CN217548356U - Temperature control cold and hot compress integrated compress device - Google Patents
Temperature control cold and hot compress integrated compress device Download PDFInfo
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- CN217548356U CN217548356U CN202220716058.6U CN202220716058U CN217548356U CN 217548356 U CN217548356 U CN 217548356U CN 202220716058 U CN202220716058 U CN 202220716058U CN 217548356 U CN217548356 U CN 217548356U
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Abstract
The utility model discloses a control by temperature change cold and hot compress integral type applies and treats device, including applying bag, semiconductor refrigeration piece, temperature measuring element, current direction change over switch, temperature controller, cooling system and power module, temperature measuring element, cooling system and power module are connected with the temperature controller electricity respectively, and the semiconductor refrigeration piece passes through current direction change over switch and is connected with the temperature controller electricity. The utility model discloses can apply the treatment position to needs high-efficiently conveniently and carry out cold compress or hot compress, and can carry out automatic control to the temperature of applying the bag and make the temperature of applying the bag keep in the temperature range of the good effect of applying the therapy for need apply the treatment position can not be frostbitten, thereby can reach better treatment in the same time.
Description
Technical Field
The utility model relates to the technical field of medical supplies, especially, relate to a control by temperature change cold and hot compress integral type and apply and treat device.
Background
A series of adverse reactions such as pain, swelling, inflammation, fever and the like generated after injury always troubles people. Swelling and pain of wounds are the most common symptoms in the clinic,
at present, people often apply the ice bag and the hot water bag to the affected part for treatment. However, the conventional ice bag and hot water bag have a lot of inconvenience in practical application.
Firstly, the ice bag needs to be placed in the refrigerator for freezing for a long time, and the hot water bag needs to be filled with hot water or connected with a power supply for charging and heating; secondly, the temperature of the patient and the patient cannot be controlled to change, the temperature of the patient and the patient is influenced by the ambient environment and the body temperature of the patient, and the treatment effect is poor; thirdly, in the process of using the ice bag and the hot water bag, in order to avoid frostbite or low-temperature scald, the patient or the medical care personnel need to pay attention to the application time all the time, and the workload of the medical care personnel or the family members of the patient is increased to a certain extent.
Therefore, the problems of inconvenient operation, poor effect, easy frostbite, uncontrollable temperature and the like exist in the prior art when the traditional ice bag and the hot water bag are used for cold compress and hot compress.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least, creatively provide a cold and hot compress integral type of control by temperature change and apply the therapy device very much, effectively solved and utilized traditional ice bag and hot-water bottle to come cold compress and hot compress to lead to inconvenient, poor, the easy frostbite of effect, the uncontrollable problem of temperature among the prior art.
In order to realize the above purpose of the utility model, the utility model provides a temperature control cold and hot compress integrated applying and treating device, which comprises an applying bag, a semiconductor refrigeration piece, a temperature measuring element, a current direction change-over switch, a temperature controller, a heat radiation system and a power module, wherein the temperature measuring element, the heat radiation system and the power module are respectively electrically connected with the temperature controller, the semiconductor refrigeration piece is electrically connected with the temperature controller through the current direction change-over switch,
the compress bag is used for carrying out cold compress or hot compress on the part needing to be applied;
the semiconductor refrigeration sheet is in heat transfer connection with the compress bag to exchange heat with the compress bag;
the current direction change-over switch is used for changing the electrifying current direction of the semiconductor refrigerating sheet so as to change the refrigerating and heating effects of the semiconductor refrigerating sheet;
the heat dissipation system is used for dissipating heat of the semiconductor refrigeration sheet during cold compress;
the temperature measuring element is used for detecting the real-time temperature information of the dressing bag and sending the real-time temperature information to the temperature controller;
the temperature controller is used for controlling the on-off state of the semiconductor refrigerating sheet according to the real-time temperature information detected by the temperature measuring element.
Preferably, the temperature controller comprises a microcontroller, a key module and a display module, wherein the key module and the display module are respectively connected with the microcontroller.
