CN217548356U - Temperature control cold and hot compress integrated compress device - Google Patents

Abstract

The utility model discloses a control by temperature change cold and hot compress integral type applies and treats device, including applying bag, semiconductor refrigeration piece, temperature measuring element, current direction change over switch, temperature controller, cooling system and power module, temperature measuring element, cooling system and power module are connected with the temperature controller electricity respectively, and the semiconductor refrigeration piece passes through current direction change over switch and is connected with the temperature controller electricity. The utility model discloses can apply the treatment position to needs high-efficiently conveniently and carry out cold compress or hot compress, and can carry out automatic control to the temperature of applying the bag and make the temperature of applying the bag keep in the temperature range of the good effect of applying the therapy for need apply the treatment position can not be frostbitten, thereby can reach better treatment in the same time.

Description

Temperature-controlled cold and hot compress integrated compress device

technical field

The utility model relates to the technical field of medical supplies, in particular to a temperature-controlled cold-hot compress integrated compress device.

Background technique

A series of adverse reactions after injury, such as pain, swelling, inflammation, fever, etc., have always plagued people. Wound swelling and pain are the most common clinical symptoms,

At present, people often apply ice packs and hot water packs to the affected area for treatment. However, traditional ice packs and hot water packs have many inconveniences in practical applications.

First of all, the ice pack needs to be kept in the freezer for a long time, and the hot water bottle needs to be filled with hot water or connected to the power supply for charging and heating; secondly, the two cannot control the temperature change, and the temperature will be affected by the surrounding environment and the patient's own body temperature. Third, in the process of using ice packs and hot water bags, in order to avoid frostbite or low-temperature scald, patients or medical staff need to always pay attention to the application time, which increases the workload of medical staff or patients' families to a certain extent.

From this, it can be seen that in the prior art, conventional ice packs and hot water packs are used for cold compress and hot compress, which have problems such as inconvenient operation, poor effect, easy frostbite, and uncontrollable temperature.

Utility model content

The utility model aims to solve at least one of the technical problems existing in the prior art, and particularly innovatively proposes a temperature-controlled cold and hot compress integrated therapy device, which effectively solves the problem of using traditional ice packs and hot water packs in the prior art. Cold and hot compresses lead to problems of inconvenience, poor effect, easy frostbite, and uncontrollable temperature.

In order to achieve the above purpose of the present utility model, the present utility model provides a temperature-controlled cold and hot compress integrated therapy device, including a compress bag, a semiconductor refrigerating sheet, a temperature measuring element, a current direction switch, a temperature controller, and a heat dissipation system. and a power supply module, the temperature measuring element, the heat dissipation system and the power supply module are respectively electrically connected to the temperature controller, and the semiconductor refrigeration chip is electrically connected to the temperature controller through the current direction switch, wherein,

The compress bag is used for cold compress or hot compress on the part to be compressed;

the semiconductor refrigeration sheet is thermally connected to the pack for heat exchange with the pack;

The current direction changeover switch is used to change the current direction of the semiconductor refrigerating sheet to convert the cooling and heating effects of the semiconductor refrigerating sheet;

The heat dissipation system is used to dissipate heat to the semiconductor refrigeration sheet during cold compressing;

The temperature measuring element is used to detect the real-time temperature information of the dressing bag, and send the real-time temperature information to the thermostat;

The temperature controller is used for controlling the on/off state of the semiconductor refrigeration chip according to the real-time temperature information detected by the temperature measuring element.

Preferably, the temperature controller includes a microcontroller, a key module and a display module, and the key module and the display module are respectively connected to the microcontroller.

Preferably, the heat dissipation system includes a cold drain, a water pump, a water cooling head and a circulating liquid. The cold drain, the water pump and the water cooling head are connected in series through pipelines to form a circulation loop for circulating the circulating liquid. The water cooling head is connected to the circulating liquid. The semiconductor refrigeration sheet is thermally connected, and the water pump is electrically connected to the microcontroller.

