CN217591077U

CN217591077U - Mechanical vibration type electret bone voiceprint sensor

Info

Publication number: CN217591077U
Application number: CN202220209137.8U
Authority: CN
Inventors: 裴振伟
Original assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Current assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Priority date: 2022-01-25
Filing date: 2022-01-25
Publication date: 2022-10-14
Anticipated expiration: 2032-01-25
Also published as: WO2023142866A1

Abstract

The utility model provides a mechanical vibration type electret bone voiceprint sensor, which comprises a PCB and a shell fixed on the PCB, wherein a packaging structure is formed between the shell and the PCB; and a mechanical vibration part and a polar plate are arranged in the packaging structure and are arranged in parallel to form a pickup unit. Utilize above-mentioned utility model can solve traditional electret bone vocal print sensor with high costs, product assembly yield is low, the poor problem of reliability.

Description

Mechanical vibration type electret bone voiceprint sensor

Technical Field

The utility model relates to a sensor design field, more specifically relates to a mechanical vibration formula electret bone vocal print sensor.

Background

The electret bone voiceprint sensor is a sensor which utilizes a vibration pickup unit to vibrate along with external bones, so that the distance between two polar plates of a capacitor is changed, the capacitor is changed, and a bone conduction signal is detected.

The electret bone voiceprint sensor usually comprises a vibration assembly consisting of a vibrating diaphragm and a mass block and a diaphragm capacitor filled with certain charges, wherein the vibration pickup unit is formed by the vibrating diaphragm and the mass block, external vibration information is sensed through the vibration pickup unit, and analog electric signals are output through a matching circuit at the rear end so as to express the vibration information.

The conventional vibration assembly includes a mass and a diaphragm. The vibrating diaphragm is used as an elastic material, and concentricity and glue overflow amount cannot be well controlled in the mass block mounting process, so that the consistency of the vibrating diaphragm is poor, and the assembly yield and reliability of products are reduced. Meanwhile, in order to ensure air pressure balance in the manufacturing process, the shell is generally provided with a hole with a certain size, and the product is required to be made of special materials to block the hole when in use, so that the use cost is increased, and the product is easily influenced by external sound signals. In addition, the electret bone voiceprint sensor usually has a small vibration space reserved for the vibration component during design and assembly, so that the product can generate distortion at partial frequency points.

Based on the above technical problems, an electret bone voiceprint sensor with high product assembly yield, high reliability and low manufacturing cost is needed urgently.

SUMMERY OF THE UTILITY MODEL

In view of the above problem, the utility model aims at providing a mechanical vibration formula electret bone vocal print sensor to solve traditional electret bone vocal print sensor with high costs, product assembly yield low, the poor problem of reliability.

The mechanical vibration type electret bone vocal print sensor provided in the embodiment of the utility model comprises a PCB and a shell fixed on the PCB, wherein a packaging structure is formed between the shell and the PCB; and a mechanical vibration piece and a polar plate are arranged in the packaging structure, and the mechanical vibration piece and the polar plate are arranged in parallel to form a pickup unit.

In addition, it is preferable that the mechanical oscillator includes a positioning outer ring and a vibrating piece suspended inside the positioning outer ring, and a spacer is provided between the positioning outer ring and the electrode plate.

In addition, preferably, a cantilever beam is connected to an inner wall of the positioning outer ring, a positioning inner ring adapted to the vibrating piece is connected to a side of the cantilever beam away from the positioning outer ring, and the vibrating piece is fixed inside the positioning inner ring.

In addition, the preferable structure is that two cantilever beams are arranged between the positioning outer ring and the positioning inner ring, and the included angle between the two cantilever beams is smaller than 90 degrees.

In addition, the structure is preferably that PCBA components are arranged on the PCB inside the packaging structure; and also,

and a conducting ring is connected between the positioning outer ring and the PCB, and the upper end of the conducting ring is electrically connected with the PCBA component in the packaging structure.

In addition, the preferable structure is that an insulating cavity is reserved between the conducting ring and the shell.

Further, it is preferable that the PCBA assembly includes a FET and a capacitor provided on the PCB.

In addition, it is preferable that the FET corresponds to a vertical position of the cantilever.

In addition, it is preferable that a connecting piece is provided between the pole plate and the bottom of the case.

In addition, it is preferable that the housing and the PCB form a sealing structure.

