CN217503859U - Semiconductor fan - Google Patents

Abstract

The present disclosure relates to a semiconductor fan, the fan comprising: the air conditioner comprises a shell, wherein an air outlet duct and a heat dissipation duct are formed in the shell; the semiconductor heat exchange sheet is arranged in the shell, the first variable temperature surface of the semiconductor heat exchange sheet faces the air outlet duct, and the second variable temperature surface faces the heat dissipation duct; a humidifying assembly located within the housing; a humidifying assembly comprising: the first water storage cavity is positioned in the air outlet duct and is used for collecting condensed water generated by the first temperature changing surface of the semiconductor heat exchange sheet; the second water storage cavity is positioned in the heat dissipation air duct, is mutually isolated from the first water storage cavity and is used for collecting condensed water generated by the second temperature change surface of the semiconductor heat exchange sheet; the one-way circulation piece is arranged between the first water storage cavity and the second water storage cavity and is used for allowing the condensed water in the second water storage cavity to flow into the first water storage cavity in a one-way mode; and the humidifying unit is connected with the first water storage cavity and is used for humidifying by utilizing the condensed water in the first water storage cavity.

Description

Semiconductor fan

Technical Field

The present disclosure relates to a household electrical appliance, and more particularly, to a semiconductor fan.

Background

With the development of science and technology and the improvement of living standard, people have higher and higher requirements on indoor environment, and environment conditioning equipment (such as an air conditioner, a fan and the like) needs to have not only a refrigerating function and a heating function but also a humidifying function.

In the related art, a semiconductor heat exchanger fin is arranged in a semiconductor fan, and the semiconductor heat exchanger fin is used for changing the temperature of wind blown out by the semiconductor fan, so that cooling or heating is realized.

Because the semiconductor fan does not have a humidifying function, a user needs to additionally equip a humidifier, and the common adjustment of the environment temperature and the environment humidity is realized through the matching work of the humidifier and the semiconductor fan; so that the use cost of the user increases.

Disclosure of Invention

To overcome the problems in the related art, the present disclosure provides a semiconductor fan.

According to a first aspect of the embodiments of the present disclosure, there is provided a semiconductor fan, including:

the air conditioner comprises a shell, wherein an air outlet duct and a heat dissipation duct are formed in the shell;

the semiconductor heat exchange sheet is arranged in the shell, the first variable temperature surface of the semiconductor heat exchange sheet faces the air outlet duct, and the second variable temperature surface of the semiconductor heat exchange sheet faces the heat dissipation duct;

a humidifying assembly located within the housing; the humidification assembly, comprising:

the first water storage cavity is positioned in the air outlet duct and is used for collecting condensed water generated by the first temperature changing surface of the semiconductor heat exchange sheet;

the second water storage cavity is positioned in the heat dissipation air duct, is mutually isolated from the first water storage cavity and is used for collecting condensed water generated by the second temperature changing surface of the semiconductor heat exchange plate;

the one-way circulation piece is arranged between the first water storage cavity and the second water storage cavity and is used for allowing condensed water in the second water storage cavity to flow into the first water storage cavity in a one-way mode;

and the humidifying unit is connected with the first water storage cavity and is used for humidifying by utilizing the condensed water in the first water storage cavity.

Optionally, the first reservoir chamber and the second reservoir chamber are juxtaposed and spaced apart by a first sidewall of the second reservoir chamber; the collecting port of the second water storage cavity is higher than the collecting port of the first water storage cavity;

the one-way flow element comprising: at least one circulation hole is arranged on the first side wall of the second water storage cavity, the position of the circulation hole on the first side wall is higher than that of the first water storage cavity, and the circulation hole is used for allowing the condensed water in the second water storage cavity to flow into the first water storage cavity through the circulation hole.

Optionally, the humidification unit comprises:

a water-absorbing portion comprising: a water absorption end and a diffusion end;

the water suction end is arranged in the first water storage cavity, is used for absorbing condensed water in the first water storage cavity and diffuses to the diffusion end;

the diffusion end is used for humidifying the air communicated to the diffusion end by utilizing the condensed water.

Optionally, the position of the divergent end of the water intake section is adjustable;

when the semiconductor fan is in a refrigerating state, the diffusion end of the water absorption part is positioned in the heat dissipation air channel;

when the semiconductor fan is in a heating state, the diffusion end of the water absorption part is positioned in the air outlet duct.

Optionally, the fan includes:

and the fan assembly is rotatably arranged in the shell and used for adjusting the position of the diffusion end of the water absorption part by utilizing output airflow at different air outlet angles.

Optionally, the fan includes:

and the control assembly is arranged in the shell, is connected with the fan assembly and is used for controlling the air outlet angle of the fan assembly after detecting a humidification opening instruction.

Optionally, the fan includes:

the temperature and humidity sensor is arranged at the air inlet of the shell and used for detecting the temperature and the humidity of air circulating into the shell;

and the control assembly is connected with the temperature and humidity sensor and used for controlling the air outlet angle of the fan assembly based on the temperature and the humidity detected by the temperature and humidity sensor.

Optionally, the control assembly is configured to:

and controlling the rotating speed of the fan assembly based on the fan adjusting instruction.

Optionally, the fan includes:

the first radiator is arranged in the air outlet duct, is connected with the first temperature changing surface of the semiconductor heat exchange fin and is used for performing heat exchange between air circulating in the air outlet duct and the first temperature changing surface of the semiconductor heat exchange fin;

the second radiator is arranged in the radiating air duct, is connected with the second temperature changing surface of the semiconductor heat exchange sheet and is used for exchanging heat between air circulating in the radiating air duct and the second temperature changing surface of the semiconductor heat exchange sheet;

the heat dissipation area of the first radiator is larger than that of the second radiator.

