CN217489244U - Gun body of fascia gun and fascia gun - Google Patents

Abstract

The utility model discloses a rifle body and manadesma rifle of manadesma rifle, wherein, the rifle body of manadesma rifle includes: the rifle shell, semiconductor refrigeration piece and driver part, the rifle shell includes the main part shell, be formed with the installation area who is suitable for the massage head of installation manadesma rifle on the main part shell, the heat-conducting portion has on the main part shell, the semiconductor refrigeration piece is located in the rifle shell, the semiconductor refrigeration piece passes through heat-conducting portion and external heat transfer, driver part locates in the rifle shell and is suitable for the drive massage head, driver part and semiconductor refrigeration piece spaced apart the setting, and be connected with the bolster between driver part and the rifle shell. The utility model discloses the rifle body of manadesma rifle, through setting up drive assembly and semiconductor refrigeration piece interval and set up the bolster between drive assembly and rifle shell to reduce the influence of drive assembly produced vibration at the during operation to the semiconductor refrigeration piece, improve the reliability of semiconductor refrigeration piece, thereby prolong the life of semiconductor refrigeration piece.

Description

Gun body of fascia gun and fascia gun

Technical Field

The utility model relates to a manadesma rifle technical field specifically is a rifle body and manadesma rifle that relates to a manadesma rifle.

Background

The fascia gun is also called as a muscle fascia relaxing massage gun, and the massage head in the fascia gun can generate high-frequency vibration when the fascia gun works so as to stimulate the adhesion and the nodes between muscles and fascia, relieve the stiffness and the aching pain of the muscles, and increase the blood circulation and the motion range, thereby achieving the purpose of massage.

However, most fascia guns in the market can only realize the massage effect, and cannot perform cold compress or hot compress on the skin of a user, so that the user experience is reduced.

In order to solve the problems, a multifunctional fascia gun continuously appears on the market, and a semiconductor refrigerating piece, also called a thermoelectric refrigerating piece, is arranged in the multifunctional fascia gun, and is a heat pump. By utilizing the Peltier effect of the semiconductor materials (namely when current flows through a joint formed by two different conductors, the heat release and heat absorption phenomena are generated at the joint, and the heat release or heat absorption magnitude is determined by the current magnitude), when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, so that the purpose of refrigeration or heating is achieved, the fascia gun can massage a user, and cold compress or hot compress can be performed on the skin of the user. However, when the fascia gun performs massage work, the driving component for driving the massage head to work in the fascia gun generates high-frequency vibration, and the high-frequency vibration easily generates vibration impact on the semiconductor refrigeration sheet, so that the semiconductor refrigeration sheet is adversely affected, and the service life of the semiconductor refrigeration sheet is shortened.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a rifle body of manadesma rifle, the drive part that the internal setting of rifle can not too much cause the influence to the semiconductor refrigeration piece at produced high-frequency vibration of during operation, prolongs the life of semiconductor refrigeration piece.

The utility model discloses still aim at providing the manadesma rifle that has above-mentioned rifle body.

According to the utility model discloses rifle body of manadesma rifle, include: a gun housing including a main body housing formed with a mounting area adapted to mount a massage head of the fascial gun, the main body housing having a heat conduction portion thereon; the semiconductor refrigeration piece is arranged in the gun shell and exchanges heat with the outside through the heat conducting part; the driving part is arranged in the gun shell and is suitable for driving the massage heads, the driving part and the semiconductor refrigeration sheet are arranged at intervals, and a buffer piece is connected between the driving part and the gun shell.

According to the gun body of the fascia gun provided by the embodiment of the utility model, the semiconductor refrigeration piece is arranged in the gun shell and is used for enriching the functions of the fascia gun, so that the fascia gun has diversified functions and the user experience is improved; through setting up drive unit and semiconductor refrigeration piece interval, avoid drive unit produced high-frequency vibration direct transmission to semiconductor refrigeration piece when the first vibration of drive massage, make the stable in structure of semiconductor refrigeration piece, and be connected with the bolster between drive unit and the rifle shell, when the high-frequency vibration transmission that drive unit produced is to on the bolster, the bolster can absorb partial vibration and strike, reduce the influence of high-frequency vibration to the rifle shell, correspondingly also reduced the influence of drive unit to semiconductor refrigeration piece when high-frequency motion, further make semiconductor refrigeration piece stable in structure, the life of extension semiconductor refrigeration piece.

In some examples, a mounting seat is arranged in the gun shell, the buffer is connected between the mounting seat and the gun shell, and the driving part is mounted on the mounting seat.

In some examples, the mounting has a plurality of connecting portions thereon, and each connecting portion is connected to the gun housing by the buffer.

In some examples, the bumper is a spring or a rubber pad.

In some examples, the main body case includes a first end and a second end that are disposed opposite to each other, the mounting region is formed on the first end, the heat conduction portion is located between the first end and the second end, the semiconductor refrigeration sheet is disposed opposite to the heat conduction portion, and the driving member is disposed on a side of the semiconductor refrigeration sheet away from the heat conduction portion.

In some examples, the gun housing further includes a handle housing having one end connected to the body housing between the first and second ends and disposed on opposite sides of the body housing from the thermally conductive portion, the drive member being located between the semiconductor chilling plate and the handle housing.

In some examples, the body case includes a first case portion and a second case portion that are oppositely disposed and spliced, the semiconductor refrigeration sheet is mounted to the first case portion, and the driving part is mounted to the second case portion.

In some examples, a heat dissipation air duct is formed in the gun housing, the heat dissipation air duct is disposed between the first end and the second end, and the semiconductor chilling plate is disposed in the heat dissipation air duct.

In some examples, the heat dissipation duct includes an air outlet and an air inlet, one of the air outlet and the air inlet being disposed on the first end, and the other of the air outlet and the air inlet being disposed on the second end.

In some examples, the gun body further comprises: and the heat dissipation assembly is arranged in the heat dissipation air duct and is positioned between the semiconductor refrigeration piece and the driving part.

