CN219542769U

CN219542769U - Semiconductor processing grinding equipment

Info

Publication number: CN219542769U
Application number: CN202320168911.XU
Authority: CN
Inventors: 田素利; 黄西红; 付春; 秦墨洲
Original assignee: Shanghai Jingkuang Semiconductor Technology Co ltd
Current assignee: Shanghai Jingkuang Semiconductor Technology Co ltd
Priority date: 2023-02-09
Filing date: 2023-02-09
Publication date: 2023-08-18
Anticipated expiration: 2033-02-09

Abstract

The utility model relates to the technical field of semiconductor processing, in particular to semiconductor processing grinding equipment, which comprises a workbench, wherein the upper surface of the workbench is fixedly connected with a supporting frame, and the upper end of the supporting frame is fixedly connected with a feed hopper. This semiconductor processing grinding equipment, the starter motor, the motor drives the first drive gear of output and rotates, it rotates to drive the second drive gear through meshing relation when first drive gear rotates, two opposite sector gears of orientation of first drive gear and second drive gear tip follow the rotation this moment, along with the rotation of sector gear, two opposite sector gears of upper and lower range constantly drive the rack through meshing relation and reciprocate from top to bottom, the tooth strip is with guide arm and solid fixed ring reciprocates this moment, gu fixed ring is rocked from top to bottom along the bellows, prevent abrasive material adhesion at the bellows inner wall and lead to the emergence of jam condition.

Description

Semiconductor processing grinding equipment

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to semiconductor processing grinding equipment.

Background

Semiconductors refer to materials that have electrical conductivity properties at normal temperatures that are intermediate between conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high power conversion, and the like, and semiconductor processing requires multiple processes such as ingot growth, ingot cutting and detection, grinding, slicing, and edge rounding, and after the ingot is cut, wafers are formed, and the cut surfaces of the wafers are not smooth enough, have burrs, and the like, and generally require grinding before subsequent processing.

The existing semiconductor processing grinding equipment in the market at present needs to fix the crystal bar to the rotating wheel in the grinding equipment one by one in the use process, then grinding fluid and abrasive materials are added into the grinding equipment to mix, the rotating wheel is started to drive the crystal bar to rotate, so that the crystal bar abrades the outer surface in the contact process of the grinding fluid and the abrasive materials, and the burrs are ground, but because the abrasive materials are finely crushed, adhesion and blockage are easily generated in a feeding pipeline in the process of mixing the abrasive materials with the grinding fluid and adding the grinding equipment, the grinding operation is delayed due to untimely treatment, the actual needs are not met, and the popularization and the use are inconvenient.

Disclosure of Invention

The utility model aims to provide a semiconductor processing grinding device, which solves the problems that the grinding device is easy to generate adhesion and blockage in a feeding pipeline in the process of mixing with grinding liquid and adding the grinding liquid into the grinding device due to the fact that grinding materials are finely crushed, the grinding operation is delayed when the grinding device is not timely processed, the actual needs are not met, and the popularization and the use are inconvenient. In order to achieve the above purpose, the present utility model provides the following technical solutions: the semiconductor processing and grinding equipment comprises a workbench, wherein the upper surface of the workbench is fixedly connected with a supporting frame, and the upper end of the supporting frame is fixedly connected with a feed hopper;

the outer wall fixedly connected with fixed frame of braced frame, the motor is installed to the outer wall of fixed frame, the output fixedly connected with first drive gear of motor, the outer wall meshing of first drive gear is connected with second drive gear, the equal fixedly connected with sector gear of tip of first drive gear and second drive gear, the sector gear of first drive gear tip is opposite with the sector gear orientation setting of second drive gear tip.

As an alternative to the semiconductor processing polishing apparatus of the present utility model, wherein: the feeder hopper runs through braced frame, the lower extreme fixedly connected with bellows of feeder hopper.

As an alternative to the semiconductor processing polishing apparatus of the present utility model, wherein: the lower extreme fixedly connected with grinding equipment main part of bellows, the lower extreme fixedly connected with outlet conduit of grinding equipment main part.

As an alternative to the semiconductor processing polishing apparatus of the present utility model, wherein: the inside fixedly connected with filter screen of outlet conduit, outlet conduit runs through the workstation, the motorised valve is installed to outlet conduit's lower extreme.

As an alternative to the semiconductor processing polishing apparatus of the present utility model, wherein: the outer wall of the sector gear is connected with a rack in a meshed mode, and the outer wall of the rack is connected with the inner wall of the fixed frame in a sliding mode.

