CN217521982U

CN217521982U - Wafer gripper

Info

Publication number: CN217521982U
Application number: CN202221206218.9U
Authority: CN
Inventors: 王森民; 白胜清
Original assignee: Yongsi Semiconductor Ningbo Co ltd
Current assignee: Yongsi Semiconductor Ningbo Co ltd
Priority date: 2022-05-18
Filing date: 2022-05-18
Publication date: 2022-09-30
Anticipated expiration: 2032-05-18

Abstract

The utility model discloses a wafer tongs relates to wafer processing equipment technical field, including the tongs body, multiunit connecting grooves has evenly been seted up to one side position at tongs body top, and the dog is worn to be equipped with in the activity of multiunit connecting grooves inner chamber, and the intermediate position department of multiunit dog diapire has seted up the second intercommunicating pore, and the first intercommunicating pore of multiunit has evenly been seted up to one side that tongs body diapire is close to connecting grooves, the first intercommunicating pore of multiunit respectively with multiunit connecting grooves, the first intercommunicating pore of multiunit inner chamber activity wear to be equipped with the locating convex block with second intercommunicating pore looks block. The utility model discloses according to the size of the wafer that will snatch or place, select with the dog block to the coupling groove who corresponds the position, start the vacuum generator on the robotic arm, utilize the vacuum gas pocket to realize vacuum adsorption and control the dog and go up and down through the locating convex block to can block the wafer and realize snatching, and then can snatch or place the wafer of different dimensions.

Description

Wafer gripper

Technical Field

The utility model belongs to the technical field of the technique of wafer processing equipment and specifically relates to a wafer tongs is related to.

Background

Along with the rapid development of the semiconductor industry, in the manufacturing process of wafer level package, the photoetching process is to expose and develop to form the required resist pattern with photomask after coating the resist solution on the wafer substrate, and its wafer utilizes robotic arm to carry out accurate snatching and placing, and traditional wafer tongs can satisfy people's user demand basically, realizes the utility model discloses in-process, the inventor finds that there is at least following problem in this technique, and specific problem is as follows:

most wafer grippers on the market can only grab and place wafers with the same size, and the grippers with different sizes need to be purchased when wafers with different sizes are operated.

SUMMERY OF THE UTILITY MODEL

In order to improve the above-mentioned problem that most wafer tongs can only snatch and place the wafer of the same size on the existing market, the utility model provides a wafer tongs.

The utility model provides a wafer tongs adopts following technical scheme:

the wafer gripper comprises a gripper body, wherein a plurality of groups of connecting grooves are uniformly formed in one side of the top of the gripper body, a plurality of groups of connecting grooves are formed in the inner cavities of the connecting grooves in a movable mode, a stop block is arranged in the plurality of groups of the connecting grooves, a second communicating hole is formed in the middle of the bottom wall of the stop block, a plurality of groups of first connecting holes are uniformly formed in one side, close to the connecting grooves, of the bottom wall of the gripper body, the plurality of groups of first connecting holes are respectively communicated with the plurality of groups of connecting grooves, and a plurality of groups of positioning lugs clamped with the second communicating holes are movably arranged in the inner cavities of the first connecting holes in a penetrating mode.

Through adopting above-mentioned technical scheme, with the dog block to the connecting groove of corresponding position, start the vacuum generator on the robotic arm, utilize the vacuum gas pocket to realize vacuum adsorption and control the dog and go up and down through the location lug to can block the wafer and realize snatching, and then can snatch or place the wafer of different dimensions.

Optionally, the width dimensions of the stop block and the gripper body are the same.

By adopting the technical scheme, the wafer is conveniently fixed and is conveniently installed and fixed.

Optionally, the cross sections of the positioning lug and the first through hole are both circular.

Optionally, the outer diameter of the positioning projection is smaller than the inner diameter of the first communication hole.

By adopting the technical scheme, the positioning lug can be conveniently driven by compressed air to move up and down so as to drive the stop block to move synchronously.

Optionally, the tongs body is a ceramic plate.

Optionally, multiple groups of vacuum air holes are uniformly formed in the two sides of the interior of the gripper body, and the multiple groups of vacuum air holes are respectively arranged in a staggered mode with the multiple groups of connecting grooves.

By adopting the technical scheme, the vacuum generator and the vacuum air holes are conveniently utilized to realize vacuum adsorption.

To sum up, the utility model discloses a following at least one beneficial effect:

firstly, according to the size of a wafer to be grabbed or placed, a stop block is selected to be clamped into a connecting groove at a corresponding position, a vacuum generator on a mechanical arm is started, vacuum adsorption is realized by using a vacuum air hole, and the stop block is controlled to lift through a positioning lug, so that the wafer can be blocked to be grabbed, and further, wafers with different sizes and specifications can be grabbed or placed;

second, utilize the structural strength that the multiunit dog of design can strengthen the tongs body, reduce to damage, if a certain section tongs body damages the back, can directly maintain and change impaired one section and then can realize the tear-down change.

Drawings

FIG. 1 is a first schematic view of the front sectional structure of the present invention;

fig. 2 is a schematic top view of the first embodiment of the present invention;

FIG. 3 is a schematic top view of the present invention;

fig. 4 is a schematic view of the front sectional structure of the present invention.

In the figure: 1. positioning the bump; 2. a first communication hole; 3. the gripper body; 4. a second communication hole; 5. a stopper; 6. a connecting groove; 7. and (4) vacuum air holes.

