CN217589334U - Module sampling assembly and battery package - Google Patents
Module sampling assembly and battery package Download PDFInfo
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- CN217589334U CN217589334U CN202221670985.5U CN202221670985U CN217589334U CN 217589334 U CN217589334 U CN 217589334U CN 202221670985 U CN202221670985 U CN 202221670985U CN 217589334 U CN217589334 U CN 217589334U
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- circuit board
- sampling assembly
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- flexible circuit
- module
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The utility model provides a module sampling assembly and battery package, module sampling assembly include flexible circuit board, and flexible circuit board includes first circuit board section and the second circuit board section of being connected rather than, and flexible circuit board is the setting of buckling in the junction of first circuit board section and second circuit board section, and second circuit board section overlaps with first circuit board section part in the direction of the first circuit board section of perpendicular to and sets up, the utility model discloses a flexible circuit board that module sampling assembly has solved module sampling assembly among the prior art receives the width restriction and the problem of wiring difficulty.
Description
Technical Field
The utility model relates to a power battery technical field particularly, relates to a module sampling assembly and battery package.
Background
Compared with the traditional pure wire harness module sampling, when the module with more battery cores is sampled, the FPC (Flexible Printed Circuit board) is widely applied due to higher plasticity, the space utilization rate of the battery pack is improved, and the energy density of the battery pack is increased to a certain extent.
However, because the requirement for the utilization rate of the space in the power battery pack is higher and higher, the current module sampling assembly (voltage and temperature sampling module) of the soft package battery core is affected by limited space and can only be arranged on the side face of the module. When the number of the battery cells is large, the FPC is difficult to wire due to the limitation of the width, the main structure only can consider a double-sided board, and the price of the double-sided board is higher by about 20% compared with that of a single-sided board, so that the cost of the module sampling assembly is increased; moreover, the FPC structure is flexible, a supporting bracket of the FPC structure is often fixed with the module in a hot riveting mode, and the installation mode is complex.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a module sampling assembly and battery pack to the flexible circuit board of the module sampling assembly among the prior art receives the width restriction and the problem of wiring difficulty.
In order to achieve the above object, according to the utility model discloses an aspect provides a module sampling assembly, including the flexible circuit board, the flexible circuit board includes first circuit board section and the second circuit board section of being connected with it, and the flexible circuit board is the setting of buckling in the junction of first circuit board section and second circuit board section, and the second circuit board section overlaps with first circuit board section part in the direction of the first circuit board section of perpendicular to and sets up.
Further, the modular sampling assembly further comprises a first guard piece disposed between the first circuit board segment and the second circuit board segment such that the first circuit board segment and the second circuit board segment are spaced apart in a direction perpendicular to the first circuit board segment.
Further, the first protection part is made of foam rubber, and the second circuit board section and the first circuit board section are bonded through the foam rubber.
Further, the first circuit board section and the second circuit board section are adhesively connected.
Further, the module sampling assembly still includes: and the first circuit board section and the second circuit board section are connected with the sampling assembly bracket.
Furthermore, a first fixing hole is formed in the first circuit board section, a second fixing hole is formed in the second circuit board section, and at least parts of the first fixing hole and the second fixing hole are arranged oppositely; the sampling assembly support is provided with a hot riveting column, and the first circuit board section and the second circuit board section are connected with the hot riveting column sequentially arranged in the second fixing hole and the first fixing hole in a penetrating mode.
Further, the sampling assembly bracket comprises a buckle which is used for being clamped with the module bracket of the module; and/or the flexible circuit board comprises a first end part and a second end part which are oppositely arranged; the sampling assembly support comprises a first baffle and a second baffle, the first baffle and the second baffle are arranged on two opposite sides of the flexible circuit board, the first baffle is used for stopping the first end portion, and the second baffle is used for stopping the second end portion.
Furthermore, a temperature acquisition element is arranged on the flexible circuit board and is positioned on one side of the flexible circuit board, which is far away from the sampling assembly bracket; the sampling assembly bracket is provided with an accommodating groove; the module sampling assembly further comprises a first reinforcing plate, the first reinforcing plate is covered on the flexible circuit board, and the first reinforcing plate and the temperature acquisition element are arranged on two opposite sides of the flexible circuit board; the first reinforcing plate is positioned in the accommodating groove; and/or a second protection piece is arranged on one side of the flexible circuit board far away from the sampling assembly bracket, and the second protection piece protrudes out of the temperature acquisition element towards the direction far away from the sampling assembly bracket.