In some examples, the heat dissipation assembly includes a heat sink disposed opposite the semiconductor chilling plates and in heat exchange with the semiconductor chilling plates.

In some examples, the heat dissipation assembly further includes a heat dissipation fan configured to draw air from the air inlet through the heat dissipation air duct and supply air from the air outlet.

In some examples, the gun body further includes a wind shielding sheet, and the wind shielding sheet is disposed on a side, away from the semiconductor refrigeration sheet, between the heat dissipation fan and the heat sink and is fixedly connected to the gun housing.

In some examples, the gun housing has an accommodating hole therein corresponding to the heat conducting portion, and the semiconductor chilling plate is disposed in the accommodating hole.

In some examples, the main body case includes a case body having a mounting groove thereon, and a heat conductive member provided in the mounting groove to form the heat conductive portion.

In some examples, the size of the mounting groove is larger than that of the accommodating hole, and the heat conducting piece completely covers and exceeds the semiconductor chilling plate.

In some examples, a heat transfer medium is disposed between the semiconductor chilling plate and the heat conducting portion.

According to the utility model discloses manadesma rifle, include: the massage gun comprises a gun body and a massage head, wherein the gun body is the fascia gun, and the massage head is installed in the installation area.

According to the utility model discloses manadesma rifle through adopting aforementioned rifle body to enrich the function of manadesma rifle, make manadesma rifle both accessible massage head realize the massage, go back accessible rifle body and reach the purpose of carrying out cold compress or hot compress to user's skin, promote the practicality of manadesma rifle.

Additional aspects and advantages of the invention will be set forth in the description which follows, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is an exploded view of a fascia gun according to an embodiment of the present invention.

Fig. 2 is an exploded view of a gun housing according to an embodiment of the present invention.

Fig. 3 is an exploded view of a fascia gun according to an embodiment of the present invention.

Fig. 4 is an exploded view of a portion of a fascia gun according to an embodiment of the present invention.

Fig. 5 is an assembly view of a fascial gun according to an embodiment of the present invention.

Fig. 6 is a top view of a fascial gun according to an embodiment of the invention.

Fig. 7 is a partial cross-sectional view taken along line a-a of fig. 6.

Fig. 8 is a partially enlarged view of the region I in fig. 7.

Fig. 9 is an exploded view of the first housing portion and the heat sink according to an embodiment of the present invention.

Fig. 10 is a schematic view of the first shell portion according to an embodiment of the present invention.

Reference numerals:

100. a gun body;

1. a gun housing;

11. a main body case;

111. an installation area; 112. a heat conducting portion; 113. a first end; 114. a second end;

115. a first shell portion; 116. a second shell portion;

117. a housing body; 1171. mounting grooves;

118. a heat conductive member;

12. a mounting base; 121. a connecting portion;

13. a handle case; 14. an air inlet; 15. an air outlet; 16. an accommodation hole;

2. a semiconductor refrigeration sheet; 3. a drive member; 4. a buffer member; 5. a heat dissipation air duct;

6. a heat dissipating component; 61. a heat sink; 62. a heat radiation fan;

7. a wind-shielding sheet; 8. a heat transfer medium;

1000. a fascia gun;

200. a massage head.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "length", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

The gun body 100 of the fascia gun 1000 according to the embodiment of the present invention will be described with reference to the drawings.

According to the utility model discloses rifle body 100, as shown in fig. 1, include: gun shell 1, semiconductor refrigeration piece 2 and drive assembly 3.

As shown in fig. 1 and 2, the gun case 1 includes a main body case 11, a mounting area 111 adapted to mount the massage head 200 of the fascial gun 1000 is formed on the main body case 11, and a heat conduction portion 112 is provided on the main body case 11.

Referring to fig. 1 and 7, the semiconductor refrigeration piece 2 is disposed in the gun case 1, and the semiconductor refrigeration piece 2 exchanges heat with the outside through the heat conduction portion 112.

As shown in fig. 1, the driving unit 3 is disposed in the gun housing 1 and adapted to drive the massage head 200, the driving unit 3 is disposed spaced apart from the semiconductor cooling plate 2, and a buffer 4 is connected between the driving unit 3 and the gun housing 1.

According to the structure, the gun body 100 of the embodiment of the present invention, through forming the mounting region 111 on the main body case 11, the mounting region 111 provides a space for mounting the massage head 200, so as to realize mounting the massage head 200 on the main body case 11, and the following massage head 200 and the driving part 3 in the main body case 11 are convenient to cooperate for user massage, thereby improving user experience.

Through set up semiconductor refrigeration piece 2 in rifle shell 1, and semiconductor refrigeration piece 2 passes through heat-conducting part 112 and external heat transfer, when semiconductor refrigeration piece 2 produced heat or cold volume like this, with the direct or indirect user's skin of laminating of heat-conducting part 112, rifle body 100 can reach carries out hot compress or cold compress's purpose to user's skin. For example, before the user uses the massage head 200 to perform massage, the user firstly uses the heat conduction part 112 on the main body shell 11 to perform hot compress, so that the tight muscles are firstly relaxed, and the subsequent massage is more comfortable; for another example, after the user finishes the exercise, the heat conduction part 112 on the main body shell 11 is used for cold compress to reduce the physical temperature of the skin, thereby reducing the blood circulation and the pain feeling during the subsequent massage. So set up, when setting up the rifle body 100 of this application on manadesma rifle 1000 for manadesma rifle 1000 not only can realize the massage and still can reach the purpose of carrying out cold compress or hot compress to user's skin, makes manadesma rifle 1000's function diversified, promotes user experience.

It should be noted that, in the process of utilizing semiconductor refrigeration piece 2 to carry out cold compress or hot compress, semiconductor refrigeration piece 2 one end cold volume or heat can transmit to heat-conducting part 112 earlier, rethread heat-conducting part 112 is used in user's skin afterwards, so that semiconductor refrigeration piece 2 can make full use of the structure of main part shell 11 and carry out cold compress or hot compress, and the setting of heat-conducting part 112 still can avoid semiconductor refrigeration piece 2 direct exposure to the outside of main part shell 11, prolong semiconductor refrigeration piece 2's life. The semiconductor cooling plate 2 is well known in the prior art, and will not be described herein.

