CN217572927U

CN217572927U - Wafer clamping mechanical arm and wafer cleaning device

Info

Publication number: CN217572927U
Application number: CN202221293160.6U
Authority: CN
Inventors: 苏建生; 夏新超
Original assignee: Xian Eswin Silicon Wafer Technology Co Ltd; Xian Eswin Material Technology Co Ltd
Current assignee: Xian Eswin Silicon Wafer Technology Co Ltd; Xian Eswin Material Technology Co Ltd
Priority date: 2022-05-26
Filing date: 2022-05-26
Publication date: 2022-10-14
Anticipated expiration: 2032-05-26

Abstract

The utility model provides a wafer centre gripping robotic arm and wafer belt cleaning device belongs to the silicon chip and makes technical field. The wafer clamping robot comprises: the mechanical arm comprises a mechanical arm body, wherein the mechanical arm body comprises a pair of clamping units which are oppositely arranged, the lower part of each clamping unit is provided with at least one clamping rod, the clamping rods are provided with a plurality of grooves which are parallel to each other, and the extending direction of the grooves is vertical to the extending direction of the clamping rods; the inside of the clamping rod is provided with a dry gas spray pipe, and the clamping rod is provided with a plurality of spray heads communicated with the dry gas spray pipe. The utility model discloses robotic arm's dryness fraction and cleanliness factor can be improved, and then the yield of wafer is improved.

Description

Wafer clamping mechanical arm and wafer cleaning device

Technical Field

The utility model relates to a silicon chip makes technical field, especially indicates a wafer centre gripping robotic arm and wafer belt cleaning device.

Background

In the field of semiconductor silicon wafers, the application of a tank type cleaning machine is very wide, the tank type cleaning machine is used for removing organic matters, particles, metal pollution and the like on the surfaces of silicon wafers to obtain silicon wafers with high clean surfaces, and the tank type cleaning machine is active in the field of production and manufacturing of integrated circuits with the surface thickness of 30nm or more due to high production capacity and stable process capacity.

In the traditional groove type cleaning machine, a plurality of mechanical arms cooperate together to convey and transfer wafers, so that the wafers are sequentially cleaned and rotated in each groove body, finally, the wafers with high cleanliness are obtained after drying, in the section of the cleaning groove, the mechanical arms can clamp the wafers and directly immerse the wafers into a chemical tank or a pure water tank, namely, in the process, the mechanical arms are always in a wet state, the wafers cannot be influenced by the mechanical arms because the wafers are also in the wet state when being conveyed among the cleaning groove bodies, but when the wafers reach a groove body at the rear end of the cleaning equipment, as shown in figure 1, when the wafers 2 reach a #11 slow lifting groove, a lifting mechanism in the groove body can uniformly lift the wafers at a low speed, after most of the wafers are exposed out of the water, the mechanical arms 1 can clamp the wafers 2 and then continue to carry out slow lifting action, until the wafer 2 is completely separated from the liquid level, the liquid on the surface of the wafer 2 is separated from the surface of the wafer 2 due to tension to achieve a preliminary drying effect, in the process, the mechanical arm 1 is not directly contacted with the liquid level, but the clamped wafer 2 is only subjected to preliminary drying, so that the card comb of the mechanical arm 1 risks being wetted to a certain extent, then the wafer 2 is transferred to a #12 infrared drying tank for final drying treatment, the wafer 2 is continuously conveyed out by the mechanical arm 1 after the final drying treatment is completed, the first drying process and the second drying process both need the mechanical arm 1 to complete the transfer, in the process, the dryness and cleanliness of the card comb of the mechanical arm 1 are particularly important, in the process, the card comb of the mechanical arm 1 risks being wetted and deposition of pollution particles, and then the wafer 2 after the second drying process is polluted, and edge stains are left.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a wafer centre gripping robotic arm and wafer belt cleaning device can improve robotic arm's dryness fraction and cleanliness factor, and then improves the yield of wafer.

In order to solve the above technical problem, embodiments of the present invention provide the following technical solutions:

on the one hand, the embodiment of the utility model provides a wafer centre gripping robotic arm, include:

the mechanical arm comprises a mechanical arm body, wherein the mechanical arm body comprises a pair of clamping units which are oppositely arranged, the lower part of each clamping unit is provided with at least one clamping rod, the clamping rods are provided with a plurality of grooves which are parallel to each other, and the extending direction of the grooves is vertical to the extending direction of the clamping rods;

the inside of the clamping rod is provided with a dry gas spray pipe, and the clamping rod is provided with a plurality of spray heads communicated with the dry gas spray pipe.

In some embodiments, one end of the dry gas nozzle is connected to the nozzle, and the other end of the dry gas nozzle is connected to a dry gas source through an air inlet pipe, and the air inlet pipe is provided with an electromagnetic valve unit.

In some embodiments, the solenoid unit includes a solenoid coil and a solenoid switch controlled by the solenoid coil.

In some embodiments, the spray head is located between adjacent recesses.