Optionally, the cross-sectional area of the air outlet duct is larger than that of the heat dissipation duct.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

this disclosed embodiment is through set up first water storage chamber and second water storage chamber respectively in the air-out wind channel and the heat dissipation wind channel at semiconductor fan, utilize first water storage chamber and second water storage chamber to collect semiconductor fan refrigeration respectively or when heating, the comdenstion water that the semiconductor heat exchanger fin produced, and make the comdenstion water of first water storage chamber and second water storage intracavity converge together through one-way circulation piece, directly utilize the comdenstion water to carry out humidification processing by humidification element, not only realize the effect of humidification, can realize recycling of comdenstion water again, need not the manual moisturizing of user, promote user's use and experience.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a first schematic structural diagram of a semiconductor fan according to an exemplary embodiment.

Fig. 2 is a schematic structural diagram illustrating a humidifying assembly according to an exemplary embodiment.

Fig. 3 is a schematic structural diagram ii of a semiconductor fan according to an exemplary embodiment.

Fig. 4 is a schematic structural diagram three of a semiconductor fan according to an exemplary embodiment.

Fig. 5 is a fourth schematic structural diagram of a semiconductor fan according to an exemplary embodiment.

In the above figures: 10, a semiconductor fan; 11, a housing; 12, an air outlet duct; 13, a heat dissipation air duct; 14, semiconductor heat exchange fins; 15, a humidifying component; 16, a fan assembly; 17, a control component; 18, a temperature and humidity sensor; 121, a first heat sink; 131, a second heat sink; 151, a first reservoir chamber; 152, a second water storage chamber; 153, one-way flow-through; 154, a humidifying unit; 153a, flow holes; 1541, a water-absorbing part; 1541a, water-absorbing end; 1541b, diffusion end.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.

The embodiment of the present disclosure provides a semiconductor fan, as shown in fig. 1, fig. 1 is a schematic structural diagram of a semiconductor fan according to an exemplary embodiment. The semiconductor fan 10 includes:

the air conditioner comprises a shell 11, wherein an air outlet duct 12 and a heat dissipation duct 13 are formed in the shell 11;

the semiconductor heat exchange fins 14 are arranged in the shell 11, and a first temperature change surface of each semiconductor heat exchange fin 14 faces the air outlet duct 12, and a second temperature change surface faces the heat dissipation duct 13;

a humidifying assembly 15 located within the housing 11; the humidifying assembly 15 comprises:

the first water storage cavity 151 is located in the air outlet duct 12 and is used for collecting condensed water generated by the first temperature change surface of the semiconductor heat exchange fin 14;

the second water storage cavity 152 is positioned in the heat dissipation air duct 13, is isolated from the first water storage cavity 151, and is used for collecting condensed water generated by the second temperature-changing surface of the semiconductor heat exchange fin 14;

a one-way flow element 153 arranged between the first water storage cavity 151 and the second water storage cavity 152 and used for allowing the condensed water in the second water storage cavity 152 to flow into the first water storage cavity 151 in one way;

and a humidifying unit 154 connected to the first water storage chamber 151, for performing a humidifying process using the condensed water in the first water storage chamber 151.

In an embodiment of the present disclosure, the semiconductor fan includes: a housing;

a first accommodating cavity and a second accommodating cavity are formed in the shell, and the first accommodating cavity is communicated with the second accommodating cavity;

the first accommodating cavity is provided with an air outlet duct and a heat dissipation duct which are mutually isolated, and the second accommodating cavity is provided with an air inlet; air flows into the shell through the air inlet and respectively flows to the air outlet duct and the heat dissipation duct.

It can be understood that the shell is internally provided with a partition board, and the first accommodating cavity is divided into an air outlet duct and a heat dissipation duct by the partition board.

In other embodiments, the air outlet duct and the heat dissipation duct form a predetermined angle therebetween.

Here, in order to reduce the influence of the air flow output by the heat dissipation air duct on the temperature of the air flow output by the air outlet duct, a preset angle may be formed between the air outlet duct and the heat dissipation air duct; the preset angle can be set according to actual requirements, and the embodiment of the disclosure does not limit the preset angle.

For example, the air outlet duct and the heat dissipation duct are in a V shape.

The semiconductor fan includes: the semiconductor heat exchange fins are arranged in the shell.

The semiconductor heat exchange sheet is located in the first accommodating cavity, the first variable temperature surface of the semiconductor heat exchange sheet faces the air outlet duct, and the second variable temperature surface of the semiconductor heat exchange sheet faces the heat dissipation duct.

Here, the partition plate may be provided with an opening communicating the air outlet duct and the heat dissipation duct, the semiconductor heat exchanger fin may be mounted in the opening, and the first variable temperature surface of the semiconductor heat exchanger fin faces the air outlet duct, and the second variable temperature surface of the semiconductor heat exchanger fin faces the heat dissipation duct. It can be understood that the air outlet duct and the heat dissipation duct are separated by the semiconductor heat exchange fins and the isolation plate in the embodiment of the disclosure.

The semiconductor heat exchange plate is an electronic component which generates cold and heat by using a thermoelectric effect (peltier effect); after the direct current is introduced into the semiconductor heat exchange plate, the refrigerating surface of the semiconductor heat exchange plate can absorb the heat of the surrounding environment, so that the refrigerating effect is realized; the heating surface of the semiconductor heat exchange plate can release heat to the surrounding environment, and the heating effect is achieved.

Here, when the semiconductor fan is in a cooling mode, the first temperature varying surface of the semiconductor heat exchanger plate may be a cooling surface, and the second temperature varying surface may be a heating surface; when the semiconductor fan is in a heating mode, the first temperature changing surface of the semiconductor heat exchange plate can be a heating surface, and the second temperature changing surface can be a cooling surface.

It should be noted that, the direction of the direct current passed through the semiconductor heat exchange plate changes, and the cooling surface and the heating surface of the semiconductor heat exchange plate also change accordingly. For example, if the electrical signal flowing through the semiconductor heat exchange plate is in a first current direction, the first temperature changing surface of the semiconductor heat exchange plate may be a cooling surface, and the second temperature changing surface may be a heating surface; if the electric signal flowing through the semiconductor heat exchange plate is in a second current direction, the first temperature changing surface of the semiconductor heat exchange plate can be a heating surface, and the second temperature changing surface can be a cooling surface, wherein the first current direction is opposite to the second current direction.

The semiconductor fan includes: and the humidifying assembly is arranged in the shell and is used for humidifying the air circulating in the shell.