Preferably, the heat dissipation system comprises a cold row, a water pump, a water cooling head and a circulating liquid, the cold row, the water pump and the water cooling head are sequentially connected in series through a pipeline to form a circulating loop for the circulating liquid to flow circularly, the water cooling head is in heat transfer connection with the semiconductor refrigeration piece, and the water pump is electrically connected with the microcontroller.
Preferably, the heat dissipation system further comprises a fan, the fan is fixedly installed on one side of the cold row, and the fan is electrically connected with the microcontroller.
Preferably, the temperature control cold and hot compress integrated therapeutic device further comprises a power switch, and the power switch is connected with the power module and between the temperature controllers.
Preferably, the power module is a rechargeable lithium battery, and the power module is connected with the temperature controller in a pluggable manner through a power line.
Preferably, the temperature measuring element is a thermocouple.
Preferably, the dressing bag is fixedly provided with an elastic magic tape.
Preferably, the compress bag comprises an upper graphene heat dissipation patch and a lower graphene heat dissipation patch which are oppositely arranged, a plurality of heat conduction metal sheets which are uniformly arranged at intervals are arranged between the upper graphene heat dissipation patch and the lower graphene heat dissipation patch, and the upper graphene heat dissipation patch, the heat conduction metal sheets and the lower graphene heat dissipation patch are sequentially in heat transfer connection.
Preferably, the semiconductor refrigeration piece is equipped with a plurality ofly, the semiconductor refrigeration piece set up in go up the upper surface that graphite alkene heat dissipation pasted and with the heat conduction sheetmetal corresponds the setting.
Since the technical scheme is used, the beneficial effects of the utility model are as follows:
the utility model discloses according to the Peltier effect of semiconductor refrigeration piece, switch the current direction of semiconductor refrigeration piece through current direction change over switch, thereby make the semiconductor refrigeration piece change the realization between refrigeration effect and heating effect and to applying the heating or the refrigeration of bag, thereby conveniently high-efficiently to need to apply the treatment position and carry out cold compress or hot compress, and can control the expert of semiconductor refrigeration piece through the temperature controller, the break-make electricity state of outage state and cooling system carries out automatic control to the temperature of applying the bag and makes the temperature of applying the bag keep in the temperature range of good treatment effect of applying, make need apply the treatment position can not be frostbitten, thereby can reach better treatment in the same time.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural view of a warm-controlled cold-hot compress integrated therapeutic device in a preferred embodiment;
FIG. 2 is a schematic top view of a preferred embodiment of the dressing bag provided by the present invention;
fig. 3 is a schematic sectional view of a dressing bag according to a preferred embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In the description of the present invention, unless otherwise specified and limited, it is to be noted that the terms "mounted," "connected" and "connected" are to be interpreted broadly, and may be, for example, a mechanical connection or an electrical connection, a communication between two elements, a direct connection, or an indirect connection through an intermediate medium, and those skilled in the art may understand the specific meanings of the above terms according to specific situations.
The utility model provides a control by temperature change cold hot compress integral type is applied and is treated device, as shown in fig. 1-3, this control by temperature change cold hot compress integral type is applied and is treated device is including applying bag 1, semiconductor refrigeration piece 2, temperature measuring element 3, current direction change over switch 4, temperature controller 5, cooling system 6 and power module 7, temperature measuring element 3, cooling system 6 and power module 7 are connected with 5 electricity of temperature controller respectively, semiconductor refrigeration piece 2 is connected with 5 electricity of temperature controller through current direction change over switch 4, semiconductor refrigeration piece 2 with apply bag 1 heat-transfer connection in order to carry out the heat exchange with applying bag 1. The compress bag 1 is used for cold compress or hot compress of the part needing to be compressed; the current direction change-over switch 4 is used for changing the electrifying current direction of the semiconductor chilling plate 2 so as to change the refrigeration and heating effects of the semiconductor chilling plate 2; the heat dissipation system 6 is used for dissipating heat of the semiconductor refrigeration sheet 2 during cold compress; the temperature measuring element 3 is used for detecting the real-time temperature information of the dressing bag 1 and sending the real-time temperature information to the temperature controller 5; the temperature controller 5 is used for controlling the on-off state of the semiconductor refrigerating sheet 2 according to the real-time temperature information detected by the temperature measuring element 3.