According to the technical scheme, the mechanical vibration type electret bone voiceprint sensor provided by the utility model adopts the metal mechanical vibration piece, so that the difference of the vibration pickup unit can be effectively reduced, and the consistency of product performance is greatly improved; in addition, the vibrating plate in the middle of the mechanical vibrating piece is suspended through the suspension beam arm, so that the vibrating effect of the vibrating plate can be obviously improved, and the sensitivity is improved; in addition, the shell can be a non-porous shell, so that the influence of sound on the sensor is blocked, and the sensitivity is further improved; in addition, through reasonable PCB arrangement, the influence of the FET on the vibration of the vibrating plate is avoided, the vibration range of the mechanical part is greatly improved, distortion is eliminated, and the sensitivity is obviously improved.

Drawings

Other objects and results of the invention will become more apparent and readily appreciated by reference to the following description taken in conjunction with the accompanying drawings, and as the invention becomes more fully understood. In the drawings:

fig. 1 is a front sectional view of a mechanically-vibrating electret bone voiceprint sensor according to an embodiment of the invention;

fig. 2 is a top view of a mechanical vibratory member according to an embodiment of the present invention;

wherein the reference numerals include: PCB11, shell 12, FET13, capacitor 131, mechanical vibration piece 14, positioning outer ring 141, cantilever arm 142, positioning inner ring 143, vibrating piece 144, conducting ring 15, insulating cavity 16, gasket 17, polar plate 18 and connecting piece 19.

The same reference numbers in all figures indicate similar or corresponding features or functions.

Detailed Description

For the structure of the mechanical vibration type electret bone voiceprint sensor, the detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings.

Fig. 1 shows according to the embodiment of the present invention, the main view section structure of the mechanical vibration type electret bone voiceprint sensor is shown in fig. 1, the embodiment of the present invention provides a mechanical vibration type electret bone voiceprint sensor, which comprises a PCB11 (Printed Circuit Board, and electronic component support) for welding the internal Circuit of the mechanical vibration type electret bone voiceprint sensor and a housing 12 fixed on the PCB11 and functioning as a protection component, an encapsulation structure is formed between the housing 12 and the PCB11, a mechanical vibration member 14 for sensing external vibration information and a polar plate 18 used in cooperation with the mechanical vibration member 14 are arranged inside the encapsulation structure, the mechanical vibration member 14 and the polar plate 18 are arranged in parallel to form a pickup unit for picking up external vibration signals; the mechanical vibrator 14 is electrically connected to a PCBA component (for signal amplification) inside the package structure, and converts an external vibration signal picked up by the pickup unit into an amplified electrical signal, and transmits the amplified electrical signal to an external signal processing device for signal analysis.

In addition, fig. 2 shows the overlooking structure of the mechanical vibration member 14 according to the embodiment of the present invention, as can be seen from fig. 2, the mechanical vibration member 14 includes a positioning outer ring 141 for supporting integrally and a vibrating piece 144 suspended inside the positioning outer ring 141 (usually, disposed at the central position inside the positioning outer ring 141), and a gasket 17 is disposed below the positioning outer ring 141, and the gasket 17 is clamped between the positioning outer ring 141 and the polar plate 18 to make the positioning outer ring 141 and the polar plate 18 parallel to each other, so as to form a parallel capacitor, thereby forming the pickup unit of the present invention. The distance between the mechanical vibration piece 14 and the polar plate 18 can be further increased by arranging the gasket 17, so that the phenomenon that the anode and the cathode of the electret are contacted under the action of some special external forces in practical application is avoided.

In actual use, the vibration plate 144 vibrates with an external vibration signal, so that the capacitance between the vibration plate 144 and the electrode plate 18, which forms a parallel capacitor, changes, and the external vibration signal picked up by the pickup unit is converted into an electric signal and transmitted to the PCBA assembly.

Specifically, the cantilever 142 may be connected to the inner wall of the positioning outer ring 141, the positioning inner ring 143 adapted to the vibrating reed 144 is connected to a side of the cantilever 142 away from the positioning outer ring 141, and then the vibrating reed 144 is fixed inside the positioning inner ring 143, so that the vibrating reed 144 is suspended, and the sensitivity of the vibrating reed 144 is improved.

It should be noted that, in order to ensure the stability of the vibrating reed 144 during the vibrating process, two cantilever beams 142 may be disposed between the outer positioning ring 141 and the inner positioning ring 143, so as to avoid that the whole apparatus cannot be used when one cantilever beam 142 is broken. Of course, to ensure a larger vibration amplitude of the vibration plate 144, the two cantilevers 142 need to be disposed on the same side of the positioning inner ring 143, and the included angle between the two cantilevers is smaller than 90 degrees (usually, the included angle is set to be about 30 degrees), and at this time, the side of the vibration plate 144 not connected to the cantilever 142 can vibrate freely.