As an alternative to the semiconductor processing polishing apparatus of the present utility model, wherein: the outer wall of the rack is fixedly connected with a guide rod, and the end part of the guide rod is fixedly connected with a fixing ring.

As an alternative to the semiconductor processing polishing apparatus of the present utility model, wherein: the inner wall of the fixed ring is fixedly connected with the outer wall of the corrugated hose.

As an alternative to the semiconductor processing polishing apparatus of the present utility model, wherein: the fixed ring is provided with two.

Compared with the prior art, the utility model has the beneficial effects that:

when the semiconductor processing grinding equipment is used, firstly, a crystal bar to be ground is added into the grinding equipment main body, then grinding liquid and grinding materials are mixed and then are added into a feed hopper, at the moment, a motor is started, the motor drives a first transmission gear at an output end to rotate, the first transmission gear drives a second transmission gear to rotate through a meshing relationship, at the moment, two opposite sector gears at the end parts of the first transmission gear and the second transmission gear rotate in a following manner, the two opposite sector gears which are arranged up and down continuously drive racks to reciprocate up and down through the meshing relationship along with the rotation of the sector gears, at the moment, the tooth strips drive guide rods and fixing rings to move up and down, and the fixing rings drive a corrugated hose to shake up and down, so that the occurrence of blockage caused by the adhesion of the grinding materials on the inner wall of the corrugated hose is prevented.

When the semiconductor processing grinding equipment is used, the electric valve can be started after grinding is finished, grinding fluid in the grinding equipment main body can be discharged through the water outlet pipeline when the electric valve is started, grinding materials mixed in the grinding fluid in the discharging process can be filtered and intercepted by the filter screen, and grinding can be carried out only by adding the grinding fluid when the next grinding operation is carried out, so that the grinding materials can be continuously utilized.

Drawings

FIG. 1 is a cross-sectional side view of a structure of the present utility model;

FIG. 2 is an enlarged view of the structure of FIG. 1A according to the present utility model;

FIG. 3 is a schematic elevational view of the present utility model;

fig. 4 is a schematic top view of the present utility model.

In the figure: 1. a work table; 2. a support frame; 3. a feed hopper; 4. a fixed frame; 5. a motor; 6. a first transmission gear; 7. a second transmission gear; 8. a sector gear; 9. a corrugated hose; 10. a grinding apparatus main body; 11. a water outlet pipe; 12. a filter screen; 13. an electric valve; 14. a rack; 15. a guide rod; 16. and a fixing ring.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

The embodiment aims to solve the problems that the grinding materials are finely crushed, adhesion and blockage are easily generated in a feeding pipeline in the process of mixing the grinding materials with grinding liquid and adding the grinding materials into grinding equipment, the grinding operation is delayed when the grinding materials are not timely processed, the actual needs are not met, and popularization and use are inconvenient, and referring to fig. 1-4, the semiconductor processing and grinding equipment comprises a workbench 1, wherein the upper surface of the workbench 1 is fixedly connected with a supporting frame 2, and the upper end of the supporting frame 2 is fixedly connected with a feed hopper 3;

the outer wall fixedly connected with fixed frame 4 of braced frame 2, motor 5 is installed to the outer wall of fixed frame 4, the output fixedly connected with first drive gear 6 of motor 5, the outer wall meshing of first drive gear 6 is connected with second drive gear 7, the equal fixedly connected with sector gear 8 of tip of first drive gear 6 and second drive gear 7, sector gear 8 of first drive gear 6 tip and the sector gear 8 orientation setting of second drive gear 7 tip are opposite, feeder hopper 3 runs through braced frame 2, the lower extreme fixedly connected with bellows 9 of feeder hopper 3, the outer wall meshing of sector gear 8 is connected with rack 14, the outer wall of rack 14 and the inner wall sliding connection of fixed frame 4, the outer wall fixedly connected with guide arm 15 of rack 14, the tip fixedly connected with solid fixed ring 16 of guide arm 15, the inner wall of solid fixed ring 16 and the outer wall fixedly connected with bellows 9, guy ring 16 is provided with two.