In this embodiment, the thermostat 5 includes a microcontroller 51, a key module 52 and a display module 53, and the key module 52 and the display module 53 are respectively connected to the microcontroller 51. Can set up cold compress temperature threshold value and hot compress temperature threshold value through button module 52, real-time temperature information that detects the temperature element 3 through display module 53, the cold compress temperature threshold value/hot compress temperature value of setting shows in real time, microcontroller 51 compares real-time temperature information and cold compress temperature threshold value/hot compress temperature value that the temperature element 3 detected, and pass through according to the comparative result control semiconductor refrigeration piece 2, the outage state, thereby avoid applying bag 1's temperature too high or low and influence and apply the treatment effect. Specifically, the temperature threshold for cold compress is generally set at 10 to 15 deg.C, and the temperature threshold for hot compress is generally set at 40 to 50 deg.C.
In this embodiment, the heat dissipation system 6 includes a cold bar 61, a water pump 62, a water cooling head 63 and a circulation liquid, the cold bar 61, the water pump 62 and the water cooling head 63 are sequentially connected in series through a pipeline to form a circulation loop for circulating the circulation liquid, the water cooling head 63 is in heat transfer connection with the semiconductor chilling plate 2, and the water pump 62 is electrically connected with the microcontroller 51. In the cold compress process, the temperature controller 5 controls the water pump 62 to be started to enable circulating liquid to circularly flow in the circulating loop, the water cooling head 63 guides heat absorbed by the semiconductor refrigerating sheet 2 out of the circulating liquid in time, and the circulating liquid is cooled through the cold row 61, so that the cold compress is realized by rapidly cooling the compress bag 1. Specifically, in this embodiment, the circulating liquid is water, which is low in cost and has a good heat conduction effect.
In the present embodiment, the heat dissipation system 6 further includes a fan 64, the fan 64 is fixedly installed on one side of the cold row 61, and the fan 64 is electrically connected to the microcontroller 51. During cold compress, temperature controller 5 control fan 64 opens and bloies the heat dissipation to cold row 61, further accelerates cooling system 6's radiating effect for apply bag 1 temperature can reach the cold compress temperature threshold value within range of setting for more fast, improve the cold compress effect.
In this embodiment, the temperature-controlled cold and hot compress integrated therapeutic apparatus further comprises a power switch 8, and the power switch 8 is connected between the power module 7 and the temperature controller 5. The power supply switch 8 is arranged to control the power supply module 7 to switch on and off the power supply of the device, so that electric energy is saved, and the power supply time of the power supply module 7 is prolonged.
In this embodiment, the power module 7 is a rechargeable lithium battery, and the power module 7 is connected to the thermostat 5 via a power cord in a pluggable manner. The lithium battery has high energy density, the volume of the power module 7 is effectively reduced while the power supply time is ensured, and the portability of the device is improved. The power module 7 is connected with the temperature controller 5 in a pluggable manner through a power line, so that the power module 7 and the temperature controller 5 can be separated in the charging or moving process, and the portability of the device is further improved.
In the present embodiment, the temperature measuring element 3 is a thermocouple. The thermocouple is a temperature sensing element, can directly measure the temperature, and convert the temperature signal into the thermoelectromotive force signal, the thermoelectromotive force signal that obtains of measurement carries out analog-to-digital conversion through the temperature control module and then converts into the temperature value of the measured application bag 1.
In this embodiment, the dressing bag 1 is fixedly provided with an elastic magic tape 11. Through setting up elasticity magic subsides 11, can be more conveniently will apply bag 1 and bind to fix and apply the treatment position, easy operation, fixed effectual.