Wherein, humidification subassembly includes: the humidifying device comprises a first water storage cavity, a second water storage cavity, a one-way circulating piece and a humidifying unit;

the first water storage cavity can be arranged in the air outlet duct and is close to the first temperature changing surface of the semiconductor heat exchange sheet; the first water storage cavity is used for collecting condensed water generated by the first temperature changing surface of the semiconductor heat exchange sheet.

The second water storage cavity can be arranged in the heat dissipation air duct and is close to the second temperature change surface of the semiconductor heat exchange sheet; the second water storage cavity is used for collecting condensed water generated by the second temperature changing surface of the semiconductor heat exchange sheet.

It can be understood that, when the semiconductor fan is in a cooling mode, the first temperature changing surface of the semiconductor heat exchange plate is a cooling surface, and the second temperature changing surface of the semiconductor heat exchange plate is a heating surface; water vapor in air circulating in the air outlet duct is condensed on the first temperature changing surface of the semiconductor heat exchange sheet to form condensed water; and the first water storage cavity is used for collecting condensed water generated by the first temperature changing surface of the semiconductor heat exchange sheet when the semiconductor fan is in a refrigerating mode.

When the semiconductor fan is in a refrigerating mode, the first temperature changing surface of the semiconductor heat exchange plate is a heating surface, and the second temperature changing surface of the semiconductor heat exchange plate is a refrigerating surface; water vapor in air circulating in the heat dissipation air duct is condensed on the second temperature changing surface of the semiconductor heat exchange sheet to form condensed water; and the second water storage cavity is used for collecting condensed water generated by the second temperature change surface of the semiconductor heat exchange sheet when the semiconductor fan is in a heating mode.

Here, the first reservoir chamber may be disposed at a bottom of the first temperature varying surface of the semiconductor heat exchanger fin, and the second reservoir chamber may be disposed at a bottom of the second temperature varying surface of the semiconductor heat exchanger fin.

It should be noted that, because the refrigerating surface of the semiconductor heat exchanger plate generates condensed water during the working process, the first water storage cavity and the second water storage cavity are respectively arranged in the air outlet duct and the heat dissipation duct, so that the condensed water on the first temperature varying surface and the condensed water on the second temperature varying surface of the semiconductor heat exchanger plate can respectively flow to the first water storage cavity and the second water storage cavity along the first temperature varying surface and the second temperature varying surface.

The surface of the first water storage cavity facing to the first temperature changing surface of the semiconductor heat exchange plate is inclined inwards, and a collection port is formed at the inclined position; the surface of the second water storage cavity facing to the second temperature changing surface of the semiconductor heat exchange plate is inclined inwards, and a collection port is formed at the inclined position.

It can be understood that the condensed water on the surface of the semiconductor heat exchange sheet can flow to the inclined surfaces of the first water storage cavity and the second water storage cavity along the semiconductor heat exchange sheet, flow into the collecting port along the inclined surfaces, and are respectively stored in the first water storage cavity and the second water storage cavity.

In some embodiments, the surface of the first water storage cavity facing the first temperature changing surface of the semiconductor heat exchange plate and the surface of the second water storage cavity facing the second temperature changing surface of the semiconductor heat exchange plate are respectively provided with an opening;

and the condensed water on the surface of the semiconductor heat exchange sheet flows into the first water storage cavity and the second water storage cavity respectively through the opening.

The one-way circulation piece is arranged between the first water storage cavity and the second water storage cavity and used for allowing condensed water in the second water storage cavity to flow to the first water storage cavity in a one-way mode and limiting the condensed water in the first water storage cavity to flow to the second water storage cavity.

Here, the one-way flow element may be set according to actual requirements, and the structure of the one-way flow element is not limited in the embodiments of the present disclosure.

For example, the one-way flow element includes: the device comprises a guide pipe and a one-way valve arranged in the guide pipe; and the guide pipe is used for communicating the first water storage cavity and the second water storage cavity, and the check valve is used for controlling the one-way circulation of condensed water from the second water storage cavity to the first water storage cavity.

The humidifying unit is connected with the first water storage cavity and is used for humidifying air circulating in the shell by utilizing condensed water in the first water storage cavity.

The humidification processing mode of the humidification unit can be set according to actual requirements, and the embodiment of the present disclosure does not limit this. For example, the condensed water in the first water storage cavity can be atomized to form water mist through the humidifying unit, and the water mist is discharged through the air outlet of the air outlet duct.

It can be understood that, when the semiconductor fan is in a cooling mode, the first temperature changing surface generates condensed water and flows into the first water storage cavity; and when the semiconductor fan is in a heating mode, the second temperature changing surface generates condensed water and flows into the second water storage cavity. Through one-way circulation piece, make the semiconductor fan is in the mode of refrigerating or heats the mode, and the comdenstion water that the semiconductor heat exchanger fin produced all finally flows into first retaining intracavity to the humidification unit utilizes the comdenstion water in the first retaining intracavity has not only realized recycling of comdenstion water, need not lead the outside of semiconductor fan to through the honeycomb duct with the comdenstion water that the semiconductor heat exchanger fin produced.

This disclosed embodiment is through set up first water storage chamber and second water storage chamber respectively in the air-out wind channel and the heat dissipation wind channel at semiconductor fan, utilize first water storage chamber and second water storage chamber to collect semiconductor fan refrigeration respectively or when heating, the comdenstion water that the semiconductor heat exchanger fin produced, and make the comdenstion water of first water storage chamber and second water storage intracavity converge together through one-way circulation piece, directly utilize the comdenstion water to carry out humidification processing by humidification element, not only realize the effect of humidification, can realize recycling of comdenstion water again, need not the manual moisturizing of user, promote user's use and experience.

Alternatively, as shown in fig. 2, fig. 2 is a schematic structural diagram of a humidifying assembly shown according to an exemplary embodiment. The first reservoir chamber 151 and the second reservoir chamber 152 are juxtaposed and spaced apart by a first side wall of the second reservoir chamber 152; the collection port of the second reservoir chamber 152 is higher than the collection port of the first reservoir chamber 151;

the one-way flow-through 153 includes: at least one flow hole 153a is arranged on the first side wall of the second water storage cavity 152, and the position of the flow hole 153a on the first side wall is higher than the collecting port of the first water storage cavity 151, so that the condensed water in the second water storage cavity 152 can flow into the first water storage cavity through the flow hole 153 a.