Preferably, the heat dissipation system further includes a fan, the fan is fixedly installed on one side of the cold row, and the fan is electrically connected to the microcontroller.

Preferably, the temperature-controlled cold and hot compress integrated therapy device further includes a power switch, and the power switch is connected between the power module and the temperature controller.

Preferably, the power module is a rechargeable lithium battery, and the power module is pluggably connected to the thermostat through a power cord.

Preferably, the temperature measuring element is a thermocouple.

Preferably, elastic Velcro is fixed on the dressing bag.

Preferably, the wrapping bag includes an upper graphene heat dissipation sticker and a lower graphene heat dissipation sticker that are oppositely arranged, and a plurality of heat conducting metal sheets arranged at uniform intervals are arranged between the upper graphene heat dissipation sticker and the lower graphene heat dissipation sticker, The upper graphene heat-dissipating sticker, the heat-conducting metal sheet and the lower graphene heat-dissipating sticker are connected by heat transfer in sequence.

Preferably, a plurality of the semiconductor refrigeration sheets are provided, and the semiconductor refrigeration sheets are arranged on the upper surface of the upper graphene heat dissipation sticker and are arranged corresponding to the thermally conductive metal sheets.

Owing to adopting the above-mentioned technical scheme, the beneficial effects of the present utility model are as follows:

According to the Peltier effect of the semiconductor refrigerating sheet, the current direction switching switch is used to switch the current direction of the semiconductor refrigerating sheet, so that the semiconductor refrigerating sheet can be converted between the cooling effect and the heating effect to achieve heating or cooling of the bag. In this way, it is convenient and efficient to apply cold or hot compress to the area to be applied, and the temperature of the bag can be automatically controlled by controlling the on/off state of the semiconductor refrigeration chip and the on/off state of the heat dissipation system through the thermostat. The temperature is kept within the temperature range of good application effect, so that the area to be applied will not be frostbitten, so that better treatment effect can be achieved in the same time.

Additional aspects and advantages of the invention will be set forth, in part, from the following description, and in part will be apparent from the following description, or learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of embodiments in conjunction with the accompanying drawings, wherein:

1 is a schematic structural diagram of a temperature-controlled cold-hot compress integrated therapy device in a preferred embodiment provided by the present utility model;

Fig. 2 is the top-view structure schematic diagram of the application bag in a preferred embodiment provided by the present utility model;

Fig. 3 is a schematic cross-sectional structure diagram of a dressing bag in a preferred embodiment provided by the present invention.

Detailed ways

The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, but should not be construed as a limitation of the present invention.

In the description of the present invention, it should be understood that the terms "portrait", "horizontal", "upper", "lower", "front", "rear", "left", "right", "vertical" , "horizontal", "top", "bottom", "inside", "outside" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, only for the convenience of describing the present utility model and simplifying the description, Rather than indicating or implying that the indicated device or element must have a particular orientation, be constructed and operate in a particular orientation, it should not be construed as a limitation of the present invention.

In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a mechanical connection or an electrical connection, or it may be a The internal communication between the two elements may be directly connected or indirectly connected through an intermediate medium, and those of ordinary skill in the art can understand the specific meanings of the above terms according to specific circumstances.

The utility model provides a temperature-controlled cold and hot compress integrated therapy device, as shown in Figures 1-3, the temperature-controlled cold and hot compress integrated therapy device includes a compress bag 1, a semiconductor refrigeration sheet 2, and a temperature measuring element 3. The current direction switch 4, the thermostat 5, the heat dissipation system 6 and the power module 7, the temperature measuring element 3, the heat dissipation system 6 and the power module 7 are respectively electrically connected with the thermostat 5, and the semiconductor refrigeration chip 2 is converted by the current direction The switch 4 is electrically connected to the thermostat 5 , and the semiconductor refrigeration sheet 2 is thermally connected to the pack 1 for heat exchange with the pack 1 . The compress bag 1 is used to apply cold compress or hot compress to the part to be applied; the current direction switch 4 is used to change the direction of the energized current of the semiconductor refrigerating sheet 2 to convert the cooling and heating effects of the semiconductor refrigerating sheet 2; the heat dissipation system 6 is used for The semiconductor refrigeration sheet 2 is radiated during the cold compress; the temperature measuring element 3 is used to detect the real-time temperature information of the bag 1 and send the real-time temperature information to the temperature controller 5; the temperature controller 5 is used to detect the temperature according to the temperature measuring element 3 The obtained real-time temperature information controls the on and off state of the semiconductor refrigeration chip 2 .

