CN217485474U - Mark making device and pole piece - Google Patents

Abstract

The application provides a system trace device and pole piece relates to battery production technical field. The mark making device comprises a hole making mechanism, a coating mechanism and a stripping mechanism. The hole making mechanism is arranged on one side of the base material along the thickness direction of the base material, and the hole making mechanism is used for making a scoring hole on the base material. The coating mechanism is arranged at the downstream of the hole forming mechanism along the conveying direction of the base material, and is used for coating the base material so as to form a coating on the surface of the base material. The stripping mechanism is arranged at the downstream of the coating mechanism along the conveying direction and is used for stripping the coating covering the notch hole. The hole making mechanism can make a notch hole on the base material, the coating mechanism can coat the base material, and the peeling mechanism can peel the coating covering the notch hole off the base material, so that a notch is formed on the base material. Because the hole making mechanism makes the nick hole on the substrate, the stripping mechanism is easier and more convenient to strip the coating, which is beneficial to improving the mark making efficiency. The mark making mechanism does not need to use laser to ablate a coating, so that a heat affected zone is avoided.

Description

Mark making device and pole piece

Technical Field

The application relates to the technical field of battery production, in particular to a mark making device and a pole piece.

Background

Batteries are widely applied in the field of new energy resources, such as electric vehicles, new energy vehicles and the like, and the new energy vehicles and the electric vehicles become new development trends of the automobile industry. In the production process of the battery, the pole piece needs to be marked, but in the prior art, the marking on the pole piece is not only low in efficiency, but also poor in performance after the marking.

SUMMERY OF THE UTILITY MODEL

An object of this application embodiment is to provide a system mark device and pole piece, it aims at improving among the prior art and makes the mark not only inefficiency on the pole piece to the pole piece performance relatively poor problem after making the mark.

In a first aspect, an embodiment of the present application provides an indentation apparatus, which includes a hole making mechanism, a coating mechanism, and a peeling mechanism, where the hole making mechanism is disposed on one side of a substrate along a thickness direction of the substrate, and the hole making mechanism is configured to make an indentation hole in the substrate; the coating mechanism is arranged at the downstream of the hole making mechanism along the conveying direction of the base material and is used for coating the base material so as to form a coating on the surface of the base material; the peeling mechanism is arranged at the downstream of the coating mechanism along the conveying direction and is used for peeling the coating covering the notch hole.

In the technical scheme, the hole making mechanism of the mark making device can quickly make the scoring hole on the base material, the coating mechanism can coat the base material to form a coating on the base material, and the stripping mechanism can strip the coating covering the scoring hole off the base material to form a score on the base material. Because the hole making mechanism makes the nick hole on the base material, the stripping mechanism can strip the coating more easily and conveniently, the stripping efficiency is higher, and the mark making efficiency is improved. Because the hole making mechanism makes the hole on the substrate, a heat affected zone generated by ablating an active material layer in the prior art during laser mark making is not generated, namely the heat affected zone is not generated during mark making of the mark making device, so that the performance of the electrode plate after mark making is better.

As an optional technical solution of the embodiment of the present application, the hole making mechanism includes a plurality of hole making portions, the plurality of hole making portions are arranged along a first direction, the hole making portions are configured to make the score holes on the base material, and the first direction is perpendicular to the thickness direction.

In above-mentioned technical scheme, system hole mechanism includes a plurality of system hole portions, and a row of nick hole can once only be made on the substrate to a plurality of system hole portions, is favorable to promoting system hole efficiency to promote system mark efficiency.

As an optional technical solution of the embodiment of the present application, the hole forming mechanism further includes a first driving unit, the first driving unit is connected to the hole forming portion, and the first driving unit is configured to drive the hole forming portion to move in the thickness direction, so that the hole forming portion forms the scored hole on the base material.

In the above technical scheme, the first driving unit can drive the hole making part to move along the thickness direction, so that the hole making part is close to or far away from the base material. When the first driving unit drives the hole forming part to be close to the base material, the hole forming part punches or drills a mark forming hole on the base material.

As an optional technical solution of the embodiment of the present application, the mark making device includes a support, the support is relatively disposed on a side of the substrate, which is away from the hole making mechanism, along the thickness direction, and the support is used for supporting the substrate.

In the technical scheme, the supporting base material is arranged, so that the base material can not be torn when the hole making part is used for making the hole in the base material, the hole making quality is guaranteed, and the performance of the pole piece is improved.

As an optional technical solution of the embodiment of the present application, the hole making mechanism is configured to make a plurality of rows of score holes on the base material, where each row of score holes includes a plurality of score holes arranged at intervals along a width direction of the base material; the peeling mechanism is also used for peeling the coating between two adjacent scoring holes in each row of scoring holes.

In the technical scheme, the coating between two adjacent score holes in each row of score holes is stripped through the stripping mechanism, so that the active material layer in the area is prevented from being cracked and chipped when the electrode assembly is manufactured by laminating.

As an optional technical solution of the embodiment of the present application, the marking device includes a rolling mechanism, and the rolling mechanism is located downstream of the coating mechanism and is used for rolling the coating layer.

In the technical scheme, the coating is compacted conveniently by arranging the rolling mechanism.

As an optional solution of the embodiment of the present application, the rolling mechanism is disposed upstream of the peeling mechanism.

