CN217597499U - Semiconductor carrier band heating device - Google Patents
Semiconductor carrier band heating device Download PDFInfo
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- CN217597499U CN217597499U CN202220256155.1U CN202220256155U CN217597499U CN 217597499 U CN217597499 U CN 217597499U CN 202220256155 U CN202220256155 U CN 202220256155U CN 217597499 U CN217597499 U CN 217597499U
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- carrier band
- plate
- slide rail
- runner plate
- carrier
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Abstract
The utility model discloses a semiconductor carrier band heating device, the mounting panel comprises a mounting panel, be equipped with first slide rail on the mounting panel, first slide rail pass through the bolt with the mounting panel is connected, be equipped with first carrier band direction runner plate in the first slide rail, first carrier band direction runner plate one side is equipped with heating element, heating element one side is equipped with carrier band stamping assembly, carrier band stamping assembly one side is equipped with second slide rail and second carrier band direction runner plate, second carrier band direction runner plate top is equipped with the pneumatic conveying device, the beneficial effects of the utility model: when processing the semiconductor carrier band of different width and specification, the accessible is adjusted the carrier band and is led the runner plate and adapt to, convenient and fast, when heating the carrier band, two-sided heating makes its shaping more easily that is heated, when the shaping after, sends into cold wind fast and makes the carrier band temperature reduce moulding to can blow off and carry and remain on the carrier band dirty on the surface.
Description
Technical Field
The utility model discloses semiconductor carrier band field specifically is a semiconductor carrier band heating device.
Background
Carrier tapes are widely used as packaging materials for electronic components because they occupy less space and are suitable for automated electronic component packaging processes. Specifically, it is known that a carrier tape is formed by arranging a plurality of pocket-shaped chambers arranged equidistantly in sequence along a long axis direction on a continuously extending sheet material, and accommodating corresponding semiconductors in the chambers, and the semiconductor carrier tape needs to have higher safety and specification compared with other carrier tapes.
Disclosure of Invention
Technical problem to be solved
The to-be-solved technical problem of the utility model is: when carrying out man-hour to the carrier band of different width specifications, prior art is mostly fixed can't adjust at any time, when the carrier band heats the softening, can't make its two-sided even of being heated, still remains the high temperature on the carrier band and easily takes place deformation or remains the dirt that leaves when moulding process on the carrier band when the carrier band after moulding process.
(II) technical scheme
In order to solve the above problem, the utility model provides a following technical scheme:
the utility model provides a semiconductor carrier band heating device, includes the mounting panel, be equipped with first slide rail on the mounting panel, first slide rail pass through the bolt with the mounting panel is connected, be equipped with first carrier band direction runner plate in the first slide rail, first carrier band direction runner plate one side is equipped with heating element, heating element one side is equipped with carrier band punching press subassembly, carrier band punching press subassembly one side is equipped with second slide rail and second carrier band direction runner plate, second carrier band direction runner plate top is equipped with the air-assisted transportation device.
Further, the first slide rail and the second slide rail are identical in structure, and the first slide rail and the second slide rail are in threaded connection with the mounting plate through bolts.
Further, the first carrier tape guide runner plate is identical to the second carrier tape guide runner plate in structure, and the first carrier tape guide runner plate is L-shaped.
The first carrier tape guide runner plate comprises a fixed end and a runner end, and the first carrier tape guide runner plate passes through the fixed end and the first slide rail movably connected.
Further, a carrier tape flow channel is arranged on the inner side wall of the flow channel end.
Further, heating element is equipped with two sets ofly, and the mirror image setting is in both sides about the first carrier band direction runner plate, heating element contains hot plate, telescopic cylinder fixed plate and telescopic cylinder.
Further, the air supply device comprises a fan fixing plate and an exhaust fan.
Further, the exhaust fans are embedded in the fan fixing plate, the exhaust fans are arranged right above the second carrier tape guide flow channel plate, and the number of the exhaust fans is at least two.
(III) advantageous effects
The utility model has the advantages that:
when processing the semiconductor carrier band of different width and specification, the accessible is adjusted the carrier band and is led the runner plate and adapt to, convenient and fast, when heating the carrier band, two-sided heating makes its shaping more easily that is heated, when the shaping after, sends into cold wind fast and makes the carrier band temperature reduce moulding to can blow off and carry and remain on the carrier band dirty on the surface.
Drawings
Fig. 1 is a front view of the present invention;
FIG. 2 is a schematic view of a first carrier tape guide runner plate;
FIG. 3 is a schematic view of a heating assembly;
FIG. 4 is a schematic view of the structure of the air blowing device;
the mark in the figure is: the device comprises a mounting plate 1, a first slide rail 2, a first carrier band guide runner plate 3, a heating assembly 4, a stamping assembly 5, a second slide rail 6, a second carrier band guide runner plate 7, an air supply device 8, a fixed end 31, a flow channel end 32, a carrier band flow channel 33, a heating plate 41, a telescopic cylinder fixing plate 42, a telescopic cylinder 43, a fan fixing plate 81 and an exhaust fan 82.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Referring to fig. 1-4, a semiconductor carrier tape heating device includes a mounting plate 1, a first slide rail 2 is disposed on the mounting plate 1, the first slide rail 2 is connected to the mounting plate 1 by a bolt to achieve fixation, a first carrier tape guide runner plate 3 is disposed in the first slide rail 2, the first carrier tape guide runner plate 3 is slidably connected to the first slide rail 2, a heating assembly 4 is disposed on one side of the first carrier tape guide runner plate 3, a carrier tape stamping assembly 5 is disposed on one side of the heating assembly 4, a second slide rail 6 and a second carrier tape guide runner plate 7 are disposed on one side of the carrier tape stamping assembly 5, and an air blower 9 is disposed above the second carrier tape guide runner plate 7.