In this embodiment, the temperature controller 5 includes a microcontroller 51 , a key module 52 and a display module 53 , and the key module 52 and the display module 53 are respectively connected to the microcontroller 51 . The cold compress temperature threshold and the hot compress temperature threshold can be set through the button module 52, and the real-time temperature information detected by the temperature measuring element 3 and the set cold compress temperature threshold/hot compress temperature value can be displayed in real time through the display module 53, and the microcontroller 51 will measure the temperature in real time. The real-time temperature information detected by the element 3 is compared with the cold compress temperature threshold value/hot compress temperature value, and the on/off state of the semiconductor refrigeration chip 2 is controlled according to the comparison result, so as to avoid the temperature of the compress bag 1 being too high or too low and affecting the compressive layer. therapeutic effect. Specifically, the cold compress temperature threshold is generally set to 10-15°C, and the hot compress temperature threshold is generally set to 40-50°C.

In this embodiment, the heat dissipation system 6 includes a cold row 61, a water pump 62, a water cooling head 63 and a circulating liquid. The cold row 61, the water pump 62 and the water cooling head 63 are connected in series through pipelines to form a circulating loop for circulating liquid. The head 63 is thermally connected to the semiconductor refrigeration chip 2 , and the water pump 62 is electrically connected to the microcontroller 51 . During the cold compress process, the thermostat 5 controls the water pump 62 to turn on the circulating fluid to circulate in the circulation loop. Dissipate heat, thereby quickly cooling the compress bag 1 to achieve cold compress. Specifically, in this embodiment, the circulating liquid is water, the cost is low, and the heat conduction effect is good.

In this embodiment, the cooling system 6 further includes a fan 64 , the fan 64 is fixedly installed on one side of the cold row 61 , and the fan 64 is electrically connected to the microcontroller 51 . During cold compress, the thermostat 5 controls the fan 64 to turn on the cooling row 61 to blow heat and dissipate heat, which further accelerates the heat dissipation effect of the heat dissipation system 6, so that the temperature of the compress bag 1 can more quickly reach the set cold compress temperature threshold range, improving the cold compress effect. .

In this embodiment, the temperature-controlled cold and hot compress integrated therapy device further includes a power switch 8 , and the power switch 8 is connected between the power module 7 and the temperature controller 5 . By arranging the power switch 8 to control the on-off of the power supply of the power supply module 7 to the device, the power is saved and the power supply time of the power supply module 7 is increased.

In this embodiment, the power module 7 is a rechargeable lithium battery, and the power module 7 is pluggably connected to the thermostat 5 through a power cord. The lithium battery has high energy density, which can effectively reduce the volume of the power supply module 7 while ensuring the power supply time, and improve the portability of the device. The power module 7 is pluggably connected to the thermostat 5 through a power cord, so that during charging or moving, the power module 7 and the thermostat 5 can be separated, thereby further improving the portability of the device.

In this embodiment, the temperature measuring element 3 is a thermocouple. A thermocouple is a temperature sensing element, which can directly measure the temperature and convert the temperature signal into a thermoelectromotive force signal. The measured thermoelectromotive force signal is converted into the temperature value of the measured bag 1 after analog-to-digital conversion by the temperature control module.

In the present embodiment, elastic Velcro 11 is fixed on the dressing bag 1 . By arranging the elastic velcro 11 , the dressing bag 1 can be bundled and fixed on the site to be applied more conveniently, the operation is simple, and the fixing effect is good.