In the technical scheme, the rolling mechanism is arranged at the upstream of the stripping mechanism, so that the coating covering the notch hole is stripped by the rolling mechanism through the stripping mechanism after the coating is compacted, the coating not covering the notch hole can be prevented from being rubbed off from the substrate when the coating covering the notch hole is stripped by the stripping mechanism, and the performance of the pole piece is favorably improved.

As an alternative to the embodiments of the present application, the score hole penetrates through the substrate along the thickness direction; the mark making device comprises two coating mechanisms and two peeling mechanisms, wherein the two coating mechanisms are respectively positioned on two sides of the base material along the thickness direction; the two peeling mechanisms are respectively positioned on two sides of the base material along the thickness direction.

In the above technical solution, one coating mechanism and one peeling mechanism are provided on each side in the thickness direction of the base material. The hole making mechanism can make a nick hole on the base material, the two coating mechanisms respectively coat the two sides of the base material in the thickness direction, and the two stripping mechanisms respectively strip the coatings covering the two ends of the nick hole off the base material, so that nicks are formed on the two sides of the base material in the thickness direction.

As an optional technical solution of the embodiment of the present application, the two peeling mechanisms are disposed opposite to each other in the thickness direction.

In the technical scheme, the two peeling mechanisms are oppositely arranged, and when the two peeling mechanisms peel off the coating covering the notch hole, the two peeling mechanisms can be mutually used as supporting parts to support the base material, and the supporting parts are not required to be additionally arranged to support the base material to assist the peeling mechanisms to peel off the coating, so that the peeling quality is ensured, and the cost of the mark making device is reduced.

As an optional technical solution of the embodiment of the present application, the peeling mechanism includes an ultrasonic peeling unit, and the ultrasonic peeling unit is configured to peel the coating covering the score hole.

In the technical scheme, the coating covering the notch hole is stripped by the ultrasonic stripping unit, so that the coating not covering the notch hole is not easily damaged, the base material is not easily damaged, the stripping efficiency is high, and the stripping quality is good.

As an optional technical solution of the embodiment of the present application, the peeling mechanism includes a peeling member and a second driving unit; the second drive unit with it is connected to peel off the piece, the second drive unit is used for the drive peel off the piece and follow the thickness direction removes, so that peel off the piece destruction cover in the nick hole the coating, in order to cover in the nick hole the coating is peeled off the substrate.

In the above-described technical solution, the second driving unit can drive the peeling member to approach or separate from the base material in the thickness direction. When the second driving unit drives the stripping piece to be close to the substrate, the stripping piece acts on the coating covering the notch hole and breaks the coating (the stripping piece can partially extend into the notch hole), so that the coating covering the notch hole is separated from the substrate.

As an optional technical scheme of this application embodiment, it has a plurality of portions of peeling off, and is a plurality of to peel off the portion and arrange along first direction, peel off the portion and be used for its edge destroy when thickness direction removes cover in the nick hole the coating, in order to cover in the nick hole the coating is peeled off the substrate, first direction perpendicular to thickness direction.

In the technical scheme, by arranging the plurality of stripping parts, when the second driving unit drives the stripping part to be close to the substrate, the plurality of stripping parts can strip the coating covering the plurality of notch holes at one time, so that the stripping efficiency is improved, and the mark making efficiency is improved.

As an optional technical scheme of the embodiment of the application, the mark making device comprises a dust removing mechanism, and the dust removing mechanism is used for removing dust from the notch hole.

In the technical scheme, the dust removal mechanism is arranged to remove dust from the notch hole, and dust or debris generated when the stripping mechanism strips the coating covering the notch hole is removed, so that the mark making quality is improved.

In a second aspect, an embodiment of the present application further provides a pole piece, where the pole piece is a product manufactured according to the above indentation apparatus, and the pole piece includes a substrate and an active material layer, where the substrate is provided with multiple rows of indentation holes, and the multiple rows of indentation holes are arranged along the length direction of the substrate; the active substance layer is coated on the substrate, and the active substance layer avoids the notch hole.

In the technical scheme, the pole piece can be manufactured by manufacturing the nick hole on the base material through the hole manufacturing mechanism, the coating mechanism coats the base material, and the stripping mechanism removes the coating covering the nick hole to manufacture the pole piece.

As an alternative solution to the embodiments of the present application, each row of the score holes includes a plurality of the score holes spaced along the width direction of the substrate.

In the technical scheme, the plurality of score holes are arranged in the width direction of the base material to form a row of score holes, so that the electrode assembly is conveniently manufactured by laminating the pole pieces.

As an alternative to the embodiment of the present application, the active material layer avoids an area between two adjacent score holes in each row of the score holes.

In the technical scheme, the active material layer avoids the area between two adjacent score holes in each row of score holes, so that the active material layer in the area is prevented from being cracked and chipped when the electrode assembly is manufactured by lamination.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic structural view of a marking device according to some embodiments of the present disclosure;

FIG. 2 is a schematic view of a hole forming mechanism provided in some embodiments of the present application;

FIG. 3 is a schematic view of a marking device (with a support added to the device shown in FIG. 1) according to some embodiments of the present disclosure;

fig. 4 is a schematic structural diagram of a marking device (a new rolling mechanism is added on the basis of fig. 3) provided by some embodiments of the application;

fig. 5 is a schematic structural diagram of a marking device provided in some embodiments of the present application (two coating mechanisms and two peeling mechanisms are provided on the basis of fig. 4);

FIG. 6 is a schematic diagram of the construction of an indentation apparatus (including an alternative release mechanism) according to some embodiments of the present disclosure;

fig. 7 is a schematic structural diagram of a marking device (a dust removing mechanism is additionally arranged on the basis of fig. 5) provided by some embodiments of the present application;

FIG. 8 is a schematic top view of a pole piece provided in some embodiments of the present application;

FIG. 9 is a cross-sectional view taken at the position C-C of FIG. 8;

FIG. 10 is a schematic top view of a pole piece according to further embodiments of the present application;

fig. 11 is a cross-sectional view taken at the position D-D in fig. 10.