Furthermore, the module sampling assembly also comprises a nickel sheet, the nickel sheet comprises a first connecting section, a transition connecting section and a second connecting section which are sequentially connected, and the first connecting section is connected with the first end part of the flexible circuit board; the first connecting end of the transition connecting section is connected with the first connecting section and is obliquely arranged relative to the first connecting section, and the second connecting end of the transition connecting section is connected with the second connecting section and is obliquely arranged relative to the second connecting section; the second connecting section is used for being connected with the bus bar.
Further, module sampling assembly still includes a plurality of nickel pieces, and a plurality of nickel piece intervals set up the first end at flexible circuit board, are provided with the breach on the first end between two adjacent nickel pieces.
According to the utility model discloses an on the other hand provides a battery pack, including module and module sampling assembly, module sampling assembly becomes foretell module sampling assembly, and the flexible circuit board of module sampling assembly sets up the lateral part at the module.
The utility model discloses a flexible circuit board of module sampling assembly includes first circuit board section and the second circuit board section of being connected with first circuit board section, when being insufficient to flexible circuit board components and parts wiring width, bend flexible circuit board at the junction of first circuit board section and second circuit board section, make second circuit board section overlap the setting with the at least part of first circuit board section in the direction of the first circuit board section of perpendicular to mutually, play under the prerequisite that does not increase the cost, increase flexible circuit board's wiring ability, avoid flexible circuit board because the less condition that is limited to the width restriction in battery package inner space and is difficult to the wiring to appear.
Drawings
The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
figure 1 shows a partial schematic view of a first angle of an exploded view of a modular sampling assembly according to the present invention;
fig. 2 shows a partial schematic view of a second angle of an exploded view of a modular sampling assembly according to the present invention;
fig. 3 shows a partial schematic view of a third angle of an exploded view of a modular sampling assembly according to the present invention;
fig. 4 shows an exploded view of a module sampling assembly according to the present invention.
Wherein the figures include the following reference numerals:
10. a flexible circuit board; 11. a first circuit board segment; 12. a second circuit board segment; 13. a first end portion; 14. a second end portion; 15. a notch; 16. positioning holes;
20. a sampling assembly support; 21. carrying out hot riveting on the column; 22. buckling; 23. a first baffle plate; 24. a second baffle; 25. an accommodating recess;
30. a temperature acquisition element;
40. a first reinforcing plate;
50. a nickel sheet; 51. a first connection section; 52. a second connection section; 53. a transitional connecting section;
60. a second guard;
70. a second reinforcing plate; 71. expanding the rivet; 80. and (6) inserting the plug-in.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The utility model provides a module sampling assembly please refer to fig. 1 to fig. 4, including flexible circuit board 10, flexible circuit board 10 includes first circuit board section 11 and the second circuit board section 12 of being connected with it, and flexible circuit board 10 is the setting of buckling in the junction of first circuit board section 11 and second circuit board section 12, and second circuit board section 12 overlaps the setting with first circuit board section 11 part mutually in the direction of the first circuit board section 11 of perpendicular to.
The utility model discloses a flexible circuit board 10 of module sampling assembly includes first circuit board section 11 and the second circuit board section 12 of being connected with first circuit board section 11, when being insufficient to flexible circuit board 10 components and parts wiring width, bend flexible circuit board 10 in the junction of first circuit board section 11 and second circuit board section 12, make second circuit board section 12 overlap the setting with first circuit board section 11 at least part in the direction of the first circuit board section 11 of perpendicular to mutually, play under the prerequisite that does not increase the cost, increase flexible circuit board 10's wiring ability, avoid flexible circuit board 10 to be difficult to the condition appearance of wiring because the less limited width of battery package inner space appears.
It should be noted that the second circuit board segment 12 is disposed to overlap at least a portion of the first circuit board segment 11 in a direction perpendicular to the first circuit board segment 11, that is, the second circuit board segment 12 is disposed to face at least a portion of the first circuit board segment 11 in a direction perpendicular to the first circuit board segment 11; the first circuit board segment 11 and the second circuit board segment 12 may have a gap in a direction perpendicular to the first circuit board segment 11 or may be attached to each other.