In this embodiment, the wrapping bag 1 includes an upper graphene heat dissipation sticker 12 and a lower graphene heat dissipation sticker 13 arranged oppositely, and five evenly spaced spaced between the upper graphene heat dissipation sticker 12 and the lower graphene heat dissipation sticker 13 The thermally conductive metal sheet 14, the upper graphene heat dissipation sticker 12, the thermally conductive metal sheet 14 and the lower graphene heat dissipation sticker 13 are thermally connected in sequence. Since both the graphene heat dissipation sticker and the heat-conducting metal sheet 14 have good heat-conducting effect, high-efficiency heat transfer between the part to be treated and the semiconductor refrigeration sheet 2 is realized. A plurality of heat-conducting metal sheets 14 are evenly spaced between the upper graphene heat-dissipating sticker 12 and the lower graphene heat-dissipating sticker 13, which not only ensures the uniformity of heat conduction, but also because there is an interval between two adjacent heat-conducting metal sheets 14, and because The upper and lower graphene heat dissipation stickers are made of flexible materials, so that the dressing bag 1 can be bent there, so that the dressing bag 1 can better fit the application site, improve the application effect and the adaptability to the application site . Specifically, in this embodiment, the thermally conductive metal sheet is a copper sheet, and the copper sheet has high thermal conductivity.

In this embodiment, there are two semiconductor cooling sheets 2 , and the semiconductor cooling sheets 2 are arranged at intervals on the upper surface of the upper graphene heat dissipation sticker 12 and corresponding to the thermally conductive metal sheet 14 .

In this embodiment, the working principle of the temperature-controlled cold and hot compress integrated therapy device is as follows:

During cold compress, use elastic Velcro 11 to fix the compress bag 1 on the site to be treated, turn on the power switch 8 to power on the device, and set the cold compress temperature threshold (the power-off temperature of the semiconductor refrigeration sheet 2) through the button module 52 of the thermostat 5. ) is set at about 13 °C, and the current direction switch 4 is switched to the cold compress gear. At this time, the thermostat 5 controls the cooling system 6 to energize and work, the device starts to perform cold compress work, and the semiconductor refrigeration sheet 2 enters the cooling effect mode. 1 to cool down, and at the same time, the temperature measuring element 3 detects the temperature value of the compress bag 1 in real time and sends it to the thermostat 5. When the temperature drops to the set cold compress temperature threshold, the thermostat 5 controls the semiconductor refrigeration chip 2 to power off. The body temperature is higher than the temperature of the compressing bag 1, so the temperature of the compressing bag 1 rises after a period of time. When the temperature of the compressing bag 1 rises above the set temperature value, the thermostat 5 controls the semiconductor refrigeration chip 2 to energize and cool again, and the cycle repeats , so that the temperature of the compress bag 1 is always within the temperature range of the good compress effect during the cold compress. When the cold compress time (for example, 30min) is reached, turn off the power switch 8, and use the elastic Velcro 11 to remove the compress bag 1. Down.

During hot compress, use elastic velcro 11 to fix the compress bag 1 on the site to be treated, turn on the power switch 8 to power on the device, and set the cold compress temperature threshold (the power-off temperature of the semiconductor refrigeration sheet 2) through the button module 52 of the thermostat 5. ) is set at about 40°C, and the current direction switch 4 is switched to the hot compressing gear. At this time, the thermostat 5 controls the cooling system 6 to not energize, the device starts to perform the hot compressing working state, and the semiconductor refrigeration sheet 2 enters the heating effect mode. 1 is heated, and at the same time, the temperature measuring element 3 detects the temperature value of the bag 1 in real time and sends it to the thermostat 5. When the temperature rises to the set hot compress temperature threshold, the thermostat 5 controls the semiconductor refrigeration chip 2 to power off. Since the body temperature is lower than the temperature of the compressing bag 1, the temperature of the compressing bag 1 decreases after a period of time. When the temperature of the compressing bag 1 drops below the set temperature value, the thermostat 5 controls the semiconductor refrigeration chip 2 to energize and heat again. , so that the temperature of the compress bag 1 is always within the temperature range of the good compress effect during the hot compress process. When the hot compress time (for example, 30min) is reached, turn off the power switch 8, and use the elastic Velcro 11 to turn off the Compress bag 1 is removed.