In the embodiment of the present disclosure, the first water storage cavity and the second water storage cavity are arranged in parallel, and the first water storage cavity and the second water storage cavity are separated by a first side wall of the second water storage cavity. It will be appreciated that the first reservoir chamber is flush with the first side wall of the second reservoir chamber.

The collecting opening of the second water storage cavity is higher than the collecting opening of the first water storage cavity.

Here, the height of the second reservoir chamber may be greater than the height of the first reservoir chamber such that the collection opening of the second reservoir chamber is higher than the collection opening of the first reservoir chamber. Or the placing position between the second water storage cavity and the first water storage cavity enables the collecting opening of the second water storage cavity to be higher than the collecting opening of the first water storage cavity.

In an embodiment of the present disclosure, the one-way flow element includes: at least one flow opening is provided in the first side wall of the second chamber and is positioned higher in the first side wall than the collection opening of the first chamber.

It should be noted that the flow opening is located at a position on the first side wall which is higher than the collection opening of the first reservoir chamber and lower than the collection opening of the second reservoir chamber. It will be appreciated that the position of the collection opening of the first reservoir chamber is above or just equal to the water level in the first reservoir chamber; and the position of the collecting port of the first water storage cavity is lower than the position of the flow hole on the second water storage cavity, so that the condensed water in the first water storage cavity can not flow into the second water storage cavity through the flow hole.

And when the water level of the condensed water stored in the second water storage cavity is higher than the position of the circulation hole, the condensed water in the second water storage cavity can flow into the first water storage cavity through the circulation hole, and the condensed water in the second water storage cavity stops flowing to the first water storage cavity until the water level of the condensed water in the second water storage cavity is lower than the position of the circulation hole.

According to the embodiment of the disclosure, the at least one circulation hole is arranged on the first side wall of the second water storage cavity, which is in contact with the first water storage cavity, so that the position of the circulation hole is higher than the collection port of the first water storage cavity, when the water level of the condensed water in the second water storage cavity is higher than the position of the circulation hole, the condensed water in the second water storage cavity can automatically flow into the first water storage cavity, and the humidifying element can conveniently perform humidification treatment based on the condensed water; on one hand, the condensed water generated under the refrigeration and heating conditions of the semiconductor fan can be fully utilized, the reuse of the condensed water is realized, and manual water supplement of a user is not needed; on the other hand, through the position setting of circulation hole, realize that the one-way circulation of the comdenstion water in the second retaining intracavity reaches first retaining chamber, reduces the spare part quantity in the semiconductor fan, reduces the volume of semiconductor fan.

Alternatively, as shown in fig. 2, the humidifying unit 154 includes:

the water absorbing portion 1541 includes: a water-absorbing end 1541a and a diffusing end 1541 b;

the water suction end 1541a is disposed in the first water storage cavity 151, and is configured to absorb condensed water in the first water storage cavity 151 and diffuse the condensed water to the diffusion end 1541 b;

the diffusion end 1541b is configured to humidify air flowing to the diffusion end 1541b by using the condensed water.

In an embodiment of the present disclosure, the humidification unit includes: a water-absorbing part;

here, the water absorption part may be made of a high polymer water absorption material, and has a strong water absorption property, so that condensed water in the first water storage cavity can be effectively absorbed.

The water absorbing portion includes: a water-absorbing end and a diffusion end.

The water suction end of the water suction part can be arranged in the first water storage cavity, and the water suction end can absorb the condensed water in the first water storage cavity and diffuse the absorbed condensed water to the diffusion end of the water suction part; the air circulating in the shell passes through the diffusion end of the water absorption part and takes away water molecules on the diffusion end to form humidifying air flow.

It can be understood that the water absorption part can be arranged in the air outlet duct, and the water absorption end absorbs the condensed water in the first water storage cavity and diffuses the absorbed condensed water to the diffusion end of the water absorption part; the air that circulates in the air outlet duct passes through the diffusion end forms the humidification air current to blow the humidification air current to the user through the air outlet in air outlet duct, realize semiconductor fan's humidification function, promote user's use and experience.

The embodiment of the disclosure sets up in first retaining intracavity through the end that absorbs water of the portion of will absorbing water, through the diffusion end that absorbs water the comdenstion water diffusion in the end with first retaining intracavity to the portion of absorbing water for the air in the circulation in air-out wind channel passes through during the diffusion end of the portion of absorbing water, take away the hydrone of diffusion end, thereby make the wind that the air-out wind channel blew off have certain humidity, realize the effect of humidification, promote user's use and experience, and realize semiconductor fan's humidification function through the portion of absorbing water, can effectively simplify the structure of humidification subassembly, reduce semiconductor fan's volume, improve semiconductor fan's portability.

Optionally, the position of the diffusion end of the water-absorbing portion is adjustable;

when the semiconductor fan is in a refrigerating state, the diffusion end of the water absorption part is positioned in the heat dissipation air channel;

when the semiconductor fan is in a heating state, the diffusion end of the water absorption part is positioned in the air outlet duct.

In the disclosed embodiment, the position of the diffusion end of the water absorption part is adjustable;

it is understood that the housing may include a rotating component, and the rotating component may be rotatably disposed between the air outlet duct and the heat dissipation duct; the first end of the rotating assembly is fixedly arranged on the separation plate between the air outlet duct and the heat dissipation duct, and the second end of the rotating assembly is connected with the diffusion end of the water absorption part; the second end can rotate relative to the first end, so that the diffusion end of the water absorption part is driven to rotate in the air outlet duct and the heat dissipation duct.