Icon: 10-a marking device; 100-a hole making mechanism; 110-making a hole part; 200-a coating mechanism; 210-a coating head; 300-a peeling mechanism; 310-a stripper; 400-a support; 500-a rolling mechanism; 510-a press roll; 600-passing through a roller; 700-a substrate; 710-a scored aperture; 800-a dust removal mechanism; 900-pole piece; 910-active substance layer.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are merely used to more clearly illustrate the technical solutions of the present application, and therefore are only examples, and the protection scope of the present application is not limited thereby.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions.

In the description of the embodiments of the present application, the technical terms "first", "second", and the like are used only for distinguishing different objects, and are not to be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary-secondary relationship of the technical features indicated. In the description of the embodiments of the present application, "a plurality" means two or more unless specifically defined otherwise.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

In the description of the embodiments of the present application, the term "and/or" is only one kind of association relationship describing an associated object, and means that three relationships may exist, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

In the description of the embodiments of the present application, the term "plurality" refers to two or more (including two), and similarly, "plural sets" refers to two or more (including two), and "plural pieces" refers to two or more (including two).

In the description of the embodiments of the present application, the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships that are based on the orientations and positional relationships shown in the drawings, and are used for convenience in describing the embodiments of the present application and for simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the embodiments of the present application.

In the description of the embodiments of the present application, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrated; mechanical connection or electrical connection is also possible; either directly or indirectly through intervening media, either internally or in any other relationship. Specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

At present, the application of the battery is more and more extensive from the development of market situation. The battery is not only applied to energy storage power supply systems such as hydraulic power, firepower, wind power and solar power stations, but also widely applied to electric vehicles such as electric bicycles, electric motorcycles and electric automobiles, and a plurality of fields such as military equipment and aerospace. With the ever-expanding application field of batteries, the market demand is also increasing.

In the production process of the battery, in order to meet the requirement of subsequent lamination manufacturing, the pole piece needs to be marked, however, in the prior art, the marking on the pole piece is low in efficiency, and the performance of the marked pole piece is poor.

The inventor of the application finds that in some cases, the marking on the pole piece is realized by ablating the active material layer on one side (or the front side and the back side) of the pole piece by using high temperature generated by high concentration of laser beams, so as to form a notch exposing the base material without damaging the base material. However, the efficiency of laser ablation of the active material layer is low, and at present, the maximum speed of laser ablation of the active material layer is about 20.2m/min, resulting in low marking efficiency. In addition, when the active material layer is ablated by laser, a heat affected zone is generated under the action of high temperature, the heat affected zone affects the performance of the active material layer on two sides of the notch and finally affects the performance of the pole piece, and the performance of the pole piece after the notch is made is poor.

In view of the above, the inventors have intensively studied and designed an indentation apparatus that forms an indentation hole in a substrate by providing a hole forming mechanism, coating the substrate by providing a coating mechanism to form a coating layer on the substrate, and peeling the coating layer covering the indentation hole off the substrate by a peeling mechanism to form an indentation in the substrate.

This system mark device's system hole mechanism can make the nick hole on the substrate fast, because the nick hole has been made on the substrate to system hole mechanism for peeling off mechanism peels off the coating and makes things convenient for more easily, peels off efficiency height, is favorable to improving system mark efficiency.

Because the hole making mechanism is used for making holes on the base material, a heat affected zone generated by ablating an active material layer when a laser mark is made in the prior art is not generated, namely the heat affected zone is not generated when the mark making device is used for making the mark, so that the performance of the pole piece after the mark is made is better.

The mark making device disclosed by the embodiment of the application is suitable for making marks on the pole pieces, and the pole pieces are used for laminating to manufacture an electrode assembly, so that a battery can be manufactured. The marking device disclosed in the embodiment of the present application is also applicable to marking of other workpieces to be coated and manufactured.

Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic structural diagram of a mark making device 10 according to some embodiments of the present application. Fig. 2 is a schematic diagram of a hole forming mechanism 100 provided in some embodiments of the present application. The embodiment of the application provides a mark making device 10, and the mark making device 10 comprises a hole making mechanism 100, a coating mechanism 200 and a peeling mechanism 300. The hole forming mechanism 100 is disposed on one side of the substrate 700 in the thickness direction of the substrate 700, and the hole forming mechanism 100 is used to form a score hole 710 in the substrate 700. The coating mechanism 200 is disposed downstream of the hole forming mechanism 100 in the conveying direction of the substrate 700, and the coating mechanism 200 is used for coating the substrate 700 to form a coating layer on the surface of the substrate 700. The peeling mechanism 300 is disposed downstream of the coating mechanism 200 in the conveying direction, and the peeling mechanism 300 is used to peel off the coating covering the notch hole 710.

