diversion and collection after gluing with crystal ingot and resin plate through overflowing gluey pipeline, connects resin plate and work piece board through the joint form of spout with the slider, has greatly improved the efficiency of cleaing away the excessive glue when guaranteeing that bonding effect is stable.

The technical scheme of the utility model is realized like this:

the embodiment of the utility model provides an ingot fixing device, ingot fixing device is used for the wire-electrode cutting equipment, the device includes plummer, work piece board, resin board, stopper, first screw; the workpiece plate is fixed at the top end of the bearing table and is provided with a sliding groove for receiving the resin plate; the bottom end of the resin plate is provided with a sliding block structure matched with the cross section shape of the chute, the sliding block structure is installed in the chute, the top end of the resin plate is provided with an arc-shaped groove structure matched with the appearance of the crystal ingot, the crystal ingot is bonded in the groove structure through an adhesive, the resin plate is provided with an adhesive overflow pipeline, and the adhesive overflow pipeline is used for guiding and collecting the adhesive overflowing from the groove structure; the limiting block is fixed in the sliding groove through a first screw to limit the sliding block structure, so that the sliding block structure is prevented from sliding out of the sliding groove.

The embodiment of the utility model provides a crystal ingot fixing device sets up the excessive glue pipeline that can the water conservancy diversion and collect the adhesive in position department that crystal ingot and resin sheet bonded, and the timely derivation and the cleaing away of the adhesive of being convenient for, the adhesive spills over to the both sides of work piece board after avoiding overflowing to glue, leads to the bonding angle deviation problem that causes at the frictioning in-process, and the adhesive of collecting simultaneously can also the secondary use after simple processing. Through the design of the sliding block and the sliding groove which are matched in shape, the requirements of gluing and degumming between the workpiece plate and the resin plate are eliminated, the replacement efficiency of the resin plate is improved, the service life of the workpiece plate is prolonged, the cost is saved, the energy consumption is reduced, and the efficiency of the cutting equipment is further improved.

Drawings

Fig. 1 is a schematic view of an ingot fixing device according to an embodiment of the present invention;

fig. 2 is a schematic view of a workpiece plate and a limiting block in an ingot fixing device according to an embodiment of the present invention;

fig. 3 is a front view of a resin plate in an ingot fixing device according to an embodiment of the present invention;

fig. 4 is a side view of a resin plate in an ingot fixing device according to an embodiment of the present invention.

Detailed Description

In order to illustrate embodiments of the present invention or technical solutions in the prior art more clearly, the following description will be made in conjunction with the accompanying drawings in embodiments of the present invention to describe the technical solutions in the embodiments of the present invention clearly and completely, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the existing ingot bonding and fixing process, an adhesive is uniformly coated between an ingot and a resin plate and between the resin plate and a workpiece plate to fix the ingot, glue overflowing between the ingot and the resin plate and between the resin plate and the workpiece plate needs to be caused by extrusion in order to ensure the bonding effect, then an operator manually scrapes off the overflowing adhesive to avoid influencing the movement of the workpiece plate into a wire cutting device for subsequent processes, after wire cutting, the resin plate needs to be stripped from the workpiece plate, then the resin plate and the workpiece plate are tightly bonded together through the adhesive, baking is needed for 1-1.5 hours at a high temperature of 300-350 ℃ to realize the separation of the resin plate and the workpiece plate, and the long-time degumming step limits the improvement of the cutting efficiency. Under high temperature, the adhesive for bonding resin plate and resin plate can send pungent smell, influences that operating personnel is healthy, the polluted environment, and plastic deformation can take place in the work piece board that toasts through many times high temperature simultaneously, influences the used repeatedly of work piece board.