In this embodiment, compress bag 1 and include relative last graphite alkene heat dissipation subsides 12 and lower graphite alkene heat dissipation subsides 13 that set up, go up graphite alkene heat dissipation subsides 12 and be provided with the heat conduction sheetmetal 14 that 5 even intervals set up down between graphite alkene heat dissipation subsides 13, go up graphite alkene heat dissipation subsides 12, heat conduction sheetmetal 14 and graphite alkene heat dissipation subsides 13 heat transfer connection in proper order down. Because the graphene heat dissipation patch and the heat conducting metal sheet 14 both have good heat conducting effects, efficient heat transfer between the part to be treated and the semiconductor refrigerating sheet 2 is realized. A plurality of heat conduction sheetmetals 14 are at last graphite alkene heat dissipation subsides 12 and graphite alkene heat dissipation subsides 13 between even interval setting down, not only guarantee the homogeneity of heat conduction, and because there is the interval between two adjacent heat conduction sheetmetals 14, because upper and lower graphite alkene heat dissipation subsides are flexible material again for apply bag 1 and can buckle in this department, thereby make to apply bag 1 can be better with apply the laminating of treating the position, improve and apply the treatment effect and to applying the adaptability of treating the position. Specifically, in the present embodiment, the heat conducting metal sheet is a copper sheet, and the copper sheet has high heat conductivity.
In this embodiment, semiconductor refrigeration piece 2 is equipped with 2, and 2 intervals of semiconductor refrigeration piece set up in the upper surface of last graphite alkene heat dissipation subsides 12 and correspond the setting with heat conduction sheetmetal 14.
In this embodiment, the working principle of the temperature control cold and hot compress integrated compress therapy device is as follows:
during cold compress, the compress bag 1 is fixed on a position needing to be treated by using the elastic magic tape 11, the power switch 8 is turned on to electrify the device, a cold compress temperature threshold value (the power-off temperature of the semiconductor refrigeration sheet 2) is set to be about 13 ℃ through the button module 52 of the temperature controller 5, the current direction change switch 4 is switched to a cold compress gear, at the moment, the temperature controller 5 controls the heat dissipation system 6 to be electrified to work, the device starts to carry out a cold compress working state, the semiconductor refrigeration sheet 2 enters a refrigeration effect mode to cool the compress bag 1, meanwhile, the temperature measuring element 3 detects the temperature value of the compress bag 1 in real time and sends the temperature value to the temperature controller 5, when the temperature is reduced to the set cold compress temperature threshold value, the temperature controller 5 controls the semiconductor refrigeration sheet 2 to be electrified and refrigerated for a long time, the temperature of the compress bag 1 is increased after a period of time because the body temperature is higher than the temperature of the compress bag 1, when the temperature of the compress bag 1 is increased to exceed the set temperature value, the temperature value is increased, the temperature of the semiconductor refrigeration sheet 2 is controlled to be electrified and refrigerated again, the cycle is repeated, so that the temperature of the compress bag 1 is always in a good effect range in the cold compress process, when the temperature value is reached (for example, after the power switch is turned off, the elastic magic tape 8 is opened, and the compress bag is disconnected, and the elastic magic tape 11 is taken out.
When in hot compress, the compress bag 1 is fixed at a position needing to be applied by using the elastic magic tape 11, the power switch 8 is turned on to electrify the device, a cold compress temperature threshold value (the power-off temperature of the semiconductor refrigeration sheet 2) is set to be about 40 ℃ through the key module 52 of the temperature controller 5, the current direction change switch 4 is switched to the hot compress gear, at the moment, the temperature controller 5 controls the heat dissipation system 6 not to be electrified, the device starts to carry out a hot compress working state, the semiconductor refrigeration sheet 2 enters a heating effect mode to heat the compress bag 1, meanwhile, the temperature measuring element 3 detects the temperature value of the compress bag 1 in real time and sends the temperature value to the temperature controller 5, when the temperature rises to the set hot compress temperature threshold value, the temperature controller 5 controls the semiconductor refrigeration sheet 2 to be electrified and heated, the cycle is repeated, the temperature of the compress bag 1 is always in the temperature value range with good hot compress effect in the hot compress process, when the temperature of the compress bag 1 is reduced to be lower than the set temperature value, the temperature of the semiconductor refrigeration sheet 2 is controlled to be electrified and heated, and the temperature of the heat compress bag is switched to be kept in the cycle, and the magic tape 11 is switched off, when the hot compress process, and the elastic magic tape is switched, and the hot compress bag is switched to be used.