Specifically, a conductive ring 15 is connected between the positioning outer ring 141 and the PCB11, and an upper end of the conductive ring 15 is electrically connected to the PCBA assembly inside the package structure. The conducting ring 15 is connected between the positioning outer ring 141 and the PCB11, so that the positioning outer ring 141 can be extruded and limited, and the positioning outer ring 141 is positioned and fixed between the conducting ring 15 and the gasket 17; and can also function as a conductor to allow electrical signals generated by the mechanical vibrator 14 to be transmitted to the PCBA assembly.

In order to prevent the housing 12 from directly contacting the conductive ring 15 and thereby absorbing the electrical signal generated by the mechanical oscillator 14, it is necessary to provide an insulating cavity 16 between the conductive ring 15 and the housing 12, and to separate the conductive ring 15 from the housing 12 by the insulating cavity 16.

Specifically, the PCBA assembly may include an FET13 (Field Effect Transistor, in the english term, a Field Effect Transistor, which is a device having a signal amplification function) for signal amplification provided on the PCB11, and a capacitor 131, a FET13 electrically connected to the FET13, the FET13 realizing amplification of an electric signal from the mechanical vibrator 14 in cooperation with the capacitor 131.

In addition, a resistor can be further arranged on the PCB11, the drain electrode of the FET13 is connected with an external power supply device through the resistor, and the signal amplification factor of the FET13 can be determined through the resistance value of the resistor in practical application.

In a preferred embodiment of the present invention, the FET13 and the cantilever 142 can be disposed on the same side, so that the positions of the two correspond to each other, and since the vibrating plate 144 mainly vibrates on the side not connected to the cantilever 142, the FET13 and the cantilever 142 are disposed on the same side, which can effectively avoid the FET13 interfering with the vibration of the vibrating plate 144, so that the vibratable range of the mechanical vibrator 14 is greatly increased, and the distortion is eliminated.

Specifically, a connecting piece 19 may be disposed between the pole plate 18 and the bottom of the housing 12 to directly electrically connect the pole plate 18 and the housing 12, and since the housing 12 is grounded, the effect of grounding the pole plate 18 can be achieved.

It should be noted that, because the vibrating reed 144 in the mechanical vibrator 14 is designed to be suspended, the vibrating reed 144 can vibrate without adding an air hole on the housing 12, and at this time, the package structure formed between the housing 12 and the PCB11 is a sealing structure, which can block the influence of external sound on the sensor.

The mechanically vibrating electret bone voiceprint sensor according to the invention is described above by way of example with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that various modifications may be made to the mechanically vibrating electret bone voiceprint sensor proposed by the present invention without departing from the teachings of the present invention. Accordingly, the scope of the present invention should be determined by the content of the appended claims.

Claims

1. A mechanical vibration type electret bone voiceprint sensor comprises a PCB and a shell fixed on the PCB, wherein a packaging structure is formed between the shell and the PCB; it is characterized in that the preparation method is characterized in that,

and a mechanical vibration part and a polar plate are arranged in the packaging structure and are arranged in parallel to form a pickup unit.

2. The mechanically vibrating electret bone voiceprint sensor of claim 1 wherein,

the mechanical vibration piece comprises a positioning outer ring and a vibration piece suspended inside the positioning outer ring, and a gasket is arranged between the positioning outer ring and the polar plate.

3. The mechanically vibrating electret bone voiceprint sensor of claim 2 wherein,

the inner wall of the positioning outer ring is connected with a cantilever beam, one side of the cantilever beam, which is far away from the positioning outer ring, is connected with a positioning inner ring matched with the vibrating piece, and the vibrating piece is fixed in the positioning inner ring.

4. The mechanically vibrating electret bone voiceprint sensor of claim 3 wherein,

two cantilever beams are arranged between the positioning outer ring and the positioning inner ring; and also,

and the included angle between the two cantilever beams is less than 90 degrees.

5. The mechanically-vibrating electret bone voiceprint sensor of claim 3,

a PCBA component is arranged on the PCB inside the packaging structure; and the number of the first and second electrodes,

the locating outer ring is connected with a conducting ring between the PCBs, and the upper end of the conducting ring is electrically connected with the PCBA component.

6. The mechanically vibrating electret bone voiceprint sensor of claim 5 wherein,

an insulating cavity is reserved between the conducting ring and the shell.

7. The mechanically vibrating electret bone voiceprint sensor of claim 5 wherein,

the PCBA assembly includes a FET and a capacitor disposed on the PCB.

8. The mechanically vibrating electret bone voiceprint sensor of claim 7 wherein,

the FET corresponds to the cantilever beam in the up-down position.

9. The mechanically vibrating electret bone voiceprint sensor of claim 2 wherein,

and a connecting sheet is arranged between the polar plate and the bottom of the shell.

10. The mechanically vibrating electret bone voiceprint sensor according to any one of claims 1 to 9,

the packaging structure formed by the shell and the PCB is a sealing structure.