When the semiconductor fan is in a refrigerating state, the first temperature changing surface of the semiconductor heat exchange plate is a refrigerating surface, and the second temperature changing surface of the semiconductor heat exchange plate is a heating surface; air circulating through the air outlet duct is condensed on the first variable temperature surface of the semiconductor heat exchange sheet to form condensed water, and the condensed water flows into the first water storage cavity along the first variable temperature surface;

the water absorption end of the water absorption part absorbs the condensed water in the first water storage cavity and diffuses to the diffusion end of the water absorption part; at the moment, the rotating assembly controls the diffusion end of the water absorption part to rotate into the heat dissipation air channel, so that the circulating air in the heat dissipation air channel passes through the diffusion end of the water absorption part to form humidifying air flow,

Because the temperature of the comdenstion water of first retaining intracavity deposit is lower, the temperature of humidification air current is lower, the humidification air current with the second variable temperature face (the face of heating) of semiconductor heat exchanger fin carries out the heat exchange, can effectively reduce the temperature of second variable temperature face, improves the radiating efficiency of the second variable temperature face of semiconductor heat exchanger fin reduces the difference in temperature between the first variable temperature face and the second variable temperature face of semiconductor heat exchanger fin to reduce the electric quantity loss when the semiconductor fan is in the refrigeration mode.

When the semiconductor fan is in a heating state, the first temperature changing surface of the semiconductor heat exchange plate is a heating surface, and the second temperature changing surface of the semiconductor heat exchange plate is a refrigerating surface; and air circulating through the heat dissipation air duct is condensed on the second temperature change surface of the semiconductor heat exchange sheet to form condensed water, and flows into the second water storage cavity along the second temperature change surface.

When the water level of the condensed water stored in the second water storage cavity is higher than the flow hole of the second water storage cavity, the condensed water in the second water storage cavity flows into the first water storage cavity through the flow hole. The water absorption end of the water absorption part absorbs the condensed water in the first water storage cavity and diffuses to the diffusion end of the water absorption part; at the moment, the diffusion end of the water absorption part is controlled to rotate into the air outlet duct through the rotating assembly, so that air circulating in the air outlet duct passes through the diffusion end of the water absorption part to form humidifying air flow.

Because the condensate water needs to be stored for a period of time, the water level of the condensate water in the second water storage cavity can be higher than the circulation hole and can flow into the first water storage cavity, and the temperature of the condensate water flowing into the first water storage cavity from the second water storage cavity is close to the current ambient temperature; therefore, the temperature of the humidifying air flow cannot be obviously reduced, hot air can be output to a user, the humidity of the hot air can be effectively improved, and the use experience of the user is improved.

According to the embodiment of the disclosure, by adjusting the position of the diffusion end of the water absorption part, when the semiconductor fan is in a refrigeration mode, the temperature of the second variable temperature surface (heating surface) of the semiconductor heat exchange sheet in the heat dissipation air duct is reduced by using condensed water with lower temperature, the heat dissipation efficiency of the second variable temperature surface of the semiconductor heat exchange sheet is improved, and the temperature difference between the first variable temperature surface and the second variable temperature surface of the semiconductor heat exchange sheet is reduced, so that the electric quantity loss of the semiconductor fan in the refrigeration mode is reduced; when the semiconductor fan is in the heating mode, the condensed water flowing into the first water storage cavity from the second water storage cavity is utilized to humidify the hot air blown up from the air outlet channel, so that the humidity of the hot air is effectively improved, and the use experience of a user is improved.

Alternatively, as shown in fig. 1, the fan 10 includes:

and the fan assembly 16 is rotatably arranged in the shell 11 and used for adjusting the position of the diffusion end 1541b of the water absorption part 1541 by utilizing output air flows with different air outlet angles.

In an embodiment of the present disclosure, the fan includes: a fan assembly;

the fan assembly is rotatably arranged in the second accommodating cavity of the shell and is positioned between the air inlet of the shell and the water absorbing part.

It can be understood that, when the fan assembly rotates relative to the housing, the outlet angle of the outlet airflow of the fan assembly changes accordingly.

In the embodiment of the disclosure, if the output airflow of the rotated fan assembly deviates to the heat dissipation air duct; under the effect of the output airflow of the fan assembly, the diffusion end of the water absorption part moves into the heat dissipation air duct, and the air circulating in the heat dissipation air duct passes through the diffusion end of the water absorption part to form humidifying airflow.

If the output airflow of the rotated fan assembly deviates to the air outlet duct; under the effect of the output airflow of the fan assembly, the diffusion end of the water absorption part moves into the air outlet duct, and the air circulating in the air outlet duct passes through the diffusion end of the water absorption part to form humidifying airflow.

This disclosed embodiment utilizes the fan subassembly in the semiconductor fan, through changing the air-out angle of fan subassembly for the diffusion end of water absorption portion is in the change of position takes place under the effect of the output air current of fan subassembly, thereby realizes the humidification to the air of circulation in the different wind channels, can simplify the structure of humidification subassembly again, reduces the spare part quantity in the semiconductor fan, reduces the volume of semiconductor fan, improves the portability of semiconductor fan.

Optionally, as shown in fig. 1, the fan 10 includes:

the control assembly 17 is arranged in the shell 11, connected with the fan assembly 16 and used for controlling the air outlet angle of the fan assembly 16 after detecting a humidification opening instruction.

In an embodiment of the present disclosure, the semiconductor fan includes: a control component;

the control assembly is arranged in the shell, and the control assembly is connected with the fan assembly.

It should be noted that, a humidification button is arranged on the semiconductor fan, and when the humidification button is pressed, the control component receives a humidification starting instruction and controls the fan component to rotate so as to adjust the air outlet angle of the fan component. Or the semiconductor fan is in communication connection with the terminal equipment, and after the semiconductor fan receives a humidification starting instruction sent by the terminal equipment, the control assembly controls the fan assembly to rotate so as to adjust the air outlet angle of the fan assembly.

In the embodiment of the disclosure, after a humidification starting instruction is detected, the control component controls the fan component to rotate, so that the output airflow of the rotated fan component deflects to the air outlet duct; under the action of the output airflow of the fan assembly, the diffusion end of the water absorption part moves into the air outlet duct, and the air circulating in the air outlet duct passes through the diffusion end of the water absorption part to form humidifying airflow; the air outlet duct outputs humidifying air flow to realize the humidifying function.