By arranging the semiconductor refrigerating piece 2 and the driving part 3 in the gun shell 1, the gun shell 1 can protect the semiconductor refrigerating piece 2 and the driving part 3 by utilizing the structural strength of the gun shell 1, so that in the process of containing or using the gun body 100, external sharp objects, dust or foreign matters and the like are prevented from falling on the semiconductor refrigerating piece 2 or the driving part 3, on one hand, the semiconductor refrigerating piece 2 or the driving part 3 is prevented from being damaged, and the service lives of the semiconductor refrigerating piece 2 and the driving part 3 are further prolonged; on the other hand, the dust or foreign matters are prevented from influencing the refrigerating or heating performance of the semiconductor refrigerating sheet 2, so that the refrigerating or heating effect of the semiconductor refrigerating sheet 2 is ensured, and the purpose of cold compress or hot compress is achieved. And above-mentioned setting still can avoid semiconductor refrigeration piece 2 and driver part 3 to occupy the space beyond the rifle shell 1 to make rifle body 100 form an overall structure, be convenient for accomodate, carry and use.

In some examples, the driving unit 3 disposed in the gun housing 1 may be used to drive the massage head 200 to generate high frequency vibration, and when the massage head 200 contacts with the user, the high frequency vibration generated by the massage head 200 acts on the deep muscle layer to reduce the local tissue tension, relieve pain, promote blood circulation, and so on, thereby achieving the purpose of massage.

In some examples, the driving part 3 may be selected from a driving motor, for example, in some cases, a brushless motor may be specifically selected. Compare in brush motor, the noise of brushless click is little, stability is high, the security is high, be difficult for generating heat and longe-lived to effectively promote user experience.

Because of drive unit 3 also can produce the vibration at the in-process self that drive massage head 200 produced the vibration, consequently, this application sets up drive unit 3 and semiconductor refrigeration piece 2 spaced apart, avoids the produced vibration transmission of drive unit 3 to semiconductor refrigeration piece 2 as far as on, in order to guarantee semiconductor refrigeration piece 2's connection reliability, prolong semiconductor refrigeration piece 2's life on the one hand, on the other hand makes semiconductor refrigeration piece 2 can be steadily through heat conduction portion 112 and external heat transfer.

Because the driving part 3 and the semiconductor refrigerating sheet 2 are both arranged in the gun shell 1, in order to further reduce the influence of the driving part 3 on the semiconductor refrigerating sheet 2 during vibration, a buffer part 4 is connected between the driving part 3 and the gun shell 1, when the driving part 3 generates vibration, part of the vibration can be transmitted to the buffer part 4, and the buffer part 4 is used for absorbing part of vibration impact from the driving part 3, so that the vibration impact transmitted to the gun shell 1 by the driving part 3 during high-frequency motion is counteracted by part of the vibration impact, on one hand, the vibration impact of the driving part 3 on the semiconductor refrigerating sheet 2 in the gun shell 1 during high-frequency motion can be reduced, and the connection reliability of the semiconductor refrigerating sheet 2 is further improved; on the other hand, when the user holds the gun body 100 for massaging, the user does not feel too large vibration impact, and the user experience is improved.

It can be understood that compare in correlation technique, the drive assembly 3 that this application rifle body 100 set up on the one hand reduces the influence of vibration impact to semiconductor refrigeration piece 2 through setting up with semiconductor refrigeration piece 2 interval, on the other hand further reduces the influence of vibration impact to semiconductor refrigeration piece 2 through with set up bolster 4 between the rifle shell 1, thereby guarantee semiconductor refrigeration piece 2's operational reliability as far as possible, prolong semiconductor refrigeration piece 2's life, promote semiconductor refrigeration piece 2 through the stability of heat-conducting part 112 with external heat transfer.

Optionally, the buffer 4 may be a spring, one end of the spring is connected to the driving component 3, the other end of the spring is connected to the gun housing 1, and the spring is used for absorbing the vibration impact generated by the driving component 3, so as to reduce the vibration impact of the driving component 3 on the semiconductor refrigeration piece 2 in the gun housing 1 during high-frequency motion.

In other examples, the buffer 4 may also be a rubber pad or a silicone pad, and the above structures can both play a role in absorbing vibration and shock to improve the reliability of the semiconductor cooling plate 2.

In some embodiments of the present invention, as shown in fig. 3 and 4, a mounting seat 12 is provided in the gun housing 1, and the driving member 3 is mounted on the mounting seat 12. It can be understood that the driving unit 3 is installed in the gun housing 1 through the installation seat 12, and the installation seat 12 is used for defining the position of the driving unit 3 and improving the position stability of the driving unit 3, so that the driving unit 3 can be stably connected in the gun housing 1, thereby effectively driving the massage head 200 to vibrate.

Optionally, as shown in fig. 3 and 4, a buffer 4 is connected between the mounting 12 and the gun housing 1. The buffer member 4 is used for absorbing the vibration impact transmitted to the mounting base 12, so as to reduce the influence of the vibration impact on the gun housing 1, prolong the service life of the semiconductor refrigeration piece 2 and improve the user experience. Further, by providing the cushion member 4 between the mounting base 12 and the gun case 1, the mounting convenience and mounting reliability of the cushion member 4 can be improved as compared with providing the cushion member 4 between the mounting base 12 and the driving member 3.

Alternatively, as shown in fig. 4, the mounting 12 has a plurality of connecting portions 121, and each connecting portion 121 is connected to the gun housing 1 through a buffer 4. The mounting 12 is connected to the gun housing 1 through a plurality of connecting portions 121 to increase the contact area between the mounting 12 and the gun housing 1, so that the mounting 12 can be stably connected to the inside of the gun housing 1 to effectively support and define the position of the driving element 3, and the buffer 4 is connected between the connecting portions 121 and the gun housing 1 to reduce the impact of the vibration generated by the driving element 3 mounted on the mounting 12 on the gun housing 1.