The thickness direction of the substrate 700 is the a direction shown in fig. 1 and 2. The conveyance direction of the substrate 700 is the B direction shown in fig. 1 and 2.

The hole forming mechanism 100 is a mechanism for forming a scored hole 710 on the substrate 700, and the hole forming mechanism 100 may be, but is not limited to, a punching mechanism, a drilling mechanism, a laser ablation mechanism (the power of the emitted laser can be increased appropriately to improve the hole forming efficiency), and the like. The scoring holes 710 formed in the substrate 700 by the hole forming mechanism 100 may be through holes or blind holes.

The hole forming mechanism 100 is located on one side in the thickness direction of the substrate 700, and for example, when the substrate 700 extends in the horizontal direction, the hole forming mechanism 100 may be located on the upper side or the lower side of the substrate 700. When the substrate 700 extends in a vertical direction, the hole making mechanism 100 may be located on the left or right side of the substrate 700.

The coating mechanism 200 is a mechanism for applying a coating material to the substrate 700. For example, when the marking device 10 is used to mark the pole piece 900, the coating material is an active material. The coating mechanism 200 coats an active material on the substrate 700 so as to form an active material layer 910 on the substrate 700.

The peeling mechanism 300 is a mechanism for peeling off the coating layer covering the notch hole 710 from the substrate 700. After the peeling mechanism 300 peels the coating covering the score hole 710 from the substrate 700, the score hole 710 is located at a position where the coating is not applied to form a score.

The hole forming mechanism 100, the coating mechanism 200, and the peeling mechanism 300 are sequentially disposed along the conveying direction of the base material 700 to form the notch hole 710 on the base material 700, coat the base material 700, and finally peel the coating layer covering the notch hole 710 off the base material 700.

The hole forming mechanism 100 of the trace forming apparatus 10 can rapidly form a trace hole 710 on the substrate 700, the coating mechanism 200 can coat the substrate 700 to form a coating on the substrate 700, and the peeling mechanism 300 can peel off the coating covering the trace hole 710 from the substrate 700 to form a trace on the substrate 700. Because the hole making mechanism 100 makes the notch hole 710 on the substrate 700, the peeling mechanism 300 can peel off the coating more easily and conveniently, the peeling efficiency is higher, and the mark making efficiency is improved. In addition, since the hole forming mechanism 100 forms a hole in the substrate 700, a heat-affected zone generated by ablation of the active material layer 910 in the case of laser marking in the conventional art, that is, a heat-affected zone generated in the case of marking by the marking apparatus 10, is not generated. When the pole piece 900 is marked, the marked pole piece 900 has better performance.

Referring to fig. 1 and fig. 2, in some embodiments, the hole forming mechanism 100 includes a plurality of hole forming portions 110, and the plurality of hole forming portions 110 are arranged along a first direction. The hole forming part 110 is used to form a score hole 710 in the base material 700. The first direction is perpendicular to the thickness direction.

The drilling portion 110 is a component for drilling in the drilling mechanism 100. For example, if the hole forming mechanism 100 is a punching mechanism, the hole forming portion 110 is a punching head of the punching mechanism. For another example, when the hole forming mechanism 100 is a drilling mechanism, the hole forming portion 110 is a drill of a punching mechanism. The drilling portion 110 may or may not be in contact with the substrate 700, for example, when the drilling mechanism 100 is a punching mechanism, the drilling portion 110 is in contact with the substrate 700 to complete drilling. When the hole forming mechanism 100 is a laser ablation mechanism, the hole forming portion 110 emits a laser to ablate the substrate 700 to complete the hole formation.

The first direction is an arbitrary direction perpendicular to the thickness direction. During the hole making process, the orientations of the plurality of hole making portions 110 may be adjusted so that the arrangement direction of the score holes 710 made in the substrate 700 may satisfy the design requirement. In the present embodiment, the plurality of hole forming parts 110 are arranged along the width direction of the base material 700. The plurality of hole forming parts 110 may be arranged in other directions perpendicular to the thickness direction. For example, the plurality of hole-making parts 110 may be arranged along the length direction of the base material 700, and during hole-making, the orientation of the plurality of hole-making parts 110 may be adjusted to rotate from being arranged along the length direction to being arranged along the width direction, so as to make the plurality of score holes 710 arranged along the width direction on the base material 700. Of course, depending on the drilling method, it may not be necessary to adjust the orientation of the plurality of drilling portions 110. For example, the plurality of hole forming portions 110 may be arranged along the longitudinal direction of the base material 700, and in the case of forming holes, the plurality of hole forming portions 110 may be formed along the width direction, or a plurality of rows of score holes 710 may be formed in the base material 700, and the plurality of score holes 710 in each row of score holes 710 may be arranged along the width direction.

The hole forming mechanism 100 includes a plurality of hole forming portions 110, and the plurality of hole forming portions 110 can form a row of scored holes 710 on the substrate 700 at one time, which is beneficial to improving the hole forming efficiency and thus the scoring efficiency.

Referring to fig. 2, in some embodiments, the plurality of hole forming portions 110 are sequentially connected along the width direction to form a saw-toothed structure. In other embodiments, a plurality of hole forming portions 110 are provided at intervals in the width direction.

In some embodiments, the hole forming mechanism 100 further includes a first driving unit connected to the hole forming portion 110. The first driving unit is configured to drive the hole forming part 110 to move in the thickness direction, so that the hole forming part 110 forms the score hole 710 on the base material 700.