Specifically, the first circuit board segment 11 and the second circuit board segment 12 are adhesively connected. The arrangement is convenient to connect, other parts are not added, and the structure is simple.
Specifically, the modular sampling assembly further includes a first guard disposed between the first circuit board segment 11 and the second circuit board segment 12 such that the first circuit board segment 11 and the second circuit board segment 12 are spaced apart in a direction perpendicular to the first circuit board segment 11. The first protection part can play a role in buffering, and the bent part of the flexible circuit board 10 is prevented from being damaged.
Specifically, the first shielding member is plural, and the plural first shielding members are arranged at intervals between the first circuit board segment 11 and the second circuit board segment 12.
Specifically, the first protection member is a double-sided adhesive tape, and the second circuit board segment 12 and the first circuit board segment 11 are bonded by the double-sided adhesive tape; optionally, the first protection component is foam adhesive, and the second circuit board segment 12 and the first circuit board segment 11 are bonded by the foam adhesive; the foam may have a thickness of 0.5mm. This arrangement enables the first circuit board section 11 and the second circuit board section 12 to be always connected after the flexible circuit board 10 is bent.
In this embodiment, the module sampling assembly further includes: the sampling assembly support 20, the first circuit board segment 11 and the second circuit board segment 12 are all connected with the sampling assembly support 20. Such an arrangement ensures a secure fixation of the first circuit board segment 11 and the second circuit board segment 12.
Specifically, the sampling assembly support 20 is made of plastic.
Specifically, a first circuit board segment 11 is provided with a first fixing hole, a second circuit board segment 12 is provided with a second fixing hole, and at least parts of the first fixing hole and the second fixing hole are arranged oppositely; the sampling assembly bracket 20 is provided with a hot riveting column 21, and the first circuit board section 11 and the second circuit board section 12 are in hot riveting connection with the hot riveting column 21 sequentially arranged in the second fixing hole and the first fixing hole in a penetrating manner. This arrangement provides a secure connection of the first circuit board segment 11 and the second circuit board segment 12 to the sampling assembly holder 20.
Specifically, the first protection part is provided with a third fixing hole, and the third fixing hole is opposite to at least part of the first fixing hole and at least part of the second fixing hole, so that the hot riveting column 21 is also arranged in the third fixing hole in a penetrating manner.
Optionally, the first fixing hole and the second fixing hole are both strip-shaped holes. Due to the arrangement, the problem that the first circuit board section 11 and the second circuit board section 12 cannot be butted with the hot riveting columns 21 due to design errors is avoided, and the first circuit board section 11 and the second circuit board section 12 are conveniently connected with the sampling assembly support 20.
In the embodiment, the sampling assembly bracket 20 includes a clip 22, and the clip 22 is used for clipping with a module bracket of a module; and/or, the flexible circuit board 10 includes a first end portion 13 and a second end portion 14 which are oppositely arranged; the sampling assembly support 20 includes a first barrier 23 and a second barrier 24, the first barrier 23 and the second barrier 24 are disposed on opposite sides of the flexible circuit board 10, the first barrier 23 is used for stopping the first end portion 13, and the second barrier 24 is used for stopping the second end portion 14.
During specific implementation, the sampling assembly support 20 is clamped with the module support of the module through the buckle 22, so that the fixing is reliable, the installation and the disassembly are convenient, and the installation difficulty of workers is reduced.
In specific implementation, the first baffle 23 and the second baffle 24 are arranged to limit the flexible circuit board 10 in the arrangement direction of the first end portion 13 and the second end portion 14, so as to prevent the flexible circuit board 10 from moving in the direction; in addition, the first circuit board section 11 and the second circuit board section 12 are matched to be in hot riveting connection with the hot riveting columns 21, so that the flexible circuit board 10 cannot move in the X direction, the Y direction and the Z direction; two phases in the X, Y and Z directions are vertically arranged, the Z direction is a direction perpendicular to the flexible circuit board 10, and the Y direction is a direction in which the first end portion 13 and the second end portion 14 are sequentially arranged. Thus, the flexible circuit board 10 can be prevented from shaking, and the problem of insufficient soldering of the nickel plate and the bus bar can be further prevented.