In the description of the present invention, "a plurality" means two or more unless otherwise specified.

Optionally, the mounting seat 12 is formed with a mounting slot for mounting the driving part 3, and the driving part 3 is clamped in the mounting slot to limit the position of the driving part 3.

It should be noted that, the connection mode between the above-mentioned buffering member 4 and the connecting portion 121 and the gun case 1 is not limited, for example, when the buffering member 4 is a spring, the buffering member 4 can be connected to the connecting portion 121 and the gun case 1 by welding or by using a bolt connection; when the cushion member 4 is made of a rubber pad, a silicone pad, etc., the cushion member 4 may be connected to the connecting portion 121 and the gun housing 1 by an adhesive connection method, and so on, which will not be described herein.

In some embodiments of the present invention, as shown in fig. 2, the main body case 11 includes a first end 113 and a second end 114 that are oppositely disposed, the mounting region 111 is formed on the first end 113, and the heat conduction portion 112 is located between the first end 113 and the second end 114. The installation area 111 and the heat conduction part 112 are separately arranged, so that after the massage head 200 is installed in the installation area 111, the heat conduction part 112 can be normally used, the independence of massage and heat conduction is ensured, and the function of the fascia gun 1000 is diversified. In addition, the space between the first end 113 and the second end 114 is relatively large, and the heat conduction part 112 is arranged at the space, so that the area of the heat conduction part 112 can be increased as much as possible according to needs, and the comfort and the efficiency of hot compress or cold compress are improved.

The first end 113 and the second end 114 may be the front and rear ends of the fascia gun 1000 shown in fig. 5, or the left and right ends of the fascia gun 1000 shown in fig. 5.

In the description of the present invention, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features for distinguishing between descriptive features, non-sequential, non-trivial and non-trivial.

Optionally, as shown in fig. 1, the semiconductor chilling plate 2 is disposed opposite to the heat conducting portion 112, that is, projected onto the plane where the semiconductor chilling plate 2 is located, and the orthographic projection of the heat conducting portion 112 and the orthographic projection of the semiconductor chilling plate 2 at least partially coincide. Therefore, the heat generated by the semiconductor refrigerating sheet 2 can be quickly transferred to the heat conducting part 112, and heat exchange with the outside is realized through the heat conducting part 112, so that heat loss is avoided, and the purpose of cold compress or hot compress can be achieved by fully utilizing the heat generated by the semiconductor refrigerating sheet 2.

Alternatively, as shown in fig. 1 and 7, the driving member 3 is provided on the side of the semiconductor chilling plate 2 away from the heat conduction portion 112. On the one hand, the driving member 3 does not hinder the heat generated by the semiconductor cooling plate 2 from being transferred toward the heat conducting portion 112, thereby avoiding heat loss; on the other hand, the driving member 3 and the heat-conducting portion 112 are spaced from each other, and the influence of the vibration impact generated by the driving member 3 on the heat-conducting portion 112 is reduced.

Optionally, as shown in fig. 2, the gun housing 1 further includes a handle housing 13, one end of the handle housing 13 is connected between the first end 113 and the second end 114 of the main body housing 11, and the heat conducting portion 112 is disposed on the opposite sides of the main body housing 11, and the driving member 3 is disposed between the semiconductor cooling plate 2 and the handle housing 13. Setting up convenience of customers operation of handle shell 13, when the user needs to use manadesma rifle 1000 to massage, manadesma rifle 1000 is taken up to user's accessible handle shell 13, and adopt the mode of handheld manadesma rifle 1000 to massage the user, promote user experience, and set up heat-conducting portion 112 and handle shell 13 in the relative both sides of main part shell 11, ensure that the user is at the in-process of handheld handle shell 13, can not block heat-conducting portion 112, and then make the heat that transmits to on the heat-conducting portion 112 normally with external heat transfer, and the user can hand handle shell 13 and carry out cold compress or hot compress to user's skin, make manadesma rifle 1000's use more convenient.

In a specific example, the handle case 13 may be formed in a cylindrical shape and have a surface treated to prevent slipping, so that the user can hold the gun case 1 for massage or cold compress, etc.

Alternatively, as shown in fig. 2 and 3, the main body case 11 includes a first case portion 115 and a second case portion 116 that are oppositely disposed and spliced, the semiconductor chilling plate 2 is mounted to the first case portion 115, and the driving part 3 is mounted to the second case portion 116. The first shell portion 115 and the second shell portion 116 that splice each other make the body shell 11 constitute by two solitary structures, like this at the in-process of rifle body 100 assembly, can install semiconductor refrigeration piece 2 in first shell portion 115 earlier, driving part 3 is installed in second shell portion 116, semiconductor refrigeration piece 2 and driving part 3 all install the back of counterpointing, splice first shell portion 115 and second shell portion 116 together again, very big reduction rifle body 100's the assembly degree of difficulty, and promote assembly efficiency.

Optionally, the first shell portion 115 and the second shell portion 116 are detachably connected, the detachable connection can reduce the difficulty in mounting and dismounting the first shell portion 115 and the second shell portion 116, and when the semiconductor chilling plate 2 or the driving part 3 mounted in the main body shell 11 needs to be maintained or replaced, the first shell portion 115 is directly detached from the second shell portion 116, so that the semiconductor chilling plate 2 or the driving part 3 of the main body shell 11 can be replaced or maintained conveniently.

The detachable connection referred to herein may be a snap-fit connection, for example: a plurality of clamping grooves are arranged on the first shell part 115 at intervals, and a buckle matched with the clamping grooves is arranged on the second shell part 116 and clamped in the clamping grooves to form detachable connection of the first shell part 115 and the second shell part 116; of course, the detachable connection can also be a bolted connection, for example: a plurality of through holes are arranged on the first shell part 115 at intervals, the second shell part 116 is provided with internal threaded holes matched with the through holes, and bolts pass through the through holes to be fixedly connected with the internal threaded holes, so that the detachable connection of the first shell part 115 and the second shell part 116 can be formed.