The first driving unit is a member that drives the punching portion 110 to move in the thickness direction. The first driving unit includes, but is not limited to, a linear cylinder, a linear electric cylinder, a linear oil cylinder, and the like. Of course, the first driving unit may also include a rotary driving member and a transmission mechanism, the rotary driving member is connected to the hole forming portion 110 through the transmission mechanism, the rotary driving member outputs a rotary motion, and the transmission mechanism converts the rotary motion output by the rotary driving member into a movement of the hole forming portion 110 along the thickness direction. Here, the rotary drive may be an electric motor. The transmission mechanism may be a lead screw and nut mechanism.

The first driving unit can drive the hole forming part 110 to move in the thickness direction so that the hole forming part 110 approaches or separates from the base material 700. When the first driving unit drives the punching portion 110 to approach the base material 700, the punching portion 110 punches or drills a punching hole on the base material 700.

Referring to fig. 3, fig. 3 is a schematic structural view of a marking device 10 (a support 400 is added on the basis of fig. 1) according to some embodiments of the present disclosure. In some embodiments, the marking device 10 includes a support 400, and the support 400 is disposed on a side of the substrate 700 facing away from the hole making mechanism 100. The support 400 is used to support the substrate 700.

The supporter 400 is a member that supports the substrate 700. The supporting member 400 and the hole forming portion 110 are respectively disposed at two sides of the base material 700 in the thickness direction, and the supporting member 400 is supported on the base material 700, so that when the first driving unit drives the hole forming portion 110 to be close to the base material 700 in the thickness direction for hole forming, the base material 700 is not torn due to too large tension change, and the hole forming quality of the hole forming portion 110 is ensured. When the pole piece 900 is marked, the marked pole piece 900 has better performance.

The support 400 includes, but is not limited to, a support table, support rollers, belts, and the like.

By arranging the supporting member 400 to support the base material 700, the base material 700 is prevented from being torn when the hole forming portion 110 forms a hole in the base material 700, which is beneficial to ensuring the hole forming quality.

In some embodiments, the hole forming mechanism 100 is configured to form a plurality of rows of score holes 710 on the substrate 700, wherein each row of score holes 710 includes a plurality of score holes 710 spaced apart along the width of the substrate 700. The peeling mechanism 300 is also used to peel the coating between two adjacent scoring holes 710 within each row of scoring holes 710.

"the peeling means 300 is also used to peel off the coating between two adjacent score holes 710 in each row of score holes 710" means that the peeling means 300 is to peel off not only the coating covering the score holes 710 but also the coating between two score holes 710 in the width direction.

The coating layer covering the region between two adjacent score holes 710 in each row of score holes 710 is peeled off by the peeling mechanism 300 so as to prevent the active material layer 910 of the region from being broken and generating debris when the electrode assembly is manufactured by lamination.

In some embodiments, coating mechanism 200 includes a coating head 210, coating head 210 being used to coat substrate 700. Optionally, the marking device 10 includes a roller 600, the coating head 210 and the roller 600 are respectively located at two sides of the substrate 700 in the thickness direction, the substrate 700 has a winding area wound around the roller 600, and the coating head 210 is used for coating the surface of the winding area, which faces away from the roller 600.

Referring to fig. 4, fig. 4 is a schematic structural diagram of a marking device 10 (with a rolling mechanism 500 added to fig. 3) according to some embodiments of the present disclosure. The marking device 10 comprises a rolling mechanism 500, the rolling mechanism 500 is positioned at the downstream of the coating mechanism 200, and the rolling mechanism 500 is used for rolling the coating.

The rolling mechanism 500 is a mechanism for rolling the substrate 700. The roller mechanism 500 is disposed downstream of the coating mechanism 200 to facilitate the compaction of the coating applied to the substrate 700 by the coating mechanism 200. For example, the roll pressing mechanism 500 includes two pressing rolls 510, the two pressing rolls 510 are oppositely arranged in the thickness direction of the substrate 700, and the two pressing rolls 510 cooperate to press the coating layer.

Through setting up roll-in mechanism 500, be convenient for with the compaction of coating, promote pole piece 900's performance.

In some embodiments, the roller press mechanism 500 is disposed upstream of the peeling mechanism 300. By placing the rolling mechanism 500 upstream of the peeling mechanism 300 such that the rolling mechanism 500 compacts the coating and then peels the coating covering the notch hole 710 through the peeling mechanism 300, the peeling mechanism 300 can be prevented from peeling off the coating not covering the notch hole 710 from the substrate 700 when peeling off the coating covering the notch hole 710 because the coating is compacted. When the pole piece 900 is marked, the marked pole piece 900 has better performance.

Referring to fig. 5, fig. 5 is a schematic structural diagram of a marking device 10 (provided with two coating mechanisms 200 and two peeling mechanisms 300 on the basis of fig. 4) according to some embodiments of the present application. In some embodiments, the scoring aperture 710 extends through the substrate 700 in the thickness direction. The marking device 10 includes two coating mechanisms 200 and two peeling mechanisms 300, and the two coating mechanisms 200 are respectively located on both sides of the substrate 700 in the thickness direction. The two peeling mechanisms 300 are respectively located on both sides of the base material 700 in the thickness direction.

The "score hole 710 penetrates the substrate 700 in the thickness direction" means that the score hole 710 is a through hole penetrating both sides of the substrate 700 in the thickness direction.