In the description of this specification, description with reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples", etc., mean specific features described in connection with the embodiment or example , structure, material or feature is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention. Variations, the scope of the present invention is defined by the claims and their equivalents.

Claims (10)

1. A temperature-controlled cold and hot compress integrated compress therapy device is characterized by comprising a compress bag, a semiconductor refrigeration sheet, a temperature measuring element, a current direction change switch, a temperature controller, a heat dissipation system and a power module, wherein the temperature measuring element, the heat dissipation system and the power module are respectively and electrically connected with the temperature controller, the semiconductor refrigeration sheet is electrically connected with the temperature controller through the current direction change switch, wherein,

the compress bag is used for carrying out cold compress or hot compress on the part needing to be applied;

the semiconductor refrigeration sheet is in heat transfer connection with the compress bag to exchange heat with the compress bag;

the current direction change-over switch is used for changing the electrifying current direction of the semiconductor chilling plate so as to change the chilling and heating effects of the semiconductor chilling plate;

the heat dissipation system is used for dissipating heat of the semiconductor refrigeration sheet during cold compress;

the temperature measuring element is used for detecting real-time temperature information of the dressing bag and sending the real-time temperature information to the temperature controller;

the temperature controller is used for controlling the on-off state of the semiconductor refrigerating sheet according to the real-time temperature information detected by the temperature measuring element.

2. The temperature-controlled cold and hot compress integrated therapeutic device according to claim 1, wherein the temperature controller comprises a microcontroller, a key module and a display module, and the key module and the display module are respectively connected with the microcontroller.

3. The integrated temperature-controlled cold and hot compress and therapy device according to claim 2, wherein the heat dissipation system comprises a cold row, a water pump, a water cooling head and a circulating liquid, the cold row, the water pump and the water cooling head are sequentially connected in series through a pipeline to form a circulating loop for the circulating liquid to flow circularly, the water cooling head is in heat transfer connection with the semiconductor cooling sheet, and the water pump is electrically connected with the microcontroller.

4. The temperature-controlled cold and hot compress integrated therapeutic device of claim 3, wherein the heat dissipation system further comprises a fan fixedly mounted on one side of the cold row, the fan being electrically connected to the microcontroller.

5. The temperature-controlled cold and hot compress integrated therapeutic device according to claim 1, further comprising a power switch connected between the power module and the temperature controller.

6. The temperature-controlled cold-and-hot compress integrated therapy device according to claim 1, wherein the power module is a rechargeable lithium battery, and the power module is connected with the temperature controller in a pluggable manner through a power cord.

7. The integrated temperature-controlled cold and hot compress therapy device according to claim 1, wherein the temperature measuring element is a thermocouple.

8. The temperature-controlled integrated cold and hot compress application device as claimed in any one of claims 1 to 7, wherein an elastic magic tape is fixedly arranged on the application bag.

9. The temperature-controlled cold-and-hot-compress integrated application device according to claim 8, wherein the application bag comprises an upper graphene heat dissipation patch and a lower graphene heat dissipation patch which are oppositely arranged, a plurality of heat-conducting metal sheets which are uniformly arranged at intervals are arranged between the upper graphene heat dissipation patch and the lower graphene heat dissipation patch, and the upper graphene heat dissipation patch, the heat-conducting metal sheets and the lower graphene heat dissipation patch are sequentially connected in a heat transfer manner.

10. The integrated temperature-controlled cold and hot compress application device of claim 9, wherein a plurality of semiconductor cooling fins are provided, and the semiconductor cooling fins are disposed on the upper surface of the upper graphene heat dissipation patch and corresponding to the heat conducting metal sheet.

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