Optionally, as shown in fig. 7, a heat dissipation air duct 5 is formed in the gun housing 1, and the semiconductor refrigeration piece 2 is disposed in the heat dissipation air duct 5. When utilizing semiconductor refrigeration piece 2 to realize the cold compress function because of the rifle body 100, semiconductor refrigeration piece 2 produces cold volume towards one side of user's skin, and semiconductor refrigeration piece 2 opposite side also is semiconductor refrigeration piece 2 and can produce a large amount of heats towards one side of driver part 3, lead to a large amount of heats of the inside gathering of rifle shell 1, in order to dispel the heat, consequently, set up heat dissipation wind channel 5 in the inside of rifle shell 1, heat dissipation wind channel 5 can be with the inside heat transfer of rifle shell 1 to the outside of rifle shell 1, reach the purpose of cooling down to rifle shell 1 inside, thereby the extension sets up the life at the inside driver part 3 of rifle shell 1.

It should be noted that, when semiconductor refrigeration piece 2 is used for realizing the cold compress, if the heat that one side of semiconductor refrigeration piece 2 produced can in time be gived off, can also promote the cold compress effect of semiconductor refrigeration piece 2, therefore, this application is through setting up heat dissipation wind channel 5, not only can reduce the inside temperature of rifle shell 1, still can make semiconductor refrigeration piece 2 have better cold compress effect, with effectively through heat conduction portion 112 and external heat transfer, thereby reach the purpose of cold compress.

Optionally, as shown in fig. 2 and fig. 3, the heat-dissipating air duct 5 is disposed between the first end 113 and the second end 114, and the first end 113 and the second end 114 are respectively formed with the air inlet 14 and the air outlet 15 communicated with the heat-dissipating air duct 5. The heat dissipation air duct 5 comprises an air outlet 15 and an air inlet 14, the air outlet 15 and the heat dissipation air duct 5 are matched, in the working process of the semiconductor refrigeration piece 2, external normal temperature air can enter the heat dissipation air duct 5 through the air inlet 14 at one end of the gun shell 1 and flows towards the air outlet 15 along the extending direction of the heat dissipation air duct 5, when the normal temperature air flows along the heat dissipation air duct 5, the normal temperature air can exchange heat with high temperature air in the gun shell 1, the air after heat exchange is discharged to the outside of the gun shell 1 from the air outlet 15, heat is prevented from being accumulated on the semiconductor refrigeration piece 2, the accelerated temperature rise of the semiconductor refrigeration piece 2 is avoided, the refrigeration effect of the semiconductor refrigeration piece 2 is influenced, even the semiconductor refrigeration piece 2 is damaged, and meanwhile, the damage caused by the long-time working of the internal structure of the gun shell 1 in a high temperature environment is also avoided, the service life of the internal structure of the gun case 1 is prolonged.

Alternatively, as shown in FIG. 2, one of the outlet 15 and the inlet 14 is disposed on the first end 113 and the other is disposed on the second end 114. Because the first end 113 and the second end 114 of the gun housing 1 are oppositely arranged, and the air outlet 15 and the air inlet 14 are respectively arranged at the first end 113 and the second end 114, in this way, the air inlet 14 and the air outlet 15 communicated with the heat dissipation air duct 5 can be oppositely arranged, so that the arrangement of the heat dissipation air duct 5 can fully utilize the internal space of the gun housing 1 to form a long and straight heat dissipation air duct 5 (the straight is taken as a broad sense here, and is not limited to be a straight line, and for example, the straight line can be an oblique line or a curve which is approximate to a straight line, etc.), and the heat dissipation efficiency is improved.

Alternatively, as shown in fig. 2, the air inlet 14 is disposed at the second end 114, the air outlet 15 is disposed at the first end 113, and since the first end 113 is formed with the mounting region 111 suitable for mounting the massage head 200, the arrangement is such that, when the massage head 200 is mounted at the first end 113, the air inlet 14 is disposed far away from the massage head 200, and the massage head 200 does not obstruct the outside air at normal temperature from entering the gun housing 1, that is, the circulation of the outside air is smooth when entering the gun housing 1, thereby improving the heat exchange efficiency.

Alternatively, the air inlet 14 is disposed on the first end 113, the air outlet 15 is disposed on the second end 114, and since the mounting area 111 suitable for mounting the massage head 200 is formed on the first end 113, the arrangement is such that the air outlet 15 can be disposed away from the massage head 200 when the massage head 200 is mounted on the first end 113, the heat dissipation air flow blown out from the air outlet 15 will not adversely affect the massage head 200, and the reliability of the massage head 200 is improved.

Optionally, as shown in fig. 1 and 7, the gun body 100 further includes a heat dissipation assembly 6, and the heat dissipation assembly 6 is disposed in the heat dissipation air duct 5 to accelerate heat exchange of the semiconductor chilling plates 2. So set up, for example, when semiconductor refrigeration piece 2 produced cold volume towards one side of heat conduction portion 112 and realized the cold compress, the produced heat accessible of semiconductor refrigeration piece 2 opposite side is located heat dissipation wind channel 5 and radiator unit 6 and is dispelled fast, radiator unit 6 is in order to realize the quick heat dissipation to semiconductor refrigeration piece 2, further improve the radiating efficiency, and radiator unit 6 locates in heat dissipation wind channel 5, the air in the heat dissipation wind channel 5 can be fast with the heat transmission to the outside of rifle shell 1 on the semiconductor refrigeration piece 2, in order to reach the purpose that reduces the inside temperature of rifle shell 1, prolong the life of rifle shell 1 internal structural component. In addition, it should be noted that when the semiconductor chilling plate 2 generates heat toward one side of the heat conducting portion 112 to implement hot compress, the cold generated by the other side of the semiconductor chilling plate 2 can be rapidly dissipated through the heat dissipating air duct 5 and the heat dissipating assembly 6, so as to improve the working efficiency of the semiconductor chilling plate 2.