The two coating mechanisms 200 are used to coat both sides of the substrate 700 in the thickness direction, respectively. The two peeling mechanisms 300 are used to peel off the coating layer covering the two ends of the score hole 710 in the thickness direction from the substrate 700.

One coating mechanism 200 and one peeling mechanism 300 are provided on each side in the thickness direction of the substrate 700. The hole forming mechanism 100 may form a notch hole 710 penetrating through the substrate 700 on the substrate 700, two coating mechanisms 200 respectively coat two sides of the substrate 700 in the thickness direction, and two peeling mechanisms 300 respectively peel off the coating layers covering two ends of the notch hole 710 from the substrate 700, so that the substrate 700 forms a notch on two sides in the thickness direction.

Referring to fig. 5, in some embodiments, two peeling mechanisms 300 are disposed opposite to each other in the thickness direction.

The two peeling mechanisms 300 being disposed opposite to each other means that the two peeling mechanisms 300 are located at the same position in the conveyance direction of the substrate 700 and are located on both sides of the substrate 700 in the thickness direction, respectively. When the first peeling mechanism 300 peels off the coating covering one end in the thickness direction of the notch hole 710, the second peeling mechanism 300 can be used as a supporting member to support the substrate 700, so as to improve the quality of the coating peeled by the first peeling mechanism 300. Meanwhile, the second peeling mechanism 300 may peel off the coating layer covering the other end of the score hole 710 in the thickness direction, and the first peeling mechanism 300 may serve as a supporting member to support the substrate 700, so as to improve the quality of peeling off the coating layer by the second peeling mechanism 300. That is, the two peeling mechanisms 300 can support each other to assist the other peeling mechanism 300 in peeling off the coating.

By arranging the two peeling mechanisms 300 oppositely, the two peeling mechanisms 300 can be used as supporting members to support the substrate 700 when peeling off the coating covering the score hole 710, and a supporting member supporting the substrate 700 is not needed to be additionally arranged to assist the peeling mechanisms 300 in peeling off the coating, so that the cost of the marking device 10 is reduced while the peeling quality is ensured.

In other embodiments, the two peeling mechanisms 300 are arranged in a staggered manner along the thickness direction, that is, the two peeling mechanisms 300 are located at different positions in the conveying direction of the substrate 700 (it can also be understood that the two peeling mechanisms 300 have an upstream-downstream relationship in the conveying direction), and are respectively located at two sides of the substrate 700 in the thickness direction.

In some embodiments, the peeling mechanism 300 includes an ultrasonic peeling unit for peeling off the coating covering the score hole 710.

The ultrasonic peeling unit can emit ultrasonic waves to vibrate the coating layer covering the score hole 710 to be broken, thereby peeling the substrate 700. Due to the existence of the score hole 710, the coating layer covering the score hole 710 is not firm and easily separated from the substrate 700 by the ultrasonic wave, thereby having high peeling efficiency.

The coating covering the notch hole 710 is stripped by the ultrasonic stripping unit, so that the coating not covering the notch hole 710 is not easily damaged, the base material 700 is not easily damaged, the stripping efficiency is high, and the stripping quality is good. In addition, when the ultrasonic stripping unit strips the coating covering the notch hole 710, the ultrasonic stripping unit can also play a role in dust removal, and the quality of the stripped coating is further improved.

Referring to fig. 6, fig. 6 is a schematic structural view of the mark forming apparatus 10 (including another peeling mechanism 300) according to some embodiments of the present disclosure. In other embodiments, the peeling mechanism 300 includes a peeling member 310 and a second driving unit connected to the peeling member 310. The second driving unit is used for driving the peeling member 310 to move along the thickness direction, so that the peeling member 310 destroys the coating covering the score hole 710, and the coating covering the score hole 710 is peeled off the substrate 700.

The peeling member 310 is a member for contacting the coating covering the score hole 710 and applying an external force to the coating to break the coating. Stripper 310 includes, but is not limited to, a cutter head, a punch head, a drill bit, and the like.

The second driving unit is a member that drives the peeling member 310 to move in the thickness direction. The second driving unit includes, but is not limited to, a linear cylinder, a linear electric cylinder, a linear oil cylinder, and the like. Of course, the second driving unit may also include a rotation driving member and a transmission mechanism, the rotation driving member is connected to the peeling member 310 through the transmission mechanism, the rotation driving member outputs a rotation motion, and the transmission mechanism converts the rotation motion output by the rotation driving member into a movement motion of the peeling member 310 along the thickness direction. Here, the rotary drive may be a motor. The transmission mechanism may be a lead screw and nut mechanism.

The second driving unit can drive the peeling member 310 closer to or farther from the base material 700 in the thickness direction. When the second driving unit drives the peeling member 310 to approach the substrate 700, the peeling member 310 acts on the coating covering the score hole 710 and breaks the coating (the peeling member 310 may partially extend into the score hole 710), so that the coating covering the score hole 710 is separated from the substrate 700.

In some embodiments, the peeling member 310 has a plurality of peeling portions arranged in the first direction. The peeling part serves to break the coating layer covering the score hole 710 as it moves in the thickness direction, so as to peel the coating layer covering the score hole 710 off the substrate 700. The first direction is perpendicular to the thickness direction.

The peeling part is a portion of the peeling member 310 for directly contacting the coating covering the score hole 710 and applying an external force to the coating to break the coating. The stripped portion includes, but is not limited to, a nose portion, a punch bar, a drill bar, and the like.