Detailed Description

The present invention will be described in further detail with reference to the accompanying fig. 1-4.

Referring to fig. 1 and 2 in the drawings, the present invention provides an embodiment: the utility model provides a wafer tongs, includes tongs body 3, and multiunit connecting groove 6 has evenly been seted up to one side position at 3 tops of tongs body, and connecting groove 6's depth dimension is less than tongs body 3's thickness dimension, and tongs body 3 is the ceramic plate, and 3 inside one sides that are close to connecting groove 6 of tongs body set up to the fretwork form, and dog 5 is worn to be equipped with in the inner chamber activity of multiunit connecting groove 6, and dog 5 is the same with tongs body 3's width dimension.

Please refer to fig. 3 in the drawings of the specification, a second communication hole 4 is formed in the middle of the bottom wall of the plurality of groups of stoppers 5, the depth of the second communication hole 4 is smaller than the thickness of the stoppers 5, a plurality of groups of first communication holes 2 are uniformly formed in the bottom wall of the gripper body 3, the plurality of groups of first communication holes 2 are arranged on one side close to the connecting grooves 6, the plurality of groups of first communication holes 2 are respectively communicated with the plurality of groups of connecting grooves 6, positioning protrusions 1 engaged with the second communication holes 4 are movably arranged in the inner cavities of the plurality of groups of first communication holes 2, the cross sections of the positioning protrusions 1 and the first communication holes 2 are circular, and the outer diameter of the positioning protrusions 1 is smaller than the inner diameter of the first communication holes 2.

When the wafer gripper is used, the wafer gripper is fixed at a proper position on a mechanical arm, the stop block 5 is selected to be clamped into the connecting groove 6 at a corresponding position according to the size of a wafer to be gripped or placed, the positioning lug 1 penetrates through the first communicating hole 2 and is clamped with the second communicating hole 4, a vacuum generator on the mechanical arm is started, vacuum adsorption is realized by the vacuum air hole 7, the stop block 5 is controlled to lift through the positioning lug 1, and therefore the wafer can be blocked to be gripped, and wafers with different sizes and specifications can be gripped or placed.

Please refer to fig. 3 and 4 in the drawings of the specification, multiple groups of vacuum air holes 7 are uniformly formed in two sides of the interior of the gripper body 3, the depth of each vacuum air hole 7 is equal to the thickness of the gripper body 3, the multiple groups of vacuum air holes 7 are respectively arranged in a staggered manner with the multiple groups of connecting grooves 6, the structural strength of the gripper body 3 can be enhanced by the aid of the designed multiple groups of stop blocks 5, damage is reduced, and if a certain section of gripper body 3 is damaged, the damaged section can be directly maintained and replaced so as to realize disassembly and replacement.

The working principle is as follows: when the wafer gripper is used, the wafer gripper is fixed at a proper position on a mechanical arm, the stop block 5 is selected to be clamped into the connecting groove 6 at a corresponding position according to the size of a wafer to be gripped or placed, the positioning lug 1 penetrates through the first communicating hole 2 and is clamped with the second communicating hole 4, a vacuum generator on the mechanical arm is started, vacuum adsorption is realized by the vacuum air hole 7, the stop block 5 is controlled to lift through the positioning lug 1, and therefore the wafer can be blocked to be gripped, and wafers with different sizes and specifications can be gripped or placed.

Utilize the structural strength that multiunit dog 5 of design can strengthen tongs body 3, reduce to damage, if a certain section tongs body 3 damages the back, can directly maintain and change impaired one section and then can realize the tear-down change.

The above is the preferred embodiment of the utility model, not limit according to this the utility model discloses a protection scope, the event: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims

1. The utility model provides a wafer tongs, includes tongs body (3), its characterized in that: the gripper comprises a gripper body (3), wherein a plurality of groups of connecting grooves (6) are uniformly formed in one side of the top of the gripper body (3), a plurality of groups of connecting grooves (6) are movably arranged in an inner cavity of each connecting groove (6) in a penetrating mode to form a stop block (5), a plurality of groups of second communicating holes (4) are formed in the middle position of the bottom wall of the stop block (5), a plurality of groups of first communicating holes (2) are uniformly formed in one side, close to the connecting grooves (6), of the bottom wall of the gripper body (3), the plurality of groups of first communicating holes (2) are respectively communicated with the plurality of groups of connecting grooves (6), and a plurality of groups of positioning lugs (1) clamped with the second communicating holes (4) are movably arranged in the inner cavity of the first communicating holes (2).

2. The wafer gripper as claimed in claim 1, wherein: the width sizes of the stop block (5) and the gripper body (3) are the same.

3. The wafer gripper of claim 1, wherein: the cross sections of the positioning lug (1) and the first through hole (2) are both circular.

4. The wafer gripper as claimed in claim 3, wherein: the outer diameter of the positioning lug (1) is smaller than the inner diameter of the first communication hole (2).

5. The wafer gripper of claim 1, wherein: the gripper body (3) is a ceramic plate.

6. The wafer gripper as claimed in claim 1, wherein: multiple groups of vacuum air holes (7) are uniformly formed in the two sides of the interior of the gripper body (3), and the multiple groups of vacuum air holes (7) are respectively arranged in a staggered mode with the multiple groups of connecting grooves (6).