In some specific examples, the heat dissipation assembly 6 is disposed in the gap between the semiconductor cooling plate 2 and the driving component 3 of the heat dissipation air duct 5, so that the space inside the gun housing 1 can be reasonably utilized, the structural compactness is improved, the heat dissipation assembly 6 can dissipate heat for the semiconductor cooling plate 2 more directly, the interference caused by the driving component 3 is reduced, and the heat dissipation effect of the semiconductor cooling plate 2 is improved.

Alternatively, as shown in conjunction with fig. 1 and 7, the heat sink assembly 6 is disposed spaced apart from the driving part 3. High-frequency vibration generated by the driving component 3 is prevented from being transmitted to the heat dissipation assembly 6, so that the stability of the heat dissipation assembly 6 is improved, on one hand, the service life of the heat dissipation assembly 6 is prolonged, and the heat dissipation assembly 6 can effectively exchange heat with the semiconductor refrigeration fins 2; on the other hand, when the heat dissipation assembly 6 is arranged between the semiconductor refrigeration piece 2 and the driving component 3, the high-frequency motion generated by the driving component 3 can be prevented from being transmitted to the semiconductor refrigeration piece 2 through the heat dissipation assembly 6, and the service life of the semiconductor refrigeration piece 2 is further prolonged.

Optionally, as shown in fig. 1 and 3, the heat dissipation assembly 6 includes a heat sink 61, and the heat sink 61 is disposed opposite to the semiconductor chilling plates 2 and exchanges heat with the semiconductor chilling plates 2. The heat radiator 61 radiates heat and cools the hot end of the semiconductor refrigeration piece 2, so that when the semiconductor refrigeration piece 2 is in cold compress, heat generated by one side of the semiconductor refrigeration piece 2 can be directly transferred to the heat radiator 61 and dissipated by the heat dissipation air duct 5, and the heat dissipation efficiency is improved.

Optionally, the heat sink 61 is attached to one side of the semiconductor chilling plate 2, and completely covers one side of the semiconductor chilling plate 2. The heat transfer area between the radiator 61 and the semiconductor chilling plate 2 is increased, so that the heat generated by the semiconductor chilling plate 2 close to one side of the radiator 61 can be directly transferred to the radiator 61, the radiator 61 can absorb the heat on the semiconductor chilling plate 2 more quickly and comprehensively, and the heat dissipation efficiency is improved.

Optionally, the heat sink 61 is attached to one side of the semiconductor chilling plate 2, and may form a direct or indirect gapless fit, for example, the heat sink 61 directly contacts one side of the semiconductor chilling plate 2, or the heat sink 61 is connected to one side of the semiconductor chilling plate 2 through a heat conducting adhesive to form an indirect contact, so that heat on one side of the semiconductor chilling plate 2 can be sufficiently transferred to the heat sink 61, thereby improving heat transfer efficiency and further improving heat dissipation efficiency. The side of the semiconductor cooling sheet 2 referred to herein mainly means the side of the semiconductor cooling sheet 2 away from the heat conductive portion 112.

Optionally, as shown in fig. 2 and fig. 3, the heat sink assembly 6 further includes a heat sink fan 62, and the heat sink fan 62 is used for sucking the heat sink air duct 5 from the air inlet 14 and sending air from the air outlet 15. Radiator fan 62, air intake 14 and the cooperation of air outlet 15, when the in-process of radiator fan 62 work, radiator fan 62 can accelerate the circulation of air, external normal atmospheric temperature air can pass through in air intake 14 gets into rifle shell 1 this moment, carry out the heat transfer with the heat in the rifle shell 1 in radiating duct 5 afterwards, heat after the heat transfer is discharged fast through air outlet 15 again, guarantee the unobstructed stable discharge of heat, avoid the heat gathering in rifle shell 1, and improve the radiating efficiency.

Optionally, the heat sink 61 is disposed on an airflow path from the air inlet 14 to the air outlet 15, and when the heat dissipation fan 62 accelerates the air flow, the heat transferred from the semiconductor cooling fin 2 to the heat sink 61 can be taken away and guided out of the gun case 1 through the air outlet 15, so as to reduce the heat inside the gun case 1, and achieve the purpose of cooling the inside of the gun case 1.

It can be understood that the present application greatly improves the heat dissipation effect by the cooperation of the heat dissipation fan 62 and the heat sink 61.

Optionally, as shown in fig. 1 and 3, the gun body 100 further includes a wind shielding sheet 7, and the wind shielding sheet 7 is disposed on a side away from the semiconductor chilling plate 2 between the heat dissipation fan 62 and the heat sink 61 and is fixedly connected to the gun housing 1. The wind shield 7 is fixedly connected to the gun shell 1, so that the position of the wind shield 7 relative to the gun shell 1 is stable, and the wind shield 7 is arranged at one side, far away from the semiconductor refrigeration sheet 2, between the heat dissipation fan 62 and the heat radiator 61, on one hand, the wind shield 7 can fix the heat dissipation fan 62 and the heat radiator 61, so that the heat dissipation fan 62 and the heat radiator 61 are firmly fixed in the gun shell 1, and the relative positions of the heat dissipation fan 62 and the heat radiator 61 are ensured to be fixed, so that the heat on the heat radiator 61 can be taken away by the heat dissipation fan 62 in the working process; on the other hand, the wind-blocking sheet 7 may be used to form a relatively closed airflow channel between the heat sink 61 and the heat dissipation air duct 5, so that the airflow may flow through the heat sink 61 more intensively, and the heat dissipation efficiency of the heat sink 61 is improved.

Alternatively, the wind deflector 7 may be made of sheet metal or other structural strength-imparting connecting pieces, such as: copper sheets, etc. to improve the structural strength of the wind-blocking sheet 7, and to connect the heat-radiating fan 62 and the heat sink 61 to the wind-blocking sheet 7, the heat-radiating fan 62 and the heat sink 61 can be effectively supported, and a heat transfer function is performed.