The first direction is an arbitrary direction perpendicular to the thickness direction. When stripping the coating, the orientation of the plurality of stripped portions may be adjusted so that it matches the location of the plurality of score holes 710. In the present embodiment, the plurality of peeling portions are arranged along the width direction of the base material 700. The plurality of peeling portions may be arranged in other directions perpendicular to the thickness direction. For example, a plurality of peeling sections may be arranged along the length direction of the substrate 700, and the orientation of the plurality of peeling sections may be adjusted to rotate from being arranged along the length direction to being arranged along the width direction to match the positions of the plurality of score holes 710 when peeling the coating. Of course, depending on the peeling method, it is not necessary to adjust the orientation of the plurality of peeling portions. For example, a plurality of peeling portions may be arranged along the longitudinal direction of the base material 700, and when peeling the coating, the plurality of peeling portions may peel along the width direction, or the coating covering the plurality of rows of the notch holes 710 may be peeled.

By providing the plurality of peeling parts, when the second driving unit drives the peeling member 310 to approach the substrate 700, the plurality of peeling parts can peel off the coating covering the plurality of notch holes 710 at one time, which is beneficial to improving the peeling efficiency and improving the mark making efficiency.

It should be noted that the peeling mechanism 300 may peel off only the coating covering the score holes 710, or may peel off the coating covering the area between two adjacent score holes 710 in each row of score holes 710 from the substrate 700.

Referring to fig. 7, fig. 7 is a schematic structural view of a mark making device 10 (a dust removing mechanism 800 is additionally provided on the basis of fig. 5) according to some embodiments of the present disclosure. The marking device 10 comprises a dust removing mechanism 800, and the dust removing mechanism 800 is used for removing dust from the marking hole 710.

The dust removing mechanism 800 includes, but is not limited to, a negative pressure dust removing mechanism, an electrostatic dust removing mechanism, a dust removing brush, and the like. The dust removing mechanism 800 may be provided at a station where the peeling mechanism 300 is located. The dust removing mechanism 800 may be disposed downstream of the peeling mechanism 300 along the conveying direction of the substrate 700.

By arranging the dust removal mechanism 800 to remove dust from the notch hole 710, dust or debris generated when the peeling mechanism 300 peels off the coating covering the notch hole 710 is removed, which is beneficial to improving the marking quality.

Referring to fig. 8 in conjunction with fig. 9, fig. 8 is a schematic top view of a pole piece 900 according to some embodiments of the present disclosure. Fig. 9 is a cross-sectional view taken at the position C-C in fig. 8. The embodiment of the application further provides a pole piece 900, and the pole piece 900 is a product manufactured according to the mark making device 10. Pole piece 900 includes substrate 700 and active material layer 910. The substrate 700 is formed with a plurality of rows of the score holes 710, and the plurality of rows of the score holes 710 are arranged along the length direction of the substrate 700. The active material layer 910 is coated on the substrate 700, and the active material layer 910 avoids the notch hole 710.

"active material layer 910 avoids score hole 710" means that active material layer 910 does not cover score hole 710, that is, the open end of score hole 710 is not shielded by active material layer 910.

The pole piece 900 can be manufactured by manufacturing the notch hole 710 on the substrate 700 through the hole manufacturing mechanism 100, coating the substrate 700 through the coating mechanism 200, and removing the coating covering the notch hole 710 through the peeling mechanism 300, and has the advantages of simple and convenient manufacture, higher manufacturing efficiency and easy quality guarantee.

Referring to fig. 8, in some embodiments, each row of score holes 710 includes a plurality of score holes 710 spaced apart along the width of the substrate 700. The electrode assembly is fabricated by subsequently laminating pole piece 900 by arranging a plurality of score holes 710 in a direction along the width of substrate 700 to form an array of score holes 710.

Referring to fig. 9, in some embodiments, the active material layer 910 covers the area between two adjacent score holes 710 in each row of score holes 710. Thus, the peeling mechanism 300 only needs to remove the coating covering the notch hole 710 when peeling the coating, and the removal efficiency is high.

Referring to fig. 10 in conjunction with fig. 11, fig. 10 is a schematic top view of a pole piece 900 according to another embodiment of the present disclosure. Fig. 11 is a cross-sectional view taken at the position D-D in fig. 10. In other embodiments, active material layer 910 avoids the area between two adjacent score holes 710 within each row of score holes 710.

"active material layer 910 avoids the area between two adjacent perforation holes 710 in each row of perforation holes 710" i.e. active material layer 910 does not cover the area between two adjacent perforation holes 710 in each row of perforation holes 710, or the area between two adjacent perforation holes 710 in each row of perforation holes 710 does not have active material layer 910.

The active material layer 910 avoids the region between two adjacent score holes 710 in each row of score holes 710, so as to prevent the active material layer 910 in the region from breaking and generating debris when the electrode assembly is manufactured by lamination.

Please refer to fig. 1-7 according to some embodiments of the present application.

The embodiment of the application provides a mark making device 10, and the mark making device 10 comprises a hole making mechanism 100, a coating mechanism 200 and a peeling mechanism 300. The hole forming mechanism 100 is disposed on one side of the substrate 700 in the thickness direction of the substrate 700, and the hole forming mechanism 100 is used to form a score hole 710 in the substrate 700. The coating mechanism 200 is disposed downstream of the hole forming mechanism 100 in the conveying direction of the substrate 700, and the coating mechanism 200 is configured to coat the substrate 700 to form a coating layer on the surface of the substrate 700. The peeling mechanism 300 is disposed downstream of the coating mechanism 200 in the conveying direction, and the peeling mechanism 300 is used to peel off the coating covering the notch hole 710.