In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A temperature-controlled cold and hot compress integrated compress therapy device is characterized by comprising a compress bag, a semiconductor refrigeration sheet, a temperature measuring element, a current direction change switch, a temperature controller, a heat dissipation system and a power module, wherein the temperature measuring element, the heat dissipation system and the power module are respectively and electrically connected with the temperature controller, the semiconductor refrigeration sheet is electrically connected with the temperature controller through the current direction change switch, wherein,
the compress bag is used for carrying out cold compress or hot compress on the part needing to be applied;
the semiconductor refrigeration sheet is in heat transfer connection with the compress bag to exchange heat with the compress bag;
the current direction change-over switch is used for changing the electrifying current direction of the semiconductor chilling plate so as to change the chilling and heating effects of the semiconductor chilling plate;
the heat dissipation system is used for dissipating heat of the semiconductor refrigeration sheet during cold compress;
the temperature measuring element is used for detecting real-time temperature information of the dressing bag and sending the real-time temperature information to the temperature controller;
the temperature controller is used for controlling the on-off state of the semiconductor refrigerating sheet according to the real-time temperature information detected by the temperature measuring element.
2. The temperature-controlled cold and hot compress integrated therapeutic device according to claim 1, wherein the temperature controller comprises a microcontroller, a key module and a display module, and the key module and the display module are respectively connected with the microcontroller.
3. The integrated temperature-controlled cold and hot compress and therapy device according to claim 2, wherein the heat dissipation system comprises a cold row, a water pump, a water cooling head and a circulating liquid, the cold row, the water pump and the water cooling head are sequentially connected in series through a pipeline to form a circulating loop for the circulating liquid to flow circularly, the water cooling head is in heat transfer connection with the semiconductor cooling sheet, and the water pump is electrically connected with the microcontroller.
4. The temperature-controlled cold and hot compress integrated therapeutic device of claim 3, wherein the heat dissipation system further comprises a fan fixedly mounted on one side of the cold row, the fan being electrically connected to the microcontroller.
5. The temperature-controlled cold and hot compress integrated therapeutic device according to claim 1, further comprising a power switch connected between the power module and the temperature controller.
6. The temperature-controlled cold-and-hot compress integrated therapy device according to claim 1, wherein the power module is a rechargeable lithium battery, and the power module is connected with the temperature controller in a pluggable manner through a power cord.
7. The integrated temperature-controlled cold and hot compress therapy device according to claim 1, wherein the temperature measuring element is a thermocouple.
8. The temperature-controlled integrated cold and hot compress application device as claimed in any one of claims 1 to 7, wherein an elastic magic tape is fixedly arranged on the application bag.
9. The temperature-controlled cold-and-hot-compress integrated application device according to claim 8, wherein the application bag comprises an upper graphene heat dissipation patch and a lower graphene heat dissipation patch which are oppositely arranged, a plurality of heat-conducting metal sheets which are uniformly arranged at intervals are arranged between the upper graphene heat dissipation patch and the lower graphene heat dissipation patch, and the upper graphene heat dissipation patch, the heat-conducting metal sheets and the lower graphene heat dissipation patch are sequentially connected in a heat transfer manner.
10. The integrated temperature-controlled cold and hot compress application device of claim 9, wherein a plurality of semiconductor cooling fins are provided, and the semiconductor cooling fins are disposed on the upper surface of the upper graphene heat dissipation patch and corresponding to the heat conducting metal sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220716058.6U CN217548356U (en) | 2022-03-30 | 2022-03-30 | Temperature control cold and hot compress integrated compress device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220716058.6U CN217548356U (en) | 2022-03-30 | 2022-03-30 | Temperature control cold and hot compress integrated compress device |
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| Publication Number | Publication Date |
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| CN217548356U true CN217548356U (en) | 2022-10-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220716058.6U Active CN217548356U (en) | 2022-03-30 | 2022-03-30 | Temperature control cold and hot compress integrated compress device |
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| CN (1) | CN217548356U (en) |
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- 2022-03-30 CN CN202220716058.6U patent/CN217548356U/en active Active
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