In some embodiments, the drying gas in the drying gas nozzle is nitrogen.

In some embodiments, the wafer clamping robot includes a plurality of clamping bar sets, each clamping bar set includes two clamping bars disposed oppositely, the two clamping bars are located on different clamping units, and a nozzle of one clamping bar faces to another clamping bar of the same clamping unit.

In some embodiments, the wafer holding robot comprises two gripper bar sets.

The embodiment of the utility model provides a wafer belt cleaning device is still provided, include as above wafer centre gripping robotic arm.

The embodiment of the utility model has the following beneficial effect:

in the above scheme, press from both sides and get the inside dry gas spray tube that is provided with of pole, press from both sides and be provided with a plurality of shower nozzles that communicate with the dry gas spray tube on getting the pole, can carry the wafer after the drying before at the manipulator through dry gas spray tube and shower nozzle, carry out self earlier and sweep and guarantee to press from both sides the drying and the cleanness of getting the pole, when guaranteeing the wafer after the manipulator is dry in the centre gripping with this, can not press from both sides the humidity or the cleanliness factor of getting the pole and not high and pollute the wafer because of manipulator, and then can improve the yield of finished product wafer.

Drawings

FIG. 1 is a schematic diagram illustrating a wafer cleaning process according to the related art;

FIG. 2 is a schematic view of a robot arm according to the related art;

fig. 3-5 are schematic structural views of a wafer-clamping robot according to an embodiment of the present invention;

FIG. 6 is a schematic view of the clamping unit clamping a wafer;

fig. 7 is a schematic view illustrating the clamping unit clamping the wafer according to the embodiment of the present invention.

Reference numerals

1. Mechanical arm

2. Wafer

31. First clamping unit

32. Second gripping unit

41. First clamping rod

42 second gripper bar

43. Third clamping rod

44. Fourth clamping rod

51. First dry gas nozzle

52. Second dry gas nozzle

6. Solenoid valve unit

7. Air inlet pipe

Detailed Description

In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.

In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined below to clearly and completely describe the technical solution of the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived from the description of the embodiments of the present invention by a person skilled in the art, are within the scope of the present invention.

The embodiment of the utility model provides a wafer centre gripping robotic arm, include:

In this embodiment, press from both sides and get the inside dry gas spray tube that is provided with of pole, press from both sides and be provided with a plurality of shower nozzles that communicate with the dry gas spray tube on getting the pole, can carry the wafer after the drying before at the manipulator through dry gas spray tube and shower nozzle, carry out self earlier and sweep and guarantee to press from both sides the drying and the cleanness of getting the pole, when guaranteeing the wafer of manipulator after the centre gripping is dry with this, can not press from both sides the humidity or the cleanliness factor of getting the pole and not high and pollute the wafer because of manipulator, and then can improve the yield of finished product wafer.

Wherein, the one end of dry gas spray tube with the shower nozzle is connected, and the other end passes through the intake pipe to be connected with the dry gas source, be provided with the solenoid valve unit in the intake pipe, can control the intercommunication between dry gas spray tube and the dry gas source or turn-off through the solenoid valve unit. When the mechanical arm carries wet wafers or does not carry wafers, the electromagnetic valve unit can control the drying gas spray pipe and the drying gas source to be switched off, so that energy consumption is saved; before the robot carries the dried wafer, the electromagnetic valve unit can control the communication between the drying gas spray pipe and the drying gas source so as to dry and clean the clamping rod.

The electromagnetic valve unit comprises an electromagnetic valve coil and an electromagnetic valve switch controlled by the electromagnetic valve coil. The electromagnetic valve switch can be controlled to be turned off or turned on by controlling the current in the electromagnetic valve coil, so that the supply of dry gas is controlled, and whether the clamping rod is dried and cleaned is judged.

The dry gas in the dry gas spray pipe can adopt nitrogen, and certainly, the dry gas in the dry gas spray pipe is not limited to adopt nitrogen and can also adopt other dry gases.

The position of the spray head on the clamping rod is not limited, but in order to avoid the influence of the spray head on clamping the wafer, the spray head is preferably positioned between the adjacent grooves.

In some embodiments, the wafer clamping robot arm includes a plurality of clamping rod groups, each clamping rod group includes two clamping rods arranged oppositely, the two clamping rods are located on different clamping units, and in one clamping rod group, a spray head on one clamping rod faces towards the other clamping rod in the same group, so that the other clamping rod in the same group can be dried and cleaned by the spray head on the one clamping rod. The wafer clamping mechanical arm can comprise two or more than three clamping rod groups, and the wafer clamping mechanical arm can clamp a firm wafer.

In one embodiment, as shown in fig. 2 and 3, the wafer-holding robot includes a robot body, and the robot body includes a pair of opposing gripping units: the first clamping unit 31 and the second clamping unit 32 complete the clamping and the releasing of the wafer through the simultaneous opening and closing of the first clamping unit 31 and the second clamping unit 32.