In this embodiment, the flexible circuit board 10 is provided with a temperature collecting element 30, and the temperature collecting element 30 is located on a side of the flexible circuit board 10 away from the sampling assembly bracket 20. Temperature acquisition element 30 is used for gathering the cell temperature of module.
Specifically, the flexible circuit board 10 is provided with a plurality of temperature acquisition elements 30 arranged at intervals to acquire the cell temperatures of different positions of the module.
In the present embodiment, the sampling assembly holder 20 is provided with an accommodating recess 25; the module sampling assembly further comprises a first reinforcing plate 40, the first reinforcing plate 40 is covered on the flexible circuit board 10, and the first reinforcing plate 40 and the temperature acquisition element 30 are arranged on two opposite sides of the flexible circuit board 10; the first reinforcing plate 40 is positioned in the accommodating recess 25; and/or, a second protection member 60 is disposed on a side of the flexible circuit board 10 away from the sampling assembly holder 20, and the second protection member 60 is disposed to protrude from the temperature acquisition element 30 in a direction away from the sampling assembly holder 20.
In specific implementation, the first reinforcing plate 40 and the temperature acquisition element 30 are arranged oppositely in a direction perpendicular to the first circuit board section 11, and the first reinforcing plate 40 can protect the temperature acquisition element 30; the receiving recess 25 is provided to avoid interference between the first reinforcing plate 40 and the sampling assembly holder 20.
In one embodiment, the second protection member 60 protrudes from the temperature acquisition element 30 in a direction away from the sampling assembly bracket 20, so that other components can press against the second protection member 60 and the temperature acquisition element 30 and the flexible circuit board 10 when pressing against the module sampling assembly, thereby preventing the temperature acquisition element 30 and the flexible circuit board 10 from being damaged.
Specifically, the side of the flexible circuit board 10 away from the sampling assembly holder 20 is provided with a plurality of second guards 60; the second guard 60 is foam cotton.
Specifically, the receiving groove 25 is a groove of equal depth, the depth of the receiving groove 25 is 0.3mm, and the thickness of the first reinforcing plate 40 is equal to the depth of the receiving groove 25.
In this embodiment, the module sampling assembly further includes a nickel plate 50, the nickel plate 50 includes a first connection section 51, a transition connection section 53 and a second connection section 52, which are connected in sequence, the first connection section 51 is connected with the first end 13 of the flexible circuit board 10; a first connecting end of the transition connecting section 53 is connected with the first connecting section 51 and is arranged obliquely relative to the first connecting section 51, and a second connecting end of the transition connecting section 53 is connected with the second connecting section 52 and is arranged obliquely relative to the second connecting section 52; the second connecting section 52 is used for connecting to a busbar. Due to the arrangement, the first connecting section 51 and the second connecting section 52 are arranged at intervals in the direction perpendicular to the first circuit board section 11, so that the second connecting section 52 can be located on the same plane with the bus bar, the height difference between the first connecting section 51 and the bus bar is avoided, the second connecting section 52 can be conveniently welded with the bus bar, and the problem of insufficient welding of nickel sheets and the bus bar is avoided.
Wherein the nickel plate 50 is in a zigzag structure in shape.
Specifically, the first connecting section 51 is attached to a side of the flexible circuit board 10 away from the sampling assembly bracket 20.
In this embodiment, the module sampling assembly further includes a plurality of nickel sheets 50, the plurality of nickel sheets 50 are disposed at intervals at the first end portion 13 of the flexible circuit board 10, and a gap 15 is disposed on the first end portion 13 between two adjacent nickel sheets 50. When the setting of breach 15 was used for preventing the electric core inflation of module, flexible circuit board 10 received the power of X direction and tears.
In specific implementation, the temperature collecting element 30 is attached to the arched structure stamped by the nickel sheet 50 and fixed by dispensing to collect the cell temperatures of different positions of the module.
In the present embodiment, the sampling assembly support 20 is provided with a positioning protrusion, and the flexible circuit board 10 is provided with a positioning hole 16, and the positioning protrusion is inserted into the positioning hole 16. When the flexible circuit board 10 is mounted on the sampling assembly bracket 20, the flexible circuit board 10 is positioned by the positioning protrusions and the positioning holes 16, so as to reduce the mounting tolerance of the flexible circuit board 10.