When a humidification opening instruction is not detected or a humidification closing instruction is detected, namely the semiconductor fan is in a humidification closing state, the control assembly controls the fan assembly to rotate, so that the output airflow of the rotated fan assembly deflects to the heat dissipation air duct, under the action of the output airflow of the fan assembly, the diffusion end of the water absorption part is positioned in the heat dissipation air duct, and the air circulating in the heat dissipation air duct passes through the diffusion end of the water absorption part to form humidification airflow; the humidifying air flow circulates in the heat dissipation air duct and is output from the air outlet of the heat dissipation air duct, and the air humidity of the air flow output by the air outlet duct cannot be influenced.

In some embodiments, when a humidification start instruction is detected and the semiconductor fan is in a heating mode, the control component controls the fan component to rotate, so that the output airflow of the rotated fan component deviates to the air outlet duct.

It can be understood that when the semiconductor fan is in the heating mode, the first temperature changing surface of the semiconductor heat exchange plate is a heating surface, and the second temperature changing surface of the semiconductor heat exchange plate is a cooling surface; and air circulating through the heat dissipation air duct is condensed on the second variable temperature surface of the semiconductor heat exchange plate to form condensed water, and flows into the second water storage cavity along the second variable temperature surface.

When the water level of the condensed water stored in the second water storage cavity is higher than the flow hole of the second water storage cavity, the condensed water in the second water storage cavity flows into the first water storage cavity through the flow hole. The water absorption end of the water absorption part absorbs the condensed water in the first water storage cavity and diffuses to the diffusion end of the water absorption part; at the moment, the diffusion end of the water absorption part is controlled to rotate into the air outlet duct through the rotating assembly, so that air circulating in the air outlet duct passes through the diffusion end of the water absorption part to form humidifying air flow.

And because the temperature of water molecules in the diffusion end of the water absorption part approaches to the current ambient temperature, the temperature of the humidifying air flow cannot be reduced, so that hot air can be output to a user, the humidity of the hot air can be effectively improved, and the use experience of the user is improved.

In addition, when the semiconductor fan is in a refrigeration mode, if the diffusion end of the water absorption part moves into the air outlet duct, air circulating in the air outlet duct passes through the diffusion end of the water absorption part to form humidifying air flow; because the first temperature-changing surface of the semiconductor heat exchange plate is a refrigerating surface, water vapor in the humidifying air flow can be condensed on the first temperature-changing surface of the semiconductor heat exchange plate, and can release heat to the surrounding environment to influence the refrigerating effect of the semiconductor heat exchange plate. Therefore, when a humidification starting instruction is detected and the semiconductor fan is in a heating mode, the control assembly controls the fan assembly to rotate to start a humidification function.

This disclosed embodiment is through control assembly control the rotational position of fan subassembly, in order to change the air-out angle of fan subassembly makes the diffusion end of water absorption portion be in the change of position takes place under the effect of the output air current of fan subassembly to the realization is to the humidification of the air of circulation in the different wind channels, can simplify the structure of humidification subassembly again, reduces the spare part quantity in the semiconductor fan, reduces the volume of semiconductor fan, improves the portability of semiconductor fan.

Alternatively, as shown in fig. 3, fig. 3 is a schematic structural diagram ii of a semiconductor fan according to an exemplary embodiment. The fan 10 includes:

the temperature and humidity sensor 18 is arranged at the air inlet of the shell 11 and used for detecting the temperature and the humidity of air circulating into the shell 11;

and the control component 17 is connected with the temperature and humidity sensor 18 and used for controlling the air outlet angle of the fan component 16 based on the temperature and the humidity detected by the temperature and humidity sensor.

In an embodiment of the present disclosure, the semiconductor fan includes: a temperature and humidity sensor;

temperature and humidity sensor set up in the air intake department of casing, just temperature and humidity sensor with control assembly connects.

The temperature and humidity sensor is used for detecting the temperature and humidity of air flowing from the air inlet to the shell, and sending the detected temperature and humidity to the control assembly; the control assembly compares the temperature and the humidity detected by the temperature and humidity sensor with a preset temperature threshold and a preset humidity threshold.

When the air temperature detected by the temperature and humidity sensor is lower than the preset temperature threshold value, and the air humidity detected by the temperature and humidity sensor is larger than the preset humidity threshold value, the control assembly controls the electric signal flowing to the semiconductor heat exchange sheet to be switched to the second current direction, so that the semiconductor fan is switched to the heating mode.

When the air temperature detected by the temperature and humidity sensor is lower than the preset temperature threshold value and the air humidity detected by the temperature and humidity sensor is smaller than or equal to the preset humidity threshold value, the control assembly controls the fan assembly to rotate, so that the output airflow of the rotated fan assembly deflects to the air outlet duct;

under the action of the output airflow of the fan assembly, the diffusion end of the water absorption part moves into the air outlet duct, and the air circulating in the air outlet duct passes through the diffusion end of the water absorption part to form humidifying airflow; the air outlet duct outputs humidifying air flow to realize the humidifying function.

It should be noted that, because the temperature of the water molecules in the diffusion end of the water absorption part approaches to the current ambient temperature, the temperature of the humidifying air flow is not reduced, so that hot air can be output to a user, the humidity of the hot air can be effectively improved, and the use experience of the user is improved.

When the air temperature detected by the temperature and humidity sensor is higher than the preset temperature threshold value, the control assembly controls the electric signal which circulates to the semiconductor heat exchange sheet to be switched to a first current direction, and controls the fan assembly to rotate, so that the output airflow of the rotated fan assembly deflects to the heat dissipation air duct;

it can be understood that when the electric signal flowing to the semiconductor heat exchange fin is switched to the first current direction, the semiconductor fan is in a cooling mode; and under the effect of the output airflow of the fan assembly, the diffusion end of the water absorption part moves into the heat dissipation air duct, and the circulating air in the heat dissipation air duct passes through the diffusion end of the water absorption part to form humidifying airflow.