The structure of the first slide rail 2 is the same as that of the second slide rail 6, the first slide rail 2 is arranged on one side of the stamping component 5, the second slide rail 6 is arranged on the other side of the stamping component 5, the first slide rail 2 and the second slide rail 6 are connected with the mounting plate 1 through bolts in a threaded manner to achieve a fixing effect, the first carrier band guide runner plate 3 is the same as that of the second carrier band guide runner plate 7, only the first carrier band guide runner plate 3 is described here, the first carrier band guide runner plate 3 is L-shaped, the first carrier band guide runner plate 3 comprises a fixed end 31 and a runner end 32, the first carrier band guide runner plate 3 is movably connected with the first slide rail 2 through the fixed end 31, the first carrier band guide runner plate 3 comprises the fixed end 31 and the runner end 32, the wall on the inner side of the runner end 32 is provided with a carrier band runner 33, the fixed end 31 is arranged in the first slide rail 2, and can slide in first slide rail 2, drive first carrier band direction runner plate 3 with this and adjust, the carrier band that adapts to different width specifications is processed, heating element 4 is equipped with two sets ofly, the mirror image sets up both sides about first carrier band direction runner plate 3, heating element 4 contains hot plate 41, telescopic cylinder fixed plate 42 and telescopic cylinder 43, telescopic cylinder fixed plate 42 is used for fixed telescopic cylinder 43, and hot plate 41 and the telescopic end fixed connection of telescopic cylinder 43, telescopic cylinder 43's flexible drive hot plate 41 removes, pneumatic conveying device 8 contains fan fixed plate 81 and exhaust fan 82, exhaust fan 82 inlays among fan fixed plate 81, exhaust fan 81 is located directly over second carrier band direction runner plate 7, exhaust fan 82 quantity is two at least, concrete theory of operation is: the carrier band to be punched enters from the first carrier band guide runner plate 3, the two ends of the carrier band are limited by carrier band runners 33, the fixed end 31 of the first carrier band guide runner plate 3 can be adjusted according to the width of the carrier band, the fixed end 31 slides in the first slide rail 2 to drive and adjust the distance between the first carrier band guide runner plates 3 to adapt to carrier bands with different widths, after the carrier band is transmitted from the runner end 32 of the first carrier band guide runner plate 3, the carrier band is subjected to double-side heating by the heating component 4, the telescopic cylinder 43 pushes the heating plate 41 to be in contact with the carrier band to heat and soften the carrier band so as to facilitate punch forming, then the carrier band is subjected to punch forming by the punching component 5, high temperature including possible residual dirt in the punching process is still remained in the carrier band after the punch forming, the air conveying device 8 is used for blowing away the residual high temperature on the carrier band to rapidly cool the carrier band, and blowing the dirt existing on the carrier band off the carrier band, so that the punched cavity of the carrier band is kept clean.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. A semiconductor carrier tape heating device is characterized in that: including mounting panel (1), be equipped with first slide rail (2) on mounting panel (1), first slide rail (2) through the bolt with mounting panel (1) is connected, be equipped with first carrier band direction runner plate (3) in first slide rail (2), first carrier band direction runner plate (3) one side is equipped with heating element (4), heating element (4) one side is equipped with carrier band punching press subassembly (5), carrier band punching press subassembly (5) one side is equipped with second slide rail (6) and second carrier band direction runner plate (7), second carrier band direction runner plate (7) top is equipped with air conveying device (8).
2. A semiconductor tape heating apparatus according to claim 1, wherein: the first sliding rail (2) and the second sliding rail (6) are identical in structure, and the first sliding rail (2) and the second sliding rail (6) are in threaded connection with the mounting plate (1) through bolts.
3. A semiconductor tape heating apparatus according to claim 1, wherein: the first carrier band guide flow passage plate (3) and the second carrier band guide flow passage plate (7) are identical in structure, and the first carrier band guide flow passage plate (3) is L-shaped.
4. The semiconductor tape heating apparatus according to claim 1, wherein: first carrier band direction runner board (3) contain stiff end (31) and runner end (32), first carrier band direction runner board (3) are passed through stiff end (31) with first slide rail (2) swing joint.
5. The semiconductor tape heating apparatus according to claim 4, wherein: the inner side wall of the flow passage end (32) is provided with a carrier band flow passage (33).
6. A semiconductor tape heating apparatus according to claim 1, wherein: heating element (4) are equipped with two sets ofly, and the mirror image setting is in both sides about first carrier band direction runner plate (3), heating element (4) contain hot plate (41), telescopic cylinder fixed plate (42) and telescopic cylinder (43).
7. A semiconductor tape heating apparatus according to claim 1, wherein: the air supply device (8) comprises a fan fixing plate (81) and an exhaust fan (82).
8. A semiconductor tape heating apparatus according to claim 7, wherein: the exhaust fans (82) are embedded in the fan fixing plate (81), the exhaust fans (82) are arranged right above the second carrier tape guide runner plate (7), and the number of the exhaust fans (82) is at least two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220256155.1U CN217597499U (en) | 2022-02-08 | 2022-02-08 | Semiconductor carrier band heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220256155.1U CN217597499U (en) | 2022-02-08 | 2022-02-08 | Semiconductor carrier band heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217597499U true CN217597499U (en) | 2022-10-18 |
Family
ID=83562337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220256155.1U Active CN217597499U (en) | 2022-02-08 | 2022-02-08 | Semiconductor carrier band heating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217597499U (en) |
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2022
- 2022-02-08 CN CN202220256155.1U patent/CN217597499U/en active Active
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