In this embodiment, the module sampling assembly further includes a second reinforcing plate 70, the second reinforcing plate 70 is connected to the flexible circuit board 10, the second reinforcing plate 70 is disposed obliquely relative to the flexible circuit board 10, and the second reinforcing plate 70 is used for connecting to an end plate of the module. The second reinforcing plate 70 serves to protect and fix the insert 80.
In this embodiment, the module sampling assembly further includes a plug 80, the plug 80 is connected to the flexible circuit board 10, and the plug 80 is disposed on the second reinforcing plate 70. Wherein the insert 80 is a low pressure insert.
Specifically, the modular sampling assembly includes two inserts 80, and the number of pins of the two inserts 80 is the same.
In specific implementation, the pins of the interposer 80 are soldered to the pads of the flexible circuit board 10 by reflow soldering, and then the pins are subjected to dispensing, after the dispensing, the pins are not allowed to expose metal or have through holes.
Specifically, an FR-4 reinforcing plate with the thickness of 1.5mm is adhered on the plug-in 80; the FR-4 reinforcing plate is bonded to the second reinforcing plate 70 so that the insert 80 is connected to the second reinforcing plate 70 via the FR-4 reinforcing plate. The FR-4 stiffener serves to protect the insert 80.
Specifically, the second reinforcing plate 70 is provided with at least one expansion rivet 71, and the expansion rivet 71 is used for connecting with the end plate of the module. This can serve for simple installation.
During specific implementation, the width of the flexible circuit board 10 after being bent and overlapped is determined by the total width required by wiring, because the flexible circuit board 10 is locally widened, the temperature acquisition line width is 0.2mm, the voltage acquisition line width is 0.4mm at the bending position of the flexible circuit board 10 close to an end plate (also close to a plug-in), and the line widths of other positions of the flexible circuit board 10 are all set to be 0.5mm, so that the resistance value requirement of the sampling line inside the flexible circuit board 10 is met, and the total wiring width of the whole flexible circuit board 10 is also met.
In specific implementation, the edge of the sampling assembly bracket 20 is flush with the first end portion 13, which is convenient for welding the nickel plate and the battery core tab (i.e. the busbar).
The cost of the flexible circuit board in the module sampling assembly is reduced; the structure of the sampling assembly bracket not only well fixes the flexible circuit board, but also avoids the insufficient welding of the nickel sheet and the electric core electrode lug (also called a busbar); the installation difficulty of workers to the module sampling assembly is reduced.
The utility model also provides a battery pack, including module and module sampling assembly, wherein, module sampling assembly in the above-mentioned embodiment of module sampling assembly, the flexible circuit board 10 of module sampling assembly sets up the lateral part at the module.
Specifically, the second reinforcing plate 70 is provided at an end of the module, opposite to an end plate of the module.
From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects:
the utility model discloses a flexible circuit board 10 of module sampling assembly includes first circuit board section 11 and the second circuit board section 12 of being connected with first circuit board section 11, when being insufficient to flexible circuit board 10 components and parts wiring width, bend flexible circuit board 10 in the junction of first circuit board section 11 and second circuit board section 12, make second circuit board section 12 overlap the setting with first circuit board section 11 at least part in the direction of the first circuit board section 11 of perpendicular to mutually, play under the prerequisite that does not increase the cost, increase flexible circuit board 10's wiring ability, avoid flexible circuit board 10 to be difficult to the condition appearance of wiring because the less limited width of battery package inner space appears.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Moreover, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
For ease of description, spatially relative terms such as "over 8230 \ 8230;,"' over 8230;, \8230; upper surface "," above ", etc. may be used herein to describe the spatial relationship of one device or feature to another device or feature as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary terms "at 8230; \8230; 'above" may include both orientations "at 8230; \8230;' above 8230; 'at 8230;' below 8230;" above ". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (11)
1. The utility model provides a module sampling assembly, includes flexible circuit board (10), its characterized in that, flexible circuit board (10) include first circuit board section (11) and second circuit board section (12) rather than being connected, flexible circuit board (10) are in first circuit board section (11) with the junction of second circuit board section (12) is the setting of buckling, second circuit board section (12) are perpendicular to in the direction of first circuit board section (11) with first circuit board section (11) part overlaps the setting mutually.