Because the temperature of the comdenstion water of first retaining intracavity deposit is lower, the temperature of humidification air current is lower, the humidification air current with the second variable temperature face (the face of heating) of semiconductor heat exchanger fin carries out the heat exchange, can effectively reduce the temperature of second variable temperature face, improves the radiating efficiency of the second variable temperature face of semiconductor heat exchanger fin reduces the difference in temperature between the first variable temperature face and the second variable temperature face of semiconductor heat exchanger fin to reduce the electric quantity loss when the semiconductor fan is in the refrigeration mode.

It should be noted that, if the semiconductor fan is in the cooling mode and the diffusion end of the water absorption part moves into the air outlet duct, the air circulating in the air outlet duct passes through the diffusion end of the water absorption part to form a humidified air flow; because the first temperature-changing surface of the semiconductor heat exchange plate is a refrigerating surface, water vapor in the humidifying air flow can be condensed on the first temperature-changing surface of the semiconductor heat exchange plate, and can release heat to the surrounding environment to influence the refrigerating effect of the semiconductor heat exchange plate. Therefore, when the semiconductor fan is in a cooling mode, the control assembly controls the fan assembly to rotate, so that the output airflow of the rotated fan assembly deviates to the heat dissipation air duct.

This disclosed embodiment is through setting up temperature and humidity sensor, utilizes the temperature and the humidity of circulation to the air in the casing that temperature and humidity sensor detected, controls according to temperature and humidity the rotational position of fan subassembly is in order to change the air-out angle of fan subassembly for the diffusion end of water absorption portion is in the position change takes place under the effect of the output air current of fan subassembly, thereby according to the temperature and the humidity of current environment, opens semiconductor fan's humidification function automatically, improves user's use and experiences.

Optionally, the control component is configured to:

and controlling the rotating speed of the fan assembly based on the fan adjusting instruction.

In the embodiment of the disclosure, the control component can control the rotating speed of the fan component, so as to adjust the air intake of the semiconductor fan.

The semiconductor fan is provided with a wind speed adjusting button, and when the wind speed adjusting button is pressed, the control assembly receives a wind speed adjusting instruction and controls the rotating speed of the fan assembly. Or the semiconductor fan is in communication connection with the terminal equipment, the semiconductor fan receives the wind speed adjusting instruction sent by the terminal equipment, and the control component controls the rotating speed of the fan component.

It can be understood that the effect of adjusting the temperatures of the first variable temperature surface and the second variable temperature surface of the semiconductor heat exchange sheet is achieved by adjusting the rotating speed of the fan assembly to change the air inlet volume of the air outlet duct and the heat dissipation duct and adjusting the heat exchange efficiency of the first variable temperature surface of the semiconductor heat exchange sheet in the air outlet duct and the heat exchange efficiency of the second variable temperature surface of the semiconductor heat exchange sheet in the heat dissipation duct.

Alternatively, as shown in fig. 4, fig. 4 is a schematic structural diagram three of a semiconductor fan according to an exemplary embodiment. The fan 10 includes:

the first radiator 121 is disposed in the air outlet duct 12, connected to the first temperature-changing surface of the semiconductor heat exchanger fin 14, and configured to perform heat exchange between air flowing through the air outlet duct 12 and the first temperature-changing surface of the semiconductor heat exchanger fin 14;

the second radiator 131 is arranged in the heat dissipation air duct 13, is connected with the second temperature-changing surface of the semiconductor heat exchange fin 14, and is used for performing heat exchange between air circulating in the heat dissipation air duct 13 and the second temperature-changing surface of the semiconductor heat exchange fin 14;

the heat dissipation area of the first radiator is larger than that of the second radiator.

In an embodiment of the present disclosure, the fan includes: a first heat sink and a second heat sink;

the first radiator is arranged in the air outlet duct and is connected with the first temperature changing surface of the semiconductor heat exchange sheet; and air circulating in the air outlet duct exchanges heat with the first temperature changing surface of the semiconductor heat exchange sheet through the first radiator.

The second radiator is arranged in the radiating air duct and is connected with the second temperature changing surface of the semiconductor heat exchange sheet; and air circulating in the heat dissipation air duct exchanges heat with the second temperature changing surface of the semiconductor heat exchange sheet through the second radiator.

It can be understood that, by using the first radiator and the second radiator, the heat exchange area of the semiconductor heat exchange fins for heat exchange with air is increased, and the cooling or heating efficiency of the semiconductor fan is improved.

Here, in order to increase the heat exchange amount between the semiconductor heat exchange fins and air, the first heat sink and the second heat sink may be filter-type heat sinks, heat pipe heat sinks, water-cooled heat sinks, or the like.

It should be noted that the semiconductor heat exchanger plate is a heat transfer tool, and when direct current is applied to the semiconductor heat exchanger plate, heat transfer can occur between two end surfaces of the semiconductor heat exchanger plate, and the heat is transferred from one end surface to the other end surface, so that a temperature difference is generated, and a cooling surface and a heating surface are formed.

However, because the semiconductor heat exchange plate has resistance, when current flows through the semiconductor heat exchange plate, heat is generated, and heat transfer is affected; and the heat between the anode and the cathode of the semiconductor heat exchange plate can also be reversely transferred through the air and the semiconductor material. When the temperature difference between the two end surfaces of the semiconductor heat exchange sheet reaches a certain value, the two heat transfer quantities are the same, a balance point is reached, and the positive heat transfer and the reverse heat transfer are mutually offset; the temperature of the semiconductor heat exchange plate can not be changed continuously.

When the semiconductor fan is in a refrigeration mode, the diffusion end of the water absorption part moves into the heat dissipation air channel, so that air circulating in the heat dissipation air channel passes through the diffusion end of the water absorption part to form humidifying air flow; the temperature of the second variable temperature surface of the semiconductor heat exchange plate is reduced by utilizing the humidifying air flow and the second radiator in the heat dissipation air duct, so that the temperature of the first variable temperature surface of the semiconductor heat exchange plate is reduced along with the reduction of the temperature of the first variable temperature surface of the semiconductor heat exchange plate, and the temperature of the first variable temperature surface of the semiconductor heat exchange plate is reduced to reach lower temperature; the refrigeration effect of the semiconductor fan is improved, and the electric quantity loss of the semiconductor fan in the refrigeration mode is reduced.