The hole forming mechanism 100 is a punching mechanism including a punching head having a plurality of hole forming portions 110 arranged along the width direction of the base material 700. The hole forming mechanism 100 punches a plurality of rows of the score holes 710 in the longitudinal direction of the base material 700 using a punching head, and the plurality of score holes 710 in each row of the score holes 710 are arranged in the width direction. The score hole 710 is not limited to a round hole, a square hole, etc. The coating mechanism 200 coats the substrate 700 to form a coating layer, and after the coating layer is coated by the coating mechanism 200, the coating layer coated by the coating mechanism 200 is compacted using the rolling mechanism 500. Finally, the coating covering the notch hole 710 is peeled off by using the peeling mechanism 300 (in this embodiment, an ultrasonic dust removing mechanism), and the notch hole 710 is simultaneously subjected to dust removal, so that the notch can be obtained.

Because the hole making mechanism 100 makes the notch hole 710 on the substrate 700, the peeling mechanism 300 can peel off the coating more easily and conveniently, the peeling efficiency is higher, and the mark making efficiency is improved. In addition, since the hole forming mechanism 100 forms a hole in the substrate 700, a heat affected zone generated by ablation of the active material layer 910 in the case of laser marking in the prior art, that is, a heat affected zone generated in the case of marking by the marking apparatus 10, is not generated.

It should be noted that, in the embodiments given in the present application, the embodiments may be combined with each other as long as there is no contradiction.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present disclosure, and the present disclosure should be construed as being covered by the claims and the specification. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. The present application is not intended to be limited to the particular embodiments disclosed herein, but rather to cover all embodiments falling within the scope of the appended claims.

Claims (16)

1. An indentation apparatus, comprising:

the hole making mechanism is arranged on one side of the base material along the thickness direction of the base material and is used for making a scoring hole in the base material;

the coating mechanism is arranged at the downstream of the hole making mechanism along the conveying direction of the base material and is used for coating the base material so as to form a coating on the surface of the base material;

and the stripping mechanism is arranged at the downstream of the coating mechanism along the conveying direction and is used for stripping the coating covering the notch hole.

2. The marking device according to claim 1, wherein the hole making mechanism includes a plurality of hole making portions arranged in a first direction for making the score hole in the base material, the first direction being perpendicular to the thickness direction.

3. The marking device according to claim 2, wherein the hole forming mechanism further comprises a first driving unit connected to the hole forming portion, the first driving unit being configured to drive the hole forming portion to move in the thickness direction so that the hole forming portion forms the scored hole in the base material.

4. Indentation apparatus according to any one of claims 1-3, characterized in that it comprises:

the supporting piece is arranged on one side, deviating from the hole making mechanism, of the base material oppositely along the thickness direction, and the supporting piece is used for supporting the base material.

5. The marking device according to any one of claims 1 to 3, wherein the hole making mechanism is configured to make a plurality of rows of the score holes in the substrate, each row of the score holes comprising a plurality of the score holes spaced along the width direction of the substrate;

the peeling mechanism is also used for peeling the coating between two adjacent scoring holes in each row of scoring holes.

6. Marking device according to claim 1, characterized in that it comprises a rolling mechanism downstream of said coating mechanism for rolling said coating layer.

7. The marking device according to claim 6, wherein the rolling mechanism is provided upstream of the peeling mechanism.

8. The marking device according to claim 1, wherein the scoring hole penetrates through the substrate in the thickness direction; the mark making device comprises:

the two coating mechanisms are respectively positioned on two sides of the base material along the thickness direction;

and the two peeling mechanisms are respectively positioned on two sides of the base material along the thickness direction.

9. Indentation apparatus according to claim 8, characterized in that the two peeling means are arranged opposite each other in the thickness direction.

10. Trace-making device according to claim 1, characterized in that the peeling means comprise an ultrasonic peeling unit for peeling off the coating covering the scoring hole.

11. Indentation device according to claim 1, characterized in that said peeling means comprise:

a stripping member;

the second driving unit is connected with the stripping piece, and is used for driving the stripping piece to move in the thickness direction, so that the stripping piece is damaged and covered on the coating of the score hole, and the coating of the score hole is stripped from the substrate.

12. The marking device according to claim 11, wherein the peeling member has a plurality of peeling portions arranged in a first direction, the peeling portions being configured to break the coating layer covering the notch hole when the peeling member moves in the thickness direction to peel the coating layer covering the notch hole off the substrate, the first direction being perpendicular to the thickness direction.

13. The marking device according to any one of claims 1 to 12, comprising a dust removal mechanism for removing dust from the scoring hole.

14. A pole piece manufactured by the marking device according to any one of claims 1 to 13, comprising:

the substrate is provided with a plurality of rows of scoring holes, and the scoring holes are distributed along the length direction of the substrate;

and the active substance layer is coated on the substrate, and the active substance layer avoids the notch holes.

15. The pole piece of claim 14 wherein each row of said score holes comprises a plurality of said score holes spaced along the width of said substrate.

16. The pole piece of claim 15 wherein said active material layer avoids the area between two adjacent score holes in each row of said score holes.

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