In this embodiment: when the semiconductor processing grinding equipment is used, firstly, after a crystal bar to be ground is added into the grinding equipment main body 10, grinding fluid and grinding materials are mixed and then added into the feed hopper 3, at the moment, the motor 5 is started, the motor 5 drives the first transmission gear 6 at the output end to rotate, the first transmission gear 6 drives the second transmission gear 7 to rotate through a meshing relationship when rotating, at the moment, two sector gears 8 with opposite directions at the ends of the first transmission gear 6 and the second transmission gear 7 follow rotation, the two sector gears 8 with opposite directions which are arranged up and down continuously drive the rack 14 to reciprocate up and down through the meshing relationship along with the rotation of the sector gears 8, at the moment, the rack 14 drives the guide rod 15 and the fixing ring 16 to reciprocate up and down, and the fixing ring 16 drives the corrugated hose 9 to shake up and down, so that the grinding materials are prevented from being adhered to the inner wall of the corrugated hose 9 to cause blocking.

Example 2

The embodiment aims to promote solving the problems that the grinding operation is delayed due to the fact that the grinding materials are finely crushed and are easy to adhere and block in a feeding pipeline in the process of being mixed with grinding liquid and added into grinding equipment, the actual needs are not met, popularization and use are inconvenient, the embodiment is an improvement on the basis of the embodiment 1, and particularly, referring to fig. 1 and 3, the lower end of a feed hopper 3 is fixedly connected with a corrugated hose 9, the lower end of the corrugated hose 9 is fixedly connected with a grinding equipment main body 10, the lower end of the grinding equipment main body 10 is fixedly connected with a water outlet pipeline 11, a filter screen 12 is fixedly connected in the water outlet pipeline 11, the water outlet pipeline 11 penetrates through a workbench 1, and an electric valve 13 is arranged at the lower end of the water outlet pipeline 11.

In this embodiment: when the semiconductor processing grinding device is used, after grinding is finished, the electric valve 13 can be started, grinding fluid in the grinding device main body 10 can be discharged through the water outlet pipeline 11 when the electric valve 13 is started, grinding materials mixed in the grinding fluid in the discharging process can be filtered and intercepted by the filter screen 12, and grinding can be carried out only by adding the grinding fluid when the next grinding operation is carried out, so that the grinding materials can be continuously utilized.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that it will be apparent to those skilled in the art that several modifications and variations can be made without departing from the technical principle of the present utility model, and these modifications and variations should also be regarded as the scope of the utility model.

Claims

1. Semiconductor processing grinding equipment, including workstation (1), its characterized in that: the upper surface of the workbench (1) is fixedly connected with a supporting frame (2), and the upper end of the supporting frame (2) is fixedly connected with a feed hopper (3);

the outer wall fixedly connected with fixed frame (4) of braced frame (2), motor (5) are installed to the outer wall of fixed frame (4), the output fixedly connected with first drive gear (6) of motor (5), the outer wall meshing of first drive gear (6) is connected with second drive gear (7), the equal fixedly connected with sector gear (8) of tip of first drive gear (6) and second drive gear (7), sector gear (8) of first drive gear (6) tip are opposite with sector gear (8) orientation setting of second drive gear (7) tip.

2. The semiconductor processing polishing apparatus according to claim 1, wherein: the feed hopper (3) penetrates through the supporting frame (2), and the lower end of the feed hopper (3) is fixedly connected with a corrugated hose (9).

3. A semiconductor processing polishing apparatus according to claim 2, wherein: the lower extreme fixedly connected with grinding equipment main part (10) of bellows (9), the lower extreme fixedly connected with outlet conduit (11) of grinding equipment main part (10).

4. A semiconductor processing polishing apparatus according to claim 3, wherein: the inside fixedly connected with filter screen (12) of outlet conduit (11), outlet conduit (11) run through workstation (1), electric valve (13) are installed to the lower extreme of outlet conduit (11).

5. The semiconductor processing polishing apparatus according to claim 1, wherein: the outer wall of the sector gear (8) is connected with a rack (14) in a meshed manner, and the outer wall of the rack (14) is in sliding connection with the inner wall of the fixed frame (4).

6. The semiconductor processing polishing apparatus according to claim 5, wherein: the outer wall of the rack (14) is fixedly connected with a guide rod (15), and the end part of the guide rod (15) is fixedly connected with a fixing ring (16).

7. The semiconductor processing polishing apparatus according to claim 6, wherein: the inner wall of the fixing ring (16) is fixedly connected with the outer wall of the corrugated hose (9).

8. The semiconductor processing polishing apparatus according to claim 7, wherein: the number of the fixing rings (16) is two.