CN217531517U

CN217531517U - Improved structure of mold

Info

Publication number: CN217531517U
Application number: CN202221577135.0U
Authority: CN
Inventors: 赵磊; 邓旻睿; 王文峰
Original assignee: Chengdu Weiran Technology Co ltd
Current assignee: Chengdu Weiran Technology Co ltd
Priority date: 2022-06-22
Filing date: 2022-06-22
Publication date: 2022-10-04
Anticipated expiration: 2032-06-22

Abstract

The utility model discloses a mould improvement structure relates to mould technical field, including the die holder, the upper end of die holder is fixed with guide pillar and die board, the inside of die holder is provided with the cooling tube, the one end of cooling tube is connected with the water inlet, the other end of the relative water inlet of cooling tube is connected with the delivery port, the fixed surface of cooling tube has the cooling box, the surface of cooling box is provided with the semiconductor fin, the utility model discloses a cooling device carries out the fixed point to the inside cooling water of cooling tube and cools off, guarantees that the temperature of the water of each position department in cooling tube is different little, makes the cooling rate of material keep unanimously, increases the shaping precision of material.

Description

Improved structure of mold

Technical Field

The utility model relates to the technical field of mold, especially, relate to a mold improvement structure.

Background

The mould is various moulds and tools for obtaining required products by injection moulding, blow moulding, extrusion, die casting or forging forming, smelting, stamping and other methods in industrial production, and the processing of the appearance of an article is realized mainly by changing the physical state of a formed material.

The material is cooled through the circulating water inside the existing die, so that the forming speed is accelerated, but the temperature of the circulating water rises gradually in the circulating process, and reaches the highest when reaching a water outlet, so that the cooling speed of the material inside the die is inconsistent, and the forming precision is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a mould improvement structure has solved above-mentioned technical problem.

For solving the technical problem, the utility model provides a pair of mould improvement structure, the die holder comprises a die holder, the upper end of die holder is fixed with guide pillar and die board, the inside of die holder is provided with the cooling tube, the one end of cooling tube is connected with the water inlet, the other end of the relative water inlet of cooling tube is connected with the delivery port, the fixed surface of cooling tube has the cooling box, the surface of cooling box is provided with the semiconductor fin.

Preferably, the other end of the semiconductor cooling fin, which is opposite to the cooling box, is fixed with a heat dissipation row, and the cooling box is hollow inside and provided with a communication groove on the surface.

Preferably, the cooling pipe is fixed inside the cooling box through a communication groove, and cooling water is arranged inside the cooling box.

Preferably, the cold end and the hot end of the semiconductor cooling fin are respectively in surface contact with the cooling box and the cooling row.

Preferably, the cooling pipe is an S-shaped bent pipe and a cooling box is arranged at a turning position of the cooling pipe.

Preferably, the water outlet and the water inlet are respectively connected with the filtering device and the water cooler.

Compared with the prior art, the utility model provides a pair of mould improvement structure has following beneficial effect:

the utility model discloses a cooling device carries out the fixed point cooling to the inside cooling water of cooling tube, guarantees that the temperature of the water of each position department in the cooling tube is little different, makes the cooling rate of material keep unanimous, increases the shaping precision of material.

Drawings

FIG. 1 is a view of the main structure of the present invention;

FIG. 2 is a structural diagram of a cooling tube according to the present invention;

FIG. 3 is a structural diagram of the cooling device of the present invention;

fig. 4 is a structural diagram of the cooling box of the present invention.

The reference numbers in the figures: 1. a die holder; 2. a guide post; 3. a water outlet; 4. a cooling device; 5. a water inlet; 6. a cavity plate; 7. a cooling tube; 41. a semiconductor heat sink; 42. a cooling box; 43. and (4) heat dissipation and discharge.

Detailed Description

The embodiment is given by fig. 1-4, the utility model discloses a mould improvement structure, including die holder 1, the upper end of die holder 1 is fixed with guide pillar 2 and die board 6, the inside of die holder 1 is provided with cooling tube 7, the one end of cooling tube 7 is connected with water inlet 5, the other end of the relative water inlet 5 of cooling tube 7 is connected with delivery port 3, the fixed surface of cooling tube 7 has cooling box 42, the surface of cooling box 42 is provided with semiconductor fin 41.

When the material on the surface of the concave template 6 needs to be cooled, water is introduced into the water inlet 5 by the water cooler, the water enters the cooling pipe 7 through the water inlet 5, the temperature of the cooling pipe 7 is conducted to the concave template 6, the cooling speed of the material on the surface of the concave template 6 is accelerated, when the water inside the cooling pipe 7 turns, the cooling water inside the cooling box 42 is cooled by the semiconductor cooling fins 41 after being electrified, the cooling water wraps the cooling pipe 7 to cool the water inside, the temperature difference of the water at each position inside the cooling pipe 7 is ensured to be small, the cooling speed of the material is kept consistent, and the forming precision of the material is improved.

Claims

1. The improved structure of the die comprises a die holder (1) and is characterized in that a guide pillar (2) and a concave die plate (6) are fixed at the upper end of the die holder (1), a cooling pipe (7) is arranged inside the die holder (1), one end of the cooling pipe (7) is connected with a water inlet (5), the other end, opposite to the water inlet (5), of the cooling pipe (7) is connected with a water outlet (3), a cooling box (42) is fixed on the surface of the cooling pipe (7), and semiconductor cooling fins (41) are arranged on the surface of the cooling box (42).

2. The improved mold structure according to claim 1, wherein a heat dissipation row (43) is fixed to the other end of the semiconductor heat sink (41) opposite to the cooling box (42), and the cooling box (42) is hollow inside and provided with a communication groove on the surface.

3. The improved mold structure according to claim 2, wherein the cooling pipe (7) is fixed inside the cooling box (42) through a communication groove, and cooling water is provided inside the cooling box (42).

4. The improved mold structure according to claim 2, wherein the cold end and the hot end of the semiconductor heat sink (41) are in surface contact with the cooling box (42) and the heat sink row (43), respectively.

5. The improved mold structure according to claim 1, wherein the cooling pipe (7) is an S-shaped bent pipe and a cooling box (42) is arranged at the turning position of the cooling pipe (7).

6. The improved mold structure according to claim 1, wherein the water outlet (3) and the water inlet (5) are connected to a filtering device and a water chiller, respectively.