CN217507301U - Electronic device and heat dissipation metal structure for electronic device - Google Patents
Electronic device and heat dissipation metal structure for electronic device Download PDFInfo
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- CN217507301U CN217507301U CN202220042239.5U CN202220042239U CN217507301U CN 217507301 U CN217507301 U CN 217507301U CN 202220042239 U CN202220042239 U CN 202220042239U CN 217507301 U CN217507301 U CN 217507301U
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Abstract
The utility model provides an electronic device and be used for electronic device's heat dissipation metal structure, because the upper and lower surface welding of chip has the heat dissipation body among the electronic device, the heat dissipation body sets up to circular thin slice, is provided with the locating hole group at the edge of heat dissipation body, is used for wearing into the locating pin in the locating hole group, the locating hole group comprises four the same breachs, and two liang of a set ofly is in the marginal symmetric distribution of heat dissipation body, when inserting the locating pin cooperation in every breach of locating hole group, just can be quick with the chip restriction in the inside preset position of heat dissipation body, reduce manual operation, raise the efficiency, reduction in production cost. Meanwhile, the surface area of the heat dissipation body is large, so that the chip can be protected from being collided while heat dissipation can be better achieved, and the requirements for chip protection and reliability are met.
Description
Technical Field
The present application relates to the field of semiconductors, and more particularly, to an electronic device and a heat-dissipating metal structure for the same.
Background
Transient suppression diodes are widely used for protection of semiconductors and sensitive devices, and are generally used for secondary protection, secondary protection behind gas discharge tubes, and primary protection of circuits directly.
As basic circuit elements, the market demand of diodes is very large, and with the development of the market, the application field of semiconductor products develops towards two directions, one is thinner and thinner, so that the size of circuit protection devices is smaller and smaller, and the devices develop towards miniaturization; meanwhile, in some fields, the functional integration level is higher and higher, the power of the circuit is higher and higher, especially in the communication field and the automobile field, along with the development of a 5G communication base station and a new energy automobile, the high-power and high-reliability circuit protection device is more and more required, and the high-power and high-surge absorption capacity of the device is dual required. The TVS power is increased more and more, the chip size of a product is increased correspondingly, the chip area is increased, the difficulty of the anti-packaging stress capability and the heat dissipation capability of the product is increased more and more, the chip area and the material are increased, the production efficiency of a device is reduced, and the production cost is increased.
Therefore, it is desirable to provide an electronic device structure that can meet the requirements for chip protection, reliability and heat dissipation capability, and can improve the production efficiency and reduce the production cost.
SUMMERY OF THE UTILITY MODEL
The application provides an electronic device structure, when can satisfying all having the requirement to chip protection, reliability and heat-sinking capability, still help improving production efficiency, reduction in production cost.
According to an aspect of the present application, there is provided in one embodiment a heat dissipating metal structure for an electronic device, comprising:
the radiating body is a circular sheet, the edge of the radiating body is provided with a positioning hole group, and a positioning pin can be inserted into the positioning hole group;
the positioning hole group is composed of four same notches, every two notches are in a group, the edges of the heat dissipation body are symmetrically distributed, and the positioning pins are correspondingly inserted into the positioning hole group and can limit the chips at preset positions of the heat dissipation body.
Optionally, the edge of the heat dissipation body has two sets of positioning hole sets, which are a first positioning hole set and a second positioning hole set, respectively, where the first positioning hole set is used to define a chip with a first shape, and the second positioning hole set is used to define a chip with a second shape.
Optionally, a straight line where the first positioning hole group is located and a straight line where the second positioning hole group is located are crossed, the first-shaped chip is a regular quadrilateral chip, and the first positioning hole group is used for limiting two diagonal positions of the first-shaped chip; the second shaped chip is a regular hexagon chip, and the second positioning hole group is used for defining a symmetrical angular position of the second shaped chip.