Alternatively, as shown in fig. 3, both the heat sink 61 and the heat dissipation fan 62 are disposed within the first case portion 115. The distance between the heat dissipation assembly 6 and the semiconductor chilling plates 2 is reduced, and therefore heat dissipation efficiency is improved.

In some embodiments of the present invention, as shown in fig. 9 and 10, the gun case 1 has a receiving hole 16 corresponding to the heat conducting portion 112, and the semiconductor cooling plate 2 is disposed in the receiving hole 16. The accommodation hole 16 provides the space of dodging for the setting of semiconductor refrigeration piece 2, ensures that semiconductor refrigeration piece 2 can locate in rifle shell 1 steadily, like this, can further restrict the activity space of semiconductor refrigeration piece 2 on rifle shell 1, when avoiding semiconductor refrigeration piece to install in rifle shell 1, takes place to rock because of receiving the vibration impact. And the accommodation hole 16 can also play the effect of location, and at the specific in-process of assembling of rifle body 100, the mounted position of accessible accommodation hole 16 location semiconductor refrigeration piece 2 fast reduces the installation degree of difficulty of semiconductor refrigeration piece 2, and improves the installation effectiveness, and install semiconductor refrigeration piece 2 back in accommodation hole 16, can guarantee that semiconductor refrigeration piece 2 just sets up heat conduction portion 112, with effectively through heat conduction portion 112 and external heat transfer.

Alternatively, as shown in fig. 2, the main body case 11 includes a case body 117 and a heat conduction member 118, the case body 117 having a mounting groove 1171 thereon, the heat conduction member 118 being provided in the mounting groove 1171 to form the heat conduction portion 112. Mounting groove 1171 provides the space of dodging for the setting of heat-conducting member 118, ensures that heat-conducting member 118 can stably connect on shell body 117, and heat-conducting member 118 still can fix a position the mounted position of self through mounting groove 1171's position fast, improves the installation effectiveness.

Locate the mounting groove 1171 with heat-conducting piece 118 on, and the accommodation hole 16 forms on the diapire of mounting groove 1171 for heat-conducting piece 118 can carry out the heat transfer that produces when cold compress or hot compress with semiconductor refrigeration piece 2 fast to the user's skin on, avoid the cold volume or the heat that semiconductor refrigeration piece 2 produced because of heat transfer efficiency low, and spread in the atmosphere, thereby improve the effect of cold compress or hot compress, promote user experience.

It should be noted that the shell body 117 may be formed by combining the first shell portion 115 and the second shell portion 116, that is, the shell body 117 is formed by connecting the first shell portion 115 and the second shell portion 116.

Optionally, mounting groove 1171 is just to receiving hole 16 setting, sets up semiconductor refrigeration piece 2 on receiving hole 16 like this, when heat-conducting piece 118 sets up on mounting groove 1171, can guarantee that semiconductor refrigeration piece 2 is just to heat-conducting piece 118 setting, and semiconductor refrigeration piece 2 passes through heat-conducting piece 118 and external heat transfer to reach the purpose of carrying out cold compress or hot compress to user's skin.

Optionally, the size of the mounting groove 1171 is larger than that of the accommodating hole 16, and the heat conduction member 118 completely covers and extends beyond the semiconductor chilling plate 2. So set up, semiconductor refrigeration piece 2 is kept away from one side surface of radiator 61 and can be all with heat-conducting piece 118 cooperation heat transfer to increase semiconductor refrigeration piece 2 and heat-conducting piece 118's heat transfer area, so that semiconductor refrigeration piece 2 carries out cold compress or hot compress to user's skin more fast, comprehensively, improves the efficiency of cold compress or hot compress.

Optionally, the heat conducting member 118 is in direct contact with the semiconductor refrigeration sheet 2 or in indirect contact with the semiconductor refrigeration sheet through a heat conducting glue or the like, so that the heat transfer efficiency can be further improved, and the effect of cold compress or hot compress can be improved.

Alternatively, the mounting groove 1171 is formed on a side wall of the housing body 117 away from the handle housing 13, and the mounting groove 1171 is formed as a concave groove facing the handle housing 13, but the concave groove does not completely communicate with the side wall of the housing body 117, the receiving hole 16 is also formed on a side bottom wall of the housing body 117 away from the handle housing 13, the receiving hole 16 is disposed opposite to the mounting groove 1171, and the receiving hole 16 completely penetrates through the bottom wall of the housing body 117, so that, since the size of the mounting groove 1171 is larger than that of the receiving hole 16, a side wall area of the housing body 117, which is covered by the heat conducting member 118, outside the receiving hole 16 can insulate heat between the semiconductor cooling fin 2 and the heat conducting member 118, thereby preventing cold or heat generated by the side of the cooling semiconductor fin 2 away from the heat conducting member 118 from being transferred to the heat conducting member 118, and improving the effect of cold or hot compress.

In some embodiments of the present invention, as shown in fig. 7 and 8, a heat transfer medium 8 is disposed between the semiconductor cooling fin 2 and the heat conducting portion 112. The heat transfer medium 8 is used for accelerating the heat transfer efficiency and ensuring that the heat or cold generated by the side of the semiconductor refrigeration piece 2 close to the heat conducting part 112 can be quickly transferred to the heat conducting part 112.

Optionally, heat transfer medium 8 can be selected to use heat conduction silicone grease piece or heat conduction silicone sheet, with heat conduction silicone grease piece or heat conduction silicone sheet setting between semiconductor refrigeration piece 2 and heat-conduction part 112, heat conduction silicone grease piece or heat conduction silicone sheet can accelerate the heat transfer between semiconductor refrigeration piece 2 and heat-conducting piece 118 on the one hand, on the other hand, can cushion semiconductor refrigeration piece 2 and the laminating between heat-conducting piece 118, thereby it directly transmits to semiconductor refrigeration piece 2 through heat-conducting piece 118 to slow down the vibration impact that comes from rifle shell 1, further improve the reliability of semiconductor preparation 2, prolong the life of semiconductor refrigeration piece 2, and promote the effect of cold compress or hot compress.