2. The modular sampling assembly of claim 1, further comprising a first guard disposed between the first circuit board segment (11) and the second circuit board segment (12) such that the first circuit board segment (11) and the second circuit board segment (12) are spaced apart in a direction perpendicular to the first circuit board segment (11).
3. The modular sampling assembly of claim 2, wherein the first guard is foam and the second circuit board segment (12) and the first circuit board segment (11) are bonded by the foam.
4. The modular sampling assembly of claim 1, wherein the first circuit board segment (11) and the second circuit board segment (12) are adhesively connected.
5. The modular sampling assembly of any of claims 1-4, further comprising:
a sampling assembly support (20), the first circuit board segment (11) and the second circuit board segment (12) both connected with the sampling assembly support (20).
6. The modular sampling assembly of claim 5, wherein the first circuit board segment (11) is provided with a first fixing hole, the second circuit board segment (12) is provided with a second fixing hole, and at least parts of the first fixing hole and the second fixing hole are arranged oppositely;
and a hot riveting column (21) is arranged on the sampling assembly bracket (20), and the first circuit board section (11) and the second circuit board section (12) are in hot riveting connection with the hot riveting column (21) which is sequentially arranged in the second fixing hole and the first fixing hole in a penetrating manner.
7. The modular sampling assembly of claim 5, wherein the sampling assembly holder (20) comprises a snap (22), the snap (22) for snapping with a modular holder of a module; and/or the presence of a gas in the atmosphere,
the flexible circuit board (10) comprises a first end part (13) and a second end part (14) which are oppositely arranged; the sampling assembly support (20) comprises a first baffle plate (23) and a second baffle plate (24), the first baffle plate (23) and the second baffle plate (24) are arranged on two opposite sides of the flexible circuit board (10), the first baffle plate (23) is used for stopping the first end portion (13), and the second baffle plate (24) is used for stopping the second end portion (14).
8. The modular sampling assembly of claim 5, wherein a temperature acquisition element (30) is disposed on the flexible circuit board (10), the temperature acquisition element (30) being located on a side of the flexible circuit board (10) remote from the sampling assembly support (20);
an accommodating groove (25) is formed in the sampling assembly bracket (20); the module sampling assembly further comprises a first reinforcing plate (40), the first reinforcing plate (40) is covered on the flexible circuit board (10), and the first reinforcing plate (40) and the temperature acquisition element (30) are arranged on two opposite sides of the flexible circuit board (10); the first reinforcing plate (40) is positioned in the accommodating groove (25); and/or the presence of a gas in the gas,
the side of the flexible circuit board (10) far away from the sampling assembly support (20) is provided with a second protection piece (60), and the second protection piece (60) is arranged to protrude out of the temperature acquisition element (30) towards the direction far away from the sampling assembly support (20).
9. The modular sampling assembly of any of claims 1 to 4, further comprising a nickel plate (50), the nickel plate (50) comprising a first connection section (51), a transition connection section (53) and a second connection section (52) connected in series, the first connection section (51) being connected with the first end (13) of the flexible circuit board (10); a first connecting end of the transition connecting section (53) is connected with the first connecting section (51) and is arranged obliquely relative to the first connecting section (51), and a second connecting end of the transition connecting section (53) is connected with the second connecting section (52) and is arranged obliquely relative to the second connecting section (52); the second connecting section (52) is used for connecting to a busbar.
10. The modular sampling assembly of any of claims 1-4, further comprising a plurality of nickel plates (50), wherein the plurality of nickel plates (50) are spaced apart at a first end portion (13) of the flexible circuit board (10), and wherein a gap (15) is disposed on the first end portion (13) between two adjacent nickel plates (50).
11. A battery pack comprising a module and a module sampling assembly, wherein the module sampling assembly is the module sampling assembly of any one of claims 1 to 10, and a flexible circuit board (10) of the module sampling assembly is disposed at a side of the module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221670985.5U CN217589334U (en) | 2022-06-30 | 2022-06-30 | Module sampling assembly and battery package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221670985.5U CN217589334U (en) | 2022-06-30 | 2022-06-30 | Module sampling assembly and battery package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217589334U true CN217589334U (en) | 2022-10-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221670985.5U Active CN217589334U (en) | 2022-06-30 | 2022-06-30 | Module sampling assembly and battery package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217589334U (en) |
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2022
- 2022-06-30 CN CN202221670985.5U patent/CN217589334U/en active Active
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