Based on the technical scheme, the connection between the resin plate and the workpiece plate is realized through a mechanical structure, the degumming step is omitted, and meanwhile, in order to avoid the problem of the bonding angle of the crystal ingot caused by manual frictioning of an operator, the adhesive collecting device is used for collecting the adhesive overflowing when the crystal ingot is bonded with the resin plate. The inventor provides an ingot fixing device, referring to fig. 1, in an ingot fixing device 100 according to an embodiment of the present invention, the device includes a bearing table 10, a workpiece plate 20, a resin plate 30, a limiting block 40, a first screw M1, a second screw M2;

referring to fig. 2, the workpiece plate 20 is fixed to the top end of the carrier 10 by bolts or other conventional techniques, the top end of the workpiece plate 20 has a chute G for receiving the resin plate 30, the chute G has a single opening along the length direction of the workpiece plate 20, the width of the cross section of the chute G gradually increases from top to bottom along the vertical direction, preferably, the cross section of the chute G has a trapezoidal or inverted T shape, and the resin plate 30 is slid into the chute G through the opening to be received in the workpiece plate 20 to connect the resin plate 30 and the workpiece plate 20;

3-4, the resin plate 30 is used for bonding and fixing the ingot, the bottom end of the resin plate 30 is a slider structure matching the cross-sectional shape of the chute G, accordingly, the cross-sectional shape of the chute G and the cross-sectional shape of the slider structure are configured such that when the slider structure is disposed in the chute G, the resin plate 30 has zero degree of freedom in the vertical direction with respect to the workpiece plate 20, the slider structure slides through the opening into the chute G to be accommodated in the chute G, the top end of the resin plate 30 is an arc-shaped groove structure S matching the ingot shape, such that when the ingot is placed in the groove structure S, the ingot completely fits the groove structure S, the ingot is bonded to the resin plate 30 by applying an adhesive on the surface of the groove structure S, wherein the adhesive used in the embodiment of the invention is preferably an epoxy adhesive, then the ingot is pressed, the adhesive overflows the groove structure S and slides down along the sidewall of the resin plate 30, the end of the resin plate 30 is further wrapped with an adhesive guiding and collecting the overflow from the groove structure P, and the overflow line P is inclined so that the overflow line P of the overflow structure P is disposed on the sidewall P of the resin plate 30, wherein the overflow line P is inclined to be disposed along the slope of the overflow line P-P of the overflow line P, preferably, in order to make the adhesive flow better in the overflow pipe P to enhance the flow guiding effect, the surface of the overflow pipe P is coated with a hydrophobic material, wherein the hydrophobic coating may be made of one or more materials selected from polyethylene, polypropylene, polytetrafluoroethylene, polyvinyl chloride, and the like, the overflow pipe P further has a liquid collecting pipe (not shown) for collecting the adhesive, the liquid collecting pipe is disposed at the lowest position of the slope structure to collect the adhesive guided by the slope structure, for example, referring to fig. 3-4, an AB section of the overflow pipe is an inclined slope structure, wherein an a point is higher than a point B, the adhesive collected by the AB section overflow pipe flows to the overflow pipe at the B position, a BC section of the overflow pipe is an inclined slope structure, wherein the B point is higher than the point C, the adhesive guided to the BC section overflow pipe by the AB section overflow pipe flows to the overflow pipe at the C position, the liquid collecting pipe is disposed at the lowest point C position of the BC section to collect the adhesive, and correspondingly, the overflow pipe on the other side walls of the resin plate 30 have the same configuration;

referring to fig. 2, the stopper 40 is fixed in the sliding groove G by a first screw M1 to limit the slider structure, so as to prevent the slider structure from sliding out of the sliding groove G, and thus prevent the resin plate 30 from separating from the workpiece plate 20, a through hole H for a first screw M1 to pass through is formed in a side wall outside the sliding groove G, accordingly, a first threaded hole N1 for receiving the first screw M1 is formed in the stopper 40, when the stopper 40 is installed in the sliding groove G, the first threaded hole N1 corresponds to the through hole H, the first screw M1 passes through the through hole H to enter the first threaded hole N1 in a twisting manner, so as to fix the stopper 40 in the sliding groove G, prevent the slider structure from sliding out of the sliding groove G, and ensure the connection between the resin plate 30 and the workpiece plate 20, referring to fig. 2, a second threaded hole N2 for receiving the second screw M2 is further formed in the stopper 40, the second threaded hole N2 is disposed along a length direction of the sliding groove G and penetrates through the stopper 40, so that the second screw M2 passes through the second threaded hole M2 to be fixed in the sliding groove G, and the second resin plate 30, and the second threaded hole N2 is abutted against the second screw 30.