Optionally, the diameter of the heat dissipation body is 10mm, the side length of the first-shaped chip is 6.7mm, the diameter of the notch in the first positioning hole group is 0.8mm, and the distance between two adjacent notches is 1.6 mm; the side length of the chip with the second shape is 8.2mm, the diameter of each notch in the second positioning hole group is 0.6mm, and the distance between every two adjacent notches is 1.8 mm.
Optionally, the heat dissipation body is made of metal copper; the notch of the positioning hole group is a through hole penetrating through the thickness of the heat dissipation body or a groove not penetrating through the notch.
Optionally, the outer surface of the heat dissipation body is provided with a silver plating layer, and the thickness of the silver plating layer is 2.5 μm to 5 μm.
According to an aspect of the present application, there is provided in an embodiment an electronic device including: a chip having a bottom surface and a top surface opposite the bottom surface;
the bottom surface and the top surface are respectively welded with any one of the heat dissipation bodies correspondingly.
Optionally, the heat dissipation body further comprises device pins welded on the surface of the heat dissipation body, the device pins are provided with welding parts and connecting line parts, the welding parts and the connecting line parts form bending angles, the welding parts are attached to the surface of the heat dissipation body for welding, and the connecting line parts extend out of the heat dissipation body and are parallel to each other.
Optionally, the diameter of the device pin is 0.7-1mm, and the surface of the welding part is provided with a spray coating, wherein the spray coating is 15% of tin and 85% of silver or a mixed material of 20% of tin and 80% of silver.
Optionally, the electronic device further comprises a coating layer, the coating layer is coated on the surface of the electronic device, part of the connecting line part is exposed, and the length of the coating layer is 3.5mm-6 mm.
According to the radiating metal structure for the chip and the electronic device of the embodiment, as the upper surface and the lower surface of the chip in the electronic device are welded with the radiating body, the radiating body is arranged into a circular sheet, the edge of the radiating body is provided with the positioning hole group, the positioning holes are used for penetrating the positioning pins, the positioning hole group consists of four same notches, every two of the notches are symmetrically distributed on the edge of the radiating body, when the positioning pins are matched and inserted into each notch of the positioning hole group, the chip can be quickly limited in the internal preset position of the radiating body, the manual operation is reduced, the efficiency is improved, and the production cost is reduced. Meanwhile, the surface area of the heat dissipation body is large, so that the chip can be protected from being collided while better heat dissipation is achieved, and the requirements for chip protection and reliability are met.
Drawings
Fig. 1 is a schematic view of a heat dissipation metal and a chip provided in an embodiment of the present invention;
fig. 2 is a schematic diagram of a heat dissipation metal and a chip according to another embodiment of the present invention;
fig. 3 is a schematic diagram of an electronic device provided in an embodiment of the present invention;
fig. 4 is a schematic diagram of an electronic device provided in another embodiment of the present invention;
fig. 5 is a schematic diagram of a device pin structure provided in an embodiment of the present invention.
Detailed Description
The present application will be described in further detail below with reference to the accompanying drawings by way of specific embodiments. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.
Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments, and the operation steps involved in the embodiments may be interchanged or modified in order as will be apparent to those skilled in the art. Accordingly, the description and drawings are merely for clarity of description of certain embodiments and are not intended to necessarily refer to a required composition and/or order.
The ordinal numbers used herein for the components, such as "first," "second," etc., are used merely to distinguish between the objects described, and do not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).
As known from the background art, because the power of the current semiconductor device is large, heat dissipation is required, in order to ensure heat dissipation, the surface area of the heat dissipation metal needs to be as large as possible, and in order to ensure that the chip is not damaged by stress, when the heat dissipation metal is soldered on the chip, the chip and the heat dissipation metal need to be placed in the middle as much as possible, and the heat dissipation metal in the prior art is generally the same as the surface of the chip in shape, and the chip is generally a regular quadrangle or a regular hexagon, and in the manufacturing process, labor energy is also required to be consumed in order to ensure that the chip and the heat dissipation metal can be aligned, which also makes the manufacturing efficiency lower.