According to the embodiment of the disclosure, the first radiator and the second radiator are respectively arranged in the air outlet duct and the heat dissipation duct, and the first radiator and the second radiator are utilized to increase the heat exchange area of the semiconductor heat exchange fins for heat exchange with air, so that the refrigerating or heating efficiency of the semiconductor fan is improved; when the semiconductor fan is in a cooling mode, the temperature of the second variable temperature surface of the semiconductor heat exchange sheet is reduced by utilizing the humidifying air flow in the heat dissipation air duct and the second radiator, so that the temperature of the first variable temperature surface of the semiconductor heat exchange sheet is reduced along with the reduction of the temperature of the first variable temperature surface of the semiconductor heat exchange sheet, and the temperature of the first variable temperature surface of the semiconductor heat exchange sheet is reduced to reach lower temperature; the refrigeration effect of the semiconductor fan is improved, and the electric quantity loss of the semiconductor fan in a refrigeration mode is reduced.

Alternatively, as shown in fig. 5, fig. 5 is a schematic structural diagram of a semiconductor fan according to an exemplary embodiment. The cross-sectional area of the air outlet duct 12 is larger than that of the heat dissipation duct 13.

In the embodiment of the present disclosure, since the cross-sectional area of the air outlet duct is greater than the cross-sectional area of the heat dissipation duct, and the area of the air inlet of the air outlet duct corresponding to the air outlet side of the fan assembly is greater than the area of the air inlet of the heat dissipation duct corresponding to the air outlet side of the fan assembly, the air flow output by the fan assembly is greater than the air flow flowing to the air outlet duct.

It can be understood that the cross section of the air outlet duct is larger than the cross section of the heat dissipation duct, and the air inlet volume of the air outlet duct is larger than the air inlet volume of the heat dissipation duct, so that the heat exchange efficiency of the first temperature change surface of the semiconductor heat exchange fins in the air outlet duct is larger than the heat exchange efficiency of the second temperature change surface of the semiconductor heat exchange fins in the heat dissipation duct, and the refrigeration or heating effect of the semiconductor fan is improved.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims (10)

1. A semiconductor fan, comprising:

the air conditioner comprises a shell, wherein an air outlet duct and a heat dissipation duct are formed in the shell;

the semiconductor heat exchange sheet is arranged in the shell, the first variable temperature surface of the semiconductor heat exchange sheet faces the air outlet duct, and the second variable temperature surface of the semiconductor heat exchange sheet faces the heat dissipation duct;

a humidifying assembly located within the housing; the humidification assembly, comprising:

the first water storage cavity is positioned in the air outlet duct and is used for collecting condensed water generated by the first temperature changing surface of the semiconductor heat exchange sheet;

the second water storage cavity is positioned in the heat dissipation air duct, is mutually isolated from the first water storage cavity and is used for collecting condensed water generated by the second temperature change surface of the semiconductor heat exchange sheet;

the one-way circulation piece is arranged between the first water storage cavity and the second water storage cavity and is used for allowing condensed water in the second water storage cavity to flow into the first water storage cavity in a one-way mode;

and the humidifying unit is connected with the first water storage cavity and is used for humidifying by utilizing the condensed water in the first water storage cavity.

2. The fan of claim 1 wherein the first reservoir chamber and the second reservoir chamber are juxtaposed and spaced apart by a first sidewall of the second reservoir chamber; the collecting port of the second water storage cavity is higher than the collecting port of the first water storage cavity;

the one-way flow element comprising: at least one circulation hole is arranged on the first side wall of the second water storage cavity, the position of the circulation hole on the first side wall is higher than the collecting opening of the first water storage cavity, and the circulation hole is used for allowing the condensed water in the second water storage cavity to flow into the first water storage cavity through the circulation hole.

3. The fan as claimed in claim 1, wherein the humidifying unit comprises:

a water-absorbing portion comprising: a water absorption end and a diffusion end;

the water suction end is arranged in the first water storage cavity, is used for absorbing condensed water in the first water storage cavity and diffuses to the diffusion end;

the diffusion end is used for humidifying the air which flows to the diffusion end by utilizing the condensed water.

4. The fan of claim 3 wherein the position of the diverging end of the water intake section is adjustable;

when the semiconductor fan is in a refrigerating state, the diffusion end of the water absorption part is positioned in the heat dissipation air channel;

when the semiconductor fan is in a heating state, the diffusion end of the water absorbing part is positioned in the air outlet duct.

5. The fan as claimed in claim 4, comprising:

and the fan assembly is rotatably arranged in the shell and used for adjusting the position of the diffusion end of the water absorption part by utilizing output airflow at different air outlet angles.

6. The fan as claimed in claim 5, comprising:

and the control assembly is arranged in the shell, is connected with the fan assembly and is used for controlling the air outlet angle of the fan assembly after detecting a humidification opening instruction.

7. The fan as claimed in claim 6, comprising:

the temperature and humidity sensor is arranged at the air inlet of the shell and used for detecting the temperature and the humidity of air circulating into the shell;

and the control assembly is connected with the temperature and humidity sensor and used for controlling the air outlet angle of the fan assembly based on the temperature and the humidity detected by the temperature and humidity sensor.

8. The fan of claim 6, wherein the control assembly is configured to:

and controlling the rotating speed of the fan assembly based on the fan adjusting instruction.

9. The fan as claimed in claim 1, comprising:

the first radiator is arranged in the air outlet duct, is connected with the first temperature changing surface of the semiconductor heat exchange fin and is used for performing heat exchange between air circulating in the air outlet duct and the first temperature changing surface of the semiconductor heat exchange fin;

the second radiator is arranged in the radiating air duct, is connected with the second temperature changing surface of the semiconductor heat exchange fin and is used for exchanging heat between air circulating in the radiating air duct and the second temperature changing surface of the semiconductor heat exchange fin;

the heat dissipation area of the first radiator is larger than that of the second radiator.

10. The fan as claimed in claim 1, wherein the cross-sectional area of the outlet duct is larger than the cross-sectional area of the heat dissipating duct.

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