A first clamping rod 41 and a second clamping rod 42 are arranged on the first clamping unit 31, a third clamping rod 43 and a fourth clamping rod 44 are arranged on the second clamping unit 32, and a plurality of grooves are arranged on the first clamping rod 41, the second clamping rod 42, the third clamping rod 43 and the fourth clamping rod 44 for clamping the wafer. Wherein, the first clamping rod 41 corresponds to the fourth clamping rod 44, and belongs to the same group of clamping rods; the second grasping rod 42 corresponds to the third grasping rod 43, and belongs to the same group of grasping rods.

A dry gas spray pipe is arranged inside the clamping rod, a first dry gas spray pipe 51 is arranged on the first clamping unit 31, a second dry gas spray pipe 52 is arranged on the second clamping unit 32, the dry gas spray pipe is connected with a dry gas source through an air inlet pipe 7, and an electromagnetic valve unit 6 is arranged on the air inlet pipe 7. Through the air inlet pipe 7 and the dry gas spray pipe, dry gas is sprayed out from the dry gas source through the spray head, and the clamping rod is dried and cleaned. The nozzle may be a hole disposed on the clamping rod, as shown in fig. 3, the nozzle on the first clamping rod 41 may dry and clean the fourth clamping rod 44, the nozzle on the fourth clamping rod 44 may dry and clean the first clamping rod 41, the nozzle on the second clamping rod 42 may dry and clean the third clamping rod 43, and the nozzle on the third clamping rod 43 may dry and clean the second clamping rod 42.

As shown in fig. 4 and 5, by opening and closing the first gripping unit 31 and the second gripping unit 32 at the same time, gripping and releasing of the wafer can be completed by the gripping lever 4. As shown in fig. 6, when the wafer 2 is grasped, the wafer 2 is held between the opposing sets of the grasping rods, and the positions of the grooves in the opposing sets of the grasping rods correspond to one another, that is, for the first grasping rod 41 and the second grasping rod 42, the grooves on the first grasping rod 41 correspond to the grooves on the second grasping rod 42, and the wafer 2 is clamped between the corresponding grooves.

When the robot arm clamps the wafer and transfers the wafer from the slow lifting groove to the infrared drying groove, the wafer is in the infrared groove for final drying, the robot arm is in an idle waiting state, the air inlet pipe 7 and the dry gas spray pipe are conducted after the electromagnetic valve unit is triggered to be powered on, nitrogen can enter and be distributed to the second dry gas spray pipe 52 and the first dry gas spray pipe 51 through the electromagnetic valve unit and finally be sprayed out through the spray heads on the clamping rods, as shown in fig. 7, the first clamping rod 41 and the fourth clamping rod 44 are mutually purged, the second clamping rod 42 and the third clamping rod 43 are mutually purged, the purging time can be adjusted and is determined according to the action interval time of the next step and the drying degree of the clamping rods. And when the wafer processing of the infrared drying tank is finished, the mechanical arm stops automatically blowing, and then starts to clamp and take the wafer from the tank for blanking and conveying.

The embodiment of the utility model provides a wafer belt cleaning device is still provided, include as above wafer centre gripping robotic arm. The wafer holding robot has the advantages that the silicon wafer cleaning device also has the advantages, and the description is omitted.

In the embodiments of the methods of the present invention, the sequence numbers of the steps cannot be used to define the sequence of the steps, and for those skilled in the art, the sequence of the steps is not changed without creative work.

It should be noted that, in the present specification, all the embodiments are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the embodiments, since they are substantially similar to the product embodiments, the description is simple, and the relevant points can be referred to the partial description of the product embodiments.

Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.

In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A wafer clamping robot, comprising:

the mechanical arm comprises a mechanical arm body, wherein the mechanical arm body comprises a pair of clamping units which are oppositely arranged, the lower part of each clamping unit is provided with at least one clamping rod, the clamping rods are provided with a plurality of grooves which are parallel to each other, and the extending directions of the grooves are vertical to the extending directions of the clamping rods;

2. The wafer holding robot as claimed in claim 1, wherein one end of the dry gas nozzle is connected to the shower head, and the other end is connected to a dry gas source through an inlet pipe, and the inlet pipe is provided with an electromagnetic valve unit.

3. The wafer holding robot as recited in claim 2, wherein the solenoid unit comprises a solenoid coil and a solenoid switch controlled by the solenoid coil.

4. The wafer holding robot of claim 1, wherein the showerhead is positioned between adjacent grooves.

5. The wafer holding robot of claim 1, wherein the dry gas in the dry gas nozzle is nitrogen.

6. The wafer holding robot as claimed in claim 1, wherein the wafer holding robot comprises a plurality of clamping bar sets, each clamping bar set comprises two opposite clamping bars, the two clamping bars are located on different clamping units, and the nozzles of one clamping bar face to the other clamping bar of the same clamping bar set.

7. The wafer holding robot of claim 6, wherein the wafer holding robot comprises two gripper bar sets.

8. A wafer cleaning apparatus comprising the wafer-holding robot as recited in any one of claims 1-7.