In this embodiment, a structure that can be used for radiating heat dissipation metal of chip is provided, and the heat dissipation body sets up to circular thin slice, is provided with the locating hole group at the edge of heat dissipation body, is used for wearing into the locating pin in the locating hole group, the locating hole group comprises four the same breachs, and two liang of a set of is at the marginal symmetric distribution of heat dissipation body, when inserting the locating pin cooperation in every breach of locating hole group, just can be quick with the chip restriction in the inside preset position of heat dissipation body, reduce manual operation, raise the efficiency, reduction in production cost. Meanwhile, the surface area of the heat dissipation body is large, so that the chip can be protected from being collided while better heat dissipation is achieved, and the requirements for chip protection and reliability are met.
As shown in fig. 1 or fig. 2, the present embodiment provides a heat dissipation metal structure for an electronic device, which includes a heat dissipation body 100, where the heat dissipation body 100 is a circular thin plate, and the edge of the heat dissipation body 100 has a positioning hole set, and a positioning pin can be inserted into the positioning hole set. The positioning hole group is composed of four same notches, and every two positioning hole groups are symmetrically distributed on the edge of the heat dissipation body 100. When the positioning pins are inserted into the positioning hole groups, the chips can be limited to the preset positions of the heat dissipation body 100.
In this embodiment, the heat dissipation body 100 is made of copper, and copper has good heat dissipation and heat conduction capabilities.
In this embodiment, the outer surface of the heat dissipation body 100 is further covered with a silver plating layer, and the thickness of the silver plating layer is 2.5 μm to 5 μm. The silver coating can be better conductive, and the silver coating with the thickness of 2.5-5 mu m can be better welded or routing to improve the performance of the electronic device.
The positioning pin refers to a stainless steel rod body which can be inserted into the positioning hole group and has a certain length. The positioning hole group is matched for use.
The heat dissipation body 100 is set to be circular, the circular contact area is large, heat dissipation is facilitated, and in the subsequent application, the positioning hole group limits the chip in the inside of the heat dissipation body 100, namely the area of the heat dissipation body 100 is larger than the area of the surface of the chip, so that the chip can be protected from colliding with the heat dissipation surface while the heat dissipation surface is larger, the damage of external mechanical collision to the chip is avoided, and the stability of the device is improved.
In this embodiment, the edge of the heat dissipation body 100 has two different sets of positioning holes, namely a first positioning hole set 110 for defining a first shape of the chip 200 and a second positioning hole set 120 for defining a second shape of the chip 201. The first positioning hole group 110 and the second positioning hole group 120 are disposed on the same heat dissipation body 100, so that the same heat dissipation body 100 can be used in the packaging process of chips with two shapes, and the production cost can be greatly saved.
In some embodiments, while meeting the design and application requirements, the heat dissipation body 100 may further include two or more positioning hole sets, which may meet the requirements of packaging technologies for a wider variety of chips.
In this embodiment, the straight line of the first positioning hole set 110 on the heat dissipation body 100 is crossed with the straight line of the second positioning hole set 120.
Referring to fig. 1, when the first shaped chip 200 is a regular quadrilateral chip, the first positioning hole set 110 can define two diagonal positions of the regular quadrilateral, so that the regular quadrilateral can be defined at a predetermined position of the heat dissipation body 100 by inserting the corresponding positioning pin a into the first positioning hole.
Referring to fig. 2, when the second-shaped chip 201 is a regular hexagon-shaped chip, the second positioning hole set 120 can define a symmetrical angular position of the second-shaped chip 201, so that the regular hexagon can be defined at a predetermined position of the heat dissipation body 100 by the corresponding insertion positioning pin B in the second positioning hole.