When the ingot fixing device of the above embodiment is used, firstly, an ingot bonding process is performed, a slider structure of the resin plate 30 slides into the chute G of the workpiece plate 20 to realize primary fixing of the resin plate 30 and the workpiece plate 20, the stopper 40 is installed into the chute G, the first screw M1 passes through the through hole H and is screwed into the first threaded hole N1 to fix the stopper 40 in the chute G, the second screw M2 enters the second threaded hole N2 by being screwed until the second screw M2 passes through the stopper 40 and abuts against the resin plate 30, so as to realize final fixing of the resin plate 30 and the workpiece plate 20, and an assembly of the resin plate 30 and the workpiece plate 20 is obtained; coating an adhesive in a groove structure S at the top of a resin plate 30, moving a combined part of the resin plate 30 and a workpiece plate 20 to the lower part of an ingot, slowly lowering the ingot into the groove structure S at an adjusted angle to be cut and extruding the ingot to enable the adhesive to overflow from the periphery of the groove structure S and flow into an overflow pipeline P, and enabling the overflowed adhesive to flow into a liquid collecting pipe along the overflow pipeline P to be collected for secondary use; cutting the bonded ingot; after cutting, the second screw M2 and the first screw M1 are loosened in sequence, the limiting block 40 is removed, and the resin plate 30 is separated from the workpiece plate 20.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. An ingot fixing device is used for a wire cutting device and is characterized by comprising a bearing table, a workpiece plate, a resin plate, a limiting block and a first screw;

the workpiece plate is fixed at the top end of the bearing table and is provided with a sliding groove for receiving the resin plate;

the bottom end of the resin plate is provided with a sliding block structure matched with the cross section shape of the chute, the sliding block structure is installed in the chute, the top end of the resin plate is provided with an arc-shaped groove structure matched with the appearance of the crystal ingot, the crystal ingot is bonded in the groove structure through an adhesive, the resin plate is provided with an adhesive overflow pipeline, and the adhesive overflow pipeline is used for guiding and collecting the adhesive overflowing from the groove structure;

the limiting block is fixed in the sliding groove through a first screw to limit the sliding block structure, so that the sliding block structure is prevented from sliding out of the sliding groove.

2. The apparatus of claim 1, wherein the overflow lines are wrapped around the top of the resin plate, and the overflow lines on a single sidewall of the resin plate each have a ramp structure to direct the adhesive overflowing from the groove structure.

3. The apparatus of claim 2, wherein the flash line has a liquid trap positioned at the lowest of the ramp structure to collect adhesive that overflows the trough structure.

4. The apparatus of any one of claims 2 to 3, wherein the glue overflow pipe site is coated with a hydrophobic material.

5. The apparatus of claim 1, wherein the workpiece plate sidewall has a through hole, and the stopper has a first threaded hole, and wherein when the stopper is installed in the chute, the first screw can pass through the through hole and enter the first threaded hole to secure the stopper in the chute.

6. The device of claim 5, further comprising a second screw, wherein the stopper further has a second threaded hole disposed along the length of the sliding slot, and the second screw can pass through the second threaded hole to abut against the slider structure to fix the slider structure in the sliding slot.

7. The device of claim 1, wherein the chute is trapezoidal in cross-section along the length.

8. The device of claim 1, wherein the chute is inverted T-shaped in cross-section along the length.