The fascia gun 1000 according to embodiments of the present invention will be described with reference to the drawings.

The fascial gun 1000 according to embodiments of the present invention, as shown in fig. 5 and 6, includes: a gun body 100 and a massage head 200.

The gun body 100 is the gun body 100 of the fascia gun 1000, the specific structure of the gun body 100 is not described herein, and the massage head 200 is installed in the installation region 111.

According to the structure, the fascia gun 1000 of the embodiment of the present invention is provided with the gun body 100 to enrich the function of the fascia gun 1000, so that the fascia gun 1000 can massage the skin of the user through the massage head 200, and can also perform cold compress or hot compress on the skin of the user through the gun body 100, thereby improving the practicability of the fascia gun 1000. And the drive unit 3 that sets up in the rifle body 100 on the one hand reduces the influence of vibration impact to semiconductor refrigeration piece 2 through setting up with semiconductor refrigeration piece 2 interval, on the other hand further reduces the influence of vibration impact to semiconductor refrigeration piece 2 through with set up bolster 4 between the rifle shell 1 to guarantee semiconductor refrigeration piece 2's operational reliability as far as, prolong semiconductor refrigeration piece 2's life, promote semiconductor refrigeration piece 2 and pass through the stability of heat conduction portion 112 with external heat transfer.

Optionally, the massage heads 200 are detachably mounted on the mounting region 111, so that the massage heads 200 can be maintained conveniently, and the massage heads 200 can be replaced conveniently, so that different types of massage heads 200 can be mounted on the same gun body 100, and thus different types of massage heads 200 can be replaced for the part to be massaged of the user before massage, and the use cost of the fascia gun 1000 can be reduced while the user experience is improved.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Four connecting portions 121 are shown in fig. 4 for illustrative purposes, but it is obvious to those skilled in the art after reading the above technical solutions that the solution can be applied to two, three or more connecting portions 121, and this also falls within the protection scope of the present invention.

The gun body 100 of the fascial gun 1000 according to the present embodiment and other components of the fascial gun 1000, such as the components of the driving member 3 and the driving principle, are well known to those skilled in the art and will not be described in detail herein.

In the description of the present specification, references to the description of the terms "embodiment," "example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (16)

1. A gun body for a fascial gun, comprising:

a gun housing including a main body housing formed with a mounting area adapted to mount a massage head of the fascial gun, the main body housing having a heat conduction portion thereon;

the semiconductor refrigeration piece is arranged in the gun shell and exchanges heat with the outside through the heat conducting part;

drive unit, drive unit locates just be suitable for the drive in the rifle shell the massage head, drive unit with semiconductor refrigeration piece spaced apart the setting, just drive unit with be connected with the bolster between the rifle shell, be equipped with the mount pad in the rifle shell, the mount pad with be connected with between the rifle shell the bolster, drive unit install in the mount pad, the bolster is spring or rubber pad.

2. The fascia gun body according to claim 1, wherein the mounting base has a plurality of connecting portions, and each connecting portion is connected to the gun housing through the buffer member.

3. The fascia gun body as claimed in claim 1 or 2, wherein the main body case includes a first end and a second end disposed opposite to each other, the mounting region is formed on the first end, the heat conduction portion is disposed between the first end and the second end, the semiconductor cooling fin is disposed opposite to the heat conduction portion, and the driving member is disposed on a side of the semiconductor cooling fin away from the heat conduction portion.

4. The gun body of fascia gun of claim 3, wherein the gun housing further comprises a handle housing connected at one end to the body housing between the first end and the second end and disposed on opposite sides of the body housing from the heat conducting portion, the driving member being located between the semiconductor chilling plate and the handle housing.

5. The gun body of fascia gun according to claim 4, wherein the main body case comprises a first case part and a second case part which are oppositely arranged and spliced, the semiconductor chilling plate is mounted on the first case part, and the driving part is mounted on the second case part.

6. The gun body of the fascia gun according to claim 3, wherein a heat dissipation air duct is formed in the gun housing, the heat dissipation air duct is disposed between the first end and the second end, and the semiconductor refrigeration sheet is disposed in the heat dissipation air duct.

7. The fascia gun body as claimed in claim 6, wherein the heat dissipation duct comprises an air outlet and an air inlet, one of the air outlet and the air inlet is disposed on the first end, and the other is disposed on the second end.

8. The fascia gun body according to claim 7, further comprising:

and the heat dissipation assembly is arranged in the heat dissipation air duct and is positioned between the semiconductor refrigeration piece and the driving part.

9. The fascia gun body according to claim 8, wherein the heat dissipation assembly comprises a heat sink, and the heat sink is disposed opposite to the semiconductor cooling fins and exchanges heat with the semiconductor cooling fins.

10. The gun body of fascia gun according to claim 9, wherein the heat dissipation assembly further comprises a heat dissipation fan for sucking air from the air inlet and blowing air from the air outlet.

11. The fascia gun body according to claim 10, further comprising: the wind-shielding sheet is arranged on one side, far away from the semiconductor refrigeration sheet, between the heat dissipation fan and the radiator and fixedly connected to the gun shell.

12. The gun body of fascia gun according to claim 1, wherein the gun shell has a receiving hole corresponding to the heat conducting part, and the semiconductor refrigerating sheet is disposed in the receiving hole.

13. The fascia gun body as claimed in claim 12, wherein the main body case includes a case body having a mounting groove and a heat conduction member provided in the mounting groove to form the heat conduction portion.

14. The fascia gun body as claimed in claim 13, wherein the mounting groove is larger than the receiving hole, and the heat conducting member completely covers and extends beyond the semiconductor cooling plate.

15. The fascia gun body according to claim 1, wherein a heat transfer medium is disposed between the semiconductor refrigeration sheet and the heat conduction portion.

16. A fascial gun, comprising: a gun body of the fascial gun of any one of claims 1-15 and a massage head mounted to the mounting area.

Images