It can be understood that the notches of the positioning hole sets are through holes penetrating the thickness of the heat dissipating body or grooves not penetrating the thickness of the heat dissipating body, in this embodiment, in order to facilitate the convenience of manufacturing the positioning hole sets, the depth and diameter of the notches in each positioning hole set are the same, that is, the positioning hole sets may be grooves that do not completely penetrate the thickness of the heat dissipating body. And the height of the positioning pin is consistent, so that the position of placing the chip can be ensured to be more accurate when the positioning pin is used.
For example, in the present embodiment, the diameter of the heat dissipation body 100 is 10mm, the diameter of the notch in the first positioning hole set 110 is 0.8mm, and the distance between two adjacent notches is 1.6mm, wherein the depth of the notch in the first positioning hole set 110 is 0.8 mm. The diameter of the corresponding positioning pin in the first positioning hole group 110 is 0.7mm, and the height is 3mm-5 mm; the chip 200 adapted to the first shape is a regular quadrangle with a side of 6.7 mm.
The diameter of the notches in the second positioning hole set 120 is 0.6mm, and the distance between two adjacent notches is 1.8mm, wherein the depth of the notches in the second positioning hole set 120 is 0.6 mm. The diameter of the corresponding positioning pin in the second positioning hole group 120 is 0.5mm, and the height thereof is 3mm-5 mm; the chip 201 adapted to the second shape is a regular hexagon with a side length of 8.2 mm.
In some embodiments, when the notch of the positioning hole group is a through hole penetrating through the thickness of the heat dissipation body, the heat dissipation body does not need to be divided into a back side and a front side when in use, and the application effect can be achieved more quickly.
Fig. 3 and 4 are perspective views of an electronic device structure provided in the present embodiment. Referring to fig. 3 or 4, the electronic device structure provided in the present embodiment includes: a chip having a bottom surface and a top surface opposite the bottom surface. The bottom surface and the top surface are respectively welded with the heat dissipation body 100 described in the embodiment.
For example, the chip is a TVS chip, which may be a unidirectional TVS chip, a bidirectional TVS chip, a square chip, or a hexagon chip. The bottom surface and the top surface of the TVS chip are respectively and correspondingly provided with the heat dissipation body 100, a welding layer is arranged between the heat dissipation body 100 and the bottom surface or the top surface, the welding layer can be 0.05mm-0.08mm in thickness, and the welding layer comprises 5% of tin, 95% of lead or 5% of tin, 92.5% of lead and 2.5% of silver.
Since the heat dissipation body 100 is provided as a circular thin sheet, the outer surface thereof may be plated with a silver layer. Be provided with the locating hole group at the edge of heat dissipation body 100, be used for wearing into the locating pin in the locating hole group, the locating hole group comprises four the same breachs, two liang of a set ofly, at the edge symmetric distribution of heat dissipation body 100, when placing the TVS chip between two heat dissipation bodies 100 from top to bottom, when the locating pin cooperation is inserted in every breach of two heat dissipation body 100's locating hole groups from top to bottom, just can be quick with TVS chip restriction between two heat dissipation bodies 100 and be located the position placed in the middle, the manual operation that can significantly reduce, the efficiency is improved, the production cost is reduced, and, make the shape of whole device be circular, be convenient for follow-up processing becomes electronic device.
Referring to fig. 5, in this embodiment, the electronic device further includes a device pin 300 soldered on the surface of the heat dissipation body 100, the device pin 300 has a soldering portion 301 and a wire portion 302, the soldering portion 301 and the wire portion 302 form a bending angle, the angle formed by the soldering portion 301 and the wire portion 302 is 135 °, the soldering portion 301 is attached to the surface of the heat dissipation body 100 for soldering, and the wire portions 302 extend out of the heat dissipation body 100 and are parallel to each other.
The diameter of the device pin 300 is 0.7-1mm, and the surface of the welding part 301 is provided with a spray coating which is a mixed material of 15% of tin and 85% of silver or a mixed material of 20% of tin and 80% of silver.
The surface layer of the electronic device is also provided with a coating layer, the coating layer is made of epoxy resin, can play an insulating role, coats the surface of the electronic device, exposes part of the connecting line part 302, and the length of the exposed connecting line part 302 is 3.5mm-6 mm.
The electronic device structure in the embodiment has good heat conduction and heat dissipation capacity, and can also play a role in protecting the chip and ensure the stability of the electronic device.
It is right to have used specific individual example above the utility model discloses expound, only be used for helping to understand the utility model discloses, not be used for the restriction the utility model discloses. To the technical field of the utility model technical personnel, the foundation the utility model discloses an idea can also be made a plurality of simple deductions, warp or replacement.
Claims (10)
1. A heat dissipating metal structure for an electronic device, comprising:
the radiating body is a circular sheet, the edge of the radiating body is provided with a positioning hole group, and a positioning pin can be inserted into the positioning hole group;
the positioning hole group is composed of four same notches, every two notches are in a group, the edges of the heat dissipation body are symmetrically distributed, and the positioning pins are correspondingly inserted into the positioning hole group and can limit the chips at preset positions of the heat dissipation body.
2. The heat dissipating metal structure of claim 1, wherein the heat dissipating body edge has two sets of positioning holes, a first set of positioning holes for defining a first shape of chip and a second set of positioning holes for defining a second shape of chip.
3. The heat-dissipating metal structure of claim 2, wherein a straight line of the first positioning hole group crosses a straight line of the second positioning hole group, the first shaped chip is a regular quadrilateral chip, and the first positioning hole group is used for defining two diagonal positions of the first shaped chip; the second shaped chip is a regular hexagon chip, and the second positioning hole group is used for defining a symmetrical angular position of the second shaped chip.
4. The heat dissipating metal structure of claim 3, wherein the heat dissipating body has a diameter of 10mm, the first shape chip has a side length of 6.7mm, the first positioning hole group has notches with a diameter of 0.8mm, and the distance between two adjacent notches is 1.6 mm; the side length of the chip with the second shape is 8.2mm, the diameter of each notch in the second positioning hole group is 0.6mm, and the distance between every two adjacent notches is 1.8 mm.
5. The heat dissipating metal structure of claim 1, wherein the heat dissipating body is made of copper; the notch of the positioning hole group is a through hole penetrating through the thickness of the heat dissipation body or a groove not penetrating through the notch.
6. The heat dissipating metal structure of claim 1, wherein the outer surface of the heat dissipating body has a silver plating layer having a thickness of 2.5 μm to 5 μm.
7. An electronic device, comprising: a chip having a bottom surface and a top surface opposite the bottom surface;
the bottom surface and the top surface are respectively welded with a heat dissipation body correspondingly, the heat dissipation body is a circular sheet, a positioning hole group is arranged on the edge of the heat dissipation body, and a positioning pin can be inserted into the positioning hole group.
8. The electronic device according to claim 7, further comprising device pins soldered to the surface of the heat dissipating body, wherein the device pins have soldering portions and connecting portions, the soldering portions and the connecting portions form bending corners, the soldering portions are soldered to the surface of the heat dissipating body, and the connecting portions extend out of the heat dissipating body and are parallel to each other.
9. The electronic device of claim 8, wherein the device pin diameter is 0.7-1mm and the solder portion surface has a spray coating.
10. The electronic device according to claim 8, further comprising a coating layer which covers the surface of the electronic device and exposes a portion of the wire connecting portion, wherein the length of the coating layer is 3.5mm to 6 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220042239.5U CN217507301U (en) | 2022-01-06 | 2022-01-06 | Electronic device and heat dissipation metal structure for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220042239.5U CN217507301U (en) | 2022-01-06 | 2022-01-06 | Electronic device and heat dissipation metal structure for electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN217507301U true CN217507301U (en) | 2022-09-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220042239.5U Active CN217507301U (en) | 2022-01-06 | 2022-01-06 | Electronic device and heat dissipation metal structure for electronic device |
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| CN (1) | CN217507301U (en) |
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- 2022-01-06 CN CN202220042239.5U patent/CN217507301U/en active Active
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